CN105713219A - Shape memory composite material and preparation method and application thereof - Google Patents

Shape memory composite material and preparation method and application thereof Download PDF

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CN105713219A
CN105713219A CN201610036574.3A CN201610036574A CN105713219A CN 105713219 A CN105713219 A CN 105713219A CN 201610036574 A CN201610036574 A CN 201610036574A CN 105713219 A CN105713219 A CN 105713219A
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shape memory
layer
high molecule
gallium
molecule material
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CN105713219B (en
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路金蓉
刘静
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Yunnan maiteli Medical Technology Co.,Ltd.
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Yunnan Kewei Liquid Metal Valley R&D Co Ltd
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/06Coating with compositions not containing macromolecular substances
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
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    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04Homopolymers or copolymers of esters
    • C09D133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D167/00Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D167/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C08J2333/00Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2333/04Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C08J2333/06Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
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    • C08J2367/00Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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Abstract

The invention relates to shape memory composite material and a preparation method and application thereof. The composite material is prepared by alternately compositing liquid metal layers and shape memory polymer material layers. The preparation method includes: using a layering compositing method, evenly spraying liquid metal on a shape memory polymer material layer to form a liquid metal layer, coating another shape memory polymer material layer on the liquid metal layer, and repeating the steps until the required thickness is reached. The conductive flexible shape memory polymer composite material has the advantages that the material is excellent in conductivity and flexible, and the thickness of the material can be changed according to needs. The preparation method is simple, fast, efficient and controllable, extremely high in flexibility and promising in application prospect.

Description

A kind of composite material of shape memory and its preparation method and application
Technical field
The present invention relates to a kind of multifunctional polymer composite, particularly to a kind of conductive flexible shape memory polymer composite material and its preparation method and application being main component with liquid metal and shape memory high molecule polymer.
Background technology
Shape memory high molecule is also known as shape-memory polymer (ShapeMemoryPolymers, it is called for short SMP), after referring to that the goods with original shape change its initial condition under certain conditions and be fixing, the macromolecular material of its original shape can be recovered again by the stimulation of external condition (such as heat, electricity, light, chemical co-ordination etc.).At present, shape memory high molecule material obtains in intellectual material field and pays close attention to widely and research.Compared with marmem, shape-memory polymer, as a kind of novel functional high molecule material, has light weight, can reply deformation quantity greatly, is prone to advantages such as processing, cheap.But it is functional relatively single, and does not possess the functional characteristic adapted with applied environment, significantly limit in the universal of Practical Project field and application.Therefore, in order to expand practical engineering application, shape-memory polymer of being everlasting adds various types of filler and makes shape memory polymer composite material, thus reaching to strengthen the purpose of its properties.At present, studying more is thermotropic shape-memory polymer, but thermotropic shape-memory polymer is easily subject to the restriction of the environmental factorss such as external heat source, its further application there is also a lot of problem.In recent years, conductive material is added to this as, in the shape-memory polymer collective of insulator, having prepared electroluminescent type shape memory polymer composite material by research worker.This material can make system temperature raise by the raw heat of electric current, it is achieved deformation recovers, and not by the interference of outside environmental elements, has good stability.
Electroluminescent type shape-memory polymer can be divided into metal packing filling shape memory composites and carbon filler filling shape memory composites according to the difference of packing material.Conventional is carbon filler, utilization be carbon black, CNT, carbon fiber etc. as conductive filler to affect electrical property and the shape memory effect of shape memory polymer composite material.But easily there is, in energising temperature-rise period, the phenomenon that resistance increases in carbon filler filling shape memory composite material, so that composite loses conductive capability.Therefore from conduction angle, the shape memory polymer composite material performance of metal packing is more excellent.But metal packing conventional at present is gold, silver, copper etc., and hardness is higher at normal temperatures, it is impossible to change shape flexibly.Simultaneously as the deformation recovery rate of carbon filler and metal packing is relatively low, when large deformation occurs in shape memory polymer composite material, filler is easily and matrix stripping, and this significantly limit the application of shape memory polymer composite material.Therefore, the appearance of a kind of new packing of exigence.
Summary of the invention
For solving above-mentioned technical problem, it is an object of the present invention to provide a kind of conductive flexible shape memory composite material.
Realizing the object of the invention technical scheme is:
A kind of composite material of shape memory, is alternately composited by liquid-metal layer and shape memory high molecule material layer.
Preferably, the thickness respectively 10 μm-100 μm of described liquid-metal layer and shape memory high molecule material layer.
Preferably, the thickness proportion of described liquid-metal layer and shape memory high molecule material layer is 0.5-1.5: 0.5-1.5, more preferably 1: 1.
Described composite material of shape memory includes multiple liquid-metal layer replaced and shape memory high molecule material layer.
Preferably, in described composite material of shape memory, liquid-metal layer is 3-10 layer, or described shape memory high molecule material is 4-11 layer.
Described composite material of shape memory can be actually needed according to different occasions and adjust to desired thickness.
Preferably, the thickness of described composite material of shape memory is 70 μm of-2mm.
Preferably, its outermost layer of described composite material of shape memory is shape memory high molecule material layer.
Preferably, described liquid metal is one or more in the ternary alloy three-partalloy of gallium, the bianry alloy of gallium, gallium.
It is preferred that described liquid metal is gallium indium bianry alloy, wherein the content of gallium is mass fraction 50%-90%, and all the other are indium;
Or described liquid metal is gallium indium tin ternary alloy three-partalloy, wherein the content of gallium is mass fraction 60%-80%, and the content of indium is mass fraction 10%-30%, and all the other are stannum.
Shape memory high molecule material of the present invention can be the common all kinds of shape memory high molecule materials of industry, includes but not limited to one or more in polystyrene shape-memory polymer, epoxy resin shape polymer, styrene-butadiene system shape polymer, using trans-polyisoprene system shape polymer, cyanate system shape polymer etc..Preferred shape memory high molecule material is that polybutylene terephthalate (PBT), polyethylene are to one or more in this ethylene glycol, Polyetherimide, polyisobutyl methacrylate etc..
The preferred version of the present invention is, a kind of composite material of shape memory, liquid-metal layer and shape memory high molecule material layer are alternately composited;The thickness respectively 10 μm-100 μm of described liquid-metal layer and shape memory high molecule material layer, wherein, the thickness proportion of described liquid-metal layer and shape memory high molecule material layer is 1:1;Described liquid-metal layer is 3-10 layer;Or shape memory high molecule material layer is 4-11 layer;Or the thickness of described composite is 70 μm of-2mm;Its outermost layer is shape memory high molecule material layer.Described liquid metal is one or more in gallium, gallium indium bianry alloy, gallium indium tin ternary alloy three-partalloy;Wherein, in described gallium indium bianry alloy, the content of gallium is mass fraction 50%-90%, and all the other are indium;In described gallium indium tin ternary alloy three-partalloy, the content of gallium is mass fraction 60%-80%, and the content of indium is mass fraction 10%-30%, and all the other are stannum.Described shape memory high molecule material is that polybutylene terephthalate (PBT), polyethylene are to one or more in this ethylene glycol, Polyetherimide, polyisobutyl methacrylate.
The present invention also provide for above-mentioned can the preparation method of conductive flexible shape memory polymer composite material, including the method adopting hierarchical composite, by above-mentioned liquid metal even application on above-mentioned shape memory high molecule material layer, form liquid-metal layer, then on described liquid-metal layer, it is coated with another layer of described shape memory high molecule material layer, repeats above step to desired thickness.
Owing to the shape-memory polymer overwhelming majority is insulator, self does not have conductive capability.Therefore, the flexible shape memory composites of conduction is by liquid-metal layer transmission conduction, thus possessing conductive capability.
Present invention additionally comprises the application of above-mentioned conductive flexible shape memory composites, described application includes for space industry, medical device, sensor or intelligent packaging fabric etc..
Present invention additionally comprises the equipment containing above-mentioned conductive flexible shape memory composites or device, described equipment or device including but not limited to Spacecraft Launch device, Statellite antenna or artificial-muscle etc..
The beneficial effects of the present invention is:
Conductive flexible shape memory composites provided by the invention, the deficiency such as broken away from filler and matrix poor compatibility in conventional shape-memory polymer composites, deformation-recovery power is poor, conduction power is weak.Owing to liquid metal has high heat conductivity, excellent surface tension, therefore can perfectly fit with shape memory high molecule material, thus improving the electric conductivity of integral material.And based on the characteristic of liquid metal flowing itself, the flexible shape memory composites of conduction provided by the invention has better flexible characteristic.Simultaneously as the method adopting hierarchical composite, thickness adjustability can be realized according to different occasions, greatly improve its range of application.
Accompanying drawing explanation
Fig. 1 is composite material of shape memory material structural representation of the present invention.Wherein, 1 is shape memory high molecule material;2 is liquid metal.
Fig. 2 is composite material of shape memory of the present invention deformation and replys schematic diagram.Wherein, 1 is original state;2 is case of bending after deformation;3 is state after replying.
Fig. 3 is composite material of shape memory of the present invention deformation and replys angle schematic diagram (experimental example 3).Wherein, 1 is original state;2 is case of bending after deformation;3 is state after replying.α is deformation angle;β is for replying angle.
Detailed description of the invention
Now with following most preferred embodiment, the present invention is described, but is not limited to the scope of the present invention.In embodiment, if no special instructions, the technological means adopted is the technological means that this area is conventional.
Embodiment 1
A kind of composite material of shape memory, as it is shown in figure 1, it is alternately composited by liquid-metal layer and shape memory high molecule material layer;Wherein, 1 is shape memory high molecule material polybutylene terephthalate (PBT);2 is liquid metal gallium.The thickness respectively 10 μm of described liquid-metal layer and shape memory high molecule material layer, the former (refers to liquid-metal layer, lower same), and the number of plies is 9 layers, and the latter (refers to shape memory polymer material layer, lower same), and the number of plies is 10 layers.
Embodiment 2
A kind of composite material of shape memory, as it is shown in figure 1, it is alternately composited by liquid-metal layer and shape memory high molecule material layer;Wherein, 1 is that shape memory high molecule material polyethylene is to this ethylene glycol;2 is liquid metal gallium-indium alloy, and wherein the content of gallium is mass fraction 90%, and all the other are indium;The thickness respectively 10 μm of described liquid-metal layer and shape memory high molecule material layer, the former number of plies is 3 layers, and the latter's number of plies is 4 layers.
Embodiment 3
A kind of composite material of shape memory, as it is shown in figure 1, it is alternately composited by liquid-metal layer and shape memory high molecule material layer;Wherein, 1 is shape memory high molecule material Polyetherimide;2 is liquid metal gallium-indium alloy, and wherein the content of gallium is mass fraction 70%, and all the other are indium;The thickness respectively 10 μm of described liquid-metal layer and shape memory high molecule material layer, the former number of plies is 5 layers, and the latter's number of plies is 6 layers.
Embodiment 4
A kind of composite material of shape memory, as it is shown in figure 1, it is alternately composited by liquid-metal layer and shape memory high molecule material layer;Wherein, 1 is shape memory high molecule material polyisobutyl methacrylate;2 is liquid metal gallium-indium-tin alloy, and wherein the content of gallium is mass fraction 70%, and the content of indium is mass fraction 25%, and all the other are stannum;The thickness respectively 10 μm of described liquid-metal layer and shape memory high molecule material layer, the former number of plies is 4 layers, and the latter's number of plies is 5 layers.
Embodiment 5
A kind of composite material of shape memory, as it is shown in figure 1, it is alternately composited by liquid-metal layer and shape memory high molecule material layer;Wherein, 1 is shape memory high molecule material polybutylene terephthalate (PBT);2 is liquid metal gallium.The thickness respectively 100 μm of described liquid-metal layer and shape memory high molecule material layer, the former number of plies is 9 layers, and the latter's number of plies is 10 layers.
Embodiment 6
A kind of composite material of shape memory, as it is shown in figure 1, it is alternately composited by liquid-metal layer and shape memory high molecule material layer;Wherein, 1 is shape memory high molecule material polybutylene terephthalate (PBT);2 is liquid metal gallium.The thickness respectively 50 μm of described liquid-metal layer and shape memory high molecule material layer, the former number of plies is 9 layers, and the latter's number of plies is 10 layers.
Embodiment 7
A kind of composite material of shape memory, as it is shown in figure 1, it is alternately composited by liquid-metal layer and shape memory high molecule material layer;Wherein, 1 is shape memory high molecule material polybutylene terephthalate (PBT);2 is liquid metal gallium.The thickness respectively 70 μm of described liquid-metal layer and shape memory high molecule material layer, the former number of plies is 9 layers, and the latter's number of plies is 10 layers.
Embodiment 8
A kind of composite material of shape memory, as it is shown in figure 1, it is alternately composited by liquid-metal layer and shape memory high molecule material layer;Wherein, 1 is that shape memory high molecule material polyethylene is to this ethylene glycol;2 is liquid metal gallium-indium alloy, and wherein the content of gallium is mass fraction 90%, and all the other are indium;Described liquid metal layer thickness is 50 μm, and the thickness of shape memory high molecule material layer is 100 μm, and the former number of plies is 3 layers, and the latter's number of plies is 4 layers.
Embodiment 9
A kind of composite material of shape memory, as it is shown in figure 1, it is alternately composited by liquid-metal layer and shape memory high molecule material layer;Wherein, 1 is shape memory high molecule material Polyetherimide;2 is liquid metal gallium-indium alloy, and wherein the content of gallium is mass fraction 70%, and all the other are indium;The thickness of described liquid-metal layer is 20 μm, and the thickness of shape memory high molecule material layer is 60 μm, and the former number of plies is 5 layers, and the latter's number of plies is 6 layers.
Embodiment 10
A kind of composite material of shape memory, as it is shown in figure 1, it is alternately composited by liquid-metal layer and shape memory high molecule material layer;Wherein, 1 is shape memory high molecule material polyisobutyl methacrylate;2 is liquid metal gallium-indium-tin alloy, and wherein the content of gallium is mass fraction 70%, and the content of indium is mass fraction 25%, and all the other are stannum;The thickness of described liquid-metal layer is 90 μm, and the thickness of shape memory high molecule material layer is 30 μm, and the former number of plies is 4 layers, and the latter's number of plies is 5 layers.
Embodiment 11
The present embodiment provides the preparation method of composite material of shape memory described in embodiment 1, including the thin layer (i.e. shape polymer material layer) that described shape memory high molecule material utilizes general macromolecule masking means prepare into desired thickness (10 μm), then liquid metal utilizes spray gun spray on this shape polymer material layer, forms the liquid-metal layer of desired thickness (10 μm).This liquid-metal layer continues to prepare the shape memory high molecule material thin layer of desired thickness (10 μm), the rear liquid-metal layer continuing spraying desired thickness (10 μm).Repeat process above to desired thickness.
Described in embodiment 2-10, the preparation method of conductive flexible shape memory composites is similar to embodiment 11.
Comparative example 1
A kind of composite, its thickness respectively 150 μm differing only in described liquid-metal layer and shape memory high molecule material layer with embodiment 1.Now, composite integral thickness is 2.85mm, and this compound material flexible is deteriorated.
Comparative example 2
A kind of composite, its thickness respectively 5 μm differing only in described liquid-metal layer and shape memory high molecule material layer with embodiment 2.Now, composite integral thickness is 35 μm, and the intensity of this composite reduces, it is easy to break.
Experimental example 1
Accompanying drawing 2 is to composite electroluminescent deformation Recovery Process schematic diagram.Wherein, 1 is original state;2 is case of bending after deformation;3 is state after replying.Its shape recovery process is:
1) it is warming up to more than the vitrification point of shape memory high molecule material, material is applied external force and makes its deformation;
2) keep external force constant, can freezing stress and deformation after reducing temperature;
3) the flexible shape memory composites of conduction is applied voltage and be passed to liquid-metal layer conduction.Electric current can make the temperature of composite rise to more than the vitrification point of shape memory high molecule material by heat produced by composite inner liquid-metal layer, the state thus discharging freezing stress, before making composite be returned to deformation.
Adopting above method respectively each composite of embodiment 1-10 and comparative example 1-2 to be tested, result shows that each compound material flexible of embodiment 1-10 is good, all can well deformation-recovery;But comparative example 1 compound material flexible is poor, it is not easy to deformation-recovery;The intensity of comparative example 2 composite reduces, it is easy to break.
Experimental example 2
Respectively embodiment 1-10 and comparative example 1,2 composite being carried out deformation-recovery experiment (empirically example 1 method), angle after measuring its angle of bend and replying, schematic diagram is as shown in Figure 3.Concrete measurement result is as shown in table 1.By table 1 it can be seen that each composite of embodiment 1-10 all can well deformation-recovery;But the deformation recovery situation of comparative example 1,2 composite is poor.
Table 1
Above embodiments is only that the preferred embodiment of the present invention is described; not the scope of the present invention is defined; under the premise designing spirit without departing from the present invention; various modification that technical scheme is made by this area ordinary skill technical staff and improvement, all should fall in the protection domain that claims of the present invention are determined.

Claims (10)

1. a composite material of shape memory, it is characterised in that be alternately composited by liquid-metal layer and shape memory high molecule material layer.
2. composite according to claim 1, it is characterised in that the thickness respectively 10 μm-100 μm of described liquid-metal layer and shape memory high molecule material layer;
Preferably, the thickness proportion of described liquid-metal layer and shape memory high molecule material layer is 0.5-1.5: 0.5-1.5, more preferably 1: 1.
3. composite according to claim 1 and 2, it is characterised in that described liquid-metal layer is 3-10 layer;Or described shape memory high molecule material layer is 4-11 layer;Or the thickness of described composite is 70 μm of-2mm.
4. the composite according to any one of claim 1-3, it is characterised in that its outermost layer of described composite is shape memory high molecule material layer.
5. the composite according to any one of claim 1-4, it is characterised in that described liquid metal is one or more in the ternary alloy three-partalloy of gallium, the bianry alloy of gallium, gallium;
Preferably, described liquid metal is gallium indium bianry alloy, and wherein the content of gallium is mass fraction 50%-90%, and all the other are indium;Or described liquid metal is gallium indium tin ternary alloy three-partalloy, wherein the content of gallium is mass fraction 60%-80%, and the content of indium is mass fraction 10%-30%, and all the other are stannum.
6. the composite according to any one of claim 1-5, it is characterized in that, described shape memory high molecule material includes one or more in polystyrene shape-memory polymer, epoxy resin shape polymer, styrene-butadiene system shape polymer, using trans-polyisoprene system shape polymer, cyanate system shape polymer;It is preferably polybutylene terephthalate (PBT), polyethylene to one or more in this ethylene glycol, Polyetherimide, polyisobutyl methacrylate.
7. composite according to claim 1, it is characterised in that the thickness respectively 10 μm-100 μm of described liquid-metal layer and shape memory high molecule material layer, wherein, the thickness proportion of described liquid-metal layer and shape memory high molecule material layer is 1:1;Described liquid-metal layer is 3-10 layer;Or shape memory high molecule material layer is 4-11 layer;Or the thickness of described composite is 70 μm of-2mm;Its outermost layer is shape memory high molecule material layer;
Described liquid metal is one or more in gallium, gallium indium bianry alloy, gallium indium tin ternary alloy three-partalloy;Wherein, in described gallium indium bianry alloy, the content of gallium is mass fraction 50%-90%, and all the other are indium;In described gallium indium tin ternary alloy three-partalloy, the content of gallium is mass fraction 60%-80%, and the content of indium is mass fraction 10%-30%, and all the other are stannum;
Described shape memory high molecule material is that polybutylene terephthalate (PBT), polyethylene are to one or more in this ethylene glycol, Polyetherimide, polyisobutyl methacrylate.
8. the preparation method of composite described in any one of claim 1-7, including the method adopting hierarchical composite, by liquid metal even application on shape memory high molecule material layer, form liquid-metal layer, then on described liquid-metal layer, it is coated with another layer of described shape memory high molecule material layer, repeats above step to desired thickness.
9. the application of composite described in any one of claim 1-8, described application includes for space industry, medical device, sensor or intelligent packaging fabric.
10. containing equipment or the device of composite described in any one of claim 1-8, described equipment or device include Spacecraft Launch device, Statellite antenna or artificial-muscle.
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CN107938369A (en) * 2017-11-06 2018-04-20 北京梦之墨科技有限公司 A kind of conductive fabric and preparation method thereof
CN109016771A (en) * 2018-07-20 2018-12-18 北京梦之墨科技有限公司 A kind of plastotype part and preparation method thereof
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CN109637698A (en) * 2018-11-06 2019-04-16 中国科学院理化技术研究所 Liquid metal fexible film and preparation method thereof with two-sided inequality characteristic
CN110753443A (en) * 2018-07-23 2020-02-04 浙江清华柔性电子技术研究院 Method for manufacturing circuit conversion unit
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CN113043288A (en) * 2020-12-25 2021-06-29 天津大学 Liquid metal-polymer composite soft driver and preparation method thereof
CN113529075A (en) * 2020-04-20 2021-10-22 厦门大学 Liquid metal composite porous membrane and preparation method and application thereof
CN114621498A (en) * 2022-04-14 2022-06-14 哈尔滨工业大学 Fine controllable heat transfer body with shape memory characteristic and preparation method and application thereof

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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106426099A (en) * 2016-10-31 2017-02-22 清华大学 Electrically driven artificial muscle and preparation method thereof
CN107582214A (en) * 2017-09-04 2018-01-16 云南靖创液态金属热控技术研发有限公司 A kind of artificial muscle fibre and artificial muscle
CN107819069A (en) * 2017-10-30 2018-03-20 清华大学 The memory that phase-change memory cell and the unit based on nanometer liquid metallic particles are formed
CN107938369A (en) * 2017-11-06 2018-04-20 北京梦之墨科技有限公司 A kind of conductive fabric and preparation method thereof
CN109016771A (en) * 2018-07-20 2018-12-18 北京梦之墨科技有限公司 A kind of plastotype part and preparation method thereof
CN110753441A (en) * 2018-07-23 2020-02-04 浙江清华柔性电子技术研究院 Circuit conversion unit and manufacturing method thereof, electronic device and temperature control equipment
CN110753443A (en) * 2018-07-23 2020-02-04 浙江清华柔性电子技术研究院 Method for manufacturing circuit conversion unit
CN110753441B (en) * 2018-07-23 2020-08-04 浙江清华柔性电子技术研究院 Circuit conversion unit and manufacturing method thereof, electronic device and temperature control equipment
CN110753443B (en) * 2018-07-23 2022-03-08 浙江清华柔性电子技术研究院 Method for manufacturing circuit conversion unit
CN109637698A (en) * 2018-11-06 2019-04-16 中国科学院理化技术研究所 Liquid metal fexible film and preparation method thereof with two-sided inequality characteristic
CN109627769A (en) * 2018-12-03 2019-04-16 深圳大学 A kind of shape changing memory composite material and preparation method and application based on liquid metal
CN109627769B (en) * 2018-12-03 2021-11-30 深圳大学 Liquid metal-based deformation memory composite material and preparation method and application thereof
CN113529075A (en) * 2020-04-20 2021-10-22 厦门大学 Liquid metal composite porous membrane and preparation method and application thereof
CN112233869A (en) * 2020-10-30 2021-01-15 江苏普隆磁电有限公司 Neodymium-iron-boron magnet and preparation method thereof
CN113043288A (en) * 2020-12-25 2021-06-29 天津大学 Liquid metal-polymer composite soft driver and preparation method thereof
CN114621498A (en) * 2022-04-14 2022-06-14 哈尔滨工业大学 Fine controllable heat transfer body with shape memory characteristic and preparation method and application thereof

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