CN114589425B - Method for welding micro-interconnection welding spots of integrated circuit by electromagnetic pulse solid state welding - Google Patents
Method for welding micro-interconnection welding spots of integrated circuit by electromagnetic pulse solid state welding Download PDFInfo
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- CN114589425B CN114589425B CN202210223891.1A CN202210223891A CN114589425B CN 114589425 B CN114589425 B CN 114589425B CN 202210223891 A CN202210223891 A CN 202210223891A CN 114589425 B CN114589425 B CN 114589425B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
The invention discloses a method for welding micro-interconnection welding spots of an integrated circuit by electromagnetic pulse solid state welding, which comprises the steps of welding a line-to-line double coil, welding a line-to-line single coil and welding a line-to-plate; the method for welding the micro-interconnection welding spots of the integrated circuit by the electromagnetic pulse solid state welding has the advantages that three structures and methods for welding based on the strong electromagnetic pulse principle are provided for welding the lines and the surfaces respectively, the reliable connection of the micro-welding spots of the integrated circuit can be realized, the long-term service reliability of the welding spots is improved, the equipment composition is simple, the control is convenient, the disassembly and the replacement and the later maintenance are very simple, and the efficiency-cost ratio is greatly improved.
Description
Technical Field
The invention relates to the technical field of integrated circuit processing, in particular to a method for welding micro-interconnection welding spots of an integrated circuit by electromagnetic pulse solid state welding.
Background
At present, integrated circuits play a vital role in the advanced scientific and technological fields of 5G communication, intelligent automobiles, internet of things and the like. The welding spot is the main interconnection structure of the integrated circuit, is responsible for electric signal transmission and provides mechanical support, and the long-term service reliability of the welding spot determines the service performance and the safety performance of electronic products and equipment. With the development of electronic devices toward miniaturization, lightness, thinness, high performance, and multiple functions, the solder joint diameter has changed by orders of magnitude, with the minimum diameter even smaller than 10 μm. The reduction of the diameter of the micro-interconnection welding spot leads to the sharp increase of the current density of the cross section, thus aggravating the electromigration of the welding spot in the working process and greatly improving the failure probability of electronic products and equipment.
The interconnection welding point of the integrated circuit generally adopts a soldering technology taking a tin-based material as a connecting material, and metal atoms in a liquid solder alloy and metal atoms in a solid welding disc generate IMC at a liquid-solid interface where the metal atoms are contacted so as to achieve metallurgical bonding. The solder joint failure mechanism has two main points. Firstly, IMC between a cathode bonding pad and brazing filler metal is decomposed and generates holes and cracks to cause open circuit; secondly, IMC grows in the anode in an aggregation way and generates brittle fracture, and the thicker the IMC layer is, the more easily the welding spot fractures due to stress concentration. The essence of the method is that the difference between the mobility rate and the mobility rate of all substances in the brazing filler metal and the bonding pad is large, so that the growth of IMC and the formation of cavities and cracks are caused. And a plurality of elements and IMC are inevitably introduced into the welding spots in the brazing process.
Currently, there are three main approaches to inhibiting electromigration. Adding alloy elements such as Ag, ce, ni and the like; optimizing a bump structure to avoid area current crowding, such as increasing the area of a lead and thickening a metal layer of a bonding pad; changing the kind of UBM or adding an anti-electromigration layer in the UBM layer. Although the method can improve atom migration to a certain extent and inhibit the growth of IMC and the formation of voids and cracks, the problem of long-term service reliability of the solder joint cannot be completely overcome, and therefore, the present invention is developed in view of the above problems.
Disclosure of Invention
The invention aims to solve the problems, designs a method for welding micro-interconnection welding spots of an integrated circuit by electromagnetic pulse solid state welding, and solves the problems of the prior art.
The technical scheme of the invention for realizing the aim is as follows: a method for welding micro-interconnection welding spots of an integrated circuit by electromagnetic pulse solid state welding comprises wire-to-wire double-coil welding, wire-to-wire single-coil welding and wire-to-plate welding;
the wire-to-double coil welding comprises the following steps: s1, preparing a base plate, S2, preparing welding materials, S3, installing an insulating gasket, S4, welding at a high speed, and S5, collecting, picking and blanking;
step S1: replacing a base plate of welding equipment with a base plate which is in accordance with welding materials according to welding requirements, wherein the base plate is provided with a coil in a matching manner;
step S2: preparing welding materials, stacking the welding materials on two sides of the equipment, selecting a pair of copper wires at a time, and inserting the copper wires from the two sides for standby;
and step S3: inserting an insulating film for welding from one side of the backing plate to isolate the welding material from the coil;
and step S4: electrifying the coil, and carrying out high-speed relative motion on the copper wires so as to enable the two copper wires to collide at high speed and then realize metallurgical bonding;
step S5: after welding, the welded materials are taken out from the through groove on one side through manual work to complete blanking.
The wire is welded to the single coil, and only one coil is used at the upper part of the joint of the pair of welded copper wires.
And an insulating gasket is arranged between the copper wire and the welding pad in the wire-to-plate welding mode.
The interval between a pair of the copper wires or the copper wires and the bonding pad is 0.5-2mm before.
And in the step S4, pulse heavy current is introduced into the coil, so that the coil generates a strong magnetic field.
The equipment for welding micro-interconnection welding spots of the integrated circuit by using the electromagnetic pulse solid state welding comprises a support, a top seat and two pairs of supporting rods, wherein the support is provided with two pairs of supporting rods for supporting the top seat, the support and the top seat are respectively and symmetrically provided with two pairs of bolts, and the support and the top seat are respectively provided with an upper base plate and a lower base plate;
the upper backing plate and the lower backing plate are respectively in threaded connection with the two pairs of bolts;
in the process of welding the double coils on line, a pair of transverse grooves are formed in an upper base plate and a lower base plate, the center lines of the transverse grooves penetrate through one end of the upper base plate or one end of the lower base plate, a pair of vertical grooves are formed in the transverse grooves, a pair of coils are embedded in the transverse grooves, and a pair of vertical grooves are used for inserting copper wires;
in the on-line single coil welding process, only the vertical grooves symmetrical to the upper base plate are formed in the used lower base plate;
in the online plate-to-plate welding process, a lower base plate is a flat plate and is not provided with a groove;
a pair of clamping grooves are formed in two sides of the transverse groove, and isolation gaskets are inserted into the clamping grooves;
the both sides of support are provided with a pair of reassembling type high-speed welding structure that delivers, the both ends of support are provided with a pair of air supply fast cooling structure respectively.
And the thickness of one side of the transverse groove, which is not provided with the vertical groove, is larger than that of one side provided with the vertical groove.
The demountable high-speed delivery welding structure comprises: the device comprises two pairs of slots, a fixing plate, a pair of sockets, a pair of height adjusting threaded rods, a lifting plate, a pushing cylinder, a pushing rod, a feeding groove and a pushing groove;
the novel multifunctional lifting device is characterized in that two pairs of slots are formed in two sides of the support, a pair of sockets are arranged on the bottom surface of the fixing plate and inserted into the slots, a pair of height adjusting threaded rods are arranged on the fixing plate, the lifting plate is mounted on the pair of height adjusting threaded rods, a pushing cylinder is arranged on one side of the lifting plate, a pushing rod is arranged at the telescopic end of the pushing cylinder, a feeding groove is formed in the lifting plate and is a groove with a micro gradient, and the end of the feeding groove is provided with a pushing groove which is aligned with the vertical groove.
The air supply rapid cooling structure comprises: the heat exchanger comprises a support, a pair of embedded grooves, a pair of heat exchange plates, a water inlet pipe, a water outlet pipe and a plurality of heat exchange fins;
the two ends of the support are respectively provided with a pair of embedded grooves, heat exchange plates are arranged in the embedded grooves, one side of each heat exchange plate is provided with a cooling fan, the two sides of each heat exchange plate are respectively provided with a water inlet pipe and a water outlet pipe, and a plurality of heat exchange sheets are arranged on the heat exchange plates.
The two pairs of supporting rods are two pairs of synchronously moving inserting sleeve type structural bodies with automatic telescopic functions.
The method for welding the micro-interconnection welding spots of the integrated circuit by utilizing the electromagnetic pulse solid state welding manufactured by the technical scheme of the invention provides three structures and methods for welding based on the strong electromagnetic pulse principle aiming at the welding of lines and surfaces respectively, not only can realize the reliable connection of the micro-welding spots of the integrated circuit and improve the long-term service reliability of the welding spots, but also has simple equipment composition, convenient control, very simple disassembly and replacement and later maintenance and greatly improves the efficiency-cost ratio.
Drawings
Fig. 1 is a schematic partial front view of a structure of a method for electromagnetic pulse solid-state welding of a micro-interconnection pad of an integrated circuit according to embodiment 1 of the present invention.
Fig. 2 is a schematic diagram of a partial top view structure of a method for solid-state soldering a micro-interconnect pad of an integrated circuit by electromagnetic pulses according to embodiment 1 of the present invention.
Fig. 3 is a schematic structural diagram of a front view of a method for electromagnetic pulse solid-state welding of micro-interconnection pads of an integrated circuit according to embodiment 2 of the present invention.
Fig. 4 is a schematic structural diagram of a front view of a method for electromagnetic pulse solid-state welding of a micro-interconnection pad of an integrated circuit according to embodiment 3 of the present invention.
FIG. 5 is a schematic structural diagram of a front view of an apparatus for electromagnetic pulse solid state welding of micro-interconnect pads of an integrated circuit according to the present invention.
FIG. 6 is a schematic diagram of a side view of a portion of an apparatus for solid state welding a micro-interconnect pad of an integrated circuit according to the present invention.
FIG. 7 is a schematic diagram of a partial top view of an apparatus for electromagnetic pulse solid state welding of a micro interconnect pad of an integrated circuit according to the present invention.
In the figure: 1. a support; 2. a top seat; 3. a strut; 4. a bolt; 5. an upper base plate; 6. a lower base plate; 7. a transverse groove; 8. a vertical slot; 9. a coil; 10. a card slot; 11. an isolation gasket; 12. a slot; 13. A fixing plate; 14. a socket; 15. a height adjustment threaded rod; 16. a lifting plate; 17. a push cylinder; 18. a push rod; 19. a feeding groove; 20. a push tank; 21. a cooling fan; 22. embedding a groove; 23. A heat exchange plate; 24. a water inlet pipe; 25. a water outlet pipe; 26. a heat exchange fin.
Detailed Description
The present invention will now be described in detail with reference to the accompanying drawings, as shown in FIGS. 1-7.
All the electrical components in the present application are connected with the power supply adapted to the electrical components through the wires, and an appropriate controller should be selected according to actual conditions to meet the control requirements, and specific connection and control sequences should be obtained.
According to the attached figures 1-4 of the specification, the method for welding the micro-interconnection welding points of the integrated circuit by the electromagnetic pulse solid state welding specifically comprises three implementation modes, namely wire-to-double-coil welding, wire-to-single-coil welding and wire-to-plate welding;
example 1: the wire-to-double coil welding comprises the following steps:
the method comprises the following steps: according to welding requirements, replacing a base plate of welding equipment with a base plate which meets welding materials, wherein the base plate is provided with two coils 9 in a matching manner, and the two coils 9 are respectively placed on an upper base plate and a lower base plate;
step two: preparing welding materials, stacking the welding materials on two sides of equipment, selecting a pair of copper wires at a time, inserting the copper wires from the two sides of the equipment in opposite directions for standby, wherein the relative interval between the two copper wires is 0.5-2mm in standby;
step three: an insulating film for welding is inserted from one side of the backing plate to isolate the welding material from the coil 9, so that the copper wire is prevented from being conductive with the coil 9;
step four: pulse large current is introduced into the coil 9, so that the coil 9 generates a strong magnetic field, and the copper wires move relatively at a high speed, so that the two copper wires collide at a high speed after being deformed, and then metallurgical bonding is realized;
step five: after welding, the welded materials are taken out from the through groove on one side through manual work to complete blanking.
Example 2: the wire-to-wire single coil welding is performed by using the lower pad 6 having only the vertical groove 8 without arranging a gasket on the lower pad 6 in step S1, and welding the upper portion of the junction of a pair of copper wires using one coil 9 in step S4.
Example 3: and an insulating gasket is arranged between the copper wire and the welding pad in a wire-to-plate welding mode.
Example 4: the scheme also discloses equipment for welding micro-interconnection welding spots of the integrated circuit by using the electromagnetic pulse solid state welding, which comprises a support 1, a top seat 2 and two pairs of support rods 3, wherein the support 1 is provided with the two pairs of support rods 3 for supporting the top seat 2, the support 1 and the top seat 2 are respectively and symmetrically provided with two pairs of bolts 4, the support 1 and the top seat 2 are respectively provided with an upper backing plate 5 and a lower backing plate 6, the two pairs of support rods 3 are two pairs of insert sleeve type structural bodies which synchronously move and have an automatic telescopic function, the interval between the top seat 2 and the support 1 can be adjusted by adjusting the heights of the support rods 3, and the upper backing plate 5 and the lower backing plate 6 are replaceable structures;
the upper backing plate 5 and the lower backing plate 6 are respectively in threaded connection with the two pairs of bolts 4, and the upper backing plate 5 and the lower backing plate 6 can be disassembled and replaced by rotating the bolts 4;
in the process of welding the double coils on line, a pair of transverse grooves 7 are formed in the upper backing plate 5 and the lower backing plate 6, the center lines of the transverse grooves 7 penetrate through one end of the upper backing plate 5 or one end of the lower backing plate 6 to form a pair of vertical grooves 8, a pair of coils 9 are embedded in the transverse grooves 7, and the vertical grooves 8 are used for inserting copper wires;
in the on-line single coil welding process, only the vertical groove 8 symmetrical to the upper backing plate 5 is arranged on the lower backing plate 6;
in the online plate-to-plate welding process, the lower backing plate 6 is a flat plate without a groove;
corresponding to the above-mentioned three embodiments respectively,
a pair of clamping grooves 10 are formed in two sides of the transverse groove 7, and isolation gaskets 11 are inserted into the clamping grooves 10 and used for isolating and fixing the separation welding materials and the coils 9;
a pair of dismounting type high-speed delivery welding structures are arranged on two sides of the support 1, and a pair of air supply quick cooling structures are respectively arranged at two ends of the support 1.
The both sides of transverse groove 7, wherein do not set up the thickness of one side of erecting groove 8 and be greater than the thickness of the one side of seting up erecting groove 8 for the tip of spacing copper line avoids the copper line motion of welding usefulness to cross the position.
According to the attached drawings 5-7 of the specification, the present application further provides a detachable high-speed delivery welding structure comprising: the device comprises two pairs of slots 12, a fixed plate 13, a pair of sockets 14, a pair of height adjusting threaded rods 15, a lifting plate 16, a pushing cylinder 17, a pushing rod 18, a feeding groove 19 and a pushing groove 20, wherein the connection relation and the position relation are as follows;
two pairs of slots 12 are arranged on two sides of the support 1, a pair of sockets 14 are arranged on the bottom surface of the fixed plate 13 and inserted into the slots 12, a pair of height adjusting threaded rods 15 are arranged on the fixed plate 13, the lifting plate 16 is arranged on the pair of height adjusting threaded rods 15, a pushing cylinder 17 is arranged on one side of the lifting plate 16, a pushing rod 18 is arranged on the telescopic end of the pushing cylinder 17, a feeding groove 19 is formed in the lifting plate 16, the feeding groove 19 is a groove with a micro gradient, and a pushing groove 20 is arranged at the end part of the feeding groove 19 and is aligned with the vertical groove 8;
in the implementation of details in-process, slot 12 and socket 14's matching, a position for spacing fixed plate 13, place the copper line of a section through chute feeder 19, because the miniature slope of gravity factor chute feeder 19, guaranteed that the material rolls to chute feeder 20 one side, push cylinder 17 control push rod 18 through lifter 16 one side stretches out and draws back, and then promote the copper line of least significant end and inserted in chute feeder 20, and then make the material insert the welded position from erecting groove 8, be provided with at the front end of chute feeder 20 and be used for spacing card, the copper line is not the complete motion in place under standby state, after start-up coil 9 produces powerful magnetic field, control push cylinder 17 pushes away push rod 18 fast and accomplishes last one section linear motion, copper line tip warp under the rapid motion state and keeps away from the coil and realize the collision of crossing with another copper line, make the welding of crossing of relative motion's copper line.
According to the attached figures 5-7 of the specification, the air supply rapid cooling structure is further arranged in the scheme: the heat exchanger comprises a support 1, a pair of embedded grooves 22, a pair of heat exchange plates 23, a water inlet pipe 24, a water outlet pipe 25 and a plurality of heat exchange fins 26, wherein the connection relation and the position relation are as follows;
the two ends of the support 1 are respectively provided with a pair of embedded grooves 22, heat exchange plates 23 are arranged in the embedded grooves 22, one side of each heat exchange plate 23 is provided with a cooling fan 21, the two sides of each heat exchange plate 23 are respectively provided with a water inlet pipe 24 and a water outlet pipe 25, and the heat exchange plates 23 are provided with a plurality of heat exchange sheets 26.
In the specific implementation process, through a pair of fixed cooling blower 21 of inlaying the dress groove 22, the air supply that cooling blower 21 produced cools off under the effect of a plurality of heat exchanger fins 26 heat transfer rapidly behind heat transfer plate 23, makes cold air blow in coil department from horizontal groove 7, realizes the quick cooling to the coil, avoids the coil because of letting in the electric current big, influences self performance, improves welding efficiency.
In summary, the method for welding the micro-interconnection welding spots of the integrated circuit by the electromagnetic pulse solid state welding has the advantages that three structures and methods for welding based on the strong electromagnetic pulse principle are provided for welding the lines and the surfaces respectively, the reliable connection of the micro-welding spots of the integrated circuit can be realized, the long-term service reliability of the welding spots is improved, the equipment composition is simple, the control is convenient, the disassembly and the replacement and the later maintenance are very simple, and the efficiency-cost ratio is greatly improved.
The technical solutions described above only represent the preferred technical solutions of the present invention, and some possible modifications made to some parts by those skilled in the art all represent the principles of the present invention, and fall within the protection scope of the present invention.
Claims (8)
1. A method for welding micro-interconnection welding spots of an integrated circuit by electromagnetic pulse solid state welding is characterized by comprising line-to-line double-coil welding, line-to-line single-coil welding and line-to-plate welding; the equipment used by the method comprises a support, a top seat and two pairs of supporting rods, wherein the support is provided with two pairs of supporting rods for supporting the top seat, the support and the top seat are respectively symmetrically provided with two pairs of bolts, and the support and the top seat are respectively provided with an upper base plate and a lower base plate; the upper backing plate and the lower backing plate are respectively in threaded connection with the two pairs of bolts; a transverse groove is formed in the base plate, and a vertical groove is formed in the middle line of the transverse groove and penetrates through one end of the base plate; coils are embedded in the transverse grooves, and the vertical grooves are used for inserting copper wires; the thickness of one side of the transverse groove, which is not provided with the vertical groove, is larger than that of one side provided with the vertical groove; a pair of detachable high-speed delivery welding structures is arranged on two sides of the support, and a pair of air supply quick cooling structures is respectively arranged on two ends of the support;
wherein, in the process of welding the double coils, the upper backing plate and the lower backing plate are both provided with a pair of transverse grooves;
in the on-line welding of the single coil, only the upper backing plate is provided with the transverse grooves and the vertical grooves which are connected with the transverse grooves, the lower backing plate is provided with the vertical grooves which are symmetrical with the upper backing plate,
in the online plate-to-plate welding process, only the upper backing plate is provided with the transverse groove and the connected vertical groove, and the lower backing plate is a flat plate and is not provided with the groove;
the welding comprises the following steps: s1, preparing a base plate, S2, preparing welding materials, S3, installing an insulating gasket, S4, welding at a high speed, and S5, collecting, picking and blanking;
step S1: replacing a base plate of welding equipment by a base plate which is in accordance with welding materials according to welding requirements, wherein coils are arranged on transverse grooves of the base plate in a matching manner;
step S2: preparing a welding material;
and step S3: inserting an insulating gasket for welding from one side of the backing plate to isolate the welding material from the coil;
and step S4: electrifying the coil, inserting a copper wire from the vertical groove, and enabling the copper wire to move at a high speed to complete welding;
step S5: after welding is finished, the welded materials are taken out from the through groove on one side manually to finish blanking;
wherein, in the process of welding the double coils on line, the step S2: preparing welding materials, stacking the welding materials on two sides of the equipment, selecting a pair of copper wires at a time, and inserting the copper wires from the two sides for standby; and step S4: and electrifying the coil, and enabling the copper wires to move relatively at a high speed, so that the two copper wires collide at a high speed and then metallurgical bonding is realized.
2. An electromagnetic pulse solid state welding integrated circuit micro-interconnect pad method as in claim 1 wherein said wire to wire single coil weld uses only one coil in the upper pad cross slot where a pair of copper wire bonds are welded.
3. An electromagnetic pulse solid state welding integrated circuit micro-interconnect weld of claim 1, wherein the wire-to-board weld is provided with insulating spacers between the copper wires and the weld plate.
4. An electromagnetic pulse solid state welding integrated circuit micro interconnect pad method as claimed in claim 1 wherein the spacing between a pair of said copper lines or copper lines and the bonding pad is between 0.5-2 mm.
5. The method of claim 1, wherein in step S4, a pulsed high current is applied to the coil to generate a strong magnetic field.
6. The method of claim 1, wherein the demountable high speed delivery solder structure comprises: the device comprises two pairs of slots, a fixing plate, a pair of sockets, a pair of height adjusting threaded rods, a lifting plate, a pushing cylinder, a pushing rod, a feeding groove and a pushing groove; the improved multifunctional lifting device is characterized in that two pairs of slots are formed in two sides of the support, a pair of sockets are arranged on the bottom surface of the fixing plate and inserted into the slots, a pair of height adjusting threaded rods are arranged on the fixing plate, the lifting plate is installed on the pair of height adjusting threaded rods, a pushing cylinder is arranged on one side of the lifting plate, a pushing rod is arranged at the telescopic end of the pushing cylinder, a feeding groove is formed in the lifting plate and is a groove with a micro slope, and the end part of the feeding groove is provided with a pushing groove which is aligned with the vertical groove.
7. The method of claim 1, wherein the air blast rapid cooling structure: the heat exchanger comprises a support, a pair of embedded grooves, a pair of heat exchange plates, a water inlet pipe, a water outlet pipe and a plurality of heat exchange sheets; the two ends of the support are respectively provided with a pair of embedded grooves, heat exchange plates are arranged in the embedded grooves, one side of each heat exchange plate is provided with a cooling fan, the two sides of each heat exchange plate are respectively provided with a water inlet pipe and a water outlet pipe, and a plurality of heat exchange sheets are arranged on the heat exchange plates.
8. The method of claim 1, wherein said two pairs of said struts are two pairs of synchronously moving plug-in structures with automatic telescoping function.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210223891.1A CN114589425B (en) | 2022-03-09 | 2022-03-09 | Method for welding micro-interconnection welding spots of integrated circuit by electromagnetic pulse solid state welding |
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| CN202210223891.1A CN114589425B (en) | 2022-03-09 | 2022-03-09 | Method for welding micro-interconnection welding spots of integrated circuit by electromagnetic pulse solid state welding |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5981921A (en) * | 1997-06-20 | 1999-11-09 | Dana Corporation | Method of magnetic pulse welding an end fitting to a driveshaft tube of a vehicular driveshaft |
| DE102011010216A1 (en) * | 2011-02-03 | 2012-08-09 | Pst Products Gmbh | Pulse welder for metal welding |
| CN105014224B (en) * | 2015-08-14 | 2017-03-22 | 哈尔滨工业大学 | High-speed deformation connecting method and device for dissimilar metal sheets |
| CN105965184B (en) * | 2016-07-21 | 2018-08-24 | 内蒙古科技大学 | A kind of electromagnet pulse welding collection chinaware |
| CN206702406U (en) * | 2017-05-17 | 2017-12-05 | 重庆市光学机械研究所 | Homogeneity or different metal materials electromagnetic pulse overlap joint welder |
| CN109396768A (en) * | 2018-12-10 | 2019-03-01 | 北京工业大学 | Apply the method that transient pulse electric field prepares miniature polycrystalline solder joint |
| CN109807449B (en) * | 2019-01-18 | 2021-08-03 | 重庆科技学院 | Combined magnetic collector for electromagnetic pulse welding |
| CN109807426B (en) * | 2019-02-27 | 2021-04-09 | 重庆科技学院 | Electromagnetic pulse welding system special for PCB welding |
| CN113275732B (en) * | 2021-05-26 | 2022-04-26 | 中南大学 | Electromagnetic welding device for composite plate parts and forming method thereof |
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