CN108587501A - A kind of wafer cutting expansion protective film and preparation method thereof - Google Patents
A kind of wafer cutting expansion protective film and preparation method thereof Download PDFInfo
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- CN108587501A CN108587501A CN201810344064.1A CN201810344064A CN108587501A CN 108587501 A CN108587501 A CN 108587501A CN 201810344064 A CN201810344064 A CN 201810344064A CN 108587501 A CN108587501 A CN 108587501A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
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- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention discloses the production methods that a kind of wafer cuts expansion protective film.The protective film includes：Substrate layer and the release layer and adhesive layer for being respectively coated on substrate layer tow sides, the substrate layer use PVC film；The release layer uses paraffin wax type mould release；The adhesive layer uses acrylic glue.The production method of protective film includes the following steps：Step 1, using PVC film as substrate layer；Step 2, the front coating using dimple coating method in substrate layer form release layer；Step 3 is coated with to form adhesive layer by the way of print-on coating in the reverse side of substrate layer.Adhesive layer of the present invention can be expanded with substrate layer and be extended, and be not in cracking.Meanwhile crystal grain can uniformly be detached with the expansion of protective film in expansion process, also allowed for manipulator and taken crystal grain.
Description
Technical field：
The present invention relates to protective film product technical fields, refer in particular to a kind of production method of wafer cutting expansion protective film.
Background technology：
Wafer cutting is that each crystal grain in wafer is cut separation by wafer cutting machine.See Chinese patent application
Number it is：201410364441.X patent of invention Publication Specification, it discloses a kind of uniform expansions to expand brilliant machine.Pass through the disclosure
Technical solution can see, after being cut to wafer, expand brilliant, be just to need to use protective film.Wafer is viscous
It is attached on blue film, after wafer is cut, stretches blue film, the crystal grain being pasted onto on blue film is enabled to be separated from each other with the stretching of blue film,
Crystal grain is taken away convenient for subsequent mechanical hand in this way.
In order to ensure that all crystal grain can be with protective film Uniform Tension after wafer is cut in process of expansion, it is desirable that
Bonding glue-line on protective film can stretch with protection film base material and be extended, and will not form cracking.Bonding glue-line is required simultaneously
Viscosity is in a year appropriate, and viscosity is excessive, and manipulator is difficult to remove when taking crystal grain.If viscosity is too small, crystal grain is attached
Put forth effort it is too small, be likely to occur in wafer process of expansion viscosity not enough and fall off.
The present inventor is exactly to propose following technical scheme according to the characteristic of protective film.
Invention content：
Technical problem to be solved by the present invention lies in a kind of wafer cutting expansion protective films of offer and preparation method thereof.
In order to solve the above-mentioned technical problem, wafer cutting expansion protective film uses following technical proposals in the present invention：It should
Protective film includes：Substrate layer and the release layer and adhesive layer for being respectively coated on substrate layer tow sides, the substrate layer are adopted
Use PVC film；The release layer uses paraffin wax type mould release；The adhesive layer uses acrylic glue.
Furthermore, in above-mentioned technical proposal, the acrylic glue of the adhesive layer includes acrylate and curing agent,
The weight ratio of the two is：100：0.4-0.8.
Furthermore, in above-mentioned technical proposal, the curing agent uses Isocyanates curing agent.
Furthermore, in above-mentioned technical proposal, the thickness of the substrate layer is：60-80 microns；The release layer
Thickness be：0.1-0.4 microns；The thickness of the adhesive layer is 2-3 microns.
Wafer cutting expansion protective film production method uses following technical proposals in the present invention：The protective film includes：Base
The production method of material layer and the release layer and adhesive layer for being respectively coated on substrate layer tow sides, the protective film includes following step
Suddenly：Step 1, using PVC film as substrate layer；Step 2 is coated with paraffin using dimple coating method in the front of substrate layer
Type mould release forms release layer in the front of substrate layer；Step 3 is applied by the way of print-on coating in the reverse side of substrate layer
Cloth acrylic glue forms adhesive layer in the reverse side of substrate layer.
Furthermore, in above-mentioned technical proposal, in the step two, the process for being coated with release layer is as follows：First, will
Paraffin is 25-35 according to weight ratio with solvent：100 ratio allocates to form release solution；Then, a surface forming there is into array
The release liquid dimple transfer roller part for being distributed release liquid groove is immersed in release solution, after release liquid dimple transfer roller rotation, in its table
It is attached with release solution in face and release liquid groove, is scraped the release solution of release liquid dimple roll surface by release liquid scraper plate
It goes, release solution is remained only in release liquid groove；Then, release liquid dimple transfer roller and a release hydraulic pressure roller coordinate, substrate layer
By passing through between release liquid dimple transfer roller and release hydraulic pressure roller, the front of substrate layer is bonded release liquid dimple transfer roller, with release
The rotation of liquid dimple transfer roller and release hydraulic pressure roller, release solution is remained in release liquid groove can be attached to the surface of substrate layer, attached
It in the positive release solution of substrate layer along base material layer surface levelling；Finally, front is attached with the substrate layer process of release solution
Solvent in release solution is volatilized, then after supercooling, is finally formed with release layer in the front of substrate layer by baking oven.
Furthermore, in above-mentioned technical proposal, in the step three, the process for being coated with adhesive layer is as follows：First, match
Acrylic glue is set, is according to weight ratio with curing agent by acrylate：100：The ratio of 0.4-0.8 allocates to form acrylic glue；
Then, acrylic glue is being coated in a layer upper surface without silicon release film by the way of dimple coating；Finally, pass through one group
The acrylic glue of attachment on no silicon release film is transferred to the reverse side of substrate layer by transfer pressure roller, to form the bonding
Layer.
Furthermore, described that acrylic glue is being coated on one without the release of silicon release film in above-mentioned technical proposal
Process on face is as follows：First, a surface forming is had to the acrylic glue dimple transfer roller part of array distribution acrylic glue groove
It immerses in acrylic glue, after the rotation of acrylic glue dimple transfer roller, acrylic glue is attached in its surface and acrylic glue groove,
The acrylic glue of acrylic glue dimple roll surface is scraped off by acrylic glue scraper plate, Asia is remained only in acrylic glue groove
Gram force glue；Then, the recessed transfer roller of acrylic glue and an acrylic glue laminated roller coordinate, and one is turned without silicon release film by acrylic glue dimple
Pass through between roller and acrylic glue laminated roller, the layer upper surface of no silicon release film is bonded acrylic glue dimple transfer roller, with acrylic glue
The rotation of dimple transfer roller and acrylic glue laminated roller, remain in acrylic glue groove acrylic glue can be attached to no silicon release film from
Type face is attached to the acrylic glue in no silicon release film layer upper surface along layer upper surface surface levelling.
After adopting the above technical scheme, the present invention has the advantages that compared with prior art：
1, using PVC, (polyvinyl chloride film, PVC film good toughness have good the substrate layer in protective film of the invention
Ductility, in wafer process of expansion, the case where crystal grain being enabled uniformly to detach, be not in local accumulation.
2, adhesive layer of the invention is coated with using acrylic glue, is enabled adhesive layer that can expand and extend with substrate layer, will not be gone out
Now it is cracked.Meanwhile acrylic adhesiveness is appropriate, can effectively cling the crystal grain of cutting, enables crystal grain in expansion process can be with protection
The expansion of film and uniformly detach, while will not can not be removed because viscosity is excessive again when manipulator takes crystal grain.
3, base material layer surface of the invention is formed with release layer, and protective film entire in this way can be wound, and is convenient for subsequent work
Industry.
4, in production method of the invention, release layer uses dimple coating method, adhesive layer to use using print-on coating
Mode can enable release layer and adhesive layer uniformly on substrate layer, enable coating layer thickness Jinyun, avoid applying by this coating method
Layer sunburner or excessively thin.
Description of the drawings：
Fig. 1 is the structural schematic diagram of the protective film of the present invention；
Fig. 2 is release layer coating process schematic diagram in the present invention；
Fig. 3 is binding layer coating technology schematic diagram in the present invention.
Specific implementation mode：
With reference to specific embodiments and the drawings, the present invention is further described.
See Fig. 1 so, the present invention be a kind of wafer cutting expansion protective film.The protective film includes：Substrate layer 1 and difference
It is coated on the release layer 2 and adhesive layer 3 of 1 tow sides of substrate layer.1 surface of substrate layer of the present invention is formed with release layer 2, in this way
Entire protective film can be wound, and be convenient for subsequent operation.The adhesive layer 3 of the present invention is used to cling the crystalline substance after wafer and cutting
Grain.
Specifically, the substrate layer 1 uses PVC film, PVC (polyvinyl chloride) film, good toughness to have good
Ductility, be highly suitable for the substrate layer as protective film.The release layer 2 uses paraffin wax type mould release, this implementation
Release layer 2 includes using no silica wax mould release, material in example：The ratio of paraffin and paraffin solvent, the two is：Paraffin with it is molten
Agent is 25-35 according to weight ratio：100.Dimethylbenzene can be used in solvent.The adhesive layer 3 uses acrylic glue.The acrylic glue
Including acrylate and curing agent, the weight ratio of the two are：100：0.4-0.8.In general, isocyanic acid can be used in the curing agent
Esters curing agent.
In finally formed protective film product, the thickness of the substrate layer 1 is：60-80 microns；The release layer 2
Thickness be：0.1-0.4 microns；The thickness of the adhesive layer 3 is 2-3 microns.
The production method of protective film includes the following steps in the present invention：
Step 1, using PVC film as substrate layer 1；
Step 2 is coated with paraffin wax type mould release, i.e., in substrate layer 1 using dimple coating method in the front of substrate layer 1
Front forms release layer 2；
Step 3 is coated with acrylic glue, i.e., in the anti-of substrate layer 1 by the way of print-on coating in the reverse side of substrate layer 1
Face forms adhesive layer 3.
As shown in Figure 2, in the step two, the process for being coated with release layer 2 is as follows：
First, it is 25-35 according to weight ratio by paraffin and solvent：100 ratio allocates to form release solution.
Then, release 41 part of liquid dimple transfer roller of the release liquid groove of array distribution 411 immerses one a surface forming
In the release solution of release liquid bath 44, after release liquid dimple transfer roller 41 rotates, it is attached in its surface and release liquid groove 411
Release solution is scraped off the release solution on release 41 surface of liquid dimple transfer roller by release liquid scraper plate 42, only in release liquid groove
Release solution is remained in 411.
Then, 41 and one release hydraulic pressure roller 43 of release liquid dimple transfer roller coordinate, substrate layer 1 by release liquid dimple transfer roller 41 with
Pass through between release hydraulic pressure roller 43, the front of substrate layer 1 is bonded release liquid dimple transfer roller 41, with release liquid dimple transfer roller 41 with
The rotation of release hydraulic pressure roller 43, release solution is remained in release liquid groove 411 can be attached to the surface of substrate layer 1, be attached to base
The positive release solution of material layer 1 is along 1 surface levelling of substrate layer.
Finally, the substrate layer 1 that front is attached with release solution volatilizees the solvent in release solution by baking oven, baking oven
Temperature at 70-90 degrees Celsius.Then after supercooling, release layer 2, cooling side finally are formed in the front of substrate layer 1
Formula contributes to the volatilization of solvent in such a way that cold wind brushes.
As shown in Figure 3, in production method of the invention, in the step three, the process for being coated with adhesive layer 3 is as follows：
First, acrylic glue is configured, is according to weight ratio with curing agent by acrylate：100：The ratio tune of 0.4-0.8
With forming acrylic glue.
Then, acrylic glue is being coated in a layer upper surface without silicon release film 5 by the way of dimple coating.
Finally, the acrylic glue of the attachment on no silicon release film 5 is transferred to by substrate layer by one group of transfer pressure roller 71,72
1 reverse side, to form the adhesive layer 3.
It is identical as the coating method of foregoing release layer 2, it is also to adopt first in 3 coating process of adhesive layer of the invention
The mode being coated with dimple, is then coated with by transfer modes, the specific method is as follows again：Described is coated on by acrylic glue
Process in one layer upper surface without silicon release film 5 is as follows：
First, 61 part of acrylic glue dimple transfer roller of array distribution acrylic glue groove 611 soaks a surface forming
In the acrylic glue for entering an acrylic glue groove 64, after acrylic glue dimple transfer roller 61 rotates, in its surface and acrylic glue groove
It is attached with acrylic glue in 611, is scraped off the acrylic glue on 61 surface of acrylic glue dimple transfer roller by acrylic glue scraper plate 62,
Acrylic glue is remained only in acrylic glue groove 611；
Then, recessed 61 and one acrylic glue laminated roller 63 of the transfer roller cooperation of acrylic glue, by one without silicon release film 5 by acrylic glue
Pass through between dimple transfer roller 61 and acrylic glue laminated roller 63, the layer upper surface fitting acrylic glue dimple transfer roller 61 of no silicon release film 5,
With the rotation of acrylic glue dimple transfer roller 61 and acrylic glue laminated roller 63, acrylic glue meeting is remained in acrylic glue groove 611
It is attached to the layer upper surface of no silicon release film 5, the acrylic glue being attached in no 5 layer upper surface of silicon release film is flowed along layer upper surface surface
It is flat.
Acrylic glue is coated on no silicon release film 5 by above-mentioned dimple coating method, then by way of transfer
By the reverse side of the acrylic glue transfer coated on no silicon release film 5 to substrate layer 1.In conjunction with shown in Fig. 3, it is coated with release layer 2
Substrate layer 1 is run from discharge roller 73 to wind-up roll 74, while material midway can pass through one group of transfer pressure roller 71,72.And it is coated with
Complete acrylic glue enters in the transfer pressure roller 71,72 simultaneously without silicon release film 5, at this point, being coated with acrylic without silicon release film 5
The one side of glue is bonded with the reverse side of substrate layer 1, by transferring pressure roller 71,72 by no silicon release film 5 and being coated with the base of release layer 2
Material layer 1 presses.It will be transferred to the reverse side of substrate layer 1 without attachment acrylic glue in 5 layer upper surface of silicon release film in this way, to be formed
The adhesive layer 3.After the completion of transfer, no silicon release film 5 will continue to the winding that moves ahead, and be coated with 1 meeting of substrate layer of adhesive layer 3
There is the winding of wind-up roll 74, forms final protective film.
The present invention is during being coated with adhesive layer 3, why in such a way that dimple coating and print-on coating are combined,
Exactly in order to obtain uniform adhesive layer 3.At present similar product use direct coating method, be struck off by scraper it is viscous
Layer is closed, but scraper can not accomplish complete straight line, cause last adhesive layer glue surface will appear in uneven thickness.Although dimple
It is coated with conducive to uniform glue-line is obtained, but the present invention applies to further increase the uniformity of adhesive layer 3 in conjunction with transfer
Cloth, so that it is guaranteed that adhesive layer 3 is uniform.
In addition, the adhesive layer 3 of the present invention is coated with using acrylic glue, enable adhesive layer 3 that can expand and extend with substrate layer 1,
It is not in cracking.Meanwhile acrylic adhesiveness is appropriate, can effectively cling the crystal grain of cutting, enable crystal grain energy in expansion process
It uniformly detaches with the expansion of protective film, while will not can not be removed because viscosity is excessive again when manipulator takes crystal grain.
Certainly, the above is only a specific embodiment of the present invention, be not to limit the scope of the present invention, it is all according to
The equivalent change or modification that structure, feature and principle described in scope of the present invention patent is done should all be included in Shen of the present invention
It please be in the scope of the claims.
Claims (8)
1. a kind of wafer cutting expansion protective film, the protective film include：Substrate layer (1) and it is respectively coated on substrate layer (1) just
The release layer (2) and adhesive layer (3) on anti-two sides, it is characterised in that：
The substrate layer (1) uses PVC film；
The release layer (2) uses paraffin wax type mould release；
The adhesive layer (3) uses acrylic glue.
2. a kind of wafer cutting expansion protective film according to claim 1, it is characterised in that：The adhesive layer (3)
Acrylic glue includes acrylate and curing agent, and the weight ratio of the two is：100：0.4-0.8.
3. a kind of wafer cutting expansion protective film according to claim 2, it is characterised in that：The curing agent is using different
Cyanate curing agent.
4. a kind of wafer cutting expansion protective film according to any one of claim 1-3, it is characterised in that：Described
The thickness of substrate layer (1) is：60-80 microns；The thickness of the release layer (2) is：0.1-0.4 microns；The adhesive layer
(3) thickness is 2-3 microns.
5. a kind of production method of wafer cutting expansion protective film, the protective film include：Substrate layer (1) and it is respectively coated on base
The release layer (2) and adhesive layer (3) of material layer (1) tow sides, it is characterised in that：The production method of the protective film includes following step
Suddenly：
Step 1, using PVC film as substrate layer (1)；
Step 2 is coated with paraffin wax type mould release, i.e., in substrate layer (1) using dimple coating method in the front of substrate layer (1)
Front forms release layer (2)；
Step 3 is coated with acrylic glue, i.e., in the anti-of substrate layer (1) by the way of print-on coating in the reverse side of substrate layer (1)
Face forms adhesive layer (3).
6. a kind of production method of wafer cutting expansion protective film according to claim 5, it is characterised in that：The step
In rapid two, the process of coating release layer (2) is as follows：
First, it is 25-35 according to weight ratio by paraffin and solvent：100 ratio allocates to form release solution；
Then, to have the release liquid dimple transfer roller (41) of the release liquid groove (411) of array distribution partly to immerse surface forming release
In solution, after release liquid dimple transfer roller (41) rotation, it is attached with release solution in its surface and release liquid groove (411), is led to
It crosses release liquid scraper plate (42) to scrape off the release solution on release liquid dimple transfer roller (41) surface, only in release liquid groove (411)
Remain release solution；
Then, release liquid dimple transfer roller (41) coordinates with a release hydraulic pressure roller (43), and substrate layer (1) is by release liquid dimple transfer roller
(41) pass through between release hydraulic pressure roller (43), the front of substrate layer (1) is bonded release liquid dimple transfer roller (41), with release liquid
The rotation of dimple transfer roller (41) and release hydraulic pressure roller (43), release solution is remained in release liquid groove (411) can be attached to base material
The surface of layer (1), is attached to the positive release solution of substrate layer (1) along substrate layer (1) surface levelling；
Finally, the solvent in release solution is volatilized, is then passed through by baking oven by the substrate layer (1) that front is attached with release solution
After supercooling, finally release layer (2) is formed in the front of substrate layer (1).
7. a kind of production method of wafer cutting expansion protective film according to claim 5, it is characterised in that：The step
In rapid three, the process of coating adhesive layer (3) is as follows：
First, acrylic glue is configured, is according to weight ratio with curing agent by acrylate：100：The ratio of 0.4-0.8 allocates shape
At acrylic glue；
Then, acrylic glue is being coated in a layer upper surface without silicon release film (5) by the way of dimple coating；
Finally, the acrylic glue without the attachment on silicon release film (5) is transferred to by substrate layer by one group of transfer pressure roller (71,72)
(1) reverse side, to form the adhesive layer (3).
8. a kind of production method of wafer cutting expansion protective film according to claim 7, it is characterised in that：It is described
The process that acrylic glue is coated in a layer upper surface without silicon release film (5) is as follows：
First, acrylic glue dimple transfer roller (61) part of array distribution acrylic glue groove (611) soaks a surface forming
Enter in acrylic glue, after acrylic glue dimple transfer roller (61) rotation, Asia is attached in its surface and acrylic glue groove (611)
Gram force glue is scraped off the acrylic glue on acrylic glue dimple transfer roller (61) surface by acrylic glue scraper plate (62), only at sub- gram
Acrylic glue is remained in power glue groove (611)；
Then, the recessed transfer roller of acrylic glue (61) coordinates with an acrylic glue laminated roller (63), by one without silicon release film (5) by acrylic
Pass through between glue dimple transfer roller (61) and acrylic glue laminated roller (63), the layer upper surface fitting acrylic glue of no silicon release film (5) is micro-
Recessed transfer roller (61), with the rotation of acrylic glue dimple transfer roller (61) and acrylic glue laminated roller (63), acrylic glue groove (611)
In remain acrylic glue and can be attached to the layer upper surface of no silicon release film (5), the Ya Ke being attached in no silicon release film (5) layer upper surface
Power glue is along layer upper surface surface levelling.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810344064.1A CN108587501A (en) | 2018-04-17 | 2018-04-17 | A kind of wafer cutting expansion protective film and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810344064.1A CN108587501A (en) | 2018-04-17 | 2018-04-17 | A kind of wafer cutting expansion protective film and preparation method thereof |
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| CN108587501A true CN108587501A (en) | 2018-09-28 |
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| CN109484049A (en) * | 2018-10-30 | 2019-03-19 | 上海马云标识有限公司 | A kind of anti-counterfeit package integral preparation process |
| CN114851262A (en) * | 2022-07-07 | 2022-08-05 | 南通君越新材料科技有限公司 | Film cutting machine capable of degrading plastic film |
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