CN114641667A

CN114641667A - Surface profile measuring system

Info

Publication number: CN114641667A
Application number: CN202180005935.7A
Authority: CN
Inventors: 方仲平
Original assignee: Element Photoelectric Intelligent Technology Suzhou Co ltd
Current assignee: Element Photoelectric Intelligent Technology Suzhou Co ltd
Priority date: 2020-04-02
Filing date: 2021-03-25
Publication date: 2022-06-17
Also published as: WO2021197207A1; CN111307068A; TW202140995A

Abstract

The application discloses a surface profile measurement system, the system comprising: a light source assembly; a confocal microscope assembly including an optical beam splitter; a pinhole device comprising an array of pinholes configured to pass uniform light from the optical beam splitter through the pinhole device to an object under test; an incident optical assembly for directing uniform light from the pinhole device to the object; and the pinhole device being arranged to pass reflected light from the object through the pinhole device to the optical beam splitter, a photodetector for receiving said reflected light from the beam splitter; a set of detection optics that direct the reflected light from the beam splitter to the photodetector; the photoelectric detector can detect and analyze the three-dimensional topography of the surface of the object, so as to measure the surface profile topography of the object.

Description

Surface profile measuring system

Technical Field

The invention relates to the field of surface profile measurement, in particular to a surface profile measurement system.

Background

Object surface profile is an important feature for inspecting the quality of many task objects. In particular, in the semiconductor industry, the measurement and inspection of surface profiles of, for example, semiconductor wafers, devices or substrates, is considered to be part of quality control and quality assurance processes. One conventional method of measuring the surface profile of an object is by confocal microscopy (sensor) techniques. Specifically, confocal sensors are used to measure the height of multiple points of the surface of the object, and the relative height of these points at the surface is combined to estimate the surface profile of the object. However, the process of measuring the surface point by point is time consuming, making the measurement of the surface profile slow. Neither of these arbitrary points covers all areas of the surface, potentially excluding relevant regions of interest of the surface profile.

To address or eliminate at least one of the above-mentioned problems and/or disadvantages and to provide a more advanced surface profile measuring system.

Disclosure of Invention

The invention solves the technical problem of providing a surface profile measuring system.

The technical scheme adopted by the invention for solving the technical problems is as follows: a surface profile measurement system, the system comprising:

a light source assembly including a set of broadband light sources;

a confocal microscope assembly comprising:

an optical beam splitter for directing the uniform beam from the broadband light source to the surface of the object to be measured;

a pinhole device comprising an array of pinholes configured to pass the uniform light from the optical splitter to an object under test;

a set of incident optical assembly, which includes a chromatic aberration lens set therein for guiding the uniform light from the pinhole device to the object to be measured and causing chromatic aberration of the uniform light passing through the incident optical assembly;

the pinhole device is arranged to pass reflected light from the object through the pinhole device to an optical beam splitter, the reflected light containing the surface profile information based on chromatic aberration;

a photodetector assembly, comprising:

a photodetector for receiving said reflected light from the optical beam splitter;

a set of detection optics for directing said reflected light from the optical beam splitter to the photodetector;

the spectrum of the reflected light from the surface of the measured object contains the surface profile information of the object, and the photoelectric detector can detect and analyze the three-dimensional profile of the surface of the object, so that the surface profile of the object is measured.

Further, the method comprises the following steps: wherein the broadband light source comprises:

an optical integrating sphere;

a set of bulbs disposed around the optical integrating sphere, the optical integrating sphere configured to integrate light energy from all of the set of bulbs; and

an optical aperture that directs the uniform light emitted from the set of bulbs away from the broadband light source.

Further, the method comprises the following steps: the group of bulbs is a broadband white light source, and the spectrum range of the bulbs comprises red light to blue light or infrared light to ultraviolet light.

Further, the method comprises the following steps: wherein the pinhole device comprises one or more microlens arrays arranged to mate with the pinhole arrays such that a pinhole in each of the pinhole arrays mates with at least a first microlens in the microlens arrays, the first microlens being arranged to focus light from the optical beam splitter to a respective pinhole.

Further, the method comprises the following steps: wherein the microlens array is disposed on one or both sides of the pinhole device.

Further, the method comprises the following steps: wherein the confocal microscope assembly includes a driving mechanism for moving the pinhole device in a plane.

Further, the method comprises the following steps: wherein the drive mechanism is configured to move the pinhole device planarly along the X-axis and/or the Y-axis.

Further, the method comprises the following steps: wherein the set of incident optical elements comprises:

an objective lens for focusing light on the object;

a second tube lens for focusing the reflected light from the object to the pinhole device; and

and the chromatic aberration lens is arranged between the second lens cone lens and the objective lens to cause chromatic aberration of the light.

Further, the method comprises the following steps: wherein the objective lens and the chromatic aberration lens are integrated into a lens assembly.

Further, the method comprises the following steps: wherein the photodetector assembly is a hyperspectral imaging assembly configured to measure the surface topography of the object, as well as multilayer film thickness and surface topography.

Further, the method comprises the following steps: the hyperspectral imaging component is a single-shooting hyperspectral imaging component and can measure the upper surface profile, the thickness of a multilayer film and the surface appearance of the object by using a single image.

Further, the method comprises the following steps: wherein this single super spectral imaging subassembly of shooing contains:

the photoelectric detector comprises a hyperspectral camera;

the reflected light from the optical beam splitter passes through the aperture device to the hyperspectral camera;

a wavelength separation device arranged between the aperture device and the hyperspectral camera and used for separating the spectrum of the reflected light;

the set of detection optics includes:

a relay lens disposed between the optical beam splitter and the aperture device;

a collimator disposed between the aperture device and the wavelength division device,

and the first imaging lens is arranged between the wavelength separation device and the hyperspectral camera and used for focusing the reflected light on the hyperspectral camera.

Further, the method comprises the following steps: wherein the aperture device comprises an array of second pinhole or slit apertures.

Further, the method comprises the following steps: wherein the aperture device comprises an array of second pinholes of the array and an array of second microlenses associated with the array of second pinholes such that each of the pinholes is associated with a second microlens, wherein the second microlenses are configured to focus the reflected light from the optical beam splitter to the respective second pinholes.

Further, the method comprises the following steps: wherein the wavelength separation means comprises a grating for causing a diffraction effect on the reflected light from the surface of the object to be measured to perform wavelength resolution, or an optical prism for causing a dispersion effect on the reflected light from the surface of the object to be measured to perform wavelength resolution.

Further, the method comprises the following steps: wherein

The light source assembly comprises the broadband light source and an optical illumination device, wherein the optical illumination device is used for uniformly guiding uniform light rays from the broadband light source to the confocal microscope system;

the confocal microscope assembly includes:

the optical beam splitter and the set of incident optical components;

the pinhole device comprises the pinhole array and one or more arrays of first microlenses matched with the pinhole array, so that each first pinhole is matched with at least one first microlens, wherein the first microlenses are used for focusing light rays from the optical beam splitter into the respective first pinholes; and

a driving mechanism for moving the pinhole device along the X-axis and Y-axis planes;

and

the photodetector assembly includes a color camera for measuring the surface profile of the object.

Further, the method comprises the following steps: wherein

The light source component comprises the broadband light source and an optical illumination device, wherein the optical illumination device is used for uniformly guiding a uniform light beam from the broadband light source;

the confocal microscope assembly comprises:

the optical beam splitter and the set of incident optical components; and

the pinhole device comprises the pinhole array and the matched pinhole array, wherein the pinhole array comprises one or more arrays of first microlenses, so that each pinhole is matched with at least one first microlens, and the first microlenses are used for focusing light rays from the optical beam splitter into each respective first pinhole; and

the photodetector is a single-shot hyperspectral imaging assembly configured to measure a surface profile, a multi-layer film thickness, and a surface profile of an object under measurement, the single-shot hyperspectral imaging assembly comprising:

a hyperspectral camera; and

an aperture device, wherein the reflected light from the optical beam splitter passes through the aperture device to the hyperspectral camera, the aperture device comprising an array of pinholes and an array of second microlenses associated with the array of pinholes, such that each pinhole is associated with a second microlens, the second microlenses being configured to focus the reflected light from the optical beam splitter into a respective second pinhole.

Further, the method comprises the following steps: also included is a drive mechanism, wherein the drive mechanism moves the pinhole device in a plane along the X-axis and the Y-axis.

Further, the method comprises the following steps: wherein

The light source component comprises the broadband light source and a cylindrical lens, and the cylindrical lens is used for focusing uniform light from the broadband light source into a linear light beam so as to linearly scan the object;

the confocal microscope assembly comprises:

the optical beam splitter and the set of incident optical components;

the pinhole device includes an array of the pinholes in a single row based on the linear scan and first microlenses associated with one or more arrays of the pinholes in the single row such that each pinhole is associated with at least one of the first microlenses arranged to focus light from the optical beam splitter into the respective first pinholes; and

a driving mechanism for moving the pinhole device parallel to the plane of the single row of pinholes; and

the photodetector assembly is a single-shot hyperspectral imaging assembly configured to measure the surface profile and subsurface profile of the object, the single-shot hyperspectral imaging assembly comprising:

a hyperspectral camera; and

an aperture device through which the reflected light from the beam splitter passes to the hyperspectral imager, the aperture device comprising a single row of pinholes for the linear scanning and a single row of second microlenses matching the single row of pinholes such that each pinhole matches a second microlens arranged to focus the reflected light from the optical beam splitter into a respective second pinhole.

Further, the method comprises the following steps: wherein

the confocal microscope assembly comprises:

the optical beam splitter and the set of incident optical components;

a hyperspectral camera; and

an aperture device, wherein the reflected light from the optical beam splitter passes through the aperture device to the hyperspectral camera, the aperture device comprising a slit aperture for the linear scanning.

Further, the method comprises the following steps: wherein

The light source assembly comprises the broadband light source and an illuminating device, wherein the illuminating device is used for uniformly guiding uniform light rays from the broadband light source;

the confocal microscope assembly comprises:

the optical beam splitter and the set of incident optical components; and

the pinhole device is a nipkov disk and includes the pinhole array; and

a drive mechanism for rotating the pinhole device along the Z axis; and

a hyperspectral camera; and

an aperture device, wherein the reflected light from the optical beam splitter passes through the aperture device to the hyperspectral camera, the aperture device comprising an array of pinholes and an array of microlenses associated with the array of pinholes, such that each pinhole is associated with a second microlens, the second microlenses being configured to focus the reflected light from the optical beam splitter into a respective second pinhole.

Further, the method comprises the following steps: wherein the nipkov disk includes one or more arrays of first microlenses arranged to mate with the pinhole array such that each pinhole mates with at least one of the first microlenses, the first microlenses being arranged to focus light from the optical beam splitter into respective ones of the first pinholes.

Further, the method comprises the following steps: wherein the first microlenses of the arrays are disposed on one or both sides of the pinhole device.

Further, the method comprises the following steps: wherein the first pinhole is round or square.

The invention has the beneficial effects that: the system and method are suitable for high speed and accurate surface profile measurement, particularly surface profiles in wavy or discontinuous configurations, and thus are suitable for a variety of applications including high speed automatic surface profile inspection of semiconductor wafers, integrated circuit circuitry loops, and precision components.

Drawings

FIG. 1 is an exemplary schematic diagram of a surface profile measurement system having a color camera according to some embodiments of the present application.

FIG. 2 is an example of a flowchart of steps of a method of measuring a surface profile of an object according to some embodiments of the present application.

Fig. 3 is a first exemplary schematic diagram of a pinhole device of the measurement system according to some embodiments of the present application.

Fig. 4 is a second exemplary schematic diagram of a pinhole device of the measurement system according to some embodiments of the present application.

Fig. 5 is a third exemplary schematic diagram of a pinhole device of the measurement system according to some embodiments of the present application.

Fig. 6 is an exemplary schematic diagram of a light source of the measurement system according to some embodiments of the present application.

Fig. 7 is an exemplary schematic diagram of a spectral image of the object captured by the measurement system according to some embodiments of the present application.

Fig. 8 is an exemplary schematic diagram of a measurement system of another configuration architecture according to some embodiments of the present application.

Fig. 9 is an exemplary schematic diagram of another measurement system with a hyperspectral imaging assembly according to some embodiments of the application.

Fig. 10 is an exemplary illustration of a hyperspectral image of the object captured by a measurement system according to some embodiments of the present application.

Fig. 11 is an exemplary schematic diagram of another measurement system having a hyperspectral imaging assembly and configured for linear scanning according to some embodiments of the application.

FIG. 12 is an exemplary illustration of a hyperspectral image of the object captured by the measurement system using linear scanning according to some embodiments of the present application.

FIG. 13 is an exemplary schematic diagram of another measurement system with hyperspectral imaging and a nipkov disk according to some embodiments of the application.

FIG. 14 is a first exemplary schematic view of the nipkov disk according to some embodiments of the present application.

FIG. 15 is a second exemplary schematic view of the nipkov disk according to some embodiments of the present application.

Fig. 16 is an exemplary schematic diagram of another measurement system having a color camera according to some embodiments of the present application.

Labeled as: 20. a system; 30. an object; 32. a mechanically movable platform; 40. a spectral image; 50. hyper-spectral images; 100. a light source assembly; 110. a broadband light source; 112. lighting; 114. an optical aperture; 116. an optical integrating sphere; 120. a Kohler lighting device; 122. a first tube lens; 200. a confocal microscope assembly; 210. an optical beam splitter; 220. a pinhole device; 222. a first pinhole; 224. a first microlens; 226. a nipkov disk; 230. an incident optical component; 232. an objective lens; 234. a second barrel lens; 236. a chromatic aberration lens; 238. a second objective lens; 240. a drive mechanism; 250. a conversion device; 300. a photodetector assembly; 302. a single shot hyperspectral imaging component; 310. a photodetector; 312. a color camera; 314. a hyperspectral camera; 320. detecting the optical component; 322. a first imaging lens; 324. a collimator; 326. a relay lens; 330. an aperture device; 332. a second pinhole; 334. a second microlens; 336. a slit aperture; 340. a grating; 500. an observation device; 510. a first optical beam splitter; 520. a second optical beam splitter; 530. an eyepiece; 540. a second imaging lens; 550. a camera; r, red; G. green; B. and blue.

Detailed Description

For the sake of brevity and clarity, embodiments of the present disclosure are described with respect to a system for measuring a surface profile of an object, in accordance with the drawings. Aspects of the present disclosure are described in conjunction with the embodiments provided herein, it being understood that they are not intended to limit the present disclosure to these embodiments. On the contrary, the present disclosure is intended to cover alternatives, modifications, and equivalents of the embodiments described herein, which may be included within the scope of the present disclosure as defined by the appended claims. Furthermore, the following detailed description sets forth specific details in order to provide a thorough understanding of the present disclosure. However, it will be apparent to one of ordinary skill in the art that the present disclosure may be practiced without the specific details and/or with several of the specific embodiments that are presented in combination with the present teachings. Some examples have not described in detail known systems, methods, procedures, and components to avoid unnecessarily obscuring aspects of the embodiments of the disclosure.

In the embodiments of the present disclosure, the same, equivalent or similar components or corresponding materials appearing in different figures are represented by the same reference numerals or symbols.

References to "one embodiment/example," "another embodiment/example," "some embodiments/examples," "some other embodiments/examples," and so forth, mean that the embodiment/example so described may include a particular feature, structure, characteristic, component, or limitation, but every embodiment/example need not include the particular feature, structure, characteristic, component, or limitation. Moreover, repeated use of "in one embodiment/example" or "in another embodiment/example" does not necessarily refer to the same embodiment/example.

The terms "comprising," "including," "having," and the like, do not exclude the presence of other features/components/steps than those listed in an embodiment. Certain features/elements/steps defined in different embodiments do not imply that a combination of these features/elements/steps cannot be used in an embodiment.

The terms a or an, as used herein, refer to one or more than one. Unless otherwise indicated, the drawings or text use "/" to represent "and/or". The term "set" is defined as a non-empty but finite set of elements that, according to known mathematical definitions, mathematically represent at least a base number (e.g., where a set is defined as corresponding to a unit, a single state, or a group of elements.

Referring to FIG. 1, in an exemplary embodiment of the present disclosure, a system 20 is provided for measuring a surface profile of an object 30. The system 20 includes a light source assembly 100, a confocal microscope assembly 200, and a photodetector assembly 300. The system 20 further comprises a platform for supporting the object 30 during the measurement. The platform may be configured to be displaceable, for example, to translate the object 30 to measure different areas or the entire area of the surface profile.

The light source assembly 100 includes a broadband light source 110 configured to emit a broadband uniform light beam having a broadband continuous wavelength. For example, the broadband uniform light is white light covering the wavelengths of the visible color spectrum, and the spectrum thereof can also be extended to the infrared and/or ultraviolet spectral bands.

The confocal microscope assembly 200 includes a set of entrance optics 230, such as lenses and/or mirrors, for directing the uniform beam from the pinhole device 220 to the object 30 and through the entrance optics 230, which can produce chromatic aberration (chromatic aberration) due to the chromatic aberration set included in the entrance optics 230. In addition, the pinhole device 220 is configured to pass reflected light from the object 30 through the first pinhole 222 thereof to the optical beam splitter 210, the reflected light containing spectral information based on chromatic aberration based on the surface profile. More specifically, the first pinhole 222 allows only a reflected beam focused on the surface of the object 30, among the light reflected from the object 30, to pass through, and then passes through the optical beam splitter 210. The pinhole device 220 blocks all reflected light rays that are not focused on the object 30 so that these reflected light rays do not enter the first pinhole 222.

The photodetector assembly 300 includes a photodetector 310 that receives the reflected light from the optical beam splitter 210. The photodetector assembly 300 includes a set of photodetectors 320 that direct the reflected light from the optical beam splitter 210 to the photodetectors 310. The photodetector 310 receives spectral information of light reflected from various points on the surface of the object 30 to be measured, and performs surface profile measurement of the object 30 based on this spectral information. For example, a certain spectrum is focused on a certain point on the surface of the object 30, the reflected light is focused and passes through the first pinhole 222, and the reflected light wavelength information of the part can measure the height of the point. Similarly, the height of each point across the problem surface profile may also be measured simultaneously.

In various embodiments of the present disclosure, fig. 2 illustrates a method 400 of measuring a surface profile of the object 30, wherein the method 400 is performed by the system 20. The method 400 includes step 402 of directing uniform light from the broadband light source 110 through the optical beam splitter 210 to the object 30. The method 400 includes a step 404 of passing the uniform light from the optical beam splitter 210 through the array of first pinholes 222 of the pinhole device 220 to the object 30. The method 400 includes a step 406 of directing the uniform light from the pinhole device 220 through the set of incident optics 230 to an object 30 and generating chromatic aberration as the uniform light beam passes through the incident optics 230. The method 400 includes step 408: the reflected light of the object 30, which contains spectral information of the surface profile based on the chromatic aberration, is passed through the array of first pinholes 222 to the optical beam splitter 210. The method 400 includes the step 410 of: the reflected light from the optical beam splitter 210 is directed through the set of detection optics 320 to the photodetector 310. The method 400 includes step 412: the reflected light from the optical beam splitter 210 is received through the photodetector 310. The method 400 includes the steps 414: the surface profile of the object 30 is measured based on spectral information of the reflected light received by the photodetector 310, which represents the height across the surface profile.

As described above, the incident optical element 230 deflects the uniform beam projected from the pinhole device 220 to the object 30 to be measured into a beam with chromatic aberration, such that the reflected light from the object 30 includes spectral information, such as wavelength, based on the chromatic aberration. More specifically, the set of incident optical elements 230 causes axial or longitudinal chromatic aberration of the light, resulting in different wavelengths of light from the incident optical elements 230 being focused to different heights on the surface of the object 30. That is, due to chromatic aberration, the different wavelengths of light are focused at different heights or depths of the object 30 relative to a reference plane along the surface profile. For example, red light (having a wavelength of about 620nm to 720 nm) is focused at a lower height, blue light (having a wavelength of about 460nm to 500 nm) is focused at a higher height, and green light (having a wavelength of about 500nm to 570 nm) is focused at an intermediate height therebetween, all relative to a reference plane.

The object surface to be measured has different heights at each point, so that light of different wavelengths is focused at each point of different height of the surface profile of the object 30, reflected light from the surface of the object 30, which in turn becomes incident light along the same propagation path. The wavelengths of the reflected light focused on the object 30 pass through the pinhole device 220 to the optical beam splitter 210, while the wavelengths of the reflected light not focused on the object 30 are not focused on the first pinhole 222 and therefore cannot pass through the first pinhole 222. In other words, the pinhole device 220 blocks all reflected light that is not focused on the object 30. Only the wavelengths of the reflected light reflected from the object 30 pass through the first pinhole 222 to the optical beam splitter 210. The reflected light is then imaged onto a conjugate plane of the pinhole device 220 and received by the photodetector 310. Only the wavelengths of the reflected light that are focused at different heights across the surface profile, which represent the height of the point, are reflected from the object 30 and received by the photodetector 310, and from which the surface profile can be measured in three dimensions. The color spectral image of the surface profile can accurately measure the three-dimensional height profile of the entire surface being measured without the need to vertically scan or move any of the components of the system 20.

Since the pinhole device 220 blocks most of the light incident on the surface of the pinhole device 220, i.e. the area around the first pinhole 222, the pinhole device 220 may comprise suitable optical elements to minimize or prevent light reflection. For example, light incident on the top surface of the pinhole device 220 may be reflected back to the optical beam splitter 210 and merged with the reflected light from the object 30, potentially affecting the accuracy of the surface profile measurement. These optical elements may facilitate focusing of light into the first aperture 222, thereby improving spectral imaging and measurement of the surface profile.

As shown in fig. 3, the pinhole device 220 may include one or more arrays of first microlenses 224, along with an array of first pinholes 222. For example, the pinhole device 220 includes a first array of first microlenses 224 disposed at the top of the first pinholes 222, such that each first pinhole 222 fits one of the first microlenses 224 of the first array, and the first microlenses 224 of the first array are configured to focus light from the optical splitter 210 into the respective first pinholes 222. The pinhole device 220 may optionally comprise a second array of first microlenses 224 disposed below the first pinholes 222, such that each first pinhole 222 mates with a second array of first microlenses 224, and the first microlenses 224 of the second array are configured to focus the reflected light from the object 30 into respective first pinholes 222. The first pinhole 222 and the array of first microlenses 224 can be formed separately and joined together, or they can be integrated together as a unit.

Each of the first pinholes 222 is paired with at least one of the first microlenses 224, and they cooperate to focus light into the center of the respective first pinhole 222. The first microlenses 224 are specifically matched to the first apertures 222 such that their center focal points are aligned, thereby focusing light incident on the first microlenses 224 into the first apertures 222. In this way, more light can be collected at one or both sides of the pinhole device 220, and the amount of light guided into each of the first pinholes 222 is increased, thereby increasing the light efficiency because the light efficiency of the conventional confocal microscope is very low. The curved surfaces of the first microlenses 224 can drain and remove unwanted light incident on their surfaces, thereby improving the quality of light passing through the first apertures 222.

As shown in fig. 3, the first microlenses 224 are arranged together so that they contact each other, or so that there is some gap between them. Since the diameter of the first pin holes 222 is smaller than the diameter of the first microlenses 224, gaps exist between the first pin holes 222. As shown in the fourth drawing, the gaps are represented by two vertical pitches P1, P2, for example, along the X-axis and Y-axis, respectively. By projecting the first pinhole 222 onto the object 30, the first pinhole 222 corresponds to a plurality of individual points of the surface profile of the object 30, and the gaps or pitches P1 and P2 between the first pinholes 222 correspond to the intervals between the individual points.

One advantage of the first pin hole 222 is that the heights of the individual points of the surface profile can be measured simultaneously. The independent points are allocated over at least one sampling area, or in some instances over substantially the entire area of the surface profile, so that the system 20 can perform rapid sampling measurements of the sampling area. It should be noted that the number of the independent points depends on the number of the first pinhole 222, so that a larger number of the first pinholes 222 can increase the sampling area to be measured and/or increase the measurement resolution. The high speed sampling measurement of the individual points of the sampling area is advantageous for various practical applications, particularly where rapid inspection of a batch of the objects 30 is required.

Since the pinhole device 220 remains stationary during the sampling measurement, the gap between the individual points is not imaged and measured. To address this, in some embodiments, the confocal microscope assembly 200 may include a drive mechanism 240 for moving the pinhole device 220 planarly. As shown in fig. 5, the drive mechanism 240 may be configured to move the pinhole device 220 along the X-axis and/or Y-axis plane. Alternatively, the drive mechanism 240 may be configured to rotate the pinhole device 220 planarly about the Z-axis so that the pinhole device 220 remains in the XY plane during rotation. The drive mechanism 240 includes, for example, a driver such as a motor and a piezoelectric driver.

As the pinhole device 220 moves along this XY plane, the first pinhole 222 and the corresponding point on the surface profile move across the surface profile so that light can reach and scan a continuous surface area and substantially the entire surface profile. Substantially all of the area of the surface profile can be scanned and measured seamlessly, thereby eliminating the risk of excluding areas of interest to the surface profile. More detailed measurements of the surface profile may be obtained so as to provide a higher quality inspection of the object 30.

In the embodiment shown in fig. 1, the system 20 includes the light source assembly 100, the confocal microscope assembly 200, and the photodetector assembly 300 as described above. The light source assembly 100 includes the broadband light source 110 configured to emit broadband uniform light, such as white light. As shown in fig. 6, the broadband light source 110 includes a set of lamps 112. The light 112 may be an incandescent lamp or a broadband white light emitting diode. The incandescent lamp is, for example, a halogen lamp, such as a tungsten halogen lamp. The light 112 may be low power, such as 50 watts, to reduce wasted heat generated using the system 20. The low power light 112 eliminates the need for fans to cool the equipment, thereby reducing mechanical vibration and power consumption. However, the light source assembly 100 may include a small heat sink to remove any heat generated by the broadband light source 110.

The broadband light source 110 includes an optical aperture 114 for directing the uniform light emitted from the lamp light 112 away from the broadband light source 110. The optical aperture 114 may be circular and configured to control the diameter of the beam emitted from the broadband light source 110 to the confocal microscope assembly 200. The broadband light source 110 may include an optical integrating sphere (optical) 116 configured to integrate light energy from the lamps 112. The optical integrating sphere 116, known as the Ulbricht sphere (Ulbricht sphere), is an optical component with a hollow spherical cavity and an internal reflective coating to uniformly scatter light and reduce light loss. As shown in FIG. 6, the set of lamp light 112 is arranged around the optical integrating sphere 116 such that light from the set of lamp light 112 is directed into the hollow sphere cavity and toward the internal reflective coating of the optical integrating sphere 116 such that the internal reflective coating reflects the light to the optical aperture 114.

The broadband light source 110 may include an optical bandpass filter (optical bandpass filter) configured to filter out light outside a predetermined wavelength range. The optical bandpass filter is disposed between the set of lamp lights 112 and the optical integrating sphere 116, such as at the optical aperture 114. For example, the optical bandpass filter includes a dichroic filter or a dielectric mirror. The predetermined wavelength range may correspond to the visible color spectrum, or red to blue region, and the optical bandpass filter allows all visible light to pass through and exit the optical aperture 114. Unwanted light outside the visible color spectrum, such as infrared and ultraviolet light, is blocked by the optical bandpass filter. It should be noted that infrared light blocks infrared light more than visible light, and that less heat is transferred from the optical aperture 114, thereby eliminating thermal damage to the confocal microscope assembly 200.

The uniform light from the broadband light source 110 can propagate through the optical aperture 114 directly to the confocal microscope assembly 200. Alternatively, the light source assembly 110 may include a kohler illumination device having one or more lenses disposed between the broadband light source 110 and the confocal microscope assembly 200(s) ((

Drilling device) 120. The kohler illuminator 120 provides parallel and uniform light to the confocal microscope assembly 200.

The confocal microscope assembly 200 includes the optical beam splitter 210, the pinhole device 220, and the set of entrance optics 230 as described above. The set of incident optics 230 includes an objective lens 232 for focusing light onto the object 30, and a second tube lens 234 for focusing reflected light from the object 30 onto the pinhole device 220. The set of incident optical elements 230 further includes a chromatic aberration lens 236 disposed between the objective lens 232 and the second tube lens 234 to induce chromatic aberration of light. The chromatic aberration lens 236 is designed to have a specific chromatic aberration characteristic and good linearity. Depending on the desired measurement range and resolution, different chromatic lenses 236 may be used. Alternatively, the chromatic aberration lens 236 may be integrated with the objective lens 232 as a single lens component. With chromatic aberration, light of different wavelengths can be more clearly separated, and the different heights of the surface profile can be clearly distinguished, so that the surface profile can be three-dimensionally imaged and measured.

The photodetector device 300 includes the photodetector 310 and the set of detection optics 320 as described above. The detection optics 320 can include a first imaging lens 322 for directing the reflected light from the optical beam splitter 210 to the photodetector 310. The photodetector 310 may include a color camera 312 having red-green-blue (RGB) colored image sensors, such as CCD or CMOS image sensors. The first imaging lens 322 is configured to focus the reflected light containing the spectral information onto the image sensors of the color camera 312, thereby imaging the spectral information of the reflected light from the surface profile of the object 30 onto the color camera.

The operating spectrum of the color camera 312 may cover the visible color spectrum and optionally the infrared spectrum and/or the ultraviolet spectrum. For example, the operating spectral range of the color camera 312 may be approximately 380nm to 1000 nm. The color camera 312 may include an infrared filter to exclude infrared and/or near infrared rays. As described above, different heights or depths across the surface profile are imaged in different colors based on the precise spectral information and wavelength of the reflected light, and the captured spectral images of the surface profile accurately measure the three-dimensional surface profile, where the different heights across the surface profile are represented by the different spectral colors in the spectral images. The seventh drawing shows an example of an RGB spectral image 40, which includes the corrected RGB curve of the object 30 captured by the color camera 312. The system 20 may be integrated with or coupled to an image processing module to generate a surface profile of the object 30 based on the spectral image 40. More specifically, the image processing module calculates the surface profile of the object 30 based on the spectral image 40 received by the photodetector 310, wherein the color or wavelength of each point (corresponding to the first pinhole 222) represents the height of the point of the surface profile. All points taken together represent the height variation across the entire surface profile.

In one embodiment, the light source assembly 100, the confocal microscope assembly 200, and the photodetector assembly 300 are arranged as shown in the first drawing. When the system 20 is in use, uniform light from the light source assembly 100 passes through the optical beam splitter 210 to the object 30, reflects from the object 30 back to the beam splitter optical beam splitter 210, and the optical beam splitter 210 reflects light to the photodetector assembly 300. Since the optical splitter 210 is configured to transmit and reflect light (preferably in equal proportions), the system 20 can have other configurations. In the embodiment shown in the eighth figure, when the system 20 is in use, light from the light source assembly 100 reaches the optical beam splitter 210, reflects to the object 30, reflects from the object 30 back to the optical beam splitter 210, and passes through the optical beam splitter 210 to the photodetector assembly 300.

In general, in the embodiment illustrated in fig. 1 and 8, the system 20 includes the light source assembly 100, the confocal microscope assembly 200, and the photodetector assembly 300, which are configured to measure the surface profile of the object 30. The light source assembly 100 includes the broadband light source 110 and the kohler illumination device 120. The confocal microscope assembly 200 includes the optical beam splitter 210 and the pinhole device 220 having an array of pinholes and a first microlens 224 that mates with one or more arrays of the pinhole array. The confocal microscope assembly 200 further includes the set of entrance optics 230 and the drive mechanism 240 for moving the pinhole device 220 planarly along the X-axis and Y-axis. The incident optical elements 230 include the objective lens 232, a second tube lens 234, and the chromatic aberration lens 236. The photodetector assembly 300 includes the photodetector 310 with the color camera and further includes the set of detection optics 320 with the first imaging lens 322 that focuses the reflected light onto the color camera 312.

In the embodiment shown in fig. 9, the system 20 is substantially similar to the embodiment of the first figure except for the photodetector assembly 300. The above description of aspects of the embodiment of the first figure may apply equally or similarly to the embodiment of fig. 9, and vice versa. The photodetector 310 includes a hyperspectral camera 314, and the photodetector assembly 300 can be used as a one-shot hyperspectral imaging assembly 302. The hyperspectral camera 314 can more finely capture the spectral information of the reflected light and obtain the hyperspectral information of the surface profile. Furthermore, the hyperspectral camera 314 is a single-shot hyperspectral camera (one-shot or single-shot hyperspectral camera) that captures only one image to obtain the hyperspectral information of the surface profile. The hyperspectral camera 314 can capture the hyperspectral information in full color or monochrome. The hyperspectral camera 314 is, for example, a high-resolution full-color or monochrome camera.

Regular or multispectral imaging typically captures and processes images at three broadband wavelengths corresponding to the RGB colors, since the human eye sees most of the colors of visible light in these three broadband wavelengths. Hyperspectral imaging can capture and process images of the infrared spectrum to the ultraviolet spectrum or even electromagnetic spectrum including the X-ray spectrum. Hyperspectral imaging separates the electromagnetic waves into more spectral bands than general RGB spectral bands and covers a wide wavelength range with fine wavelength resolution. Regular spectral imaging measures spaced apart RGB spectral bands, but conversely hyperspectral imaging measures multiple contiguous spectral bands. The hyperspectral camera 314 can capture and process images of the object 30 in a very large number of fine wavelengths, and the hyperspectral information can be broken up into a very large number of colors corresponding to these fine wavelengths.

The single-shot hyperspectral imaging assembly 302 includes an aperture device 330, and the reflected light from the optical beam splitter 210 passes through the aperture device 330 to the hyperspectral camera 314. The aperture device 330 includes at least one aperture or hole for allowing light to pass through. The single shot hyperspectral imaging assembly 302 includes a spectral spreading device (wavelength division device) disposed between the aperture device 330 and the hyperspectral camera 314 to separate the reflected light so that the reflected light is more clearly distinguished by the spectral information, such as wavelength. The spectrum spreading device may be a grating that diffracts the reflected light or an optical prism that scatters the reflected light.

In the single-shot hyperspectral imaging assembly 302 of fig. 9, the set of detection optics 320 includes the first imaging lens 322 disposed in front of the hyperspectral camera 314 and behind the grating 340. The first imaging lens 322 is configured to focus the reflected light from the grating 340 onto an image sensor of the hyperspectral camera 314, so that spectral information of the reflected light from the surface profile of the object 30 is imaged onto the hyperspectral camera 314. The detection optics 320 further includes a collimator (collimator)324 disposed between the aperture device 330 and the grating 340. The collimator 324 is a device, such as a curved lens or mirror, that narrows and aligns the beam to a particular direction. It is noted that the collimator 324 directs the reflected light from the aperture device 330 to the grating 340, and the grating 340 more clearly distinguishes the light into its wavelength continuum. The detection optics 320 may further include a relay lens 326 disposed between the optical beam splitter 210 and the aperture device 330. The relay lens 326 is configured to project the surface profile image formed at the pinhole device 220 onto the aperture device 330 via the optical beam splitter 210.

Based on the spectral information of the reflected light, the first imaging lens 322 projects the diffracted wavelength of the reflected light at a separated wavelength onto the hyperspectral camera 314. Due to the effect of the first microlenses 224 increasing the amount of light directed to the first pinhole 222, image sensitivity is increased and the global spectrum of each point of the surface profile of the object 30 is imaged by the hyperspectral camera 314. FIG. 10 illustrates a hyperspectral image 50 of the object 30 captured by the single-shot hyperspectral imaging assembly 302. The system 20 may be integrated with or coupled to an image processing module to generate the surface profile of the object 30 based on the hyperspectral image 50. Since it is a full hyperspectral of the 3D surface profile, the sub-surface profile and multi-layer thickness of the surface of the object 30 can be finely measured and inspected in addition to the surface profile. Hyperspectral imaging thus allows high resolution detailed measurement of the full spectrum of the surface profile and the system 20 can be used in a wide variety of applications and is not limited to in-line inspection and the semiconductor industry, electronics industry, precision engineering, optics, biomedical agriculture, and food industry.

In the embodiment shown in fig. 9, the aperture arrangement 330 comprises an array of second pinholes 332 similar to the first pinholes 222 of the pinhole arrangement 220. The aperture device 330 may further comprise a second microlens 224 in an array with the second array of pinholes 332. Specifically, the aperture device 330 includes the second microlenses 224 of the array disposed in front of the second pinholes 332, i.e., between the optical beam splitter 210 and the second pinholes 332, such as each second pinhole 332 matching a second microlens 224. The array of second pinholes 332 and the array of second microlenses 224 can be formed separately and coupled together, or they can be integrated into a unit. Each of the second pinholes 332 is paired with a second microlens 224 and they cooperate to focus light at the center of the respective second pinhole 332.

In summary, in the embodiment shown in fig. 9, the system 20 includes the light source assembly 100, the confocal microscope assembly 200, and the photodetector assembly 300. The photodetector assembly 300 is a single shot hyperspectral imaging assembly 302 configured to measure the surface profile of the object 30 and subsurface profiles including multi-layer film thicknesses. The light source assembly 100 includes the broadband light source 110 and the kohler illumination device 120. The confocal microscope assembly 200 includes the optical beam splitter 210 and the pinhole device 220 having the pinhole arrays and a first microlens 224 fitted with one or more of the pinhole arrays. The confocal microscope assembly 200 further includes the entrance optics 230 and the drive mechanism 240 for moving the pinhole device 220 planarly along the X-axis and Y-axis. However, the system 20 can eliminate or stop the drive mechanism 240 to perform rapid sample measurements of the object 30. The incident optical assembly 230 includes the objective lens 232, the second tube lens 234, and the chromatic aberration lens 236. The single-shot hyperspectral imaging assembly 302 includes the photodetector 310 with the hyperspectral camera 314, the aperture device 330 with the first microlens 234 in an array with the second pinhole 332 array, and the wavelength division device (wavelength division device). The single-shot hyperspectral imaging assembly 302 further includes the set of detection optics 320 that includes the relay lens 326, the collimator 324, and the first imaging lens 322.

In the embodiment of fig. 1 and 9, the system 20 is configured to scan a 2D area of the surface profile of the object 30. Specifically, the array of first apertures 222 of the pinhole device 220 is disposed across a 2D plane. In the embodiment of fig. 11, the system 20 is configured to perform a linear scan of the surface profile of the object 30. The aspects of fig. 1 and 9 described above may be similarly or analogously applied to the 11 embodiment of fig. and vice versa. In the embodiment of fig. 11, the first pinholes 222 and likewise the first microlenses 224 can be arranged in a single row (one-dimensional arrangement) instead of the two-dimensional array of first pinholes 222. Similarly for the pinhole device 220, the second pinholes 332 and likewise the first microlenses 224 can be arranged in a single row (one-dimensional arrangement) instead of a two-dimensional array of second pinholes 332. Alternatively, the single row of second pinholes 332 may be replaced by a one-dimensional slit aperture 336 as shown in fig. 11.

Alternatively, the optical aperture 114 of the broadband light source 110 is a linear aperture corresponding to the single row of the first pinhole 222/the second pinhole 332. The Kohler illumination device 120 may also be replaced with a first tube lens 122 that focuses the broadband light beam into a line-shaped light beam. The drive mechanism 240 for moving the needle hole arrangement 220 in a plane may be configured to move the needle hole arrangement 220 in a direction parallel to the single row of first needle holes 222 to cover the gap or spacing between the first needle holes 222. For example, the row of first needle holes 222 is arranged across the surface contour along an X-axis, and the drive mechanism 240 is configured to move the needle hole arrangement 220 along this X-axis. The drive mechanism 240 in conjunction with a displaceable platform supporting the object 30 measures the entire surface profile of the object 30. For example, the drive mechanism 240 moves the first pinhole 222 along the X-axis and the stage moves the object 30 along the Y-axis. As the line-shaped beam moves across the surface profile, the photodetector 310 (e.g., the color camera 312 or hyperspectral camera 314) captures a row of spectra at a time. FIG. 12 illustrates hyperspectral images of the object 30 captured by the hyperspectral camera 314 in the form of a succession of spectra.

In summary, in the embodiment of fig. 11, the system 20 is configured to linearly scan the object 30 and includes the light source assembly 100, the confocal microscope assembly 200, and the photodetector assembly 300, with the photodetector assembly 300 being the single-shot hyperspectral imaging assembly 302. The light source assembly 100 includes the broadband light source 110 and the first tube lens 122. The first tube lens 122 focuses the uniform light from the broadband light source 110 into a linear light beam to linearly scan the object 30. The confocal microscope assembly 200 includes the optical beam splitter 210 and the pinhole device 220 with a single row of pinhole arrays for linear scanning and microlenses 234 that mate with one or more arrays of the single row of pinhole arrays. The confocal microscope assembly 200 further includes the set of entrance optics 230 and the drive mechanism 240. The drive mechanism 240 is used to move the needle hole arrangement 220 planarly parallel to the single row of first needle holes 222, e.g., along the X-axis. The incident optical assembly 230 includes the objective lens 232, the second tube lens 234, and the chromatic aberration lens 236. The single-shot hyperspectral imaging assembly 302 includes the photodetector 310 with the hyperspectral camera 314, the aperture device 330 with the slit aperture 336 for linear scanning, and the wavelength-splitting device. Alternatively, the aperture device 330 includes a single row of second pinholes 332 for linear scanning and a single row of second microlenses 224 matching the single row of second pinholes 332. The single-shot hyperspectral imaging assembly 302 further includes the set of detection optics 320, and the set of detection optics 320 has a relay lens 326, a collimator 324, and a first imaging lens 322.

In the embodiment shown in fig. 13, the system 20 is substantially similar to the embodiment shown in fig. 9, except for the pinhole device 220. However, aspects of the embodiments described above with respect to fig. 1, 9 and 11 may be applied equally or similarly to the embodiment of fig. 13, and vice versa. In the embodiment of fig. 13, the needle device 220 is a Nipkow disk (Nipkow disk) 226. The nipkov disk 226 is a scanning disk having equidistant and circular or square first pinhole 222. The drive mechanism 240 is configured to rotate the nipkov disk 226 about the Z-axis in a plane. Preferably, the first pinhole 222 is positioned starting from an outer radial point of the nipkov disk 226 towards its center to form a single-turn spiral to facilitate the trajectory of the first pinhole 222 scanning from a circular pattern as the driving mechanism 240 rotates the nipkov disk 226. As described above, as the nipkov disk 226 rotates, the first pinhole 222 and the corresponding point on the surface profile of the object 30 are moved through the surface profile and a continuous surface area of the surface profile is scanned and measured.

In the embodiment of FIG. 14, the nipkov disk 226 further includes a first array of first microlenses 224 disposed at the top of the first apertures 222. As shown in fig. 15, the nipkov disk 226 may further include a second array of first microlenses 224 disposed below the first pinholes 222, i.e., the array of first pinholes 222 is located between the first array and the second array of first microlenses 224. Each of the first pinholes 222 is associated with at least one first microlens 224, and the first microlenses 224 are arranged to focus light into the respective first pinholes 222.

In general, in the embodiment of fig. 13-15, the system 20 includes the light source assembly 100, the confocal microscope assembly 200, and the photodetector assembly 300. The photodetector assembly 300 is the single-shot hyperspectral imaging assembly 302. The light source assembly 100 includes the broadband light source 110 and the kohler illumination device 120. The confocal microscope assembly 200 includes the optical beam splitter 210 and the pinhole device 220. The pinhole device 220 is the nipkov disk 226 with the array of pinholes. The nipkov disk 226 may further include a first microlens 224 that fits one or more of the pinhole arrays. The confocal microscope assembly 200 further includes the set of entrance optics 230 and the drive mechanism 240 that rotates the pinhole device 220 along the Z-axis. The set of incident optical elements 230 includes the objective lens 232, the second tube lens 234, and the chromatic aberration lens 236. The single-shot hyperspectral imaging assembly 302 includes the photodetector 310 with the hyperspectral camera 314, the aperture device 330 with the second pinhole 332 array, an array of second microlenses 224 that match the second pinhole 332 array, and the wavelength separation device. The single-shot hyperspectral imaging assembly 302 further comprises the set of detection optics 320, and the set of detection optics 320 has the relay lens 326, the collimator 324, and the first imaging lens 322.

In the embodiment of fig. 16, the system 20 includes the light source assembly 100, the confocal microscope assembly 200, and the photodetector assembly 300 as described above. The light source assembly 100 includes the broadband light source 220 and the kohler illumination device 120. The photodetector assembly 300 includes the color camera 312 and the first imaging lens 322, although it is understood that the photodetector assembly 300 can be the single-shot hyperspectral imaging assembly 302.

The confocal microscope assembly 200 includes the optical beam splitter 210, the pinhole device 220 in the form of a nipkov disk 226, and the drive mechanism 240 for rotating the nipkov disk 226. The confocal microscope assembly 200 further includes the second tube lens 234, the chromatic aberration lens 236, and the objective lens 232 for chromatically focusing light rays onto the object 30 in tandem. The object 30 is supported on a movable mechanically movable platform 32. For example, the mechanically movable platform 32 is coupled to or integrated with a drive, such as a motor and a piezoelectric drive. The actuators may move the mechanically movable stage 32 along at least one of the XYZ axes and/or rotate the mechanically movable stage 32 around at least one of the XYZ axes.

In the embodiment shown in fig. 16, the set of incident optical elements 230 includes a first objective lens 232 and a second objective lens 238. The confocal microscope assembly 200 further includes a translation device or stage 250 that supports the first objective 232 and the second objective 238. The changer 250 may include actuators such as motors and piezoelectric actuators and may be operated between the first objective 232 and second objective 238. For example, the first objective lens 232 has a higher magnification and the second objective lens 238 has a lower magnification. Furthermore, the set of incident optical components 230 may comprise a plurality of objective lenses, and the objective lenses may be switched with respect to each other by the transmission conversion device 250, wherein the objective lenses may have different magnifications, which facilitates the selection of the measurement performance.

Although the three-dimensional surface profile measurement system 20 may be used primarily for on-line high-speed measurement and inspection, it may also be used as a stand-alone measurement system for sampling measurements. Fig. 16 illustrates the stand-alone measurement system 20.

As described above, the system 20 includes the broadband light source 110, the kohler illumination device 120, and the optical beam splitter 210. The optical beam splitter 210 directs uniform illumination to the surface of the nipkov disk 226. Some of the light is blocked by the nipkov disk 226 and some of the light passes through the first aperture 222 of the nipkov disk 226. The light from the first pinhole 222 passes through the second tube lens 234, the chromatic aberration lens 236, and finally is focused on the surface of the object 30 disposed on the mechanically movable stage 32 through the objective lens 232.

A viewing device 500 is disposed between the objective lens 232 and the second tube lens 234 for viewing and selecting the area of the surface profile to be viewed. The observation device 500 includes a first optical beam splitter 510, a second optical beam splitter 520, an eyepiece 530, a second imaging lens 540, and a camera 550. The surface profile of the object 30 is imaged through the objective lens 232 and reflected by the first optical beam splitter 510 and the second optical beam splitter 520. The image can be imaged by the second imaging lens 540 and the camera 550. The image of the object 30 can also be observed directly through the eyepiece 530 with the naked eye. The scope 500 may be moved in for viewing and out for three-dimensional surface profile measurement.

As with the various embodiments described above, the system 20 and method 400 measure the surface profile of the object 30 by capturing a single image of the surface profile and using spectral analysis to generate the surface profile of the object 30. The light source assembly 100 provides uniform broadband light to the confocal microscope assembly 200 and the photodetector assembly 300 to image the object 30. The confocal microscope assembly 200 generates and collects spectral information of the surface profile and the photodetector assembly 300 records spectral information of the spectral image of the surface profile. The system 20 may be integrated with or coupled to an image processing module to generate the surface profile of the object 30 based on the spectral image, such as the spectral image 40 or hyperspectral image 50 described above. For example, through the hyperspectral image 50, the sub-surface profile and surface layer thickness of the object 30 other than the surface profile can be viewed.

The spectral analysis is based on the principle of chromatic aberration of the broadband uniform light passing through the confocal microscope assembly 200. The chromatic aberration of the uniform light produces spectral information representing more distinct wavelengths across the height of the surface profile, and the surface profile can be accurately measured from these wavelengths without the need for vertical scanning. The system 20 can achieve high speed surface profile measurements due to the pinhole device 220, such as the nipkov disk 226, as compared to slow conventional point-to-point measurement methods. The entire surface of the object 30 can be scanned and measured seamlessly, eliminating the risk of regions of interest of the object 30 being excluded, and allowing for higher quality inspection of the object 30.

Thus, the system 20 and method 40 are suitable for high speed and accurate surface profile measurements, particularly surface profiles of wavy or discontinuous morphology, and thus are suitable for a variety of applications including high speed automated surface profile inspection of semiconductor wafers, integrated circuit wire loops, and precision components.

Embodiments of the disclosed system 20 and method 400 for measuring a surface profile of an object are described in detail above with reference to the drawings. These embodiments are not intended to limit the disclosure to the particular representative embodiments disclosed herein, but are merely illustrative of non-limiting examples of the disclosure. The present disclosure is directed to solving at least one of the problems and disadvantages of the related art. Although only a few embodiments have been disclosed in detail herein, those skilled in the art should, in light of the present disclosure, appreciate that many changes and/or modifications can be made to the disclosed embodiments without departing from the scope of the disclosure. Accordingly, the scope of the present disclosure and appended claims is not to be limited to the embodiments disclosed herein.

Claims

1. A surface profile measurement system, characterized by: the system comprises:

a light source assembly including a set of broadband light sources;

a confocal microscope assembly comprising:

a set of incident optical assembly, including a chromatic aberration lens set, for guiding the uniform light from the pinhole device to the object to be measured and generating chromatic aberration of the uniform light passing through the incident optical assembly;

the pinhole device is arranged to pass reflected light from the object through the pinhole device to the optical beam splitter, the reflected light containing the surface profile information based on the chromatic aberration;

a photodetector assembly, comprising:

the spectrum of the reflected light of the surface of the object to be measured contains the surface profile information of the object, and the photoelectric detector can detect and analyze the three-dimensional profile of the surface of the object, so that the surface profile of the object is measured.

2. The surface profile measuring system of claim 1, wherein: wherein the broadband light source comprises:

an optical integrating sphere;

a set of bulbs disposed around the optical integrating sphere, the optical integrating sphere configured to integrate all light energy from the set of bulbs; and

3. The surface profile measuring system of claim 2, wherein: the group of bulbs is a white light component, and the spectral range of the white light component comprises red light to blue light or infrared light to ultraviolet light.

4. A surface profile measuring system according to any one of claims 1 to 3, wherein: wherein the pinhole device comprises one or more microlens arrays arranged to mate with the pinhole arrays such that a first pinhole in each of the pinhole arrays mates with at least a first microlens in the microlens array, the first microlens being arranged to focus light from the optical beam splitter to a respective first pinhole.

5. The surface profile measuring system of claim 4, wherein: wherein the microlens array is disposed on one or both sides of the pinhole device.

6. The surface profile measuring system of any one of claims 1 to 5, wherein: wherein the confocal microscope assembly comprises a driving mechanism for moving the pinhole device in a plane.

7. The surface profile measuring system of claim 6, wherein: wherein the drive mechanism is configured to move the pinhole device planarly along the X-axis and/or the Y-axis.

8. The surface profile measuring system of any one of claims 1 to 7, wherein: wherein the set of incident optical elements comprises:

an objective lens for focusing light on the object to be measured;

and the chromatic aberration lens is arranged between the second lens cone lens and the objective lens so as to cause the chromatic aberration of the light rays.

9. The surface profile measuring system of claim 8, wherein: wherein the objective lens and the chromatic aberration lens may be integrated into a single lens assembly.

10. The surface profile measuring system of any one of claims 1 to 9, wherein: wherein the photodetector assembly is a hyperspectral imaging assembly configured to measure the surface topography of the object, as well as multilayer film thickness and surface topography.

11. The surface profile measuring system of claim 10, wherein: wherein the hyperspectral imaging assembly is a single-shot hyperspectral imaging assembly configured to measure multilayer film thickness and surface topography of the object with a single photograph.

12. The surface profile measuring system of claim 11, wherein: wherein this single shooting hyperspectral imaging subassembly contains:

the photoelectric detector comprises a hyperspectral camera;

a wavelength separating device arranged between the aperture device and the hyperspectral camera and used for separating the spectrum of the reflected light;

the set of detection optics includes:

13. The surface profile measuring system of claim 12, wherein: wherein the aperture device comprises an array of second pinhole or a slit aperture.

14. The surface profile measuring system of claim 13, wherein: wherein the aperture device comprises an array of second pinholes of the array and an array of second microlenses associated with the array of second pinholes such that each of the pinholes is associated with a second microlens, wherein the second microlenses are configured to focus the reflected light from the optical beam splitter to the respective second pinholes.

15. The surface profile measuring system of any one of claims 12 to 14, wherein: wherein the wavelength separation means comprises a grating for causing a diffraction effect on the reflected light from the surface of the object to be measured to perform wavelength resolution, or an optical prism for causing a dispersion effect on the reflected light from the surface of the object to be measured to perform wavelength resolution.

16. The surface profile measuring system according to claim 1, wherein: wherein

the confocal microscope assembly includes:

the optical beam splitter and the set of incident optical components;

the pinhole device comprises the pinhole array and one or more arrays of first microlenses matched with the pinhole array, so that each pinhole is matched with at least one first microlens, wherein the first microlenses are used for focusing light rays from the optical beam splitter into the respective first pinholes; and

and

17. The surface profile measuring system of claim 1, wherein: wherein

The light source assembly comprises the broadband light source and an optical illumination device, wherein the optical illumination device is used for uniformly guiding a uniform light beam from the broadband light source;

the confocal microscope assembly comprises:

the optical beam splitter and the set of incident optical components; and

the photodetector is a single-shot hyperspectral imaging assembly configured to measure a surface profile and a subsurface profile of an object under measurement, the single-shot hyperspectral imaging assembly comprising:

a hyperspectral camera; and

an aperture device, wherein the reflected light from the optical beam splitter passes through the aperture device to the hyperspectral imager, the aperture device comprising an array of pinholes and an array of second microlenses associated with the array of pinholes, such that each pinhole is associated with a second microlens, the second microlenses being configured to focus the reflected light from the optical beam splitter into a respective second pinhole.

18. The surface profile measuring system of claim 17, wherein: also included is a drive mechanism, wherein the drive mechanism drives the pinhole device along the X-axis and the Y-axis plane.

19. The surface profile measuring system of claim 1, wherein: wherein

the confocal microscope assembly comprises:

the optical beam splitter and the set of incident optical components;

a hyperspectral camera; and

an aperture device through which the reflected light from the optical beam splitter passes to the hyperspectral imager, the aperture device comprising a single row of pinholes for the linear scanning and a single row of second microlenses matching the single row of pinholes, such that each pinhole matches a second microlens, the second microlenses being configured to focus the reflected light from the optical beam splitter into the respective second pinholes.

20. The surface profile measuring system of claim 1, wherein: wherein

The light source assembly comprises the broadband light source and a cylindrical lens, and the cylindrical lens is used for focusing uniform light from the broadband light source into a linear light beam so as to linearly scan the object;

the confocal microscope assembly comprises:

the optical beam splitter and the set of incident optical components;

a hyperspectral camera; and

an aperture device, wherein the reflected light from the optical beam splitter passes through the aperture device to the hyperspectral imager, the aperture device comprising a slit aperture for the linear scanning.

21. The surface profile measuring system of claim 1, wherein: wherein

the confocal microscope assembly comprises:

the optical beam splitter and the set of incident optical components; and

the pinhole device is a nipkov disk and includes the pinhole array; and

a drive mechanism for rotating the pinhole device along the Z axis; and

a hyperspectral camera; and

an aperture device through which the reflected light from the optical beam splitter passes to the hyperspectral imager, the aperture device comprising an array of pinholes and an array of microlenses associated with the array of pinholes such that each pinhole is associated with a second microlens, the second microlenses being configured to focus the reflected light from the optical beam splitter into respective second pinholes.

22. The surface profile measuring system of claim 21, wherein: wherein the nipkov disk includes one or more arrays of first microlenses arranged to mate with the pinhole array such that each pinhole mates with at least one of the first microlenses, the first microlenses being arranged to focus light from the optical beam splitter into respective ones of the first pinholes.

23. The surface profile measuring system of claim 22, wherein: wherein the first microlenses of the arrays are disposed on one or both sides of the pinhole device.

24. A surface profile measuring system according to any one of claims 21 to 23, wherein: wherein the first pinhole is round or square.