CN114621498A - Fine controllable heat transfer body with shape memory characteristic and preparation method and application thereof - Google Patents
Fine controllable heat transfer body with shape memory characteristic and preparation method and application thereof Download PDFInfo
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Abstract
A fine controllable heat transfer body with shape memory characteristic and a preparation method and application thereof belong to the technical field of heat conduction, and the specific scheme is as follows: the fine controllable heat transfer body comprises a liquid metal and a deformable substrate, wherein the deformable substrate has shape memory characteristics, and the liquid metal is compounded on the skeleton surface of the deformable substrate and bonded on the deformable substrate through chemical bonds. The invention takes epoxy resin modified polyurethane sponge with shape memory property as a deformable matrix for thermal response stimulation, compounds low-melting-point liquid metal on the surface of a deformable matrix skeleton, and regulates and controls the aggregation state of the liquid metal in pores of the deformable matrix by changing the compressibility of the deformable matrix, thereby regulating the connection state of a heat conduction path. The invention accurately controls the deformation of the sponge matrix to control the state of the liquid metal heat conduction path, thereby meeting the requirement of fine regulation and control of temperature change, and the prepared fine controllable heat transfer body has the infrared signal counterfeiting and infrared stealth functions.
Description
Technical Field
The invention belongs to the technical field of heat conduction, and particularly relates to a fine controllable heat transfer body with shape memory characteristics, and a preparation method and application thereof.
Background
Thermal management is the process of regulating and controlling the temperature or temperature difference of a specific object by heating or cooling means according to the requirements of the specific object. Due to the increasing development and popularization of electronic components and wearable equipment, the fine regulation and control degree of heat transfer is also required to be higher. The deformable material can change the heat transfer performance of the material along with the difference of deformation amount, can be used in the aspect of thermal management application, and has attracted the extensive attention of researchers. The heat transfer capacity of the deformable material made of a single material is small in change in the deformation process, the effect of regulating and controlling the heat transfer capacity in a large range cannot be achieved, the capacity of regulating and controlling the heat transfer capacity of the material can be improved by introducing Liquid Metal (LM) with the heat conduction capacity, but the shape of the deformable material can be fixed only by maintaining the effect of force, and the accurate controllable heat transfer capacity of the deformable material is limited.
Disclosure of Invention
The first purpose of the invention is to solve the problem that the prior art can not accurately regulate and control heat transfer, and provide a fine controllable heat transfer body with shape memory property.
It is a second object of the present invention to provide a method for preparing a finely controllable heat transfer body having shape memory properties.
A third object of the invention is to provide the use of a finely controllable heat-transferring body with shape memory properties.
In order to achieve the purpose, the invention adopts the following technical scheme:
a fine controllable heat transfer body with shape memory property comprises a liquid metal and a deformable substrate, wherein the deformable substrate has the shape memory property, the deformable substrate is a porous framework structure, pores are communicated with one another, and the liquid metal is compounded on the surface of the framework of the deformable substrate and bonded on the deformable substrate through chemical bonds.
Further, the deformable matrix is polyurethane sponge modified by epoxy resin.
Further, the mass ratio of the liquid metal to the deformable matrix is 0.1: 1-1: 1.
Further, the type of the epoxy resin is E-51, and the type of the epoxy resin is one or a combination of E-44.
Further, the liquid metal is a liquid metal having a melting point of 8 ℃, 10.5 ℃, 11.5 ℃, 12 ℃, 15.7 ℃, 18 ℃, 25 ℃, 29.8 ℃ or 47 ℃.
Further, the liquid metal is connected with the deformable matrix through a chemical bond in a silane coupling agent, and the silane coupling agent is one or a combination of two of 3-mercaptopropyltriethoxysilane and 3-mercaptopropyltrimethoxysilane.
A method for preparing the fine controllable heat transfer body with the shape memory characteristic comprises the following steps:
soaking polyurethane sponge in a mixture of epoxy resin and a curing agent which are uniformly mixed, extruding redundant mixture, vacuumizing, and heating and curing at 60-150 ℃ for 2-12 hours;
step two, repeating the step one for 1-3 times to obtain a deformable substrate with shape memory characteristics;
and step three, dispersing the liquid metal in an ethanol solution, adding a silane coupling agent to obtain an ethanol dispersion liquid of the liquid metal modified by the silane coupling agent, soaking the deformable matrix with the shape memory characteristic obtained in the step two in the ethanol dispersion liquid of the liquid metal modified by the silane coupling agent, taking out the deformable matrix and drying the deformable matrix at the temperature of 40-60 ℃ for 2-6 hours to obtain the fine controllable heat transfer body.
Further, in the first step, the mass ratio of the epoxy resin to the curing agent is 1: 0.1-1: 0.5, and the curing agent is one or a combination of more of n-octylamine, dodecylamine, m-xylylenediamine, polyetheramine D230, polyetheramine D400, diaminodiphenyl sulfone and isophorone diamine; in the third step, the mass volume ratio of the liquid metal, the ethanol and the silane coupling agent is 1g to 10ml to 10-40 mu L.
The application of the fine controllable heat transfer body with the shape memory characteristic is characterized in that the heat conductivity coefficient of the fine controllable heat transfer body with the shape memory characteristic can be changed along with the compression of the fine controllable heat transfer body, and the fine control of the heat conductivity coefficient of the fine controllable heat transfer body is realized by precisely controlling the compression rate of the fine controllable heat transfer body; meanwhile, based on the shape memory characteristic, the fine controllable heat transfer body can reversibly obtain a temporary shape with any compression ratio, and the fine controllable heat transfer body can realize fine and reversible regulation and control of heat transfer capacity corresponding to different connection states of the liquid metal heat conduction path.
When the fine controllable heat transfer body with the shape memory characteristic is in an uncompressed deformation state, the fine controllable heat transfer body is in a heat insulation state, and infrared stealth is realized; when the compression ratio is gradually improved, the heat transfer capacity is also gradually improved, and the infrared stealth is relieved;
or, the local deformation of the fine controllable heat transfer body is controlled, the heat signals in different shapes are selectively displayed, and the function of forging infrared signals is realized;
or based on the shape memory characteristic, the fine controllable heat transfer body is shaped repeatedly, and different fake infrared signals are displayed or the fake signals are removed.
Compared with the prior art, the invention has the beneficial effects that:
in order to achieve the purpose of finely regulating and controlling the heat transfer performance, the invention takes epoxy resin modified polyurethane sponge (EP/PU) with shape memory property as a deformable matrix for thermal response stimulation, liquid metal is compounded on the surface of the deformable matrix framework, and based on the shape memory property of the deformable matrix, the deformation of the deformable matrix can be accurately controlled to control the state of an LM heat conduction channel, so as to meet the requirement of finely regulating and controlling the heat transfer performance. The heat conductivity coefficient of the fine controllable heat transfer body with the shape memory characteristic can be changed along with the compression of the fine controllable heat transfer body, the fine and reversible regulation and control of the heat conductivity coefficient of the fine controllable heat transfer body can be realized by accurately controlling the compression rate of the fine controllable heat transfer body, and the regulation and control precision can reach 0.05-0.1W/m.K. Meanwhile, the material has the capability of circularly regulating and controlling the heat transfer performance due to good shape memory characteristics, and various different heat conductivity coefficients can be repeatedly obtained by using a single material. Moreover, due to the capability of finely regulating and controlling the heat transfer performance of the material, the material also has the infrared signal counterfeiting and infrared stealth functions, has the heat insulation capability when the deformation quantity is low, achieves the infrared stealth effect, and can control the switch through the compression rate based on the shape memory characteristic. The infrared sensor can also be locally deformed to selectively display different thermal signals, thereby achieving the effect of forging infrared signals. Meanwhile, the same material is shaped repeatedly based on the shape memory performance, and different forged infrared signals can be displayed or removed.
Drawings
FIG. 1 is a graph showing a variation of thermal conductivity ratio values between different compression states and an initial state when a mass ratio of the liquid metal to the deformable substrate is 1: 1;
FIG. 2 is a schematic view of thermal imaging of a fine controllable heat transfer body prepared for the second embodiment, a being a schematic view of infrared stealth thermal imaging; b is a schematic diagram of infrared camouflage thermal imaging;
FIG. 3 is a schematic diagram of a temperature testing method;
in the figure, 1, an infrared imager, 2, a fine controllable heat transfer body, 3 and a heating table.
Detailed Description
The technical solution of the present invention is further described below with reference to the accompanying drawings, but not limited thereto, and any modification or equivalent replacement of the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention shall be covered by the protection scope of the present invention.
Detailed description of the invention
A fine controllable heat transfer body with shape memory property comprises a liquid metal and a deformable substrate, wherein the deformable substrate has the shape memory property, the deformable substrate is a porous framework structure, pores are communicated with one another, and the liquid metal is compounded on the surface of the framework of the deformable substrate and bonded on the deformable substrate through chemical bonds.
Further, the deformable matrix is polyurethane sponge modified by epoxy resin, and the polyurethane sponge is a commercial product.
Further, the mass ratio of the liquid metal to the deformable matrix is 0.1: 1-1: 1.
Further, the type of the epoxy resin is E-51, and the type of the epoxy resin is one or a combination of E-44.
Further, the liquid metal is a liquid metal having a melting point of 8 ℃, 10.5 ℃, 11.5 ℃, 12 ℃, 15.7 ℃, 18 ℃, 25 ℃, 29.8 ℃ or 47 ℃.
Further, the liquid metal is connected to the deformable substrate through a chemical bond in the silane coupling agent.
Further, the silane coupling agent is one or the combination of two of 3-mercaptopropyltriethoxysilane and 3-mercaptopropyltrimethoxysilane.
Detailed description of the invention
One embodiment of the present invention provides a method for preparing a fine controllable heat transfer body having shape memory characteristics, comprising the steps of:
firstly, putting polyurethane sponge into ethanol for ultrasonic cleaning, soaking the cleaned polyurethane sponge into a mixture of epoxy resin and a curing agent which are uniformly mixed, then extruding redundant mixture, vacuumizing, and heating and curing for 2-12 hours at the temperature of 60-150 ℃;
step two, repeating the step one for 1-3 times to obtain a deformable substrate with shape memory characteristics;
dispersing 5g of liquid metal in 50mL of ethanol, adding 50-200 mu L of silane coupling agent, performing ultrasonic dispersion for 5-60 min to obtain an ethanol dispersion liquid of the liquid metal modified by the silane coupling agent Si-OH, soaking the deformable matrix with the shape memory property obtained in the step two in the ethanol dispersion liquid of the liquid metal modified by the silane coupling agent, taking out the deformable matrix after 1min, and drying the deformable matrix at the temperature of 40-60 ℃ for 2-6 h to obtain the fine controllable heat transfer body.
Further, in the first step, the mass ratio of the epoxy resin to the curing agent is 1: 0.1-1: 0.5.
Furthermore, the mass volume ratio of the liquid metal, the ethanol and the silane coupling agent is 1g to 10ml to 10-40 mu L.
Further, the curing agent is one or a combination of more of n-octylamine, dodecylamine, m-xylylenediamine, polyetheramine D230, polyetheramine D400, diaminodiphenyl sulfone and isophorone diamine.
Further, in the third step, the obtained fine controllable heat transfer body is repeatedly soaked in the ethanol dispersion liquid of the liquid metal modified by the silane coupling agent, taken out, and dried for 2-6 hours at the temperature of 40-60 ℃, so that the fine controllable heat transfer body containing the liquid metal with different mass fractions can be obtained.
Detailed description of the invention
The application of the fine controllable heat transfer body with shape memory property described in the first embodiment utilizes the shape memory property of the deformable substrate and the heat conduction property of the liquid metal, controls the temperature change of the fine controllable heat transfer body during heating by controlling the deformation amount of the deformable substrate, the deformable substrate is in an initial state of an uncompressed state, the size of the uncompressed state can be in a range of 1 × 1 × 0.2cm to 20 × 20 × 2cm, and the thickness of the deformable substrate is h0The thickness of the deformable matrix after compression is h, and the compression ratio of the deformable matrix is h/h0X 100%, when the compressibility of the deformable base is 0%, the finely controllable heat transfer body is in an insulated state, and the heat transfer rate of the finely controllable heat transfer body increases as the compressibility increases (from 0% to 80%). The thickness of the deformable substrate is changed by heating recovery or compression, so that the heat transfer state of the fine controllable heat transfer body can be changed, and the purpose of fine regulation and control of heat transfer is achieved.
When the liquid metal accounts for 50% of the mass fraction of the fine controllable heat transfer body, the compressibility of the same controllable heat transfer body is increased from 0% to 80%, the thermal conductivity of the fine controllable heat transfer body is increased from 0.10W/(m.K) to 0.51W/(m.K), the same fine controllable heat transfer body is heated at 80 ℃, the compressibility is increased from 0% to 80%, and the equilibrium temperature of the surface is increased to 55 ℃.
The heat conductivity of the deformable substrate was 0.18W/(m.K) at a compressibility of 40%, and the substrate was heated on a 80 ℃ hot stage at an equilibrium temperature of 45 ℃ after surface heating.
When the compressibility of the deformable substrate was 50%, the thermal conductivity was 0.32W/(m.K), and the substrate was heated on a 80 ℃ hot stage at an equilibrium temperature of 50 ℃ after surface heating.
The response temperature of the prepared fine controllable heat transfer body to thermal stimulation is 50-150 ℃.
Detailed description of the invention
The fine controllable heat transfer body prepared by the invention has an infrared stealth function. The infrared imager 1 is used for measuring the fine controllable heat transfer body 2 positioned above the heating table 3, when the compression rate of the fine controllable heat transfer body 2 is 0%, the fine controllable heat transfer body 2 is insulated, the monitored surface temperature is close to the ambient temperature, the infrared stealth function is realized, and as shown in fig. 2a, the heat signal of the heat source can be hidden. When the compression rate is 80%, the heat conductivity of the fine controllable heat transfer body 2 is improved to transfer more heat, the surface temperature is obviously different from the ambient temperature, and the infrared stealth capability is lost at the moment.
The fine controllable heat transfer body prepared by the invention has an infrared signal camouflage function. The fine controllable heat transfer body is locally compressed and the compressed portion transfers more heat indicating pattern shaped heat signals as shown in fig. 2 b.
Based on the shape memory function of the fine controllable heat transfer body, different patterns are obtained by forming the fine controllable heat transfer body for multiple times, different thermal signals are displayed, and the function of forging infrared signals or removing forged signals is achieved.
Claims (10)
1. A finely controllable heat transfer body with shape memory characteristics, comprising a liquid metal and a deformable matrix, wherein the deformable matrix has shape memory characteristics, the deformable matrix is a porous framework structure, pores are communicated with one another, and the liquid metal is compounded on the surface of the framework of the deformable matrix and is bonded on the deformable matrix through chemical bonds.
2. Finely controllable heat transfer body with shape memory properties according to claim 1, characterized in that: the deformable matrix is polyurethane sponge modified by epoxy resin.
3. Finely controllable heat transfer body with shape memory properties according to claim 1, characterized in that: the mass ratio of the liquid metal to the deformable matrix is 0.1: 1-1: 1.
4. Finely controllable heat transfer body with shape memory properties according to claim 2, characterized in that: the type of the epoxy resin is one or a combination of E-51 and E-44.
5. Finely controllable heat transfer body with shape memory properties according to claim 1, characterized in that: the liquid metal is a liquid metal having a melting point of 8 ℃, 10.5 ℃, 11.5 ℃, 12 ℃, 15.7 ℃, 18 ℃, 25 ℃, 29.8 ℃ or 47 ℃.
6. Finely controllable heat transfer body with shape memory properties according to claim 1, characterized in that: the liquid metal is connected with the deformable matrix through a chemical bond in a silane coupling agent, and the silane coupling agent is one or the combination of two of 3-mercaptopropyltriethoxysilane and 3-mercaptopropyltrimethoxysilane.
7. A method for preparing a finely controllable heat transfer body with shape memory properties according to any of claims 1 to 6, characterized in that it comprises the following steps:
step one, soaking polyurethane sponge in a mixture of epoxy resin and a curing agent which are uniformly mixed, then extruding out redundant mixture, vacuumizing, and heating and curing at 60-150 ℃ for 2-12 hours;
step two, repeating the step one for 1-3 times to obtain a deformable substrate with shape memory characteristics;
and step three, dispersing the liquid metal in an ethanol solution, adding a silane coupling agent to obtain an ethanol dispersion liquid of the liquid metal modified by the silane coupling agent, soaking the deformable matrix with the shape memory characteristic obtained in the step two in the ethanol dispersion liquid of the liquid metal modified by the silane coupling agent, taking out the deformable matrix and drying the deformable matrix at the temperature of 40-60 ℃ for 2-6 hours to obtain the fine controllable heat transfer body.
8. The method of claim 7, wherein: in the first step, the mass ratio of the epoxy resin to a curing agent is 1: 0.1-1: 0.5, and the curing agent is one or a combination of more of n-octylamine, dodecylamine, m-xylylenediamine, polyetheramine D230, polyetheramine D400, diaminodiphenyl sulfone and isophorone diamine; in the third step, the mass volume ratio of the liquid metal, the ethanol and the silane coupling agent is 1g, 10ml and 10-40 mu L.
9. Use of a finely controllable heat-transfer body with shape memory properties according to any of claims 1-6, characterized in that: the heat conductivity coefficient of the fine controllable heat transfer body with the shape memory characteristic can be changed along with the compression of the fine controllable heat transfer body, and the fine control of the heat conductivity coefficient of the fine controllable heat transfer body is realized by accurately controlling the compression rate of the fine controllable heat transfer body; meanwhile, based on the shape memory characteristic, the fine controllable heat transfer body can reversibly obtain a temporary shape with any compression ratio, and fine and reversible regulation and control of the heat transfer capacity are realized corresponding to different liquid metal heat conduction path connection states.
10. Use of a finely controllable heat-transfer body with shape memory according to any of claims 1-6, characterized in that: when the fine controllable heat transfer body with the shape memory characteristic is in an uncompressed deformation state, the fine controllable heat transfer body is in a heat insulation state, and infrared stealth is realized; when the compression ratio is gradually improved, the heat transfer capacity is also gradually improved, and the infrared stealth is relieved;
or, the local deformation of the fine controllable heat transfer body is controlled, the thermal signals with different shapes are selectively displayed, and the function of forging infrared signals is realized;
or based on the shape memory characteristic, the fine controllable heat conductor is shaped repeatedly, and different fake infrared signals are displayed or removed.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115558153A (en) * | 2022-09-28 | 2023-01-03 | 苏州泰吉诺新材料科技有限公司 | Liquid metal chemical anti-overflow foam and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105713219A (en) * | 2016-01-20 | 2016-06-29 | 云南科威液态金属谷研发有限公司 | Shape memory composite material and preparation method and application thereof |
| CN110753441A (en) * | 2018-07-23 | 2020-02-04 | 浙江清华柔性电子技术研究院 | Circuit conversion unit and manufacturing method thereof, electronic device and temperature control equipment |
| CN113045796A (en) * | 2021-03-19 | 2021-06-29 | 国家纳米科学中心 | Shape memory composite material and preparation method and application thereof |
-
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- 2022-04-14 CN CN202210395421.3A patent/CN114621498B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105713219A (en) * | 2016-01-20 | 2016-06-29 | 云南科威液态金属谷研发有限公司 | Shape memory composite material and preparation method and application thereof |
| CN110753441A (en) * | 2018-07-23 | 2020-02-04 | 浙江清华柔性电子技术研究院 | Circuit conversion unit and manufacturing method thereof, electronic device and temperature control equipment |
| CN113045796A (en) * | 2021-03-19 | 2021-06-29 | 国家纳米科学中心 | Shape memory composite material and preparation method and application thereof |
Non-Patent Citations (2)
| Title |
|---|
| WANG WU等: "Highly Conductive Liquid Metal-Based Shape Memory Material with an Ultrasensitive Fire Warning Response", 《ACS APPL. POLYM. MATER.》 * |
| WU YUNHUI等: "Tuning Flexibility–Rigidity Conversion of Liquid Metal/Polyurethane Composites by Phase Transition for Potential Shape Memory Application", 《ADV. ENG. MATER.》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115558153A (en) * | 2022-09-28 | 2023-01-03 | 苏州泰吉诺新材料科技有限公司 | Liquid metal chemical anti-overflow foam and preparation method thereof |
| CN115558153B (en) * | 2022-09-28 | 2023-08-29 | 苏州泰吉诺新材料科技有限公司 | Liquid metal chemical anti-overflow foam and preparation method thereof |
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