CN114672255A - Production process of solvent type super-thick substrate-free double faced adhesive tape - Google Patents
Production process of solvent type super-thick substrate-free double faced adhesive tape Download PDFInfo
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- CN114672255A CN114672255A CN202210458796.XA CN202210458796A CN114672255A CN 114672255 A CN114672255 A CN 114672255A CN 202210458796 A CN202210458796 A CN 202210458796A CN 114672255 A CN114672255 A CN 114672255A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
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- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a production process of a solvent type super-thick substrate-free double faced adhesive tape, which is characterized by comprising the following steps of: s1, coating solvent type pressure-sensitive adhesive glue on release paper with the release force of 8-15gf/25mm, drying by a coating machine, and directly rolling to obtain a semi-finished product A; s2, coating the same solvent type pressure-sensitive adhesive glue on release paper or release film with the release force of 3-5gf/25mm, wherein the coating width is reduced by 4-6mm compared with that of a single side of a semi-finished product A, drying the semi-finished product A by a coating machine, pasting the semi-finished product A with an adhesive surface and the adhesive surface, uncovering the release paper on the second layer, and keeping the first layer of release paper to be rolled; s3, repeating the step S2, coating and attaching the third layer, and repeating the operation to produce various thick pressure-sensitive adhesives without base materials; s4, putting the produced adhesive tape into a curing room at the temperature of 55-65 ℃ for curing for 3-5 days. The invention has the advantages that: the produced adhesive tape has excellent performance, and a UV curing coating machine is not required to be invested, so that a large amount of cost is saved.
Description
Technical Field
The invention relates to the technical field of double faced adhesive tapes, in particular to a production process of a solvent type super-thick substrate-free double faced adhesive tape.
Background
The thick double-sided adhesive tape generally refers to a pressure-sensitive adhesive with a single-layer adhesive thickness of more than 0.075 mm. The thick type has wide application in the household appliances, consumer electronics products and automobile industries, and common application scenes are large-size area pasting, curved surface pasting, rough surface pasting, cloth and leather pasting and the like.
The main flow coating production mode of the pressure-sensitive adhesive has three types, the first type is that solvent type glue is coated on a base material, and a required product is obtained after heating and drying. And secondly, heating and melting the hot melt adhesive, coating the hot melt adhesive on a base material through a hot melt extrusion coating machine, and cooling to obtain the required product. And thirdly, coating the solvent-free glue containing the photoinitiator on a substrate, irradiating by UV light, and cracking the photoinitiator into free radicals to cause polymerization reaction of unsaturated double bonds in the glue, so as to be cured into the adhesive tape and obtain the required product.
The thick double-sided adhesive tape products on the market are basically produced by a hot-melt extrusion method or a UV curing method. But can not produce through the solvent method, because when glue coating thickness is very big, the heating toasts and can produce a large amount of bubbles problems, and the glue surface is dry fast moreover, and inside solvent can't volatilize, and residual solvent content is too big, influences the cohesion and the viscidity of sticky tape.
It has the following disadvantages: when produced using a hot melt extrusion method, the heat resistance thereof tends to be poor. Because the colloid is coated after being heated and melted, when a high-temperature and high-humidity test is carried out, the colloid can be recovered to a softened state or even a molten state, and the cohesive force is sharply reduced to cause glue failure.
When UV curing is used, most of the time its performance is not problematic. However, since the UV-curing coater equipment is very costly, it is not an economically good solution for customized products.
Disclosure of Invention
The invention aims to solve the technical problem of providing a production process of a solvent-based ultra-thick substrate-free double faced adhesive tape, which has excellent performance, does not need to invest in a UV curing type coating machine and saves a large amount of cost.
In order to solve the technical problems, the technical scheme provided by the invention is as follows: a production process of a solvent type super-thick double faced adhesive tape without base materials comprises the following steps:
s1, coating solvent type pressure sensitive adhesive glue on release paper with the release force of 8-15gf/25mm, wherein the thickness of dry glue is less than or equal to 0.075 mm. Drying by a coating machine and then directly rolling to obtain a semi-finished product A;
s2, coating the same solvent type pressure-sensitive adhesive glue on release paper or a release film with a release force of 3-5gf/25mm, wherein the thickness of dry glue is less than or equal to 0.075mm, the coating width is reduced by 4-6mm compared with that of a single side of a semi-finished product A, after being dried by a coating machine, the semi-finished product A is pasted with an adhesive surface and an adhesive surface in an opposite mode, then the release paper on the second layer is uncovered, and the first layer of release paper is kept for rolling;
s3, repeating the step S2, coating and attaching the third layer, and repeating the operation to produce various thick pressure-sensitive adhesives without base materials;
s4, putting the produced adhesive tape in a curing room at 55-65 ℃ for curing for 3-5 days to ensure sufficient crosslinking between the adhesive layers.
Further, the dry glue thickness of the S1 and S2 is 0.05 mm.
Further, the coating width of the dry glue in the step S2 is respectively reduced by 5mm compared with that of the single side of the semi-finished product A.
Further, the temperature in the curing room in S4 was 60 ℃, and the curing time was 4 days.
Compared with the prior art, the invention has the advantages that: the production process of the solvent type super-thick substrate-free double faced adhesive tape uses a multilayer stacking process and is matched with release paper and release films with different release forces, so that a conventional solvent type coating machine can produce thick pressure-sensitive adhesive, the use application of the solvent type coating machine is expanded, the thick pressure-sensitive adhesive is produced by using a solvent type method, the performance of the adhesive tape is excellent, and the equipment investment and the manufacturing cost of an adhesive tape factory are greatly saved.
Drawings
FIG. 1 is a schematic view of the coating of the present invention.
FIG. 2 is a schematic view of a release paper for applying and removing according to the present invention.
Detailed Description
Example one
A production process of a solvent type super-thick double faced adhesive tape without base materials comprises the following steps:
s1, coating solvent pressure sensitive adhesive glue on release paper with the release force of 8-15gf/25mm, wherein the dry glue thickness is 0.075 mm. Drying by a coating machine and then directly rolling to obtain a semi-finished product A;
s2, coating the same solvent type pressure-sensitive adhesive glue on release paper or a release film with a release force of 3-5gf/25mm, wherein the dry glue thickness is 0.075mm, the coating width is reduced by 4mm compared with that of a single side of a semi-finished product A, after drying by a coating machine, the semi-finished product A is pasted with an adhesive surface and an adhesive surface, then the release paper of the second layer is uncovered, and the first layer of release paper is kept for rolling;
s3, repeating the step S2, coating and attaching the third layer, and repeating the operation to produce various thick pressure-sensitive adhesives without base materials;
s4, putting the produced adhesive tape in a curing room at 55 ℃ for curing for 3 days to ensure that the crosslinking between the adhesive layers is sufficient.
Example two
A production process of a solvent type super-thick double faced adhesive tape without base materials is characterized by comprising the following steps:
s1, coating solvent type pressure sensitive adhesive glue on release paper with the release force of 8-15gf/25mm, wherein the dry glue thickness is 0.05 mm. Drying by a coating machine and then directly rolling to obtain a semi-finished product A;
s2, coating the same solvent type pressure-sensitive adhesive glue on release paper or release film with a release force of 3-5gf/25mm, wherein the dry glue thickness is 0.05mm, the coating width is respectively reduced by 5mm compared with the single edge of the semi-finished product A, after drying by a coating machine, the semi-finished product A is pasted with the glue surface and the glue surface, then the release paper of the second layer is uncovered, and the first layer of release paper is kept for rolling;
s3, repeating the step S2, coating and attaching the third layer, and repeating the operation to produce various thick pressure-sensitive adhesives without base materials;
s4, placing the produced adhesive tape in a curing room at 60 ℃ for curing for 4 days to ensure that the crosslinking between the adhesive layers is sufficient.
EXAMPLE III
A production process of a solvent type super-thick double faced adhesive tape without base materials is characterized by comprising the following steps:
s1, coating solvent type pressure sensitive adhesive glue on release paper with the release force of 8-15gf/25mm, wherein the dry adhesive thickness is 0.06 mm. Drying by a coating machine and then directly rolling to obtain a semi-finished product A;
s2, coating the same solvent type pressure-sensitive adhesive glue on release paper or release film with a release force of 3-5gf/25mm, wherein the dry glue thickness is 0.06mm, the coating width is respectively reduced by 6mm compared with the single edge of the semi-finished product A, after drying by a coating machine, the semi-finished product A is pasted with the glue surface and the glue surface, then the release paper of the second layer is uncovered, and the first layer of release paper is kept for rolling;
s3, repeating the step S2, coating and attaching the third layer, and repeating the operation to produce various thick pressure-sensitive adhesives without base materials;
s4, placing the produced adhesive tape in a curing room at 65 ℃ for curing for 5 days to ensure that the crosslinking between the adhesive layers is sufficient.
Although the present invention has been described in detail with reference to the above embodiments, it should be understood by those skilled in the art that: modifications and equivalents may be made thereto without departing from the spirit and scope of the invention and it is intended to cover in the claims the invention as defined in the appended claims.
Claims (4)
1. A production process of a solvent type super-thick double faced adhesive tape without base materials is characterized by comprising the following steps:
s1, coating solvent type pressure-sensitive adhesive glue on release paper with a release force of 8-15gf/25mm, wherein the thickness of dry glue is less than or equal to 0.075mm, and directly rolling after drying by a coating machine to obtain a semi-finished product A;
s2, coating the same solvent type pressure-sensitive adhesive glue on release paper or a release film with a release force of 3-5gf/25mm, wherein the thickness of dry glue is less than or equal to 0.075mm, the coating width is reduced by 4-6mm compared with that of a single side of a semi-finished product A, after being dried by a coating machine, the semi-finished product A is pasted with an adhesive surface and an adhesive surface in an opposite mode, then the release paper on the second layer is uncovered, and the first layer of release paper is kept for rolling;
s3, repeating the step S2, coating and attaching the third layer, and repeating the operation to produce various thick pressure-sensitive adhesives without base materials;
s4, putting the produced adhesive tape in a curing room at 55-65 ℃ for curing for 3-5 days to ensure sufficient crosslinking between the adhesive layers.
2. The production process of the solvent-based ultra-thick substrate-free double faced adhesive tape according to claim 1, characterized in that: the dry glue thickness of the S1 and S2 is 0.05 mm.
3. The production process of the solvent-based ultra-thick substrate-free double faced adhesive tape according to claim 1, characterized in that: and the coating width of the dry glue in the S2 is respectively reduced by 5mm compared with that of the single side of the semi-finished product A.
4. The production process of the solvent-based ultra-thick substrate-free double faced adhesive tape according to claim 1, characterized in that: the temperature in the curing room in the S4 is 60 ℃, and the curing time is 4 days.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210458796.XA CN114672255A (en) | 2022-04-27 | 2022-04-27 | Production process of solvent type super-thick substrate-free double faced adhesive tape |
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| CN202210458796.XA CN114672255A (en) | 2022-04-27 | 2022-04-27 | Production process of solvent type super-thick substrate-free double faced adhesive tape |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014008813A1 (en) * | 2012-07-12 | 2014-01-16 | 深圳市摩码科技有限公司 | Releasing film with light releasing force and manufacture method of releasing film |
| CN104527196A (en) * | 2014-12-29 | 2015-04-22 | 宁波大榭开发区综研化学有限公司 | Method for preparing thick optical cement without base material |
| CN204605074U (en) * | 2015-01-30 | 2015-09-02 | 东莞市纳利光学材料有限公司 | A kind of without base material AB glued membrane |
| CN109796900A (en) * | 2018-12-28 | 2019-05-24 | 新纶科技（常州）有限公司 | A kind of height is viscous without base material adhesive tape preparation method |
| CN110819242A (en) * | 2019-09-26 | 2020-02-21 | 江苏晶华新材料科技有限公司 | Non-base material adhesive tape with different peeling forces on two sides and preparation method thereof |
| CN111319271A (en) * | 2020-03-31 | 2020-06-23 | 南京汇鑫光电材料有限公司 | Thick glue multilayer laminating process |
| CN111849373A (en) * | 2020-07-27 | 2020-10-30 | 芜湖徽氏新材料科技有限公司 | Preparation method of environment-proof thin waterproof double-sided adhesive tape |
-
2022
- 2022-04-27 CN CN202210458796.XA patent/CN114672255A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014008813A1 (en) * | 2012-07-12 | 2014-01-16 | 深圳市摩码科技有限公司 | Releasing film with light releasing force and manufacture method of releasing film |
| CN104527196A (en) * | 2014-12-29 | 2015-04-22 | 宁波大榭开发区综研化学有限公司 | Method for preparing thick optical cement without base material |
| CN204605074U (en) * | 2015-01-30 | 2015-09-02 | 东莞市纳利光学材料有限公司 | A kind of without base material AB glued membrane |
| CN109796900A (en) * | 2018-12-28 | 2019-05-24 | 新纶科技（常州）有限公司 | A kind of height is viscous without base material adhesive tape preparation method |
| CN110819242A (en) * | 2019-09-26 | 2020-02-21 | 江苏晶华新材料科技有限公司 | Non-base material adhesive tape with different peeling forces on two sides and preparation method thereof |
| CN111319271A (en) * | 2020-03-31 | 2020-06-23 | 南京汇鑫光电材料有限公司 | Thick glue multilayer laminating process |
| CN111849373A (en) * | 2020-07-27 | 2020-10-30 | 芜湖徽氏新材料科技有限公司 | Preparation method of environment-proof thin waterproof double-sided adhesive tape |
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