CN111394035A - High-strength transparent nail-free glue and preparation method thereof - Google Patents
High-strength transparent nail-free glue and preparation method thereof Download PDFInfo
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- CN111394035A CN111394035A CN202010384023.2A CN202010384023A CN111394035A CN 111394035 A CN111394035 A CN 111394035A CN 202010384023 A CN202010384023 A CN 202010384023A CN 111394035 A CN111394035 A CN 111394035A
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- Prior art keywords
- nail
- filler
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- free glue
- strength transparent
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- 239000003292 glue Substances 0.000 title claims abstract description 82
- 238000002360 preparation method Methods 0.000 title abstract description 9
- 239000000945 filler Substances 0.000 claims abstract description 56
- 239000004014 plasticizer Substances 0.000 claims abstract description 49
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 48
- 239000004526 silane-modified polyether Substances 0.000 claims abstract description 44
- 229920000570 polyether Polymers 0.000 claims abstract description 43
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000000463 material Substances 0.000 claims abstract description 42
- 239000000853 adhesive Substances 0.000 claims abstract description 40
- 238000003756 stirring Methods 0.000 claims abstract description 40
- 230000001070 adhesive effect Effects 0.000 claims abstract description 39
- 239000007822 coupling agent Substances 0.000 claims abstract description 39
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 32
- 239000003054 catalyst Substances 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000002156 mixing Methods 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 19
- 239000003381 stabilizer Substances 0.000 claims abstract description 17
- 229910021485 fumed silica Inorganic materials 0.000 claims abstract description 8
- 239000006229 carbon black Substances 0.000 claims description 40
- 239000003963 antioxidant agent Substances 0.000 claims description 35
- 230000003078 antioxidant effect Effects 0.000 claims description 35
- 239000004611 light stabiliser Substances 0.000 claims description 31
- 239000000203 mixture Substances 0.000 claims description 23
- 239000002250 absorbent Substances 0.000 claims description 17
- 230000002745 absorbent Effects 0.000 claims description 17
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 16
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 14
- 239000002994 raw material Substances 0.000 claims description 13
- -1 polyoxypropylene Polymers 0.000 claims description 12
- 239000012974 tin catalyst Substances 0.000 claims description 10
- 229920001451 polypropylene glycol Polymers 0.000 claims description 8
- 239000002516 radical scavenger Substances 0.000 claims description 8
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- SRSXLGNVWSONIS-UHFFFAOYSA-M benzenesulfonate Chemical compound [O-]S(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-M 0.000 claims description 3
- 239000012964 benzotriazole Substances 0.000 claims description 3
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 claims description 3
- 229920005862 polyol Polymers 0.000 claims description 3
- 150000003077 polyols Chemical class 0.000 claims description 3
- XJKVPKYVPCWHFO-UHFFFAOYSA-N silicon;hydrate Chemical group O.[Si] XJKVPKYVPCWHFO-UHFFFAOYSA-N 0.000 claims description 3
- 241000872198 Serjania polyphylla Species 0.000 claims 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 claims 1
- 230000008901 benefit Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 11
- 238000001816 cooling Methods 0.000 description 11
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 8
- 238000002834 transmittance Methods 0.000 description 6
- IYAZLDLPUNDVAG-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 IYAZLDLPUNDVAG-UHFFFAOYSA-N 0.000 description 5
- UWSMKYBKUPAEJQ-UHFFFAOYSA-N 5-Chloro-2-(3,5-di-tert-butyl-2-hydroxyphenyl)-2H-benzotriazole Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O UWSMKYBKUPAEJQ-UHFFFAOYSA-N 0.000 description 5
- 230000032683 aging Effects 0.000 description 5
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 4
- 230000002209 hydrophobic effect Effects 0.000 description 4
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- HXJZEGBVQCRLOD-UHFFFAOYSA-N 1-triethoxysilylpropan-2-amine Chemical compound CCO[Si](CC(C)N)(OCC)OCC HXJZEGBVQCRLOD-UHFFFAOYSA-N 0.000 description 2
- KBRVQAUYZUFKAJ-UHFFFAOYSA-N 1-trimethoxysilylpropan-2-amine Chemical compound CO[Si](OC)(OC)CC(C)N KBRVQAUYZUFKAJ-UHFFFAOYSA-N 0.000 description 2
- ZMWRRFHBXARRRT-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-methylbutan-2-yl)phenol Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(N2N=C3C=CC=CC3=N2)=C1O ZMWRRFHBXARRRT-UHFFFAOYSA-N 0.000 description 2
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 2
- 229910008051 Si-OH Inorganic materials 0.000 description 2
- 229910006358 Si—OH Inorganic materials 0.000 description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- GRVDJDISBSALJP-UHFFFAOYSA-N methyloxidanyl Chemical compound [O]C GRVDJDISBSALJP-UHFFFAOYSA-N 0.000 description 2
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 239000008029 phthalate plasticizer Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 125000005372 silanol group Chemical group 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 1
- ZUGOSPHJWZAGBH-UHFFFAOYSA-N CO[SiH](OC)C=C Chemical compound CO[SiH](OC)C=C ZUGOSPHJWZAGBH-UHFFFAOYSA-N 0.000 description 1
- 229920000715 Mucilage Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910002808 Si–O–Si Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- OFFHCUWJGDPERE-UHFFFAOYSA-N butanedioic acid;1-(2-hydroxyethyl)-2,2,6,6-tetramethylpiperidin-4-ol Chemical compound OC(=O)CCC(O)=O.CC1(C)CC(O)CC(C)(C)N1CCO OFFHCUWJGDPERE-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- ZXDVQYBUEVYUCG-UHFFFAOYSA-N dibutyltin(2+);methanolate Chemical compound CCCC[Sn](OC)(OC)CCCC ZXDVQYBUEVYUCG-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 238000006884 silylation reaction Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical group CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
Abstract
The invention provides a high-strength transparent nail-free glue and a preparation method thereof, wherein the high-strength transparent nail-free glue is prepared by the following method: step S1: uniformly mixing a silane modified polyether polymer, a plasticizer, a filler and a stabilizer, and heating and dehydrating to obtain a first mixed material; step S2: adding a water removing agent, a coupling agent, a filler and a catalyst into the first mixed material, and mixing and stirring to obtain a high-strength transparent nail-free adhesive; wherein the filler is fumed silica. The invention has the beneficial effects that: the high-strength transparent nail-free glue prepared by the invention has the advantages of high strength, high transparency and excellent storage stability, is simple in operability, moderate in extrudability, short in initial curing time, fast in deep curing, and capable of being positioned instantly, improves the operational performance and the mechanical property of the transparent nail-free glue, and effectively improves the storage stability of the transparent nail-free glue.
Description
Technical Field
The invention belongs to the field of nail-free glue, and particularly relates to high-strength transparent nail-free glue and a preparation method thereof.
Background
Along with the improvement of economy and living standard, the requirements of people on the family living environment are higher and higher, and the traditional home decoration mode which is time-consuming, labor-consuming and inconvenient to operate and seriously influences the attractiveness is not favored any more. The nail-free glue is a binder capable of replacing nails to fix and install objects in many occasions, and effectively avoids the trouble caused by noise, dust and substrate damage. The transparent nail-free glue has high acceptance due to unique high transparency, aesthetic property, wide base material adhesion and convenient operation.
At present, great breakthroughs are made on the research and development of transparent silane modified polyether nail-free glue, the preparation method has great advantages in environmental protection, but the existing preparation method makes the transparent silane modified polyether nail-free glue difficult to achieve the balance of mechanical strength and transparency, so that the transparent silane modified polyether nail-free glue with high mechanical strength and high transparency is very necessary.
Disclosure of Invention
In order to solve the technical problem that the transparent silane modified polyether nail-free adhesive in the prior art cannot give consideration to both mechanical strength and transparency, the invention provides a high-strength transparent nail-free adhesive and a preparation method thereof.
The specific technical scheme is as follows:
the high-strength transparent nail-free glue is characterized by comprising the following raw materials in parts by weight:
silane-modified polyether polymer: 20-80 parts of plasticizer: 10-50 parts of filler: 5-40 parts of stabilizer: 0.3-4.5 parts of water removing agent: 0.5-5 parts of coupling agent: 0.5-5 parts and a catalyst: 0.5 to 3 parts;
the high-strength transparent nail-free glue is prepared by the following method:
step S1: uniformly mixing a silane modified polyether polymer, a plasticizer, a filler and a stabilizer, and heating and dehydrating to obtain a first mixed material;
step S2: adding a water removing agent, a coupling agent, a filler and a catalyst into the first mixed material, and mixing and stirring to obtain a high-strength transparent nail-free adhesive;
wherein the filler is fumed silica.
Further, the filler is gas-phase hydrophilic white carbon black, and the specific surface area of the filler is 100m2/g~200m2/g。
Further, the high-strength transparent nail-free glue is prepared from the following raw materials in parts by weight:
silane-modified polyether polymer: 30-60 parts of plasticizer: 20-40 parts of filler: 10-30 parts of stabilizer: 0.3-3 parts of water removing agent: 1-3 parts of a coupling agent: 1-3 parts and a catalyst: 0.5 to 2 portions.
Further, the silane modified polyether polymer is selected from trimethoxy silane terminated polyoxypropylene ether and/or methyl dimethoxy silane terminated polyoxypropylene ether.
Further, the coupling agent is selected from silane coupling agents.
Further, the plasticizer is selected from at least one of phthalate plasticizer, phenyl sulfonate plasticizer, fatty alcohol ester plasticizer or polyether polyol plasticizer; the catalyst is an organic tin catalyst; the water removing agent is a silane water removing agent.
Further, the stabilizer comprises a light stabilizer, an antioxidant and an ultraviolet absorber;
the ultraviolet absorbent is benzotriazole ultraviolet absorbent; the light stabilizer is a hindered amine light stabilizer; the antioxidant is hindered phenol antioxidant.
The method for preparing the high-strength transparent nail-free glue is characterized by comprising the following steps of:
step S1: uniformly mixing a silane modified polyether polymer, a plasticizer, a filler and a stabilizer, and heating and dehydrating to obtain a first mixed material;
step S2: and adding a water removing agent, a coupling agent, a filler and a catalyst into the first mixed material, and mixing and stirring to obtain the high-strength transparent nail-free glue.
Further, in the step S1, the silane-modified polyether polymer, the plasticizer, the filler, the stabilizer and the antioxidant are stirred under a vacuum condition and heated to 100 to 120 ℃ to obtain a first mixed material; wherein the filler is added in one or more times in the step S1.
Further, in the step S2, when the first mixed material is cooled to below 50 ℃, a water removing agent, a coupling agent, a filler and a catalyst are added; wherein the filler is added in one or more times in the step S2.
Compared with the prior art, the invention has the beneficial effects that: the high-strength transparent nail-free glue prepared by the invention has the advantages of high strength, high transparency and excellent storage stability, is simple in operability, moderate in extrudability, short in initial curing time and fast in deep curing, can be positioned instantly, improves the operability and mechanical property of the transparent nail-free glue, effectively improves the storage stability of the transparent nail-free glue, solves the contradiction of the transparent nail-free glue in the aspects of high strength, high transparency, excellent storage stability and the like, and provides high-quality performance experience and higher economic benefit.
Detailed Description
The principles and features of this invention are described below in conjunction with examples which are set forth to illustrate, but are not to be construed to limit the scope of the invention.
The preparation method of the high-strength transparent nail-free glue is characterized by comprising the following steps:
step S1: uniformly mixing a silane modified polyether polymer, a plasticizer, a filler, a stabilizer and an antioxidant, and heating and dehydrating to obtain a first mixed material;
step S2: adding a water removing agent, a coupling agent, a filler and a catalyst into the first mixed material, mixing and stirring for reaction to obtain a high-strength transparent nail-free adhesive;
wherein the filler in the steps S1 and S2 is fumed silica.
The term "tack-free adhesive" as used herein reacts via a unique silylation and moisture curing mechanism. The terminal siloxane and water in moisture are hydrolyzed to generate silanol groups, and the silanol groups are subjected to dehydration condensation to produce a high molecular product, so that a very stable Si-O-Si structure is formed, and the mechanical strength is provided between base materials. The specific crosslinking reaction is as follows:
(1) and (3) hydrolysis reaction:
-Si-OR+H2O→-Si-OH+ROH
(2) and (3) polycondensation reaction:
-Si-OH+HO-Si-→-Si-O-Si-+H2O
the term "silane modified polyether Polymer" is abbreviated as MS-Polymer (MS Polymer), and the adhesive prepared from the silane modified polyether Polymer can be called MS adhesive, modified silicone adhesive or organic silicon modified polyether adhesive.
In the present invention, the silane-modified polyether polymer is selected from trimethoxy silane-terminated polyoxypropylene ether and/or methyl dimethoxy silane-terminated polyoxypropylene ether.
The structural formula of the trimethoxy silane-terminated polyoxypropylene ether is shown as the formula I:
(CH3O)3Si(CH2)3O(CHCH3CH2O)m(CH2)3Si(OCH3)3
formula I
The structural formula of the methyldimethoxysilane-terminated polyoxypropylene ether is shown as the formula II:
(CH3O)2CH3Si(CH2)3O(CHCH3CH2O)n(CH2)3SiCH3(OCH3)2
formula II
Wherein m and n are integers more than 1, and the molecular weight of the silane modified polyether is 8000-30000.
The term "plasticizer" means an organic substance which improves the fluidity of the resin during molding and processing, and imparts flexibility to the article and dilution. In order to reduce the water content of the product, improve the storage stability of the system and prolong the shelf life, when the nail-free glue is prepared, the filler with higher water content is separately dissolved by the plasticizer and dehydrated at high temperature to prepare dehydrated mucilage, and meanwhile, the dispersibility of the filler is also improved. The plasticizer molecules can be inserted into the matrix glue molecules, so that the distance between molecular chains is enlarged, the addition amount of the filler is increased, the mechanical strength and other properties of the glue are improved, and the cost is reduced.
In the invention, the plasticizer is selected from at least one of phthalate plasticizer, phenyl sulfonate plasticizer, fatty alcohol ester plasticizer or polyether polyol plasticizer;
the term "filler" is mostly inorganic material, which can improve the heat resistance and water resistance of the nail-free glue and simultaneously enhance the mechanical strength and thixotropic property of the nail-free glue.
In the invention, the filler is fumed silica with a specific surface area of 100m2/g~200m2(ii) in terms of/g. Furthermore, the filler is hydrophilic white carbon black prepared by a gas phase method.
The term "gas-phase hydrophilic white carbon black" is nano-scale white powder produced by hydrolyzing silicon halides (mainly silicon tetrachloride and methyl trichlorosilane) at high temperature in oxyhydrogen flame, the surface of the nano-scale white powder can show hydrophilicity without treatment, the nano-scale hydrophilic white carbon black is one of extremely important high-tech superfine inorganic new materials, and the nano-scale hydrophilic white carbon black has specific properties in the aspects of large specific surface area, strong surface adsorption force, large surface energy, high chemical purity, good dispersion performance, thermal resistance, electric resistance and the like due to small particle size, and has unique characteristics in a plurality of subjects and fields with excellent stability, reinforcement, thickening property and thixotropy, and has irreplaceable effect.
The stabilizer comprises a light stabilizer, an antioxidant and an ultraviolet absorber; the addition of the stabilizer can improve the stability of the glue-free nail and improve the aging resistance.
The term "light stabilizer" refers to a substance added to the nail-free glue to improve the light resistance and aging resistance of the nail-free glue.
In the invention, the light stabilizer is a hindered amine light stabilizer; still further, the light stabilizer is at least one selected from the group consisting of UV-292 (bis (1,2,2,6, 6-pentamethylpiperidinol) sebacate), UV-622 (poly (4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidineethanol) succinate) and UV-770 (bis (2,2,6, 6-tetramethyl-4-piperidyl) sebacate).
The term "antioxidant" is a substance that can improve the oxidation resistance when added to a nail-free glue;
in the present invention, the antioxidant is a hindered phenol antioxidant, and further, the antioxidant is at least one selected from the group consisting of an antioxidant 245 (diethylene glycol bis [ β -propionate ]), and an antioxidant 1010 (pentaerythrityl tetrakis [ β - (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate) ].
In the step S1, an ultraviolet absorber is further added, the ultraviolet absorber is a benzotriazole-based ultraviolet absorber, and the ultraviolet absorber is at least one selected from the group consisting of UV-326(2- (2 '-hydroxy-3' -tert-butyl-5 '-methylphenyl) -5-chlorobenzotriazole), UV-327(2- (2-hydroxy-3, 5-di-tert-butylphenyl) -5-chlorobenzotriazole), UV-328(2- (2' -hydroxy-3 ',5' -ditert-pentylphenyl) benzotriazole), and UV-329(2- (2 '-hydroxy-5' -tert-octylphenyl) benzotriazole).
The term "water remover" is a substance added in the nail-free glue for removing trace water in a system, so that the phenomena of gelation and invalidation of the nail-free glue in the storage process are avoided.
In the invention, the water removing agent is a silane water removing agent; further, the water removing agent is at least one selected from the group consisting of vinyltrimethoxysilane, vinyltriethoxysilane and vinyldimethoxysilane.
The term "coupling agent" can improve the bonding effect of the nail-free glue and improve the bonding strength of the nail-free glue.
In the invention, the coupling agent is selected from silane coupling agents, the coupling agent is selected from at least one of gamma-aminopropyltrimethoxysilane, gamma-aminopropyltriethoxysilane, N- (β -aminoethyl) -gamma-aminopropylmethyldimethoxysilane, N- (β -aminoethyl) -gamma-aminopropyltrimethoxysilane and N- (β -aminoethyl) -gamma-aminopropyltriethoxysilane, and as a still further preferable technical scheme of the invention, the coupling agent is selected from at least one of gamma-aminopropyltrimethoxysilane or N- (β -aminoethyl) -gamma-aminopropyltrimethoxysilane.
The term "catalyst" can accelerate the crosslinking and curing of the silane modified polyether polymer, shorten the surface drying time of the nail-free glue and improve the curing speed of the nail-free glue.
In the present invention, the "catalyst" is an organic tin catalyst, and the catalyst is at least one selected from the group consisting of dibutyltin dilaurate, dioctyltin dilaurate, dibutyltin dimethoxide and chelated tin.
In the step S1, stirring the silane modified polyether polymer, the plasticizer, the filler, the stabilizer and the antioxidant under a vacuum condition, and heating to 100-120 ℃ to obtain a first mixed material; wherein the filler is added in one or more times in the step S1.
In the step S2, when the first mixed material is cooled to below 50 ℃, a water removing agent, a coupling agent, a filler and a catalyst are added; wherein the filler is added in one or more times in the step S2.
The high-strength transparent nail-free glue is prepared from the following raw materials in parts by weight:
silane-modified polyether polymer: 20-80 parts of plasticizer: 10-60 parts of filler: 5-40 parts of ultraviolet absorbent: 0.1-1.5 parts of light stabilizer: 0.1-1.5 parts of antioxidant: 0.1-1.5 parts of water removing agent: 0.5-5 parts of coupling agent: 0.5-5 parts and a catalyst: 0.5 to 3 portions. By the proportion, transparent nail-free glue products with different strengths, different breaking elongations and different light transmittances can be prepared.
Further preferably, the high-strength transparent nail-free glue is prepared from the following raw materials in parts by weight:
silane-modified polyether polymer: 30-60 parts of plasticizer: 20-40 parts of filler: 10-30 parts of ultraviolet absorbent: 0.1-1 part of light stabilizer: 0.1 to 1 part of antioxidant: 0.1-1 part of water removing agent: 1-3 parts of a coupling agent: 1-3 parts of catalyst: 0.5 to 2 portions. By the further optimized proportion, the transparent nail-free adhesive product with high strength, high transparency, thixotropy and excellent storage stability can be prepared.
The high-strength transparent nail-free glue is characterized by being prepared by the preparation method.
Example 1
The composition of the high-strength transparent nail-free glue of this example is shown in Table 1.
Table 1 example 1 high strength transparent nail-free adhesive composition
Raw material components | Parts by mass |
SAX400 (silane modified polyether polymer) | 55 |
Diisononyl phthalate (plasticizer) | 25 |
Gas-phase hydrophilic white carbon black (step S1 adding filler) | 10 |
UV-329 (ultraviolet absorber) | 0.4 |
UV-770 (light stabilizer) | 0.4 |
245 (antioxidant) | 0.2 |
Vinyl trimethoxy silane (Water scavenger) | 2 |
Aminopropyl trimethoxysilane (coupling agent) | 1.5 |
Gas-phase hydrophilic white carbon black (step S2 adding filler) | 5 |
Chelated tin catalysts | 0.5 |
Embodiment 1 a method for preparing a high-strength transparent nail-free glue, comprising the steps of:
step S1: according to the proportion, adding a silane modified polyether polymer, a plasticizer, gas-phase hydrophilic white carbon black, an ultraviolet absorbent, a light stabilizer and an antioxidant into a vacuum double-shaft stirring kettle, stirring and dispersing uniformly, vacuumizing less than or equal to-0.094 MPa, heating to 110 ℃, and maintaining for 2 hours to obtain a first mixed material;
step S2: and cooling the first mixed material to 50 ℃, adding a water removing agent, a coupling agent, gas-phase hydrophilic white carbon black and a catalyst, and mixing and stirring for 30 minutes to obtain a fine and transparent nail-free adhesive product.
Example 2
The composition of the high-strength transparent nail-free glue of this example is shown in Table 2.
Table 2 example 2 high strength transparent type nail-free glue composition
Raw material components | Parts by mass |
S303H (silane modified polyether polymer) | 50 |
Diisodecyl phthalate (plasticizer) | 30 |
Gas-phase hydrophilic white carbon black (step S1 adding filler) | 8 |
UV-327 (ultraviolet absorber) | 0.4 |
UV-622 (light stabilizer) | 0.4 |
1010 (antioxidant) | 0.2 |
Vinyl trimethoxy silane (Water scavenger) | 2 |
Aminopropyltriethoxysilane (coupling agent) | 2 |
Gas-phase hydrophilic white carbon black (step S2 adding filler) | 10 |
Chelated tin catalysts | 1 |
Example 2 a high strength transparent type nail free glue was prepared in the same manner as in example 1. The method comprises the following steps:
step S1: according to the proportion, adding a silane modified polyether polymer, a plasticizer, gas-phase hydrophilic white carbon black, an ultraviolet absorbent, a light stabilizer and an antioxidant into a vacuum double-shaft stirring kettle, stirring and dispersing uniformly, vacuumizing less than or equal to-0.094 MPa, heating to 110 ℃, and maintaining for 2 hours to obtain a first mixed material;
step S2: and cooling the first mixed material to 50 ℃, adding a water removing agent, a coupling agent, gas-phase hydrophilic white carbon black and a catalyst, and mixing and stirring for 30 minutes to obtain a fine and transparent nail-free adhesive product.
Example 3
The composition of the high-strength transparent nail-free glue of this example is shown in Table 3.
Table 3 example 3 high strength transparent nail-free adhesive composition
Example 3 a high strength transparent type nail free glue was prepared in the same manner as in example 1. The method comprises the following steps:
step S1: according to the proportion, adding silane modified polyether polymer, plasticizer, gas-phase hydrophilic white carbon black, ultraviolet absorbent, light stabilizer and antioxidant into a vacuum double-shaft stirring kettle, stirring and dispersing uniformly, vacuumizing less than or equal to-0.094 MPa, heating to 110 ℃, and maintaining for 2 hours to obtain a base material;
step S2: and cooling the first mixed material to 50 ℃, adding a water removing agent, a coupling agent, gas-phase hydrophilic white carbon black and a catalyst, and mixing and stirring for 30 minutes to obtain a fine and transparent nail-free adhesive product.
Example 4
The composition of the high-strength transparent nail-free glue of this example is shown in Table 4.
Table 4 example 4 high strength transparent nail-free adhesive composition
Example 4 a high strength transparent type nail free glue was prepared in the same manner as in example 1. The method comprises the following steps:
step S1: according to the proportion, adding a silane modified polyether polymer, a plasticizer, gas-phase hydrophilic white carbon black, an ultraviolet absorbent, a light stabilizer and an antioxidant into a vacuum double-shaft stirring kettle, stirring and dispersing uniformly, vacuumizing less than or equal to-0.094 MPa, heating to 110 ℃, and maintaining for 2 hours to obtain a first mixed material;
step S2: and cooling the first mixed material to 50 ℃, adding a water removing agent, a coupling agent, gas-phase hydrophilic white carbon black and a catalyst, and mixing and stirring for 30 minutes to obtain a fine and transparent nail-free adhesive product.
Example 5
The composition of the high-strength transparent nail-free glue of this example is shown in Table 5.
Table 5 example 5 high strength transparent nail-free adhesive composition
Raw material components | Parts by mass |
SAT400 (silane-modified polyether polymer) | 80 |
Diisononyl phthalate (plasticizer) | 10 |
Gas-phase hydrophilic white carbon black (step S1 adding filler) | 3 |
UV-326 (ultraviolet absorber) | 1.5 |
UV-292 (light stabilizer) | 1.5 |
Antioxidant 245 (antioxidant) | 1.5 |
Vinyl trimethoxy silane (Water scavenger) | 0.5 |
Aminopropyl trimethoxysilane (coupling agent) | 5 |
Gas-phase hydrophilic white carbon black (step S2 adding filler) | 2 |
Chelated tin catalysts | 3 |
Example 5 a high strength transparent type nail free glue was prepared in the same manner as in example 1. The method comprises the following steps:
step S1: according to the proportion, adding a silane modified polyether polymer, a plasticizer, gas-phase hydrophilic white carbon black, an ultraviolet absorbent, a light stabilizer and an antioxidant into a vacuum double-shaft stirring kettle, stirring and dispersing uniformly, vacuumizing less than or equal to-0.094 MPa, heating to 110 ℃, and maintaining for 2 hours to obtain a first mixed material;
step S2: and cooling the first mixed material to 50 ℃, adding a water removing agent, a coupling agent, gas-phase hydrophilic white carbon black and a catalyst, and mixing and stirring for 30 minutes to obtain a fine and transparent nail-free adhesive product.
Example 6
The composition of the high-strength transparent nail-free glue of this example is shown in Table 6.
Table 6 example 6 high strength transparent nail-free adhesive composition
Raw material components | Parts by mass |
SAT350 (silane-modified polyether polymer) | 30 |
Diisononyl phthalate (plasticizer) | 40 |
Gas-phase hydrophilic white carbon black (step S1 adding filler) | 18 |
UV-327 (ultraviolet absorber) | 1 |
UV-622 (light stabilizer) | 1 |
Antioxidant 1010 (antioxidant) | 1 |
Vinyl trimethoxy silane (Water scavenger) | 3 |
Aminopropyl trimethoxysilane (coupling agent) | 3 |
Gas-phase hydrophilic white carbon black (step S2 adding filler) | 12 |
Chelated tin catalysts | 2 |
Embodiment 6 a method for preparing a high-strength transparent nail-free glue, comprising the steps of:
step S1: according to the proportion, the silane modified polyether polymer, the plasticizer and the gas-phase hydrophilic white carbon black are added in the step three times, the ultraviolet absorbent, the light stabilizer and the antioxidant are added into a vacuum double-shaft stirring kettle, the stirring and the dispersion are uniform, the vacuumizing is less than or equal to-0.094 MPa, the heating is carried out to 110 ℃, and the heating is maintained for 2 hours, so as to obtain a first mixed material;
step S2: and cooling the first mixed material to 50 ℃, adding a water removing agent, a coupling agent, gas-phase hydrophilic white carbon black and a catalyst, and mixing and stirring for 30 minutes to obtain a fine and transparent nail-free adhesive product.
Example 7
The composition of the high-strength transparent nail-free glue of this example is shown in Table 7.
Table 7 example 7 high strength transparent nail-free adhesive composition
Example 7 a high strength transparent nail free glue was prepared as follows:
step S1: according to the proportion, adding a silane modified polyether polymer, a plasticizer, gas-phase hydrophilic white carbon black, an ultraviolet absorbent, a light stabilizer and an antioxidant into a vacuum double-shaft stirring kettle, stirring and dispersing uniformly, vacuumizing less than or equal to-0.094 MPa, heating to 100 ℃, and maintaining for 2 hours to obtain a first mixed material;
step S2: and cooling the first mixed material to 50 ℃, adding a water removing agent, a coupling agent, gas-phase hydrophilic white carbon black and a catalyst, and mixing and stirring for 30 minutes to obtain a fine and transparent nail-free adhesive product.
Example 8
The composition of the high-strength transparent nail-free glue of this example is shown in Table 8.
Table 8 example 8 high strength clear nail free adhesive composition
Raw material components | Parts by mass |
SAX400 (silane modified polyether polymer) | 55 |
Diisononyl phthalate (plasticizer) | 25 |
Gas-phase hydrophobic white carbon black (step S1 adding filler) | 10 |
UV-329 (ultraviolet absorber) | 0.4 |
UV-770 (light stabilizer) | 0.4 |
245 (antioxidant) | 0.2 |
Vinyl trimethoxy silane (Water scavenger) | 2 |
Aminopropyl trimethoxysilane (coupling agent) | 1.5 |
Gas-phase hydrophobic white carbon black (step S2 adding filler) | 5 |
Chelated tin catalysts | 0.5 |
Embodiment 8 a method for preparing a high strength transparent type nail free glue, comprising the steps of:
step S1: according to the proportion, adding a silane modified polyether polymer, a plasticizer, gas-phase hydrophilic white carbon black, an ultraviolet absorbent, a light stabilizer and an antioxidant into a vacuum double-shaft stirring kettle, stirring and dispersing uniformly, vacuumizing less than or equal to-0.094 MPa, heating to 110 ℃, and maintaining for 2 hours to obtain a first mixed material;
step S2: and cooling the first mixed material to 50 ℃, adding a water removing agent, a coupling agent, gas-phase hydrophilic white carbon black and a catalyst, and mixing and stirring for 30 minutes to obtain a fine and transparent nail-free adhesive product.
Example 9
The composition of the high-strength transparent nail-free glue of this example is shown in Table 9.
Table 9 example 9 high strength transparent nail-free adhesive composition
Raw material components | Parts by mass |
S303H (silane modified polyether polymer) | 50 |
Diisodecyl phthalate (plasticizer) | 30 |
Gas-phase hydrophobic white carbon black (step S1 adding filler) | 8 |
UV-327 (ultraviolet absorber) | 0.4 |
UV-622 (light stabilizer) | 0.4 |
1010 (antioxidant) | 0.2 |
Vinyl trimethoxy silane (Water scavenger) | 2 |
Aminopropyltriethoxysilane (coupling agent) | 2 |
Gas phase hydrophobic white carbon black (step S2 adding)With stuffing) | 10 |
Chelated tin catalysts | 1 |
Example 9 a high strength clear nail free glue was prepared as in example 1. The method comprises the following steps:
step S1: according to the proportion, adding a silane modified polyether polymer, a plasticizer, gas-phase hydrophilic white carbon black, an ultraviolet absorbent, a light stabilizer and an antioxidant into a vacuum double-shaft stirring kettle, stirring and dispersing uniformly, vacuumizing less than or equal to-0.094 MPa, heating to 110 ℃, and maintaining for 2 hours to obtain a first mixed material;
step S2: and cooling the first mixed material to 50 ℃, adding a water removing agent, a coupling agent, gas-phase hydrophilic white carbon black and a catalyst, and mixing and stirring for 30 minutes to obtain a fine and transparent nail-free adhesive product.
Comparative example 1
The composition of the high-strength transparent nail-free glue of this example is shown in Table 10.
TABLE 10 COMPARATIVE EXAMPLE 1 high-Strength transparent type nail-free glue composition
Comparative example 1 a method for preparing a high-strength transparent type nail-free glue, comprising the steps of:
1) according to the proportion, adding silane modified polyether polymer, plasticizer, gas-phase hydrophilic white carbon black, ultraviolet absorbent, light stabilizer and antioxidant into a vacuum double-shaft stirring kettle, stirring and dispersing uniformly, vacuumizing less than or equal to-0.094 MPa, heating to 110 ℃, and maintaining for 2 hours to obtain a base material;
2) and cooling the first mixed material to 50 ℃, adding a water removing agent, a coupling agent and a catalyst, and mixing and stirring for 30 minutes to obtain a fine and transparent nail-free adhesive product.
Comparative example 2
The composition of the high-strength transparent nail-free glue of this example is shown in Table 11.
TABLE 11 COMPARATIVE EXAMPLE 2 HIGH-STRENGTH TRANSPARENT TYPE NON-NAIL GLUE COMPOSITION
Raw materials | Parts by mass |
SAT350 (silane-modified polyether polymer) | 55 |
Diisononyl phthalate (plasticizer) | 25 |
Gas-phase hydrophilic white carbon black (step S1 adding filler) | 0 |
UV-329 (ultraviolet absorber) | 0.4 |
UV-770 (light stabilizer) | 0.4 |
245 (antioxidant) | 0.2 |
Vinyl trimethoxy silane (Water scavenger) | 2 |
Ammonia propaneTrimethoxysilane (coupling agent) | 1.5 |
Gas-phase hydrophilic white carbon black (step S2 adding filler) | 15 |
Chelated tin catalysts | 0.5 |
Comparative example 2 a method for preparing a high-strength transparent type nail-free glue, comprising the steps of:
1) according to the proportion, adding the silane modified polyether polymer, the plasticizer, the ultraviolet absorbent, the light stabilizer and the antioxidant into a vacuum double-shaft stirring kettle, stirring and dispersing uniformly, vacuumizing to be less than or equal to-0.094 MPa, heating to 110 ℃, and maintaining for 2 hours to obtain a base material;
2) and cooling the first mixed material to 50 ℃, adding a water removing agent, a coupling agent, gas-phase hydrophilic white carbon black and a catalyst, and mixing and stirring for 30 minutes to obtain a fine and transparent nail-free adhesive product.
The high strength transparent type nail free adhesive products of examples 1 to 9 and comparative examples 1 to 2 were subjected to a performance test, and the performance test methods of the examples and comparative examples were as follows:
hardness the hardness of the cured silicone rubber was measured with a rubber durometer (model L X-A, Hengyu instruments and electronics Co., Ltd., Suzhou) with reference to GB/T531-2008.
Tensile strength and elongation at break: with reference to GB/T528-1998, tensile strength and elongation at break of the silicone rubber cured products were measured using a tensile tester (Zwick company, Zwick Z010, Germany).
Shear strength: according to GB/T7124-.
Transparency: referring to GB/T2410-2008, the light transmittance of the high-strength transparent nail-free adhesive is tested by adopting an SM-2 type light transmittance tester, and the thickness of the adhesive is 2 mm.
Thixotropy: with reference to the sag test method in JC/T2186-2013, a sag of 3mm or less indicates excellent thixotropy.
Storage stability: and (3) aging the packaged nail-free glue finished product in an electrothermal blowing drying oven at 70 ℃ for 168 hours, testing the extrudability of the nail-free glue before and after aging, and if the numerical value change value of the extrudability after aging is less than or equal to 50%, indicating that the storage stability of the nail-free glue is excellent.
The test results are shown in table 12.
TABLE 12 test results of examples and comparative examples
As can be seen from table 12, the high-strength transparent nail-free glue prepared in the embodiment of the present invention has the characteristics of high light transmittance, high tensile and shear strength, excellent thixotropy, excellent storage stability, and fast curing. Comparative example 1 is a transparent type nail-free adhesive with excellent light transmittance and storage stability, but the nail-free adhesive prepared by the process method has poor thixotropy and mechanical strength, and cannot be applied as a high-strength transparent type nail-free adhesive. Comparative example 2 is a typical transparent type nail-free adhesive with high mechanical strength and high thixotropy, but the nail-free adhesive prepared by the process method has low light transmittance and extremely poor storage stability, and cannot be applied as a high-strength transparent type nail-free adhesive. The embodiment shows that the traditional one-step filling mode is changed into two-stage filling mode by changing the feeding mode of the fumed silica, and the fumed silica can still keep high transparency even if the fumed silica reaches 15-20 percent.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. The high-strength transparent nail-free glue is characterized by comprising the following raw materials in parts by weight:
silane-modified polyether polymer: 20-80 parts of plasticizer: 10-50 parts of filler: 5-40 parts of stabilizer: 0.3-4.5 parts of water removing agent: 0.5-5 parts of coupling agent: 0.5-5 parts and a catalyst: 0.5 to 3 parts;
the high-strength transparent nail-free glue is prepared by the following method:
step S1: uniformly mixing a silane modified polyether polymer, a plasticizer, a filler and a stabilizer, and heating and dehydrating to obtain a first mixed material;
step S2: adding a water removing agent, a coupling agent, a filler and a catalyst into the first mixed material, and mixing and stirring to obtain a high-strength transparent nail-free adhesive;
wherein the filler is fumed silica.
2. The high-strength transparent nail-free glue according to claim 1, wherein the filler is fumed hydrophilic white carbon black with a specific surface area of 100m2/g~200m2/g。
3. The high-strength transparent nail-free glue according to claim 1, wherein the high-strength transparent nail-free glue is prepared from the following raw materials in parts by weight:
silane-modified polyether polymer: 30-60 parts of plasticizer: 20-40 parts of filler: 10-30 parts of stabilizer: 0.3-3 parts of water removing agent: 1-3 parts of a coupling agent: 1-3 parts and a catalyst: 0.5 to 2 portions.
4. The high-strength transparent type nail-free glue according to claim 1, wherein the silane-modified polyether polymer is selected from trimethoxy silane-terminated polyoxypropylene ether and/or methyl dimethoxy silane-terminated polyoxypropylene ether.
5. The high-strength transparent nail-free glue according to claim 1, wherein the coupling agent is selected from silane coupling agents.
6. The high-strength transparent type nail-free glue according to claim 1, wherein the plasticizer is at least one selected from phthalate plasticizers, phenyl sulfonate plasticizers, fatty alcohol ester plasticizers or polyether polyol plasticizers; the catalyst is an organic tin catalyst; the water removing agent is a silane water removing agent.
7. The high-strength transparent nail-free glue according to claim 1, wherein the stabilizer comprises a light stabilizer, an antioxidant and an ultraviolet absorber;
the ultraviolet absorbent is benzotriazole ultraviolet absorbent; the light stabilizer is a hindered amine light stabilizer; the antioxidant is hindered phenol antioxidant.
8. A method for preparing the high-strength transparent nail-free glue of any one of claims 1 to 7, comprising the following steps:
step S1: uniformly mixing a silane modified polyether polymer, a plasticizer, a filler and a stabilizer, and heating and dehydrating to obtain a first mixed material;
step S2: and adding a water removing agent, a coupling agent, a filler and a catalyst into the first mixed material, and mixing and stirring to obtain the high-strength transparent nail-free glue.
9. The method for preparing the high-strength transparent nail-free glue according to claim 7, wherein in the step S1, the silane-modified polyether polymer, the plasticizer, the filler, the stabilizer and the antioxidant are stirred under a vacuum condition and heated to 100-120 ℃ to obtain a first mixed material; wherein the filler is added in one or more times in the step S1.
10. The method as claimed in claim 7, wherein in step S2, when the first mixture is cooled to below 50 ℃, a water scavenger, a coupling agent, a filler and a catalyst are added; wherein the filler is added in one or more times in the step S2.
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CN113388353A (en) * | 2021-06-04 | 2021-09-14 | 浙江皇马科技股份有限公司 | Silane modified polyether nail-free glue and preparation method thereof |
CN113388353B (en) * | 2021-06-04 | 2023-03-07 | 浙江皇马科技股份有限公司 | Silane modified polyether nail-free glue and preparation method thereof |
CN114634786A (en) * | 2022-02-25 | 2022-06-17 | 浙江皇马科技股份有限公司 | Silane modified resin transparent sealant and preparation method thereof |
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