CN114590045B - Printing method of high-precision solder pattern - Google Patents
Printing method of high-precision solder pattern Download PDFInfo
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- CN114590045B CN114590045B CN202111652113.6A CN202111652113A CN114590045B CN 114590045 B CN114590045 B CN 114590045B CN 202111652113 A CN202111652113 A CN 202111652113A CN 114590045 B CN114590045 B CN 114590045B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/34—Printing on other surfaces than ordinary paper on glass or ceramic surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/009—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using thermal means, e.g. infrared radiation, heat
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Abstract
The invention discloses a printing method of a high-precision solder pattern, which comprises the following processes: adding positioning dots on a silk-screen printing steel mesh; (2) Arranging alignment holes corresponding to the dots on the steel mesh on the ceramic substrate; (3) Performing screen printing, printing solder on the ceramic substrate through the positioning circular dots, and drying to form alignment points; and (4) aligning, and taking the active solder for screen printing. The invention can effectively solve the problem of difficult positioning of the existing silk screen printing, realize the positioning printing of high-precision solder patterns, simultaneously realize high-efficiency continuous printing and prevent the precision loss caused by the difficult positioning; the method can effectively compensate in a mode of using a CCD alignment system, is convenient to debug, and meets the printing requirement of the prior high-precision pattern solder.
Description
Technical Field
The invention relates to the technical field of solder pattern printing, in particular to a printing method of a high-precision solder pattern.
Background
The production process of the PCB is complex, the related process range is wide, the screen printing is an important printing mode in the production of the circuit board, and the basic principle that the meshes of the image-text part of a screen printing plate are ink-permeable and the meshes of the non-image-text part are ink-impermeable is utilized for printing. With the development of technology, it is necessary to align the positions before printing in order to improve accuracy and precision. The printing positioning mode in the industry at present has two modes, one is that a limiting jig is used, and the limiting jig is adapted to perform alignment printing in a fixed range after a printing range is determined, but the jig positioning mode is complicated, the preparation time is long, a large amount of time and energy are wasted, and the positioning accuracy is low; secondly, printing is carried out by using CCD alignment, the CCD alignment has high accuracy and high speed, the alignment speed is less than 1s, the alignment is precise, the alignment precision is less than 5 microns, and the CCD alignment device has a compensation function, can effectively compensate mechanical errors and is convenient to debug; however, the CCD alignment system is expensive, and the mark points required for alignment need to be precise and pollution-free. Therefore, we propose a method of printing a high-precision solder pattern.
Disclosure of Invention
The present invention is directed to a method for printing a high-precision solder pattern, which solves the above-mentioned problems of the related art.
In order to solve the technical problems, the invention provides the following technical scheme: a printing method of a high-precision solder pattern comprises the following processes:
(1) Adding positioning dots on a steel mesh for screen printing;
(2) Arranging alignment holes corresponding to the dots on the steel mesh on the ceramic substrate;
(3) Performing screen printing, printing solder on the ceramic substrate through the positioning circular dots, and drying to form alignment points;
(4) And aligning the alignment points and the positioning round dots, and taking the active solder for screen printing to form a high-precision solder pattern.
In the technical scheme, the ceramic substrate is filled with the solder by adopting a screen printing technology, positioning round dots are added on a steel mesh on the screen printing equipment, and alignment holes are added on the ceramic substrate and correspond to the round dots on the steel mesh; the welding flux is printed on the ceramic substrate through a silk screen by printing, after the ceramic substrate is dried by the oven, the CCD is aligned with the required alignment points to form, and the ceramic substrate can be used. Aligning and calibrating mark points of a screen printing machine to the aligning points; after the equipment is calibrated, the silk screen can be performed only by placing the positioning points on the ceramic substrate in the mark point mark position area.
Further, the active solder comprises the following components in parts by weight: 88 to 96 parts of solder alloy particles and 4 to 12 parts of soldering flux.
Further, the soldering flux comprises the following components in parts by weight: 7-15 parts of active agent, 35-50 parts of film forming agent, 8-9 parts of thixotropic agent and 28-32 parts of solvent.
Further, the active agent comprises methylsuccinic acid, adipic acid, salicylic acid and succinic acid, and the mass ratio of the active agent to the active agent is 5.
Further, the film forming agent comprises acrylic acid modified rosin and specific modified rosin, and the mass ratio of the acrylic acid modified rosin to the specific modified rosin is 1 (3-4).
Furthermore, the thixotropic agent is hydrogenated castor oil and ethylene bisstearamide, and the mass ratio of the thixotropic agent to the ethylene bisstearamide is (1.5-4.0): 1.
Further, the solvent is ethylene glycol ethyl ether, tetrahydrofurfuryl alcohol and diethylene glycol monoethyl ether, and the mass ratio is 1.
Further, the specific modified rosin is prepared by the following process:
heating and melting rosin, adding fumaric acid and acetic acid, mixing, and carrying out microwave reaction, wherein the microwave process comprises the following steps: the microwave power is 280-300W, the reaction time is 25-30 min, and a product A is obtained;
taking the product A, adding thionyl chloride, and stirring and reacting at room temperature for 30-60 min; adding anhydrous dichloromethane for dissolving, adjusting the temperature of the system to 0 ℃, adding ammonia water, and stirring for reaction for 1-2 hours to obtain a product B;
mixing the product B with anhydrous toluene, adjusting the temperature of the system to 0 ℃, adding oxalyl chloride, recovering the room temperature, stirring and reacting for 50-60 min, adjusting the temperature of the system to 50-57 ℃, stirring and reacting for 2.8-3.2 h, heating and refluxing for reaction for 4.8-5.3 h to obtain a product C;
(2) Taking pentaerythritol, N-dihydroxyethyl-3-methyl aminopropionate and a catalyst, heating to 120-125 ℃, reacting for 3h, carrying out rotary evaporation for 45-60 min at 40-50 ℃, and vacuumizing for 30-40 min to remove generated methanol; adding N, N-dihydroxyethyl-3-amino methyl propionate and p-toluenesulfonic acid, and continuing to react to obtain a product D;
(3) And (3) dissolving the product D in chloroform, dropwise adding the product C, and reacting at room temperature for 24 hours to obtain the specific modified rosin.
Further, the molar ratio of the rosin to the fumaric acid is (1.0-1.1) 1; the mass ratio is 10 (2.5-3.2).
Furthermore, the mol of the product A and the thionyl chloride is 1 (1.0-1.2).
Furthermore, the molar ratio of the product B to the oxalyl chloride is 1 (1.0-1.1).
Further, the molar ratio of the pentaerythritol to the methyl N, N-dihydroxyethyl-3-aminopropionate is 1.
Furthermore, the catalyst is p-toluenesulfonic acid, and the mass of the catalyst is 5% of that of the N, N-dihydroxyethyl-3-methyl aminopropionate.
Furthermore, the molar ratio of the product C to the product D is (12.0-12.1): 1.
In the technical scheme, the resin soldering flux is selected to assist the solder alloy particles for welding, so that the corrosion strength of the solder alloy particles to the ceramic substrate is reduced while the excellent soldering performance is provided, and the realization of a high-precision solder pattern is facilitated; performing Diels-Alder reaction (D-A addition) on conjugated diene in rosin and olefin in fumaric acid to obtain fumaric rosin, namely a product A; acylating part of carboxylic acid in the product A by thionyl chloride, aminolysis by ammonia water, and finally reacting with oxalyl chloride to convert part of carboxylic acid in the product A into isocyanato to obtain a product C; adding N, N-dihydroxyethyl-3-amino methyl propionate and a catalyst for several times, and reacting with pentaerythritol to obtain hydroxyl-terminated branched polyester, namely a product D; adding the product C to react isocyanate groups in the product C with hydroxyl groups in the terminal hydroxyl branched polyester to obtain terminal abietic acid group branched polyester, namely the specific modified rosin; the nitrogen element is introduced as a film forming agent and is matched with acrylic acid modified rosin, compared with the conventional rosin and modified substances thereof, the nitrogen element can improve the adhesive strength between the solder alloy particles and the ceramic substrate and reduce the corrosivity to metal; meanwhile, the solder alloy can cooperate with an activator to promote the activity of the solder alloy particles to be improved; due to the branched structure, the specific modified rosin has lower viscosity and stronger dissolving capacity in a solvent, and is matched with a thixotropic agent to improve the spreading performance of the prepared active solder; the rosin modified has better thermal stability, is beneficial to the attractive appearance of the spreading appearance of the active solder, reduces the spreading performance and improves the spreading performance; the film forming agent is modified, so that the synergistic effect between the film forming agent and other components of the soldering flux is improved, and the welding performance of the film forming agent is improved.
Compared with the prior art, the invention has the following beneficial effects:
according to the printing method of the high-precision solder pattern, the positioning round points are added on the steel mesh, the alignment holes corresponding to the round points on the steel mesh are added on the ceramic substrate, the ceramic substrate is filled with the solder through the positioning round points by utilizing the screen printing technology, and after drying, the alignment points required by CCD alignment are formed and can be used. Setting mark points of a screen printing machine to align the alignment points, and calibrating; after equipment is calibrated, silk-screen printing can be performed only by placing positioning points on the ceramic substrate in mark point marking position areas; the problem of difficult positioning of the existing screen printing can be effectively solved, the positioning printing of high-precision solder patterns is realized, meanwhile, the high-efficiency continuous printing is realized, and the precision loss caused by the difficult positioning is prevented; the method can effectively compensate in a mode of using a CCD alignment system, is convenient to debug, and meets the printing requirement of the current high-precision pattern solder.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
(1) Adding positioning round dots on a steel mesh for screen printing;
(2) Arranging alignment holes corresponding to the dots on the steel mesh on the ceramic substrate;
(3) Performing screen printing, printing solder on the ceramic substrate through the positioning circular dots, and drying to form alignment points;
(4) Aligning the alignment points and the positioning dots, and taking the active solder for screen printing to form a high-precision solder pattern;
the active solder comprises the following components in parts by weight: 88 parts of solder alloy particles and 4 parts of soldering flux; the soldering flux comprises the following components in parts by weight: 7 parts of active agent, 35 parts of film forming agent, 8 parts of thixotropic agent and 28 parts of solvent; the activating agent comprises methylsuccinic acid, adipic acid, salicylic acid and succinic acid, and the mass ratio of the activating agent to the active agent is 5; the film forming agent comprises acrylic acid modified rosin and specific modified rosin, and the mass ratio of the acrylic acid modified rosin to the specific modified rosin is 1; the thixotropic agent is hydrogenated castor oil and ethylene bisstearamide, and the mass ratio is 1.5; the solvent is ethylene glycol ethyl ether, tetrahydrofurfuryl alcohol and diethylene glycol monoethyl ether, and the mass ratio is 1;
the specific modified rosin is prepared by the following process:
(1) Heating and melting rosin, adding fumaric acid and acetic acid, mixing, and carrying out microwave reaction, wherein the process comprises the following steps: the microwave power is 280W, and the reaction time is 25min; adding ethanol for crystallization, filtering after 24 hours, and vacuum drying filter residues to obtain a product A;
taking the product A, adding thionyl chloride, and stirring at room temperature for reaction for 30min; adding anhydrous dichloromethane for dissolution, adjusting the temperature of the system to 0 ℃, adding ammonia water, and stirring for reaction for 1h to obtain a product B;
mixing the product B with anhydrous toluene, adjusting the temperature of the system to 0 ℃, adding oxalyl chloride, recovering to room temperature, stirring for reaction for 50min, adjusting the temperature of the system to 50 ℃, stirring for reaction for 2.8h, and heating for reflux reaction for 4.8h to obtain a product C; the molar ratio of rosin to fumaric acid is 1; the mass ratio is 10; the molar ratio of the product A to thionyl chloride is 1; the molar ratio of the product B to oxalyl chloride is 1;
(2) Heating pentaerythritol, N-dihydroxyethyl-3-methyl aminopropionate and a catalyst to 120 ℃, reacting for 3h, carrying out rotary evaporation for 45min at 40 ℃, and vacuumizing for 30min to remove generated methanol; adding N, N-dihydroxyethyl-3-methyl aminopropionate and p-toluenesulfonic acid, and continuing to react to obtain a product D; the molar ratio of pentaerythritol to methyl N, N-dihydroxyethyl-3-aminopropionate is 1; the catalyst is p-toluenesulfonic acid, and the mass of the catalyst is 5% of that of N, N-dihydroxyethyl-3-methyl aminopropionate;
(3) Dissolving the product D in chloroform, dropwise adding the product C, and reacting at room temperature for 24h; washing with methanol, and rotary-steaming at 30 deg.C for 1h to remove solvent to obtain specific modified rosin; the molar ratio of the product C to the product D is 12.
Example 2
(1) Adding positioning dots on a steel mesh for screen printing;
(2) Arranging alignment holes corresponding to the dots on the steel mesh on the ceramic substrate;
(3) Performing screen printing, printing solder on the ceramic substrate through the positioning round dots, and drying to form alignment points;
(4) Aligning the alignment points and the positioning dots, and taking the active solder for screen printing to form a high-precision solder pattern;
the active solder comprises the following components in parts by weight: 92 parts of solder alloy particles and 8 parts of soldering flux; the soldering flux comprises the following components in parts by weight: 11 parts of active agent, 42 parts of film forming agent, 8 parts of thixotropic agent and 30 parts of solvent; the activator comprises methylsuccinic acid, adipic acid, salicylic acid and succinic acid, and the mass ratio is 5; the film forming agent comprises acrylic acid modified rosin and specific modified rosin, and the mass ratio of the acrylic acid modified rosin to the specific modified rosin is 1; the thixotropic agent is hydrogenated castor oil and ethylene bisstearamide, and the mass ratio of the thixotropic agent to the ethylene bisstearamide is 2.7; the solvent is ethylene glycol ethyl ether, tetrahydrofurfuryl alcohol and diethylene glycol monoethyl ether, and the mass ratio is 1;
the specific modified rosin is prepared by the following process:
(1) Heating and melting rosin, adding fumaric acid and acetic acid, mixing, and carrying out microwave reaction, wherein the process comprises the following steps: microwave power 290W and reaction time 27min; adding ethanol for crystallization, filtering after 24 hours, and vacuum drying filter residues to obtain a product A;
taking the product A, adding thionyl chloride, and stirring at room temperature for reaction for 45min; adding anhydrous dichloromethane for dissolution, adjusting the temperature of the system to 0 ℃, adding ammonia water, and stirring for reaction for 1.5 hours to obtain a product B;
mixing the product B with anhydrous toluene, adjusting the temperature of the system to 0 ℃, adding oxalyl chloride, recovering to room temperature, stirring for reaction for 55min, adjusting the temperature of the system to 55 ℃, stirring for reaction for 3h, and heating for reflux reaction for 5h to obtain a product C; the molar ratio of rosin to fumaric acid is 1.05; the mass ratio is 10; the mol of the product A and thionyl chloride is 1.1; the molar ratio of the product B to oxalyl chloride is 1.0;
(2) Heating pentaerythritol, N-dihydroxyethyl-3-methyl aminopropionate and a catalyst to 122 ℃, reacting for 3h, carrying out rotary evaporation for 52min at 45 ℃, and vacuumizing for 35min to remove generated methanol; adding N, N-dihydroxyethyl-3-amino methyl propionate and p-toluenesulfonic acid, and continuing to react to obtain a product D; the molar ratio of pentaerythritol to methyl N, N-dihydroxyethyl-3-aminopropionate is 1; the catalyst is p-toluenesulfonic acid, and the mass of the catalyst is 5% of that of N, N-dihydroxyethyl-3-methyl aminopropionate;
(3) Dissolving the product D in chloroform, dropwise adding the product C, and reacting at room temperature for 24h; washing with methanol, and rotary-steaming at 35 deg.C for 1h to remove solvent to obtain specific modified rosin; the molar ratio of the product C to the product D is 12.
Example 3
(1) Adding positioning dots on a steel mesh for screen printing;
(2) Arranging alignment holes corresponding to the dots on the steel mesh on the ceramic substrate;
(3) Performing screen printing, printing solder on the ceramic substrate through the positioning circular dots, and drying to form alignment points;
(4) Aligning the alignment points and the positioning dots, and taking the active solder for screen printing to form a high-precision solder pattern;
the active solder comprises the following components in parts by weight: 96 parts of solder alloy particles and 12 parts of soldering flux; the soldering flux comprises the following components in parts by weight: 15 parts of active agent, 50 parts of film forming agent, 9 parts of thixotropic agent and 32 parts of solvent; the activator comprises methylsuccinic acid, adipic acid, salicylic acid and succinic acid, and the mass ratio is 5; the film forming agent comprises acrylic acid modified rosin and specific modified rosin, and the mass ratio of the acrylic acid modified rosin to the specific modified rosin is 1; the thixotropic agent is hydrogenated castor oil and ethylene bisstearamide, and the mass ratio is 4; the solvent is ethylene glycol ethyl ether, tetrahydrofurfuryl alcohol and diethylene glycol monoethyl ether, and the mass ratio is 1;
the specific modified rosin is prepared by the following process:
(1) Heating and melting rosin, adding fumaric acid and acetic acid, mixing, and carrying out microwave reaction, wherein the process comprises the following steps: the microwave power is 300W, and the reaction time is 30min; adding ethanol for crystallization, filtering after 24 hours, and vacuum drying filter residues to obtain a product A;
taking the product A, adding thionyl chloride, and stirring and reacting at room temperature for 60min; adding anhydrous dichloromethane for dissolving, adjusting the temperature of the system to 0 ℃, adding ammonia water, and stirring for reacting for 2 hours to obtain a product B;
mixing the product B with anhydrous toluene, adjusting the temperature of the system to 0 ℃, adding oxalyl chloride, recovering to room temperature, stirring and reacting for 60min, adjusting the temperature of the system to 57 ℃, stirring and reacting for 3.2h, heating and refluxing for 5.3h to obtain a product C; the molar ratio of rosin to fumaric acid is 1.1; the mass ratio is 10; the mol of the product A and thionyl chloride is 1.2; the molar ratio of the product B to oxalyl chloride is 1.1;
(2) Heating pentaerythritol, N-dihydroxyethyl-3-methyl aminopropionate and a catalyst to 125 ℃, reacting for 3h, carrying out rotary evaporation for 60min at 50 ℃, and vacuumizing for 40min to remove generated methanol; adding N, N-dihydroxyethyl-3-amino methyl propionate and p-toluenesulfonic acid, and continuing to react to obtain a product D; the molar ratio of pentaerythritol to methyl N, N-dihydroxyethyl-3-aminopropionate is 1; the catalyst is p-toluenesulfonic acid, and the mass of the catalyst is 5 percent of that of N, N-dihydroxyethyl-3-methyl aminopropionate;
(3) Dissolving the product D in chloroform, dropwise adding the product C, and reacting at room temperature for 24h; cleaning with methanol, and rotary-steaming at 40 ℃ for 1h to remove the solvent to obtain the specific modified rosin; the molar ratio of the product C to the product D is 12.1.
Comparative example 1
(1) Adding positioning dots on a steel mesh for screen printing;
(2) Arranging alignment holes corresponding to the dots on the steel mesh on the ceramic substrate;
(3) Performing screen printing, printing solder on the ceramic substrate through the positioning circular dots, and drying to form alignment points;
(4) Aligning the alignment points and the positioning dots, and taking the active solder for screen printing to form a high-precision solder pattern;
the active solder comprises the following components in parts by weight: 96 parts of solder alloy particles and 12 parts of soldering flux; the soldering flux comprises the following components in parts by weight: 15 parts of active agent, 50 parts of film forming agent, 9 parts of thixotropic agent and 32 parts of solvent; the activating agent comprises methylsuccinic acid, adipic acid, salicylic acid and succinic acid, and the mass ratio of the activating agent to the active agent is 5; the film forming agent comprises acrylic acid modified rosin and white ice rosin, and the mass ratio of the acrylic acid modified rosin to the white ice rosin is 1; the thixotropic agent is hydrogenated castor oil and ethylene bisstearamide, and the mass ratio is 4; the solvent is ethylene glycol ethyl ether, tetrahydrofurfuryl alcohol and diethylene glycol monoethyl ether, and the mass ratio is 1.
Comparative example 2
(1) Adding positioning dots on a steel mesh for screen printing;
(2) Arranging alignment holes corresponding to the dots on the steel mesh on the ceramic substrate;
(3) Performing screen printing, printing solder on the ceramic substrate through the positioning circular dots, and drying to form alignment points;
(4) Aligning the alignment points and the positioning dots, and taking the active solder for screen printing to form a high-precision solder pattern;
the active solder comprises the following components in parts by weight: 96 parts of solder alloy particles and 12 parts of soldering flux; the soldering flux comprises the following components in parts by weight: 15 parts of active agent, 50 parts of film forming agent, 9 parts of thixotropic agent and 32 parts of solvent; the activating agent comprises methylsuccinic acid, adipic acid, salicylic acid and succinic acid, and the mass ratio of the activating agent to the active agent is 5; the film forming agent comprises acrylic acid modified rosin and fumaric rosin, and the mass ratio is 1; the thixotropic agent is hydrogenated castor oil and ethylene bisstearamide, and the mass ratio is 4; the solvent is ethylene glycol ethyl ether, tetrahydrofurfuryl alcohol and diethylene glycol monoethyl ether, and the mass ratio is 1.
Comparative example 3
In comparison with the example 1, the method of the present invention,
the specific modified rosin is prepared by the following process:
(1) Heating and melting rosin, adding fumaric acid and acetic acid, mixing, and carrying out microwave reaction, wherein the process comprises the following steps: the microwave power is 280W, and the reaction time is 25min; adding ethanol for crystallization, filtering after 24 hours, and vacuum-drying filter residues to obtain a product A;
taking the product A, adding thionyl chloride, and stirring and reacting at room temperature for 30min; adding anhydrous dichloromethane for dissolving, adjusting the temperature of the system to 0 ℃, adding ammonia water, and stirring for reacting for 1 hour to obtain a product B;
mixing the product B with anhydrous toluene, adjusting the temperature of the system to 0 ℃, adding oxalyl chloride, recovering to room temperature, stirring for reaction for 50min, adjusting the temperature of the system to 50 ℃, stirring for reaction for 2.8h, and heating for reflux reaction for 4.8h to obtain a product C; the molar ratio of rosin to fumaric acid is 1; the mass ratio is 10; the molar ratio of the product A to the thionyl chloride is 1; the molar ratio of the product B to oxalyl chloride is 1;
(2) Dissolving N, N-dihydroxyethyl-3-amino methyl propionate in chloroform, dropwise adding the product C, and reacting at room temperature for 24h; washing with methanol, and rotary-steaming at 30 deg.C for 1h to remove solvent to obtain specific modified rosin; the molar ratio of the product C to the product N, N-dihydroxyethyl-3-aminopropionic acid methyl ester is 2;
the other steps are the same as the process of example 1.
Experiment of the invention
Taking the high-precision solder patterns obtained in the examples 1 to 3 and the comparative examples 1 to 3, preparing samples, respectively detecting the performances of the samples and recording the detection results:
the solder alloy particles used in the above examples 1 to 3 and comparative examples 1 to 3 were Sn — Bi alloy;
spreading rate: taking a stainless steel template to print active solder on a copper-clad ceramic substrate, wherein the size of the template is as follows: thickness of 0.25mm, opening phi of 6.5mm, reflow soldering, melting solder, wetting and spreading on a substrate to form a spherical crown, calculating spreading rate E = (d-h)/d × 100% of active solder, and d = K in the drawing 3 √m pp X η, and observing corrosion; wherein d is the equivalent spherical diameter of the active solder and is in mm; h is the height of a welding spot in mm; k is a conversion coefficient, and K is approximately equal to 6.05574; m is a unit of pp Is the print mass of the active solder, in g; eta is the mass fraction of the solder alloy particles in the active solder.
Residual rate after welding: taking a single-sided copper-clad ceramic substrate with polished and wiped surface, wherein the size of the substrate is 15mm multiplied by 1mm, respectively printing active solder in the center of the substrate by using a stainless steel template, and the size of the template is as follows: the thickness is 0.25mm, and the diameter of the hole phi is 6.5mm; respectively weighing the mass of the substrate and the total mass of the welding points and the substrate before and after welding; calculating the residual rate eta = (m 1-m 2)/alpha (m 1-m 0) after welding; where m1 is the printed substrate mass (active solder + substrate), in g; m2 is the total mass of the welded substrate and the welding spot, and the unit is g; alpha is the mass fraction of the soldering flux; m0 is the mass of the substrate in g.
| Spreading Rate (%) | Residual rate after welding (%) | |
| Example 1 | 86.44 | 38.42 |
| Example 2 | 87.10 | 38.37 |
| Example 3 | 87.73 | 38.23 |
| Comparative example 1 | 85.02 | 40.33 |
| Comparative example 2 | 84.24 | 42.78 |
| Comparative example 3 | 85.41 | 40.12 |
From the data in the table above, it is clear that the following conclusions can be drawn:
the high-precision solder patterns obtained in examples 1 to 3 were compared with the high-precision solder patterns obtained in comparative examples 1 to 3, and the results of the tests were found to be,
compared with comparative examples 1-3, the high-precision solder patterns obtained in examples 1-3 have obviously higher spreading rate data and obviously lower post-welding residual rate data, so that the active solder realizes the improvement of the spreading rate and the post-welding residual rate of the solder patterns, improves the welding performance, and is beneficial to the high-precision control and realization of the solder patterns;
compared with the example 1, the specific modified rosin in the comparative example 1 is replaced by white ice rosin, the specific modified rosin in the comparative example 2 is replaced by fumaric rosin, the specific modified rosin in the comparative example 3 is obtained by reacting N, N-dihydroxyethyl-3-methyl aminopropionate and a product C, the data of the spreading rate and the residual rate after welding are all deteriorated, the corrosion condition is observed, and the corrosion of the welding spot in the comparative examples 1-2 is relatively high; the reason is that: compared with the specific modified rosin in the embodiment 1, the substances in the comparative examples 1 to 3 have lower viscosity, simpler molecular structure, weaker bonding with metal and poorer thermal stability, so that the welding performance between the prepared active solder and the copper-clad ceramic substrate is reduced.
It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Furthermore, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process method article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process method article or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent change and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A printing method of a high-precision solder pattern is characterized in that: the method comprises the following processes:
(1) Adding positioning dots on a steel mesh for screen printing;
(2) Arranging alignment holes corresponding to the dots on the steel mesh on the ceramic substrate;
(3) Performing screen printing, printing solder on the ceramic substrate through the positioning circular dots, and drying to form alignment points;
(4) Aligning, and taking active solder for screen printing;
the active solder comprises the following components in parts by weight: 88 to 96 parts of solder alloy particles and 4 to 12 parts of soldering flux; the soldering flux comprises the following components in parts by weight: 7-15 parts of active agent, 35-50 parts of film forming agent, 8-9 parts of thixotropic agent and 28-32 parts of solvent;
the film forming agent comprises acrylic acid modified rosin and specific modified rosin, and the mass ratio of the acrylic acid modified rosin to the specific modified rosin is 1 (3-4);
the specific modified rosin is prepared by the following process:
heating and melting rosin, adding fumaric acid and acetic acid, mixing, and carrying out microwave reaction, wherein the microwave process comprises the following steps: the microwave power is 280-300W, the reaction time is 25-30 min, and a product A is obtained;
taking the product A, adding thionyl chloride, stirring and reacting at room temperature for 30-60 min; adding anhydrous dichloromethane for dissolving, adjusting the temperature of the system to 0 ℃, adding ammonia water, and stirring for reaction for 1-2 hours to obtain a product B;
mixing the product B with anhydrous toluene, adjusting the temperature of the system to 0 ℃, adding oxalyl chloride, recovering to room temperature, stirring and reacting for 50-60 min, adjusting the temperature of the system to 50-57 ℃, stirring and reacting for 2.8-3.2 h, and heating and refluxing for 4.8-5.3 h to obtain a product C;
(2) Heating pentaerythritol, N-dihydroxyethyl-3-methyl aminopropionate and a catalyst to 120-125 ℃, reacting for 3h, carrying out rotary evaporation for 45-60 min at 40-50 ℃, and vacuumizing for 30-40 min to remove generated methanol; adding N, N-dihydroxyethyl-3-amino methyl propionate and p-toluenesulfonic acid, and continuing to react to obtain a product D;
(3) And (3) dissolving the product D in chloroform, dropwise adding the product C, and reacting at room temperature for 24 hours to obtain the specific modified rosin.
2. A printing method of a high precision solder pattern according to claim 1, characterized in that: the activator comprises methylsuccinic acid, adipic acid, salicylic acid and succinic acid, and the mass ratio of the activator to the activator is 5.
3. A printing method of a high precision solder pattern according to claim 1, characterized in that: the thixotropic agent is hydrogenated castor oil and ethylene bisstearamide, and the mass ratio of the thixotropic agent to the ethylene bisstearamide is (1.5-4.0): 1.
4. A printing method of a high precision solder pattern according to claim 1, characterized in that: the solvent is ethylene glycol ethyl ether, tetrahydrofurfuryl alcohol and diethylene glycol monoethyl ether, and the mass ratio is 1.
5. A printing method of a high precision solder pattern according to claim 1, characterized in that: the molar ratio of the rosin to the fumaric acid is (1.0-1.1) to 1; the mass ratio is 10 (2.5-3.2);
the mol of the product A and the thionyl chloride is 1 (1.0-1.2);
the molar ratio of the product B to the oxalyl chloride is 1 (1.0-1.1).
6. A printing method of a high precision solder pattern according to claim 1, characterized in that: the molar ratio of the pentaerythritol to the methyl N, N-dihydroxyethyl-3-aminopropionate is 1; the catalyst is p-toluenesulfonic acid, and the mass of the catalyst is 5% of that of N, N-dihydroxyethyl-3-methyl aminopropionate.
7. A printing method of a high precision solder pattern according to claim 1, characterized in that: the molar ratio of the product C to the product D is (12.0-12.1): 1.
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