CN114600240A - 显示用发光元件及具有其的led显示装置 - Google Patents
显示用发光元件及具有其的led显示装置 Download PDFInfo
- Publication number
- CN114600240A CN114600240A CN202080075493.9A CN202080075493A CN114600240A CN 114600240 A CN114600240 A CN 114600240A CN 202080075493 A CN202080075493 A CN 202080075493A CN 114600240 A CN114600240 A CN 114600240A
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- China
- Prior art keywords
- light emitting
- type semiconductor
- emitting stack
- light
- semiconductor layer
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/821—Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8314—Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/833—Transparent materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962926590P | 2019-10-28 | 2019-10-28 | |
| US62/926,590 | 2019-10-28 | ||
| US17/076,750 US11658275B2 (en) | 2019-10-28 | 2020-10-21 | Light emitting device for display and LED display apparatus having the same |
| US17/076,750 | 2020-10-21 | ||
| PCT/KR2020/014768 WO2021085993A1 (ko) | 2019-10-28 | 2020-10-28 | 디스플레이용 발광 소자 및 그것을 갖는 led 디스플레이 장치 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114600240A true CN114600240A (zh) | 2022-06-07 |
Family
ID=75312219
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080075493.9A Pending CN114600240A (zh) | 2019-10-28 | 2020-10-28 | 显示用发光元件及具有其的led显示装置 |
| CN202022439692.3U Active CN212934617U (zh) | 2019-10-28 | 2020-10-28 | 发光元件及显示装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022439692.3U Active CN212934617U (zh) | 2019-10-28 | 2020-10-28 | 发光元件及显示装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US12159966B2 (enExample) |
| EP (1) | EP4024479A4 (enExample) |
| JP (1) | JP7709433B2 (enExample) |
| KR (1) | KR20220093086A (enExample) |
| CN (2) | CN114600240A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7709433B2 (ja) * | 2019-10-28 | 2025-07-16 | ソウル バイオシス カンパニー リミテッド | ディスプレイ用発光素子及びそれを有するledディスプレイ装置 |
| CN112133734B (zh) * | 2020-09-29 | 2022-08-30 | 湖北长江新型显示产业创新中心有限公司 | 显示面板及显示装置 |
| KR20220079170A (ko) * | 2020-12-04 | 2022-06-13 | 엘지디스플레이 주식회사 | 발광 소자 및 표시 장치 |
| US20250204092A1 (en) * | 2023-12-18 | 2025-06-19 | Innolux Corporation | Semiconductor chip and semiconductor device |
| KR20250164979A (ko) * | 2024-05-17 | 2025-11-25 | 주식회사 오플렉스 | 발광 다이오드 필름 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103477456A (zh) * | 2011-02-09 | 2013-12-25 | 首尔半导体株式会社 | 具有波长转换层的发光装置 |
| CN104037281A (zh) * | 2013-03-07 | 2014-09-10 | 株式会社东芝 | 半导体发光元件及其制造方法 |
| CN105830141A (zh) * | 2013-12-17 | 2016-08-03 | Lg电子株式会社 | 使用半导体发光器件的显示设备及其制造方法 |
| US20190164945A1 (en) * | 2017-11-27 | 2019-05-30 | Seoul Viosys Co., Ltd. | Light emitting diode for display and display apparatus having the same |
| US20190189596A1 (en) * | 2017-12-20 | 2019-06-20 | Seoul Viosys Co., Ltd. | Led unit for display and display apparatus having the same |
| CN212934617U (zh) * | 2019-10-28 | 2021-04-09 | 首尔伟傲世有限公司 | 发光元件及显示装置 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11503879A (ja) * | 1995-12-21 | 1999-03-30 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | 多色光放出ダイオード、その製造方法及びこのledが組み込まれた多色表示装置 |
| TW522534B (en) | 2001-09-11 | 2003-03-01 | Hsiu-Hen Chang | Light source of full color LED using die bonding and packaging technology |
| JP4214704B2 (ja) | 2002-03-20 | 2009-01-28 | 日亜化学工業株式会社 | 半導体素子 |
| KR100548584B1 (ko) * | 2004-07-23 | 2006-02-02 | 주식회사 하이닉스반도체 | 게이트전극 형성방법 |
| JP2007080885A (ja) | 2005-09-09 | 2007-03-29 | New Japan Chem Co Ltd | 光半導体用封止剤、光半導体及びその製造方法 |
| JP5002703B2 (ja) | 2010-12-08 | 2012-08-15 | 株式会社東芝 | 半導体発光素子 |
| US8981391B2 (en) * | 2012-06-22 | 2015-03-17 | Industrial Technology Research Institute | Display panel with high transparency |
| TW201438188A (zh) | 2013-03-25 | 2014-10-01 | 美祿科技股份有限公司 | 堆疊式發光二極體陣列結構 |
| DE102016104280A1 (de) * | 2016-03-09 | 2017-09-14 | Osram Opto Semiconductors Gmbh | Bauelement und Verfahren zur Herstellung eines Bauelements |
| KR102513080B1 (ko) | 2016-04-04 | 2023-03-24 | 삼성전자주식회사 | Led 광원 모듈 및 디스플레이 장치 |
| KR102385091B1 (ko) | 2017-03-07 | 2022-04-12 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
| CN106847800A (zh) | 2017-03-28 | 2017-06-13 | 山东晶泰星光电科技有限公司 | Qfn表面贴装式rgb‑led封装模组及其制造方法 |
| US11282981B2 (en) * | 2017-11-27 | 2022-03-22 | Seoul Viosys Co., Ltd. | Passivation covered light emitting unit stack |
| US10892297B2 (en) * | 2017-11-27 | 2021-01-12 | Seoul Viosys Co., Ltd. | Light emitting diode (LED) stack for a display |
| US10892296B2 (en) * | 2017-11-27 | 2021-01-12 | Seoul Viosys Co., Ltd. | Light emitting device having commonly connected LED sub-units |
| US11527519B2 (en) * | 2017-11-27 | 2022-12-13 | Seoul Viosys Co., Ltd. | LED unit for display and display apparatus having the same |
| US10886327B2 (en) | 2017-12-14 | 2021-01-05 | Seoul Viosys Co., Ltd. | Light emitting stacked structure and display device having the same |
| US11522006B2 (en) * | 2017-12-21 | 2022-12-06 | Seoul Viosys Co., Ltd. | Light emitting stacked structure and display device having the same |
| US11114499B2 (en) * | 2018-01-02 | 2021-09-07 | Seoul Viosys Co., Ltd. | Display device having light emitting stacked structure |
| US10862006B2 (en) * | 2018-08-17 | 2020-12-08 | Seoul Viosys Co., Ltd. | Light emitting device |
| US11476236B2 (en) * | 2018-11-07 | 2022-10-18 | Seoul Viosys Co., Ltd. | Display apparatus |
| US11508876B2 (en) * | 2018-12-31 | 2022-11-22 | Seoul Viosys Co., Ltd. | Light emitting device package and display device having the same |
| US11152553B2 (en) * | 2019-01-15 | 2021-10-19 | Seoul Viosys Co., Ltd. | Light emitting device package and display device having the same |
| US11450648B2 (en) * | 2019-03-19 | 2022-09-20 | Seoul Viosys Co., Ltd. | Light emitting device package and application thereof |
| US11587914B2 (en) * | 2019-05-14 | 2023-02-21 | Seoul Viosys Co., Ltd. | LED chip and manufacturing method of the same |
| MX2021013716A (es) * | 2019-05-14 | 2021-11-25 | Seoul Viosys Co Ltd | Chip led y metodo de manufactura del mismo. |
| WO2020257391A1 (en) * | 2019-06-19 | 2020-12-24 | Hong Kong Beida Jade Bird Display Limited | Systems and methods for coaxial multi-color led |
| US11810944B2 (en) * | 2019-10-23 | 2023-11-07 | Seoul Viosys Co., Ltd. | LED display apparatus |
| US11817435B2 (en) * | 2019-10-28 | 2023-11-14 | Seoul Viosys Co., Ltd. | Light emitting device for display and LED display apparatus having the same |
-
2020
- 2020-10-28 JP JP2022525583A patent/JP7709433B2/ja active Active
- 2020-10-28 CN CN202080075493.9A patent/CN114600240A/zh active Pending
- 2020-10-28 KR KR1020227004603A patent/KR20220093086A/ko not_active Ceased
- 2020-10-28 EP EP20881323.8A patent/EP4024479A4/en active Pending
- 2020-10-28 CN CN202022439692.3U patent/CN212934617U/zh active Active
-
2023
- 2023-05-22 US US18/200,400 patent/US12159966B2/en active Active
-
2024
- 2024-09-26 US US18/897,592 patent/US20250023006A1/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103477456A (zh) * | 2011-02-09 | 2013-12-25 | 首尔半导体株式会社 | 具有波长转换层的发光装置 |
| CN104037281A (zh) * | 2013-03-07 | 2014-09-10 | 株式会社东芝 | 半导体发光元件及其制造方法 |
| CN105830141A (zh) * | 2013-12-17 | 2016-08-03 | Lg电子株式会社 | 使用半导体发光器件的显示设备及其制造方法 |
| US20190164945A1 (en) * | 2017-11-27 | 2019-05-30 | Seoul Viosys Co., Ltd. | Light emitting diode for display and display apparatus having the same |
| US20190189596A1 (en) * | 2017-12-20 | 2019-06-20 | Seoul Viosys Co., Ltd. | Led unit for display and display apparatus having the same |
| CN212934617U (zh) * | 2019-10-28 | 2021-04-09 | 首尔伟傲世有限公司 | 发光元件及显示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20230378412A1 (en) | 2023-11-23 |
| US12159966B2 (en) | 2024-12-03 |
| EP4024479A4 (en) | 2023-10-11 |
| CN212934617U (zh) | 2021-04-09 |
| KR20220093086A (ko) | 2022-07-05 |
| JP7709433B2 (ja) | 2025-07-16 |
| EP4024479A1 (en) | 2022-07-06 |
| US20250023006A1 (en) | 2025-01-16 |
| JP2023501269A (ja) | 2023-01-18 |
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