CN114605927A - high-PID-resistance photovoltaic adhesive film, preparation method thereof and photovoltaic module - Google Patents
high-PID-resistance photovoltaic adhesive film, preparation method thereof and photovoltaic module Download PDFInfo
- Publication number
- CN114605927A CN114605927A CN202210333674.8A CN202210333674A CN114605927A CN 114605927 A CN114605927 A CN 114605927A CN 202210333674 A CN202210333674 A CN 202210333674A CN 114605927 A CN114605927 A CN 114605927A
- Authority
- CN
- China
- Prior art keywords
- adhesive film
- pid
- photovoltaic
- resistance
- antioxidant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002313 adhesive film Substances 0.000 title claims abstract description 93
- 238000002360 preparation method Methods 0.000 title abstract description 10
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 34
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 33
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 26
- 238000004806 packaging method and process Methods 0.000 claims abstract description 23
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910003472 fullerene Inorganic materials 0.000 claims abstract description 19
- 239000007822 coupling agent Substances 0.000 claims abstract description 13
- 239000002994 raw material Substances 0.000 claims abstract description 10
- 238000001125 extrusion Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 14
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 238000004132 cross linking Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- -1 azo compound Chemical class 0.000 claims description 8
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 claims description 6
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 6
- 239000000155 melt Substances 0.000 claims description 6
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 5
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims description 5
- NPCRFXPZMMRNAA-UHFFFAOYSA-N 4-nonylphenol;phosphorous acid Chemical group OP(O)O.CCCCCCCCCC1=CC=C(O)C=C1.CCCCCCCCCC1=CC=C(O)C=C1.CCCCCCCCCC1=CC=C(O)C=C1 NPCRFXPZMMRNAA-UHFFFAOYSA-N 0.000 claims description 5
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 claims description 5
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims description 5
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 claims description 5
- 150000001451 organic peroxides Chemical group 0.000 claims description 5
- 238000005266 casting Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 claims description 4
- 238000007493 shaping process Methods 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 claims description 3
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 17
- 238000010248 power generation Methods 0.000 abstract description 8
- 238000002834 transmittance Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 5
- 230000000903 blocking effect Effects 0.000 abstract description 3
- 230000005012 migration Effects 0.000 abstract description 3
- 238000013508 migration Methods 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 230000002195 synergetic effect Effects 0.000 abstract 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 33
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 33
- 230000008569 process Effects 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 5
- 230000007774 longterm Effects 0.000 description 5
- 230000032683 aging Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- VLKZOEOYAKHREP-UHFFFAOYSA-N methyl pentane Natural products CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 4
- SYXTYIFRUXOUQP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy butaneperoxoate Chemical compound CCCC(=O)OOOC(C)(C)C SYXTYIFRUXOUQP-UHFFFAOYSA-N 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- FIYMNUNPPYABMU-UHFFFAOYSA-N 2-benzyl-5-chloro-1h-indole Chemical compound C=1C2=CC(Cl)=CC=C2NC=1CC1=CC=CC=C1 FIYMNUNPPYABMU-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004224 protection Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ZKJRBWBAOPPIDO-UHFFFAOYSA-N 2-methylbutan-2-yloxy pentaneperoxoate Chemical compound CCCCC(=O)OOOC(C)(C)CC ZKJRBWBAOPPIDO-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- SPTHWAJJMLCAQF-UHFFFAOYSA-M ctk4f8481 Chemical compound [O-]O.CC(C)C1=CC=CC=C1C(C)C SPTHWAJJMLCAQF-UHFFFAOYSA-M 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000006864 oxidative decomposition reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- ZHKJSBQGKDLHAP-UHFFFAOYSA-N tert-butyl 2-ethylhexylperoxy carbonate Chemical compound CCCCC(CC)COOOC(=O)OC(C)(C)C ZHKJSBQGKDLHAP-UHFFFAOYSA-N 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 229940070710 valerate Drugs 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Photovoltaic Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention belongs to the technical field of solar cells, and provides a high-PID-resistance photovoltaic adhesive film, a preparation method thereof and a photovoltaic module, wherein the high-PID-resistance photovoltaic adhesive film comprises the following raw materials in percentage by weight: 87-98% of EVA resin, 0.05-4% of adamantane, 0.05-4% of fullerene, 0.05-5% of antioxidant, 0.25-2% of cross-linking agent and 0.1-4% of coupling agent. The photovoltaic adhesive film takes the EVA resin which is low in price and good in heat sealing performance as the main material, so that the cost of the photovoltaic adhesive film can be reduced, and the packaging effect of a photovoltaic module can be improved; furthermore, the photovoltaic adhesive film can provide a stable conjugated network structure to play a role in blocking electron migration through the synergistic cooperation of adamantane and fullerene, so that the photovoltaic adhesive film has a high PID (potential induced degradation) resistance effect, and meanwhile, excellent light transmittance can be kept. Therefore, the service life and the power generation power of the photovoltaic module obtained by the photovoltaic adhesive film can be effectively prolonged.
Description
Technical Field
The invention relates to the technical field of solar cells, in particular to a high-PID resistance photovoltaic adhesive film, a preparation method thereof and a photovoltaic module.
Background
A photovoltaic packaging adhesive film, referred to as a photovoltaic adhesive film for short, is one of important materials in the solar technology industry, plays an important role in bonding a solar cell with front plate glass and a back plate, and simultaneously has multiple functions of mechanical buffering, packaging protection and ultraviolet resistance protection of a photovoltaic module. The photovoltaic adhesive film, as a polymer material, is inevitably eroded by the natural environment to cause aging, so the photovoltaic adhesive film is one of the key materials affecting the service life and the power generation power of the photovoltaic module. The research and improvement of the photovoltaic adhesive film have important significance for the promotion of the photovoltaic industry.
Among them, the conventional photovoltaic adhesive film is made of an EVA (ethylene-vinyl acetate copolymer) polymer as a basic material, which is called an EVA photovoltaic adhesive film, for example, an EVA encapsulant film for a solar photovoltaic module provided in publication No. CN102604557A and a method for preparing the same. However, the chemical structure of vinyl acetate in the EVA resin has polarity, and electrons thereof can migrate under a voltage condition, so that a photovoltaic module adopting the EVA photovoltaic adhesive film can generate a PID effect in a power generation process, and further the power generation power of the photovoltaic module can be obviously reduced.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a high-PID-resistance photovoltaic adhesive film, a preparation method thereof and a photovoltaic module, so as to overcome the defect of poor PID-resistance effect of the traditional EVA photovoltaic adhesive film, and the obtained high-PID-resistance photovoltaic adhesive film also has good light transmittance.
Based on the above, the invention discloses a high-PID-resistance photovoltaic adhesive film, which comprises the following raw materials in percentage by weight:
preferably, the mass ratio of adamantane to fullerene is 1-2: 1.
further preferably, the EVA resin: antioxidant: a crosslinking agent: coupling agent: adamantane: the mass ratio of the fullerene is 100: 0.5: 2: 0.5: 0.1-0.2: 0.1-0.15.
Preferably, the EVA resin has a vinyl acetate content of 20-30 mol% and a melt flow rate of 1.5-18 g/min.
Preferably, the antioxidant comprises a primary antioxidant and a secondary antioxidant;
the main anti-oxygen group is beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid octadecyl ester;
the auxiliary antioxidant is tris (4-nonylphenol) phosphite and/or tris (2, 4-di-tert-butylphenyl) phosphite.
Preferably, the crosslinking agent comprises a crosslinking curing agent and a co-crosslinking agent;
the crosslinking curing agent is organic peroxide and/or azo compound;
the auxiliary crosslinking agent is one or the combination of any more of triallyl isocyanurate, triallyl cyanurate, trimethylolpropane trimethacrylate and diethylene glycol dimethacrylate.
The organic peroxide is preferably one or a combination of any more of cumyl peroxide, di-tert-butyl peroxide, diisopropylbenzene hydroperoxide, 2, 5-dimethyl-2, 5-di-tert-butylperoxy hexane, n-butyl 4, 4-di (tert-amylperoxy) valerate, tert-butyl peroxy-2-ethylhexylcarbonate and ethyl 3, 3-di (tert-butylperoxy) butyrate.
Preferably, the coupling agent is a silane coupling agent;
the silane coupling agent is one or the combination of any more of vinyl triethoxysilane, vinyl trimethoxysilane, vinyl tri-tert-butyl peroxide silane, vinyl triacetoxysilane and vinyl tri (beta-methoxyethoxy) silane.
The invention also discloses a preparation method of the high-PID-resistance photovoltaic adhesive film, which comprises the following preparation steps:
step S1, uniformly mixing the EVA resin, the antioxidant, the cross-linking agent, the coupling agent, the adamantane and the fullerene according to the formula ratio to prepare a mixture;
and step S2, adding the mixture into an extrusion device for melt extrusion, cooling by a casting device, and shaping to obtain the high-PID-resistance photovoltaic adhesive film.
Preferably, in the step S2, the temperature of the melt extrusion is 80-90 ℃.
Preferably, in step S2, after the sizing process, the method further includes: and (4) carrying out thickness measurement, trimming and rolling on the photovoltaic adhesive film with high PID resistance after shaping treatment, and then packaging and warehousing.
The invention also discloses a photovoltaic module which comprises a front plate, a first packaging adhesive film, a solar cell piece, a second packaging adhesive film and a back plate which are sequentially stacked, wherein the first packaging adhesive film and/or the second packaging adhesive film is/are the high-PID-resistance photovoltaic adhesive film.
Compared with the prior art, the invention at least comprises the following beneficial effects:
in the high-PID-resistance photovoltaic adhesive film, the EVA resin is used as the main material, compared with POE resin, the EVA resin is lower in raw material price, so that the cost of the photovoltaic adhesive film can be reduced, and the bonding performance of the EVA resin is better than that of the POE resin, so that the bonding force of the photovoltaic adhesive film with a solar cell, a front plate and a back plate can be enhanced, and the packaging effect of a photovoltaic module is improved; furthermore, a proper amount of adamantane and fullerene are added into the photovoltaic adhesive film, and the adamantane and the fullerene are cooperated to provide a stable conjugated network structure to play a role in blocking electron migration, so that the photovoltaic adhesive film can overcome the defect of poor PID (proportion integration differentiation) resistance effect of the traditional EVA photovoltaic adhesive film, and the photovoltaic adhesive film provided by the invention has a high PID resistance effect and can maintain excellent light transmittance. Therefore, the service life and the power generation power of the photovoltaic module obtained by the high-PID-resistance photovoltaic adhesive film can be effectively prolonged.
Detailed Description
The present invention will be described in further detail with reference to specific embodiments in order to make the above objects, features and advantages more apparent and understandable.
The invention relates to a high-PID-resistance photovoltaic adhesive film, which comprises the following raw materials in percentage by weight:
in the raw material formula of this high anti PID's photovoltaic glued membrane, use EVA resin as the major ingredient, compare POE resin, the raw materials price of this EVA resin is lower, consequently can reduce the cost of photovoltaic glued membrane, and EVA resin's adhesion properties is more good than POE resin, consequently can also strengthen this high anti PID's photovoltaic glued membrane and solar wafer, the adhesion of front bezel and backplate, improves photovoltaic module's encapsulation effect.
In order to further improve the heat sealing performance of the high-PID-resistance photovoltaic adhesive film, the EVA resin contains 20-30% of vinyl acetate in mole, and the melt flow rate of the EVA resin is 1.5-18 g/min.
Preferably, the EVA resin has a molar vinyl acetate content of 28%.
In the raw material formula of the photovoltaic adhesive film with high PID resistance, a certain amount of antioxidant is added on the basis of EVA resin, so that the oxidative decomposition of the EVA resin in the processes of melt extrusion and long-term use can be avoided, and the problems of aging and bonding force reduction of the photovoltaic adhesive film in the processes of melt extrusion and long-term use can be effectively avoided.
Furthermore, in the raw material formula of the high-PID-resistant photovoltaic adhesive film, a certain amount of cross-linking agent is added on the basis of EVA resin and antioxidant, so that the EVA resin is properly cross-linked to form a reticular molecular structure, and the heat resistance, mechanical strength and electrical property of the high-PID-resistant photovoltaic adhesive film in the processes of melt extrusion and long-term use are improved.
Furthermore, in the raw material formula of the high-PID-resistant photovoltaic adhesive film, a certain amount of coupling agent is added on the basis of EVA resin, antioxidant and crosslinking agent, so that the adhesion, water resistance, chemical resistance, salt mist resistance and electrical insulation performance of the high-PID-resistant photovoltaic adhesive film in a wet state are effectively improved.
According to the high-PID-resistance photovoltaic adhesive film, a proper amount of adamantane and fullerene are added, and the adamantane and the fullerene are cooperatively matched to provide a stable conjugated net structure to play a role in blocking electron migration, so that the photovoltaic adhesive film can overcome the defect of poor PID resistance effect of the traditional EVA photovoltaic adhesive film, and a photovoltaic module obtained by using the high-PID-resistance photovoltaic adhesive film cannot generate a PID effect in the power generation process, so that the photovoltaic adhesive film has a high PID resistance effect and can maintain excellent light transmittance; therefore, the service life and the power generation power of the photovoltaic module obtained by the high-PID-resistance photovoltaic adhesive film can be effectively prolonged.
Preferably, in the high-PID-resistance photovoltaic adhesive film, the mass ratio of the adamantane to the fullerene is 1-2: 1; so as to further improve the effect of high PID resistance of the photovoltaic adhesive film.
More preferably, in the high-PID-resistant photovoltaic adhesive film, the weight ratio of EVA resin: antioxidant: a crosslinking agent: coupling agent: adamantane: the mass ratio of the fullerene is 100: 0.5: 2: 0.5: 0.1-0.2: 0.1-0.15; the high PID resistance effect of the photovoltaic adhesive film is improved, and the high PID resistance photovoltaic adhesive film has excellent heat sealing performance and light transmittance.
Wherein the antioxidant comprises a primary antioxidant and a secondary antioxidant. The aging resistance and the bonding performance of the high-PID-resistance photovoltaic adhesive film in the processes of melt extrusion and long-term use are further improved by matching the main antioxidant with the auxiliary antioxidant and optimizing and selecting the specific types of the main antioxidant and the auxiliary antioxidant as follows.
Specifically, the main antioxidant is beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid octadecyl ester. The auxiliary antioxidant is tris (4-nonylphenol) phosphite and/or tris (2, 4-di-tert-butylphenyl) phosphite.
Preferably, the auxiliary antioxidant is a compound of tris (4-nonylphenol) phosphite and tris (2, 4-di-tert-butylphenyl) phosphite.
Wherein the cross-linking agent comprises a cross-linking curing agent and an auxiliary cross-linking agent. The heat resistance, the mechanical strength and the electrical property of the high-PID-resistance photovoltaic adhesive film in the melt extrusion and long-term use processes are further improved by matching the crosslinking curing agent and the auxiliary crosslinking agent and optimally selecting the specific types of the crosslinking curing agent and the auxiliary crosslinking agent as follows.
Specifically, the crosslinking curing agent is an organic peroxide and/or an azo compound; the organic peroxide is one or the combination of any more of cumyl peroxide, di-tert-butyl peroxide, dicumyl hydroperoxide, 2, 5-dimethyl-2, 5-di-tert-butyl peroxy hexane, 4-di (tert-amyl peroxy) n-butyl valerate, peroxy 2-ethyl hexyl carbonic acid tert-butyl ester and 3, 3-di (tert-butyl peroxy) ethyl butyrate.
Preferably, the crosslinking curing agent is a complex of tert-butyl 2-ethylhexyl peroxycarbonate and ethyl 3, 3-di (tert-butylperoxy) butyrate.
Specifically, the auxiliary crosslinking agent is one or a combination of any one of triallyl isocyanurate, triallyl cyanurate, trimethylolpropane trimethacrylate and diethylene glycol dimethacrylate.
Preferably, the auxiliary crosslinking agent is a compound of triallyl isocyanurate, triallyl cyanurate and trimethylolpropane trimethacrylate.
Wherein the coupling agent is a silane coupling agent. The silane coupling agent is preferably selected, and the specific type of the silane coupling agent is optimally selected as follows, so that the adhesion, water resistance, chemical resistance, salt mist resistance and wet electrical insulation performance of the high-PID-resistance photovoltaic adhesive film are further improved.
Specifically, the silane coupling agent is one or the combination of any of vinyltriethoxysilane, vinyltrimethoxysilane, vinyltri-tert-butyl-peroxide silane, vinyltriacetoxysilane and vinyltris (beta-methoxyethoxy) silane.
Preferably, the silane coupling agent is vinyltris (. beta. -methoxyethoxy) silane.
The preparation method of the photovoltaic adhesive film with high PID resistance comprises the following preparation steps:
step S1, uniformly mixing the EVA resin, the antioxidant, the cross-linking agent, the coupling agent, the adamantane and the fullerene according to the formula ratio to prepare a mixture;
and step S2, adding the mixture into an extrusion device for melt extrusion, cooling by a casting device, carrying out sizing treatment, and carrying out thickness measurement, edge cutting, rolling, packaging and warehousing to obtain the high-PID-resistance photovoltaic adhesive film.
In step S2, the melt extrusion temperature is preferably 80-90 ℃, so as to ensure the adhesion effect of the high PID resistant photovoltaic adhesive film after melt extrusion and avoid aging of the mixture during melt extrusion.
The photovoltaic module comprises a front plate, a first packaging adhesive film, a solar cell piece, a second packaging adhesive film and a back plate which are sequentially stacked, wherein the first packaging adhesive film and/or the second packaging adhesive film adopt the photovoltaic adhesive film with high PID resistance, so that the PID resistance effect of the photovoltaic module is improved, the photovoltaic module keeps excellent light transmittance, and the service life and the power generation power of the photovoltaic module are further improved.
Example 1
The photovoltaic adhesive film with high resistance to PID of the embodiment comprises:
EVA resin: namely an ethylene-vinyl acetate copolymer, wherein the molar content of vinyl acetate in the ethylene-vinyl acetate copolymer is 28 percent;
antioxidant: the main antioxidant group is beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid octadecyl ester, and the auxiliary antioxidant is a compound of tris (4-nonylphenol) phosphite ester and tris (2, 4-di-tert-butylphenyl) phosphite;
a crosslinking agent: the crosslinking curing agent is a compound of tert-butyl peroxy-2-ethylhexyl carbonate and ethyl 3, 3-di (tert-butylperoxy) butyrate, and the auxiliary crosslinking agent is a compound of triallyl isocyanurate, triallyl cyanurate and trimethylolpropane trimethacrylate;
coupling agent: vinyltris (. beta. -methoxyethoxy) silane;
adamantane: i.e. tricyclo [3.3.1.13˙]Decane;
fullerene: is a hollow molecule composed of carbon and contains six-membered rings, five-membered rings and seven-membered rings.
In the high-resistance PID photovoltaic adhesive film of the embodiment, the weight ratio of EVA resin: antioxidant: a crosslinking agent: silane coupling agent: adamantane: fullerene, 100: 0.5: 2: 0.5: x: and Y.
The preparation method of the high-resistance PID photovoltaic adhesive film of the embodiment includes: uniformly mixing the EVA resin, the antioxidant, the crosslinking agent, the silane coupling agent, the adamantane and the fullerene according to the mass ratio to prepare a mixture; and adding the mixture into a hopper of an extruder, carrying out melt extrusion, controlling the temperature of each area of the extruder and a die head to be 80-90 ℃, extruding through the die head, cooling through a casting roller, shaping after an embossing process, and finally carrying out thickness measurement, edge cutting, rolling, packaging and warehousing to obtain the high-resistance PID photovoltaic adhesive film of the embodiment.
After the photovoltaic adhesive film with high PID resistance is used as a first packaging adhesive film and a second packaging adhesive film and packaged to form a photovoltaic module, the PID of the photovoltaic module is tested according to the IEC-62804 standard so as to observe the PID resistance effect of the photovoltaic module; and testing the light transmittance of the photovoltaic module according to the national standard GB/T29848-2018. The test results are shown in table 1 below:
TABLE 1
As can be seen from Table 1, the photovoltaic adhesive film with high PID resistance provided by the invention has a high PID resistance effect and also has good light transmittance after being packaged into a photovoltaic module as a first packaging adhesive film and a second packaging adhesive film.
While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.
The technical solutions provided by the present invention are described in detail above, and the principle and the implementation of the present invention are explained in this document by applying specific examples, and the descriptions of the above examples are only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. The photovoltaic adhesive film with high PID resistance is characterized by comprising the following raw materials in percentage by weight:
EVA resin 87-98%
Adamantane 0.05-4%
0.05-4% of fullerene
0.05 to 5 percent of antioxidant
0.25 to 2 percent of cross-linking agent
0.1 to 4 percent of coupling agent.
2. The high-PID-resistance photovoltaic adhesive film according to claim 1, wherein the mass ratio of the adamantane to the fullerene is 1-2: 1.
3. the high-PID-resistance photovoltaic adhesive film according to claim 2, wherein the EVA resin: antioxidant: a crosslinking agent: coupling agent: adamantane: the mass ratio of the fullerene is 100: 0.5: 2: 0.5: 0.1-0.2: 0.1-0.15.
4. The high-PID-resistance photovoltaic adhesive film according to claim 1, wherein the EVA resin has a vinyl acetate molar content of 20-30% and a melt flow rate of 1.5-18 g/min.
5. The high-PID-resistance photovoltaic adhesive film according to claim 1, wherein the antioxidant comprises a primary antioxidant and a secondary antioxidant;
the main anti-oxygen group is beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid octadecyl ester;
the auxiliary antioxidant is tris (4-nonylphenol) phosphite and/or tris (2, 4-di-tert-butylphenyl) phosphite.
6. The high-PID-resistance photovoltaic adhesive film according to claim 1, wherein the crosslinking agent comprises a crosslinking curing agent and an auxiliary crosslinking agent;
the crosslinking curing agent is organic peroxide and/or azo compound;
the auxiliary crosslinking agent is one or the combination of any several of triallyl isocyanurate, triallyl cyanurate, trimethylolpropane trimethacrylate and diethylene glycol dimethacrylate.
7. The high-PID-resistance photovoltaic adhesive film according to claim 1, wherein the coupling agent is a silane coupling agent;
the silane coupling agent is one or the combination of any more of vinyl triethoxysilane, vinyl trimethoxysilane, vinyl tri-tert-butyl peroxide silane, vinyl triacetoxysilane and vinyl tri (beta-methoxyethoxy) silane.
8. The method for preparing the photovoltaic adhesive film with high PID resistance of any one of claims 1 to 7, characterized by comprising the following steps:
step S1, uniformly mixing the EVA resin, the antioxidant, the cross-linking agent, the coupling agent, the adamantane and the fullerene according to the formula ratio to prepare a mixture;
and step S2, adding the mixture into an extrusion device for melt extrusion, cooling by a casting device, and shaping to obtain the high-PID-resistance photovoltaic adhesive film.
9. The method for preparing a highly PID resistant photovoltaic adhesive film according to claim 8, wherein in the step S2, the temperature of melt extrusion is 80-90 ℃.
10. A photovoltaic module comprises a front plate, a first packaging adhesive film, a solar cell piece, a second packaging adhesive film and a back plate which are sequentially stacked, and is characterized in that the first packaging adhesive film and/or the second packaging adhesive film is the high-PID-resistance photovoltaic adhesive film of any one of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210333674.8A CN114605927B (en) | 2022-03-31 | 2022-03-31 | high-PID-resistance photovoltaic adhesive film, preparation method thereof and photovoltaic module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210333674.8A CN114605927B (en) | 2022-03-31 | 2022-03-31 | high-PID-resistance photovoltaic adhesive film, preparation method thereof and photovoltaic module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114605927A true CN114605927A (en) | 2022-06-10 |
| CN114605927B CN114605927B (en) | 2023-08-11 |
Family
ID=81867408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210333674.8A Active CN114605927B (en) | 2022-03-31 | 2022-03-31 | high-PID-resistance photovoltaic adhesive film, preparation method thereof and photovoltaic module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114605927B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115477477A (en) * | 2022-08-16 | 2022-12-16 | 常州亚玛顿股份有限公司 | Production process of glass film integrated product |
| CN116948538A (en) * | 2023-07-14 | 2023-10-27 | 安徽隆芃新材料科技有限公司 | High-toughness photovoltaic EVA adhesive film and preparation process thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107841256A (en) * | 2016-09-19 | 2018-03-27 | 阿特斯(中国)投资有限公司 | Anti- PID types photovoltaic EVA packaging adhesive films and preparation method thereof |
| CN109554141A (en) * | 2017-09-25 | 2019-04-02 | 上海海优威新材料股份有限公司 | Ethylene vinyl acetate glue film, package assembling and the packaging method of anti-PID |
-
2022
- 2022-03-31 CN CN202210333674.8A patent/CN114605927B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107841256A (en) * | 2016-09-19 | 2018-03-27 | 阿特斯(中国)投资有限公司 | Anti- PID types photovoltaic EVA packaging adhesive films and preparation method thereof |
| CN109554141A (en) * | 2017-09-25 | 2019-04-02 | 上海海优威新材料股份有限公司 | Ethylene vinyl acetate glue film, package assembling and the packaging method of anti-PID |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115477477A (en) * | 2022-08-16 | 2022-12-16 | 常州亚玛顿股份有限公司 | Production process of glass film integrated product |
| CN116948538A (en) * | 2023-07-14 | 2023-10-27 | 安徽隆芃新材料科技有限公司 | High-toughness photovoltaic EVA adhesive film and preparation process thereof |
| CN116948538B (en) * | 2023-07-14 | 2024-01-16 | 安徽隆芃新材料科技有限公司 | High-toughness photovoltaic EVA adhesive film and preparation process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114605927B (en) | 2023-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108753184B (en) | Silane-grafted POE adhesive film for photovoltaic packaging and preparation method thereof | |
| CN111518487B (en) | Special PID (potential induced degradation) -resistant POE (polyolefin elastomer) adhesive film for photovoltaic dual-glass assembly packaging and preparation method thereof | |
| CN114605927A (en) | high-PID-resistance photovoltaic adhesive film, preparation method thereof and photovoltaic module | |
| US10030085B2 (en) | Resin composition for solar cell encapsulant, and solar cell encapsulant and solar cell module using the same | |
| JP6428199B2 (en) | Resin composition for solar cell encapsulant, and solar cell encapsulant and solar cell module using the same | |
| EP2958151B1 (en) | Resin composition for solar cell sealing materials, solar cell sealing material using same, and solar cell module | |
| CN114854331B (en) | Ultraviolet cut-off type EVA photovoltaic adhesive film, preparation method thereof and photovoltaic module | |
| EP2685508B1 (en) | Sealing film for solar cells and solar cell using same | |
| CN111732902A (en) | Anti-polarization packaging adhesive film for double-sided battery and preparation method thereof | |
| CN111635706A (en) | PID (potential induced degradation) resistant packaging adhesive film for double-sided PREC (pre-positive electrode contact) battery and preparation method thereof | |
| TW201441288A (en) | Encapsulation composition for a solarcell module and the solarcell module using the same | |
| EP2770541B1 (en) | Solar cell sealing film and solar cell using same | |
| CN114806422B (en) | UV cut-off type EPE photovoltaic adhesive film, preparation method thereof and photovoltaic module | |
| JP2016117891A (en) | Co-crosslinking agent system for encapsulation film comprising ethylene glycol di(meth)acrylate compound | |
| JP5565520B1 (en) | Resin composition for solar cell encapsulant, solar cell encapsulant and solar cell module | |
| CN107501706B (en) | P-type double-sided battery packaging adhesive film | |
| JP2016117897A (en) | Co-crosslinking agent system for encapsulation film containing urea compound | |
| KR20140072934A (en) | Encapsulation composition for a solarcell and preparing process fo the sheet using the same | |
| JP6608693B2 (en) | Co-crosslinking agent system for sealing film containing bis- (alkenylamide) compound | |
| CN109705772B (en) | POE (polyolefin elastomer) adhesive film with high electrical strength and resistance to electrochemical tracking and preparation method thereof | |
| CN114774023B (en) | EPE photovoltaic adhesive film, preparation method thereof and photovoltaic module | |
| CN116217431A (en) | Encapsulation composition, encapsulation material, preparation method thereof and electronic device assembly | |
| CN112852311B (en) | Photovoltaic packaging adhesive film, preparation method thereof and photovoltaic module | |
| CN113372849A (en) | anti-PID EMMA packaging adhesive film for solar packaging material | |
| JPWO2016043235A1 (en) | Solar cell encapsulant and solar cell module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220819 Address after: 215500 Building 1, No. 32, Qingnian Road, Changkun Industrial Park, Shajiabang Town, Changshu City, Suzhou City, Jiangsu Province Applicant after: Jiangsu Zhonglai New Material Technology Co.,Ltd. Address before: 215500 No.32 Qingnian Road, Changkun Industrial Park, Shajiabang Town, Changshu City, Suzhou City, Jiangsu Province Applicant before: Jolywood (Suzhou) Sunwatt Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |