CN114679903B - 一种夹芯结构电磁屏蔽复合材料、电磁屏蔽体 - Google Patents
一种夹芯结构电磁屏蔽复合材料、电磁屏蔽体 Download PDFInfo
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- CN114679903B CN114679903B CN202210579683.5A CN202210579683A CN114679903B CN 114679903 B CN114679903 B CN 114679903B CN 202210579683 A CN202210579683 A CN 202210579683A CN 114679903 B CN114679903 B CN 114679903B
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- carbon fiber
- electromagnetic shielding
- weft
- conductive
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- 239000002131 composite material Substances 0.000 title claims abstract description 39
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 114
- 239000004917 carbon fiber Substances 0.000 claims abstract description 114
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 112
- 239000000835 fiber Substances 0.000 claims abstract description 76
- 239000004744 fabric Substances 0.000 claims abstract description 71
- 239000006260 foam Substances 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 239000011159 matrix material Substances 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 13
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000007667 floating Methods 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000003063 flame retardant Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims 1
- 229910000831 Steel Inorganic materials 0.000 abstract description 15
- 239000010959 steel Substances 0.000 abstract description 15
- 238000003466 welding Methods 0.000 abstract description 5
- 229910000838 Al alloy Inorganic materials 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000006229 carbon black Substances 0.000 description 3
- 239000010960 cold rolled steel Substances 0.000 description 3
- 238000013329 compounding Methods 0.000 description 2
- 230000007123 defense Effects 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000005493 welding type Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0001—Rooms or chambers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0001—Rooms or chambers
- H05K9/0005—Shielded windows
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Textile Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
Description
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202210579683.5A CN114679903B (zh) | 2022-05-26 | 2022-05-26 | 一种夹芯结构电磁屏蔽复合材料、电磁屏蔽体 |
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CN202210579683.5A CN114679903B (zh) | 2022-05-26 | 2022-05-26 | 一种夹芯结构电磁屏蔽复合材料、电磁屏蔽体 |
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Publication Number | Publication Date |
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CN114679903A CN114679903A (zh) | 2022-06-28 |
CN114679903B true CN114679903B (zh) | 2023-02-28 |
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CN202210579683.5A Active CN114679903B (zh) | 2022-05-26 | 2022-05-26 | 一种夹芯结构电磁屏蔽复合材料、电磁屏蔽体 |
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Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2014050896A1 (ja) * | 2012-09-26 | 2014-04-03 | 東邦テナックス株式会社 | プリプレグ及びその製造方法 |
CN103552318B (zh) * | 2013-11-05 | 2016-03-16 | 中航复合材料有限责任公司 | 一种含金属镀层的无纺布及其制品 |
CN103644768A (zh) * | 2013-11-25 | 2014-03-19 | 衡阳泰豪通信车辆有限公司 | 一种具有雷达隐身带电磁屏蔽的方舱壁板 |
GB201420055D0 (en) * | 2014-11-11 | 2014-12-24 | Technion Res & Dev Foundation | Low density micropsheres |
CN105774095A (zh) * | 2016-02-03 | 2016-07-20 | 江苏恒神股份有限公司 | 具有电磁屏蔽功能的复合材料面板 |
CN108274829A (zh) * | 2017-11-29 | 2018-07-13 | 浙江三元电子科技有限公司 | 一种具有雷达隐身功能的轻量化的屏蔽方舱壁板及其制备方法 |
CN108394148B (zh) * | 2018-01-03 | 2020-12-08 | 山东鲁泰控股集团有限公司 | 一种电磁屏蔽复合材料的制备方法 |
CN109930393A (zh) * | 2019-02-28 | 2019-06-25 | 宁波三同编织有限公司 | 一种衬经衬纬粘合衬及其制备方法 |
CN109878149A (zh) * | 2019-03-20 | 2019-06-14 | 海添琪 | 一种复合材料结构及其生产方法 |
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Effective date of registration: 20230113 Address after: 215500 no.1150, Southeast Avenue, Southeast street, Changshu City, Suzhou City, Jiangsu Province Applicant after: Jiangsu Hengrui Aviation Industry Co.,Ltd. Applicant after: Henfron (Jiangsu) composite materials research and Development Co.,Ltd. Address before: 215500 no.1150, Southeast Avenue, Southeast street, Changshu City, Suzhou City, Jiangsu Province Applicant before: Jiangsu Hengrui Aviation Industry Co.,Ltd. |
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Address after: No. 1150 Southeast Avenue, Southeast Street, Changshu City, Suzhou City, Jiangsu Province Patentee after: Jiangsu Hengrui Aviation Industry Co.,Ltd. Country or region after: China Patentee after: Jiangsu Hengrui Fraun New Materials Research and Development Co.,Ltd. Address before: 215500 no.1150, Southeast Avenue, Southeast street, Changshu City, Suzhou City, Jiangsu Province Patentee before: Jiangsu Hengrui Aviation Industry Co.,Ltd. Country or region before: China Patentee before: Henfron (Jiangsu) composite materials research and Development Co.,Ltd. |