CN114667604A - Array substrate, manufacturing method thereof, display panel and display device - Google Patents
Array substrate, manufacturing method thereof, display panel and display device Download PDFInfo
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- CN114667604A CN114667604A CN202080000146.XA CN202080000146A CN114667604A CN 114667604 A CN114667604 A CN 114667604A CN 202080000146 A CN202080000146 A CN 202080000146A CN 114667604 A CN114667604 A CN 114667604A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
Abstract
The array substrate, the manufacturing method thereof, the display panel and the display device are provided, and the manufacturing method of the array substrate comprises the following steps: providing a substrate (1); sequentially forming electrode structures (2) on the first surface of the substrate base plate (1); forming a first protection structure (3) covering the substrate base plate (1) on one side of the electrode structure (2) departing from the substrate base plate (1); the substrate base plate (1) is turned over, so that the first protection structure (3) is attached to the bearing machine table; forming a binding terminal (4) on a second surface of the substrate base plate (1), wherein the second surface is opposite to the first surface; and turning the substrate base plate (1) again, and patterning the first protection structure (3) to expose the electrode structure (2). By the manufacturing method, the electrode structure (2) on the first surface of the substrate base plate (1) is protected so as to prevent the electrode structure (2) from being damaged, the first protection structure (3) does not need to be torn off, the manufacturing process is simplified, and meanwhile, the production cost is saved.
Description
Technical Field
The disclosure relates to the field of display technologies, and in particular, to an array substrate, a manufacturing method thereof, a display panel, and a display device.
Background
With the development of display technology, full-screen display is increasingly favored by people, and the borderless design of the display panel can be realized by manufacturing circuit structures on both the front and back sides of the substrate.
Disclosure of Invention
In a first aspect, an embodiment of the present disclosure provides a method for manufacturing an array substrate, including:
providing a substrate base plate;
forming an electrode structure on the first surface of the substrate base plate, wherein the electrode structure is configured to be electrically connected with a light-emitting device;
forming a first protection structure covering the substrate on one side of the electrode structure, which is far away from the substrate;
turning over the substrate base plate;
forming a binding terminal on a second surface of the substrate base plate, wherein the second surface is opposite to the first surface;
and turning over the substrate again, and patterning the first protection structure to expose the electrode structure.
In a possible implementation manner, in the manufacturing method of the array substrate provided by the embodiment of the present disclosure, the forming a first protection structure on a side of the electrode structure, which is away from the substrate, specifically includes:
forming a plurality of first spacers on one side of the electrode structure, which is far away from the substrate base plate, wherein the orthographic projection of the first spacers on the substrate base plate and the orthographic projection of the electrode structure on the substrate base plate are not overlapped with each other;
and forming a first protective film on one side of the first spacer, which is far away from the substrate base plate.
In a possible implementation manner, in the manufacturing method of an array substrate provided in an embodiment of the present disclosure, the patterning the first protection structure specifically includes:
patterning the first protective film to expose at least a portion of a surface of the electrode structure.
In a possible implementation manner, in the manufacturing method of the array substrate provided in the embodiment of the present disclosure, before turning over the substrate again, the method further includes:
and forming a second protection structure on one side of the binding terminal, which is far away from the substrate base plate.
In a possible implementation manner, in the manufacturing method of the array substrate provided by the embodiment of the present disclosure, the forming a second protection structure on a side of the binding terminal away from the substrate specifically includes:
forming a second spacer on one side of the binding terminal, which is far away from the substrate base plate, wherein the orthographic projection of the second spacer on the substrate base plate and the orthographic projection of the binding terminal on the substrate base plate are not overlapped with each other;
forming a second protective film on the second spacer;
patterning the second protective film to expose at least a part of a surface of the binding terminal.
In a second aspect, an embodiment of the present disclosure further provides an array substrate, including:
a substrate base plate;
an electrode structure on the first surface of the substrate base plate, the electrode structure being configured to be electrically connected with a light emitting device;
a binding terminal located on a second surface of the substrate base plate, the second surface being disposed opposite the first surface;
the first protection structure is positioned on one side, away from the substrate base plate, of the electrode structure, and at least part of the surface of the electrode structure is exposed by the first protection structure.
In a possible implementation manner, in the array substrate provided in an embodiment of the present disclosure, the first protection structure includes:
the electrode structure comprises a substrate base plate, a plurality of first spacers and a first protective film, wherein the first spacers are positioned on one side, away from the substrate base plate, of the electrode structure;
the orthographic projection of the first spacer on the substrate base plate and the orthographic projection of the electrode structure on the substrate base plate are not overlapped;
the first protective film is provided with a first opening area, and the orthographic projection of the electrode structure on the substrate at least covers the orthographic projection of the first opening area on the substrate.
In a possible implementation manner, in the array substrate provided in the embodiment of the present disclosure, a height of the first spacer ranges from 1 μm to 30 μm;
the thickness of the first protective film ranges from 1 μm to 5 μm.
In a possible implementation manner, in the array substrate provided in an embodiment of the present disclosure, the array substrate further includes: a second protective structure;
the second protection structure is located on one side of the binding terminal, which is far away from the substrate base plate.
In a possible implementation manner, in the array substrate provided in an embodiment of the present disclosure, the second protection structure includes:
the second spacer is positioned on one side, away from the substrate base plate, of the binding terminal, and the orthographic projection of the second spacer on the substrate base plate and the orthographic projection of the binding terminal on the substrate base plate are not overlapped;
and the second protective film is positioned on one side of the second spacer, which is far away from the substrate base plate, and the second protective film is provided with a second opening area, and at least part of the surface of the binding terminal is exposed by the second opening area.
In a third aspect, an embodiment of the present disclosure further provides a display panel, which includes the array substrate provided in any embodiment of the second aspect, and a plurality of light emitting devices electrically connected to the array substrate.
In a possible implementation manner, in the display panel provided in the embodiment of the present disclosure, the display panel further includes: a flexible circuit board electrically connected with the binding terminal.
In one possible implementation manner, in a display panel provided in an embodiment of the present disclosure, the light emitting device includes:
a micro light emitting device electrically connected with the electrode structure.
In a fourth aspect, embodiments of the present disclosure further provide a display device, including the display panel provided in any embodiment of the third aspect, and an integrated circuit.
Drawings
Fig. 1 is a schematic structural view of an array substrate in the related art;
fig. 2 is a schematic structural diagram of a driving pixel circuit according to an embodiment of the disclosure;
fig. 3a to fig. 3e are schematic structural diagrams in the manufacturing process of the array substrate according to the embodiment of the disclosure;
fig. 4 is a schematic structural diagram of an array substrate according to an embodiment of the present disclosure;
fig. 5 is a schematic top view of an array substrate according to an embodiment of the present disclosure;
fig. 6 is another schematic structural diagram of an array substrate according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a display panel according to an embodiment of the disclosure.
Detailed Description
In the related art, a display panel includes a display area and a bezel area surrounding the display area, and a PAD (PAD) generally used for bonding with an IC is disposed in the bezel area of the display panel. The full-screen and frameless display product can enable a user to obtain better viewing experience and is increasingly favored by the user.
In order to realize frameless display, the related art proposes a technology for realizing frameless display through front and back surface processes of a substrate, namely, the front surface is designed as a back plate of a pixel driving circuit, the back surface is designed as a binding terminal, through holes are formed in the substrate, and metal is filled in the through holes to realize connection of front and back surface signals.
Because the front and back surfaces of the substrate are designed with circuit structures, after the circuit structure on one surface is manufactured, the substrate needs to be turned over to manufacture the circuit structure on the other surface. At this time, the surface on which the circuit structure is manufactured needs to be in contact with the machine platform deck, and the surface on which the circuit structure is manufactured needs to be adsorbed and transferred by the machine platform decks of a plurality of process sections, so that the film layer of the manufactured circuit structure on the surface in contact with the machine platform deck is seriously scratched.
The structure of the array substrate in the related art is shown in fig. 1, and includes: the substrate 01 is positioned on each film layer structure on the front surface of the substrate 01, and comprises electrodes 02 which are used for being connected with the micro light-emitting device; and the reverse side of the substrate 1 includes a binding structure 03 for binding with a flexible circuit board or the like. In order to protect the front film layer structure before the back circuit structure is fabricated, a protective film 04 is generally attached to the whole front film layer structure, and after the back circuit structure is fabricated, the substrate is turned over and the protective film 04 is removed, so as to bind the micro light emitting device. However, this type of protective film 04 may adhere to the electrode 02 and the like, which may affect the usability, and may require a separate film removing device, which may increase the production cost.
It should be noted that fig. 1 is only illustrated as one possible embodiment of an array substrate in the related art, and the specific structure thereof is not specifically limited herein.
Based on the above problems in the related art, embodiments of the present disclosure provide an array substrate, a manufacturing method thereof, a display panel and a display device. In order to make the purpose, technical solution and advantages of the present disclosure more clear, specific embodiments of an array substrate, a manufacturing method thereof, a display panel and a display device provided in the embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. It is to be understood that the preferred embodiments described below are for purposes of illustration and explanation only and are not intended to limit the present disclosure. And the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
The shapes and sizes of the various elements in the drawings are not to scale and are merely intended to illustrate the present disclosure.
Specifically, an embodiment of the present disclosure provides a method for manufacturing an array substrate, including:
providing a substrate base plate;
forming an electrode structure on the first surface of the substrate base plate, wherein the electrode structure is configured to be electrically connected with a light-emitting device;
forming a first protection structure covering the substrate on one side of the electrode structure, which is far away from the substrate;
turning over the substrate base plate;
forming a binding terminal on a second surface of the substrate base plate, wherein the second surface is arranged opposite to the first surface;
and turning over the substrate again, and patterning the first protection structure to expose the electrode structure.
Specifically, in the manufacturing method of the array substrate provided by the embodiment of the present disclosure, first, an electrode structure electrically connected to the light emitting device is formed on a first surface of the substrate, and a first protection structure is formed on the electrode structure, so that the first protection structure is in contact with the carrier platform after being turned over, the electrode structure on the first surface of the substrate is protected, and after the bonding terminal is manufactured on a second surface of the substrate, the substrate is turned over again, so that the second surface of the substrate is in contact with the carrier platform; the first protective structure is then patterned to expose the covered electrode structure for subsequent electrical connection to the light emitting device. By the manufacturing method, the electrode structure on the first surface of the substrate base plate is protected so as to avoid damage to the electrode structure, the first protection structure does not need to be torn off, the manufacturing process is simplified, and meanwhile, the production cost is saved.
The light emitting device described in the embodiments of the present disclosure may be a Micro light emitting diode chip, such as a Micro LED chip or a μ LED chip or a Mini LED chip.
A driving pixel circuit for providing a driving signal to the electrode structure is further disposed between the electrode structure and the substrate, and the structure and layout of the driving pixel circuit are the same as those of the driving pixel circuit in the related art, for example, the structure of the driving pixel circuit may be as shown in fig. 2, and includes: a first transistor T1 having a gate electrode of the first transistor T1 electrically connected to the light emission control terminal EM, a first electrode of the first transistor T1 electrically connected to the first reference voltage signal terminal VDD, and a second electrode of the first transistor T1 electrically connected to the first electrode of the driving transistor DT; a second transistor T2, a gate of the second transistor T2 being electrically connected to the emission control terminal EM, a first pole of the second transistor T2 being electrically connected to the second pole of the driving transistor DT, a second pole of the second transistor T2 being electrically connected to the first pole of the fourth transistor T4; a third transistor T3, a gate of the third transistor T3 being electrically connected to the second scan control terminal G _ B, a first pole of the third transistor T3 being electrically connected to the second data signal terminal D _ B, and a second pole of the third transistor T3 being electrically connected to a gate of the fourth transistor T4; a fourth transistor T4, a second electrode of the fourth transistor T4 being electrically connected to an anode of the light emitting device L, a cathode of the light emitting device L being electrically connected to the second reference voltage signal terminal VSS; a fifth transistor T5, a gate of the fifth transistor T5 being electrically connected to the first scan control terminal G _ a, a first pole of the fifth transistor T5 being electrically connected to the first data signal terminal D _ a, a second pole of the fifth transistor T5 being electrically connected to the first pole of the driving transistor DT, a gate of the driving transistor DT being electrically connected to the first voltage signal terminal V1, a gate signal provided from the first voltage signal terminal V1 generating a driving current for driving the light emitting device L; a first capacitor C having a first electrode electrically connected to the gate of the fourth transistor T4, a second electrode electrically connected to the second voltage signal terminal V2, and a second voltage signal terminal V2 connected to the ground GND. The layout of the driving pixel circuit on the substrate may be as shown in fig. 3a, and of course, the structure and layout of the driving pixel circuit shown in fig. 2 and fig. 3a are only described as one embodiment, and the structure and layout of the driving pixel circuit are not limited in detail here.
It should be noted that, in the manufacturing method of the array substrate provided in the embodiment of the present disclosure, the pixel driving circuit and the electrode structure on the first surface of the substrate are firstly manufactured, and then the binding terminal on the second surface of the substrate is manufactured, because the number of the films on the first surface of the substrate is large, each film needs to be formed through multiple processes, and thus needs to be adsorbed and transferred by the supporting machines of multiple process stages; the number of the film layers on the second surface of the substrate is small, and the process is simple relative to the manufacture of the structure on the first surface. If the films on the second surface of the substrate are first fabricated and then the films on the first surface are fabricated, the films on the second surface need to be adsorbed and transferred by the bearing machine tables of the plurality of process segments, so that the films on the second surface are seriously damaged. Therefore, the film layers on the first surface of the substrate are formed first, and then the film layers on the second surface are formed.
In the manufacturing method of the array substrate provided by the embodiment of the disclosure, the first protection structure is preferably formed on one side of the first surface of the substrate, because the pattern sizes of the pixel driving circuit and the electrode structure on the first surface of the substrate are both small, and slight damage may have a large influence on the display performance.
Optionally, in a manufacturing method of an array substrate provided in this disclosure, forming a first protection structure on a side of the electrode structure away from the substrate specifically includes:
forming a plurality of first spacers on one side of the electrode structure, which is far away from the substrate base plate, wherein the orthographic projection of the first spacers on the substrate base plate is not overlapped with the orthographic projection of the electrode structure on the substrate base plate;
and forming a first protective film on one side of the first spacer, which is far away from the substrate base plate.
As shown in fig. 4 and 5, in order to prevent the first spacer 31 from shielding each electrode structure 2, and improve the resolution of the display panel while ensuring normal display, the first spacer 31 may be disposed at the gap region between adjacent sub-pixels, wherein the first spacer 31 may be disposed between every two adjacent rows or two adjacent columns of sub-pixels, the first spacer 31 may be disposed at intervals between two rows/columns of sub-pixels, and of course, the first spacer 31 may be disposed at intervals between multiple rows/columns of sub-pixels. The structure shown in fig. 4 is described by taking an example that one sub-pixel needs to be driven by two electrode structures 2, and of course, the case that one sub-pixel needs to be driven by only one electrode structure 2 is also within the protection scope of the present disclosure.
It should be noted that, the relative position relationship between the first spacers and the electrode structures shown in fig. 4 and 5 is only described as an example, that is, the first spacers are regularly arranged, and the case where the orthographic projection of other first spacers on the substrate base plate and the orthographic projection of the electrode structures on the substrate base plate do not overlap each other, including the case where the first spacers are irregularly arranged, is also within the protection scope of the present disclosure, and is not specifically limited herein.
Specifically, in the manufacturing method of the array substrate provided by the embodiment of the disclosure, the first protection structure includes a first spacer and a first protection film, the first spacer is disposed to keep a certain distance between each film layer on the first surface of the substrate and the carrier platform, so as to prevent particles from damaging each film layer, and the first protection film is disposed to cover an area where each film layer is located, so as to comprehensively protect each film layer on the first surface of the substrate.
In the manufacturing method of the array substrate provided in the embodiment of the present disclosure, an orthogonal projection of the first spacer on the substrate needs not to overlap an orthogonal projection of the electrode structure on the substrate, so as to avoid shielding the electrode structure. If the first spacer is disposed to overlap the electrode structure, it may not only cause difficulty in patterning the first protection structure later but also affect the disposition of the light emitting device.
In a specific implementation, the first protection structure may also only include the first protection film, and how to select may be determined according to an environment where the substrate is actually located and design parameters of the panel, which is not specifically limited herein.
Optionally, in the manufacturing method of the array substrate provided in the embodiment of the present disclosure, the step of placing the first protection structure on a side away from the carrier stage, and patterning the first protection structure specifically includes:
the first protective film is patterned to expose at least a portion of a surface of the electrode structure.
In particular, in the manufacturing method of the array substrate provided by the embodiment of the disclosure, since there is no overlapping region between the first spacer and the electrode structure, only the first protective film covers the electrode structure, and thus, patterning the first protective film can expose at least a part of the surface of the electrode structure, so that the electrode structure can be bound with the light emitting device, and a driving current can be provided to the light emitting device.
The following describes a method for manufacturing the array substrate according to the above embodiment with reference to fig. 3a to 3 e:
as shown in fig. 3a, a substrate 1 is provided, the substrate 1 is placed on a carrier 10, and a corresponding pixel driving circuit and an electrode structure 2 located on the pixel driving circuit and electrically connected to the pixel driving circuit are sequentially formed on the substrate 1;
the pixel driving circuit may include a semiconductor layer P, a gate layer (G1/G2), a source/drain electrode layer (SD/DA/VDD/VSS), and an insulating layer between the adjacent layers, wherein the structure of the pixel driving circuit shown in fig. 3a is merely used as an example for description, and the structure of the pixel driving circuit is not specifically limited herein.
As shown in fig. 3b, a first spacer 31 and a first protection film 32 are sequentially formed on the electrode structure 2, wherein a patterning process of the first spacer 31 is included, and will not be described in detail.
As shown in fig. 3c, the substrate 1 is turned over, and the first protection film 32 is in contact with the loader 10.
As shown in fig. 3d, a binding terminal 4 is formed on the second surface of the substrate base plate 1;
it should be noted that, in the array substrate provided in the embodiment of the present disclosure, when a driving chip is used for driving, a gate driving circuit GOA does not need to be arranged between the binding terminal 4 and the substrate 1, and the driving chip can directly provide a driving signal to each gate line; as shown in fig. 3d, a gate driving circuit GOA is disposed between the bonding terminal 4 and the substrate 1, the gate driving circuit GOA is electrically connected to the bonding terminal 4 to receive a signal provided by the bonded flexible circuit board, and the gate driving circuit GOA is also electrically connected to a gate line disposed on the first surface of the substrate 1, which may be implemented by disposing a via hole or routing a periphery. The specific manner of driving can be selected according to the actual use condition, and is not particularly limited herein.
As shown in fig. 3e, the substrate 1 is turned over again, the binding terminals 4 are contacted with the carrier 10, and the first protective film 32 is patterned to expose at least a portion of the surface of the electrode structure 4, thereby forming the array substrate shown in fig. 4.
Optionally, in the manufacturing method of the array substrate provided in the embodiment of the present disclosure, in order to protect each film layer on the second surface of the substrate, before the substrate is turned over again, the manufacturing method further includes:
and forming a second protection structure on one side of the binding terminal, which is far away from the substrate base plate.
Specifically, in the manufacturing method of the array substrate provided in the embodiment of the present disclosure, after the electrode structure is exposed, the corresponding light emitting device needs to be manufactured or bonded at the position corresponding to the electrode structure, and therefore, the film layers formed on the second surface of the substrate may be damaged through the moving and adsorbing processes of the multiple carrier platforms, and by setting the second protection structure on the bonding terminal, the film layers of the substrate located on the second surface can be protected, so that the use performance of the film layers of the second surface of the substrate is improved.
Optionally, in the manufacturing method of the array substrate provided in the embodiment of the present disclosure, a second protection structure is formed on a side of the binding terminal away from the substrate, and specifically includes:
forming a second spacer on one side of the binding terminal, which is far away from the substrate base plate, wherein the orthographic projection of the second spacer on the substrate base plate is not overlapped with the orthographic projection of the binding terminal on the substrate base plate;
forming a second protective film on the second spacer;
the second protective film is patterned to expose at least a part of the surface of the binding terminal.
Specifically, in the manufacturing method of the array substrate provided by the embodiment of the present disclosure, after the binding terminals are formed, the second spacer and the second protective film may be sequentially formed on the binding terminals, and the binding terminals are exposed by patterning the second protective film, so that the binding terminals are bound with the flexible circuit board and the like.
Based on the same inventive concept, as shown in fig. 4, an embodiment of the present disclosure further provides an array substrate, including:
a base substrate 1;
an electrode structure 2, the electrode structure 2 being located on the first surface of the substrate base plate 1, the electrode structure being configured to be electrically connected with the light emitting device;
the binding terminal 4 is positioned on a second surface of the substrate base plate 1, and the second surface is opposite to the first surface;
and the first protection structure 3, the first protection structure 3 is positioned on one side of the electrode structure 2, which faces away from the substrate base plate 1, and the first protection structure 3 exposes at least part of the surface of the electrode structure 2.
Specifically, in the array substrate provided by the embodiment of the disclosure, through the arrangement of the first protection structure, when the first surface of the substrate faces the loader table, each film layer located on the first surface of the substrate can be protected so as to prevent each film layer from being damaged. And the first protection structure has a first opening region, at least part of the surface of the electrode structure can be exposed, so that the electrode structure and the light-emitting device can be bound, the first protection structure does not need to be torn off, the preparation process is simplified, and the production cost is saved.
Optionally, in the array substrate provided in the embodiment of the present disclosure, as shown in fig. 4, the first protection structure 3 includes:
a plurality of first spacers 31 located on a side of the electrode structure 2 facing away from the substrate base plate 1, and a first protection film 32 located on a side of the first spacers 31 facing away from the substrate base plate 1;
the orthographic projection of the first spacer 31 on the substrate 1 and the orthographic projection of the electrode structure 2 on the substrate 1 do not overlap;
the first protective film 32 has a first open region, and an orthographic projection of the electrode structure 2 on the substrate at least covers the orthographic projection of the first open region on the substrate, i.e., exposes a portion of the surface of the electrode structure 2.
Specifically, in the array substrate provided by the embodiment of the disclosure, through the arrangement of the first spacer, a certain distance can be kept between each film layer on the first surface of the substrate and the carrier platform, so as to avoid damage of the particulate matter to each film layer, and the arrangement of the first protection film can cover the region where each film layer is located, so as to comprehensively protect each film layer on the first surface of the substrate.
In other embodiments provided by the present disclosure, the first protection structure 3 may also include only the first protection film, the material of the first protection film is organic resin, and the first protection film 32 has a first open region to expose a portion of the surface of the electrode structure 2.
Optionally, in the array substrate provided in the embodiment of the present disclosure, a height of the first spacer ranges from 1 μm to 30 μm;
the thickness of the first protective film ranges from 1 μm to 5 μm.
Specifically, in the array substrate provided in the embodiment of the disclosure, the height of the first spacer may be set higher according to the environment of the array substrate, for example, when there may be larger particles in the carrier during the manufacturing process, the height of the first spacer needs to be set to be higher, for example, 20 μm to 30 μm, so as to ensure the yield of the product; if the particles possibly existing in the carrier during the manufacturing process are smaller, the height of the first spacer can be reduced, for example, the height can be set to be between 5 μm and 10 μm, which not only can ensure the yield of the product and the stability of the array substrate on the carrier, but also can increase the productivity. The specific value can be selected according to actual needs, and is not particularly limited herein. Similarly, the thickness of the first protective film may be set to be 1 μm to 5 μm to protect the electrode structure in each region in the whole, and the thickness of the first protective film may be selected according to the actual use situation, and is not limited specifically herein. It is understood that the thickness of the first protection film is almost uniform everywhere, but the distance between the first protection film and the base substrate at different positions on the surface away from the base substrate is different.
The first shock insulator and the first protective film can be formed by organic resin, and have the advantages of high temperature resistance, transparency, high stability and the like, and have strong adaptability to various processes.
Optionally, in the array substrate provided in the embodiment of the present disclosure, as shown in fig. 6, the method further includes: a second protective structure 5;
the second protection structure 5 is located on the side of the binding terminal 4 facing away from the substrate base 1.
Specifically, in the array substrate provided in the embodiment of the present disclosure, after the electrode structure is exposed, the corresponding light emitting device needs to be fabricated or bonded at a position corresponding to the electrode structure, and therefore, the second surface of the substrate may be damaged by moving and adsorbing processes of the plurality of supporting stations, and by setting the second protection structure on the bonding terminal, the films on the second surface of the substrate may be protected, so that the performance of the films on the second surface of the substrate may be improved.
Optionally, in the array substrate provided in the embodiment of the present disclosure, as shown in fig. 6, the second protection structure 5 includes:
the second spacer 51 is positioned on one side, away from the substrate base plate 1, of the binding terminal 4, and the orthographic projection of the second spacer 51 on the substrate base plate 1 is not overlapped with the orthographic projection of the binding terminal 4 on the substrate base plate 1;
and the second protective film 52 is positioned on the side of the second spacer 51, which faces away from the substrate base plate 1, and the second protective film 52 has a second opening area which exposes at least part of the surface of the binding terminal 4.
In particular, in the array substrate provided by the embodiment of the present disclosure, in order to implement frameless or narrow-frame display of the display panel, a portion of the peripheral circuit may be fabricated on the non-display side of the substrate, i.e., the second surface of the substrate. In order to protect the film layers on the second surface of the base substrate, a second spacer and a second protective film may be formed on the second surface of the base substrate. Because the second surface of the substrate base plate forms fewer circuit structures, the space is more sufficient, and a plurality of second spacers can be arranged to ensure the stability of the array base plate.
The orthographic projection of the second spacer on the substrate base plate can not coincide with the orthographic projection of the first spacer on the substrate base plate, and an appropriate position can be selected for manufacturing according to the structure formed on the second surface of the substrate base plate.
It should be noted that, when the position of the second spacer is designed, the position for binding the flexible circuit board needs to be reserved, so that the binding of the flexible circuit board is not affected, that is, the orthographic projection of the second spacer on the substrate is not overlapped with the preset area where the flexible circuit board is located. Wherein the area occupied by the flexible circuit board is 100 μm2～1000μm2In the meantime. In addition, the uniformity and the flatness of the height of the second spacer should be within an acceptable range to ensure the yield of the subsequent bonding of the light emitting device.
Specifically, after the second spacer and the second protective film are formed in sequence, the second protective film needs to be patterned before the substrate base plate is turned over so as to expose the binding terminal, and the binding terminal is convenient to bind with the flexible circuit board in the later period. I.e., after patterning the second protective film, the substrate base is inverted. Although the bonding terminals are exposed after being turned over, the second spacers and the second protective film have certain thicknesses, so that the substrate is supported and protected during the next process.
Based on the same inventive concept, the embodiment of the present disclosure further provides a display panel, including: the array substrate provided by any of the above embodiments, and a plurality of light emitting devices electrically connected to the array substrate.
Optionally, in the display panel provided in the embodiment of the present disclosure, the display panel further includes: and the flexible circuit board is electrically connected with the binding terminal.
Optionally, in a display panel provided in an embodiment of the present disclosure, the light emitting device includes:
and the micro light-emitting device is electrically connected with the electrode structure.
As shown in fig. 7, the micro light emitting device L includes two electrode pins L1, L2 respectively bonded to the two electrode structures 2, wherein the electrode pin L1 receives a data signal from the SD electrode, and the electrode pin L2 receives a low voltage or a ground voltage supplied from the VSS electrode.
When the light-emitting device is a micro light-emitting device, the micro light-emitting device can be directly bound with the electrode structure, and the process is simple.
Of course, the light emitting device may also be an organic electroluminescent device, that is, a film layer such as a light emitting layer is formed on the electrode structure, and specifically, which type of light emitting device is used may be selected according to the actual use situation, and is not particularly limited herein.
Based on the same inventive concept, embodiments of the present disclosure also provide a display device, which includes the display panel provided in any of the above embodiments, and a driving IC.
The display panel and the display device have all the advantages of the array substrate provided by the above embodiments, and can be implemented by referring to the above embodiments of the array substrate, which are not described herein again.
The manufacturing method comprises the steps that an electrode structure electrically connected with a light-emitting device is formed on a first surface of a substrate base plate, a first protection structure is formed on the electrode structure, the first protection structure is in contact with a bearing machine after overturning, the electrode structure on the first surface of the substrate base plate is protected, and after a binding terminal is manufactured on a second surface of the substrate base plate, the substrate base plate is overturned again, so that the second surface of the substrate base plate is in contact with the bearing machine; the first protective structure is then patterned to expose the covered electrode structure for subsequent electrical connection to the light emitting device. By the manufacturing method, the electrode structure on the first surface of the substrate is protected, so that the electrode structure is prevented from being damaged, the first protection structure is not required to be torn off, the manufacturing process is simplified, and meanwhile, the production cost is saved.
It will be apparent to those skilled in the art that various changes and modifications can be made in the present disclosure without departing from the spirit and scope of the disclosure. Thus, if such modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include such modifications and variations as well.
Claims (14)
1. A manufacturing method of an array substrate comprises the following steps:
providing a substrate base plate;
forming an electrode structure on the first surface of the substrate base plate, wherein the electrode structure is configured to be electrically connected with a light-emitting device;
forming a first protection structure covering the substrate on one side of the electrode structure, which is far away from the substrate;
turning over the substrate base plate;
forming a binding terminal on a second surface of the substrate base plate, wherein the second surface is opposite to the first surface;
and turning over the substrate again, and patterning the first protection structure to expose the electrode structure.
2. The method for manufacturing the array substrate according to claim 1, wherein the forming of the first protection structure on the side of the electrode structure away from the substrate specifically comprises:
forming a plurality of first spacers on one side of the electrode structure, which is far away from the substrate base plate, wherein the orthographic projection of the first spacers on the substrate base plate and the orthographic projection of the electrode structure on the substrate base plate are not overlapped with each other;
and forming a first protective film on one side of the first spacer, which is far away from the substrate base plate.
3. The method for manufacturing the array substrate according to claim 2, wherein the patterning the first protection structure specifically comprises:
patterning the first protective film to expose at least a portion of a surface of the electrode structure.
4. The method for manufacturing an array substrate according to claim 1, wherein before the substrate is turned over again, the method further comprises:
and forming a second protection structure on one side of the binding terminal, which is far away from the substrate base plate.
5. The manufacturing method of the array substrate according to claim 4, wherein the forming of the second protection structure on the side of the binding terminal away from the substrate specifically comprises:
forming a second spacer on one side of the binding terminal, which is far away from the substrate base plate, wherein the orthographic projection of the second spacer on the substrate base plate and the orthographic projection of the binding terminal on the substrate base plate are not overlapped with each other;
forming a second protective film on the second spacer;
patterning the second protective film to expose at least a part of a surface of the binding terminal.
6. An array substrate, comprising:
a base substrate;
an electrode structure on the first surface of the substrate base plate, the electrode structure being configured to be electrically connected with a light emitting device;
a binding terminal located on a second surface of the substrate base plate, the second surface being disposed opposite the first surface;
the first protection structure is positioned on one side, away from the substrate base plate, of the electrode structure, and at least part of the surface of the electrode structure is exposed by the first protection structure.
7. The array substrate of claim 6, wherein the first protection structure comprises:
the electrode structure comprises a plurality of first shock insulators and a first protective film, wherein the first shock insulators are positioned on one side, away from the substrate, of the electrode structure;
the orthographic projection of the first spacer on the substrate base plate and the orthographic projection of the electrode structure on the substrate base plate are not overlapped;
the first protective film is provided with a first opening area, and the orthographic projection of the electrode structure on the substrate at least covers the orthographic projection of the first opening area on the substrate.
8. The array substrate of claim 7, wherein the height of the first spacer ranges from 1 μm to 30 μm;
the thickness of the first protective film ranges from 1 μm to 5 μm.
9. The array substrate of claim 6, further comprising: a second protective structure;
the second protection structure is located on one side of the binding terminal, which is far away from the substrate base plate.
10. The array substrate of claim 9, wherein the second protective structure comprises:
the second spacer is positioned on one side, away from the substrate base plate, of the binding terminal, and the orthographic projection of the second spacer on the substrate base plate and the orthographic projection of the binding terminal on the substrate base plate are not overlapped;
and the second protective film is positioned on one side of the second spacer, which is far away from the substrate base plate, and the second protective film is provided with a second opening area, and at least part of the surface of the binding terminal is exposed by the second opening area.
11. A display panel comprising the array substrate of any one of claims 6 to 10, and a plurality of light emitting devices electrically connected to the array substrate.
12. The display panel of claim 11, further comprising: a flexible circuit board electrically connected with the binding terminal.
13. The display panel of claim 11, wherein the light emitting device comprises:
a micro light emitting device electrically connected to the electrode structure.
14. A display device comprising the display panel according to any one of claims 11 to 13, and an integrated circuit.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/075907 WO2021163940A1 (en) | 2020-02-19 | 2020-02-19 | Array substrate and manufacturing method therefor, display panel and display device |
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| CN114667604A true CN114667604A (en) | 2022-06-24 |
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| CN202080000146.XA Pending CN114667604A (en) | 2020-02-19 | 2020-02-19 | Array substrate, manufacturing method thereof, display panel and display device |
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| WO (1) | WO2021163940A1 (en) |
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| US6952020B1 (en) * | 1999-07-06 | 2005-10-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| KR101597312B1 (en) * | 2009-11-16 | 2016-02-25 | 삼성디스플레이 주식회사 | Thin film transistor display panel and method of manufacturing the same |
| CN107342299A (en) * | 2017-08-30 | 2017-11-10 | 京东方科技集团股份有限公司 | Array base palte and preparation method thereof, display device and preparation method thereof |
| CN108987443B (en) * | 2018-07-05 | 2021-06-11 | 昆山国显光电有限公司 | Display panel, manufacturing method thereof and display terminal |
| CN110010627B (en) * | 2019-04-12 | 2021-02-02 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method thereof and display device |
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