CN114682910A - Crystal grain welding device and welding method adopting lens array - Google Patents
Crystal grain welding device and welding method adopting lens array Download PDFInfo
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- CN114682910A CN114682910A CN202210521667.0A CN202210521667A CN114682910A CN 114682910 A CN114682910 A CN 114682910A CN 202210521667 A CN202210521667 A CN 202210521667A CN 114682910 A CN114682910 A CN 114682910A
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- 238000003466 welding Methods 0.000 title claims abstract description 90
- 239000013078 crystal Substances 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims abstract description 33
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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Abstract
The invention discloses a crystal grain welding device and a welding method adopting a lens array, which comprises a laser welding mechanism and a base plate for transferring and focusing; the laser welding mechanism is used for providing line laser or surface laser for welding operation; the substrate for transferring and focusing is provided with a transfer surface for transferring crystal grains, and a lens array for focusing laser is distributed at the substrate for transferring and focusing; when the transferring and focusing substrate enables the electrode of each crystal grain to face and be close to the welding position of the target substrate, the laser emitted by the laser welding mechanism can penetrate through the transferring and focusing substrate and the lens array, and reaches the electrode of each crystal grain after being focused by the lens array. The invention mainly solves the problem of low utilization rate of laser energy in the crystal grain welding operation; the invention can release more laser energy at the electrode of the crystal grain, and effectively improves the energy utilization rate of line laser or surface laser while ensuring the welding operation efficiency of the crystal grain.
Description
Technical Field
The invention relates to the technical field of laser welding technology and display panel manufacturing, in particular to a crystal grain welding device and method adopting a lens array.
Background
The Micro LED display panel is a self-luminous display panel, and has the advantages of high brightness, low energy consumption, high response speed, long service life and the like.
The Mini LED backlight source is used as a novel LCD screen backlight source, the brightness and the contrast of the LCD screen can be effectively improved, meanwhile, the display of the dark part area of the LCD screen is obviously improved, and the light leakage phenomenon of the LCD screen can be effectively controlled.
The size of the Mini LED crystal grains is 50-200 mu m, the size of the Micro LED crystal grains is smaller than 50 mu m, and when the Micro LED display panel and the Mini LED backlight source are manufactured, a laser welding technology is needed to be used for correspondingly welding each crystal grain on a welding pad of the TFT substrate or the PCB substrate.
In the prior art, the crystal grain welding operation can be completed by adopting a spot laser welding method, a line laser welding method and a surface laser welding method; however, when the spot laser welding method is adopted, each crystal grain needs to be welded one by one, so that the consumed time is long, and the working efficiency is low; when the methods of line laser welding and surface laser welding are adopted, masks are generally needed to be combined for welding, most of laser is blocked by the masks in the welding process, only the laser directly irradiating to the welding position can be utilized, and the utilization rate of laser energy is low.
Disclosure of Invention
An object of the present invention is to provide a die bonding apparatus using a lens array, which can effectively improve the energy utilization rate in line laser bonding or surface laser bonding.
Another object of the present invention is to provide a die bonding method using a lens array, which can improve the utilization rate of laser energy while efficiently completing die bonding.
In order to achieve the purpose, the invention provides the following technical scheme: a crystal grain welding device adopting a lens array is used for welding crystal grains on a target substrate and comprises a laser welding mechanism and a substrate for transferring and focusing; the laser welding mechanism is used for providing line laser or surface laser for welding operation; the substrate for transferring and focusing is provided with a transfer surface for transferring crystal grains, and a lens array for focusing laser is distributed on the substrate for transferring and focusing; when the transferring and focusing substrate enables the electrode of each crystal grain to face and be close to the welding position of the target substrate, the laser emitted by the laser welding mechanism can penetrate through the transferring and focusing substrate and the lens array, and reach the electrode of each crystal grain after being focused by the lens array.
In the above technical solution, the lens array includes a plurality of convex lens groups arranged in an array, and an arrangement pitch of each convex lens group on the substrate for transferring and focusing corresponds to a grain pitch of each grain on the target substrate.
In the above technical solution, each convex lens group includes at least one convex lens unit, and the number of the convex lens units in each convex lens group is equal to the number of the electrodes on each die that need to be welded to the target substrate; the arrangement position of each convex lens unit in the convex lens group corresponds to the arrangement position of the electrode on the crystal grain.
In the above technical solution, the convex lens unit is one of a biconvex lens, a plano-convex lens, a meniscus lens, and a truncated cone lens.
In the above technical solution, in each of the convex lens groups, diameters of every two of the convex lens units may be identical or different from each other.
In the above-described aspect, the lens array is provided on one of a transfer surface of the transfer and focus substrate, another surface opposite to the transfer surface, and an inner structure layer.
In the above technical solution, the lens array is disposed on the substrate for transferring and focusing in an embedding, welding, bonding, modifying, etching and integral forming manner.
In the above technical solution, a glue layer is disposed on the transfer surface of the transfer and focus substrate.
A die bonding method using a lens array for bonding a die on a target substrate, comprising the steps of:
s1, arranging the crystal grains on the transferring surface of the substrate for transferring and focusing in an array form by a transferring technology;
s2, bringing the transfer and focus substrate close to the target substrate, and bringing the electrodes of the crystal grains into contact with the bonding positions of the target substrate;
and S3, starting the laser welding mechanism, and making the line laser or the surface laser emitted by the laser welding mechanism penetrate through the substrate for transferring and focusing and the lens array on the substrate for transferring and focusing and focus on the electrode of each crystal grain.
In the above technical solution, the lens array includes a plurality of convex lens groups arranged in an array, and an arrangement pitch of each convex lens group on the substrate for transferring and focusing corresponds to a grain pitch of each grain on the target substrate.
In the above technical solution, each convex lens group includes at least one convex lens unit, and the number of the convex lens units in each convex lens group is equal to the number of the electrodes on each die that need to be welded to the target substrate; the arrangement position of each convex lens unit in the convex lens group corresponds to the arrangement position of the electrode on the crystal grain.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the crystal grain welding device adopting the lens array, the linear laser or the surface laser provided by the laser welding mechanism is focused by the lens array, so that more laser energy can be released at the electrode of the crystal grain, and the energy utilization rate of the linear laser or the surface laser is effectively improved while the welding operation efficiency of the crystal grain is ensured;
2. according to the crystal grain welding method adopting the lens array, disclosed by the invention, more laser energy can be released at the electrode of the crystal grain through the line laser or the surface laser provided by the focusing laser welding mechanism of the lens array, so that the energy utilization rate of the line laser or the surface laser is effectively improved while the crystal grain welding operation efficiency is ensured.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of the present invention.
FIG. 2 is a schematic structural diagram of a convex lens set according to an embodiment of the present invention.
FIG. 3 is a flowchart of a method according to a second embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a third embodiment of the present invention.
The reference signs are: 1. a laser welding mechanism; 2. a substrate for transfer and focusing; 21. a transfer surface; 22. a lens array; 22a, a convex lens group; 22b, a convex lens unit; 10. a crystal grain; 10a, an electrode; 20. a substrate; 20a, a pad; 30. the laser beam is focused.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1 and 2, the present embodiment provides a die bonding apparatus using a lens array for bonding a die 10 on a target substrate 20.
The crystal grain 10 is a Micro LED or a Mini LED, and the crystal grain 10 can be manufactured on a wafer substrate made of sapphire and the like through the process steps of epitaxy, photoetching and the like; the crystal grains 10 are provided with electrodes 10a, and in this embodiment, each crystal grain 10 is provided with two electrodes 10a corresponding to the positive and negative electrodes; the target substrate 20 is a TFT substrate or a PCB (printed circuit board), and the surface of the target substrate 20 is provided with pads 20a corresponding to the electrodes 10a of the die 10.
The die bonding apparatus using the lens array includes a laser welding mechanism 1 and a substrate 2 for transfer and focusing.
The laser welding mechanism 1 comprises a laser generator and a light path component, and laser generated by the laser generator generates linear laser or surface laser which can be used for welding operation after being refracted, polarized and diffused by the light path component; the substrate 2 for transfer and focusing is a transparent substrate, and for example, a glass material or an organic material having a high light transmittance is used as a base material of the substrate 2 for transfer and focusing, or the substrate 2 for transfer and focusing has a high light transmittance at least at the frequency of the laser light.
The laser welding mechanism 1 is used for providing line laser or surface laser for welding operation; the substrate 2 for transferring and focusing has a transfer surface 21 for transferring the crystal grain 10, and a lens array 22 for focusing laser is arranged at the substrate 2 for transferring and focusing; when the substrate 2 for transfer and focusing is brought into the vicinity of the bonding position of the target substrate 20 with the electrodes 10a of the respective crystal grains 10 facing each other, the laser light emitted from the laser welding mechanism 1 can pass through the substrate 2 for transfer and focusing and the lens array 22, be focused by the lens array 22, and then reach the electrodes 10a of the respective crystal grains 10.
Specifically, the lens array 22 includes a plurality of convex lens groups 22a arranged in an array, and an arrangement pitch of each convex lens group 22a on the substrate 2 for transferring and focusing corresponds to a die pitch of each die 10 on the target substrate 20, that is, a center pitch of two adjacent convex lens groups 22a corresponds to a center pitch of two adjacent dies 10 on the target substrate 20.
More specifically, each convex lens group 22a includes at least one convex lens unit 22b, and the number of the convex lens units 22b in each convex lens group 22a is equal to the number of the electrodes 10a on each die 10 to be welded to the target substrate 20, in this embodiment, two convex lens units 22b in each convex lens group 22a are provided corresponding to two electrodes 10a on each die 10; the arrangement position of each convex lens unit 22b in the convex lens group 22a corresponds to the arrangement position of the electrodes 10a on the die 10, that is, the center-to-center distance between two convex lens units 22b in each convex lens group 22a corresponds to the center-to-center distance between two electrodes 10a on the die 10.
The convex lens unit 22b is a transparent substrate, and for example, a glass material or an organic material having high light transmittance is used as the substrate of the convex lens unit 22b, or the convex lens unit 22b has high light transmittance at least at the frequency of the laser light.
In order to focus the line laser or the surface laser provided by the laser welding mechanism 1 and maximize the use of the energy of the line laser or the surface laser, the convex lens unit 22b is one of a biconvex lens, a plano-convex lens, a meniscus lens, and a mesa lens; in fact, the shape of the convex lens unit 22b may be any shape capable of focusing line laser light or surface laser light; in each convex lens group 22a, the shapes of the convex lens units 22b may be consistent or inconsistent with each other, and in different convex lens groups 22a, the shapes of the convex lens units 22b may also be consistent or inconsistent with each other, so that the amounts of the line laser or the surface laser focused by the convex lens units 22b are consistent or inconsistent, thereby meeting the requirements of the die welding process for different colors of light or the welding process for different electrodes of the same die.
In each convex lens group 22a, the diameters of every two convex lens units 22b are consistent or inconsistent, so that the amounts of line laser or surface laser focused by each convex lens unit 22b are consistent or inconsistent, thereby meeting the requirements of the crystal grain welding process of different color light or the welding process of different electrodes of the same crystal grain; here, the diameter of the convex lens unit 22b refers to the diameter of the convex lens unit 22b on a cross section perpendicular to the optical axis thereof where the area is the largest.
Specifically, the lens array 22 is provided at one of the transfer surface 21, the other surface opposite to the transfer surface 21, and the inner structure layer of the substrate 2 for transfer and focusing.
More specifically, the lens array 22 is provided on the substrate 2 for transfer and focusing in a manner of embedding, welding, bonding, modification, etching, and integral molding; the fitting means that a groove is provided on the surface of the transfer and focusing substrate 2, and each convex lens unit 22b is fitted into the groove of the transfer and focusing substrate 2 as an independent component; the embedding means that the transfer and focusing substrate 2 has a two-layer or multi-layer structure, and each convex lens unit 22b is sandwiched between two layers of the transfer and focusing substrate 2 as an independent component; the welding means that each convex lens unit 22b is used as an independent component and welded on the surface of the substrate 2 for transfer and focusing by using a hot melting mode; the bonding means that each convex lens unit 22b is attached to the surface of the transfer and focusing substrate 2 as an independent component by using an adhesive; the modification means that a modified layer is processed on the surface of the transfer and focus substrate 2 by using a laser in cooperation with ultrasonic waves or water impact, and the modified layer is polished into the shape of each convex lens unit 22 b; the etching is processing of the convex lens unit 22b on the surface of the transfer and focusing substrate 2 with a chemical agent; the integral molding means that the convex lens units 22b are directly molded on the surface of the transfer and focusing substrate 2 by a mold during the production of the transfer and focusing substrate 2.
In the present embodiment, the lens array 22 is provided on the transfer surface 21 of the transfer and focusing substrate 2, and the convex lens units 22b of the lens array 22 are directly molded on the surface of the transfer and focusing substrate 2 by integral molding or etching, so that the lens array 22 and the transfer and focusing substrate 2 constitute an integral structure.
Specifically, the transfer surface 21 of the substrate 2 for transfer and focusing is provided with a glue layer; in this embodiment, the adhesive layer covers the transfer and focus substrate 2 and the surfaces of the convex lens units 22b of the lens array 22, so that the crystal grains 10 can be adhered to the transfer surface 21.
In the present embodiment, the laser emitting surface of the laser welding mechanism 1 faces the other surface of the transfer and focusing substrate 2 opposite to the transfer surface 21, and the line laser or the surface laser is incident on the transfer and focusing substrate 2 from the surface.
In the crystal grain welding device adopting the lens array provided by the embodiment, when in use, the laser welding mechanism 1 provides linear laser or surface laser; the laser enters the substrate 2 for transferring and focusing from the other surface of the substrate 2 for transferring and focusing opposite to the transferring surface 21, passes through the body of the substrate 2 for transferring and focusing, and reaches the lens array 22, the laser is focused by the convex lens unit 22b when passing through each convex lens unit 22b of the lens array 22 to form a focused laser beam 30, and then passes through the body of each grain 10 and reaches the electrode 10a of each grain 10, at this time, because the electrode 10a of the grain 10 and the pad 20a of the target substrate 20 have lower light transmittance, the laser energy is released at the electrode 10a of the grain 10, thereby welding the electrode 10a of the grain 10 at the pad 20a of the target substrate 20, and completing the welding operation of the grain 10; in the above process, as the line laser or the surface laser provided by the laser welding mechanism 1 is focused by the lens array 22, more laser energy can be released at the electrode 10a of the crystal grain 10, and the energy utilization rate of the line laser or the surface laser is effectively improved.
Example two:
referring to fig. 3, the present embodiment provides a die bonding method using a lens array for bonding a die on a target substrate.
The crystal grain is a Micro LED or a Mini LED, and the crystal grain can be manufactured on a wafer substrate made of sapphire and the like through the process steps of epitaxy, photoetching and the like; the crystal grains are provided with electrodes, and in the embodiment, each crystal grain is provided with two electrodes corresponding to the positive electrode and the negative electrode; the target substrate is a TFT substrate or a PCB substrate (printed circuit board), and the surface of the target substrate is provided with a pad corresponding to the electrode of the crystal grain.
The crystal grain welding method adopting the lens array comprises the following steps:
s1, arranging the crystal grains on the transferring surface of the substrate for transferring and focusing in an array form by a transferring technology;
s2, the substrate for transferring and focusing is close to the target substrate, and the electrode of each crystal grain faces and is jointed with the welding position of the target substrate;
and S3, starting the laser welding mechanism, and making the line laser or the surface laser emitted by the laser welding mechanism penetrate through the substrate for transferring and focusing and the lens array on the substrate for transferring and focusing and focus on the electrode of each crystal grain.
The laser welding mechanism comprises a laser generator and a light path component, and laser generated by the laser generator generates linear laser or surface laser which can be used for welding operation after being refracted, polarized and diffused by the light path component; the substrate for transfer and focusing is a transparent substrate, and for example, a glass material or an organic material having high light transmittance is used as a base material of the substrate for transfer and focusing, or the substrate for transfer and focusing has high light transmittance at least at the frequency of laser light.
Specifically, the lens array includes a plurality of convex lens groups arranged in an array, and an arrangement pitch of each convex lens group on the substrate for transferring and focusing corresponds to a grain pitch of each grain on the target substrate, that is, a center pitch of two adjacent convex lens groups corresponds to a center pitch of two adjacent grains on the target substrate.
More specifically, each convex lens group comprises at least one convex lens unit, the number of the convex lens units in each convex lens group is equal to the number of the electrodes to be welded to the target substrate on each crystal grain, in this embodiment, two convex lens units in each convex lens group are arranged corresponding to two electrodes on each crystal grain; the arrangement position of each convex lens unit in the convex lens group corresponds to the arrangement position of the electrodes on the crystal grain, namely, the center distance between two convex lens units in each convex lens group corresponds to the center distance between two electrodes on the crystal grain.
The convex lens unit is a transparent substrate, for example, a glass material or an organic material having high light transmittance is used as the substrate of the convex lens unit, or the convex lens unit has high light transmittance at least at the frequency of the laser.
In order to focus the line laser or the surface laser provided by the laser welding mechanism and maximize the utilization of the energy of the line laser or the surface laser, the convex lens unit is one of a biconvex lens, a plano-convex lens, a concave-convex lens and a truncated cone lens; in fact, the shape of the convex lens unit can be any shape capable of focusing line laser or surface laser; in each convex lens group, the shapes of the convex lens units can be mutually consistent or inconsistent, and in different convex lens groups, the shapes of the convex lens units can be mutually consistent or inconsistent, so that the amounts of line laser or surface laser focused by the convex lens units are consistent or inconsistent, and the requirements of the crystal grain welding process of different color light or the welding process of different electrodes of the same crystal grain are met.
In each convex lens group, the diameters of every two convex lens units are consistent or inconsistent, so that the amounts of line laser or surface laser focused by each convex lens unit are consistent or inconsistent, and the requirements of crystal grain welding processes with different colors of light are met, or the requirements of welding processes of different electrodes of the same crystal grain are met; here, the diameter of the convex lens unit refers to a diameter of the convex lens unit on a cross section perpendicular to an optical axis thereof where an area is the largest.
Specifically, the lens array is provided at one of a transfer surface, another surface opposite to the transfer surface, and an inner structure layer of the substrate for transfer and focusing.
More specifically, the lens array is arranged on the substrate for transferring and focusing in a manner of embedding, welding, bonding, modifying, etching and integral forming; wherein, the embedding means that a caulking groove is arranged on the surface of the substrate for transferring and focusing, and each convex lens unit is embedded into the caulking groove of the substrate for transferring and focusing as an independent part; the embedding means that the substrate for transferring and focusing is in a two-layer or multi-layer structure, and each convex lens unit is used as an independent part and clamped between two layers of the substrate for transferring and focusing; the welding is that each convex lens unit is used as an independent part and welded on the surface of the substrate for transferring and focusing in a hot melting mode; bonding means that each convex lens unit is used as an independent part and is adhered to the surface of the substrate for transfer and focusing by using an adhesive; modifying means processing a modified layer on the surface of the substrate for transferring and focusing by using laser to cooperate with ultrasonic waves or water flow impact, and polishing the modified layer into the shape of each convex lens unit; the etching is to process the convex lens unit on the surface of the substrate for transferring and focusing by using a chemical reagent; the integral molding means that each convex lens unit is directly molded on the surface of the transfer and focus substrate by a mold when the transfer and focus substrate is manufactured.
In this embodiment, the lens array is disposed on the transfer surface of the transfer and focusing substrate, and the convex lens units of the lens array are directly formed on the surface of the transfer and focusing substrate by integral molding or etching, so that the lens array and the transfer and focusing substrate form an integral structure.
Specifically, a transfer surface of the substrate for transfer and focusing is provided with a glue layer; in this embodiment, the adhesive layer covers the transfer and focus substrate and the surfaces of the convex lens units of the lens array, so that the crystal grains can be adhered to the transfer surface.
In this embodiment, the laser beam emitting surface of the laser welding means faces the other surface of the transfer and focusing substrate opposite to the transfer surface, and the line laser beam or the surface laser beam is incident on the transfer and focusing substrate from the other surface.
In the die bonding method using the lens array provided in this embodiment, the laser is incident from the other surface of the transfer and focusing substrate opposite to the transfer surface to the transfer and focusing substrate, passes through the body of the transfer and focusing substrate, and then reaches the lens array, and when the laser passes through each convex lens unit of the lens array, the laser is focused by the convex lens unit to form a focused laser beam, and then passes through the body of each die, and then reaches the electrode of each die, at this time, because the electrode of the die and the pad of the target substrate have lower light transmittance, the laser energy is released at the electrode of the die, so that the electrode of the die is bonded at the pad of the target substrate, and the die bonding operation is completed; in the process, as the line laser or the surface laser provided by the laser welding mechanism is focused by the lens array, more laser energy can be released at the electrode of the crystal grain, and the energy utilization rate of the line laser or the surface laser is effectively improved.
Example three:
referring to fig. 4, the present embodiment provides a die bonding apparatus using a lens array, which is different from the die bonding apparatus using a lens array provided in the first embodiment in that:
in the present embodiment, the lens array 22 is provided on the other surface of the transfer and focusing substrate 2 opposite to the transfer surface 21, and the convex lens units of the lens array 22 are directly molded on the surface of the transfer and focusing substrate 2 by integral molding or etching, so that the lens array 22 and the transfer and focusing substrate 2 constitute an integral structure.
The transfer surface 21 of the transfer and focusing substrate 2 is provided with a glue layer; in this embodiment, the adhesive layer covers the surface of the transfer and focusing substrate 2, so that the crystal grains 10 can be adhered to the transfer surface 21.
The rest of the die bonding apparatus using the lens array provided in this embodiment is the same as the die bonding apparatus using the lens array provided in the first embodiment, and details thereof are not repeated here.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (11)
1. A crystal grain welding device adopting a lens array is used for welding crystal grains on a target substrate and is characterized by comprising a laser welding mechanism and a substrate for transferring and focusing;
the laser welding mechanism is used for providing line laser or surface laser for welding operation;
the substrate for transferring and focusing is provided with a transfer surface for transferring crystal grains, and a lens array for focusing laser is distributed on the substrate for transferring and focusing;
when the transferring and focusing substrate enables the electrode of each crystal grain to face and be close to the welding position of the target substrate, the laser emitted by the laser welding mechanism can penetrate through the transferring and focusing substrate and the lens array, and reach the electrode of each crystal grain after being focused by the lens array.
2. A die bonding apparatus using lens array according to claim 1, wherein: the lens array comprises a plurality of convex lens groups which are arranged in an array form, and the arrangement distance of each convex lens group on the substrate for transferring and focusing corresponds to the crystal grain distance of each crystal grain on the target substrate.
3. A die bonding apparatus using lens array according to claim 2, wherein: each convex lens group comprises at least one convex lens unit, and the number of the convex lens units in each convex lens group is equal to the number of the electrodes which are required to be welded to the target substrate and are arranged on each crystal grain;
the arrangement position of each convex lens unit in the convex lens group corresponds to the arrangement position of the electrode on the crystal grain.
4. A die bonding apparatus using lens array according to claim 3, wherein: the convex lens unit is one of a biconvex lens, a plano-convex lens, a meniscus lens, and a truncated cone lens.
5. A die bonding apparatus using lens array according to claim 3, wherein: in each of the convex lens groups, diameters of each two of the convex lens units may be uniform or nonuniform with each other.
6. A die bonding apparatus using lens array according to any of claims 1 to 5, wherein: the lens array is provided at one of a transfer surface of the substrate for transfer and focusing, another surface opposite to the transfer surface, and an inner structure layer.
7. A die bonding apparatus using lens array according to any of claims 1 to 5, wherein: the lens array is arranged on the substrate for transferring and focusing in an embedding, welding, bonding, modifying, etching and integrated forming mode.
8. A die bonding apparatus using lens array according to claim 1, wherein: and a glue material layer is arranged on the transferring surface of the transferring and focusing substrate.
9. A die bonding method using a lens array for bonding a die to a target substrate, comprising the steps of:
s1, arranging the crystal grains on the transferring surface of the substrate for transferring and focusing in an array form by a transferring technology;
s2, enabling the substrate for transferring and focusing to be close to the target substrate, and enabling the electrode of each crystal grain to face and be attached to the welding position of the target substrate;
and S3, starting the laser welding mechanism, and making the line laser or the surface laser emitted by the laser welding mechanism penetrate through the substrate for transferring and focusing and the lens array on the substrate for transferring and focusing and focus on the electrode of each crystal grain.
10. A die bonding method using a lens array according to claim 9, wherein: the lens array comprises a plurality of convex lens groups which are arranged in an array form, and the arrangement distance of each convex lens group on the substrate for transferring and focusing corresponds to the crystal grain distance of each crystal grain on the target substrate.
11. A die bonding method using a lens array according to claim 10, wherein: each convex lens group comprises at least one convex lens unit, and the number of the convex lens units in each convex lens group is equal to the number of the electrodes which are required to be welded to the target substrate and are arranged on each crystal grain;
the arrangement position of each convex lens unit in the convex lens group corresponds to the arrangement position of the electrode on the crystal grain.
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