CN114633020B - Double-station laser processing system and processing method - Google Patents
Double-station laser processing system and processing method Download PDFInfo
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- CN114633020B CN114633020B CN202011478155.8A CN202011478155A CN114633020B CN 114633020 B CN114633020 B CN 114633020B CN 202011478155 A CN202011478155 A CN 202011478155A CN 114633020 B CN114633020 B CN 114633020B
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- 238000012545 processing Methods 0.000 title claims abstract description 117
- 238000003672 processing method Methods 0.000 title abstract description 8
- 238000012423 maintenance Methods 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims 6
- 230000009977 dual effect Effects 0.000 claims 1
- 238000007689 inspection Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005070 sampling Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 238000012790 confirmation Methods 0.000 description 2
- 244000025254 Cannabis sativa Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention belongs to the technical field of laser processing, and particularly relates to a double-station laser processing system and a processing method. The double-station laser processing system comprises a frame, a first scanning assembly, a second scanning assembly, laser processing equipment, a first guide rail, a second guide rail, a first moving table and a second moving table; the first moving table is provided with a first supporting plate for mounting a first workpiece and a second supporting plate for mounting a second workpiece at intervals; the second moving table is provided with a third supporting plate for mounting a third workpiece and a fourth supporting plate for mounting a fourth workpiece at intervals; the first guide rail and the second guide rail are arranged in parallel; the first scanning component is arranged opposite to the first guide rail; the second scanning component is arranged opposite to the second guide rail. According to the invention, the double-station laser processing system can accurately identify the product information of the workpiece under the condition that the laser processing time of the workpiece is not increased.
Description
Technical Field
The invention belongs to the technical field of laser processing, and particularly relates to a double-station laser processing system and a processing method.
Background
The quality of products is the core competitiveness of an enterprise, and the enterprise is more and more strict in managing the quality of the products. In the production process of the product, once the problem piece appears, the production enterprises cannot quickly remove the problem piece and cannot quickly trace back the reason for the problem piece. In the technical field of laser processing, particularly when batch products are produced, if the processing information of the products in the whole processing process can be traced, the occurrence of bad batch products can be greatly reduced, and the product yield is improved.
In the prior art, product processing information of a product is difficult to trace, so that the yield of the product is usually determined by manual sampling inspection, and the manual sampling inspection mode not only increases the manufacturing cost of the product, but also has the problems of low sampling inspection accuracy, low efficiency and the like.
Disclosure of Invention
The invention solves the technical problems of high cost, low accuracy and the like in the manual spot check of products in the prior art, and provides a double-station laser processing system and a processing method.
In view of the above problems, an embodiment of the present invention provides a dual-station laser processing system, including a frame, a first scanning assembly, a second scanning assembly, a laser processing apparatus, a first rail, a second rail, a first moving stage slidably mounted on the first rail, and a second moving stage slidably mounted on the second rail; the first moving table is provided with a first supporting plate for mounting a first workpiece and a second supporting plate for mounting a second workpiece at intervals; the second moving table is provided with a third supporting plate for mounting a third workpiece and a fourth supporting plate for mounting a fourth workpiece at intervals;
the first guide rail and the second guide rail are arranged in parallel; the first scanning assembly is arranged opposite to the first guide rail and is used for scanning a first workpiece or a second workpiece sliding below the first scanning assembly along the first guide rail; the second scanning assembly is arranged opposite to the second guide rail and is used for scanning a third workpiece or a fourth workpiece sliding below the second scanning assembly along the second guide rail; the laser processing device is used for carrying out laser processing on the first workpiece and the second workpiece after being scanned by the first scanning assembly and the third workpiece and the fourth workpiece after being scanned by the second scanning assembly.
Optionally, a containing box for installing the first guide rail, the second guide rail, the first scanning assembly, the second scanning assembly and the laser processing equipment is arranged on the rack; the double-station laser processing system further comprises a supporting platform, and the first scanning assembly, the second scanning assembly, the laser processing equipment, the first guide rail and the second guide rail are all installed in the accommodating box through the supporting platform.
Optionally, the center line of the first guide rail is parallel to the X axis; the first scanning assembly comprises a first connecting plate, a second connecting plate, a third connecting plate and a first scanning gun arranged on the third connecting plate; the first connecting plate is provided with first sliding grooves distributed along the Z direction, the second connecting plate is provided with second sliding grooves distributed along the X direction, and the third connecting plate is provided with first arc-shaped grooves rotating around the Y direction; the first connecting plate is connected to the frame through a first fixing piece inserted into the first chute, the second connecting plate is connected to the first connecting plate through a second fixing piece inserted into the second chute, and the third connecting plate is connected to the second connecting plate through a third fixing piece inserted into the first arc-shaped chute.
Optionally, the third connecting plate is further provided with first connecting grooves distributed along the Z direction and second connecting grooves distributed along the Z direction; the first scanning gun is mounted on the third connecting plate through a first fastening piece inserted into the first connecting groove or the second connecting groove.
Optionally, the center line of the first guide rail is parallel to the X axis; the second scanning assembly comprises a fourth connecting plate, a fifth connecting plate, a sixth connecting plate and a second scanning gun arranged on the sixth connecting plate; the fourth connecting plate is provided with third sliding grooves distributed along the Z direction, the fifth connecting plate is provided with fourth sliding grooves distributed along the X direction, and the sixth connecting plate is provided with second arc grooves rotating around the Y direction; the fourth connecting plate is connected to the frame through a fourth fixing piece inserted into the third chute, the fifth connecting plate is connected to the fourth connecting plate through a fifth fixing piece inserted into the fourth chute, and the sixth connecting plate is connected to the fifth connecting plate through a sixth fixing piece inserted into the second arc chute.
Optionally, third connecting grooves distributed along the Z direction and fourth connecting grooves distributed along the Z direction are further formed in the sixth connecting plate; the second scanning gun is mounted on the sixth connecting plate through a second fastening piece inserted into the third connecting groove or the fourth connecting groove.
Optionally, a guardrail seat is arranged at the bottom of the accommodating box, and a maintenance space is arranged on the guardrail seat; the frame also comprises a first support column and a second support column which are arranged in the maintenance space; the first support column is provided with a third arc-shaped groove rotating around the Z-axis direction, and the first scanning assembly is arranged on the first support column through a seventh fixing piece inserted into the third arc-shaped groove; the second support column is provided with a fourth arc-shaped groove rotating around the Z-axis direction, and the second scanning assembly is installed on the second support column through a seventh fixing piece inserted into the fourth arc-shaped groove.
Optionally, the rack further comprises a protective cover mounted on the containing box.
Optionally, the dual-station laser processing system further comprises a first driving member for driving the first moving stage to move along the first guide rail, and a second driving member for driving the second moving stage to move along the second guide rail.
The invention also provides a processing method of the double-station laser processing system, which comprises the following steps:
receiving a processing instruction containing the number of the workpieces to be processed, finishing the feeding of the first workpiece and the second workpiece at a feeding station of a first guide rail, and controlling a first moving table to drive the first workpiece to move to a first scanning station of a first scanning assembly along the first guide rail so as to finish scanning;
controlling the first moving table to drive a first workpiece to move from the first scanning station to a processing station of the laser processing equipment to finish laser processing, and driving a second workpiece to move to the first scanning station to finish scanning; meanwhile, when the number of the fed workpieces is not up to the number of the workpieces, finishing feeding of the third workpiece and the fourth workpiece at the feeding station of the second guide rail;
controlling the first moving table to drive a second workpiece to move from the first scanning station to the processing station to finish laser processing, and driving a third workpiece to move to a second scanning station of a second scanning assembly along a second guide rail to finish scanning;
controlling the first moving table to move to a blanking station of the first guide rail to finish blanking of a first workpiece and a second workpiece, and driving a third workpiece to move from a second scanning station to the processing station to finish laser processing by the second moving table, and simultaneously driving four workpieces to move to the second scanning station to finish scanning;
and when the fed workpieces reach the number of the workpieces, controlling a second moving table to drive the fourth workpiece to move from a second scanning station to the processing station to finish laser processing, and then confirming that the processing is finished.
In the invention, the first moving table is provided with a first supporting plate for installing a first workpiece and a second supporting plate for installing a second workpiece at intervals; the second moving table is provided with a third supporting plate for installing a third workpiece and a fourth supporting plate for installing a fourth workpiece at intervals, the first scanning assembly can complete scanning of the first workpiece and the second workpiece which move on the first guide rail, the second scanning assembly can complete laser processing of the third workpiece and the fourth workpiece which move on the second guide rail by using the same laser processing equipment, and the moving speed and the moving position of the first moving table and the second moving table are controlled to be free from increasing the laser processing time of the workpiece, so that the product information of the workpiece can be accurately identified; the sampling inspection efficiency and cost are improved, batch problem pieces are prevented from flowing into the market, and the qualification rate of products is guaranteed.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a schematic diagram of a dual-station laser processing system according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a dual-station laser processing system according to another embodiment of the present invention;
FIG. 3 is a schematic diagram of a cutting assembly of a dual-station laser processing system according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another view of a cutting assembly of a dual-station laser processing system according to an embodiment of the present invention.
Reference numerals in the specification are as follows:
1. a frame; 11. a housing box; 12. a guardrail seat; 13. a first support column; 14. a second support column; 2. a first scanning assembly; 21. a first connection plate; 22. a second connecting plate; 23. a third connecting plate; 24. a first scanning gun; 3. a second scanning assembly; 4. a laser processing device; 5. a first guide rail; 6. a second guide rail; 7. a first mobile station; 71. a first support plate; 72. a second support plate; 8. a second mobile station; 81. a third support plate; 82. a fourth support plate; 9. and supporting the platform.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects solved by the invention more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It is to be understood that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "front", "rear", "middle", etc., are based on the directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention.
As shown in fig. 1 and 2, a dual-station laser processing system according to an embodiment of the present invention includes a frame 1, a first scanning assembly 2, a second scanning assembly 3, a laser processing apparatus 4, a first rail 5, a second rail 6, a first moving stage 7 slidably mounted on the first rail 5, and a second moving stage 8 slidably mounted on the second rail 6; the first moving table 7 is provided with a first supporting plate 71 for mounting a first workpiece and a second supporting plate 72 for mounting a second workpiece at intervals; the second moving table 8 is provided with a third supporting plate 81 for mounting a third workpiece and a fourth supporting plate 82 for mounting a fourth workpiece at intervals; it can be understood that, taking the length direction of the first guide rail 5 as the X axis, the Z axis perpendicular to the X axis direction and pointing upwards, and the direction perpendicular to the Z axis and the X axis as the Y axis; the height difference of the first support plate 71, the second support plate 72, the third support plate 81 and the fourth support plate 82 in the Z direction needs to be kept within plus or minus 0.05mm, and the error of the distance in the Y direction needs to be kept within plus or minus 0.1 mm; thereby ensuring laser processing of four workpieces by one laser processing apparatus 4.
The first guide rail 5 and the second guide rail 6 are arranged in parallel; the first scanning assembly 2 is arranged opposite to the first guide rail 5, and the first scanning assembly 2 is used for scanning a first workpiece or a second workpiece sliding below the first scanning assembly 2 along the first guide rail 5; the second scanning assembly 3 is arranged opposite to the second guide rail 6, and the second scanning assembly 3 is used for scanning a third workpiece or a fourth workpiece sliding below the second scanning assembly 3 along the second guide rail 6; the laser processing apparatus 4 is configured to perform laser processing on the first and second workpieces after being scanned by the first scanning assembly 2, and the third and fourth workpieces after being scanned by the second scanning assembly 3. It will be appreciated that in the event that the first and second workpieces are moved on the first guide rail 5, the first scanning assembly 2 completes the scanning of the first and second workpieces and uploads the workpieces to the control system. Thus, the tracing and confirmation of the product information are completed. Further, in the process that the third workpiece and the fourth workpiece move on the second guide rail 6, the second scanning assembly 3 completes scanning the third workpiece and the fourth workpiece, and uploads the workpieces to the control system. Thus, the tracing and confirmation of the product information are completed. And the laser processing apparatus 4 performs laser processing on the workpieces one by one after the workpiece information is scanned.
In the present invention, the first moving table 7 is provided with a first support plate 71 for mounting a first workpiece and a second support plate 72 for mounting a second workpiece at intervals; the second moving table 8 is provided with a third supporting plate 81 for installing a third workpiece and a fourth supporting plate 82 for installing a fourth workpiece at intervals, the first scanning assembly 2 can complete scanning of the first workpiece and the second workpiece moving on the first guide rail 5, the second scanning assembly 3 can complete laser processing of the third workpiece and the fourth workpiece moving on the second guide rail 6 by using the same laser processing equipment 4, and the moving speed and the moving position of the first moving table 7 and the second moving table 8 are controlled to be free from increasing the laser processing time of the workpiece, and product information of the workpiece can be accurately identified; the sampling inspection efficiency and cost are improved, batch problem pieces are prevented from flowing into the market, and the qualification rate of products is guaranteed.
In one embodiment, as shown in fig. 1, the housing 1 is provided with a housing box 11 for mounting the first guide rail 5, the second guide rail 6, the first scanning assembly, the second scanning assembly and the laser processing apparatus 4; the dual-station laser processing system further comprises a support platform 9, and the first scanning assembly 2, the second scanning assembly 3, the laser processing device 4, the first guide rail 5 and the second guide rail 6 are all installed in the accommodating box 11 through the support platform 9. Preferably, the supporting platform 9 is a marble platform, and the supporting platform 9 and the accommodating box 11 are arranged, so that the double-station laser processing system is convenient to install and carry, and the processing precision of products is improved.
In an embodiment, as shown in fig. 2 and 3, the center line of the first guide rail 5 is parallel to the X axis; the first scanning assembly 2 comprises a first connecting plate 21, a second connecting plate 22, a third connecting plate 23 and a first scanning gun 24 mounted on the third connecting plate 23; the first connecting plate 21 is provided with first sliding grooves distributed along the Z direction, the second connecting plate 22 is provided with second sliding grooves distributed along the X direction, and the third connecting plate 23 is provided with first arc grooves rotating around the Y direction; the first connecting plate 21 is connected to the frame 1 by a first fixing member (fixing pin, bolt, etc.) inserted into the first chute, the second connecting plate 22 is connected to the first connecting plate 21 by a second fixing member (fixing pin, bolt, etc.) inserted into the second chute, and the third connecting plate is connected to the second connecting plate 22 by a third fixing member (fixing pin, bolt, etc.) inserted into the first arc-shaped chute. It will be appreciated that by adjusting the positions of the first, second and third connection plates 21, 22, 23, the first scanning gun 24 can be adjusted to face the first guide rail 5, so that the first scanning gun 24 can accurately scan the product information of the first and second products moving from the first guide rail 5. In the invention, the double-station laser processing system has the advantages of simple mechanism, low manufacturing cost and convenient adjustment.
In one embodiment, as shown in fig. 3, the third connecting plate 23 is further provided with a first connecting groove distributed along the Z direction and a second connecting groove distributed along the Z direction; the first scanning gun 24 is mounted on the sixth connection plate by a first fastener (fixing pin, bolt, etc.) inserted into the first connection groove or the second connection groove. It will be appreciated that the first scanning gun 24 can adjust the Y-direction distance and the Z-direction height on the three connection plates, thereby further improving the positioning accuracy of the first scanning gun 24.
In an embodiment, as shown in fig. 2 and 3, the center line of the first guide rail 5 is parallel to the X axis; the second scanning assembly 3 comprises a fourth connecting plate, a fifth connecting plate, a sixth connecting plate and a second scanning gun arranged on the sixth connecting plate; the fourth connecting plate is provided with third sliding grooves distributed along the Z direction, the fifth connecting plate is provided with fourth sliding grooves distributed along the X direction, and the sixth connecting plate is provided with second arc grooves rotating around the Y direction; the fourth connecting plate is connected to the frame 1 by a fourth fixing member (fixing pin, bolt, etc.) inserted into the third chute, the fifth connecting plate is connected to the fourth connecting plate by a fifth fixing member (fixing pin, bolt, etc.) inserted into the fourth chute, and the sixth connecting plate is connected to the fifth connecting plate by a sixth fixing member (fixing pin, bolt, etc.) inserted into the second arc-shaped chute. It will be appreciated that by adjusting the positions of the fourth, fifth and sixth connection plates, the second scanning gun can be adjusted to face the second guide rail 6 so that the second scanning gun can accurately scan the product information of the third and fourth products moving from the second guide rail 6. In the invention, the double-station laser processing system has the advantages of simple mechanism, low manufacturing cost and convenient adjustment.
In an embodiment, as shown in fig. 3, the sixth connecting plate is further provided with third connecting grooves distributed along the Z direction and fourth connecting grooves distributed along the Z direction; the second scanning gun is mounted on the third connection plate 23 by a second fastener fixing pin, a bolt, etc. inserted into the third connection groove or the fourth connection groove). It can be appreciated that the second scanning gun can adjust the distance in the Y direction and the height in the Z direction on the six connecting plates, so that the positioning accuracy of the second gun head is further improved.
In one embodiment, as shown in fig. 2, a guardrail seat 12 is provided at the bottom of the accommodating box 11, and a maintenance space is provided on the guardrail seat 12; the frame 1 further comprises a first support column 13 and a second support column 14 mounted in the maintenance space; the first support column 13 is provided with a third arc-shaped groove rotating around the Z-axis direction, and the first scanning assembly 2 is installed on the first support column 13 through a seventh fixing piece inserted into the third arc-shaped groove; the second support column 14 is provided with a fourth arc-shaped groove rotating around the Z-axis direction, and the second scanning component 3 is installed on the second support column 14 through a seventh fixing piece inserted into the fourth arc-shaped groove. As can be appreciated, the first scanning assembly 2 is rotated above the first guide rail 5 by rotating the first connecting plate 21 around the first support column 13 in the Z direction, and then the first scanning gun 24 is adjusted to face the first guide rail 5 by adjusting the relative positions of the first connecting plate 21, the second connecting plate 22 and the third connecting plate 23; the adjustment of the second scanning gun is identical to the adjustment of the first scanning gun 24, and will not be described again. The double-station laser processing system has the advantages of simple mechanism, low manufacturing cost and convenient adjustment. In addition, the arrangement of the guardrail seat 12 ensures the compactness of the double-station laser processing system.
In one embodiment, as shown in fig. 1, the rack 1 further comprises a protective cover mounted on the housing box 11. It will be appreciated that the maintenance grass ensures that the scanning light of the first scanning assembly 2 and the second scanning assembly 3, and the laser light emitted by the Gu Guang processing apparatus, does not leak into the environment. Thereby protecting the operator.
In an embodiment, the dual-station laser processing system further comprises a first driving member (not shown) for driving the first moving stage 7 to move along the first guide rail 5, and a second driving member (not shown) for driving the second moving stage 8 to move along the second guide rail 6. It is understood that the first and second drive members include, but are not limited to, linear motors, pneumatic cylinders, hydraulic cylinders, and lead screw nut mechanisms, among others. Preferably, the first driving member and the second driving member are linear motors, which have simple structures and can precisely control the moving distance of the first moving stage 7 and the second moving stage 8.
As shown in fig. 4, another embodiment of the present invention further provides a processing method of the above dual-station laser processing system, including:
s1, receiving a processing instruction containing the number of workpieces to be processed, finishing the feeding of the first workpiece and the second workpiece at a feeding station of a first guide rail 5, and controlling a first moving table 7 to drive the first workpiece to move to a first scanning station of a first scanning assembly 2 along the first guide rail 5 to finish scanning; specifically, after the first workpiece and the second workpiece are respectively mounted on the first supporting table and the second supporting table, the first moving table 7 moves along the first guide rail 5, and scanning of product information of the first workpiece is completed in the moving process of the first guide rail 5.
S2, controlling the first moving table 7 to drive a first workpiece to move from the first scanning station to a processing station of the laser processing equipment 4 to finish laser processing, and driving a second workpiece to move to the first scanning station to finish scanning; meanwhile, when the number of the fed workpieces is not up to the number of the workpieces, the feeding of the third workpiece and the fourth workpiece is completed at the feeding station of the second guide rail 6; specifically, when the first moving table 7 drives the first workpiece to move to the processing station of the laser processing apparatus 4, the first supporting plate 71 and the second supporting plate 72 are arranged at intervals, and at this time, the second workpiece is at the first scanning station of the first scanning assembly 2, and at this time, the second working table is at the feeding station of the second guide rail 6; after the laser processing apparatus 4 completes laser processing of the first workpiece, the first scanning assembly 2 completes scanning of the second workpiece, and completes mounting of the third workpiece and the fourth workpiece on the first support plate 71 and the second support plate 72, respectively, the first moving stage 7 and the second moving stage 8 continue to move.
S3, controlling the first moving table 7 to drive a second workpiece to move from the first scanning station to the processing station to finish laser processing, and driving a third workpiece to move to the second scanning station of the second scanning assembly 3 along the second guide rail 6 by the second moving table 8 to finish scanning; specifically, the first moving table 7 drives the scanned second workpiece to move to the processing station of the laser processing device 4, and at this time, the second moving table 8 drives the first workpiece to be at the second scanning station of the second scanning assembly; after the laser processing device 4 completes the laser processing operation on the second workpiece, and the second scanning assembly 3 completes the scanning operation on the third workpiece, the first moving table 7 and the second moving table 8 continue to move.
S4, controlling the first moving table 7 to move to a blanking station of the first guide rail 5 to finish blanking of the first workpiece and the second workpiece, and driving a third workpiece to move from a second scanning station to the processing station by the second moving table 8 to finish laser processing and simultaneously driving four workpieces to move to the second scanning station to finish scanning; specifically, the first moving table 7 moves to the blanking station of the first guide rail 5 along the first guide rail 5, the first moving table 7 drives the third workpiece to move to the processing station of the laser processing device 4, and at this time, the fourth workpiece is located at the second scanning station of the second scanning assembly 3; after the first workpiece and the second workpiece are subjected to blanking, the laser processing device 4 completes laser processing on the third workpiece, and the second scanning assembly 3 completes scanning on the fourth workpiece, the first moving table 7 moves back, and the second moving table 8 continues to move forward.
And S5, when the number of the fed workpieces reaches the number of the workpieces, controlling the second moving table 8 to drive the fourth workpiece to move from the second scanning station to the processing station to finish laser processing, and then confirming that the processing is finished. Specifically, the two moving tables drive the fourth workpiece to move to the processing station of the laser processing device 4, the first moving table 7 moves to the feeding station along the first guide rail 5, and after the laser processing device 4 completes the laser processing work on the fourth workpiece and the feeding work on the first workpiece and the second workpiece; the second workpiece moves to a blanking station of the second guide rail 6 along the second guide rail 6, and the first moving table 7 drives the first workpiece to move to a first scanning station of the first scanning assembly 2; after the corresponding work is completed at the corresponding work station, the first moving table 7 drives the first workpiece to move to the processing work station of the laser processing device 4, the second workpiece is located at the first scanning work station of the first scanning assembly 2, and the second moving table 8 moves to the feeding work station and circulates in this way.
According to the processing method, the product information of the workpiece can be accurately identified under the condition that the laser processing time of the workpiece is not increased; the sampling inspection efficiency and cost are improved, batch problem pieces are prevented from flowing into the market, and the qualification rate of products is guaranteed.
The foregoing description of the preferred embodiment of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (9)
1. A double-station laser processing system is characterized by comprising a frame, a first scanning assembly, a second scanning assembly, laser processing equipment, a first guide rail, a second guide rail, a first mobile station slidingly mounted on the first guide rail, and a second mobile station slidingly mounted on the second guide rail; the first moving table is provided with a first supporting plate for mounting a first workpiece and a second supporting plate for mounting a second workpiece at intervals; the second moving table is provided with a third supporting plate for mounting a third workpiece and a fourth supporting plate for mounting a fourth workpiece at intervals;
the first guide rail and the second guide rail are arranged in parallel; the first scanning assembly is arranged opposite to the first guide rail and is used for scanning a first workpiece or a second workpiece sliding below the first scanning assembly along the first guide rail; the second scanning assembly is arranged opposite to the second guide rail and is used for scanning a third workpiece or a fourth workpiece sliding below the second scanning assembly along the second guide rail; the laser processing device is used for carrying out laser processing on the first workpiece and the second workpiece after being scanned by the first scanning assembly and the third workpiece and the fourth workpiece after being scanned by the second scanning assembly;
receiving a processing instruction containing the number of the workpieces to be processed, finishing the feeding of the first workpiece and the second workpiece at a feeding station of a first guide rail, and controlling a first moving table to drive the first workpiece to move to a first scanning station of a first scanning assembly along the first guide rail so as to finish scanning;
controlling the first moving table to drive a first workpiece to move from the first scanning station to a processing station of the laser processing equipment to finish laser processing, and driving a second workpiece to move to the first scanning station to finish scanning; meanwhile, when the number of the fed workpieces is not up to the number of the workpieces, finishing feeding of the third workpiece and the fourth workpiece at the feeding station of the second guide rail;
controlling the first moving table to drive a second workpiece to move from the first scanning station to the processing station to finish laser processing, and driving a third workpiece to move to a second scanning station of a second scanning assembly along a second guide rail to finish scanning;
controlling the first moving table to move to a blanking station of the first guide rail to finish blanking of a first workpiece and a second workpiece, and driving a third workpiece to move from a second scanning station to the processing station to finish laser processing and driving a fourth workpiece to move to the second scanning station to finish scanning;
controlling a second moving table to drive the fourth workpiece to move from a second scanning station to the processing station to finish laser processing; simultaneously controlling the first moving table to move to a feeding station along the first guide rail and finishing feeding of the first workpiece and the second workpiece;
controlling the third workpiece to move to a blanking station of the second guide rail along the second guide rail, and simultaneously controlling the first moving table to drive the first workpiece to move to a first scanning station of the first scanning assembly;
the first moving table is controlled to drive the first workpiece to move to a processing station of the laser processing equipment, the second workpiece is positioned at a first scanning station of the first scanning assembly, and the second moving table is controlled to move to a feeding station and circulate.
2. The dual-station laser machining system according to claim 1, wherein a housing box for mounting the first guide rail, the second guide rail, the first scanning assembly, the second scanning assembly and the laser machining equipment is arranged on the rack; the double-station laser processing system further comprises a supporting platform, and the first scanning assembly, the second scanning assembly, the laser processing equipment, the first guide rail and the second guide rail are all installed in the accommodating box through the supporting platform.
3. The dual-station laser machining system of claim 1, wherein a centerline of the first rail is parallel to the X-axis; the first scanning assembly comprises a first connecting plate, a second connecting plate, a third connecting plate and a first scanning gun arranged on the third connecting plate; the first connecting plate is provided with first sliding grooves distributed along the Z direction, the second connecting plate is provided with second sliding grooves distributed along the X direction, and the third connecting plate is provided with first arc-shaped grooves rotating around the Y direction; the first connecting plate is connected to the frame through a first fixing piece inserted into the first chute, the second connecting plate is connected to the first connecting plate through a second fixing piece inserted into the second chute, and the third connecting plate is connected to the second connecting plate through a third fixing piece inserted into the first arc-shaped chute.
4. The double-station laser processing system according to claim 3, wherein the third connecting plate is further provided with first connecting grooves distributed along the Z direction and second connecting grooves distributed along the Z direction; the first scanning gun is mounted on the third connecting plate through a first fastening piece inserted into the first connecting groove or the second connecting groove.
5. The dual-station laser machining system of claim 1, wherein a centerline of the first rail is parallel to the X-axis; the second scanning assembly comprises a fourth connecting plate, a fifth connecting plate, a sixth connecting plate and a second scanning gun arranged on the sixth connecting plate; the fourth connecting plate is provided with third sliding grooves distributed along the Z direction, the fifth connecting plate is provided with fourth sliding grooves distributed along the X direction, and the sixth connecting plate is provided with second arc grooves rotating around the Y direction; the fourth connecting plate is connected to the frame through a fourth fixing piece inserted into the third chute, the fifth connecting plate is connected to the fourth connecting plate through a fifth fixing piece inserted into the fourth chute, and the sixth connecting plate is connected to the fifth connecting plate through a sixth fixing piece inserted into the second arc chute.
6. The double-station laser processing system according to claim 5, wherein the sixth connecting plate is further provided with third connecting grooves distributed along the Z direction and fourth connecting grooves distributed along the Z direction; the second scanning gun is mounted on the sixth connecting plate through a second fastening piece inserted into the third connecting groove or the fourth connecting groove.
7. The double-station laser processing system according to claim 2, wherein a guardrail seat is arranged at the bottom of the accommodating box, and a maintenance space is arranged on the guardrail seat; the frame also comprises a first support column and a second support column which are arranged in the maintenance space; the first support column is provided with a third arc-shaped groove rotating around the Z-axis direction, and the first scanning assembly is arranged on the first support column through a seventh fixing piece inserted into the third arc-shaped groove; the second support column is provided with a fourth arc-shaped groove rotating around the Z-axis direction, and the second scanning assembly is installed on the second support column through a seventh fixing piece inserted into the fourth arc-shaped groove.
8. The dual station laser machining system of claim 2, wherein the frame further comprises a protective cover mounted on the containment box.
9. The dual-station laser machining system of claim 1, further comprising a first drive for driving the first mobile station along the first rail and a second drive for driving the second mobile station along the second rail.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201109031Y (en) * | 2007-10-12 | 2008-09-03 | 深圳市大族激光科技股份有限公司 | Double-station moving platform |
| CN205904585U (en) * | 2016-07-01 | 2017-01-25 | 大族激光科技产业集团股份有限公司 | Duplex position laser cutting equipment |
| CN107902193A (en) * | 2017-11-22 | 2018-04-13 | 广东金弘达自动化科技股份有限公司 | A kind of sweep mechanism applied to labeller |
| CN208314790U (en) * | 2018-04-10 | 2019-01-01 | 深圳正实激光科技有限公司 | A kind of adjustment device |
| CN211966329U (en) * | 2020-04-21 | 2020-11-20 | 深圳市斯普莱特激光科技有限公司 | Duplex position double-end 3D radium carving machine |
-
2020
- 2020-12-15 CN CN202011478155.8A patent/CN114633020B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201109031Y (en) * | 2007-10-12 | 2008-09-03 | 深圳市大族激光科技股份有限公司 | Double-station moving platform |
| CN205904585U (en) * | 2016-07-01 | 2017-01-25 | 大族激光科技产业集团股份有限公司 | Duplex position laser cutting equipment |
| CN107902193A (en) * | 2017-11-22 | 2018-04-13 | 广东金弘达自动化科技股份有限公司 | A kind of sweep mechanism applied to labeller |
| CN208314790U (en) * | 2018-04-10 | 2019-01-01 | 深圳正实激光科技有限公司 | A kind of adjustment device |
| CN211966329U (en) * | 2020-04-21 | 2020-11-20 | 深圳市斯普莱特激光科技有限公司 | Duplex position double-end 3D radium carving machine |
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