CN114683226A - Disc brake mechanism and wafer carrying platform - Google Patents
Disc brake mechanism and wafer carrying platform Download PDFInfo
- Publication number
- CN114683226A CN114683226A CN202210317570.8A CN202210317570A CN114683226A CN 114683226 A CN114683226 A CN 114683226A CN 202210317570 A CN202210317570 A CN 202210317570A CN 114683226 A CN114683226 A CN 114683226A
- Authority
- CN
- China
- Prior art keywords
- disc
- brake
- carrier
- base
- disc brake
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H1/00—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby
- B25H1/14—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby with provision for adjusting the bench top
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H1/00—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a disc brake mechanism and a wafer carrier, belonging to the field of high-precision machines, wherein the disc brake mechanism comprises a base brake actuating unit and a carrier disc lower connecting unit which are arranged in an overlapped mode, the base brake actuating unit is fixed above a base, and the carrier disc lower connecting unit is connected with a carrier disc from the lower side of the carrier disc; the base brake actuating unit is used for actuating the attraction or separation of the lower connecting unit of the carrying disc so as to realize whether the carrying disc is braked or not; the wafer carrying platform comprises a carrying platform main shaft, a carrying disk, a carrying platform base, a carrying platform air floatation anchor, a carrying disk brake assembly, a main shaft elastic support assembly and a centering assembly; the disc brake mechanism is arranged between the carrier platform base and the carrier disc and is used for passive braking and positioning of the carrier disc; the invention provides a brake positioning function for the passively rotating carrier disc, reduces the cost, ensures the precision and the stability of the carrier platform, and is convenient to popularize and apply in the fields of semiconductor volume detection and high-precision processing with a motion platform.
Description
Technical Field
The invention belongs to the field of high-precision machines, and particularly relates to a disc brake mechanism and a wafer carrying platform.
Background
In the detection and processing technology, a stable workbench is generally required, the workbench is generally supported on the bottom surface through a rack or feet and serves as a carrying disc of a material carrying part, and an auxiliary mechanism is required to be adopted for braking positioning under the condition of non-active driving. However, in the conventional stage, passive rotation (no rotation drive shaft) does not occur, and therefore, a brake positioning assist mechanism needs to be provided for the passively rotating carrier plate.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a disk brake mechanism and a wafer carrier, which can solve the problems.
A disc brake mechanism comprises a base brake actuating unit and a carrying disc lower connecting unit which are arranged in an overlapped mode, wherein the base brake actuating unit is fixed above a base, and the carrying disc lower connecting unit is connected with a carrying disc from the lower side of the carrying disc; the base brake actuating unit is used for actuating attraction or separation of the lower connection unit of the carrier disc so as to realize whether the carrier disc brakes or not.
Further, the base brake actuating unit comprises a disc brake base, a disc brake reed, a reed clamp and a disc brake actuating piece; the disc brake base is concave in the middle and convex at two ends, the outer ends of disc brake reeds are fixed to two ends of the disc brake base, and the disc brake reeds are connected with the disc brake actuating piece through the reed clamps so that the disc brake actuating piece is elastically supported above the middle of the disc brake base.
Furthermore, the lower connection unit of the carrier plate comprises a brake pad and a brake pad adapter; and the two ends of the brake pad are fixedly connected with the carrying disc through the brake pad adapter.
Furthermore, base brake actuating unit still includes two brake stoppers the one end of brake stopper sets up limiting flange limiting groove is seted up to the side of reed clamp, and the bottom surface of brake stopper is fixed to the both ends of dish base of stopping inboard to make limiting flange gomphosis extremely in the limiting groove.
Furthermore, the side edge of the plate of the brake pad is an arc-shaped edge matched with the carrying disc.
The invention also provides a wafer carrier, which comprises a carrier main shaft, a carrier disc, a carrier base, carrier air floatation feet, a carrier disc brake component, a main shaft elastic support component and a correcting component; wherein the main shaft of the carrier adopts a lifting shaft; the carrier spindle is vertically arranged in a bearing hole formed in the carrier base; the carrier base is supported on the frame in a floating or sliding manner through a plurality of carrier air floatation anchors; the middle part of the bottom surface of the carrier disc is fixed to the top surface of the carrier table main shaft, and the carrier disc is driven to move up and down through the carrier table main shaft; the plurality of carrying disc brake assemblies are arranged between the carrying platform base and the carrying disc and used for braking the carrying disc; the main shaft elastic support assembly is used for elastically connecting the carrier main shaft with the carrier base so as to enhance the stability of the carrier main shaft; the disc brake assembly adopts the disc brake mechanism, and the disc brake mechanism is arranged between the carrier platform base and the carrier disc and used for passive brake positioning of the carrier disc.
Compared with the prior art, the invention has the beneficial effects that: the disk brake mechanism and the wafer carrying platform can flexibly support wafers and silicon wafers to wait for detection or to-be-processed workpieces in a suspended manner, provide a brake positioning function for the passively rotating carrying disk, reduce the cost, ensure the precision and the stability of the carrying platform, and are convenient to popularize and apply in the fields of semiconductor quantity detection and high-precision processing with moving platforms.
Drawings
FIG. 1 is an assembled schematic view of a disc brake mechanism;
FIG. 2 is an exploded view of FIG. 1;
FIG. 3 is a schematic view of an overlapping manner of another embodiment;
FIG. 4 is a schematic view of one embodiment of a wafer carrier;
FIG. 5 is a schematic view of another embodiment of a wafer carrier;
in the figure:
100. a disc brake mechanism;
1. a disc brake base;
2. a disc brake spring plate;
3. a reed clip; 31. a limiting groove;
4. a disc brake actuator; 41. an air tap;
5. a brake pad;
6. a brake pad adapter;
7. a brake limiting block; 71. a limiting flange;
10000. a wafer carrier;
1000. a stage main shaft;
2000. a carrying tray;
3000. a carrier base;
4000. carrying platform air floatation anchor;
5000. a carrier disc brake assembly;
6000. a main shaft elastic support component;
7000. a correcting component;
8000. a bearing platform outer end component;
9000. the carrier closing plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Disc brake mechanism
A disc brake mechanism, referring to fig. 1 and 3, a disc brake mechanism 100 includes a base brake actuating unit and a carrier disc lower connecting unit, which are overlapped, the base brake actuating unit is fixed above a base, and the carrier disc lower connecting unit is connected with a carrier disc from below the carrier disc; the base brake actuating unit is used for actuating to attract or separate the lower connecting unit of the carrying disc so as to realize whether the carrying disc is braked or not.
The base brake actuating unit comprises a disc brake base 1, a disc brake reed 2, a reed clamp 3 and a disc brake actuating piece 4. The specific connection relationship is as follows.
The disc brake base 1 is concave in the middle and convex at two ends, the outer ends of the disc brake reeds 2 are fixed at two ends of the disc brake base 1, and the disc brake reeds 2 are connected with the disc brake actuating piece 4 through the reed clips 3, so that the disc brake actuating piece 4 is elastically supported above the middle of the disc brake base 1.
The lower carrier disc connecting unit comprises a brake pad 5 and a brake pad adapter 6; and the two ends of the brake pad 5 are fixedly connected with the carrying disc through the brake pad adapter 6.
The disc brake base 1 is ︺ -shaped, and the brake pad 5 and the brake pad adapters 6 at two ends form the shape of the brake pad.
In a specific example, the disc brake actuator 4 is a pneumatic brake air-float pad and is connected to the vacuum source assembly through an air nozzle 41.
Further, the base brake actuating unit further comprises two brake limiting blocks 7, one ends of the brake limiting blocks 7 are provided with limiting flanges 71, the side surfaces of the reed clips 3 are provided with limiting grooves 31, the bottom surfaces of the brake limiting blocks 7 are fixed to the inner sides of the two ends of the disc brake base 1, and the limiting flanges 71 are embedded into the limiting grooves 31.
Furthermore, the side edge of the plate of the brake block 5 is an arc-shaped edge matched with the carrying disc.
Overlapping mode of base brake actuating unit and carrier disc lower connecting unit
The first method is as follows: referring to fig. 1 and 3, the base brake actuating unit comprises two disc brake reeds 2, two reed clamps 3 and a disc brake actuating piece 4, the outer ends of the two disc brake reeds 2 are fixed to the two ends of the disc brake base 1, the upper surfaces of the inner ends of the two disc brake reeds 2 are connected with the disc brake actuating piece 4 through the reed clamps 3, and the brake piece 5 penetrates between the bottom surface of the disc brake actuating piece 4 and the top surface of the middle part of the disc brake base 1 to form the spatial arrangement of the disc brake actuating piece 4 for attracting the brake from the lower part.
The second method comprises the following steps: referring to fig. 2, the base brake actuating unit includes a disc brake spring 2, two spring clips 3 and a disc brake actuating member 4; two ends of the top surface of the disc brake actuating piece 4 are fixedly connected with the bottom surface of the middle part of the disc brake reed 2 through the two reed clamps 3; the brake block 5 penetrates between the lower surface of the middle part of the disc brake reed 2 and the top surface of the disc brake actuating piece 4 to form the spatial arrangement of the disc brake actuating piece 4 for attracting the brake from the upper part.
Wafer carrying platform
Referring to fig. 4 and 5, wafer stage 10000 includes a stage spindle 1000, a carrier plate 2000, a stage base 3000, a stage air-floating foot 4000, a carrier plate brake assembly 5000, a spindle elastic support assembly 6000, and a centering assembly 7000.
Arrangement relation: the carrier main shaft 1000 adopts a lifting shaft; the carrier spindle 1000 is vertically arranged in a bearing hole formed in the carrier base 3000; the stage base 3000 is supported on the frame by floating or sliding via a plurality of stage air floatation anchors 4000; the middle part of the bottom surface of the carrier disc 2000 is fixed to the top surface of the carrier spindle 1000, and the carrier disc 2000 is driven to move up and down by the carrier spindle 1000; a plurality of carrier disc brake assemblies 5000 are arranged between the carrier table base 3000 and the carrier disc 2000, and are used for braking the carrier disc 2000; spindle spring support assembly 6000 is used to resiliently couple stage spindle 1000 to stage base 3000 to enhance the stability of stage spindle 1000.
The carrier disc brake assembly 5000 adopts the disc brake mechanism 100, and the disc brake mechanism 100 is arranged between the carrier base 3000 and the carrier disc 2000 and used for passive brake positioning of the carrier disc 2000.
Further, the wafer carrier 10000 further includes two horizontal limiting members, and the two horizontal limiting members are disposed at two horizontal ends of the carrier base.
In another embodiment, referring to fig. 5, wafer stage 10000 further comprises a stage outer end component 8000 and a stage closure plate 9000.
The stage closing plate 9000 is connected to the stage base 3000 and the stage outer end component 8000 in a straddling manner from the top, and the lower space is used for arranging an X-axis beam.
Other functional structures, not shown, such as brake band assemblies, may be mounted on the stage closure plate 9000 in this embodiment.
Further, two sets of beam stop air-floating pads are arranged on two opposite surfaces of the stage base 3000 and the stage outer end assembly 8000, and are used for supporting beams and the like arranged below the stage closing plate 9000.
The carrying platform can be used for high-precision supporting of wafers and other similar plate products, and can be applied to high-precision detection and processing machines, such as machines of quantity detection machines of semiconductor wafers and photovoltaic wafers, high-precision measuring mechanisms, three-coordinate measuring machines and the like, so that stable supporting, vibration absorbing and positioning effects are improved.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A disc brake mechanism, its characterized in that: the disc brake mechanism (100) comprises a base brake actuating unit and a carrying disc lower connecting unit which are arranged in an overlapped mode, the base brake actuating unit is fixed above the base, and the carrying disc lower connecting unit is connected with the carrying disc from the lower side of the carrying disc; the base brake actuating unit is used for actuating attraction or separation of the lower connection unit of the carrier disc so as to realize whether the carrier disc brakes or not.
2. The disc brake mechanism of claim 1, wherein:
the base brake actuating unit comprises a disc brake base (1), a disc brake reed (2), a reed clamp (3) and a disc brake actuating piece (4); the disc brake base (1) is convex at the two concave ends, the outer ends of the disc brake reeds (2) are fixed at the two ends of the disc brake base (1), and the disc brake reeds (2) are connected with the disc brake actuating piece (4) through the reed clips (3), so that the disc brake actuating piece (4) is elastically supported above the middle of the disc brake base (1).
3. The disc brake mechanism of claim 2, wherein:
the lower carrier disc connecting unit comprises a brake pad (5) and a brake pad adapter (6); and the two ends of the brake pad (5) are fixedly connected with the carrying disc through the brake pad adapter (6).
4. The disc brake mechanism of claim 3, wherein: base brake actuating unit includes that two dishes stop reed (2), two reed presss from both sides (3) and a dish brake actuating piece (4), and the outer end of two dishes stop reed (2) is fixed extremely the dish is stopped the both ends of base (1), and the inner upper surface that two dishes stopped reed (2) passes through reed clamp (3) with dish brake actuating piece (4) are connected, brake block (5) pass dish brake actuating piece (4) bottom surface and dish are stopped between base (1) middle part top surface, form the space arrangement that dish brake actuating piece (4) followed the below actuation brake.
5. The disc brake mechanism of claim 3, wherein: the base brake actuating unit comprises a disc brake reed (2), two reed clamps (3) and a disc brake actuating piece (4); the two ends of the top surface of the disc brake actuating piece (4) are fixedly connected with the bottom surface of the middle part of the disc brake reed (2) through the two reed clamps (3); the brake block (5) penetrates through the lower surface of the middle part of the disc brake reed (2) and the top surface of the disc brake actuating piece (4) to form the spatial arrangement of the disc brake actuating piece (4) for attracting the brake from the upper part.
6. The disc brake mechanism according to claim 4 or 5, characterized in that: the disc brake base (1) is ︺ -shaped, and the brake pad (5) and the brake pad adapters (6) at the two ends form the shape of the restriction.
7. The disc brake mechanism according to claim 4 or 5, characterized in that: the disc brake actuating piece (4) adopts a pneumatic brake air floating pad and is connected with a vacuum source component through an air nozzle (41).
8. The disc brake mechanism according to claim 4 or 5, characterized in that: the base brake actuating unit further comprises two brake limiting blocks (7), one ends of the brake limiting blocks (7) are provided with limiting flanges (71), the side faces of the reed clips (3) are provided with limiting grooves (31), the bottom faces of the brake limiting blocks (7) are fixed to the inner sides of the two ends of the disc brake base (1), and the limiting flanges (71) are embedded into the limiting grooves (31).
9. The disc brake mechanism according to claim 4 or 5, characterized in that: the side edge of the plate of the brake block (5) is an arc-shaped edge matched with the carrying disc.
10. A wafer carrier is characterized in that: the wafer carrier (10000) comprises a carrier spindle (1000), a carrying disc (2000), a carrier base (3000), carrier air floatation feet (4000), a carrying disc brake assembly (5000), a spindle elastic support assembly (6000) and a correcting assembly (7000);
wherein the carrier main shaft (1000) adopts a lifting shaft; the carrier spindle (1000) is vertically arranged in a bearing hole formed in the carrier base (3000);
the carrier base (3000) is supported on the frame in a floating or sliding manner through a plurality of carrier air-floating feet (4000);
the middle part of the bottom surface of the carrier disc (2000) is fixed to the top surface of the carrier spindle (1000), and the carrier disc (2000) is driven to move up and down through the carrier spindle (1000);
the carrier disc brake assemblies (5000) are arranged between the carrier table base (3000) and the carrier disc (2000) and used for braking the carrier disc (2000);
the main shaft elastic support assembly (6000) is used for elastically connecting the carrier main shaft (1000) with the carrier base (3000) so as to enhance the stability of the carrier main shaft (1000);
the disc brake assembly (5000) adopts the disc brake mechanism (100) as claimed in any one of claims 1 to 9, and the disc brake mechanism (100) is arranged between the carrier base (3000) and the carrier disc (2000) and used for passive brake positioning of the carrier disc (2000).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210317570.8A CN114683226B (en) | 2022-03-29 | 2022-03-29 | Disc brake mechanism and wafer carrying platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210317570.8A CN114683226B (en) | 2022-03-29 | 2022-03-29 | Disc brake mechanism and wafer carrying platform |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114683226A true CN114683226A (en) | 2022-07-01 |
| CN114683226B CN114683226B (en) | 2022-12-02 |
Family
ID=82141288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210317570.8A Active CN114683226B (en) | 2022-03-29 | 2022-03-29 | Disc brake mechanism and wafer carrying platform |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114683226B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1241520A (en) * | 1998-07-15 | 2000-01-19 | 吉第联合股份公司 | Method and device for feeding blanks of packing material on packing machine |
| JP2004042197A (en) * | 2002-07-12 | 2004-02-12 | Komatsu Ltd | Working platform |
| CN105370774A (en) * | 2015-11-30 | 2016-03-02 | 常州南车铁马科技实业有限公司 | Braking clamp for rail vehicle |
| CN105904282A (en) * | 2015-02-24 | 2016-08-31 | 发那科株式会社 | Rotary table |
| CN210866134U (en) * | 2019-09-25 | 2020-06-26 | 湖北光安伦芯片有限公司 | Wafer carrying disc bearing device |
| CN212240352U (en) * | 2020-05-20 | 2020-12-29 | 清华大学 | Grinding workbench and wafer thinning equipment |
| CN214238068U (en) * | 2020-10-26 | 2021-09-21 | 上海卿颐电子科技有限公司 | A rotatory plummer for chip processing |
| CN215370691U (en) * | 2021-03-15 | 2021-12-31 | 浙江诸暨万宝机械有限公司 | Brake caliper friction disc return means and brake caliper |
-
2022
- 2022-03-29 CN CN202210317570.8A patent/CN114683226B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1241520A (en) * | 1998-07-15 | 2000-01-19 | 吉第联合股份公司 | Method and device for feeding blanks of packing material on packing machine |
| JP2004042197A (en) * | 2002-07-12 | 2004-02-12 | Komatsu Ltd | Working platform |
| CN105904282A (en) * | 2015-02-24 | 2016-08-31 | 发那科株式会社 | Rotary table |
| CN105370774A (en) * | 2015-11-30 | 2016-03-02 | 常州南车铁马科技实业有限公司 | Braking clamp for rail vehicle |
| CN210866134U (en) * | 2019-09-25 | 2020-06-26 | 湖北光安伦芯片有限公司 | Wafer carrying disc bearing device |
| CN212240352U (en) * | 2020-05-20 | 2020-12-29 | 清华大学 | Grinding workbench and wafer thinning equipment |
| CN214238068U (en) * | 2020-10-26 | 2021-09-21 | 上海卿颐电子科技有限公司 | A rotatory plummer for chip processing |
| CN215370691U (en) * | 2021-03-15 | 2021-12-31 | 浙江诸暨万宝机械有限公司 | Brake caliper friction disc return means and brake caliper |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114683226B (en) | 2022-12-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102584335B1 (en) | Bonding apparatus and bonding system | |
| KR20150103153A (en) | Warped silicon-chip adsorption device and adsorption method thereof | |
| JPS63114874A (en) | Assembly for treating wafer | |
| CN114683223B (en) | Wafer carrying platform | |
| US11600514B2 (en) | Substrate holding device | |
| CN114695227B (en) | Stage system and wafer driving method adopting stage system | |
| CN114683226B (en) | Disc brake mechanism and wafer carrying platform | |
| CN114683227B (en) | Wafer carrying platform | |
| CN217007403U (en) | Mask and wafer detection clamp | |
| WO2021004449A1 (en) | Embedded numerical control rotary table | |
| JPH09266242A (en) | Sucking chuck device | |
| CN114695245B (en) | Lifting shaft and wafer carrying platform | |
| CN217229415U (en) | Microporous composite material ceramic vacuum chuck | |
| JPH05343506A (en) | Chuck for wafer use | |
| CN114406454B (en) | Air supporting cutting platform | |
| WO2002077990A1 (en) | Disk clamping device | |
| CN114688183B (en) | Brake mechanism and angle modulation carrying platform adopting same | |
| CN114619411A (en) | Flexible motion platform and carrying platform system | |
| US20230163018A1 (en) | Substrate holding apparatus and substrate processing apparatus | |
| JP4215899B2 (en) | Static pressure linear guide device | |
| CN117524897B (en) | Wafer bonding alignment device | |
| CN215833462U (en) | Article carrying device and probe station | |
| CN217807111U (en) | Carrying platform and jig | |
| CN117913011A (en) | Wafer bonding alignment device for bonding first wafer to second wafer | |
| JP5792829B2 (en) | Pressure disc, laminating apparatus and laminating method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |