CN114621828A - 一种ic载板通孔填埋用除油剂及其制备方法 - Google Patents
一种ic载板通孔填埋用除油剂及其制备方法 Download PDFInfo
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- ester
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- 238000005237 degreasing agent Methods 0.000 title claims description 12
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- 235000014113 dietary fatty acids Nutrition 0.000 claims description 30
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- 229930195729 fatty acid Natural products 0.000 claims description 30
- 229910019142 PO4 Inorganic materials 0.000 claims description 28
- 239000010452 phosphate Substances 0.000 claims description 28
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- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 11
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 11
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- 150000004665 fatty acids Chemical class 0.000 claims description 10
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- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 8
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 6
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- 230000000149 penetrating effect Effects 0.000 claims description 6
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 6
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- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims description 3
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- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 3
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- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 3
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 3
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- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 3
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- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 claims description 3
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
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- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 2
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- 229910021645 metal ion Inorganic materials 0.000 description 2
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- GIAFURWZWWWBQT-UHFFFAOYSA-N 2-(2-aminoethoxy)ethanol Chemical compound NCCOCCO GIAFURWZWWWBQT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
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- 238000013329 compounding Methods 0.000 description 1
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- 230000003588 decontaminative effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
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- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 230000007794 irritation Effects 0.000 description 1
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- 238000005272 metallurgy Methods 0.000 description 1
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- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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Classifications
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D1/83—Mixtures of non-ionic with anionic compounds
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- C11D3/02—Inorganic compounds ; Elemental compounds
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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Abstract
本发明提供了一种IC载板通孔填埋用除油剂及其制备方法，所述除油剂包括阴离子表面活性剂、非离子表面活性剂、助剂、去离子水。本发明各种成分之间的复配使用，提高了除油剂的稳定性和去污能力，并减少了对IC载板的腐蚀性能，本发明公开的除油剂，制备工艺简单，可生物降解性好，绿色环保。
Description
技术领域
本发明涉及表面处理剂领域，具体涉及一种IC载板通孔填埋用除油剂及其制备方法。
背景技术
IC载板又称IC封装载板，是用于集成电路的一种关键材料，主要起到保护芯片并作为芯片与外界传输口的作用。目前，IC载板通孔填埋常见的是镀铜填埋和树脂填埋，但是不论是通过镀铜填埋还是树脂填埋，为了达到填埋后通孔平整的效果，在填埋前需要去除IC载板通孔和IC载板上附着的油污。然而，目前常用的酸性除油剂容易对IC载板产生腐蚀作用，导致通孔填埋出现毛边、镀层不均匀等问题。
发明内容
为了解决上述技术问题，本发明第一个方面提供了一种IC载板通孔填埋用除油剂，原料按质量百分比计，包括阴离子表面活性剂15-30％、非离子表面活性剂5-10％、助剂1-10％、溶剂补充余量。
优选的，所述阴离子表面活性剂包括烷基硫酸酯、烷基磺酸酯、脂肪酸、磷酸酯中的至少一种。
优选的，所述磷酸酯盐包括烷基磷酸酯、脂肪醇磷酸酯、烷基聚氧乙烯醚磷酸酯中的至少一种。
优选的，所述非离子表面活性剂包括脂肪酸聚氧乙烯酯、多元醇酯、烷醇酰胺酯中的至少一种。
优选的，所述多元醇酯包括失水山梨醇脂肪酸酯、山梨醇脂肪酸酯中的至少一种。
优选的，所述助剂包括乳化剂、渗透剂、缓蚀剂。
优选的，所述缓蚀剂包括苯甲酸类，钼酸盐，醇胺，多环胺、苯并三氮唑中的至少一种。
优选的，所述乳化剂包括碳酸钠、磷酸钠、硅酸钠、无水偏硅酸钠、柠檬酸钠、乙二胺四乙酸四钠中的至少一种。
优选的，所述渗透剂包括二乙二醇乙醚、二丙二醇、异丙醇中的至少一种。
本发明第二个方面提供了一种IC载板通孔填埋用除油剂的制备方法，将助剂加入反应器内，加入去离子水，搅拌均匀，加入阴离子表面活性剂和非离子表面活性剂，搅拌均匀，得到所述除油剂。
与现有技术相比，本发明的有益效果：
1.本发明通过磷酸酯、脂肪酸聚氧乙烯酯、多元醇酯的复配，降低了除油剂的起泡性，提高了除油剂的去污能力，加入的醇胺类物质，提高了磷酸酯、脂肪酸聚氧乙烯酯、多元醇酯等的分散性和相容性，提高了除油剂的稳定性，并且结合加入的磷酸盐在本体系中金属离子反应，生成溶解度较低的磷酸金属盐，减小IC载板的腐蚀效果。
2.本发明提供的除油剂及其制备方法，制备工艺简单，除油剂可生物降解性好，绿色环保，可以很好的应用于电镀、冶金、化工等领域。
具体实施方式
为了解决上述技术问题，本发明第一个方面提供了一种IC载板通孔填埋用除油剂，原料按质量百分比计，包括阴离子表面活性剂15-30％、非离子表面活性剂5-10％、助剂1-10％、溶剂补充余量。
优选的，所述阴离子表面活性剂包括烷基硫酸酯、烷基磺酸酯、脂肪酸酯、磷酸酯中的至少一种。
优选的，所述磷酸酯包括烷基磷酸酯、脂肪醇磷酸酯、烷基聚氧乙烯醚磷酸酯中的至少一种。
优选的，所述脂肪醇磷酸酯包括异辛醇磷酸酯、单月桂基磷酸酯、十六十八醇磷酸酯中的至少一种。
优选的，所述脂肪醇磷酸酯包括异辛醇磷酸酯、单月桂基磷酸酯中的至少一种。
优选的，所述烷基聚氧乙烯醚磷酸酯包括异辛醇聚氧乙烯醚磷酸酯、月桂醇聚氧乙烯醚磷酸、十八烷基聚氧乙烯醚磷酸酯中的至少一种。
磷酸酯阴离子表面活性剂是由脂肪醇、脂肪醇聚氧乙烯醚等亲油性物质与磷酸化试剂反应生产，具有良好的润湿、乳化、增溶的特性，刺激性较低。
优选的，所述非离子表面活性剂包括脂肪酸聚氧乙烯酯、多元醇酯、烷醇酰胺酯中的至少一种。
优选的，所述脂肪酸聚氧乙烯酯为环氧乙烯聚合度为10-15的脂肪酸聚氧乙烯酯。
脂肪酸聚氧乙烯酯是脂肪酸与环氧乙烷在催化剂存在下进行加成反应生成，环氧乙烷的聚合度会影响脂肪酸聚氧乙烯酯的去污能力和乳化能力。
优选的，所述多元醇酯包括失水山梨醇脂肪酸酯、山梨醇脂肪酸酯中的至少一种。
优选的，所述助剂包括缓蚀剂、乳化剂、渗透剂。
优选的，所述缓蚀剂包括苯甲酸类，钼酸盐，醇胺，多环胺、苯并三氮唑中的至少一种。
优选的，所述醇胺包括三乙醇胺、单乙醇胺、二甘醇胺中的至少一种。
优选的，所述乳化剂包括碳酸钠、磷酸钠、硅酸钠、无水偏硅酸钠、柠檬酸钠、乙二胺四乙酸四钠中的至少一种。
优选的，所述渗透剂包括二乙二醇乙醚、二丙二醇、异丙醇中的至少一种。
优选的，所述缓蚀剂、乳化剂、渗透剂的质量比为1：(0.5-0.8)：(0.2-0.5)。
优选的，所述原料按质量百分比计包括，阴离子表面活性剂15-30％、非离子表面活性剂5-10％，渗透剂0.1-3％，乳化剂0.1-2％，缓蚀剂1-5％，去离子水补充余量。
本发明采用阴离子表面活性剂和非离子表面活性剂复配使用，提高了除油剂的去污能力，降低了除油剂使用过程中的起泡率，但是加入了阴离子表面活性剂和非离子表面活性剂的除油剂的使用过程相容性降低。发明人发现，在本体系中加入缓蚀剂、乳化剂、渗透剂，可以提高除油剂的稳定性，较少在除油过程中对IC载板的腐蚀，并且当缓蚀剂、乳化剂、渗透剂的质量比为1：(0.3-0.7)：(0.2-0.5)时效果最好。发明人推测可能的原因是，缓蚀剂、乳化剂、渗透剂的加入增加了体系中的亲水性基团，亲水性基团与阴离子表面活性剂或非离子表面活性剂结合，促进了其在本体系中的分散性和稳定性，并且加入的助剂还可以络合金属离子或与金属离子反应，在IC载板表面形成保护层，减小IC载板的腐蚀效果。
本发明第二个方面提供了一种IC载板通孔填埋用除油剂的制备方法，将助剂加入反应器内，加入去离子水，搅拌均匀，加入阴离子表面活性剂和非离子表面活性剂，搅拌均匀，得到所述除油剂。
下面通过实施例对本发明进行具体描述。有必要在此指出的是，以下实施例只用于对本发明作进一步说明，不能理解为对本发明保护范围的限制，该领域的专业技术人员根据上述本发明的内容做出的一些非本质的改进和调整，仍属于本发明的保护范围。
实施例1
提供了一种IC载板通孔填埋用除油剂，原料包括：10％的单月桂基磷酸酯，8％月桂醇聚氧乙烯醚磷酸酯，5％的脂肪酸聚氧乙烯酯，2％失水山梨醇脂肪酸酯，3％三乙醇胺，1.5％磷酸钠，1％二丙二醇，去离子水补充余量。
其中单月桂基磷酸酯，购买自广州市雨露化工有限公司。
月桂醇聚氧乙烯醚磷酸酯，购买自江苏省海安石油化工厂。
脂肪酸聚氧乙烯酯，购买自湖北科沃得化工有限公司。
失水山梨醇脂肪酸酯，购买自江苏省海安石油化工厂。
提供了一种IC载板通孔填埋用除油剂的制备方法，将三乙醇胺，磷酸钠，二丙二醇，去离子水加入反应器内，搅拌均匀，加入单月桂基磷酸酯、月桂醇聚氧乙烯醚磷酸酯、脂肪酸聚氧乙烯酯、失水山梨醇脂肪酸酯，搅拌均匀，得到所述除油剂。
实施例2
提供了一种IC载板通孔填埋用除油剂，原料包括：8％的异辛醇磷酸酯，12％异辛醇聚氧乙烯醚磷酸酯，6％的脂肪酸聚氧乙烯酯，3％失水山梨醇脂肪酸酯，3％单乙醇胺，1.8％磷酸钠，0.8％异丙醇，去离子水补充余量。
提供了一种IC载板通孔填埋用除油剂的制备方法，将单乙醇胺，磷酸钠，异丙醇，去离子水加入反应器内，搅拌均匀，加入单月桂基磷酸酯、月桂醇聚氧乙烯醚磷酸酯、脂肪酸聚氧乙烯酯、失水山梨醇脂肪酸酯，搅拌均匀，得到所述除油剂。
对比例1
提供了一种IC载板通孔填埋用除油剂，还提供了一种IC载板通孔填埋用除油剂的制备方法，具体实施方式同实施例1，不同点在于，所述磷酸钠的质量百分数为5％，二丙二醇的质量百分数为2％。
对比例2
提供了一种IC载板通孔填埋用除油剂，还提供了一种IC载板通孔填埋用除油剂的制备方法，具体实施方式同实施例1，不同点在于，所述三乙醇胺的质量百分数为1％。
对比例3
提供了一种IC载板通孔填埋用除油剂，还提供了一种IC载板通孔填埋用除油剂的制备方法，具体实施方式同实施例1，不同点在于，所述脂肪酸聚氧乙烯酯的环氧乙烯聚合度为6。
对比例4
提供了一种IC载板通孔填埋用除油剂，还提供了一种IC载板通孔填埋用除油剂的制备方法，具体实施方式同实施例1，不同点在于，不加入阴离子表面活性剂。
对比例5
提供了一种IC载板通孔填埋用除油剂，还提供了一种IC载板通孔填埋用除油剂的制备方法，具体实施方式同实施例1，不同点在于，不加入非离子表面活性剂。
对比例6
提供了一种IC载板通孔填埋用除油剂，还提供了一种IC载板通孔填埋用除油剂的制备方法，具体实施方式同实施例1，不同点在于，不加入乳化剂。
对比例7
提供了一种IC载板通孔填埋用除油剂，还提供了一种IC载板通孔填埋用除油剂的制备方法，具体实施方式同实施例1，不同点在于，不加入缓蚀剂。
对比例8
提供了一种IC载板通孔填埋用除油剂，还提供了一种IC载板通孔填埋用除油剂的制备方法，具体实施方式同实施例1，不同点在于，不加入渗透剂。
性能测试
稳定性测试：
将实施例和对比例制得的除油剂放置于85℃条件下，放置3天，观察是否出现变质，当除油剂出现分层、析出、沉淀、起泡等现象，都属于除油剂变质。除油效果测试：
参考JB/T4323.2-1999的测试方式，将粘有油污的工件放入实施例或对比例制得的除油剂中，60℃下浸泡10min，取出工件，烘干，计算除油率。
除油率的计算公式如下：
除油率％＝[(M1-M2)/(M1-M0)]*100％
其中，M0为洁净的工件的质量；M1为粘有油污的工件的质量；M2为除油并烘干后工件的质量。
腐蚀性测试：
将洁净的工件分别放置于实施例和对比例制得的除油剂中，60℃下浸泡10min，取出工件，烘干，称重，根据损失的重量，计算腐蚀率。
腐蚀率的计算公式如下：
腐蚀率％＝[(M0-M1)/M0]*100％
其中，M0为洁净的工件的质量；M1为腐蚀后工件的质量。
表1
| 稳定性 | 除油效果％ | 腐蚀率％ | |
| 实施例1 | 未变质 | 95 | 0.3 |
| 实施例2 | 未变质 | 93 | 0.3 |
| 对比例1 | 未变质 | 89 | 1.2 |
| 对比例2 | 未变质 | 84 | 0.9 |
| 对比例3 | 未变质 | 81 | 0.8 |
| 对比例4 | 变质 | 79 | 0.8 |
| 对比例5 | 未变质 | 76 | 0.9 |
| 对比例6 | 变质 | 85 | 0.4 |
| 对比例7 | 变质 | 75 | 0.8 |
| 对比例8 | 变质 | 76 | 0.6 |
以上所述，仅是本发明的较佳实施例而已，并非是对发明作其他形式的限制，任何熟悉本专业的技术人员可能利用上述揭示的技术内容加以变更或更改为等同变化的等效实施例，但是凡是未脱离本发明技术方案内容，依据本发明的技术实质对以上实施例所作的任何简单修改，等同变化与改型，仍属于本发明技术方案的保护范围。
Claims (10)
1.一种IC载板通孔填埋用除油剂，其特征在于，原料按质量百分数计包括：阴离子表面活性剂15-30％、非离子表面活性剂5-10％、助剂1-10％、去离子水补充余量。
2.根据权利要求1所述的除油剂，其特征在于，所述阴离子表面活性剂包括烷基硫酸酯、烷基磺酸酯、脂肪酸、磷酸酯中的至少一种。
3.根据权利要求2所述的除油剂，其特征在于，所述磷酸酯盐包括烷基磷酸酯、脂肪醇磷酸酯、烷基聚氧乙烯醚磷酸酯中的至少一种。
4.根据权利要求1所述的除油剂，其特征在于，所述非离子表面活性剂包括脂肪酸聚氧乙烯酯、多元醇酯、烷醇酰胺酯中的至少一种。
5.根据权利要求4所述的除油剂，其特征在于，所述多元醇酯包括失水山梨醇脂肪酸酯、山梨醇脂肪酸酯中的至少一种。
6.根据权利要求1所述的除油剂，其特征在于，所述助剂包括乳化剂、渗透剂、缓蚀剂。
7.根据权利要求6所述的除油剂，其特征在于，所述缓蚀剂包括苯甲酸类，钼酸盐，醇胺，多环胺、苯并三氮唑中的至少一种。
8.根据权利要求6所述的除油剂，其特征在于，所述乳化剂包括碳酸钠、磷酸钠、硅酸钠、无水偏硅酸钠、柠檬酸钠、乙二胺四乙酸四钠中的至少一种。
9.根据权利要求6所述的除油剂，其特征在于，所述渗透剂包括二乙二醇乙醚、二丙二醇、异丙醇中的至少一种。
10.一种根据权利要求1所述的除油剂的制备方法，其特征在于，将助剂加入反应器内，加入去离子水，搅拌均匀，加入阴离子表面活性剂和非离子表面活性剂，搅拌均匀，得到所述除油剂。
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| CN111074285A (zh) * | 2019-12-30 | 2020-04-28 | 广东省焊接技术研究所（广东省中乌研究院） | 一种金属除油剂及其制备方法 |
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| CN115198279A (zh) * | 2022-08-11 | 2022-10-18 | 深圳市板明科技股份有限公司 | 一种适用于ic载板闪蚀方法的除油剂及其应用 |
| CN115198279B (zh) * | 2022-08-11 | 2023-09-19 | 深圳市板明科技股份有限公司 | 一种适用于ic载板闪蚀方法的除油剂及其应用 |
| CN115522389A (zh) * | 2022-10-13 | 2022-12-27 | 杭州胤众科技有限公司 | 一种印染加工用乳化除油剂 |
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