CN219831295U - High-temperature-resistant storage detection device for semiconductor packaging product - Google Patents

High-temperature-resistant storage detection device for semiconductor packaging product Download PDF

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Publication number
CN219831295U
CN219831295U CN202321053065.3U CN202321053065U CN219831295U CN 219831295 U CN219831295 U CN 219831295U CN 202321053065 U CN202321053065 U CN 202321053065U CN 219831295 U CN219831295 U CN 219831295U
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China
Prior art keywords
semiconductor
box
plate
resistant storage
detection device
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CN202321053065.3U
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Chinese (zh)
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韦嘉仲
薛慧
敖彬
黄龙
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Huizhou Kewei Lianchuang Technology Co ltd
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Huizhou Kewei Lianchuang Technology Co ltd
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Abstract

The utility model discloses a high-temperature-resistant storage detection device for semiconductor packaging products, which relates to the field of semiconductors, and aims at the problems that a certain amount of heat is generated in the storage process after the semiconductors are packaged and the semiconductors are damaged due to the fact that the space is dense, if the heat is too high, the semiconductors with different high-temperature resistance can be prevented from being damaged due to the fact that the semiconductors are stored in a classified mode. The device of the utility model is provided with the packaging box outside the semiconductor, can simulate the packaged semiconductor, and is provided with the heater below the packaging box, thus being capable of simulating the high temperature generated during storage.

Description

High-temperature-resistant storage detection device for semiconductor packaging product
Technical Field
The utility model relates to the field of semiconductors, in particular to a high-temperature-resistant storage detection device for semiconductor packaging products.
Background
Semiconductors refer to materials with conductivity between conductors and insulators at normal temperature, and are applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, so that the importance of the semiconductors is very great from the aspects of technology and economic development, and most of electronic products such as core units in computers, mobile phones or digital recorders are very closely related to the semiconductors;
because the space is dense in the storage process after the semiconductor packaging, certain heat can be generated, the semiconductors can be damaged if the heat is too high, and if the semiconductors with different high temperature resistance can be stored in a classified mode, the semiconductors can be prevented from being damaged at high temperature, so that the high temperature resistance storage detection device for the semiconductor packaging product is provided to solve the problems.
Disclosure of Invention
The high-temperature-resistant storage detection device for the semiconductor packaging product solves the problems that a certain amount of heat is generated due to dense space in the storage process after the semiconductor packaging, the semiconductor is damaged if the heat is too high, and the semiconductor with different high-temperature resistance can be stored in a classified mode, so that the semiconductor is prevented from being damaged at high temperature.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model provides a semiconductor packaging product high temperature resistant storage detection device, includes the box, the side of box is provided with the receiver, the front of receiver is provided with the display screen, the inside of box is provided with the encapsulation box, be provided with a plurality of detectors above the encapsulation box, the inside removal of encapsulation box is connected with the semiconductor, be provided with the heater below the encapsulation box.
Preferably, the front of the box body is provided with a door plate, one side of the front of the door plate is provided with a handle groove, and one side of the door plate is provided with a plurality of second connecting rods.
Preferably, a plurality of first connecting rods are arranged on one side of the front face of the box body, the first connecting rods are in rotary connection with the second connecting rods, and the front face of the box body is in movable connection with the rear face of the door plate.
Preferably, a supporting plate is connected to the lower surface of the receiver, the side surface of the supporting plate is connected to the side surface of the box body, and a plurality of receiving ports are connected to the rear surface of the receiver.
Preferably, a transmission line is connected to the detector, a heat insulation ring is sleeved in the middle of the transmission line, the heat insulation ring is fixed on the inner side surface of the box body, and the other end of the transmission line is connected with the receiving port.
Preferably, the outer side of the detector is sleeved with a threaded ring, the outer side of the threaded ring is sleeved with a fixed ring, the fixed ring is fixed on the packaging box, and the lower side of the detector is connected with the upper side of the semiconductor.
Preferably, a plurality of clamping plates are sleeved on the outer side of the packaging box and are in movable connection, the back of each clamping plate is connected with a supporting rod, the back of each supporting rod is connected with a first connecting plate, and the first connecting plates are fixedly connected with the inner side face of the box body through a plurality of third connecting rods.
Preferably, the front of the packaging box is provided with a packaging plate, one side of the packaging plate is provided with a hook plate, one side of the packaging box is provided with a hook groove, and the hook plate is connected with the hook groove.
Preferably, a fifth connecting rod is arranged on one side of the packaging plate, a plurality of fourth connecting rods are arranged on one side of the packaging box, and the fifth connecting rods are rotationally connected with the fourth connecting rods.
Preferably, a plurality of lifting rods are arranged below the heater, two second connecting plates are connected to the upper end and the lower end of each lifting rod, the second connecting plates are fixedly connected with the lower surface of the heater through a plurality of sixth connecting rods, and the second connecting plates are fixedly connected with the lower end of the inner part of the box body through the sixth connecting rods.
The beneficial effects of the utility model are as follows:
1. the semiconductor detection device is provided with the packaging box outside the semiconductor, can imitate the packaged semiconductor, is provided with the heater below the packaging box, can imitate the high temperature generated during storage, and can detect the performance of the semiconductor through the detector so as to achieve the aim of detecting the high temperature resistance of the semiconductor.
2. This semiconductor detection device has installed the grip block in the outside of encapsulation box, and the grip block is fixed the encapsulation box at half sky for encapsulation box is heated completely all around, can improve the accuracy nature of detection by a wide margin.
In summary, the device has a package box mounted on the outside of the semiconductor, which can simulate the packaged semiconductor, and a heater mounted under the package box, which can simulate the high temperature generated during storage, and then detect the performance of the semiconductor by a detector.
Drawings
Fig. 1 is a schematic view of the front view structure of the present utility model.
Fig. 2 is a schematic diagram of a side view structure of the present utility model.
Fig. 3 is a schematic view of the internal view structure of the present utility model.
Fig. 4 is a schematic view of a package view structure according to the present utility model.
Fig. 5 is a schematic view of a heater view angle structure according to the present utility model.
Reference numerals in the drawings: 1. a case; 2. a door panel; 3. a receiver; 4. a support plate; 5. a first connecting rod; 6. a second connecting rod; 7. a handle groove; 8. a display screen; 9. a receiving port; 10. a transmission line; 11. a heat insulating ring; 12. packaging the box; 13. a clamping plate; 14. a support rod; 15. a first connection plate; 16. a third connecting rod; 17. a heater; 18. a detector; 19. a threaded ring; 20. a fixing ring; 21. a hook groove; 22. a package plate; 23. a hook plate; 24. a fourth connecting rod; 25. a fifth connecting rod; 26. a semiconductor; 27. a second connecting plate; 28. lifting the rod; 29. and a sixth connecting rod.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-5, the embodiment provides a high temperature resistant storage detection device for semiconductor packaging products, which comprises a box 1, wherein a receiver 3 is arranged on the side surface of the box 1, a display screen 8 is arranged in front of the receiver 3, a packaging box 12 is arranged in the box 1, a plurality of detectors 18 are arranged on the packaging box 12, a semiconductor 26 is movably connected in the packaging box 12, a heater 17 is arranged below the packaging box 12, the heater 17 is used for simulating high temperature during storage, a door plate 2 is arranged in front of the box 1, a handle groove 7 is formed in one side of the front of the door plate 2, a plurality of second connecting rods 6 are arranged on one side of the door plate 2, a plurality of first connecting rods 5 are arranged on one side of the front of the box 1, the plurality of first connecting rods 5 are in rotary connection with the second connecting rods 6, the front of the box 1 is in movable connection with the rear of the door plate 2, and the handle groove 7 is used for opening the door plate 2.
As shown in fig. 3, the support plate 4 is connected below the receiver 3, the side of the support plate 4 is connected with the side of the box 1, a plurality of receiving ports 9 are connected behind the receiver 3, the transmission line 10 is connected above the detector 18, a heat insulation ring 11 is sleeved in the middle of the transmission line 10, the heat insulation ring 11 is fixed on the inner side of the box 1, the other end of the transmission line 10 is connected with the receiving ports 9, a threaded ring 19 is sleeved outside the detector 18, a fixing ring 20 is sleeved outside the threaded ring 19, the fixing ring 20 is fixed above the packaging box 12, the lower side of the detector 18 is connected with the upper side of the semiconductor 26, the receiver 3 is used for receiving signals of the detector 18, and the detector 18 is used for detecting the performance of the semiconductor 26.
As shown in fig. 3-4, the outer side of the packaging box 12 is sleeved with a plurality of clamping plates 13 in movable connection, the back of the clamping plates 13 is connected with a supporting rod 14, the back of the supporting rod 14 is connected with a first connecting plate 15, the first connecting plate 15 is fixedly connected with the inner side surface of the box body 1 through a plurality of third connecting rods 16, the front of the packaging box 12 is provided with a packaging plate 22, one side of the packaging plate 22 is provided with a hook plate 23, one side of the packaging box 12 is provided with a hook groove 21, the hook plate 23 is connected with the hook groove 21, one side of the packaging plate 22 is provided with a fifth connecting rod 25, one side of the packaging box 12 is provided with a plurality of fourth connecting rods 24, the fifth connecting rod 25 is rotatably connected with the fourth connecting rods 24, and the packaging box 12 is used for simulating packaging environment.
As shown in fig. 5, a plurality of lifting rods 28 are arranged below the heater 17, two second connecting plates 27 are connected to the upper end and the lower end of the lifting rods 28, the second connecting plates 27 are fixedly connected with the lower surface of the heater 17 through a plurality of sixth connecting rods 29, the second connecting plates 27 are fixedly connected with the lower end of the inner part of the box body 1 through the sixth connecting rods 29, and the lifting rods 28 are used for lifting the heater 17.
The working principle of the utility model is as follows: when the semiconductor 26 is used, the semiconductor 26 is inserted into the packaging box 12, the detector 18 is rotated to enable the threaded ring 19 to move downwards along with the fixed ring 20, the detector 18 is driven to move downwards to contact the upper surface of the semiconductor 26, the packaging plate 22 is moved to enable the semiconductor to rotate along with the fifth connecting rod 25, the packaging plate 22 clamps the hook plate 23 into the hook groove 21 to package the semiconductor 26, the door plate 2 is closed to start the heater 17 to simulate a high-temperature environment, the detector 18 detects the performance of the semiconductor 26, and then the semiconductor 26 is transmitted to the receiver 3 through the transmission line 10 to display outwards, so that the purpose of detecting the high temperature resistance of the semiconductor 26 is achieved.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims (10)

1. The utility model provides a semiconductor packaging product high temperature resistant storage detection device, includes box (1), its characterized in that, the side of box (1) is provided with receiver (3), the front of receiver (3) is provided with display screen (8), the inside of box (1) is provided with enclosure (12), be provided with a plurality of detectors (18) above enclosure (12), the inside removal of enclosure (12) is connected with semiconductor (26), be provided with heater (17) below enclosure (12).
2. The high-temperature-resistant storage detection device for semiconductor packaging products according to claim 1, wherein a door plate (2) is arranged in front of the box body (1), a handle groove (7) is formed in one side of the front of the door plate (2), and a plurality of second connecting rods (6) are arranged on one side of the door plate (2).
3. The device for detecting the high-temperature-resistant storage of the semiconductor packaging product according to claim 2, wherein a plurality of first connecting rods (5) are arranged on one side of the front face of the box body (1), the plurality of first connecting rods (5) are rotatably connected with the second connecting rods (6), and the front face of the box body (1) is movably connected with the rear face of the door plate (2).
4. The high temperature resistant storage detection device for semiconductor package products according to claim 1, wherein a supporting plate (4) is connected below the receiver (3), a side surface of the supporting plate (4) is connected with a side surface of the case (1), and a plurality of receiving ports (9) are connected at the rear of the receiver (3).
5. The high-temperature-resistant storage detection device for semiconductor packaging products according to claim 4, wherein a transmission line (10) is connected to the detector (18), a heat insulation ring (11) is sleeved in the middle of the transmission line (10), the heat insulation ring (11) is fixed on the inner side surface of the box body (1), and the other end of the transmission line (10) is connected with the receiving port (9).
6. The device for detecting the high-temperature-resistant storage of the semiconductor packaging product according to claim 1, wherein a threaded ring (19) is sleeved outside the detector (18), a fixing ring (20) is sleeved outside the threaded ring (19), the fixing ring (20) is fixed on the packaging box (12), and the lower face of the detector (18) is connected with the upper face of the semiconductor (26).
7. The high-temperature-resistant storage detection device for semiconductor packaging products according to claim 1, wherein a plurality of clamping plates (13) are sleeved on the outer side of the packaging box (12) and are movably connected, a supporting rod (14) is connected to the rear face of the clamping plates (13), a first connecting plate (15) is connected to the rear face of the supporting rod (14), and the first connecting plate (15) is fixedly connected with the inner side face of the box body (1) through a plurality of third connecting rods (16).
8. The high temperature resistant storage detection device for semiconductor packaging products according to claim 1, wherein a packaging plate (22) is arranged in front of the packaging box (12), a hook plate (23) is arranged on one side of the packaging plate (22), a hook groove (21) is arranged on one side of the packaging box (12), and the hook plate (23) is connected with the hook groove (21).
9. The high temperature resistant storage detection device for semiconductor package products according to claim 8, wherein a fifth connecting rod (25) is arranged on one side of the package plate (22), a plurality of fourth connecting rods (24) are arranged on one side of the package box (12), and the fifth connecting rod (25) is rotatably connected with the fourth connecting rods (24).
10. The high-temperature-resistant storage detection device for semiconductor packaging products according to claim 1, wherein a plurality of lifting rods (28) are arranged below the heater (17), two second connecting plates (27) are connected to the upper end and the lower end of each lifting rod (28), the second connecting plates (27) are fixedly connected with the lower surface of the heater (17) through a plurality of sixth connecting rods (29), and the second connecting plates (27) are fixedly connected with the inner lower end of the box body (1) through the sixth connecting rods (29).
CN202321053065.3U 2023-05-05 2023-05-05 High-temperature-resistant storage detection device for semiconductor packaging product Active CN219831295U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321053065.3U CN219831295U (en) 2023-05-05 2023-05-05 High-temperature-resistant storage detection device for semiconductor packaging product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321053065.3U CN219831295U (en) 2023-05-05 2023-05-05 High-temperature-resistant storage detection device for semiconductor packaging product

Publications (1)

Publication Number Publication Date
CN219831295U true CN219831295U (en) 2023-10-13

Family

ID=88278247

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321053065.3U Active CN219831295U (en) 2023-05-05 2023-05-05 High-temperature-resistant storage detection device for semiconductor packaging product

Country Status (1)

Country Link
CN (1) CN219831295U (en)

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