CN114605927B - high-PID-resistance photovoltaic adhesive film, preparation method thereof and photovoltaic module - Google Patents
high-PID-resistance photovoltaic adhesive film, preparation method thereof and photovoltaic module Download PDFInfo
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- CN114605927B CN114605927B CN202210333674.8A CN202210333674A CN114605927B CN 114605927 B CN114605927 B CN 114605927B CN 202210333674 A CN202210333674 A CN 202210333674A CN 114605927 B CN114605927 B CN 114605927B
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 66
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 36
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 35
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 239000011347 resin Substances 0.000 claims abstract description 34
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 26
- 238000004806 packaging method and process Methods 0.000 claims abstract description 20
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910003472 fullerene Inorganic materials 0.000 claims abstract description 19
- 239000007822 coupling agent Substances 0.000 claims abstract description 13
- 239000002994 raw material Substances 0.000 claims abstract description 10
- 238000001125 extrusion Methods 0.000 claims description 17
- -1 beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) octadecyl Chemical group 0.000 claims description 13
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 238000004132 cross linking Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 239000000155 melt Substances 0.000 claims description 7
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 claims description 6
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 6
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 5
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims description 5
- NPCRFXPZMMRNAA-UHFFFAOYSA-N 4-nonylphenol;phosphorous acid Chemical group OP(O)O.CCCCCCCCCC1=CC=C(O)C=C1.CCCCCCCCCC1=CC=C(O)C=C1.CCCCCCCCCC1=CC=C(O)C=C1 NPCRFXPZMMRNAA-UHFFFAOYSA-N 0.000 claims description 5
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 claims description 5
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims description 5
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 claims description 5
- 150000001451 organic peroxides Chemical group 0.000 claims description 5
- 238000007493 shaping process Methods 0.000 claims description 5
- 238000005266 casting Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 claims description 3
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 6
- 230000000903 blocking effect Effects 0.000 abstract description 4
- 230000005012 migration Effects 0.000 abstract description 3
- 238000013508 migration Methods 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 33
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 33
- 230000008569 process Effects 0.000 description 8
- 238000010248 power generation Methods 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000007774 longterm Effects 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 230000032683 aging Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- SYXTYIFRUXOUQP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy butaneperoxoate Chemical compound CCCC(=O)OOOC(C)(C)C SYXTYIFRUXOUQP-UHFFFAOYSA-N 0.000 description 3
- FIYMNUNPPYABMU-UHFFFAOYSA-N 2-benzyl-5-chloro-1h-indole Chemical compound C=1C2=CC(Cl)=CC=C2NC=1CC1=CC=CC=C1 FIYMNUNPPYABMU-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 229920006280 packaging film Polymers 0.000 description 3
- 239000012785 packaging film Substances 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000009966 trimming Methods 0.000 description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- ZKJRBWBAOPPIDO-UHFFFAOYSA-N 2-methylbutan-2-yloxy pentaneperoxoate Chemical compound CCCCC(=O)OOOC(C)(C)CC ZKJRBWBAOPPIDO-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N methyl pentane Natural products CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 230000004224 protection Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- HARQWLDROVMFJE-UHFFFAOYSA-N ethyl 3,3-bis(tert-butylperoxy)butanoate Chemical compound CCOC(=O)CC(C)(OOC(C)(C)C)OOC(C)(C)C HARQWLDROVMFJE-UHFFFAOYSA-N 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000006864 oxidative decomposition reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- DLSMLZRPNPCXGY-UHFFFAOYSA-N tert-butylperoxy 2-ethylhexyl carbonate Chemical compound CCCCC(CC)COC(=O)OOOC(C)(C)C DLSMLZRPNPCXGY-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention belongs to the technical field of solar cells, and provides a photovoltaic adhesive film with high PID resistance, a preparation method thereof and a photovoltaic module, wherein the photovoltaic adhesive film with high PID resistance comprises the following raw materials in percentage by weight: 87-98% of EVA resin, 0.05-4% of adamantane, 0.05-4% of fullerene, 0.05-5% of antioxidant, 0.25-2% of cross-linking agent and 0.1-4% of coupling agent. The photovoltaic adhesive film takes the EVA resin with low price and good heat sealability as the main material, so that the cost of the photovoltaic adhesive film can be reduced, and the packaging effect of a photovoltaic module can be improved; furthermore, the photovoltaic film can provide a stable conjugated network structure to play a role in blocking electron migration through the cooperative coordination of adamantane and fullerene, so that the photovoltaic film has a high PID resistance effect and can keep excellent light transmission performance. Therefore, the service life and the generated power of the photovoltaic module obtained by adopting the photovoltaic adhesive film can be effectively improved.
Description
Technical Field
The invention relates to the technical field of solar cells, in particular to a photovoltaic adhesive film with high PID resistance, a preparation method thereof and a photovoltaic module.
Background
The photovoltaic packaging adhesive film, which is called photovoltaic adhesive film for short, is one of important materials in the solar technology industry, plays an important role in bonding the solar cell piece with the front plate glass and the back plate, and simultaneously has multiple functions of mechanical buffering, packaging protection and ultraviolet resistance protection of the photovoltaic module. As the photovoltaic adhesive film is used as a high polymer material, the photovoltaic adhesive film is inevitably corroded by natural environment to generate aging, so the photovoltaic adhesive film is one of key materials affecting the service life and the power generation of the photovoltaic module. The research and improvement of the photovoltaic adhesive film have important significance for pushing the photovoltaic industry.
The conventional photovoltaic film is made of an EVA (ethylene-vinyl acetate copolymer) polymer as a base material, and is called an EVA photovoltaic film, for example, an EVA packaging film for a solar photovoltaic module provided in publication No. CN102604557a and a preparation method thereof. However, the chemical structure of vinyl acetate in the EVA resin has polarity, and electrons can migrate under the voltage condition, so that the PID effect can occur in the power generation process of the photovoltaic module adopting the EVA photovoltaic film, and the power generation power of the photovoltaic module can be obviously reduced.
Disclosure of Invention
The invention aims to overcome the defect of poor PID resistance effect of the traditional EVA photovoltaic adhesive film, and provides a photovoltaic adhesive film with high PID resistance, a preparation method thereof and a photovoltaic module.
Based on the above, the invention discloses a photovoltaic adhesive film with high PID resistance, which comprises the following raw materials in percentage by weight:
preferably, the mass ratio of adamantane to fullerene is 1-2:1.
further preferably, the EVA resin: an antioxidant: crosslinking agent: coupling agent: adamantane: the mass ratio of the fullerene is 100:0.5:2:0.5:0.1-0.2:0.1-0.15.
Preferably, the EVA resin has a molar content of 20-30% of vinyl acetate and a melt flow rate of 1.5-18g/min.
Preferably, the antioxidants include a primary antioxidant and a secondary antioxidant;
the main antioxidant group is beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) octadecyl propionate;
the auxiliary antioxidant is tris (4-nonylphenol) phosphite and/or tris (2, 4-di-tert-butylphenyl) phosphite.
Preferably, the crosslinking agent comprises a crosslinking curing agent and a co-crosslinking agent;
the crosslinking curing agent is an organic peroxide and/or azo compound;
the auxiliary cross-linking agent is one or a combination of any several of triallyl isocyanurate, triallyl cyanurate, trimethylolpropane trimethacrylate and diethylene glycol dimethacrylate.
Among them, the organic peroxide is preferably one or a combination of any of cumene peroxide, di-t-butyl peroxide, dicumyl hydroperoxide, 2, 5-dimethyl-2, 5-di-t-butylperoxy hexane, n-butyl 4, 4-di (t-amyl peroxy) valerate, t-butyl peroxy-2-ethylhexyl carbonate and ethyl 3, 3-di (t-butylperoxy) butyrate.
Preferably, the coupling agent is a silane coupling agent;
the silane coupling agent is one or the combination of any more of vinyl triethoxysilane, vinyl trimethoxysilane, vinyl t-butylperoxy silane, vinyl triacetoxy silane and vinyl tri (beta-methoxyethoxy) silane.
The invention also discloses a preparation method of the photovoltaic adhesive film with high PID resistance, which comprises the following preparation steps:
step S1, uniformly mixing the EVA resin, the antioxidant, the cross-linking agent, the coupling agent, the adamantane and the fullerene according to the formula amount to prepare a mixture;
and S2, adding the mixture into extrusion equipment for melt extrusion, cooling by casting equipment, and shaping to obtain the photovoltaic adhesive film with high PID resistance.
Preferably, in the step S2, the temperature of the melt extrusion is 80 to 90 ℃.
Preferably, in the step S2, after the shaping treatment, the method further includes: and (3) carrying out thickness measurement, trimming and rolling on the shaped photovoltaic adhesive film with high PID resistance, and packaging and warehousing.
The invention also discloses a photovoltaic module, which comprises a front plate, a first packaging adhesive film, a solar cell, a second packaging adhesive film and a back plate which are sequentially stacked, wherein the first packaging adhesive film and/or the second packaging adhesive film is the photovoltaic adhesive film with high PID resistance.
Compared with the prior art, the invention at least comprises the following beneficial effects:
in the photovoltaic adhesive film with high PID resistance, EVA resin is used as a main material, compared with POE resin, the EVA resin has lower raw material price, so that the cost of the photovoltaic adhesive film can be reduced, and the adhesive property of the EVA resin is better than that of the POE resin, so that the adhesive force of the photovoltaic adhesive film to a solar cell, a front plate and a back plate can be enhanced, and the encapsulation effect of a photovoltaic module can be improved; furthermore, a proper amount of adamantane and fullerene are added into the photovoltaic film, and the adamantane and the fullerene can provide a stable conjugated network structure to play a role in blocking electron migration through cooperative coordination, so that the photovoltaic film can overcome the defect of poor PID (potential induced degradation) resistance effect of the traditional EVA photovoltaic film, and the photovoltaic film provided by the invention has a high PID resistance effect and can maintain excellent light transmittance. Therefore, the service life and the power generation of the photovoltaic module obtained by adopting the photovoltaic adhesive film with high PID resistance can be effectively improved.
Detailed Description
In order that the above-recited objects, features and advantages of the present invention will become more apparent, a more particular description of the invention will be rendered by reference to specific embodiments thereof.
The invention relates to a photovoltaic adhesive film with high PID resistance, which comprises the following raw materials in percentage by weight:
in the raw material formula of the photovoltaic adhesive film with high PID resistance, EVA resin is used as a main material, compared with POE resin, the raw material price of the EVA resin is lower, so that the cost of the photovoltaic adhesive film can be reduced, and the adhesive property of the EVA resin is better than that of the POE resin, so that the adhesive force between the photovoltaic adhesive film with high PID resistance and solar cells, front plates and back plates can be enhanced, and the encapsulation effect of a photovoltaic module can be improved.
In order to further improve the heat sealing performance of the photovoltaic adhesive film with high PID resistance, the molar content of vinyl acetate in the EVA resin is 20-30%, and the melt flow rate of the EVA resin is 1.5-18g/min.
Preferably, the EVA resin has a vinyl acetate molar content of 28%.
In the raw material formula of the photovoltaic adhesive film with high PID resistance, a certain amount of antioxidant is added on the basis of EVA resin, so that the oxidative decomposition of the EVA resin in the process of melt extrusion and long-term use can be avoided, and the problems of aging and adhesive force reduction of the photovoltaic adhesive film in the process of melt extrusion and long-term use can be effectively avoided.
Furthermore, in the raw material formula of the photovoltaic adhesive film with high PID resistance, a certain amount of cross-linking agent is added on the basis of EVA resin and antioxidant, so that the EVA resin is properly cross-linked to form a netlike molecular structure, and the heat resistance, mechanical strength and electrical property of the photovoltaic adhesive film with high PID resistance in the processes of melt extrusion and long-term use are improved.
Furthermore, in the raw material formula of the photovoltaic adhesive film with high PID resistance, a certain amount of coupling agent is added on the basis of EVA resin, antioxidant and cross-linking agent, so that the adhesion, water resistance, chemical resistance, salt spray resistance and electrical insulation performance of the photovoltaic adhesive film with high PID resistance in a wet state are effectively improved.
The photovoltaic film with high PID resistance is added with a proper amount of adamantane and fullerene, and the adamantane and the fullerene can provide a stable conjugated net structure to play a role in blocking electron migration through cooperative coordination, so that the photovoltaic film can overcome the defect of poor PID resistance of the traditional EVA photovoltaic film, the PID effect of a photovoltaic module obtained by adopting the photovoltaic film with high PID resistance can not occur in the power generation process, and the photovoltaic film with high PID resistance has the effect and can maintain excellent light transmittance; therefore, the service life and the power generation of the photovoltaic module obtained by adopting the photovoltaic adhesive film with high PID resistance can be effectively improved.
Preferably, in the photovoltaic film with high PID resistance, the mass ratio of adamantane to fullerene is 1-2:1, a step of; so as to further improve the effect of high PID resistance of the photovoltaic adhesive film.
More preferably, in the photovoltaic film with high PID resistance, the EVA resin: an antioxidant: crosslinking agent: coupling agent: adamantane: the mass ratio of the fullerene is 100:0.5:2:0.5:0.1-0.2:0.1-0.15; the high PID resistance photovoltaic film has excellent heat sealing performance and light transmittance while improving the high PID resistance effect.
Wherein the antioxidant comprises a main antioxidant and an auxiliary antioxidant. The main antioxidant and the auxiliary antioxidant are matched, and the specific types of the main antioxidant and the auxiliary antioxidant are optimized and selected as follows, so that the ageing resistance and the bonding performance of the high PID-resistant photovoltaic adhesive film in the processes of melt extrusion and long-term use are further improved.
Specifically, the main antioxidant group is beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) stearyl propionate. The auxiliary antioxidant is tris (4-nonylphenol) phosphite and/or tris (2, 4-di-tert-butylphenyl) phosphite.
Preferably, the secondary antioxidant is a complex of tris (4-nonylphenol) phosphite and tris (2, 4-di-tert-butylphenyl) phosphite.
Wherein the crosslinking agent comprises a crosslinking curing agent and a secondary crosslinking agent. The heat resistance, the mechanical strength and the electrical property of the photovoltaic adhesive film with high PID resistance in the process of melt extrusion and long-term use are further improved by matching the crosslinking curing agent with the auxiliary crosslinking agent and carrying out the following optimization selection on specific types of the crosslinking curing agent and the auxiliary crosslinking agent.
Specifically, the crosslinking curing agent is an organic peroxide and/or an azo compound; the organic peroxide is one or a combination of more than one of cumene peroxide, di-tert-butyl peroxide, dicumyl hydroperoxide, 2, 5-dimethyl-2, 5-di-tert-butyl peroxy hexane, n-butyl 4, 4-di (tert-amyl peroxy) valerate, tert-butyl peroxy-2-ethylhexyl carbonate and ethyl 3, 3-di (tert-butyl peroxy) butyrate.
Preferably, the crosslinking curing agent is a complex of tert-butyl peroxy-2-ethylhexyl carbonate and ethyl 3, 3-di (tert-butylperoxy) butyrate.
Specifically, the auxiliary cross-linking agent is one or a combination of any of triallyl isocyanurate, triallyl cyanurate, trimethylolpropane trimethacrylate and diethylene glycol dimethacrylate.
Preferably, the auxiliary crosslinking agent is a compound of triallyl isocyanurate, triallyl cyanurate and trimethylolpropane trimethacrylate.
Wherein the coupling agent is a silane coupling agent. The silane coupling agent is preferred, and the specific type of the silane coupling agent is selected in the following way so as to further improve the adhesion, water resistance, chemical resistance, salt spray resistance and electrical insulation performance of the photovoltaic adhesive film with high PID resistance in a wet state.
Specifically, the silane coupling agent is one or a combination of any several of vinyl triethoxysilane, vinyl trimethoxysilane, vinyl t-butylperoxy silane, vinyl triacetoxysilane and vinyl tri (beta-methoxyethoxy) silane.
Preferably, the silane coupling agent is vinyltris (β -methoxyethoxy) silane.
The preparation method of the photovoltaic adhesive film with high PID resistance comprises the following preparation steps:
step S1, uniformly mixing EVA resin, an antioxidant, a cross-linking agent, a coupling agent, adamantane and fullerene according to the formula amount to prepare a mixture;
and S2, adding the mixture into extrusion equipment for melt extrusion, cooling by casting equipment, shaping, measuring thickness, trimming, rolling, packaging and warehousing to obtain the photovoltaic adhesive film with high PID resistance.
In step S2, the temperature of the melt extrusion is preferably 80-90 ℃ to ensure the blocking effect of the photovoltaic film with high PID resistance after the melt extrusion and avoid the aging of the mixture during the melt extrusion.
The photovoltaic module comprises a front plate, a first packaging adhesive film, a solar cell, a second packaging adhesive film and a back plate which are sequentially stacked, wherein the first packaging adhesive film and/or the second packaging adhesive film adopt the photovoltaic adhesive film with high PID resistance so as to improve the PID resistance effect of the photovoltaic module, and meanwhile, the photovoltaic module keeps excellent light transmission performance, and further, the service life and the power generation of the photovoltaic module are improved.
Example 1
The photovoltaic adhesive film with high PID resistance in the embodiment comprises:
EVA resin: i.e., an ethylene-vinyl acetate copolymer in which the molar content of vinyl acetate in the ethylene-vinyl acetate copolymer is 28%;
an antioxidant: the main antioxidant group is beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) octadecyl propionate, and the auxiliary antioxidant is a compound of tri (4-nonylphenol) phosphite and tri (2, 4-di-tert-butylphenyl) phosphite;
crosslinking agent: the crosslinking curing agent is a compound of tert-butyl peroxy-2-ethylhexyl carbonate and ethyl 3, 3-di (tert-butylperoxy) butyrate, and the auxiliary crosslinking agent is a compound of triallyl isocyanurate, triallyl cyanurate and trimethylolpropane trimethacrylate;
coupling agent: vinyl tris (beta-methoxyethoxy) silane;
adamantane: i.e. tricyclo [3.3.1.1 ] 3 ˙]Decane;
fullerene: is a hollow molecule composed of carbon and contains six-membered ring, five-membered ring and seven-membered ring.
In the photovoltaic adhesive film with high PID resistance in the embodiment, EVA resin is prepared from the following components in percentage by mass: an antioxidant: crosslinking agent: silane coupling agent: adamantane: fullerene=100: 0.5:2:0.5: x: y.
The preparation method of the photovoltaic adhesive film with high PID resistance of the embodiment comprises the following steps: uniformly mixing EVA resin, an antioxidant, a cross-linking agent, a silane coupling agent, adamantane and fullerene in the mass ratio to prepare a mixture; and adding the mixture into an extruder hopper for melt extrusion, controlling the temperature of each area of the extruder and the die head at 80-90 ℃, extruding through the die head, cooling through a casting roller, shaping after an embossing process, and finally measuring thickness, trimming, rolling, packaging and warehousing to obtain the photovoltaic adhesive film with high PID resistance.
The light Fu Jiaomo with high PID resistance of the embodiment is used as a first packaging adhesive film and a second packaging adhesive film, after being packaged to prepare a photovoltaic module, the PID of the photovoltaic module is tested according to a line standard IEC-62804 so as to observe the PID resistance effect of the photovoltaic module; and the light transmittance of the photovoltaic module is tested according to national standard GB/T29848-2018. The test results are shown in table 1 below:
TABLE 1
As can be seen from table 1, the light Fu Jiaomo with high PID resistance of the present invention has high PID resistance and good transmittance after being packaged as the first packaging film and the second packaging film to form the photovoltaic module.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the scope of the embodiments of the invention.
The foregoing has outlined rather broadly the more detailed description of the invention in order that the detailed description of the invention that follows may be better understood, and in order that the present principles and embodiments may be better understood; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present invention, the present description should not be construed as limiting the present invention in view of the above.
Claims (8)
1. The photovoltaic adhesive film with high PID resistance is characterized by comprising the following raw materials in percentage by weight:
EVA resin 87-98%
Adamantane 0.05-4%
Fullerene 0.05-4%
Antioxidant 0.05-5%
0.25 to 2 percent of cross-linking agent
0.1-4% of coupling agent;
the mass ratio of the adamantane to the fullerene is 1-2:1, a step of;
the EVA resin: an antioxidant: crosslinking agent: coupling agent: adamantane: the mass ratio of the fullerene is 100:0.5:2:0.5:0.1-0.2:0.1.
2. the photovoltaic film with high PID resistance according to claim 1, wherein the molar content of vinyl acetate in the EVA resin is 20-30%, and the melt flow rate of the EVA resin is 1.5-18g/min.
3. The high PID resistant photovoltaic film of claim 1, wherein the antioxidant comprises a primary antioxidant and a secondary antioxidant;
the main antioxidant group is beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) octadecyl propionate;
the auxiliary antioxidant is tris (4-nonylphenol) phosphite and/or tris (2, 4-di-tert-butylphenyl) phosphite.
4. The high PID resistant photovoltaic film according to claim 1, wherein the crosslinking agent comprises a crosslinking curing agent and a co-crosslinking agent;
the crosslinking curing agent is an organic peroxide and/or azo compound;
the auxiliary cross-linking agent is one or a combination of any several of triallyl isocyanurate, triallyl cyanurate, trimethylolpropane trimethacrylate and diethylene glycol dimethacrylate.
5. The high PID resistant photovoltaic film according to claim 1, wherein the coupling agent is a silane coupling agent;
the silane coupling agent is one or the combination of any more of vinyl triethoxysilane, vinyl trimethoxysilane, vinyl t-butylperoxy silane, vinyl triacetoxy silane and vinyl tri (beta-methoxyethoxy) silane.
6. The method for preparing the photovoltaic adhesive film with high PID resistance according to any one of claims 1 to 5, which is characterized by comprising the following preparation steps:
step S1, uniformly mixing the EVA resin, the antioxidant, the cross-linking agent, the coupling agent, the adamantane and the fullerene according to the formula amount to prepare a mixture;
and S2, adding the mixture into extrusion equipment for melt extrusion, cooling by casting equipment, and shaping to obtain the photovoltaic adhesive film with high PID resistance.
7. The method for preparing a photovoltaic film with high PID resistance according to claim 6, wherein in the step S2, the temperature of melt extrusion is 80-90 ℃.
8. The photovoltaic module comprises a front plate, a first packaging adhesive film, a solar cell, a second packaging adhesive film and a back plate which are sequentially stacked, and is characterized in that the first packaging adhesive film and/or the second packaging adhesive film is the photovoltaic adhesive film with high PID resistance according to any one of claims 1-5.
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| CN116948538B (en) * | 2023-07-14 | 2024-01-16 | 安徽隆芃新材料科技有限公司 | High-toughness photovoltaic EVA adhesive film and preparation process thereof |
| CN117624527B (en) * | 2023-11-29 | 2024-06-21 | 苏州易昇光学材料股份有限公司 | Antioxidant Huang Chuji, preparation method thereof and EVA adhesive film |
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| CN109554141A (en) * | 2017-09-25 | 2019-04-02 | 上海海优威新材料股份有限公司 | Ethylene vinyl acetate glue film, package assembling and the packaging method of anti-PID |
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| CN107841256A (en) * | 2016-09-19 | 2018-03-27 | 阿特斯(中国)投资有限公司 | Anti- PID types photovoltaic EVA packaging adhesive films and preparation method thereof |
| CN109554141A (en) * | 2017-09-25 | 2019-04-02 | 上海海优威新材料股份有限公司 | Ethylene vinyl acetate glue film, package assembling and the packaging method of anti-PID |
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