Disclosure of Invention
The invention aims to provide a conveying device based on an Internet of things circuit board.
In order to solve the technical problem, the invention provides a conveying device based on an internet of things circuit board, which comprises: the blanking device comprises a blanking platform, a first gluing mechanism, a turnover mechanism, a material receiving mechanism, a first track mechanism, a second gluing mechanism, a second track mechanism and a plurality of blanking mechanisms; the first gluing mechanism is positioned on one side of the blanking platform, and the blanking mechanisms are positioned on the other side of the blanking platform and are sequentially arranged along the conveying direction; the turnover mechanism is positioned between the output position of the blanking platform and the material receiving mechanism, the material receiving mechanism and the second gluing mechanism are movably mounted on the first track mechanism, and the first track mechanism is movably mounted on the second track mechanism; the blanking mechanisms respectively put the circuit board on the blanking platform, the first gluing mechanism glues the front side of the circuit board sliding along the blanking platform, namely the circuit board is conveyed to the turnover mechanism through the blanking platform, the turnover mechanism turns the circuit board and then conveys the circuit board to the material receiving mechanism, and the second gluing mechanism glues the back side of the circuit board moving along the material receiving mechanism; the first track mechanism moves on the second track mechanism, and the material receiving mechanism moves on the first track mechanism so that the material receiving mechanism is aligned with the output position of the turnover mechanism to receive the circuit board; and the second glue coating mechanism moves on the first track mechanism to align to the corresponding position on the back surface of the circuit board and perform glue coating.
Further, the blanking platform includes: the blanking plate, the two first supporting legs and the two second supporting legs; the four corners of blanking plate side is fixed through two first supporting legs, two second supporting legs respectively, two the height of first supporting leg is greater than two second supporting legs, promptly the blanking plate is the slope setting to make from each circuit board orientation tilting mechanism landing of throwing on the blanking plate is thrown to blanking mechanism.
Furthermore, the blanking plate extends upwards along two sides of the conveying direction to form corresponding material blocking parts.
Further, the blanking mechanism includes: a blanking frame and a guide plate; one end of the guide plate is connected with the blanking frame, and the other end of the guide plate is connected with the blanking plate; the blanking frame inner circuit board is put on the blanking plate through the guide board.
Further, first rubber coating mechanism includes: the glue dispensing device comprises a first glue storage tank, a first glue conveying pump, a first glue conveying pipeline, a first glue dispensing nozzle, a first moving plate and a first longitudinal rail; the first dispensing nozzle is arranged on the first moving plate and faces the blanking plate; first movable plate movable mounting is on first vertical track, first glue bin is through first defeated gluey pump, first defeated gluey pipeline connection first point gluey nozzle, promptly first movable plate moves on first vertical track through corresponding driver part, so that first glue bin carries glue to first point gluey nozzle through first defeated gluey pump, first defeated gluey pipeline, and by first point gluey nozzle carries out the point to circuit board on the flitch and glues.
Further, receiving mechanism includes: the material receiving conveying belt and the fixing plate are provided with the material receiving conveying belt; the fixed plate is movably arranged on the first track mechanism; the fixed plate moves on the first track mechanism to drive the material receiving conveying belt to align to an output position receiving circuit board of the turnover mechanism.
Further, the second gluing mechanism comprises: the glue dispensing device comprises a glue dispensing frame movably arranged on the first track mechanism, a glue dispensing barrel fixed on the glue dispensing frame and a second glue dispensing nozzle communicated with the glue dispensing barrel; the glue dispensing frame moves on the first track mechanism to drive the glue dispensing barrel and the second glue dispensing nozzle to move so as to align to the circuit board on the material receiving conveying belt and dispense glue on the back of the circuit board.
Further, the first rail mechanism includes: the material receiving screw rod assembly comprises a transverse plate, a material receiving screw rod assembly and a gluing screw rod assembly; the material receiving screw rod assembly and the gluing screw rod assembly are arranged on a transverse plate in parallel, two long-strip supporting blocks are arranged on the transverse plate to support the fixing plate, and the material receiving screw rod assembly is positioned between the two long-strip supporting blocks; the fixed plate and the glue dispensing frame are respectively movably mounted on the material receiving screw rod assembly and the glue coating screw rod assembly, namely, the transverse plate moves on the second track mechanism, the fixed plate moves on the transverse plate through the material receiving screw rod assembly, and the glue dispensing frame moves on the transverse plate through the glue coating screw rod assembly.
Further, the second rail mechanism includes: the device comprises a movable box, two support plates arranged from top to bottom, a gear assembly and a rack; remove case open-top, two backup pad parallel arrangement is at the removal case opening part, the installation department of gear assembly is fixed with the bottom of diaphragm, the movable part and the rack mesh of gear assembly, promptly the gear assembly removes on the rack, in order to drive the diaphragm removes on two backup pads.
Further, the turnover mechanism includes: a detection plate and a rotating motor; a plurality of pin holes are arranged on the circuit board, and corresponding L-shaped pins penetrate into the pin holes; the detection plate is provided with a cavity, two opposite side surfaces of the detection plate are respectively provided with a first exposure hole and a second exposure hole, the first exposure hole and the second exposure hole are communicated with the cavity to form a conveying channel, the upper edge of the first exposure hole is provided with an arc-shaped groove, and the lower edge of the first exposure hole is provided with a plurality of embedded grooves; the rotary motor drives the detection plate to turn over so that the first exposed hole is aligned with the output position of the blanking platform, the circuit board conveyed by the blanking platform is inserted into the conveying channel in the detection plate until the L-shaped pins on the circuit board are clamped into the arc-shaped grooves and the embedding grooves, and the detection plate dries glue dispensing positions on the circuit board and marks the L-shaped pins through the arc-shaped grooves and the embedding grooves; the rotary motor drives the detection plate to turn 180 degrees so that the first exposed hole is aligned to an input position of the material receiving mechanism, and the circuit board is separated from the detection plate and moves along the conveying direction under the driving of the material receiving mechanism.
The automatic circuit board feeding device has the advantages that the turnover mechanism can be arranged to realize turnover of a circuit board in the circuit board feeding process, so that the front and back surfaces of the circuit board are coated with glue through the first gluing mechanism and the second gluing mechanism, meanwhile, the blanking mechanisms are arranged to put the circuit board on the blanking platform to be fed after the circuit board is summarized and sorted, meanwhile, the gluing position of the circuit board can be adjusted through the mutual matching of the material receiving mechanism, the first track mechanism and the second track mechanism, the automatic circuit board feeding device is suitable for circuit boards of different specifications, and the conveying and gluing efficiency of the circuit board is improved.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
In this embodiment, as shown in fig. 1 to 7, the present embodiment provides a conveying device based on an internet of things circuit board 9, which includes: the automatic blanking device comprises a blanking platform 1, a first gluing mechanism 2, a turnover mechanism 3, a material receiving mechanism 4, a first track mechanism 5, a second gluing mechanism 6, a second track mechanism 7 and a plurality of blanking mechanisms 8; the first gluing mechanism 2 is positioned on one side of the blanking platform 1, and the blanking mechanisms 8 are positioned on the other side of the blanking platform 1 and are sequentially arranged along the conveying direction; the turnover mechanism 3 is positioned between the output position of the blanking platform 1 and the material receiving mechanism 4, the material receiving mechanism 4 and the second gluing mechanism 6 are movably mounted on the first track mechanism 5, and the first track mechanism 5 is movably mounted on the second track mechanism 7; the blanking mechanisms 8 respectively put the circuit boards 9 on the blanking platform 1, the first gluing mechanism 2 glues the front sides of the circuit boards 9 sliding down along the blanking platform 1, namely the circuit boards 9 are conveyed to the turnover mechanism 3 through the blanking platform 1, the turnover mechanism 3 turns over the circuit boards 9 and then conveys the circuit boards to the material receiving mechanism 4, and the second gluing mechanism 6 glues the back sides of the circuit boards 9 moving along the material receiving mechanism 4; the first track mechanism 5 moves on the second track mechanism 7, and the material receiving mechanism 4 moves on the first track mechanism 5 so that the material receiving mechanism 4 is aligned with the output position of the turnover mechanism 3 to receive the circuit board 9; the second glue application mechanism 6 moves on the first rail mechanism 5 to align and apply glue to corresponding positions on the back surface of the circuit board 9.
In this embodiment, this embodiment can realize circuit board 9 transportation process turn-over through setting up tilting mechanism 3 to all carry out the rubber coating through first rubber coating mechanism 2, second rubber coating mechanism 6 to circuit board 9 positive and negative, set up a plurality of blanking mechanisms 8 simultaneously and can conclude the arrangement back to circuit board 9 and throw and carry on blanking platform 1, can adjust the rubber coating position to circuit board 9 through receiving mechanism 4, first rail mechanism 5, the mutual cooperation of second rail mechanism 7 simultaneously, adapt to the circuit board 9 of different specifications, the conveying to circuit board 9, rubber coating efficiency have been improved.
In this embodiment, the blanking platform 1 includes: a blanking plate 101, two first supporting legs 102 and two second supporting legs 103; the four corners of the blanking plate 101 are fixed by two first supporting legs 102 and two second supporting legs 103, respectively, and the height of the two first supporting legs 102 is greater than that of the two second supporting legs 103, that is, the blanking plate 101 is arranged in a gradient manner, so that the circuit boards 9 thrown onto the blanking plate 101 from the blanking mechanisms 8 slide toward the turnover mechanism 3.
In this embodiment, the blanking plate 101 forms a slope through the two first supporting legs 102 and the two second supporting legs 103, so that the circuit board 9 entering the blanking plate 101 can slide down along the blanking plate 101 under the action of self gravity, thereby realizing unpowered conveying, saving energy and reducing cost.
In this embodiment, the blanking plate 101 functions to convey the circuit board 9, and can convey the circuit board 9 to the turnover mechanism 3 to turn over the circuit board 9.
In this embodiment, the blanking plate 101 extends upward along two sides of the conveying direction to form corresponding material blocking portions.
In this embodiment, the material blocking portion can prevent the circuit board 9 from sliding out of the two sides of the blanking plate 101, so that the circuit board has limiting and protecting effects.
In this embodiment, the blanking mechanism 8 includes: a blanking frame 801 and a guide plate 802; one end of the guide plate 802 is connected with the blanking frame 801, and the other end of the guide plate 802 is connected with the blanking plate 101; the circuit board 9 in the blanking frame 801 is thrown onto the blanking plate 101 through the guide plate 802.
In this embodiment, the blanking frame 801 receives, arranges, and throws in the circuit board 9, so as to improve the capability of receiving the circuit board 9, and the guide plate 802 protects the circuit board 9 from smoothly entering the blanking plate 101.
In this embodiment, the first glue applying mechanism 2 includes: the glue dispensing device comprises a first glue storage tank 201, a first glue conveying pump, a first glue conveying pipeline 202, a first glue dispensing nozzle 203, a first moving plate 204 and a first longitudinal rail 205; the first dispensing nozzle 203 is installed on the first moving plate 204, and the first dispensing nozzle 203 is arranged towards the blanking plate 101; the first moving plate 204 is movably mounted on the first longitudinal rail 205, the first glue storage tank 201 is connected with the first glue dispensing nozzle 203 through the first glue delivery pump and the first glue delivery pipeline 202, that is, the first moving plate 204 moves on the first longitudinal rail 205 through the corresponding driving part, so that the first glue storage tank 201 delivers glue to the first glue dispensing nozzle 203 through the first glue delivery pump and the first glue delivery pipeline 202, and the first glue dispensing nozzle 203 dispenses glue on the circuit board 9 on the blanking plate 101.
In this embodiment, the receiving mechanism 4 includes: a receiving conveyer belt 401 and a fixing plate 402 for mounting the receiving conveyer belt 401; the fixing plate 402 is movably mounted on the first track mechanism 5; the fixing plate 402 moves on the first rail mechanism 5 to drive the material receiving conveyer 401 to align with the output position of the turnover mechanism 3 to receive the circuit board 9.
In this embodiment, the receiving mechanism 4 further includes: the detection module is arranged above the material receiving conveying belt 401; the detection module detects the marked position on the circuit board 9 conveyed by the material conveying belt 401, so as to convey the circuit board 9 to the corresponding position according to the corresponding detection result.
In this embodiment, the second glue applying mechanism 6 includes: the dispensing device comprises a dispensing frame 601 movably mounted on the first track mechanism 5, a dispensing barrel 602 fixed on the dispensing frame 601 and a second dispensing nozzle 603 communicated with the dispensing barrel 602; the dispensing frame 601 moves on the first track mechanism 5 to drive the dispensing barrel 602 and the second dispensing nozzle 603 to move to align with the circuit board 9 on the material receiving conveyor 401, and dispensing is performed on the back surface of the circuit board 9.
In the present embodiment, the first rail mechanism 5 includes: the device comprises a transverse plate 501, a material receiving screw rod assembly 502 and a gluing screw rod assembly 503; the material receiving screw rod assembly 502 and the gluing screw rod assembly 503 are arranged on the transverse plate 501 in parallel, two strip-shaped supporting blocks 504 are arranged on the transverse plate 501 to support the fixing plate 402, and the material receiving screw rod assembly 502 is positioned between the two strip-shaped supporting blocks 504; the fixing plate 402 and the dispensing frame 601 are movably mounted on the material receiving screw rod assembly 502 and the glue coating screw rod assembly 503 respectively, that is, the transverse plate 501 moves on the second rail mechanism 7, the fixing plate 402 moves on the transverse plate 501 through the material receiving screw rod assembly 502, and the dispensing frame 601 moves on the transverse plate 501 through the glue coating screw rod assembly 503.
In this embodiment, the material receiving screw rod assembly 502 and the glue coating screw rod assembly 503 are both composed of a screw rod, a screw rod motor and a screw rod nut, and realize the movement of corresponding components.
In the present embodiment, the second rail mechanism 7 includes: the device comprises a moving box 701, two support plates 702 arranged from top to bottom, a gear assembly 703 and a rack 704; the top of the moving box 701 is provided with an opening, the two support plates 702 are arranged at the opening of the moving box 701 in parallel, the mounting part of the gear assembly 703 is fixed with the bottom of the transverse plate 501, the movable part of the gear assembly 703 is meshed with the rack 704, namely, the gear assembly 703 moves on the rack 704 to drive the transverse plate 501 to move on the two support plates 702.
In this embodiment, the gear assembly 703 may be engaged with a gear motor through a gear, or may be engaged with a gear through a corresponding cylinder, so that the gear rolls on the rack 704.
In this embodiment, the turnover mechanism 3 includes: a detection plate 301 and a rotating motor 302; a plurality of pin holes are arranged on the circuit board 9, and corresponding L-shaped pins 901 penetrate into the pin holes; the detection plate 301 is provided with a cavity, two opposite side surfaces of the detection plate 301 are respectively provided with a first exposure hole 3011 and a second exposure hole 3012, the first exposure hole 3011 and the second exposure hole 3012 are communicated with the cavity to form a conveying channel, an arc-shaped groove 3013 is formed in the upper edge of the first exposure hole 3011, and a plurality of embedded grooves 3014 are formed in the lower edge of the first exposure hole 3011; the rotary motor 302 drives the detection plate 301 to turn over so that the first exposure hole 3011 is aligned to the output position of the blanking platform 1, so that the circuit board 9 conveyed by the blanking platform 1 is inserted into the conveying channel in the detection plate 301 until the L-shaped pins 901 on the circuit board 9 are clamped into the arc-shaped slots 3013 and the embedded slots 3014, and the detection plate 301 dries the dispensing positions on the circuit board 9 and marks the L-shaped pins 901 through the arc-shaped slots 3013 and the embedded slots 3014; the rotating motor 302 drives the detection board 301 to turn 180 degrees, so that the first exposure hole 3011 is aligned to the input position of the material receiving mechanism 4, and the circuit board 9 is driven by the material receiving mechanism 4 to be separated from the detection board 301 and move along the conveying direction.
In this embodiment, the detection plate 301 is movably mounted on the turning support 304 through the lifting cylinder 305, the turning support 304 is movably mounted on the traverse screw rod assembly 303, that is, the turning support 304 moves on the traverse screw rod assembly 303 to drive the detection plate 301 to move between the blanking plate 101 and the receiving conveyor belt 401, so that the positions of the detection plate 301 and the quasi blanking plate 101 or the receiving conveyor belt 401 can be adjusted, and meanwhile, the lifting cylinder 305 drives the detection plate 301 to move up and down, so that the circuit board 9 can be better received.
In this embodiment, the blanking plate 101 conveys the circuit board 9 to the first glue coating mechanism 2, and the first glue coating mechanism 2 performs glue dispensing on the joints between the pin holes on the front surface of the circuit board 9 and the corresponding L-shaped pins 901; the rotary motor 302 drives the detection plate 301 to turn over for 90 degrees to enable the second exposure hole 3012 to face downwards, so that glue at the dispensing position on the circuit board 9 drips along the cavity and the second exposure hole 3012; the circuit board 9 is conveyed to a second glue coating mechanism 6 by a material receiving conveyer belt 401, glue is applied to the joints of the pin holes and the corresponding L-shaped pins 901 on the upper back surface of the circuit board 9 by the second glue coating mechanism 6, and the glue applying positions on the circuit board 9 are dried by waste heat; and a marking layer is arranged on the inner wall of the detection plate 301, and marking liquid is injected into the marking layer so as to mark the circuit board 9 passing through the conveying channel.
In this embodiment, the front and back of the circuit board 9 and the pin connection point can be glued by glue, and the blanking plate 101 is matched with the detection plate 301, so that the circuit board 9 is clamped into the detection plate 301 to dry and accelerate the solidification process of the glue gluing position, and each pin or the front and back of the circuit board 9 are marked, thereby facilitating the screening of unqualified products and improving the conveying and screening efficiency.
In this embodiment, the material receiving conveying belt 401 drives the detection board 301 to continue conveying along the conveying direction after contacting the detection board 301, and meanwhile, the material receiving conveying belt 401 can detect the marked position of the circuit board 9 by the detection board 301, that is, when detecting the specified number of L-shaped pins 901, the corresponding circuit board 9 is conveyed to the qualified product area, and when detecting that the specified number of L-shaped pins 901 is not reached or the front and back surfaces of the circuit board 9 are marked, the corresponding circuit board 9 is conveyed to the corresponding unqualified product area.
In this embodiment, the detection board 301 mainly plays a role in drying and marking the circuit board 9, if the corresponding L-shaped pins 901 penetrate through the pin holes on the circuit board 9, the circuit board 9 can be clamped in the detection board 301, and meanwhile, the arc-shaped slots 3013 and the embedded slots 3014 dry the dispensing positions on the circuit board 9 and mark the L-shaped pins 901, when the detection board 301 is turned over by 90 degrees, the excess glue can fall into the collection box along the conveying channel to be reused, and when the detection board 301 is turned over by 180 degrees, the circuit board 9 advances along the material receiving conveyer belt 401 to dispense glue on the turned surface; if the corresponding L-shaped pins 901 do not penetrate into the pin holes on the circuit board 9, the circuit board 9 directly slides onto the material receiving conveyer belt 401 from the conveying channel in the detection board 301, and the front and back sides of the circuit board 9 are marked by the marking layers on the inner wall of the detection board 301 in the process, so that the material receiving conveyer belt 401 can conveniently screen the circuit board.
In this embodiment, the circuit board 9 conveyed by the blanking plate 101 is inserted into the conveying channel in the detection plate 301, the bent portion of the upper half portion of the L-shaped pin 901 abuts against the arc-shaped slot 3013, that is, the arc-shaped slot 3013 is coated with a heat conducting agent, and a heating plate is arranged in the detection plate 301 to dry the dispensing position on the circuit board 9.
In this embodiment, on the one hand, the circuit board 9 is dried by the heat conducting agent, and meanwhile, when the circuit board 9 travels to the material receiving conveyor belt 401, residual heat still exists, and the circuit board 9 is dried again by the residual heat.
In this embodiment, the lower half portions of the L-shaped pins 901, which penetrate out of the circuit board 9, abut against the corresponding embedded grooves 3014, that is, a buffer layer is disposed in each embedded groove 3014, and a marking liquid is filled in the buffer layer to mark the L-shaped pins 901 embedded in the corresponding embedded grooves 3014.
In this embodiment, the buffer layer plays a role in marking the L-shaped pins 901, and can mark each L-shaped pin 901 on the circuit board 9, and the circuit board 9 can be summarized conveniently by detecting the L-shaped pin 901 marks at the second conveying device.
In this embodiment, a collecting box is disposed below the detecting plate 301 for collecting the glue dripping along the cavity and the second exposing hole 3012.
In this embodiment, the collection box is connected to the first glue storage tank 201 and the dispensing barrel 602, and the glue collected in the collection box is delivered to the first glue storage tank 201 and the dispensing barrel 602 through the glue delivery pump.
In this embodiment, through setting up the collecting box, realize glue reuse, practice thrift the processing cost.
In summary, the turnover mechanism is arranged to realize turnover of the circuit board in the conveying process, so that the front and back sides of the circuit board are coated with glue through the first gluing mechanism and the second gluing mechanism, the circuit board can be collected and sorted and then put on the blanking platform to be conveyed through the plurality of blanking mechanisms, the gluing position of the circuit board can be adjusted through mutual matching of the material receiving mechanism, the first rail mechanism and the second rail mechanism, the circuit board conveying and gluing efficiency is improved, and the circuit board conveying and gluing efficiency is improved.
The components selected for use in the present application (components not illustrated for specific structures) are all common standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experimentation.
In the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.