CN114666467A - Camera shooting assembly and electronic equipment - Google Patents
Camera shooting assembly and electronic equipment Download PDFInfo
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- CN114666467A CN114666467A CN202011545140.9A CN202011545140A CN114666467A CN 114666467 A CN114666467 A CN 114666467A CN 202011545140 A CN202011545140 A CN 202011545140A CN 114666467 A CN114666467 A CN 114666467A
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- 206010070834 Sensitisation Diseases 0.000 claims abstract description 30
- 230000008313 sensitization Effects 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims description 66
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 claims description 13
- 239000003456 ion exchange resin Substances 0.000 claims description 12
- 229920003303 ion-exchange polymer Polymers 0.000 claims description 12
- 230000005611 electricity Effects 0.000 claims description 5
- 239000005518 polymer electrolyte Substances 0.000 claims description 4
- 150000002500 ions Chemical class 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003729 cation exchange resin Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Lens Barrels (AREA)
Abstract
The application discloses subassembly and electronic equipment make a video recording belongs to the technical field of making a video recording, and the subassembly of making a video recording includes: a base; the lens assembly is arranged on the base; the photosensitive chip and the lens assembly are arranged at intervals along the first axial direction of the lens assembly; the adjusting structure is connected with the photosensitive chip and drives the photosensitive chip to deform so as to adjust the field curvature of the photosensitive chip; the circuit board is electrically connected with the adjusting structure. In the camera assembly of this application, adjust through the adjustment structure the field curvature of sensitization chip has solved the problem that the warpage appears in sensitization chip for central light and marginal light after light passes through the lens subassembly focus on the sensitization chip simultaneously, thereby obtain clear image, improve and shoot and experience.
Description
Technical Field
The application belongs to the technical field of camera shooting, and particularly relates to a camera shooting assembly and electronic equipment.
Background
At present, the pixel of cell-phone camera is more and more high, for satisfying user experience, and the chip size of use is bigger and bigger, but because the increase of chip, behind the attached processing procedure of processing technology and chip, cause the camera to mismatch with the chip shape, lead to making a video recording the module definition uniformity poor, the image of formation appears fuzzy, and the user experience of shooing is poor.
Disclosure of Invention
The embodiment of the application aims to provide a camera shooting assembly and electronic equipment, and aims to solve the problem that a shot image is fuzzy due to the fact that the shape of a camera is not matched with that of a chip.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a camera assembly, including:
a base;
the lens assembly is arranged on the base;
the photosensitive chip and the lens assembly are arranged at intervals along the first axial direction of the lens assembly;
the adjusting structure is connected with the photosensitive chip and drives the photosensitive chip to deform so as to adjust the field curvature of the photosensitive chip;
the circuit board is electrically connected with the adjusting structure.
Wherein the adjustment structure comprises:
the substrate is connected with the base, the photosensitive chip is arranged on one side, close to the lens component, of the substrate, and the photosensitive chip is located between the substrate and the lens component;
the driving structure is connected with the substrate, the circuit board is electrically connected with the driving structure, and the driving structure adjusts the warping degree of the area where the photosensitive chip is located on the substrate.
The driving structure comprises an electric deformation piece, the circuit board is electrically connected with the electric deformation piece, the electric deformation piece is connected with the substrate, and when the circuit board applies voltage to the electric deformation piece, the electric deformation piece deforms and drives the substrate to deform.
The driving structure comprises a plurality of the electro-deformation pieces, the electro-deformation pieces are arranged on one side, far away from the lens component, of the substrate at intervals, and the area where the electro-deformation pieces are located corresponds to the area where the photosensitive chip is located; and/or
A plurality of the interval of electricity deformation sets up be close to on the base plate one side of lens subassembly, and it is a plurality of electricity deformation centers on the periphery of sensitization chip distributes.
The lens component comprises a substrate, an electro-deformation piece, a photosensitive chip and a lens, wherein the electro-deformation piece is annular, is arranged on one side of the substrate far away from the lens component, and corresponds to the area where the photosensitive chip is located; and/or
The electro-deformation piece is arranged on one side, close to the lens component, of the substrate, and the photosensitive chip is arranged in the electro-deformation piece.
The driving structure comprises two electro-deformation pieces, the two electro-deformation pieces are arranged on one side, far away from the lens component, of the substrate in a crossed mode, and the area where the electro-deformation pieces are located corresponds to the area where the photosensitive chip is located.
The electric deformation piece is an ion conduction deformation piece, the ion conduction deformation piece comprises a first electrode layer, an ion exchange resin layer and a second electrode layer which are sequentially stacked, and polymer electrolyte is arranged in the ion exchange resin layer.
When voltages with different polarities are applied to the electro-deformation piece, the deformation directions of the electro-deformation piece are different.
When the voltage applied to the electro-deformation piece is a first voltage, the electro-deformation piece deforms along a first direction;
when the voltage applied to the electro-deformation piece is a second voltage, the electro-deformation piece deforms along a second direction;
wherein the first voltage and the second voltage are opposite in polarity, the first direction is opposite to the second direction, and the first direction and the second direction are along the first axial direction.
When the voltage applied to the electro-deformation piece is a first voltage, the deformation amplitude of the electro-deformation piece is a first amplitude;
when the voltage applied to the electro-deformation piece is a third voltage, the deformation amplitude of the electro-deformation piece is a second amplitude;
the first voltage and the third voltage have the same polarity, the third voltage is greater than the first voltage, and the first amplitude is different from the second amplitude.
Wherein, still include:
and the optical filter is positioned between the lens component and the photosensitive chip.
In a second aspect, an embodiment of the present application further provides an electronic device, including the camera module in the foregoing embodiment.
According to the camera shooting assembly, the lens assembly is arranged on the base, the photosensitive chip and the lens assembly are arranged at intervals along the first axial direction of the lens assembly, the adjusting structure is connected with the photosensitive chip, and the adjusting structure drives the photosensitive chip to deform so as to adjust the field curvature of the photosensitive chip; the circuit board is electrically connected with the adjusting structure. In the subassembly of making a video recording of this application, adjust through the adjustment structure the field curvature of sensitization chip has solved the sensitization chip and has appeared the warpage and lead to the unmatched problem of shape and camera for central light and marginal light after light passes through the lens subassembly focus on the sensitization chip simultaneously, thereby obtain clear image, improve and shoot and experience.
Drawings
Fig. 1 is a schematic structural diagram of a camera module according to an embodiment of the present application;
FIG. 2 is a schematic view of the photosensitive chip warped upward;
FIG. 3 is an enlarged schematic view of detail A of FIG. 2;
FIG. 4 is a schematic diagram of the substrate deformed by the electrostrictive element to make the photosensitive chip in a horizontal state;
FIG. 5a is a schematic view of an electro-deformable member when no voltage is applied;
FIG. 5b is a schematic view of the deformation of the electro-deformable member upon application of a voltage;
FIG. 5c is another schematic view of the deformation of the electro-deformable member upon application of a voltage;
FIG. 6a is a schematic diagram of the distribution of the photosensitive chips on the substrate;
FIG. 6b is a side view of the structure of FIG. 6 a;
FIG. 6c is an enlarged schematic view of detail B of FIG. 6B;
FIG. 7a is a schematic view of the photosensitive chip and the substrate in a state where no voltage is applied to the electro-deformable member;
FIG. 7b is a schematic view of the state of the photosensitive chip and the substrate when the voltage is applied to the electro-deformable member;
FIG. 7c is a schematic view of another state of the photosensitive chip and the substrate when a voltage is applied to the electro-deformable member;
FIG. 8a is another schematic view of the distribution of photo-sensing chips on a substrate;
FIG. 8b is a side view of the structure of FIG. 8 a;
FIG. 9a is yet another schematic illustration of the distribution of photosensitive chips on a substrate;
FIG. 9b is a side view of the structure of FIG. 9 a;
FIG. 10a is yet another schematic illustration of the distribution of photosensitive chips on a substrate;
figure 10b is a side view of the structure of figure 10 a.
Reference numerals
A base 10;
a lens assembly 20;
a light sensing chip 30;
a substrate 40;
an electro-deformable member 50; a first electrode layer 51; a second electrode layer 52; the ion exchange resin layer 53;
an optical filter 60.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The following describes in detail the image capturing module provided in the embodiment of the present application with reference to fig. 1 to fig. 10b through specific embodiments and application scenarios thereof.
As shown in fig. 1, an embodiment of the present application provides a camera assembly, which includes a base 10, a lens assembly 20, a photosensitive chip 30, an adjusting structure and a circuit board, where the lens assembly 20 is disposed on the base 10, the photosensitive chip 30 and the lens assembly 20 are disposed at an interval along a first axial direction of the lens assembly 20, the adjusting structure is connected to the photosensitive chip 30, and the adjusting structure drives the photosensitive chip 30 to deform to adjust curvature of field of the photosensitive chip 30; the circuit board is electrically connected with the adjusting structure, and the adjusting structure can be controlled through the circuit board so as to drive the photosensitive chip 30 to deform.
Wherein, can inject the cavity on the base 10, can establish lens subassembly 20 in the cavity, sensitization chip 30 also can be located the cavity, and the interval between sensitization chip 30 and the lens subassembly 20 can be adjusted to in focusing, sensitization chip 30's sensitization face can be towards lens subassembly 20, can adjust sensitization chip 30's angularity through adjusting the structure, thereby adjusts sensitization chip 30's field curvature. In the implementation process, the adjusting structure may include a driving structure, for example, the driving structure may be a driving motor, a driving shaft of the driving motor may be connected to the non-photosensitive surface of the photosensitive chip 30, and the deformation (for example, warpage) of the photosensitive chip 30 is adjusted by the movement of the driving shaft, so as to adjust the field curvature of the photosensitive chip 30; alternatively, the driving structure may include an electro-deformable element 50, the electro-deformable element 50 is connected to the non-photosensitive surface of the photosensitive chip 30, and when a voltage is applied to the electro-deformable element 50, the electro-deformable element 50 deforms to drive the photosensitive chip 30 to deform, so as to adjust the field curvature of the photosensitive chip 30. In the camera assembly of this application, through the field curvature of adjusting structure regulation sensitization chip 30, solved sensitization chip 30 and appeared warping problem for central light and marginal light after light passes through lens subassembly 20 focus on sensitization chip 30 simultaneously, thereby obtain clear image, improve and shoot and experience.
In some embodiments of the present application, as shown in fig. 1, the adjusting structure may include a substrate 40 and a driving structure, wherein the substrate 40 is connected to the base 10, the photosensitive chip 30 is disposed on a side of the substrate 40 close to the lens assembly 20, the photosensitive chip 30 is located between the substrate 40 and the lens assembly 20, the photosensitive chip 30 may be disposed on a surface of the substrate 40, and the photosensitive chip 30 and the substrate 40 may be attached together in parallel; drive structure links to each other with base plate 40, the circuit board is connected with drive structure electricity, drive structure can adjust the regional angularity in sensitization chip 30 place on the base plate 40, because sensitization chip 30 establishes on base plate 40, base plate 40 drives sensitization chip 30's angularity change when the angularity in the regional angularity in sensitization chip 30 place on the base plate 40 changes, thereby adjust sensitization chip 30's angularity through the angularity in the sensitization chip 30 place region on adjusting base plate 40, adjust sensitization chip 30's field curvature, make central light and marginal light focus on sensitization chip 30 simultaneously behind light passing lens subassembly 20, thereby obtain clear image.
In other embodiments of the present application, as shown in fig. 1, the driving structure may include an electro-deformable element 50, the electro-deformable element 50 is connected to the substrate 40, and the circuit board is electrically connected to the electro-deformable element 50, so that when the circuit board applies a voltage to the electro-deformable element 50, the electro-deformable element 50 deforms and drives the substrate 40 to deform. As shown in fig. 2 and 3, the substrate 40 and the photosensitive chip 30 are warped upward, and the central light ray and the edge light ray of the light rays passing through the lens assembly cannot be focused on the photosensitive chip 30 at the same time, resulting in image blur. As shown in fig. 4, the electro-deformation element 50 is connected to the substrate 40, when applying voltage to the electro-deformation element 50, the electro-deformation element 50 deforms, the deformation of the electro-deformation element 50 generates an acting force to drive the substrate 40 to deform, and further the warping degree of the photosensitive chip 30 is changed by the deformation of the substrate 40, the warping degree of the photosensitive chip 30 is adjusted to the required warping degree, the photosensitive chip 30 can be adjusted to be in a horizontal plane state, so that the central light and the edge light of the light passing through the lens assembly are focused on the photosensitive chip 30 at the same time, and the image is clear.
In some embodiments, as shown in fig. 6a to 6c, the driving structure may include a plurality of, for example, four, electro-deformation members 50, the plurality of electro-deformation members 50 are disposed at intervals on one side of the substrate 40 away from the lens assembly 20, a region where the electro-deformation members 50 are located corresponds to a region where the photosensitive chip 30 is located, and a center of the region where the electro-deformation members 50 are located and a center of the region where the photosensitive chip 30 is located may be located on an axis of the lens assembly 20, so that the substrate 40 can be driven to deform when the electro-deformation members 50 deform, and further the photosensitive chip 30 is driven to deform by deformation of the substrate 40; and/or, a plurality of electrostrictive members 50 set up the one side that is close to lens subassembly 20 on base plate 40 at intervals, and a plurality of electrostrictive members 50 distribute around the periphery of sensitization chip 30, and a plurality of electrostrictive members 50 produce deformation when exerting voltage, and the effort that produces through the deformation of electrostrictive members 50 drives the deformation of base plate 40, and the deformation of base plate drives the deformation of sensitization chip 30 for the angularity of sensitization chip 30 is adjusted.
For example, as shown in fig. 6a, the electro-deformable member 50 is attached to the back surface of the substrate 40 (the surface of the substrate 40 on the side away from the lens assembly 20) to tightly combine the two assemblies, and the thickness of the electro-deformable member 50 may be less than or equal to 10mm, and the width may be less than or equal to 1000 mm. As shown in fig. 7a, no voltage is applied across the electro-deformable member 50, and the electro-deformable member 50 is not deformed; as shown in fig. 7b and 7c, a voltage is applied to two ends of the electro-deformation element 50, and the electro-deformation element 50 deforms to drive the periphery of the substrate 40 to bend, so that the photosensitive chip 30 attached to the substrate 40 deforms, and the field curvature caused by the warping of the photosensitive chip 30 is compensated. The voltage value passing through the electrostrictive element 50 can be recorded according to the variation of the definition of the camera module, the optimal voltage coding value is burnt into the camera module, and the coding value can be directly called in the use process of the terminal, so that the requirement of improving the picture quality of the picture taking is met.
In the embodiment of the present application, as shown in fig. 10a and 10b, the electrostrictive element 50 is annular, the electrostrictive element 50 is disposed on a side of the substrate 40 away from the lens assembly 20, and an area where the electrostrictive element 50 is located corresponds to an area where the photosensitive chip 30 is located, and a center of the annular electrostrictive element 50 and a center of an area where the photosensitive chip 30 is located may be located on an axis of the lens assembly 20, so that the substrate 40 can be driven to deform when the electrostrictive element 50 deforms, and further the photosensitive chip 30 is driven to deform by deformation of the substrate 40; and/or, the electro-deformation element 50 is annular, the electro-deformation element 50 is disposed on one side of the substrate 40 close to the lens assembly 20, the photosensitive chip 30 is disposed in the electro-deformation element 50, and centers of the photosensitive chip 30 and the electro-deformation element 50 may be located on an axis of the lens assembly 20, so as to drive the substrate 40 to deform when the electro-deformation element 50 deforms. For example, the annular electrostrictive member 50 is attached to the back surface of the substrate 40, and the electrostrictive member 50 deforms to drive the periphery of the substrate 40 to bend by applying a voltage to the two ends of the electrostrictive member 50, so that the photosensitive chip 30 attached to the substrate 40 deforms, and the field curvature caused by the warping of the photosensitive chip 30 is compensated, thereby realizing the requirement of improving the picture quality of a picture to be taken.
Optionally, the driving structure may include two electro-deformation members 50, the two electro-deformation members 50 are disposed on one side of the substrate 40 away from the lens assembly 20 in a crossed manner, for example, the two electro-deformation members 50 may be perpendicular to each other, a region where the electro-deformation member 50 is located corresponds to a region where the photosensitive chip 30 is located, and a center of the region where the two electro-deformation members 50 are located and a center of the region where the photosensitive chip 30 is located may be located on an axis of the lens assembly 20, so that the substrate 40 can be driven to deform when the electro-deformation member 50 deforms. For example, the two electrostrictive members 50 are attached to the back surface of the substrate 40, and as shown in fig. 8a, the two electrostrictive members 50 are arranged to cross each other in a cross shape, or as shown in fig. 9a, the two electrostrictive members 50 cross each other in an X shape, so that the two components are tightly combined. Voltage is applied to two ends of the electro-deformation piece 50, the electro-deformation piece 50 deforms to drive the substrate 40 to bend all around, so that the photosensitive chip 30 attached to the substrate 40 deforms, the field curvature caused by the warping of the photosensitive chip 30 is compensated, and the requirement of improving the photographing image quality is met.
In the embodiment of the present application, as shown in fig. 5a to 5c, the electro-deformable member 50 is an ion-conducting deformable sheet, the ion-conducting deformable sheet includes a first electrode layer 51, an ion-exchange resin layer 53 and a second electrode layer 52 stacked in sequence, a polymer electrolyte is provided in the ion-exchange resin layer, a voltage can be applied to the ion-exchange resin layer 53 through the first electrode layer 51 and the second electrode layer 52, and the deformation direction of the electro-deformable member 50 is different when voltages in different directions are applied to the ion-exchange resin layer 53. When a voltage is applied to the thickness direction of the electro-deformable member 50, the electro-deformable member 50 is largely deformed and bent toward the anode; on the contrary, when the electro-deformable member 50 is subjected to bending deformation, the electro-deformable member 50 also generates a voltage in the thickness direction (reverse phenomenon). The bending of the electrostrictive element 50 can be controlled by controlling the energizing voltage or current, and the substrate 40 can be driven to deform by connecting the electrostrictive element 50 with the substrate 40, thereby realizing the adjustment of the field curvature of the photosensitive chip 30.
Wherein the ion conductive deformable sheet is a composite actuator element, cations in the polymer electrolyte move to the cathode side by applying a voltage to the ion conductive deformable sheet to cause a difference in swelling of the front and back sides of the ion conductive deformable sheet, so that the ion conductive deformable sheet deforms, the ion conductive deformable sheet can deform when the voltage is applied, and the ion conductive deformable sheet disappears when the voltage is not applied. The ion species in the ion exchange resin layer are different, the deformation speed and the deformation amount of the ion exchange resin layer are also different, and the proper ion species can be selected according to the required deformation speed and the deformation amount. For example, as shown in fig. 5a to 5c, the ion exchange resin layer 53 may have therein a cation exchange resin, cations, and polar molecules.
In some embodiments, when voltages with different polarities are applied to the electro-deformable element 50, the deformation direction of the electro-deformable element 50 is different, the deformation direction of the electro-deformable element 50 may be selected according to the different warping directions of the photosensitive chip 30, and then the corresponding voltage is applied to the electro-deformable element 50 according to the required deformation direction of the electro-deformable element 50.
In other embodiments, the electro-deformable member 50 deforms in a first direction when the voltage applied to the electro-deformable member 50 is a first voltage; when the voltage applied to the electro-deformable member 50 is a second voltage, the electro-deformable member 50 deforms in a second direction; wherein, first voltage and second voltage polarity are opposite, and first direction is reverse with the second direction, and the first axis direction of camera lens subassembly 20 is followed to first direction and second direction, is convenient for stably drive base plate 40 deformation through the deformation of electro-deformation piece 50 to drive sensitization chip 30 deformation, make central light and marginal light after light passes through camera lens subassembly 20 focus on sensitization chip 30 simultaneously, thereby obtain clear image.
Alternatively, when the voltage applied to the electro-deformable member 50 is a first voltage, the deformation amplitude of the electro-deformable member 50 is a first amplitude; when the voltage applied to the electro-deformable member 50 is the third voltage, the deformation amplitude of the electro-deformable member 50 is the second amplitude; the polarity of the first voltage is the same as that of the third voltage, the third voltage is greater than the first voltage, the first amplitude is different from the second amplitude, and the deformation amplitude of the electro-deformable element 50 can be selected according to the deformation requirement of the photosensitive chip 30.
In some embodiments, the camera assembly further includes an optical filter 60, the optical filter 60 is located between the lens assembly 20 and the photosensitive chip 30, and the optical filter 60 may be connected to the base 10.
The camera assembly also includes a circuit board that can be electrically connected to the photo sensor chip 30. The camera assembly also includes a connector that can be coupled to the circuit board.
An embodiment of the present application provides an electronic device including the camera module as described in the above embodiment. For example, the electronic device may be a mobile phone, or may also be an electronic product such as a PC, a personal game machine, an unmanned aerial vehicle, or the like. The electronic equipment with the camera shooting assembly in the embodiment has clear shot images and good shooting experience.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the present embodiments are not limited to those precise embodiments, which are intended to be illustrative rather than restrictive, and that various changes and modifications may be effected therein by one skilled in the art without departing from the scope of the appended claims.
Claims (11)
1. A camera assembly, comprising:
a base;
the lens assembly is arranged on the base;
the photosensitive chip and the lens assembly are arranged at intervals along the first axial direction of the lens assembly;
the adjusting structure is connected with the photosensitive chip and drives the photosensitive chip to deform so as to adjust the field curvature of the photosensitive chip;
the circuit board is electrically connected with the adjusting structure.
2. The camera assembly of claim 1, wherein the adjustment structure comprises:
the substrate is connected with the base, the photosensitive chip is arranged on one side, close to the lens component, of the substrate, and the photosensitive chip is located between the substrate and the lens component;
the driving structure is connected with the substrate, the circuit board is electrically connected with the driving structure, and the driving structure adjusts the warping degree of the area where the photosensitive chip is located on the substrate.
3. The camera assembly of claim 2, wherein the driving structure includes an electro-deformable element, the circuit board is electrically connected to the electro-deformable element, the electro-deformable element is connected to the substrate, and the electro-deformable element deforms to drive the substrate to deform when the circuit board applies a voltage to the electro-deformable element.
4. The camera assembly according to claim 3, wherein the driving structure includes a plurality of the electro-deformable members, the plurality of the electro-deformable members are disposed on a side of the substrate away from the lens assembly at intervals, and an area of the electro-deformable member corresponds to an area of the photosensitive chip; and/or
A plurality of the interval of electricity deformation sets up be close to on the base plate one side of lens subassembly, and it is a plurality of electricity deformation centers on the periphery of sensitization chip distributes.
5. The camera assembly according to claim 3, wherein the electro-deformable member is annular, the electro-deformable member is disposed on a side of the substrate away from the lens assembly, and an area of the electro-deformable member corresponds to an area of the photo-sensing chip; and/or
The electro-deformation piece is arranged on one side, close to the lens component, of the substrate, and the photosensitive chip is arranged in the electro-deformation piece.
6. The camera assembly according to claim 3, wherein the driving structure includes two electro-deformable members, the two electro-deformable members are disposed in a crossing manner on a side of the substrate away from the lens assembly, and an area of the electro-deformable member corresponds to an area of the photo sensor chip.
7. The camera assembly of claim 3, wherein the electro-deformable element is an ion-conductive deformable sheet, the ion-conductive deformable sheet comprises a first electrode layer, an ion-exchange resin layer and a second electrode layer stacked in sequence, and the ion-exchange resin layer has a polymer electrolyte therein.
8. A camera assembly according to claim 3, wherein the directions of deformation of the electro-deformable members are different when voltages of different polarities are applied to the electro-deformable members.
9. The camera assembly of claim 3,
when the voltage applied to the electro-deformation piece is a first voltage, the electro-deformation piece deforms along a first direction;
when the voltage applied to the electro-deformation piece is a second voltage, the electro-deformation piece deforms along a second direction;
wherein the first voltage and the second voltage are opposite in polarity, the first direction is opposite to the second direction, and the first direction and the second direction are along the first axial direction.
10. A camera assembly according to claim 3, wherein the magnitude of the deformation of the electro-deformable member is a first magnitude when the voltage applied to the electro-deformable member is a first voltage;
when the voltage applied to the electro-deformation piece is a third voltage, the deformation amplitude of the electro-deformation piece is a second amplitude;
the first voltage and the third voltage have the same polarity, the third voltage is greater than the first voltage, and the first amplitude is different from the second amplitude.
11. An electronic device comprising the camera assembly of any one of claims 1-10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011545140.9A CN114666467B (en) | 2020-12-23 | Image pickup assembly and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011545140.9A CN114666467B (en) | 2020-12-23 | Image pickup assembly and electronic apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114666467A true CN114666467A (en) | 2022-06-24 |
| CN114666467B CN114666467B (en) | 2024-09-24 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115314625A (en) * | 2022-08-22 | 2022-11-08 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| WO2024040692A1 (en) * | 2022-08-20 | 2024-02-29 | 高瞻创新科技有限公司 | Core-driven-type autofocus camera module |
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