CN109587931A - The test method of circuit board assemblies, electronic equipment and circuit board assemblies - Google Patents
The test method of circuit board assemblies, electronic equipment and circuit board assemblies Download PDFInfo
- Publication number
- CN109587931A CN109587931A CN201811469029.9A CN201811469029A CN109587931A CN 109587931 A CN109587931 A CN 109587931A CN 201811469029 A CN201811469029 A CN 201811469029A CN 109587931 A CN109587931 A CN 109587931A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- test
- board assemblies
- test end
- switch module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2843—In-circuit-testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Abstract
This application provides the test methods of a kind of circuit board assemblies, electronic equipment and circuit board assemblies, circuit board assemblies include circuit board, are fixed on the functional module of circuit board and are fixed on the switch module of circuit board, circuit board is equipped with test end, functional module, switch module and test end are sequentially connected electrically, test end connects or disconnects with test end and test fixture to be electrically connected test fixture, switch module and is in closed state or off-state.When using test fixture connecting test end, it can control switch module and enter closed state, so that functional module and test end are conducted, and then convenient for carrying out data correction to functional module；After data correction is completed, it can control switch module and enter off-state, so that functional module and test end disconnect, so that test end be avoided to contact other conductors and short-circuit.
Description
Technical field
This application involves the technical fields of circuit board, and in particular to a kind of circuit board assemblies, electronic equipment and circuit board group
The test method of part.
Background technique
Electronic equipment includes circuit board assemblies at present, and circuit board assemblies include circuit board and the function that is fixedly connected with circuit board
Energy module, circuit board are equipped with the hard contact of electrical connection function mould group, usually connect hard contact using test fixture, and then right
Functional module carries out data correction, but tests after completion, it is also necessary to which additional setting silica gel part seals hard contact, to avoid gold
Belong to contact to contact with other conductors and short-circuit.
Summary of the invention
The embodiment of the present application provides a kind of circuit board assemblies, and the circuit board assemblies include circuit board, are fixed on the electricity
The functional module of road plate and the switch module for being fixed on the circuit board, the circuit board are equipped with test end, the function mould
Block, the switch module and the test end are sequentially connected electrically, and the test end is described to open to be electrically connected test fixture
Module is closed to connect or disconnect with the test end and the test fixture and be in closed state or off-state.
The embodiment of the present application also provides a kind of electronic equipment, and the electronic equipment includes circuit board assemblies as described above.
The embodiment of the present application also provides a kind of test method of circuit board assemblies, the test method packet of the circuit board assemblies
Include following step:
A circuit board assemblies are provided, the circuit board assemblies include circuit board, the functional module for being fixed on the circuit board
With the switch module for being fixed on the circuit board, the circuit board is equipped with test end, the functional module, the switch module
It is sequentially connected electrically with the test end；
One test fixture is provided；
The test fixture is connected into the test end；
It controls the switch module and enters closed state, so that the functional module is connected with the test end；
Data are carried out to the functional module through the test end and the switch module by the test fixture to rectify
Just；
The test fixture and the test end are disconnected；
It controls the switch module and enters off-state, so that the functional module is disconnected with the test end.
The embodiment of the present application provides the test method of a kind of circuit board assemblies, electronic equipment and circuit board assemblies, passes through institute
Stating circuit board assemblies includes circuit board, the functional module for being fixed on the circuit board and the switch being electrically connected with the functional module
Module, and the circuit board is equipped with the test end being electrically connected with the switch module, when utilization test fixture connecting test end
When portion, it can control the switch module and enter closed state, so that the functional module and the test end are conducted,
And then convenient for carrying out data correction to functional module；After data correction is completed, it can control the switch module and enter disconnection
State is led so that the functional module and the test end disconnect so that the test end be avoided to contact other
Body and it is short-circuit.
Detailed description of the invention
Technical solution in ord to more clearly illustrate embodiments of the present application, below will be to needed in the embodiment attached
Figure is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for this field
For those of ordinary skill, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram one of circuit board assemblies provided by the embodiments of the present application；
Fig. 2 is the structural schematic diagram two of circuit board assemblies provided by the embodiments of the present application；
Fig. 3 is the schematic cross-section in Fig. 2 at P-P；
Fig. 4 is the structural schematic diagram three of circuit board assemblies provided by the embodiments of the present application；
Fig. 5 is the schematic cross-section in Fig. 4 at Q-Q；
Fig. 6 is the structural schematic diagram four of circuit board assemblies provided by the embodiments of the present application；
Fig. 7 is the structural schematic diagram five of circuit board assemblies provided by the embodiments of the present application；
Fig. 8 is the structural schematic diagram six of circuit board assemblies provided by the embodiments of the present application；
Fig. 9 is the structural schematic diagram of electronic equipment provided by the embodiments of the present application；
Figure 10 is the flow diagram of the test method of circuit board assemblies provided by the embodiments of the present application.
Specific embodiment
Referring to Fig. 1, the embodiment of the present application provides a kind of circuit board assemblies 100.The circuit board assemblies 100 include circuit
Plate 10, the functional module 20 for being fixed on the circuit board 10 and the switch module 30 for being fixed on the circuit board 10.The circuit
Plate 10 is equipped with test end 11.The functional module 20, the switch module 30 and the test end 11 are sequentially connected electrically.Institute
Test end 11 is stated to be electrically connected test fixture 200.The switch module 30 is controlled with the test end 11 and the test
Tool 200 connects or disconnects and is in closed state or off-state.It is understood that the circuit board assemblies 100 can answer
For smart phone, smartwatch, laptop or wearable smart machine.
By the circuit board assemblies 100 include circuit board 10, be fixed on the circuit board 10 functional module 20 and with
The switch module 30 that the functional module 20 is electrically connected, and the circuit board 10 is equipped with the survey being electrically connected with the switch module 30
End 11 is tried, when using 200 connecting test end 11 of test fixture, can control the switch module 30 into closed form
State so that the functional module 20 and the test end 11 are conducted, and then is rectified convenient for carrying out data to functional module 20
Just；After data correction is completed, the switch module 30 can control into off-state, so that 20 He of the functional module
The test end 11 disconnects, to avoid the test end 11 from contacting other conductors and short-circuit.
In present embodiment, the functional module 20 can be fixed on the circuit board 10 by modes such as welding.Institute
Stating circuit board assemblies 100 may include multiple functional modules 20, and multiple functional modules 20 are fixed on the circuit board
On 10, i.e., multiple functional modules 20 are integrated on the described circuit board 10, and multiple functional modules 20 can be distinguished
For realizing power management, the driving of display screen 80 and the different function such as communication management, so that the circuit board assemblies 100 can be with
By the function element connection different from battery, display screen 80 and antenna etc. of multiple functional modules 20, and then drive different
Function element work.
The switch module 30 is for realizing the functional module 20 and 11 mutual conduction of test end or the company of disconnection
It connects.The test end 11 can be metal gasket, and the test end 11 is set to the edge of the circuit board 10.It is described
Test end 11 is conductive, and the test end 11 can be electrically connected test fixture 200.The test end 11 with it is described
The state that test fixture 200 is electrically connected can control the switch module 30 by the methods of software control and enter closed state,
So that the functional module 20 and 11 mutual conduction of test end, so that the test fixture 200 can be through the test
End 11 and the switch module 30 are electrically connected the functional module 20, and then the test fixture 200 can be to the function
Module 20 carries out data correction.The state that the test end 11 is disconnected in the test fixture 200, i.e., to the function
After module 20 completes data correction work, the switch module 30 can be controlled by the methods of software control and enters disconnection shape
State, so that the functional module 20 is disconnected with the test end 11, thus the test end 11 and metalwork or liquid
The case where body contacts will not cause short circuit, the protection to functional module 20 may be implemented, and need not seal using insulating part
The test end 11, advantageously reduces cost.
Referring to Fig. 2, further, the circuit board assemblies 100 further include shielding case 40, the shielding case 40 is fixed to be connected
The circuit board 10 is connect, the functional module 20 and the switch module 30 are located at 40 inside of shielding case, the test lead
Portion 11 is located at 40 outside of shielding case.
In present embodiment, the shielding case 40 is metalwork, passes through the functional module 20 and the switch module 30
Positioned at 40 inside of shielding case, the shielding case 40 can shield external electromagnetic waves, to reduce the functional module 20 and institute
State the electromagnetic interference that switch module 30 is subject to.The shielding case 40 has preferable structural strength, and the shielding case 40 can be right
The functional module 20 and the switch module 30 are protected, and the functional module 20 or the switch module 30 is avoided to be pressurized
Damage.The shielding case 40 is tightly connected the circuit board 10, and sealing is formed between the shielding case 40 and the circuit board 10
Space 41.
Referring to Fig. 3, the shielding case 40 is in rectangle, the shielding case 40 includes side plate 42 and the connection side plate 42
Top plate 43.The side plate 42 can be fixed on the circuit board 10 by the modes such as welding or screw connection.The side plate
42 are tightly connected with the circuit board 10.The top plate 43 is removably attachable to the side plate 42 away from the circuit board 10 1
Side.The shielding case 40 further includes the sealing element 44 that sealing is matched between the side plate 42 and the top plate 43.The sealing
Part 44 can be silica gel ring.The top plate 43 can be connected together with the side plate 42.The top plate 43, the side plate 42 and institute
It states and forms the sealing space 41 between circuit board 10.The functional module 20 and the switch module 30 are contained in described close
It seals in space 41, so that the functional module 20 and the switch module 30 are hidden in the shielding case 40.The shielding case
40 can be entered in the sealing space 41 with barrier liquid, so that the functional module 20 or the switch module 30 be avoided to contact
Liquid and it is short-circuit.The state that the switch module 30 disconnects, the test end 11 are disconnected with the functional module 20, can
It is short-circuit to avoid 11 contact liq of test end, and the shielding case 40 can protect the functional module 20 and institute
It states switch module 30 to invade from liquid, so as to improve the security performance of the circuit board assemblies 100.
Referring to Fig. 4, further, the circuit board 10 is equipped with device mounting region 12, institute on the outside of the shielding case 40
Test end 11 is stated to be located in the device mounting region 12.In present embodiment, the device mounting region 12 is located at the shielding
40 outside of cover, the devices such as the connector 50 so that device mounting region 12 can be used for arranging.The test end 11 is located at institute
It states in device mounting region 12, i.e., the described test end 11 occupies the space of 12 part of device mounting region.When the utilization survey
It tries jig 200 to complete after carrying out data correction to the functional module 20, is entered by the control switch module 30 and disconnected
State so that the test end 11 is disconnected with the functional module 20, even if thus even if the test end 11 with
Metal pieces into contact will not be short-circuit, then the metal device being installed in the device mounting region 12 is without avoiding the test end
11, so that the test end 11 will not tie up installation space of other metal devices in the device mounting region 12.
Referring to Fig. 4, further, the circuit board assemblies 100 further include connector 50 and metal platen 60, the company
It connects device 50 to be fixed in the device mounting region 12, and is electrically connected the functional module 20, the metal platen 60 is fixedly connected
The connector 50 and the circuit board 10, and cover the test end 11.
Referring to Fig. 5, the connector 50 can be board to board connector (Board-to- in present embodiment
board Connectors).The metal platen 60 is used to the connector 50 being pressed on the circuit board 10, to guarantee
The connector 50 is bonded with the circuit board 10, and the connector 50 is avoided to fall off from the circuit board 10.It can be with
It is connected by screw to equal directions the metal platen 60 is fixed on the circuit board 10.The metal platen 60 is held in institute
Connector 50 is stated away from 10 side of circuit board, so that the metal platen 60 applies pressure to the connector 50, thus
The connector 50 is pressed on the circuit board 10 by realization.It can complete using the test fixture 200 to the function
After energy module 20 carries out data correction, first the test end 11 is disconnected with the functional module 20, then will be described
Metal platen 60 is mounted on the circuit board 10, thus will not the metal platen 60 contradicts test end 11
Cause short circuit.The test end 11 is metal gasket, covers the test end 11 by the metal platen 60, i.e., described
Metal platen 60 is superimposed on the test end 11, so that the metal platen 60 and 11 common sparing of test end are empty
Between, be conducive to the space utilization rate for improving circuit board 10.
Referring to Fig. 6, further, the switch module 30 is equipped with the first pad 31 and relatively described first pad 31 is set
The second pad 32 set, and the logic circuit 33 of connection the first pad 31 and the second pad 32, first pad 31 are electrically connected
The functional module 20 is connect, second pad 32 is electrically connected the test end 11, and the logic circuit 33 is with the test
End 11 and the test fixture 200 connect or disconnect and are in closed state or off-state.
In present embodiment, the logic circuit 33 include be connected to first pad 31 and second pad 32 it
Between switching device 34.First pad 31 and institute can may be implemented by controlling 34 closing or opening of switching device
State 32 mutual conduction of the second pad or disconnect, so realize connect the functional module 20 of first pad 31 with connect institute
It states 11 mutual conduction of test end of the second pad 32 or disconnects.The switch module 30 is equipped with multiple institutes arranged side by side
The first pad 31 is stated, the first pad 31 described in wherein at least one and 32 phase of the second pad may be selected in the logic circuit 33
Conducting.Multiple functional modules 20 are electrically connected multiple first pads 31.It is led with each 20 phase of functional module
The number of the first logical pad 31 can be one or more.
Referring to Fig. 7, the switch module 30 is equipped with second pad 32 in a kind of embodiment.The electricity
Road plate 10 is equipped with a test end 11.The switching device 34 can be single pole multiple throw, the switching device 34
With fixing end 35 and multiple selection ends 36.The fixing end 35 is connected to second pad 32, multiple selection ends 36
It is connected to multiple first pads 31.The logic circuit 33 can choose one of multiple described selection ends 36 can
To be conducted with the fixing end 35, realizes and one of multiple described first pads 31 is selected to lead with 32 phase of the second pad
It is logical, and then one of multiple described functional modules 20 of realization are conducted with the test end 11.When needing using the survey
When examination jig 200 tests the circuit board assemblies 100, multiple functional modules are selected by the logic circuit 33
One of 20 are conducted with the test end 11, and then can be by the test fixture 200 to selected functional module
20 carry out data correction, and by selecting different functional modules 20 to be tested, the data of the functional module 20 may be implemented
Correction；And due to only needing that a test end 11 is arranged on the circuit board 10, it is possible to reduce the test lead
The quantity and occupied space in portion 11.
Referring to Fig. 8, the switch module 30 is equipped with multiple second pads arranged side by side in another embodiment
32.Multiple second pads 32 are corresponded with multiple first pads 31.The circuit board 10 is equipped with multiple surveys
Try end 11.Multiple test ends 11 are electrically connected multiple second pads 32.The logic circuit 33 includes more
A switching device 34.Each switching device 34 is connected to opposite first pad 31 and second pad 32
Between.By controlling the on off operating mode of multiple switching devices 34 respectively, so that the logic circuit 33 can choose at least
One first pad 31 is conducted with the second pad 32 described at least one.In present embodiment, described in needs utilization
When test fixture 200 tests the circuit board assemblies 100, can choose multiple first pads 31 respectively with it is multiple
Second pad 32 is conducted, so may be implemented multiple functional modules 20 respectively through the switching device 34 with it is multiple
The test end 11 is conducted, consequently facilitating carrying out data correction to multiple functional modules 20 simultaneously, realizes parallel place
Reason is conducive to improve testing efficiency.
Referring to Fig. 9, the embodiment of the present application also provides a kind of electronic equipment 300, the electronic equipment 300 includes institute as above
The circuit board assemblies 100 stated.The electronic equipment 300 further include shell 70 with the display screen 80 that is fixedly connected with the shell 70,
Accommodating chamber 71 is formed between the shell 70 and the display screen 80, the circuit board assemblies 100 are fixed on the accommodating chamber 71
It is interior.The shell 70 includes frame 72 and the backboard 73 that is fixedly connected with the frame 72.The frame 72 is fixed on the display
The edge of screen 80.The backboard 73 is fixed on the frame 72 away from 80 side of display screen.The backboard 73 with it is described
Frame 72 is wholely set or the backboard 73 is connect with 72 detachability of frame.The accommodating chamber 71 is formed in institute
It states between display screen 80, the frame 72 and the backboard 73.The circuit board assemblies 100 are electrically connected the display screen 80, from
And the display screen 80 can be driven to show picture by the circuit board assemblies 100.It is understood that the electronic equipment
300 can be smart phone, smartwatch, laptop or wearable smart machine.
Referring to Fig. 10, the embodiment of the present application also provides a kind of test method of circuit board assemblies, the circuit board assemblies
Test method include the following steps, namely 101 to step 107:
101: providing a circuit board assemblies 100, the circuit board assemblies 100 include circuit board 10, are fixed on the circuit
The functional module 20 of plate 10 and the switch module 30 being electrically connected with the functional module 20, the circuit board 10 are equipped with and open with described
Close the test end 11 that module 30 is electrically connected.
In a step 101, the functional module 20, the switch module 30 and the test end 11 are sequentially connected electrically.
The test end 11 is for being electrically connected test fixture 200.The switch module 30 is with the test end 11 and the test
Jig 200 connects or disconnects and is in closed state or off-state.The switch can be controlled by modes such as software controls
Module 30 enters closed state or off-state.The circuit board assemblies 100 further include the control being fixed on the circuit board 10
Device 90 processed.Close command or open command can be issued to the switch module 30 by the controller 90, it is described to control
Switch module 30 enters closed state or off-state.
In first embodiment, the circuit board 10 is equipped with a test end 11.The switch module 30 includes
It is electrically connected the logic circuit 33 of the functional module 20 and the test end 11.The logic circuit 33 includes switching device
34.The switching device 34 can be single pole multiple throw, and the switching device 34 has fixing end 35 and multiple selection ends 36.
The fixing end 35 is electrically connected the test end 11, and multiple selection ends 36 are electrically connected the functional module 20.Institute
Stating logic circuit 33 and can choose one of multiple described selection ends 36 can be conducted with the fixing end 35, realize multiple
One of described functional module 20 is conducted with the test end 11.
In second embodiment, the circuit board 10 is equipped with multiple test ends 11.The logic circuit 33 includes
It is separately connected the multiple switch device 34 of multiple functional modules 20.Each switching device 34 is electrically connected each survey
Try end 11.By controlling the on off operating mode of multiple switching devices 34 respectively, the logic circuit 33 be can choose at least
One functional module 20 is conducted with test end 11 described at least one.
102: a test fixture 200 is provided.
In a step 102, the test fixture 200 is for correcting the parameters of the circuit board assemblies 100.
103: the test fixture 200 is connected into the test end 11.
104: controlling the switch module 30 into closed state, so that the functional module 20 and the test end 11
Conducting.
At step 104, in the first embodiment, it is issued and is closed to the switch module 30 by the controller 90
Instruction one of control the switch module 30 into closed state, and select multiple selection ends 36 can with it is described
Fixing end 35 is conducted, so that one of multiple described functional modules 20 be selected to be conducted with the test end 11.With one
The number for the test end 11 that a functional module 20 is conducted can be one or more.
In this second embodiment, close command is issued to the switch module 30 by the controller 90, control is extremely
A few switch module 30 enters closed state, and then at least one described functional module 20 may be implemented respectively and at least
One test end 11 is conducted.The number for the test end 11 being conducted with each functional module 20 can be one
It is a or multiple.
105: by the test fixture 200 through the test end 11 and the switch module 30 to the functional module
20 carry out data correction.
In the first embodiment, at step 104, one of multiple described functional modules 20 are through the switching device
34 are conducted with the test end 11, in step 105, can use the test fixture 200 to selected functional module
20 are corrected.Multiple functional modules 20 can may be implemented by selecting different functional modules 20 to be tested
Data correction.
In this second embodiment, at step 104, multiple functional modules 20 respectively through the switching device 34 with
Multiple test ends 11 are conducted.In step 105, it can use while data carried out to multiple functional modules 20
Parallel processing is realized in correction, is conducive to improve testing efficiency.
106: the test fixture 200 and the test end 11 are disconnected.
107: controlling the switch module 30 into off-state, so that the functional module 20 and the test end 11
It disconnects.
In step 107, open command is issued to the switch module 30 by the controller 90, to open described in control
It closes module 30 and enters off-state, so that the functional module 20 is disconnected with the test end 11, thus the test
The case where end 11 and metalwork or liquid contact will not cause short circuit, and the protection to functional module 20 may be implemented, and
The test end 11 need not be sealed using insulating part, advantageously reduce cost.
The embodiment of the present application provides the test method of a kind of circuit board assemblies, electronic equipment and circuit board assemblies, passes through institute
Stating circuit board assemblies includes circuit board, the functional module for being fixed on the circuit board and the switch being electrically connected with the functional module
Module, and the circuit board is equipped with the test end being electrically connected with the switch module, when utilization 200 connecting test of test fixture
When end, it can control the switch module and enter closed state, so that the functional module is mutually led with the test end
It is logical, and then convenient for carrying out data correction to functional module；After data correction is completed, it is disconnected to can control the switch module entrance
Open state, so that the functional module and the test end disconnect, so that the test end be avoided to contact other
Conductor and it is short-circuit.
Although the preferred embodiment is not to limit in conclusion the application has been disclosed in a preferred embodiment above
The application, those of ordinary skill in the art are not departing from spirit and scope, can make various changes and profit
Decorations, therefore the protective range of the application subjects to the scope of the claims.
Claims (13)
1. a kind of circuit board assemblies, which is characterized in that the circuit board assemblies include circuit board, the function for being fixed on the circuit board
Module and it can be fixed on the switch module of the circuit board, the circuit board is equipped with test end, and the functional module described is opened
Module and the test end is closed to be sequentially connected electrically, the test end to be electrically connected test fixture, the switch module with
The test end and the test fixture connect or disconnect and are in closed state or off-state.
2. circuit board assemblies as described in claim 1, which is characterized in that the circuit board assemblies further include shielding case, described
Shielding case is fixedly connected with the circuit board, and the functional module and the switch module are located on the inside of the shielding case, the survey
End is tried to be located on the outside of the shielding case.
3. circuit board assemblies as claimed in claim 2, which is characterized in that the circuit board is equipped with device on the outside of the shielding case
Part installing zone, the test lead portion are located in the device mounting region.
4. circuit board assemblies as claimed in claim 3, which is characterized in that the circuit board assemblies further include connector and metal
Pressing plate, the connector are fixed in the device mounting region, and are electrically connected the functional module, and the metal platen is fixed to be connected
The connector and the circuit board are connect, and covers the test end.
5. circuit board assemblies as described in claim 1, which is characterized in that the switch module is equipped with the first pad and opposite institute
State the second pad of the first pad setting, and the logic circuit of connection the first pad and the second pad, the first pad electricity
Connect the functional module, second pad is electrically connected the test end, the logic circuit with the test end and
The test fixture connects or disconnects and is in closed state or off-state.
6. circuit board assemblies as claimed in claim 5, which is characterized in that the switch module is equipped with multiple institutes arranged side by side
The first pad is stated, the logic circuit may be selected the first pad described in wherein at least one and be conducted with second pad.
7. circuit board assemblies as claimed in claim 6, which is characterized in that the circuit board assemblies include multiple function moulds
Block, multiple functional modules are electrically connected multiple first pads.
8. circuit board assemblies as claimed in claim 5, which is characterized in that the switch module is equipped with multiple institutes arranged side by side
The second pad is stated, the logic circuit may be selected the second pad described in wherein at least one and be conducted with first pad.
9. circuit board assemblies as claimed in claim 8, which is characterized in that the circuit board is equipped with multiple test ends,
Multiple test end parts are not electrically connected multiple second pads.
10. the circuit board assemblies as described in 9 any one of claim 1 ~, which is characterized in that the test end is metal gasket
Piece.
11. a kind of electronic equipment, which is characterized in that the electronic equipment includes as described in 10 any one of claim 1 ~
Circuit board assemblies.
12. electronic equipment as claimed in claim 11, which is characterized in that the electronic equipment further includes shell and be fixedly connected
The display screen of the shell, forms accommodating chamber between the shell and the display screen, the circuit board assemblies are fixed on described
In accommodating chamber.
13. a kind of test method of circuit board assemblies, which is characterized in that
The test method of the circuit board assemblies comprises the following steps that
A circuit board assemblies are provided, the circuit board assemblies include circuit board, the functional module for being fixed on the circuit board and consolidate
Due to the switch module of the circuit board, the circuit board is equipped with test end, the functional module, the switch module and institute
Test end is stated to be sequentially connected electrically；
One test fixture is provided；
The test fixture is connected into the test end；
It controls the switch module and enters closed state, so that the functional module is connected with the test end；
Data correction is carried out to the functional module through the test end and the switch module by the test fixture；
The test fixture and the test end are disconnected；
It controls the switch module and enters off-state, so that the functional module is disconnected with the test end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811469029.9A CN109587931B (en) | 2018-12-03 | 2018-12-03 | Circuit board assembly, electronic equipment and test method of circuit board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811469029.9A CN109587931B (en) | 2018-12-03 | 2018-12-03 | Circuit board assembly, electronic equipment and test method of circuit board assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109587931A true CN109587931A (en) | 2019-04-05 |
| CN109587931B CN109587931B (en) | 2021-05-04 |
Family
ID=65927050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811469029.9A Active CN109587931B (en) | 2018-12-03 | 2018-12-03 | Circuit board assembly, electronic equipment and test method of circuit board assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109587931B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110380273A (en) * | 2019-07-24 | 2019-10-25 | 维沃移动通信有限公司 | A kind of circuit board assemblies and terminal device |
| CN113905503A (en) * | 2021-06-30 | 2022-01-07 | 荣耀终端有限公司 | Circuit board structure, circuit board test structure and electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040227637A1 (en) * | 2003-05-16 | 2004-11-18 | Barr Andrew Harvey | Built-in circuitry and method to test connector loading |
| CN201374867Y (en) * | 2006-11-07 | 2009-12-30 | 苹果公司 | Circuit board with removable test point part |
| CN106028626A (en) * | 2016-07-22 | 2016-10-12 | 深圳天珑无线科技有限公司 | Printed circuit board and electronic device |
| CN206542623U (en) * | 2017-01-09 | 2017-10-03 | 广东欧珀移动通信有限公司 | Circuit board assemblies and terminal |
-
2018
- 2018-12-03 CN CN201811469029.9A patent/CN109587931B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040227637A1 (en) * | 2003-05-16 | 2004-11-18 | Barr Andrew Harvey | Built-in circuitry and method to test connector loading |
| CN201374867Y (en) * | 2006-11-07 | 2009-12-30 | 苹果公司 | Circuit board with removable test point part |
| CN106028626A (en) * | 2016-07-22 | 2016-10-12 | 深圳天珑无线科技有限公司 | Printed circuit board and electronic device |
| CN206542623U (en) * | 2017-01-09 | 2017-10-03 | 广东欧珀移动通信有限公司 | Circuit board assemblies and terminal |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110380273A (en) * | 2019-07-24 | 2019-10-25 | 维沃移动通信有限公司 | A kind of circuit board assemblies and terminal device |
| CN113905503A (en) * | 2021-06-30 | 2022-01-07 | 荣耀终端有限公司 | Circuit board structure, circuit board test structure and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109587931B (en) | 2021-05-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109587931A (en) | The test method of circuit board assemblies, electronic equipment and circuit board assemblies | |
| CN110854957A (en) | Wrist-worn device | |
| CN100521886C (en) | Electronic control module for a removable connector and methods of assembling same | |
| CN108681002B (en) | Optical module and communication equipment | |
| CN102857088A (en) | Power supply module | |
| CN103944505B (en) | Surface is without the photovoltaic cell component rosette of busbar wiring windows | |
| CN206480722U (en) | For the integrated form BDU of electrokinetic cell bag and the electrokinetic cell bag with it | |
| TW201607421A (en) | Electromagnetic shielding material and method for packaging optical module | |
| CN107066949A (en) | fingerprint module, display screen and mobile terminal | |
| CN108957820A (en) | A kind of low electromagnetic leakage liquid crystal display | |
| CN105489597A (en) | System in package (SiP) module assembly, SiP module and electronic equipment | |
| CN203120375U (en) | Shield cover for preventing electromagnetic leakage | |
| KR20180119059A (en) | Receptacle Connector | |
| CN209767479U (en) | junction box and solar module | |
| CN105199953B (en) | A kind of DNA sequencing reaction device with double locking | |
| CN210326299U (en) | Protection mechanism for arranging drive chip | |
| KR200491739Y1 (en) | Rf testing apparatus, movable testing device thereof, and case module | |
| CN218940088U (en) | Electric connection structure | |
| CN103995326A (en) | Optical module | |
| CN210403421U (en) | Photovoltaic power plant inductor shell structure | |
| CN214227732U (en) | Power distribution terminal control box | |
| CN2414587Y (en) | Electromagnetic interference shielding apparatus | |
| CN216083483U (en) | Data interaction controller | |
| CN213070939U (en) | Switch module, charging device and charging system | |
| CN218180150U (en) | Temperature transmitter assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |