CN114464342A - Low-resistivity low-temperature solar silver paste and preparation method thereof - Google Patents
Low-resistivity low-temperature solar silver paste and preparation method thereof Download PDFInfo
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- CN114464342A CN114464342A CN202210065061.0A CN202210065061A CN114464342A CN 114464342 A CN114464342 A CN 114464342A CN 202210065061 A CN202210065061 A CN 202210065061A CN 114464342 A CN114464342 A CN 114464342A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 21
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- 239000002245 particle Substances 0.000 claims abstract description 23
- 239000002994 raw material Substances 0.000 claims abstract description 7
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- 238000006243 chemical reaction Methods 0.000 claims description 19
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- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 claims description 2
- PLDLPVSQYMQDBL-UHFFFAOYSA-N 2-[[3-(oxiran-2-ylmethoxy)-2,2-bis(oxiran-2-ylmethoxymethyl)propoxy]methyl]oxirane Chemical compound C1OC1COCC(COCC1OC1)(COCC1OC1)COCC1CO1 PLDLPVSQYMQDBL-UHFFFAOYSA-N 0.000 claims description 2
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- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 2
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- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 2
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- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0036—Details
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses low-resistivity low-temperature solar silver paste and a preparation method thereof. The raw materials of the silver paste comprise the following components: 87-93% of silver powder, 2-5% of resin, 1-2% of diluent, 0.5-2% of curing agent, 0.01-1% of thixotropic agent, 0.01-1% of catalyst and 2-5% of organic solvent. According to the invention, the conductivity of the silver powder is optimized by combining the silver powders with different appearances, different sizes and specifications and different tap densities and matching with other additives, and through the compact accumulation of the space, the contact points among the silver powder particles are improved, the gaps of the silver powder are reduced, and the resistivity and the intrinsic resistance of the slurry are reduced. The silver paste prepared by the invention has good stability and excellent contact resistance performance with low volume resistivity.
Description
Technical Field
The invention relates to the technical field of conductive silver paste preparation, in particular to low-resistivity low-temperature solar silver paste and a preparation method thereof.
Background
With the exhaustion of non-renewable resources such as petroleum and natural gas, new energy sources such as wind energy, tidal energy and solar energy are increasingly regarded. Solar energy is used as an inexhaustible new energy source, and the time and cost for establishing the solar power station are lower than those of the traditional power station. Therefore, in the long-term energy strategy, photovoltaic power generation is an ideal solution to energy crisis.
In recent years, solar cell technology has entered a rapid development stage, forming various types of technologyProducts such as crystalline silicon solar cells, inorganic semiconductor thin film cells, dye-sensitized solar cells, perovskite solar cells, organic polymer solar cells and the like, the conventional crystalline silicon is still the mainstream at present, the inorganic semiconductor thin film cells have the problems of high production cost, low conversion rate and the like, only occupy a small part of markets, and the dye-sensitized solar cells, the perovskite solar cells and the organic polymer solar cells are still in laboratories at present. The HIT cell is commonly called a heterojunction cell, combines the advantages of a crystalline silicon cell and a thin film cell, and is a hot direction for improving the conversion rate of a silicon-based solar cell. According to the technology, passivation treatment is carried out on the front surface and the rear surface of the crystalline silicon substrate, so that recombination of carriers generated by light is effectively prevented, the service life of the carriers is prolonged, and the conversion rate is improved. Due to the fact that the temperature of the HIT battery production process is below 250 ℃ due to the design of the structure, the silver paste of the metalized grid formed on the surface of the HIT battery needs to be cured at a low temperature, and therefore the silver paste is an important key raw material of the HIT battery. The conversion rate of HIT silver paste generally affects factors including resistivity, lap resistance, screen descending amount and the like, and the resistivity of the HIT silver paste which is mainstream at present is 5 x 10-6Omega cm, and as a significant influence of the conversion, < 5 x 10-6The resistivity of omega cm is beneficial to improving the conversion rate of HIT silver paste. Therefore, the preparation of the HIT silver paste with low resistivity is of great significance.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides low-resistivity low-temperature solar silver paste and a preparation method thereof. The silver paste prepared by the invention has good stability, fine wires are well screened, and the silver paste has excellent contact resistance performance with low volume resistivity.
The technical scheme of the invention is as follows:
the low-resistivity and low-temperature solar silver paste comprises the following raw materials in percentage by mass: 87-93% of silver powder, 2-5% of resin, 1-2% of diluent, 0.5-2% of curing agent, 0.01-1% of thixotropic agent, 0.01-1% of catalyst and 2-5% of organic solvent.
Further, the silver powder is flaky powder or spherical powder; the mass ratio of the flaky powder to the spherical powder is 0.01-0.3: 1, preferably 0.02 to 0.1.
Furthermore, the D50 of the flaky powder is 2-8 mu m, and the tap density is 4-6 g/mL.
Further, the spherical powder is spherical powder I or spherical powder II; the spherical powder I comprises the following spherical powder with the following particle size in percentage by weight: 5-15% D50 is 0.05-0.8 μm, and tap density is 3-5 g/mL; 65-80% of D50 is 2-4 μm, and the tap density is 5-8 g/mL; 14-30% D50 is 1-1.8 μm, and the tap density is 4-6 g/mL.
Further, the particle size distribution of the spherical powder II satisfies: d50 is 0.8-1.5 μm, tap density is 4-7 g/mL, D10 is 0.05-0.5 μm, D100 is 2-5 μm, preferably D10 is 0.1-0.5 μm, and D100 is 2.5-3.5 μm.
Further, the resin is composed of an epoxy resin and an auxiliary resin; the epoxy resin is more than two of bisphenol A epoxy resin, phenoxy resin, bisphenol F epoxy resin, aliphatic epoxy resin, organosilicon modified epoxy, polyether modified epoxy resin and epoxidized rubber; the bisphenol A epoxy resin is JER827, JER828, JER834, JER1007 or JER 1001; the phenoxy resin is PKHB, PKHH, PKHJ or PKFE; the bisphenol F epoxy resin is 4007P, 4010P, 7787, 835 or 830S; the aliphatic epoxy resin is 2021P, EHPE3150, HE200 or HE 2025; the organic silicon modified epoxy is ERS-Si1700, YH600 or EPS-231; the polyether modified epoxy resin is EP4000, EP4010S or EP 1307; the epoxidized rubber is JP100, JP200 or XP 1740; the auxiliary resin is at least one of polyether polyol, acrylic ester polyol, polyester polyol, polyurethane resin, polyester resin and acrylic resin; the auxiliary resin is resin containing hydroxyl and hydroxyl value more than 5 or resin containing carboxyl and carboxyl value more than 5, and the Tg of the auxiliary resin is less than 100 ℃; the polyether polyol is CP450, 2070A, 2000ML or 3003 LM; the acrylate polyol is Q850M, Q519, BM666 or BM 261; the polyester polyol is 4073, 4009, 4010 or 4040; the polyurethane resin is 5836, 5778, 5715 or 5703; the polyester resin Toyobo220, 280, 296 or GK 888; the acrylic resin AC169, AC166B or BM 52.
The mass ratio of the epoxy resin to the auxiliary resin is 1-10: 1, the mass ratio of the epoxy resin to the auxiliary resin is preferably 2-5: 1.
further, the diluent is epoxy glycidyl ether, and the diluent is one or more of ethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, 1, 6-hexanediol diglycidyl ether, 1, 4-butanediol diglycidyl ether, glycerol triglycidyl ether, pentaerythritol glycidyl ether, resorcinol diglycidyl ether, trimethylolpropane triglycidyl ether, hexahydrobisphenol A diglycidyl ether, terephthalic acid diglycidyl ether, and sorbitol glycidyl ether; the thixotropic agent is one or more of fumed silica, organic bentonite, hydrogenated castor oil and polyamide wax.
Further, the curing agent consists of a main curing agent and an auxiliary curing agent; the main curing agent is an enclosed isocyanate curing agent, and the deblocking temperature is 80-150 ℃, preferably 90-120 ℃; the auxiliary curing agent is one or more of imidazole curing agent, anhydride curing agent and dicyandiamide curing agent; the imidazole curing agent is one or more of benzimidazole, DBU, dimethyl tetraethylimidazole, PN23, PN23J and PN 40; the anhydride curing agent is one or more of methyl hexa, DDSA and methyl nadic anhydride; the dicyandiamide curing agent is DICY; the mass ratio of the main curing agent to the auxiliary curing agent is 1.5-5: 1, and preferably 2-5: 1.
Further, the thixotropic agent is one or more of fumed silica, organic bentonite, modified hydrogenated castor oil and polyamide wax.
Further, the catalyst is an epoxy catalyst, and the catalyst is one or more of CXC1612, CXC1614, XC9206, XC258, CXC1756, XC2007, Vicbase TC3630, Vicbase TC3633 and ICAM-8409; the organic solvent is one or more of propylene carbonate, ethylene glycol ethyl ether acetate, ethylene glycol butyl ether acetate, diethylene glycol butyl ether acetate, dimethyl adipate, diethyl adipate, propylene glycol methyl ether acetate and terpineol.
When the spherical powder used in the low-resistivity low-temperature solar silver paste is spherical powder II, the preparation method comprises the following steps of:
(1) adding 2-5% of organic solvent into a reaction kettle, mixing, adding 2-5% of resin, heating and stirring, cooling to room temperature, and filtering to obtain a resin solution;
(2) adding 0.01-1% of catalyst, 0.01-1% of thixotropic agent, 0.5-2% of curing agent and 1-2% of diluent into the resin solution prepared in the step (1) in sequence, and performing centrifugal dispersion to obtain an organic carrier;
(3) adding 87-93% of silver powder into the organic carrier prepared in the step (2), centrifugally dispersing, shearing and dispersing by a three-roll machine until the fineness of the slurry is less than 5 micrometers, and filtering to obtain a finished product silver slurry;
in the step (1), the heating temperature is 70-95 ℃; the stirring speed is 200-300 r/min, and the stirring time is 1-2 h;
in the step (2), the centrifugal dispersion speed is 800-850 rpm, and the time is 2-4 min;
in the step (3), the specific process of centrifugal dispersion is as follows: dispersing at 800rpm, 1000rpm, 1200rpm and 1600rpm for 1-3 min respectively.
When the spherical powder used in the low-resistivity low-temperature solar silver paste is the spherical powder I, the preparation method comprises the following steps of:
(1) adding 2-5% of organic solvent into a reaction kettle, mixing, adding 2-5% of resin, heating and stirring, cooling to room temperature, and filtering to obtain a resin solution;
(2) adding 0.01-1% of catalyst, 0.01-1% of thixotropic agent, 0.5-2% of curing agent and 1-2% of diluent into the resin solution prepared in the step (1) in sequence, and performing centrifugal dispersion to obtain an organic carrier;
(3) adding spherical powder with D50 of 0.05-0.8 mu m accounting for 5-15% of the spherical powder I into the organic carrier prepared in the step (2), centrifugally dispersing, adding the rest silver powder, centrifugally dispersing, shearing and dispersing by a three-roll machine until the fineness of the slurry is less than 5 mu m, and filtering to obtain the finished product silver slurry;
in the step (1), the heating temperature is 70-95 ℃; the stirring speed is 200-300 r/min, and the stirring time is 1-2 h;
in the step (2), the centrifugal dispersion speed is 800-850 rpm, and the time is 2-4 min;
in the step (3), the specific processes of centrifugal dispersion are as follows: dispersing at 800rpm, 1000rpm, 1200rpm and 1600rpm for 1-3 min respectively.
The beneficial technical effects of the invention are as follows:
(1) according to the invention, through the combination of the silver powders with different appearances, different sizes and specifications and different tap densities, the silver powders are tightly stacked, the contact points among the silver powder particles are improved, the gaps among the silver powders are reduced, the resistivity and intrinsic resistance of the slurry are reduced, and the conductivity of the silver powders is optimized. The silver paste prepared by the invention has good stability, fine wires are well screened, and the silver paste has excellent contact resistance performance with low volume resistivity.
(2) The resin used in the invention is composed of main resin and auxiliary resin, wherein the main resin is epoxy resin and mainly bears the caking property, heat resistance and stability of the sizing agent; the addition of the auxiliary resin improves the flexibility of the sizing agent resin and promotes the electrical property of the sizing agent.
(3) The invention uses dual curing agents, and introduces the dual curing agents and the catalyst to deepen the curing degree of the slurry and improve the performance of the slurry.
Drawings
Fig. 1 is an SEM image of the low resistivity and low temperature solar silver paste prepared in example 1 of the present invention.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and examples.
Example 1
The low-resistivity and low-temperature solar silver paste comprises the following raw materials in percentage by mass: 93% of silver powder, 1.5% of resin, 1% of diluent, 1.2% of curing agent, 0.2% of thixotropic agent, 0.1% of catalyst and 3% of organic solvent.
The silver powder is composed of flaky powder which accounts for 5% of slurry and has D50 of 3.0 mu m and a tap density of 4.5g/mL, spherical powder which accounts for 10% of slurry and has D50 of 0.6 mu m and a tap density of 4.8g/mL, spherical powder which accounts for 55% of slurry and has D50 of 2 mu m and a tap density of 6g/mL, and spherical powder which accounts for 23% of slurry and has D50 of 1 mu m and a tap density of 5.8g/mL, wherein the spherical powder is spherical powder and sphere-like powder.
Epoxy resin as main resin: 0.5% of phenoxy resin PKHH and 0.7% of bisphenol a epoxy resin JER827, auxiliary resin: 0.3% 2000 ML.
Diluent agent: 1% of resorcinol diglycidyl ether.
Curing agent: the curing agent comprises an isocyanate curing agent and an auxiliary curing agent, specifically comprises 1% of G282 isocyanate curing agent, the deblocking temperature is 80 ℃, and the auxiliary curing agent comprises the following components: 0.2% benzimidazole.
Thixotropic agent: 0.2% polyamide wax.
Catalyst: 0.1% XC 2007.
Organic solvent: 3% diethylene glycol butyl ether acetate.
The preparation method of the low-resistivity low-temperature solar silver paste comprises the following steps:
(1) mixing a 3% diethylene glycol monobutyl ether acetate organic solvent in a reaction kettle, gradually adding 1.5% resin, heating to 85 ℃, stirring at the speed of 260r/min for 1h until the resin is completely dissolved, standing, cooling to room temperature, and filtering with a 300-400 mesh gauze to obtain a resin solution;
(2) taking the prepared resin solution, gradually adding 0.1% of XC2007 catalyst, 0.2% of polyamide wax thixotropic agent, 1% of resorcinol diglycidyl ether, 1% of G282 isocyanate curing agent and 0.2% of benzimidazole auxiliary curing agent, centrifugally dispersing for 2min at 800rpm, and fully and uniformly stirring to obtain an organic carrier;
(3) the prepared organic carrier and ball powder with 10% D50 of 0.6 μm are added and stirred, and then are respectively centrifugally stirred and dispersed for 1min at the speed of 800rpm, 1000rpm, 1200rpm and 1600 rpm.
(4) Slowly adding the rest silver powder, simultaneously stirring uniformly by hand, after all the silver powder is stirred uniformly, respectively and centrifugally stirring at the rotating speeds of 800rpm, 1000rpm, 1200rpm and 1600rpm for 1min in sequence, after the silver powder is centrifuged uniformly, shearing and dispersing the slurry by using a three-roller machine until the fineness of the slurry reaches below 2 mu m, and stopping the three-roller process.
(5) And filtering and removing impurities and uneven large particles in the slurry by using a 500-mesh screen to obtain the low-resistivity and low-temperature solar silver paste.
Example 2
The low-resistivity and low-temperature solar silver paste comprises the following components in percentage by mass: 93% of silver powder, 1.5% of resin, 1% of diluent, 1.2% of curing agent, 0.2% of thixotropic agent, 0.1% of catalyst and 3% of organic solvent.
The silver powder is composed of flaky powder which accounts for 5% of slurry and has D50 of 3.0 mu m and a tap density of 4.5g/mL, spherical powder which accounts for 10% of slurry and has D50 of 0.6 mu m and a tap density of 4.8g/mL, spherical powder which accounts for 55% of slurry and has D50 of 2 mu m and a tap density of 6g/mL, and spherical powder which accounts for 23% of slurry and has D50 of 1 mu m and a tap density of 5.8g/mL, wherein the spherical powder comprises spherical powder and ball-like powder.
Epoxy resin as main resin: 0.4% of phenoxy resin PKFE and 0.7% of bisphenol A epoxy resin JER830S, auxiliary resin: 0.4% of 220.
Diluent agent: 1% of resorcinol diglycidyl ether.
Curing agent: the curing agent comprises an isocyanate curing agent and an auxiliary curing agent, specifically comprises 1% of G282 isocyanate curing agent, the deblocking temperature is 80 ℃, and the auxiliary curing agent comprises the following components: 0.2% dimethyl tetraethylimidazole.
Thixotropic agent: 0.2% polyamide wax.
Catalyst: 0.1% XC 2007.
Organic solvent: 3% diethylene glycol butyl ether acetate.
The preparation method of the low-resistivity low-temperature solar silver paste comprises the following steps:
(1) mixing 3% diethylene glycol monobutyl ether acetate organic solvent in a reaction kettle, gradually adding 1.5% high molecular resin, heating to 85 ℃, stirring at the speed of 260r/min for 2 hours until the resin is completely dissolved, standing, cooling to room temperature, and filtering with 300-400 mesh gauze to obtain a resin solution;
(2) taking the prepared resin solution, gradually adding 0.1% of XC2007 catalyst, 0.2% of polyamide wax thixotropic agent, 1% of resorcinol diglycidyl ether, 1% of G282 isocyanate curing agent and 0.2% of auxiliary curing agent of dimethyl tetraethyl imidazole, centrifugally dispersing for 2min at 800rpm, and fully and uniformly stirring to obtain an organic carrier;
(3) the prepared organic vehicle and 10% D50 spherical powder of 0.6 μm were stirred, and then centrifuged at 800rpm, 1000rpm, 1200rpm, and 1600rpm for 1 min.
(4) Slowly adding the silver powder, simultaneously stirring uniformly by hand, after all the silver powder is stirred uniformly, respectively and centrifugally stirring at the rotating speeds of 800rpm, 1000rpm, 1200rpm and 1600rpm for 1min in sequence, after the silver powder is centrifuged uniformly, shearing and dispersing the slurry by using a three-roller machine until the fineness of the slurry reaches below 2 mu m, and stopping the three rollers.
(4) And filtering the slurry by using a 500-mesh screen to remove impurities and uneven large particles in the slurry to obtain the low-resistivity low-temperature solar silver paste.
Example 3
The low-resistivity and low-temperature solar silver paste comprises the following components in percentage by mass: 93% of silver powder, 1.5% of resin, 1% of diluent, 1.2% of curing agent, 0.2% of thixotropic agent, 0.1% of catalyst and 3% of organic solvent.
Wherein the silver powder is flake powder which is 3.0 μm of D50 accounting for 5% of the slurry and has tap density of 4.5 g/mL; 88% D50 was 1 μm, tap density was 5.8g/mL, D10 was 0.1 μm, D100 was 3 μm, and the particle size distribution was broad.
Epoxy resin as main resin: 0.5% of phenoxy resin PKHH and 0.7% of bisphenol a epoxy resin JER827, auxiliary resin: 0.3% 2000 ML.
Diluent agent: 1% of resorcinol diglycidyl ether.
Curing agent: the curing agent comprises an isocyanate curing agent and an auxiliary curing agent, specifically comprises 1% of G282 isocyanate curing agent, the deblocking temperature is 80 ℃, and the auxiliary curing agent comprises the following components: 0.2% benzimidazole.
Thixotropic agent: 0.2% polyamide wax.
Catalyst: 0.1% XC 2007.
Organic solvent: 3% diethylene glycol butyl ether acetate.
The preparation method of the low-resistivity low-temperature solar silver paste comprises the following steps:
(1) mixing 3% diethylene glycol monobutyl ether acetate organic solvent in a reaction kettle, gradually adding 1.5% high molecular resin, heating to 85 ℃, stirring at the speed of 260r/min until the resin is completely dissolved, standing, cooling to room temperature, and filtering with 300-400 mesh gauze to obtain a resin solution;
(2) taking the prepared resin solution, gradually adding 0.1% of XC2007, 0.2% of polyamide wax thixotropic agent, 1% of resorcinol diglycidyl ether, 1% of G282 isocyanate curing agent and 0.2% of benzimidazole auxiliary curing agent, centrifugally dispersing for 2min at 800rpm, and fully and uniformly stirring to obtain an organic carrier;
(3) and adding 93% of silver powder into the prepared organic carrier, simultaneously stirring uniformly by hand, putting the organic carrier into a centrifugal dispersion machine after all the silver powder is stirred uniformly, respectively and centrifugally stirring for 1min at the rotating speeds of 800rpm, 1000rpm, 1200rpm and 1600rpm in sequence, shearing and dispersing the slurry by using a three-roller machine after the slurry is centrifuged uniformly until the fineness of the slurry reaches below 2 mu m, and stopping three rollers.
(4) And filtering and removing impurities and uneven large particles in the slurry by using a 500-mesh screen to obtain the low-resistivity and low-temperature solar silver paste.
Example 4
The low-resistivity and low-temperature solar silver paste comprises the following components in percentage by mass: 93% of silver powder, 0.5% of resin, 2% of diluent, 1.2% of curing agent, 0.2% of thixotropic agent, 0.1% of catalyst and 3% of organic solvent.
The silver powder is composed of flaky powder which accounts for 5% of slurry and has D50 of 3.0 mu m and a tap density of 4.5g/mL, spherical powder which accounts for 10% of slurry and has D50 of 0.6 mu m and a tap density of 4.8g/mL, spherical powder which accounts for 55% of slurry and has D50 of 2 mu m and a tap density of 6g/mL, and spherical powder which accounts for 23% of slurry and has D50 of 1 mu m and a tap density of 5.8g/mL, wherein the spherical powder is spherical powder.
Epoxy resin as main resin: 0.4% of phenoxy resin PKHH, auxiliary resin: 0.1% of GK 888.
Diluent agent: 2% hexahydrobisphenol A diglycidyl ether.
Curing agent: the curing agent comprises an isocyanate curing agent and an auxiliary curing agent, specifically 1% of B-897N isocyanate curing agent, wherein the deblocking temperature is 120 ℃, and the auxiliary curing agent comprises the following components in percentage by weight: 0.2% benzimidazole.
Thixotropic agent: 0.2% polyamide wax.
Catalyst: 0.1% XC 2007.
Organic solvent: 3% diethylene glycol butyl ether acetate.
The preparation method of the low-resistivity low-temperature solar silver paste comprises the following steps:
(1) mixing 3% diethylene glycol monobutyl ether acetate organic solvent in a reaction kettle, gradually adding 0.5% high molecular resin, heating to 85 ℃, stirring at the speed of 260r/min until the resin is completely dissolved, standing, cooling to room temperature, and filtering with 300-400 mesh gauze to obtain a resin solution;
(2) taking the prepared resin solution, gradually adding 0.1% of XC2007, 0.2% of polyamide wax thixotropic agent, 2% of hexahydro bisphenol A diglycidyl ether, 1% of B-897N isocyanate curing agent and 0.2% of benzimidazole auxiliary curing agent, centrifugally dispersing for 2min at 800rpm, and fully and uniformly stirring to obtain an organic carrier;
(3) the prepared organic carrier and spherical powder D50 of 0.6 μm were added and stirred, and then placed in a centrifugal disperser, and centrifuged and stirred at 800rpm, 1000rpm and 1200rpm for 1 min.
(4) Slowly adding the rest silver powder, simultaneously stirring uniformly by hand, putting into a centrifugal dispersion machine after all the silver powder is stirred uniformly, respectively and centrifugally stirring for 1min at the rotating speeds of 800rpm, 1000rpm, 1200rpm and 1600rpm in sequence, after the silver powder is centrifuged uniformly, shearing and dispersing the slurry by using a three-roller machine until the fineness of the slurry reaches below 2 mu m, and stopping three rollers.
(5) And filtering and removing impurities and uneven large particles in the slurry by using a 500-mesh screen to obtain the low-resistivity and low-temperature solar silver paste.
Example 5
The low-resistivity and low-temperature solar silver paste comprises the following components in percentage by mass: 87% of silver powder, 5% of resin, 1% of diluent, 2% of curing agent, 0.2% of thixotropic agent, 0.2% of catalyst and 4.6% of organic solvent.
Wherein the silver powder is flaky powder which is 3.0 mu m of D50 accounting for 10 percent of the slurry and has tap density of 4.5 g/mL; 77% D50 is 1 μm, tap density is 5.8g/mL, D10 is 0.1 μm, D100 is 3 μm, and the spherical powder has wide particle size distribution and is spherical powder.
Epoxy resin as main resin: 3% of phenoxy resin PKFE and 1.5% of bisphenol A epoxy resin JER828, auxiliary resin: 0.5% of AC 166B.
Diluent agent: 1% hexahydrobisphenol A diglycidyl ether.
Curing agent: the curing agent comprises an isocyanate curing agent and an auxiliary curing agent, specifically 1.5% of G282 isocyanate curing agent, the deblocking temperature is 80 ℃, and the auxiliary curing agent: 0.5% benzimidazole.
Thixotropic agent: 0.2% polyamide wax.
Catalyst: 0.1% XC 2007.
Organic solvent: 3% diethylene glycol butyl ether acetate.
The preparation method of the low-resistivity low-temperature solar silver paste comprises the following steps:
(1) mixing 4.6% diethylene glycol monobutyl ether acetate organic solvent in a reaction kettle, gradually adding 5% high molecular resin, heating to 90 ℃, stirring at the speed of 260r/min until the resin is completely dissolved, standing, cooling to room temperature, and filtering with 300-400 mesh gauze to obtain a resin solution;
(2) taking the prepared resin solution, gradually adding 0.1% of XC2007, 0.2% of polyamide wax thixotropic agent, 1% of hexahydro bisphenol A diglycidyl ether, 1.5% of G282 isocyanate curing agent and 0.5% of benzimidazole auxiliary curing agent, centrifugally dispersing for 2min at 800rpm, and fully and uniformly stirring to obtain an organic carrier;
(3) slowly adding the silver powder, simultaneously stirring uniformly by hand, putting the silver powder into a centrifugal dispersion machine after all the silver powder is stirred uniformly, respectively and centrifugally stirring for 1min at the rotating speeds of 800rpm, 1000rpm, 1200rpm and 1600rpm in sequence, shearing and dispersing the slurry by using a three-roller machine after the silver powder is centrifuged uniformly until the fineness of the slurry reaches below 2 mu m, and stopping three rollers.
(4) And filtering the slurry by using a 500-mesh screen to remove impurities and uneven large particles in the slurry to obtain the low-resistivity low-temperature solar silver paste.
Comparative example 1
The solar silver paste comprises the following components in percentage by mass: 93% of silver powder, 1.5% of resin, 1% of epoxy diluent, 1.3% of curing agent, 0.2% of thixotropic agent, 0% of catalyst and 3% of organic solvent.
Wherein the silver powder consists of flaky powder which accounts for 3.0 mu m of D50 accounting for 5 percent of the slurry and has the tap density of 4.5g/mL and spherical powder which accounts for 2 mu m of D50 accounting for 85 percent of the slurry and has the tap density of 6 g/mL.
Epoxy resin as main resin: 0.5% of phenoxy resin PKHH and 1.3% of bisphenol a epoxy resin JER827, auxiliary resin: none.
Epoxy diluent: 1% of resorcinol diglycidyl ether.
Curing agent: the curing agent comprises an isocyanate curing agent and an auxiliary curing agent, specifically 1% of G282 isocyanate curing agent, and the auxiliary curing agent comprises: none.
Thixotropic agent: 0.2% polyamide wax.
Catalyst: none.
Organic solvent: 3% diethylene glycol butyl ether acetate.
The preparation method of the solar silver paste comprises the following steps:
(1) mixing 3% diethylene glycol monobutyl ether acetate organic solvent in a reaction kettle, gradually adding 1.5% high molecular resin, heating to 85 ℃, stirring at the speed of 260r/min until the resin is completely dissolved, standing, cooling to room temperature, and filtering with 300-400 mesh gauze to obtain a resin solution;
(2) gradually adding 0.2% of polyamide wax thixotropic agent, 1% of resorcinol diglycidyl ether and 1% of G282 isocyanate curing agent into the prepared resin solution, performing centrifugal dispersion at 800rpm for 2min, and fully stirring to obtain an organic carrier;
(3) and (3) adding 93% of silver powder into the prepared organic carrier, simultaneously stirring uniformly by hand, after all the silver powder is stirred uniformly, respectively centrifugally dispersing for 1min at the rotating speeds of 800rpm, 1000rpm, 1200rpm and 1600rpm in sequence, after the mixture is centrifuged uniformly, shearing and dispersing the slurry by using a three-roller machine until the fineness of the slurry reaches below 2 mu m, and stopping three rollers.
(4) And filtering the slurry by using a 500-mesh screen to remove impurities and uneven large particles in the slurry to obtain the finished product silver paste.
Comparative example 2
The solar silver paste comprises the following components in percentage by mass: 93% of silver powder, 1.5% of polymer resin, 1% of diluent, 1.3% of curing agent, 0.2% of thixotropic agent, 0% of catalyst and 3% of organic solvent.
Wherein the silver powder is composed of flake powder which accounts for 5 percent of the slurry and has D50 of 3.0 mu m and tap density of 4.5g/mL, spherical powder which accounts for 10 percent of the slurry and has D50 of 0.6 mu m and tap density of 4.8g/mL, and spherical powder which accounts for 78 percent of the slurry and has D50 of 2 mu m and tap density of 6 g/mL.
The polymer resin is main resin: 0.5% of phenoxy resin PKHH and 0.7% of bisphenol a epoxy resin JER827, auxiliary resin: none.
Diluent agent: 1% of resorcinol diglycidyl ether.
Curing agent: the curing agent comprises an isocyanate curing agent and an auxiliary curing agent, specifically 1.3% of G282 isocyanate curing agent, and the auxiliary curing agent comprises: none.
Thixotropic agent: 0.2% polyamide wax.
Catalyst: none.
Organic solvent: 3% diethylene glycol butyl ether acetate.
The preparation method of the solar silver paste comprises the following steps:
(1) mixing 3% diethylene glycol monobutyl ether acetate organic solvent in a reaction kettle, gradually adding 1.5% high molecular resin, heating to 85 ℃, stirring at the speed of 260r/min until the resin is completely dissolved, standing, cooling to room temperature, and filtering with 300-400 mesh gauze to obtain a resin solution;
(2) taking the prepared resin solution, gradually adding 0.2% of polyamide wax thixotropic agent, 1% of resorcinol diglycidyl ether and 1.3% of G282 isocyanate curing agent, carrying out centrifugal dispersion for 2min at 800rpm, and fully and uniformly stirring to obtain an organic carrier;
(3) the prepared organic carrier and ball powder with 10% D50 of 0.6 μm are added and stirred, and then put into a centrifugal dispersion machine to be respectively and centrifugally stirred for 1min at the speed of 800rpm, 1000rpm and 1200 rpm.
(4) Slowly adding the rest silver powder, simultaneously stirring uniformly by hand, putting into a centrifugal dispersion machine after all the silver powder is stirred uniformly, respectively and centrifugally stirring for 1min at the rotating speeds of 800rpm, 1000rpm, 1200rpm and 1600rpm in sequence, after the silver powder is centrifuged uniformly, shearing and dispersing the slurry by using a three-roller machine until the fineness of the slurry reaches below 2 mu m, and stopping three rollers.
(5) And filtering the slurry by using a 500-mesh screen to remove impurities and uneven large particles in the slurry to obtain the finished product silver paste.
Comparative example 3
The solar silver paste comprises the following components in percentage by mass: 93% of silver powder, 1.5% of polymer resin, 1% of diluent, 1.3% of curing agent, 0.2% of thixotropic agent, 0% of catalyst and 3% of organic solvent.
Wherein the silver powder comprises 5% of D50 of 3.0 μm and a tap density of 4.5g/mL in the slurry, 10% of spherical powder with D50 of 0.6 μm and a tap density of 4.8g/mL, 55% of spherical powder with D50 of 2 μm and a tap density of 6g/mL, and 23% of spherical powder with D50 of 1 μm and a tap density of 5.8 g/mL.
The polymer resin is main resin: 0.5% of phenoxy resin PKHH and 0.7% of bisphenol A epoxy resin jER827, auxiliary resin: none.
Diluent agent: 1% of resorcinol diglycidyl ether.
Curing agent: the curing agent comprises an isocyanate curing agent and an auxiliary curing agent, specifically 1.3% of G282 isocyanate curing agent, and the auxiliary curing agent comprises: none.
Thixotropic agent: 0.2% polyamide wax.
Catalyst: none.
Organic solvent: 3% diethylene glycol butyl ether acetate.
The preparation method of the solar silver paste comprises the following steps:
(1) mixing 3% diethylene glycol monobutyl ether acetate organic solvent in a reaction kettle, gradually adding 1.5% high molecular resin, heating to 85 ℃, stirring at the speed of 260r/min until the resin is completely dissolved, standing, cooling to room temperature, and filtering with 300-400 mesh gauze to obtain a resin solution;
(2) taking the prepared resin solution, gradually adding 0.2% of polyamide wax thixotropic agent, 1% of resorcinol diglycidyl ether and 1.3% of G282 isocyanate curing agent, carrying out centrifugal dispersion for 2min at 800rpm, and fully and uniformly stirring to obtain an organic carrier;
(3) the prepared organic carrier and ball powder with 10% D50 of 0.6 μm are added and stirred, and then put into a centrifugal dispersion machine to be respectively and centrifugally stirred for 2min at the speed of 800rpm, 1200rpm and 1600 rpm.
(4) Slowly adding the rest silver powder, simultaneously stirring uniformly by hand, putting into a centrifugal dispersion machine after all the silver powder is stirred uniformly, respectively and centrifugally stirring for 1min at the rotating speeds of 800rpm, 1000rpm, 1200rpm and 1600rpm in sequence, after the silver powder is centrifuged uniformly, shearing and dispersing the slurry by using a three-roller machine until the fineness of the slurry reaches below 2 mu m, and stopping three rollers.
(5) And filtering the slurry by using a 500-mesh screen to remove impurities and uneven large particles in the slurry to obtain the finished product silver paste.
Comparative example 4
The solar silver paste comprises the following components in percentage by mass: 93% of silver powder, 1.5% of polymer resin, 1% of epoxy diluent, 1.3% of curing agent, 0.2% of thixotropic agent, 0% of catalyst and 3% of organic solvent.
Wherein the silver powder comprises 5% of D50 of 3.0 μm and 4.5g/mL tap density of flaky powder, 10% of D50 of 0.6 μm and 5.3g/mL tap density of spherical powder, 55% of D50 of 2 μm and 6g/mL tap density of spherical powder, and 23% of D50 of 1 μm and 5.8g/mL tap density of spherical powder.
The polymer resin is main resin: 0.5% of phenoxy resin PKHH and 0.7% of bisphenol A epoxy resin jER827, auxiliary resin: 0.3% 2000 ML.
Epoxy diluent: 1% of resorcinol diglycidyl ether.
Curing agent: the curing agent comprises an isocyanate curing agent and an auxiliary curing agent, specifically 1.1% of G282 isocyanate curing agent, and the auxiliary curing agent comprises: none.
Thixotropic agent: 0.2% polyamide wax.
Catalyst: none.
Organic solvent: 3% diethylene glycol butyl ether acetate.
The preparation method of the solar silver paste comprises the following steps:
(1) mixing a 3% diethylene glycol monobutyl ether acetate organic solvent in a reaction kettle, gradually adding 2.3% high molecular resin, heating to 70-95 ℃, stirring at a speed of 260r/min until the resin is completely dissolved, standing, cooling to room temperature, and filtering with 300-400 mesh gauze to obtain a resin solution;
(2) taking the prepared resin solution, gradually adding 0.2% of polyamide wax thixotropic agent, 1% of resorcinol diglycidyl ether and 1.1% of G282 isocyanate curing agent, carrying out centrifugal dispersion for 2min at 800rpm, and fully and uniformly stirring to obtain an organic carrier;
(3) the prepared organic carrier and ball powder with 10% D50 of 0.6 μm are added and stirred, and then put into a centrifugal dispersion machine to be respectively and centrifugally stirred for 1min at the speed of 800rpm, 1000rpm and 1200 rpm.
(4) Slowly adding the rest silver powder, simultaneously stirring uniformly by hand, putting into a centrifugal dispersion machine after all the silver powder is stirred uniformly, respectively and centrifugally stirring for 1min at the rotating speeds of 800rpm, 1000rpm, 1200rpm and 1600rpm in sequence, after the silver powder is centrifuged uniformly, shearing and dispersing the slurry by using a three-roller machine until the fineness of the slurry reaches below 2 mu m, and stopping three rollers.
(5) And filtering the slurry by using a 500-mesh screen to remove impurities and uneven large particles in the slurry to obtain the finished product silver paste.
Comparative example 5
The solar silver paste comprises the following components in percentage by mass: 93% of silver powder, 1.5% of polymer resin, 1% of epoxy diluent, 1.3% of curing agent, 0.2% of thixotropic agent, 0% of catalyst and 3% of organic solvent.
Wherein the silver powder is flake powder which accounts for 5 percent of the slurry, has D50 of 3.0 mu m and has tap density of 4.5 g/mL; 10% of D50 is 0.6 μm, the tap density is 4.8g/mL, 55% of D50 is 2 μm, the tap density is 6g/mL, and 23% of D50 is 1 μm, the tap density is 5.8 g/mL.
The polymer resin is main resin: 0.5% of phenoxy resin PKHH and 0.7% of bisphenol a epoxy resin JER827, auxiliary resin: 0.3% 2000 ML.
Epoxy diluent: 1% of resorcinol diglycidyl ether.
Curing agent: the curing agent comprises an isocyanate curing agent and an auxiliary curing agent, specifically 1.1% of G282 isocyanate curing agent, and the auxiliary curing agent comprises: 0.2% benzimidazole.
Thixotropic agent: 0.2% polyamide wax.
Catalyst: none.
Organic solvent: 3% diethylene glycol butyl ether acetate.
The preparation method of the solar silver paste comprises the following steps:
(1) mixing 3% diethylene glycol monobutyl ether acetate organic solvent in a reaction kettle, gradually adding 1.5% high molecular resin, heating to 85 ℃, stirring at the speed of 260r/min until the resin is completely dissolved, standing, cooling to room temperature, and filtering with 300-400 mesh gauze to obtain a resin solution;
(2) taking the prepared resin solution, gradually adding 0.2% of polyamide wax thixotropic agent, 1% of resorcinol diglycidyl ether, 1.1% of G282 isocyanate curing agent and 0.2% of benzimidazole auxiliary curing agent, centrifugally dispersing for 2min at 800rpm, and fully and uniformly stirring to obtain an organic carrier;
(3) the prepared organic carrier and ball powder with 10% D50 of 0.6 μm are added and stirred, and then put into a centrifugal dispersion machine to be respectively and centrifugally stirred for 1min at the speed of 800rpm, 1000rpm and 1200 rpm.
(4) Slowly adding the rest silver powder, simultaneously stirring uniformly by hand, putting into a centrifugal dispersion machine after all the silver powder is stirred uniformly, respectively and centrifugally stirring for 1min at the rotating speeds of 800rpm, 1000rpm, 1200rpm and 1600rpm in sequence, after the silver powder is centrifuged uniformly, shearing and dispersing the slurry by using a three-roller machine until the fineness of the slurry reaches below 2 mu m, and stopping three rollers.
(5) And filtering the slurry by using a 500-mesh screen to remove impurities and uneven large particles in the slurry to obtain the finished product silver paste.
Test example:
preparing a pattern by using the silver paste prepared in the embodiments 1-5 and the comparative examples 1-5, curing the pattern in an oven at 200 ℃ for 30min, measuring the resistance after curing, and calculating the resistivity through a resistivity formula; the overlap resistance was calculated by the intercept method, the viscosity was measured by a plate viscometer, the ratio of the viscosities at the intercept rates of 4.62rpm and 46.6rpm was recorded as the thixotropic index, and the measurement results are shown in Table 1.
TABLE 1
As can be seen from Table 1, in comparative example 3, compared with comparative examples 1-2, the particle size distribution and the silver powder combination of the silver powder are improved, the resistivity and the lap resistance of the paste are obviously reduced, and the effective contact point of the silver powder is improved, the resistivity is improved, and the lap resistance is also improved probably because the particle size powder enters and fills the gaps between the original silver powders. Compared with the base material in the comparative example 3, the viscosity of the base material is reduced, the thixotropic index is increased, the resistivity and the lap resistance are reduced, small-molecular polyester is added, the viscosity of the paste is improved, a small amount of hydroxyl groups are provided, hydrogen bonds of resin of the paste are increased, a gel-like state is formed, the thixotropy of the paste is improved, the resin has flexibility and multiple functionality, the rigidity of an original epoxy system of the paste is improved, the resistivity of the paste is reduced, the adhesive force is increased, and the lap resistance is improved. The viscosity of comparative example 5 is not significantly different from that of comparative example 4, and the resistivity and the lap joint resistance of comparative example 5 are reduced, and a dual curing effect is formed, possibly due to the use of an imidazole curing agent, thereby improving the curing speed and curing degree of the paste, reducing the resistance, increasing the adhesion effect, and improving the lap joint effect.
The resistivity and the lap resistance of example 1 are slightly reduced compared with those of comparative example 5, and it is possible that the catalyst increases the dual curing effect and promotes the reduction of the resistivity and the lap resistance, but the influence on the overall performance is not as strong as that of the latter, and the thixotropic index is increased and the viscosity is reduced while the resistivity and the lap resistance of example 1 are reduced compared with those of comparative example 5. Compared with the raw material of the example 1, the raw material of the example 2 replaces a multi-powder combination scheme with single silver powder with wide distribution, but the mechanism that powder with different particle sizes is introduced to improve the particle size distribution is consistent with the mechanism of the example 1, the space effective accumulation of the silver powder is improved, the resistivity and the lap resistance are also smaller than those of the comparative examples 1-5, and the single silver powder with wide distribution can also have a good space accumulation effect, but the lap resistance is larger than that of the example 1 and is probably related to less powder with small particle size. In example 3, compared with example 1, the resin and the proportion thereof are changed, and the resistivity and the lap resistance of the resin are found to be smaller than those of comparative examples 1-5, which shows that the resin combination is favorable for improving the conductivity of the paste. Both the viscosity and the resistivity of example 4 and example 5 are reduced compared to example 1, and example 4 increases the amount of diluent to reduce the viscosity, but an excessive amount of diluent may cause insufficient curing, resulting in a decrease in resistivity. Example 5 increases the proportion of resin, and promotes a decrease in viscosity of the entire slurry, but the decrease in silver content still causes a problem of deterioration in resistivity, so the example increases the proportion of flakes, and improves the resistivity of the slurry by increasing the content of flakes.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The low-resistivity and low-temperature solar silver paste is characterized by comprising the following raw materials in percentage by mass: 87-93% of silver powder, 2-5% of resin, 1-2% of diluent, 0.5-2% of curing agent, 0.01-1% of thixotropic agent, 0.01-1% of catalyst and 2-5% of organic solvent.
2. The low resistivity and low temperature solar silver paste of claim 1, wherein the silver powder consists of flake and sphere powders; the mass ratio of the flaky powder to the spherical powder is 0.01-0.3: 1; the spherical powder is one or two of ball powder and ball-like powder.
3. The low-resistivity and low-temperature solar silver paste as claimed in claim 2, wherein the flake powder has a D50 of 2-8 μm and a tap density of 4-6 g/mL.
4. The low resistivity and low temperature solar silver paste of claim 2, wherein the spherical powder is spherical powder I or spherical powder II; the spherical powder I comprises the following spherical powder with the following particle sizes in percentage by weight: 5-15% D50 is 0.05-0.8 μm, and tap density is 3-5 g/mL; 65-80% of D50 is 2-4 μm, and the tap density is 5-8 g/mL; 14-30% D50 is 1-1.8 μm, and the tap density is 4-6 g/mL; the particle size distribution of the spherical powder II meets the following requirements: d50 is 0.8 to 1.5 μm, D10 is 0.05 to 0.5 μm, and D100 is 2 to 5 μm.
5. The low resistivity, low temperature solar silver paste of claim 1, wherein the resin is comprised of a primary resin and a secondary resin; the main resin is more than two of bisphenol A epoxy resin, phenoxy resin, bisphenol F epoxy resin, aliphatic epoxy resin, organic silicon modified epoxy, polyether modified epoxy resin and epoxidized rubber; the auxiliary resin is at least one of polyether polyol, acrylic ester polyol, polyester polyol, polyurethane resin, polyester resin and acrylic resin; the mass ratio of the main resin to the auxiliary resin is 1-10: 1.
6. the low resistivity and low temperature solar silver paste of claim 1, wherein the diluent is epoxy glycidyl ether, and the diluent is one or more of ethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, 1, 6-hexanediol diglycidyl ether, 1, 4-butanediol diglycidyl ether, glycerol triglycidyl ether, pentaerythritol glycidyl ether, resorcinol diglycidyl ether, trimethylolpropane triglycidyl ether, hexahydrobisphenol a diglycidyl ether, terephthalic acid diglycidyl ether, and sorbitol glycidyl ether.
7. The low-resistivity low-temperature solar silver paste according to claim 1, wherein the curing agent consists of a main curing agent and an auxiliary curing agent; the main curing agent is an enclosed isocyanate curing agent, and the deblocking temperature is 80-150 ℃; the auxiliary curing agent is one or more of imidazole curing agent, anhydride curing agent and dicyandiamide curing agent; the mass ratio of the main curing agent to the auxiliary curing agent is 1.5-5: 1.
8. the low resistivity and low temperature solar silver paste of claim 1, wherein the thixotropic agent is one or more of fumed silica, organobentonite, modified hydrogenated castor oil, and polyamide wax.
9. The low resistivity, low temperature solar silver paste of claim 1, wherein the catalyst is one or more of CXC1612, CXC1614, XC9206, XC258, CXC1756, XC2007, Vicbase TC3630, Vicbase TC3633, ICAM-8409; the organic solvent is one or more of propylene carbonate, ethylene glycol ethyl ether acetate, ethylene glycol butyl ether acetate, diethylene glycol butyl ether acetate, dimethyl adipate, diethyl adipate, propylene glycol methyl ether acetate and terpineol.
10. The preparation method of the low-resistivity and low-temperature solar silver paste as claimed in any one of claims 1 to 9, wherein the preparation method comprises the following steps of:
(1) adding 2-5% of organic solvent into a reaction kettle, mixing, adding 2-5% of resin, heating and stirring, cooling to room temperature, and filtering to obtain a resin solution;
(2) adding 0.01-1% of catalyst, 0.01-1% of thixotropic agent, 0.5-2% of curing agent and 1-2% of diluent into the resin solution prepared in the step (1) in sequence, and performing centrifugal dispersion to obtain an organic carrier;
(3) adding 87-93% of silver powder into the organic carrier prepared in the step (2), centrifugally dispersing, shearing and dispersing by a three-roll machine until the fineness of the slurry is less than 5 micrometers, and filtering to obtain low-resistivity low-temperature solar silver paste;
in the step (1), the heating temperature is 70-95 ℃; the stirring speed is 200-300 r/min, and the stirring time is 1-2 h;
in the step (2), the centrifugal dispersion speed is 800-850 rpm, and the time is 2-4 min;
in the step (3), the specific process of centrifugal dispersion is as follows: dispersing at 800rpm, 1000rpm, 1200rpm and 1600rpm for 1-3 min respectively.
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