CN114659078A - LED bonding pad maintenance method - Google Patents
LED bonding pad maintenance method Download PDFInfo
- Publication number
- CN114659078A CN114659078A CN202210324124.XA CN202210324124A CN114659078A CN 114659078 A CN114659078 A CN 114659078A CN 202210324124 A CN202210324124 A CN 202210324124A CN 114659078 A CN114659078 A CN 114659078A
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- CN
- China
- Prior art keywords
- pad
- led lamp
- bonding pad
- lamp beads
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000012423 maintenance Methods 0.000 title claims abstract description 10
- 239000011324 bead Substances 0.000 claims abstract description 69
- 238000001467 acupuncture Methods 0.000 claims abstract description 31
- 238000003466 welding Methods 0.000 claims abstract description 14
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- 238000009826 distribution Methods 0.000 claims abstract description 6
- 230000008439 repair process Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000006870 function Effects 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 3
- 239000011049 pearl Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 238000004590 computer program Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention discloses a method for maintaining an LED bonding pad, which comprises the following steps: step 1: presetting backup bonding pads which are completely the same as the acupuncture points of the LED lamp beads of the target bonding pad in distribution, wherein vacant positions are reserved in the acupuncture points of the LED lamp beads on the backup bonding pads; step 2: finding out the falling or damaged position and extending a plurality of LED lamp beads, taking a bonding pad which is occupied by the falling or damaged LED lamp beads and the extended and covered LED lamp beads as a bonding pad unit, and cutting the bonding pad unit from a target bonding pad; and 3, step 3: cutting out a replacement bonding pad which is the same as the bonding pad unit, welding the replacement bonding pad at the position of the bonding pad unit on the target bonding pad, replacing the bonding pad unit, and welding an LED lamp bead. The LED lamp bead welding disc maintenance device solves the problem that the LED welding disc falls off and cannot be maintained, can maintain the lost LED lamp bead welding disc, has the effect similar to a patch, has normal functions, and reduces the rejection rate of the whole PCB.
Description
Technical Field
The invention relates to the technical field of pad maintenance, in particular to a method for maintaining an LED pad.
Background
The LED module is in transportation and assembling process, collides with easily, and the LED module is welded on the carrier through the PCB board and forms the LED pad, and the size of LED pad is less usually to and every lamp pearl on the LED pad is just littleer, and under this condition, when the lamp pearl hit bad, also have the pad that some lamp pearl place and drop thereupon. For the maintenance of the bonding pad, if a new lamp bead needs to be re-welded on the bonding pad, the repair is almost not completed and the maintenance is failed, because the bonding pad where the lamp bead is located is already fallen off, and the absence of the bonding pad is equivalent to the absence of a carrier, and the new lamp bead cannot be welded at the original position, so that the maintenance is not performed, and the loss is caused because a small part of the bonding pad falls off to cause the rejection of the whole LED bonding pad.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide a method for maintaining an LED pad, which can solve the problem that a small part of the pad is difficult to maintain due to falling off.
The technical scheme for realizing the purpose of the invention is as follows: an LED pad maintenance method comprises the following steps:
step 1: presetting a backup pad, wherein the acupuncture point distribution of LED lamp beads on the backup pad is completely the same as that of LED lamp beads on a target pad, the acupuncture points of the LED lamp beads on the target pad are welded with the LED lamp beads, and vacant positions are reserved in the acupuncture points of the LED lamp beads on the backup pad;
step 2: finding out the position of a fallen or damaged LED lamp bead on a target bonding pad, extending and covering a plurality of LED lamp beads to the periphery by taking the fallen or damaged LED lamp bead as a reference point, taking a bonding pad which is occupied by the fallen or damaged LED lamp bead and the extended and covered LED lamp bead as a bonding pad unit, and cutting the bonding pad unit from the target bonding pad;
and step 3: cutting out a replacement bonding pad which is the same as the bonding pad unit from the corresponding position on the backup bonding pad, welding the replacement bonding pad on the position of the bonding pad unit on the target bonding pad so as to replace the bonding pad unit, and welding LED lamp beads on the acupuncture points of the replacement bonding pad.
Further, the backup pad and/or the target pad are pads made of FPC material.
Further, the side wall of the pad unit is cut out on the target pad through tin coating and attaching at the side wall of the replacement pad, and therefore the replacement pad is welded on the target pad.
Further, the extending to the periphery includes extending to cover one or more of the left side, the right side, the upper side and the lower side.
Furthermore, the distribution of the acupuncture points of the LED lamp beads on the backup pad is completely the same as that of the acupuncture points of the LED lamp beads on the target pad, which means that each acupuncture point of the LED lamp beads on the backup pad uniquely corresponds to one acupuncture point of the LED lamp beads on the target pad.
The beneficial effects of the invention are as follows: the LED lamp bead welding disc maintenance device solves the problem that the LED welding disc falls off and cannot be maintained, can maintain the lost LED lamp bead welding disc, has the effect similar to a patch, has normal functions, and reduces the rejection rate of the whole PCB.
Drawings
FIG. 1 is a schematic flow diagram of the present invention;
FIG. 2 is a schematic structural diagram of a target pad and a backup pad;
in the figure, 1-target bonding pad, 2-LED lamp bead acupuncture point, 3-LED lamp bead, 4-bonding pad unit and 5-backup bonding pad.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, specific embodiments of the present application will be described in detail with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some but not all of the relevant portions of the present application are shown in the drawings. Before discussing exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart may describe the operations (or steps) as a sequential process, many of the operations can be performed in parallel, concurrently or simultaneously. In addition, the order of the operations may be re-arranged. The process may be terminated when its operations are completed, but could have additional steps not included in the figure. The processes may correspond to methods, functions, procedures, subroutines, subprograms, and the like.
As shown in fig. 1 and 2, an LED pad repair method includes the following steps:
step 1: a backup pad 5 is preset, LED lamp bead acupuncture points 2 on the backup pad 5 are completely the same as LED lamp bead acupuncture points 2 on a target pad 1 in distribution, each LED lamp bead acupuncture point 2 on the backup pad 5 is uniquely corresponding to one LED lamp bead acupuncture point 2 on the target pad 1, an LED lamp bead 3 is welded on each LED lamp bead acupuncture point 2 on the target pad 1, and the LED lamp bead 3 is not welded on each LED lamp bead acupuncture point 2 on the backup pad 5 and is kept vacant.
The reserved vacant positions mean that the LED lamp beads 3 are not welded on the LED lamp bead acupuncture points 2.
Step 2: finding out the position of a fallen or damaged LED lamp bead 3 on a target bonding pad 1, extending and covering a plurality of LED lamp beads 3 to the periphery by taking the fallen or damaged LED lamp beads 3 as reference points, taking a bonding pad which is occupied by the fallen or damaged LED lamp beads 3 and the LED lamp beads 3 which are covered in an extending way as a bonding pad unit 4, and cutting the bonding pad unit 4 from the target bonding pad 1.
Usually, the pad where LED lamp bead 3 falls off or is damaged also falls off or is damaged, or damaged LED lamp bead 3 cannot be taken off alone from the pad without damaging the pad.
Referring to fig. 2, the LED lamp beads 3 on the LED lamp bead acupuncture points a in the drawing are already fallen off or damaged, and correspondingly, the bonding pads where the LED lamp bead acupuncture points a are located can also fall off, so that new LED lamp beads 3 cannot be continuously attached to the LED lamp bead acupuncture points a.
Because LED lamp pearl 3 on LED lamp pearl acupuncture point A has come off or damaged, use LED lamp pearl acupuncture point A as the benchmark, 3 LED lamp pearls 3 have been extended to the left below to the below, the shared pad of 4 LED lamp pearls 3 of LED lamp pearl 3 on the LED lamp pearl acupuncture point A of intention and 3 LED lamp pearls 3 that the colour covered is as pad unit 4, cuts out this pad unit 4. Wherein the color can be applied to one or more sides, for example, to the left or right or left or down side or all around.
And step 3: cutting out the replacement bonding pads which are the same as the bonding pad unit 4 from the corresponding positions on the backup bonding pads 5, wherein the replacement bonding pads which are the same as the bonding pad unit 4 mean the LED lamp bead acupuncture points 2 which have the same quantity and are distributed in the same way, welding the replacement bonding pads on the positions of the bonding pad unit 4 on the target bonding pads 1 so as to replace the bonding pad unit 4, and welding the LED lamp beads 3 on the acupuncture points of the replacement bonding pads. Wherein, the side wall of the pad unit 4 is cut out on the target pad 1 by tin coating and jointing the side wall of the replacement pad, so that the replacement pad is welded on the target pad 1.
The acupuncture point in the application refers to a groove which does not penetrate through a bonding pad and is equivalent to a pit position.
In an alternative embodiment, the backup pad 5 and/or the target pad 1 are pads made of an FPC material, which has a certain softness, and the thickness of the formed pads is only 0.2mm (millimeter), which is relatively easy to cut.
The invention solves the problem that the LED bonding pad falls off and can not be maintained, can maintain the missing LED lamp bead bonding pad, can continuously maintain the damaged bonding pad of a small part on the bonding pad without scrapping, has the effect similar to a patch, ensures that the original function of the bonding pad can be continuously and normally used, and reduces the scrapping rate of the whole PCB.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all changes and modifications that fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (5)
1. A method for maintaining an LED pad is characterized by comprising the following steps:
step 1: presetting a backup pad, wherein the acupuncture point distribution of LED lamp beads on the backup pad is completely the same as that of LED lamp beads on a target pad, the acupuncture points of the LED lamp beads on the target pad are welded with the LED lamp beads, and vacant positions are reserved in the acupuncture points of the LED lamp beads on the backup pad;
and 2, step: finding out the position of a fallen or damaged LED lamp bead on a target bonding pad, extending and covering a plurality of LED lamp beads to the periphery by taking the fallen or damaged LED lamp bead as a reference point, taking a bonding pad which is occupied by the fallen or damaged LED lamp bead and the extended and covered LED lamp bead as a bonding pad unit, and cutting the bonding pad unit from the target bonding pad;
and 3, step 3: cutting out a replacement bonding pad which is the same as the bonding pad unit from the corresponding position on the backup bonding pad, welding the replacement bonding pad on the position of the bonding pad unit on the target bonding pad so as to replace the bonding pad unit, and welding LED lamp beads on the acupuncture points of the replacement bonding pad.
2. The LED pad repair method according to claim 1, wherein the backup pad and/or the destination pad are/is a pad made of FPC material.
3. The LED pad repair method according to claim 1, wherein the replacement pad is soldered to the destination pad by tin-coating the sidewall of the replacement pad to the sidewall of the pad unit cut out from the destination pad.
4. The LED pad repair method of claim 1, wherein said extending peripherally comprises extending coverage to one or more of a left side, a right side, an upper side, and a lower side.
5. The LED pad maintenance method according to claim 1, wherein the acupoint distribution of the LED lamp beads on the backup pad is identical to that of the target pad, which means that each acupoint of the LED lamp beads on the backup pad uniquely corresponds to one acupoint of the LED lamp beads on the target pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210324124.XA CN114659078A (en) | 2022-03-29 | 2022-03-29 | LED bonding pad maintenance method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210324124.XA CN114659078A (en) | 2022-03-29 | 2022-03-29 | LED bonding pad maintenance method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114659078A true CN114659078A (en) | 2022-06-24 |
Family
ID=82033898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210324124.XA Pending CN114659078A (en) | 2022-03-29 | 2022-03-29 | LED bonding pad maintenance method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114659078A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050128721A1 (en) * | 2003-12-16 | 2005-06-16 | Tay Cheng S. | Printed circuit boards having pads for solder balls and methods for the implementation thereof |
| CN206312528U (en) * | 2016-12-16 | 2017-07-07 | 深圳蓝普科技有限公司 | LED display lamp plate and its circuit board |
| CN209472834U (en) * | 2018-09-21 | 2019-10-08 | 盐城多纷光电科技有限公司 | A kind of LED display module lamp face PCB Pad off repairs paper |
| CN110351948A (en) * | 2018-04-04 | 2019-10-18 | 杭州海康威视数字技术股份有限公司 | Printed circuit board for maintaining display screen lamp plate |
-
2022
- 2022-03-29 CN CN202210324124.XA patent/CN114659078A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050128721A1 (en) * | 2003-12-16 | 2005-06-16 | Tay Cheng S. | Printed circuit boards having pads for solder balls and methods for the implementation thereof |
| CN206312528U (en) * | 2016-12-16 | 2017-07-07 | 深圳蓝普科技有限公司 | LED display lamp plate and its circuit board |
| CN110351948A (en) * | 2018-04-04 | 2019-10-18 | 杭州海康威视数字技术股份有限公司 | Printed circuit board for maintaining display screen lamp plate |
| CN209472834U (en) * | 2018-09-21 | 2019-10-08 | 盐城多纷光电科技有限公司 | A kind of LED display module lamp face PCB Pad off repairs paper |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: No. 56 Nanli East Road, Shiqi Town, Panyu District, Guangzhou City, Guangdong Province, 510000 Applicant after: Guangdong Baolun Electronics Co.,Ltd. Address before: No.19 Chuangyuan Road, Zhongcun street, Panyu District, Guangzhou, Guangdong 510000 Applicant before: GUANGZHOU ITC ELECTRONIC TECHNOLOGY Co.,Ltd. |
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| CB02 | Change of applicant information |