CN114609511A - Silicon-based liquid crystal aging detection equipment - Google Patents

Silicon-based liquid crystal aging detection equipment Download PDF

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Publication number
CN114609511A
CN114609511A CN202210500115.1A CN202210500115A CN114609511A CN 114609511 A CN114609511 A CN 114609511A CN 202210500115 A CN202210500115 A CN 202210500115A CN 114609511 A CN114609511 A CN 114609511A
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CN
China
Prior art keywords
chip
drawer
cabinet
control unit
plate
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Pending
Application number
CN202210500115.1A
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Chinese (zh)
Inventor
张华�
薛银飞
魏超
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Shanghai Filai Testing Technology Co ltd
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Shanghai Filai Testing Technology Co ltd
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Priority to CN202210500115.1A priority Critical patent/CN114609511A/en
Publication of CN114609511A publication Critical patent/CN114609511A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862Chambers or ovens; Tanks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865Holding devices, e.g. chucks; Handlers or transport devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Liquid Crystal (AREA)

Abstract

The invention discloses a silicon-based liquid crystal aging detection device which comprises a cabinet body and a drawer inserted in the cabinet body in a sliding manner, wherein a temperature control unit and a control unit are arranged in the cabinet body, a plurality of vacuum adsorption units are arranged in the drawer, a chip is fixedly adsorbed in the vacuum adsorption units, and the chip and the vacuum adsorption units are electrically connected with the temperature control unit and the control unit. According to the invention, the detected control equipment is arranged in the cabinet body, and only the chip clamp and the related electric connection device are arranged in the drawer, so that the structure is effectively simplified, the space utilization rate is improved, and the silicon-based liquid crystal chip and the clamp are convenient to disassemble and assemble; the silicon-based liquid crystal chip is fixed in the drawer through vacuum adsorption, so that the chip damage during detection is effectively avoided, the product damage rate is reduced, the qualification rate is improved, the product replacement is convenient, the aging efficiency is improved, and the detection requirements of the silicon-based liquid crystal chips of different models can be met.

Description

Silicon-based liquid crystal aging detection equipment
Technical Field
The invention relates to the technical field of chip detection, in particular to a silicon-based liquid crystal aging detection device.
Background
The liquid crystal on silicon is a matrix liquid crystal display device based on a reflection mode and with a very small size, and is manufactured on a silicon chip by adopting a CMOS technology. Since the silicon-based liquid crystal can modulate the wavelength and the phase of the light beam in space, the liquid crystal is widely applied to the display fields of high-definition projectors, augmented reality, virtual reality and the like. Meanwhile, in the field of optical communications, liquid crystal on silicon devices are also used for wavelength selective switches, optical modulation and demodulation apparatuses, and the like.
With the development of the domestic chip industry, the production line of the liquid crystal on silicon is gradually transferred from abroad to China, and the existing detection line of the liquid crystal on silicon is difficult to meet the increasing production requirement of the liquid crystal on silicon. The existing silicon-based liquid crystal aging detection equipment has the following problems:
1. the traditional clamp is adopted to clamp the silicon-based liquid crystal, so that the product is easy to damage during detection;
2. the space utilization rate of the detection equipment is low, and the detection quantity of each batch is small;
3. the replacement operation of the clamp is complicated, the detection is difficult to carry out aiming at the silicon-based liquid crystals of different models, and the compatibility is poor;
4. the temperature of adjacent chips is easy to influence each other during detection, and the detection accuracy is influenced.
Therefore, it is necessary to develop a new liquid crystal on silicon degradation detection apparatus.
Disclosure of Invention
The invention aims to provide silicon-based liquid crystal aging detection equipment, which solves the technical problems that the silicon-based liquid crystal aging detection equipment in the prior art is easy to damage products, low in space utilization rate, complex in clamp replacement operation and easy to influence adjacent chips mutually.
In order to achieve the purpose, the technical scheme of the invention is as follows:
the utility model provides a silicon-based liquid crystal aging detection equipment, includes a cabinet body and slides and inserts and establish the internal drawer of cabinet, the internal temperature control unit and the control unit of being equipped with of cabinet, be equipped with a plurality of vacuum adsorption units in the drawer, the absorption is fixed with the chip in the vacuum adsorption unit, chip and vacuum adsorption unit with temperature control unit and control unit electricity are connected.
On the basis of the technical scheme, the invention can be further improved as follows:
further, the vacuum adsorption unit comprises a sucker head, a sucker base, a heating sheet and a pressing plate which are sequentially stacked from top to bottom, the sucker head is fixed to the sucker base, a high-temperature-resistant sealing strip is arranged between the sucker head and the sucker base, a vacuum joint used for being connected with a vacuum generating device is arranged on the side face of the sucker base, the pressing plate and the sucker base are fixed to compress the heating sheet, a temperature sensor is arranged inside the sucker head, and the temperature sensor and the heating sheet are electrically connected with the temperature control unit.
Through adopting above-mentioned scheme, the sucking disc base passes through the external vacuum generating device of vacuum joint to adsorb fixedly to the chip through the sucking disc head, the heating plate is used for heating the chip and reaches ageing condition, and the temperature sensor of built-in the sucking disc head can give the internal temperature control unit of cabinet with temperature signal transmission, thereby control the operating temperature on the whole.
Furthermore, the vacuum adsorption unit is externally provided with a heat insulation unit, the heat insulation unit comprises a base arranged below the pressing plate, two ends of the base are symmetrically provided with vertically arranged baffles, two sides of the top surface of the base are symmetrically fixed with fixed blocks, the baffles and the fixed blocks are matched and wrapped outside the vacuum adsorption unit, the heat insulation unit further comprises a U-shaped heat insulation plate, and the heat insulation plate is vertically arranged and surrounded beside the base.
By adopting the scheme, the chip working area is wrapped by the pair of fixing blocks and the pair of baffles, the heat insulation plates are surrounded outside, mutual influence between adjacent chips is effectively avoided, and the influence of external environment temperature is also avoided.
Further, the drawer is inside to be divided into and to keep away from the chip mounting area of cabinet body one side and the electric connection district that is close to cabinet body one side, chip mounting area bottom is equipped with the mounting panel, align to grid has a plurality of on the mounting panel the vacuum adsorption unit, the electric connection district is equipped with a main PCB board, main PCB board pass through the cable with temperature control unit and the control unit electricity are connected, be equipped with the confession on the drawer the opening that the cable passed, each vacuum adsorption unit and its absorption fixed chip pass through the linkage unit with main PCB board electricity is connected.
Further, the linkage unit includes along the orientation crimping PCB board and vice PCB board that cabinet body direction set gradually, vice PCB board is fixed electric connection district bottom, and vice PCB board one side with main PCB board electric connection, the opposite side top surface is equipped with the slot, crimping PCB board one side top surface be equipped with the plug that the slot matches, the opposite side is equipped with and compresses tightly the L shape linkage segment that chip surface electricity is connected, be equipped with the support on the mounting panel crimping PCB board the supporting pin, set up on the crimping PCB board with the support pin assorted supports the hole.
Through adopting above-mentioned scheme, when needing to be changed the product, on pull out dismantle the crimping PCB board can, after the product safety is accomplished, press the cover under with the crimping PCB board and establish and can accomplish the installation on the supporting pin, the operation is safe convenient.
Further, a mounting frame is fixed to the top of the chip mounting area, and a cover plate used for sealing the chip mounting area is mounted in the mounting frame through a hinge.
Through adopting above-mentioned scheme, the apron plays the effect of sealed chip installing zone to a certain extent to further avoid external environment to the influence of chip operation, when needing to be changed the product, open the apron can.
Furthermore, a cable protection chain for protecting the cable is arranged between the drawer and the cabinet body.
Further, the top of the cabinet body and the corresponding position of the chip mounting area are provided with a frame plate, the temperature control unit comprises a heat dissipation fan arranged on the frame plate and a temperature control box arranged on one side of the inside of the cabinet body, a heat dissipation hole corresponding to the position of the heat dissipation fan is formed in the top plate of the cabinet body, a fan cover is arranged in the heat dissipation hole, and the control unit comprises a control box arranged on the other side of the inside of the cabinet body.
By adopting the scheme, the temperature control box controls the heating sheet and the heat radiating fan to work according to the signal of the temperature sensor, so that the running temperature of the chip is controlled.
Furthermore, a latch lock is arranged between one end face of the drawer close to the cabinet body and one end face of the cabinet body far away from the drawer.
Through adopting above-mentioned scheme, set up the locking of latch assurance drawer under the running state.
Furthermore, the drawer both sides are equipped with the slider, the internal portion of cabinet be equipped with the slide rail that the slider matches.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the detected control equipment is arranged in the cabinet body, and only the chip clamp and the related electric connection device are arranged in the drawer, so that the structure is effectively simplified, the space utilization rate is improved, and the silicon-based liquid crystal chip and the clamp are convenient to disassemble and assemble;
2. the silicon-based liquid crystal chip is fixed in the drawer through vacuum adsorption, so that the damage of the chip during detection is effectively avoided, the product damage rate is reduced, the qualification rate is improved, the product replacement is convenient, the aging efficiency is improved, and the silicon-based liquid crystal chip detection device can meet the detection requirements of silicon-based liquid crystal chips of different models.
Drawings
In order to more clearly illustrate the detailed description of the invention or the technical solutions in the prior art, the drawings that are needed in the detailed description of the invention or the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Fig. 2 is a schematic structural view of the cabinet of the embodiment of the invention with the top plate removed.
Fig. 3 is a schematic view of the internal structure of the cabinet according to the embodiment of the present invention.
Fig. 4 is a schematic top view of a drawer according to an embodiment of the present invention.
Fig. 5 is a schematic structural view of the drawer of the embodiment of the present invention with the mounting frame and the cover plate removed.
Fig. 6 is a schematic structural view of a compression-bonded PCB board according to an embodiment of the present invention.
Fig. 7 is a schematic structural view of a heat insulating and preserving unit of an embodiment of the present invention.
Fig. 8 is a schematic structural view of a vacuum adsorption unit of an embodiment of the present invention.
Shown in the figure:
1. a cabinet body; 1-1, a frame plate; 1-2, a heat radiation fan; 1-3, a fan cover; 1-4, a slide rail;
2. a drawer; 2-1, a chip mounting area; 2-1-1, mounting a plate; 2-1-2, supporting pins; 2-1-3, installing a frame; 2-1-4, cover plate; 2-2, an electrical connection region; 2-2-1, a main PCB; 2-3, a sliding block; 2-4, opening;
3. a vacuum adsorption unit; 3-1, a sucker head; 3-2, a sucker base; 3-3, heating plates; 3-4, pressing a plate; 3-5, a temperature sensor;
4. a heat insulation and preservation unit; 4-1, a base; 4-2, a baffle; 4-3, fixing blocks; 4-4, a heat insulation plate;
5. a connection unit; 5-1, an auxiliary PCB; 5-2, pressing the PCB; 5-2-1, plug; 5-2-2, L-shaped connecting section;
6. a cable protection chain;
7. a temperature control box;
8. a control box;
9. and (4) latch locking.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the invention pertains.
As shown in fig. 1-8, the silicon-based liquid crystal aging detection apparatus provided in this embodiment includes a cabinet 1 and a drawer 2 slidably inserted in the cabinet 1, a temperature control unit and a control unit are disposed in the cabinet 1, a vacuum adsorption unit 3 is disposed in the drawer 2, a chip is fixed in the vacuum adsorption unit 3 by adsorption, and the chip and the vacuum adsorption unit 3 are electrically connected to the temperature control unit and the control unit.
A latch 9 is arranged between one end face of the drawer 2 close to the cabinet body 1 and one end face of the drawer 2 far away from the cabinet body 1, and the latch 9 is arranged to ensure the locking of the drawer 2 in a running state.
The two sides of the drawer 2 are provided with sliding blocks 2-3, and the cabinet body 1 is internally provided with sliding rails 1-4 matched with the sliding blocks 2-3.
Specifically, the interior of the drawer 2 is divided into a chip mounting area 2-1 far away from one side of the cabinet body 1 and an electric connection area 2-2 close to one side of the cabinet body 1, the bottom of the chip mounting area 2-1 is provided with a mounting plate 2-1-1, four vacuum adsorption units 3 are uniformly arranged on the mounting plate 2-1-1, the electric connection area 2-2 is provided with a main PCB 2-2-1, the main PCB 2-2-1 is electrically connected with the temperature control unit and the control unit through cables (not shown in the figure), the drawer 2 is provided with an opening 2-4 for the cables to pass through, and each vacuum adsorption unit 3 and a chip adsorbed and fixed by the vacuum adsorption unit are electrically connected with the main PCB 2-2-1 through a connection unit 5.
The connecting unit 5 comprises a crimping PCB 5-2 and an auxiliary PCB 5-1 which are sequentially arranged along the direction towards the cabinet body 1, the auxiliary PCB 5-1 is fixed at the bottom of the electric connecting area 2-2, one side of the auxiliary PCB 5-1 is electrically connected with the main PCB 2-2-1, the top surface of the other side is provided with a slot, the top surface of one side of the crimping PCB 5-2 is provided with a plug 5-2-1 matched with the slot, the other side is provided with an L-shaped connecting section 5-2-2 tightly pressed on the surface of the chip and electrically connected with the L-shaped connecting section, the mounting plate 2-1-1 is provided with a supporting pin 2-1-2 supporting the crimping PCB 5-2, and the crimping PCB 5-2 is provided with a supporting hole matched with the supporting pin 2-1-2.
When a product needs to be replaced, the compression joint PCB 5-2 is pulled up and detached, after the product is safely finished, the compression joint PCB 5-2 is pressed down and sleeved on the supporting pin 2-1-2, and the installation can be finished, so that the operation is safe and convenient.
The vacuum adsorption unit 3 comprises a sucker head 3-1, a sucker base 3-2, a heating sheet 3-3 and a pressing plate 3-4 which are sequentially stacked from top to bottom, the sucker head 3-1 is fixed with the sucker base 3-2, a high-temperature-resistant sealing strip is arranged between the sucker head 3-1 and the sucker base 3-2, a vacuum joint for connecting with a vacuum generating device is arranged on the side surface of the sucker base 3-2, the pressing plate 3-4 and the sucker base 3-2 are fixed to compress the heating sheet 3-3, a temperature sensor 3-5 is arranged in the sucker head 3-1, and the temperature sensor 3-5 and the heating sheet 3-3 are electrically connected with a temperature control unit.
The sucker base 3-2 is externally connected with a vacuum generating device through a vacuum joint, so that the chip is adsorbed and fixed through the sucker head 3-1, the heating plate 3-3 is used for heating the chip to reach an aging condition, the sucker head 3-1 and the sucker base 3-2 are made of red copper materials with strong heat conductivity, the temperature of the heating plate 3-3 can be rapidly transmitted to the adsorbed chip, and the temperature sensor 3-5 built in the sucker head 3-1 can transmit a temperature signal to the temperature control unit in the cabinet body 1, so that the operation temperature is integrally controlled.
The vacuum adsorption unit 3 is externally provided with a heat insulation unit 4, the heat insulation unit 4 comprises a base 4-1 arranged below a pressing plate 3-4, two ends of the base 4-1 are symmetrically provided with vertically arranged baffles 4-2, two sides of the top surface of the base 4-1 are symmetrically fixed with fixed blocks 4-3, a pair of baffles 4-2 and the fixed blocks 4-3 are matched and wrapped outside the vacuum adsorption unit 3, the heat insulation unit 4 further comprises a U-shaped heat insulation plate 4-4, and the heat insulation plate 4-4 is vertically arranged and surrounds the side of the base 4-1.
The fixing block 4-3, the baffle 4-2 and the heat insulation plate 4-4 are made of PEEK materials, and heat is effectively isolated.
The working areas of the chips are wrapped by the pair of fixing blocks 4-3 and the pair of baffles 4-2, and the heat insulation plates 4-4 are surrounded outside, so that mutual influence between adjacent chips is effectively avoided, and influence of external environment temperature is also avoided.
The top of the chip mounting area 2-1 is fixed with a mounting frame 2-1-3, and a cover plate 2-1-4 for sealing the chip mounting area 2-1 is arranged in the mounting frame 2-1-3 through a hinge.
The cover plate 2-1-4 plays a role in sealing the chip mounting area 2-1 to a certain extent, so that the influence of the external environment on the operation of the chip is further avoided, and when a product needs to be replaced, the cover plate 2-1-4 is opened.
The top of the cabinet body 1 is provided with a frame plate 1-1 corresponding to the chip mounting area 2-1, the temperature control unit comprises a cooling fan 1-2 arranged on the frame plate 1-1 and a temperature control box 7 arranged on one side of the inside of the cabinet body 1, the top plate of the cabinet body 1 is provided with a cooling hole corresponding to the cooling fan 1-2, a fan cover 1-3 is arranged in the cooling hole, and the control unit comprises a control box 8 arranged on the other side of the inside of the cabinet body 1.
The temperature control box 7 controls the heating sheet 3-3 and the cooling fan 1-2 to work according to signals of the temperature sensor 3-5, so that the running temperature of the chip is controlled.
A cable protection chain 6 for protecting cables is arranged between the drawer 2 and the cabinet body 1, the cable protection chain 6 is arranged between the opening 2-4 of the drawer 2 and the frame plate 1-1, and the cables are protected when the drawer 2 slides.
The controlgear that this embodiment will detect all sets up in the cabinet body 1, only set up chip anchor clamps and relevant electric connection device in the drawer 2, effectively simplify the structure, and convenient to detach installation silicon-based liquid crystal chip and anchor clamps, silicon-based liquid crystal chip passes through vacuum adsorption to be fixed in drawer 2, chip damage when having effectively avoided detecting, reduce the product spoilage, improve the qualification rate, and it is convenient to change the product, improve ageing efficiency, but the detection demand of the silicon-based liquid crystal chip of the different models of adaptation.
In the description of the present invention, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description.

Claims (10)

1. The silicon-based liquid crystal aging detection equipment is characterized by comprising a cabinet body and a drawer which is inserted in the cabinet body in a sliding mode, wherein a temperature control unit and a control unit are arranged in the cabinet body, a plurality of vacuum adsorption units are arranged in the drawer, a chip is fixedly adsorbed in the vacuum adsorption units, and the chip and the vacuum adsorption units are electrically connected with the temperature control unit and the control unit.
2. The LCOS aging testing device of claim 1, wherein the vacuum absorption unit comprises a sucker head, a sucker base, a heating plate and a pressing plate which are sequentially stacked from top to bottom, the sucker head is fixed with the sucker base, a high temperature resistant sealing strip is arranged between the sucker head and the sucker base, a vacuum joint for connecting with a vacuum generating device is arranged on the side surface of the sucker base, the pressing plate and the sucker base are fixed to compress the heating plate, a temperature sensor is arranged in the sucker head, and the temperature sensor and the heating plate are electrically connected with the temperature control unit.
3. The LCOS aging testing device of claim 2, wherein a heat insulation and preservation unit is arranged outside the vacuum absorption unit, the heat insulation and preservation unit comprises a base arranged below the pressing plate, vertically arranged baffles are symmetrically arranged at two ends of the base, fixed blocks are symmetrically fixed at two sides of the top surface of the base, a pair of the baffles and the fixed blocks are matched and wrapped outside the vacuum absorption unit, the heat insulation and preservation unit further comprises a U-shaped heat insulation plate, and the heat insulation plate is vertically arranged and surrounded beside the base.
4. The LCOS aging testing apparatus of claim 1, wherein the interior of the drawer is divided into a chip mounting area far away from one side of the cabinet and an electrical connection area near one side of the cabinet, a mounting plate is disposed at the bottom of the chip mounting area, a plurality of the vacuum adsorption units are uniformly arranged on the mounting plate, the electrical connection area is provided with a main PCB, the main PCB is electrically connected with the temperature control unit and the control unit through cables, the drawer is provided with openings for the cables to pass through, and each of the vacuum adsorption units and the chips adsorbed and fixed by the vacuum adsorption units are electrically connected with the main PCB through connection units.
5. The LCOS aging detection device as recited in claim 4, wherein the connection unit comprises a press-connection PCB and an auxiliary PCB sequentially arranged along a direction toward the cabinet, the auxiliary PCB is fixed at the bottom of the electrical connection region, one side of the auxiliary PCB is electrically connected with the main PCB, the other side of the auxiliary PCB is provided with a slot, the press-connection PCB is provided with a plug matched with the slot on one side, the other side of the press-connection PCB is provided with an L-shaped connection section pressed on the surface of the chip and electrically connected with the chip, the mounting plate is provided with a support pin for supporting the press-connection PCB, and the press-connection PCB is provided with a support hole matched with the support pin.
6. The LCOS aging test device according to claim 4, wherein a mounting frame is fixed on the top of the chip mounting region, and a cover plate for sealing the chip mounting region is mounted in the mounting frame through a hinge.
7. The LCOS aging test device according to claim 4, wherein a cable protection chain for protecting cables is provided between said drawer and said cabinet.
8. The LCOS aging testing apparatus of claim 1, wherein a frame plate is disposed at a position corresponding to the chip mounting region at the top of the cabinet, the temperature control unit comprises a heat dissipation fan disposed on the frame plate and a temperature control box disposed at one side of the cabinet, a heat dissipation hole corresponding to the position of the heat dissipation fan is disposed on the top plate of the cabinet, a fan housing is disposed in the heat dissipation hole, and the control unit comprises a control box disposed at the other side of the cabinet.
9. The LCOS degradation testing apparatus of claim 1, wherein a latch is disposed between an end surface of the drawer near the cabinet and an end surface of the cabinet far from the drawer.
10. The LCOS aging testing apparatus of claim 1, wherein sliding blocks are disposed on two sides of the drawer, and a sliding rail matched with the sliding blocks is disposed inside the cabinet.
CN202210500115.1A 2022-05-10 2022-05-10 Silicon-based liquid crystal aging detection equipment Pending CN114609511A (en)

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Application Number Priority Date Filing Date Title
CN202210500115.1A CN114609511A (en) 2022-05-10 2022-05-10 Silicon-based liquid crystal aging detection equipment

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Application Number Priority Date Filing Date Title
CN202210500115.1A CN114609511A (en) 2022-05-10 2022-05-10 Silicon-based liquid crystal aging detection equipment

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CN114609511A true CN114609511A (en) 2022-06-10

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CN211305632U (en) * 2019-12-27 2020-08-21 成都凯特万瑞精密机械有限公司 Vacuum chuck tool platform
CN113866585A (en) * 2020-06-30 2021-12-31 武汉普斯讯科技有限公司 Miniature laser chip aging test system
CN214300168U (en) * 2021-01-13 2021-09-28 深圳华大智造科技股份有限公司 Sequencing chip, sequencing chip module and sequencing equipment
CN113092994A (en) * 2021-06-08 2021-07-09 上海菲莱测试技术有限公司 High-power optical chip detection platform
CN215069918U (en) * 2021-06-24 2021-12-07 南昌凯捷半导体科技有限公司 Vacuum chuck for wafer processing and automatic thinning machine

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Application publication date: 20220610