CN114639620A - Equipment and method for improving position precision of chip mounted on die bonder - Google Patents
Equipment and method for improving position precision of chip mounted on die bonder Download PDFInfo
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- CN114639620A CN114639620A CN202210185445.6A CN202210185445A CN114639620A CN 114639620 A CN114639620 A CN 114639620A CN 202210185445 A CN202210185445 A CN 202210185445A CN 114639620 A CN114639620 A CN 114639620A
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- 238000000034 method Methods 0.000 title claims description 19
- 230000007246 mechanism Effects 0.000 claims abstract description 115
- 230000001629 suppression Effects 0.000 claims abstract description 34
- 230000001133 acceleration Effects 0.000 claims abstract description 7
- 238000009434 installation Methods 0.000 claims description 16
- 210000001503 joint Anatomy 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 230000008569 process Effects 0.000 description 9
- 230000002401 inhibitory effect Effects 0.000 description 4
- 230000007774 longterm Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000010009 beating Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- Power Engineering (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Aviation & Aerospace Engineering (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
Abstract
The invention provides equipment for improving the position accuracy of a chip mounted on a die bonder, which comprises a control system, and further comprises an equipment base, a support, a conveying mechanism, a chip mounting head and a vibration suppression mechanism, wherein the support is fixed on the equipment base, the conveying mechanism, the chip mounting mechanism and the vibration suppression mechanism are all fixed on the support, a first linear motor in the Y-axis direction is arranged in the chip mounting mechanism, the chip mounting head is connected with the first linear motor, the placement direction of the vibration suppression mechanism is consistent with that of the chip mounting mechanism, and the vibration suppression mechanism is provided with a balancing weight moving in the Y-axis direction. The chip mounting device is simple in structure, the control system controls the first linear motor and the second linear motor to perform acceleration or deceleration movement in opposite directions or opposite directions, the equipment is easy to control, the driving forces of the chip mounting head and the counter weight block of the vibration suppression mechanism are equal in magnitude and opposite in direction, vibration of the equipment in the Y direction is effectively eliminated, and chip mounting position accuracy is improved.
Description
Technical Field
The invention relates to the technical field of SMT electronic component production, in particular to equipment and a method for improving position accuracy of a chip mounted on a die bonder.
Background
The die bonder is a machine for bonding a chip to a support, and generally, when the die bonder works, a conductive adhesive is dispensed on a lead frame, the chip is taken down from a wafer, then the chip is placed on the conductive adhesive on the lead frame, and after the conductive adhesive is solidified, the chip is bonded on the lead frame. The existing die bonder mainly has the following problems: the die bonder mounting head driven by the linear motor has a long stroke and a large acceleration during reciprocating motion in the Y direction, and causes large vibration in the Y direction during equipment operation, so that the lead frame is vibrated, the position of the lead frame is unstable, the position of a chip mounted on the lead frame is deviated, and the accuracy of the chip mounting position is affected.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides equipment and a method for improving the position accuracy of a chip mounted on a die bonder.
In order to achieve the purpose, the invention adopts the following technical scheme: an apparatus for improving position accuracy of a chip mounted on a die bonder comprises a control system, and further comprises an apparatus base, a support, a conveying mechanism, a chip mounting head and a vibration suppressing mechanism, wherein the control system is electrically connected with the conveying mechanism, the chip mounting head and the vibration suppressing mechanism respectively, the support is fixed on the apparatus base, the conveying mechanism, the chip mounting mechanism and the vibration suppressing mechanism are fixed on the support, a first linear motor in a Y-axis direction is arranged in the chip mounting mechanism, the chip mounting head is connected with the first linear motor, the conveying mechanism comprises a conveying rail and a lead frame, the conveying rail is arranged in the X direction, the lead frame is arranged on the conveying rail, and the arrangement direction of the vibration suppressing mechanism is consistent with the arrangement direction of the chip mounting mechanism, the vibration suppression mechanism is arranged in the positive direction of the Y axis of the chip mounting mechanism and is provided with a balancing weight moving in the direction of the Y axis.
Preferably, the vibration suppression mechanism further comprises a fixing body and a second linear motor, the second linear motor is fixed on the fixing body and moves along the Y-axis direction, and the balancing weight is fixed on the second linear motor.
Preferably, the support includes track support, subsides installation mechanism support and presses down the mechanism support that shakes, track support vertical fixation is in on the equipment base, delivery track fixes on the track support, subsides installation mechanism support is fixed along the Y axle direction on the equipment base, it fixes to press down the mechanism support to shake on the equipment base of the Y axle positive direction one side of subsides installation mechanism support, chip subsides installation mechanism with paste installation mechanism support press down the mechanism leg joint that shakes, it fixes to press down the mechanism on pressing down the mechanism support that shakes.
Preferably, one side detachable on the fixed body is fixed with the slide rail, the slide rail sets up along the Y axle direction, the slider that is equipped with the Y axle direction on the balancing weight corresponds, the upper end of balancing weight is fixed with the connecting plate, the connecting plate passes through bolted connection to be fixed on the second linear electric motor.
Preferably, the middle part of slide rail is equipped with first fixed orifices, the slide rail passes through the screw connection to be fixed on the fixed body, the both sides of slide rail have the slide rail recess that slide rail length direction set up, the slider includes U template and slider body, the middle part of U template is equipped with the second fixed orifices along its length direction equidistance, the inboard of two curb plates of U template is fixed the slider body, the length of slider body with the length of U template is the same, the cross section of slider body is the isosceles triangle that the apex angle is the fillet, the shape of the cross section of slide rail recess with the shape of the cross section of slider body is the same.
Preferably, the upper surface of slide rail is equipped with the spacing groove, the spacing groove is followed the length direction of slide rail sets up, the internal surface correspondence of the bottom plate of U template is equipped with spacing arch, spacing protruding cross section is semi-circular.
Preferably, a baffle is fixed on the side surface of the fixing body facing the chip mounting mechanism, and the baffle is fixed on the fixing body at one end of the sliding rail.
Preferably, the control system includes a control board, and the control board is connected to the first linear motor and the second linear motor and controls the operation of the first linear motor and the second linear motor.
The method for improving the position accuracy of the chip mounting of the die bonder by applying the equipment comprises the following steps that under the control of a control system, when a chip mounting head operates in an accelerating or decelerating way in the Y-axis direction, a balancing weight of a vibration inhibiting mechanism and the chip mounting head simultaneously move in opposite directions or in opposite directions in the Y-axis direction to accelerate or decelerate, so that the driving force of the chip mounting head is equal to the driving force of the balancing weight of the vibration inhibiting mechanism in magnitude and opposite in direction.
Preferably, the chip mounting and the chip mounting head returning are included;
when a chip is mounted, the chip mounting head accelerates or decelerates along the positive direction of the Y axis, and meanwhile, the balancing weight of the vibration suppression mechanism accelerates or decelerates along the negative direction of the Y axis;
when the chip mounting head returns, the chip mounting head accelerates or decelerates along the negative direction of the Y axis, and meanwhile, the balancing weight of the vibration suppression mechanism accelerates or decelerates along the positive direction of the Y axis.
Compared with the prior art, the invention has the beneficial effects that: (1) the chip mounting device is simple in structure, the control system controls the first linear motor and the second linear motor to perform acceleration or deceleration movement in opposite directions or opposite directions, the equipment is easy to control, the driving forces of the chip mounting head and the counter weight block of the vibration suppression mechanism are equal in magnitude and opposite in direction, vibration of the equipment in the Y direction is effectively eliminated, and chip mounting position accuracy is improved. (2) The chip mounting mechanism is connected with the mounting mechanism support and the vibration suppression mechanism support, on one hand, the fixing strength of the chip mounting mechanism is guaranteed, the vibration amplitude in the Y-axis direction is effectively reduced in the operation process of equipment, meanwhile, the vibration generated in the operation process of the equipment can be conducted to the vibration suppression mechanism support through the chip mounting mechanism, the vibration is eliminated through the vibration suppression mechanism fixed on the vibration suppression mechanism support, the vibration in the Y-axis direction is further eliminated, the phenomenon that the vibration of the Y-axis is large, the lead frame vibrates is avoided, the chip is enabled to deviate, the chip mounting precision is reduced, and therefore the chip mounting precision in the operation process of the equipment can be improved. (3) The balancing weight and the fixed body are connected through the matching of the sliding rail and the sliding block, so that the balancing weight cannot move in the direction of a Y axis in the long-term use process, the deviation in the operation process of the balancing weight is small, and the vibration in the Y axis direction is effectively eliminated. (4) The cross sections of the sliding block body and the sliding rail groove are isosceles triangles with rounded vertex angles, so that the sliding block body can be conveniently embedded into the sliding rail groove for matching use, the sliding block body and the sliding rail groove are prevented from being deviated, the connecting strength of the sliding block body and a side plate of a U-shaped plate is ensured, and the service life of the sliding block is prolonged; simultaneously, when using, the slider body contacts with the slide rail groove through face to face, guarantees that the frictional force atress between slider body and slide rail groove is even, avoids this balancing weight can not take place the phenomenon of beating when moving along Y axle direction, guarantees that the balancing weight can be at Y axle direction even migration, can not take place the skew, has improved this mechanism of suppressing vibration and has eliminated the ability of the ascending vibration of Y axle direction.
Drawings
FIG. 1 is a schematic structural diagram of an apparatus for improving positional accuracy of a die bonder for bonding a chip according to the present invention;
FIG. 2 is an enlarged view of a portion a of an apparatus for improving the positional accuracy of a die bonder for bonding a die according to the present invention;
FIG. 3 is a schematic perspective view of a slide rail of an apparatus for improving positional accuracy of a die bonder for bonding a chip according to the present invention;
fig. 4 is a schematic perspective view of a slider of an apparatus for improving positional accuracy of a die bonder for bonding a chip according to the present invention.
Detailed Description
In order to further understand the objects, structures, features and functions of the present invention, the following embodiments are described in detail.
Referring to fig. 1, the device for improving the chip mounting position accuracy of the die bonder comprises a control system, and further comprises a device base 1, a support 2, a conveying mechanism 3, a chip mounting mechanism 4, a chip mounting head 5 and a vibration suppression mechanism 6, wherein the control system is electrically connected with the conveying mechanism 3, the chip mounting mechanism 4, the chip mounting head 5 and the vibration suppression mechanism 6 respectively, so that the device can be controlled by the control system to operate normally, and the chip mounting and fixing operations can be completed. The support 2 is fixed on the equipment base 1, conveying mechanism 3, chip mounting mechanism 4 and it all fixes to restrain shakes mechanism 6 on the support 2, be equipped with the first linear motor 7 of Y axle direction in the chip mounting mechanism 4, chip mounting head 5 with first linear motor 7 is connected, conveying mechanism 3 includes delivery track 31 and lead frame 32, delivery track 31 sets up along the X direction, lead frame 32 places on the delivery track 31, it is unanimous with the direction of placing of chip mounting mechanism 4 to restrain the direction of placing of shaking mechanism 6, it installs to restrain shakes mechanism 6 the Y axle positive of chip mounting mechanism 4 upwards, it has the balancing weight 61 of the upward removal of Y axle direction to restrain shakes mechanism 6.
As shown in fig. 1 and 2, the vibration suppressing mechanism further includes a fixing body 62 and a second linear motor 63, the second linear motor 63 is fixed to the fixing body 62, the second linear motor 63 moves along the Y-axis direction, and the weight 61 is fixed to the second linear motor 63. The second linear motor 63 can drive the counterweight block 61 to do acceleration or deceleration movement in the Y-axis direction, so as to provide driving force for the counterweight block 61, and the positioning precision of the equipment during operation can be ensured by using the first linear motor 7 and the second linear motor 63; the linear motor has easy magnetic suspension support of the rotor, so that certain air gap is always maintained between the rotor and the stator without contact, and the contact friction resistance between the stator and the rotor is eliminated, so that the sensitivity, the rapidity and the follow-up performance of the system are greatly improved.
As fig. 1, support 2 includes track support 21, subsides installation support 22 and presses down mechanism support 23 that shakes, track support 21 vertical fixation is in on the equipment base 1, delivery track 31 is fixed on track support 21, subsides installation support 22 is fixed along the Y axle direction on the equipment base 1, it fixes to press down mechanism support 23 on the equipment base 1 of the Y axle positive direction one side of installation support 22, chip subsides installation mechanism 7 with paste installation support 22 press down mechanism support 23 and connect, it fixes to press down mechanism 6 on pressing down mechanism support 23. The chip mounting mechanism 7 is connected with the mounting mechanism support 22 and the vibration suppression mechanism support 23, on one hand, the fixing strength of the chip mounting mechanism 4 is guaranteed, the vibration amplitude in the Y-axis direction is effectively reduced in the operation process of the equipment, meanwhile, the vibration generated in the operation process of the equipment can be conducted to the vibration suppression mechanism support 23 through the chip mounting mechanism 4, the vibration is eliminated through the vibration suppression mechanism 6 fixed on the vibration suppression mechanism support 23, the vibration in the Y-axis direction is further eliminated, the phenomenon that the vibration of the Y-axis is large, the lead frame 32 vibrates is avoided, the chip is deviated, the chip mounting precision is reduced, and the chip mounting precision is improved in the operation process of the equipment.
Preferably, as shown in fig. 2, one side detachable on the fixed body 62 is fixed with slide rail 8, slide rail 8 sets up along the Y axle direction, the last slider 9 that is equipped with the Y axle direction of correspondence of balancing weight 61, the upper end of balancing weight 61 is fixed with connecting plate 64, connecting plate 64 passes through bolted connection to be fixed on the second linear electric motor 63, when guaranteeing the motion of second linear electric motor 63, can drive balancing weight 61 and move in the Y axle direction, through the setting of slide rail 8, guarantee when long-term the use, the balancing weight 61 can not skew the direction motion of Y axle, and the deviation when guaranteeing the balancing weight 61 operation is less, the ascending vibration of effectual elimination Y axle direction.
Preferably, as shown in fig. 2, 3 and 4, the middle part of the slide rail 8 is provided with a first fixing hole 81, and the slide rail 81 is fixed on the fixing body 62 through screw connection, so that the slide rail 8 is convenient to detach and replace when being worn out during long-term use of the device, and maintenance is convenient. Slide rail 8's both sides have slide rail groove 82 that slide rail length direction set up, slider 9 includes U template 91 and slider body 92, the middle part of U template 91 is equipped with second fixed orifices 93 along its length direction equidistance, and the surface of the bottom plate of U template 91 is fixed on balancing weight 61, the inboard of two curb plates of U template 91 is fixed slider body 92, slider body 92's length with U template 91's length is the same, slider body 92's cross section is the isosceles triangle that the apex angle is the fillet, the shape of slide rail groove 82's cross section with slider body 92's cross section's shape is the same. When the slider is used, the slider body 92 is conveniently embedded into the slide rail groove 82 for matching use, the slider body 92 and the slide rail groove 82 are prevented from deviating, the slider body 92 with the shape ensures the connection strength of the slider body 92 and the side plate of the U-shaped plate 91, and the service time of the slider 9 is prolonged; meanwhile, when the vibration suppression mechanism is used, the sliding block body 92 is in surface-to-surface contact with the sliding rail groove 82, the friction force between the sliding block body 92 and the sliding rail groove 82 is ensured to be uniform, the phenomenon that the balancing weight 61 cannot jump when moving in the Y-axis direction is avoided, the balancing weight 61 can be ensured to uniformly move in the Y-axis direction, the deviation cannot occur, and the vibration suppression capability of the vibration suppression mechanism 6 in the Y-axis direction is improved.
Preferably, the upper surface of the slide rail 8 is provided with a limiting groove 83, the limiting groove 83 is arranged along the length direction of the slide rail 8, the inner surface of the bottom plate of the U-shaped plate 91 is correspondingly provided with a limiting protrusion 94, and the cross section of the limiting protrusion 94 is semicircular. Through the cooperation of spacing arch 94 and spacing groove 83, further go up fixed balancing weight 61 and further inject to slider 9, guarantee that this balancing weight 61 can move along the Y axle direction, can not take place wearing and tearing because of this slider body 62 during long-term use, lead to the traffic direction of balancing weight to change, the time of extension slide rail 8 and slider 9 cooperation use.
Preferably, as shown in fig. 2, a baffle 65 is fixed to a side of the fixing body 62 facing the die attaching mechanism, and the baffle 65 is fixed to the fixing body 62 at one end of the slide rail 8. During installation, this baffle 65 can block the one end of slide rail 8, prevents that balancing weight 61 from this end roll-off slide rail.
Preferably, as shown in fig. 1 and 2, the control system includes a control board connected to the first linear motor 7 and the second linear motor 63, and controlling the operation of the first linear motor 7 and the second linear motor 63. The control system controls the first linear motor 7 and the second linear motor 63, the structure is simple, the control system controls the first linear motor 7 and the second linear motor 63 to do acceleration or deceleration movement in opposite directions or opposite directions, and the equipment is easy to control.
The method for improving the position accuracy of the chip mounting position of the die bonder by applying the equipment comprises the following steps that under the control of the control system, when the chip mounting head 5 operates in an accelerating or decelerating way in the Y-axis direction, the balancing weight 61 of the vibration inhibiting mechanism 6 simultaneously performs accelerating or decelerating movement in the Y-axis direction in opposite directions or opposite directions with the chip mounting head 5, so that the driving force of the chip mounting head 5 is equal to the driving force of the balancing weight 61 of the vibration inhibiting mechanism 6, and the directions are opposite. Effectively eliminate the vibration of equipment in Y direction, improve chip and paste dress position precision.
The working process of the equipment comprises chip mounting and chip mounting head returning;
when a chip is mounted, the chip mounting head 5 moves in an accelerating or decelerating manner along the positive direction of the Y axis, and meanwhile, the balancing weight 61 of the vibration suppression mechanism 6 moves in an accelerating or decelerating manner along the negative direction of the Y axis; when the chip mounting head is returned, the chip mounting head 5 is accelerated or decelerated along the negative direction of the Y axis, and at the same time, the counter weight block 61 of the vibration suppressing mechanism 6 is accelerated or decelerated along the positive direction of the Y axis.
The present invention has been described in relation to the above embodiments, which are only exemplary of the implementation of the present invention. It should be noted that the disclosed embodiments do not limit the scope of the invention. Rather, it is intended that the invention be covered by the appended claims without departing from the spirit and scope of the invention.
Claims (10)
1. The utility model provides an improve equipment that solid crystal machine pasted dress chip position accuracy, includes control system, its characterized in that: the control system is respectively electrically connected with the conveying mechanism, the chip mounting head and the vibration suppression mechanism, the support is fixed on the equipment base, the conveying mechanism, the chip mounting mechanism and the vibration suppression mechanism are all fixed on the support, a first linear motor in the Y-axis direction is arranged in the chip mounting mechanism, the chip mounting head is connected with the first linear motor, the conveying mechanism comprises a conveying track and a lead frame, the conveying track is arranged along the X direction, the lead frame is arranged on the conveying track, the arrangement direction of the vibration suppression mechanism is consistent with the arrangement direction of the chip mounting mechanism, and the vibration suppression mechanism is arranged in the positive direction of the Y-axis of the chip mounting mechanism, the vibration suppression mechanism is provided with a balancing weight moving in the Y-axis direction.
2. The apparatus for improving the positional accuracy of a die bonder for die attach according to claim 1, wherein: the vibration suppression mechanism further comprises a fixing body and a second linear motor, the second linear motor is fixed on the fixing body and moves along the Y-axis direction, and the balancing weight is fixed on the second linear motor.
3. The apparatus for improving the positional accuracy of a die on a die bonder as claimed in claim 1, wherein: the support includes track support, subsides installation mechanism support and presses down the mechanism support that shakes, track support vertical fixation is in on the equipment base, delivery track fixes on the track support, the subsides installation mechanism support is fixed along Y axle direction on the equipment base, it fixes to press down the mechanism support that shakes on the equipment base of the Y axle positive direction one side of subsides installation mechanism support, the chip paste the installation mechanism with paste the installation mechanism support press down the mechanism leg joint that shakes, it fixes to press down the mechanism that shakes on the mechanism support.
4. The apparatus for improving the positional accuracy of a die bonder for die attach according to claim 2, wherein: one side detachable on the fixed body is fixed with the slide rail, the slide rail sets up along the Y axle direction, the slider that corresponds on the balancing weight and be equipped with the Y axle direction, the upper end of balancing weight is fixed with the connecting plate, the connecting plate passes through bolted connection to be fixed on the second linear electric motor.
5. The apparatus for improving the positional accuracy of a die on a die bonder as claimed in claim 4, wherein: the middle part of slide rail is equipped with first fixed orifices, the slide rail passes through the screw connection to be fixed on the fixed body, the both sides of slide rail have the slide rail recess that slide rail length direction set up, the slider includes U template and slider body, the middle part of U template is equipped with the second fixed orifices along its length direction equidistance, the inboard of two curb plates of U template is fixed the slider body, the length of slider body with the length of U template is the same, the cross section of slider body is the isosceles triangle that the apex angle is the fillet, the shape of the cross section of slide rail recess with the shape of the cross section of slider body is the same.
6. The apparatus for improving the positional accuracy of a die bonder for die attach according to claim 5, wherein: the upper surface of slide rail is equipped with the spacing groove, the spacing groove is followed the length direction of slide rail sets up, the internal surface of the bottom plate of U template corresponds is equipped with spacing arch, spacing bellied cross section is semi-circular.
7. The apparatus for improving the positional accuracy of a die on a die bonder as claimed in claim 4, wherein: the side face, facing the chip mounting mechanism, of the fixing body is fixedly provided with a baffle, and the baffle is fixed to the fixing body at one end of the sliding rail.
8. The apparatus for improving the positional accuracy of a die bonder for die attach according to claim 2, wherein: the control system comprises a control panel, the control panel is connected with the first linear motor and the second linear motor and controls the first linear motor and the second linear motor to operate.
9. The method for improving the position accuracy of the chip mounted on the die bonder by using the device of claim 1, wherein the method comprises the following steps: under the control of the control system, when the chip mounting head operates in an acceleration or deceleration mode in the Y-axis direction, the balancing weight of the vibration suppression mechanism moves in the acceleration or deceleration mode in the Y-axis direction in opposite direction or relative to the chip mounting head, so that the driving force of the chip mounting head is equal to the driving force of the balancing weight of the vibration suppression mechanism in magnitude and opposite in direction.
10. The method for improving the position accuracy of the chip mounted on the die bonder as claimed in claim 9, wherein: the chip mounting method comprises the steps of chip mounting and chip mounting head returning;
when the chip is mounted, the chip mounting head moves in an accelerating or decelerating way along the positive direction of the Y axis, and meanwhile, the balancing weight of the vibration suppression mechanism moves in an accelerating or decelerating way along the negative direction of the Y axis;
when the chip mounting head returns, the chip mounting head accelerates or decelerates along the negative direction of the Y axis, and meanwhile, the balancing weight of the vibration suppression mechanism accelerates or decelerates along the positive direction of the Y axis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210185445.6A CN114639620A (en) | 2022-02-28 | 2022-02-28 | Equipment and method for improving position precision of chip mounted on die bonder |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210185445.6A CN114639620A (en) | 2022-02-28 | 2022-02-28 | Equipment and method for improving position precision of chip mounted on die bonder |
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| CN114639620A true CN114639620A (en) | 2022-06-17 |
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| CN202210185445.6A Pending CN114639620A (en) | 2022-02-28 | 2022-02-28 | Equipment and method for improving position precision of chip mounted on die bonder |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115623697A (en) * | 2022-12-06 | 2023-01-17 | 常州铭赛机器人科技股份有限公司 | Chip mounting mechanism |
| CN117059519A (en) * | 2023-08-09 | 2023-11-14 | 广东省航瑞智能科技有限公司 | Multifunctional chip assembly integrated machine |
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| CN103295932A (en) * | 2012-02-29 | 2013-09-11 | 株式会社日立高新技术仪器 | Two-shaft drive mechanism and die bonder |
| CN104465413A (en) * | 2013-09-18 | 2015-03-25 | 株式会社日立高新技术仪器 | Chip sticking device |
| EP3806613A1 (en) * | 2018-06-01 | 2021-04-14 | Fuji Corporation | Component mounting machine |
| CN212184013U (en) * | 2020-05-10 | 2020-12-18 | 新乡市荣泰电器有限公司 | Charging tray installation mechanism for chip mounter |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115623697A (en) * | 2022-12-06 | 2023-01-17 | 常州铭赛机器人科技股份有限公司 | Chip mounting mechanism |
| CN117059519A (en) * | 2023-08-09 | 2023-11-14 | 广东省航瑞智能科技有限公司 | Multifunctional chip assembly integrated machine |
| CN117059519B (en) * | 2023-08-09 | 2024-04-26 | 广东省航瑞智能科技有限公司 | Multifunctional chip assembly integrated machine |
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