CN114584209B - Optical module - Google Patents

Abstract

The application provides an optical module, which comprises a circuit board, an MCU (micro controller unit) arranged on the circuit board, a laser driving chip electrically connected with the MCU and a laser chip electrically connected with the laser driving chip, wherein the MCU comprises a temperature sensor and a first register, the temperature sensor is used for acquiring temperature parameters, the first register stores emission pre-emphasis setting values, and the MCU reads corresponding emission pre-emphasis setting values from the first register according to the temperature parameters; the laser driving chip comprises a transmitting pre-emphasis regulator, a receiving device and a control device, wherein the transmitting pre-emphasis regulator is used for receiving a transmitting pre-emphasis setting value and regulating the intensity of the output modulation current according to the transmitting pre-emphasis setting value; the laser chip is used for emitting optical signals with corresponding intensity according to the adjusted modulation current. According to the application, different emission pre-emphasis setting values are set at different temperatures, and the intensity of the emission signal is adjusted according to the emission pre-emphasis setting values, so that the emission signal is optimally matched with a signal line in the module, and the emission performance of the optical module is ensured to be in an optimal state.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the development and progress of optical communication technology become more and more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of optical signals, is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously improved along with the development of the optical communication technology.

For high-speed optical modules, a Pre-emphasis (Pre-emphasis, EM) regulator and a Equalizer (CTLE) regulator are generally integrated in a transceiver driving chip, and the strength of input and output signals is controlled by adjusting the EM and CTLE, so that the signal lines in the single board and the module of the device are optimally matched, and the performance (an eye pattern of emitted light, receiving sensitivity, signal transmission and the like) of the optical module is ensured to be in an optimal state. In order to protect the performance and working state of the optical module, the pre-emphasis TXEM of the transmitting end and the debugging interface of the balanced CTLE of the receiving end are not opened to the outside, and are debugged inside the optical module, namely, the determined value is cured when the optical module leaves the factory, and the whole life cycle of the module is not changed.

However, as the speed of the optical module is continuously increased, the transmission distance is continuously increased, and the optical module scheme is diversified, experiments find that if the transmission pre-emphasis TXEM and the receiving CTLE of the optical module are set to a fixed value, the problem that the transmission performance or the receiving performance of the module is poor or even can not meet the index requirement in a certain temperature area, or the problem that the performance of the module is degraded and the index requirement is not met when the module transmits the service through a certain length of optical fiber occurs.

Disclosure of Invention

The embodiment of the application provides an optical module, which aims to solve the problem that the optical module has poor emission performance or receiving performance in a certain temperature area because the emission pre-emphasis TXEM and the receiving CTLE of the optical module are fixed values.

In a first aspect, the present application provides an optical module comprising:

A circuit board;

The MCU is arranged on the circuit board and comprises a temperature sensor and a first register, wherein the temperature sensor is used for acquiring temperature parameters, and the first register stores a transmitting pre-emphasis setting value; the device is used for reading a corresponding transmitting pre-emphasis setting value from the first register according to the temperature parameter;

The laser driving chip is arranged on the circuit board and is electrically connected with the MCU, and comprises a transmitting pre-emphasis regulator which is used for receiving the transmitting pre-emphasis setting value and regulating the output modulation current intensity according to the transmitting pre-emphasis setting value;

and the laser chip is electrically connected with the laser driving chip and is used for transmitting optical signals with corresponding intensity according to the regulated modulation current.

In a second aspect, the present application provides an optical module comprising:

A circuit board;

The MCU is arranged on the circuit board and comprises a temperature sensor and a second register, wherein the temperature sensor is used for acquiring temperature parameters, and the second register is stored with a receiving balance setting value; the receiving equalization setting value is used for reading the corresponding receiving equalization setting value from the second register according to the temperature parameter;

the receiving chip is arranged on the circuit board and is used for converting the received optical signals into electric signals;

The receiving driving chip is arranged on the circuit board and is electrically connected with the MCU and the receiving chip, and the receiving driving chip comprises a receiving equalization regulator which is used for receiving the receiving equalization setting value and adjusting the high-frequency intensity of the converted electric signal according to the receiving equalization setting value.

In a third aspect, the present application provides an optical module comprising:

A circuit board;

the MCU is arranged on the circuit board and comprises a temperature sensor, a first register and a second register, wherein the temperature sensor is used for acquiring temperature parameters, the first register stores a transmitting pre-emphasis setting value, and the second register stores a receiving balance setting value; the device is used for reading a corresponding transmitting pre-emphasis setting value from the first register according to the temperature parameter, and reading a corresponding receiving equalization setting value from the second register according to the temperature parameter;

The receiving and transmitting driving chip is arranged on the circuit board and is electrically connected with the MCU, and comprises a transmitting pre-emphasis regulator and a receiving balance regulator, wherein the transmitting pre-emphasis regulator is used for receiving the transmitting pre-emphasis setting value and adjusting the output modulation current intensity according to the transmitting pre-emphasis setting value; the receiving equalization regulator is used for receiving the receiving equalization setting value and adjusting the high-frequency intensity of the converted electric signal according to the receiving equalization setting value;

The laser chip is electrically connected with the receiving and transmitting driving chip and is used for transmitting optical signals with corresponding intensity according to the adjusted modulation current;

And the receiving chip is electrically connected with the receiving and transmitting driving chip and is used for converting the received optical signals into electric signals.

As can be seen from the foregoing embodiments, the present application provides an optical module, where the optical module includes a circuit board, an MCU, a laser driving chip and a laser chip, the MCU is disposed on the circuit board, the MCU includes a temperature sensor and a first register, the temperature sensor is used to obtain a temperature parameter, the first register stores an emission pre-emphasis setting value, i.e. a register area is provided inside the MCU to store the emission pre-emphasis setting value corresponding to the temperature, and the MCU is used to read the corresponding emission pre-emphasis setting value from the first register according to the temperature parameter, so as to obtain the corresponding emission pre-emphasis setting value at different temperatures; the laser driving chip is arranged on the circuit board and is electrically connected with the MCU, and comprises an emission pre-emphasis regulator, wherein the emission pre-emphasis regulator is used for receiving an emission pre-emphasis set value at a corresponding temperature, adjusting the intensity of an output modulation current according to the emission pre-emphasis set value, namely writing the emission pre-emphasis set value corresponding to the temperature into the emission pre-emphasis regulator, and outputting the modulation current with the corresponding intensity according to the emission pre-emphasis set value by the emission pre-emphasis regulator; the laser chip is electrically connected with the laser driving chip and is used for transmitting optical signals with corresponding intensity according to the regulated modulation current, so that the transmitted signals form optimal matching with the circuit board and signal lines in the optical module at corresponding temperature, the transmitting performance (transmitted light eye pattern, signal transmission and the like) of the optical module is ensured to be in an optimal state, and the optical module can normally and stably work in a full-temperature area.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

Fig. 1 is a connection diagram of an optical communication system according to some embodiments;

Fig. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of an optical module according to some embodiments;

Fig. 4 is an exploded view of a light module according to some embodiments;

fig. 5 is a diagram illustrating adjustment of a transmit-receive signal of an optical module according to some embodiments;

Fig. 6 is a schematic diagram of a partial structure of a circuit board in an optical module according to an embodiment of the present application;

Fig. 7 is a partial block diagram of an optical module according to an embodiment of the present application;

fig. 8 is a schematic diagram of a partial structure of a circuit board in an optical module according to an embodiment of the present application;

fig. 9 is a partial block diagram of a second optical module according to an embodiment of the present application;

fig. 10 is a schematic diagram of a partial structure of a circuit board in an optical module according to an embodiment of the present application;

fig. 11 is a partial block diagram of an optical module according to an embodiment of the present application.

Detailed Description

The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

Throughout the specification and claims, unless the context requires otherwise, the word "comprise" and its other forms such as the third person referring to the singular form "comprise" and the present word "comprising" are to be construed as open, inclusive meaning, i.e. as "comprising, but not limited to. In the description of the specification, the terms "one embodiment", "some embodiments (some embodiments)", "exemplary embodiment (exemplary embodiments)", "example (example)", "specific example (some examples)", etc. are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more.

In describing some embodiments, expressions of "coupled" and "connected" and their derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, the term "coupled" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled (communicatively coupled)" may also mean that two or more elements are not in direct contact with each other, but yet still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the disclosure herein.

At least one of "A, B and C" has the same meaning as at least one of "A, B or C" and includes the following combinations of A, B and C: a alone, B alone, C alone, a combination of a and B, a combination of a and C, a combination of B and C, and a combination of A, B and C.

"A and/or B" includes the following three combinations: only a, only B, and combinations of a and B.

The use of "adapted" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

As used herein, "about," "approximately" or "approximately" includes the stated values as well as average values within an acceptable deviation range of the particular values as determined by one of ordinary skill in the art in view of the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system).

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to an information processing device such as a computer through an information transmission device such as an optical fiber or an optical waveguide, so as to complete the transmission of the information. Since the optical signal has a passive transmission characteristic when transmitted through an optical fiber or an optical waveguide, low-cost and low-loss information transmission can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform mutual conversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electric signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electric port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical port, realizes electric connection with an optical network terminal (for example, optical cat) through the electric port, and is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to information processing equipment such as a computer through a network cable or wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6-8 kilometers), on the basis of which, if a repeater is used, it is theoretically possible to realize ultra-long-distance transmission. Thus, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may typically reach several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following: routers, switches, computers, cell phones, tablet computers, televisions, etc.

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by an optical fiber 101 and a network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101 such that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100 such that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. The optical module 200 performs mutual conversion between optical signals and electrical signals, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. A connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. By way of example, since the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103 and transmits a signal from the network cable 103 to the optical module 200, the optical network terminal 100 can monitor the operation of the optical module 200 as a host computer of the optical module 200. The upper computer of the Optical module 200 may include an Optical line terminal (Optical LINE TERMINAL, OLT) or the like in addition to the Optical network terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.

Fig. 2 is a block diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of the optical network terminal 100 related to the optical module 200 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a convex portion such as a fin that increases the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the optical network terminal 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with an electrical connector inside the cage 106, so that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bi-directional electrical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of an optical module according to some embodiments, and fig. 4 is an exploded view of an optical module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver;

the housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being capped on the lower housing 202 to form the above-described housing having two openings 204 and 205; the outer contour of the housing generally presents a square shape.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate and two lower side plates disposed at both sides of the bottom plate and perpendicular to the bottom plate; the upper case 201 includes a cover plate, and two upper side plates disposed at two sides of the cover plate and perpendicular to the cover plate, and two side walls are combined with the two side plates to realize that the upper case 201 is covered on the lower case 202.

The direction of the connection line of the two openings 204 and 205 may be identical to the length direction of the optical module 200 or not identical to the length direction of the optical module 200. Illustratively, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Or opening 204 is located at the end of light module 200 and opening 205 is located at the side of light module 200. The opening 204 is an electrical port, and the golden finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to be connected to the external optical fiber 101, so that the optical fiber 101 is connected to an optical transceiver device inside the optical module 200.

By adopting the assembly mode of combining the upper shell 201 and the lower shell 202, devices such as the circuit board 300, the optical transceiver and the like are conveniently installed in the shell, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In addition, when devices such as the circuit board 300 are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component of the devices are conveniently arranged, and the automatic implementation and production are facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking member 203 located on an outer wall of the housing, and the unlocking member 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or release the fixed connection between the optical module 200 and the host computer.

Illustratively, the unlocking member 203 is located on the outer walls of the two lower side plates of the lower housing 202, and includes a snap-in member that mates with the cage of the host computer (e.g., cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the clamping component of the unlocking component 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, so as to change the connection relationship between the engaging member and the host computer, so as to release the engagement relationship between the optical module 200 and the host computer, and thus the optical module 200 can be pulled out from the cage of the host computer.

The circuit board 300 includes circuit traces, electronic components and chips, which are connected together by the circuit traces according to a circuit design to realize functions such as power supply, electrical signal transmission, and grounding. The electronic components may include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips may include, for example, a micro control unit (Microcontroller Unit, MCU), a transimpedance amplifier (TRANSIMPEDANCE AMPLIFIER, TIA), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear chips; the hard circuit board can also be inserted into an electrical connector in the upper computer cage.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and is conductively connected to the electrical connectors within the cage 106 by the gold fingers. The golden finger can be arranged on the surface of one side of the circuit board 300 (for example, the upper surface shown in fig. 4) or on the surfaces of the upper side and the lower side of the circuit board 300, so as to adapt to the occasion with large pin number requirements. The golden finger is configured to establish electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board.

The optical transceiver device includes an optical transmitting assembly 400 and an optical receiving assembly 500, which are respectively used for realizing the transmission of the optical signal and the reception of the optical signal. The light emitting assembly 400 generally includes a light emitter, a lens and a light detector, wherein the lens and the light detector are respectively located at different sides of the light emitter, the front side and the back side of the light emitter respectively emit light beams, and the lens is used for converging the light beams emitted by the front side of the light emitter, so that the light beams emitted by the light emitter are converged light, and are conveniently coupled to an external optical fiber. In order to drive the light emitter in the light emitting assembly 400 to generate a laser beam, the circuit board 300 is provided with an emitting driving chip, the emitting driving chip can be electrically connected with the light emitter through wire bonding, so that the golden finger transmits an electric signal transmitted by the upper computer to the emitting driving chip, the emitting driving chip transmits power supply parameters to the light emitter, and the light emitter generates a laser signal according to the power supply parameters.

The light receiving assembly 500 generally includes a receiving chip and a transimpedance amplifier, the receiving chip is configured to convert a received external light signal into an electrical signal, the electrical signal is amplified by the transimpedance amplifier and then transmitted to the gold finger on the circuit board 300, and the electrical signal is transmitted to the host computer via the gold finger. In order to adjust the electric signal transmitted to the upper computer, the circuit board 300 is provided with a receiving driving chip, and the receiving driving chip is electrically connected with the receiving chip or the transimpedance amplifier, so that the electric signal output by the receiving chip is transmitted to the receiving driving chip, the electric signal is adjusted by the receiving driving chip, and the adjusted electric signal is transmitted to the upper computer.

Fig. 5 is a diagram illustrating adjustment of a transmit/receive signal of an optical module according to some embodiments. As shown in fig. 5, the optical module with the rate of 10G and above generally integrates pre-Emphasis (EM) and equalization (CTLE) regulators inside the driving chip on the circuit board 300, and controls the intensities of the input and output signals by adjusting EM and CTLE to form an optimal match with the circuit board and the signal lines inside the optical module, so as to ensure that the performance (eye pattern of emitted light, receiving sensitivity, signal transmission, etc.) of the optical module is in an optimal state.

Taking a 25G optical module as an example, at a transmitting end, a transmitting electric signal on the circuit board 300 firstly enters a transmitting equalization regulator of a transmitting driving chip, then enters a clock shaping (CDR), then enters a transmitting pre-emphasis (0 TXEM) regulator, and finally enters a laser to be converted into an optical signal to be output; at the receiving end, the received optical signal is converted into an electrical signal by the photodetector PD, and the electrical signal enters a receiving equalization (CTLE) regulator of the receiving driving chip, then enters a clock shaping (CDR), then enters a receiving pre-emphasis (RXEM) regulator, and finally is output to the circuit board 300.

The CTLE of the transmitting end and the pre-emphasis RXEM of the receiving end are matched with the equipment single board, and are opened, and the equipment end is usually debugged to a uniform fixed value when being on line. In order to protect the performance and working state of the optical module, the transmitted pre-emphasis TXEM and the debugging interface of the CTLE at the receiving end are not opened to the outside, and are debugged inside the optical module, namely, the determined value is cured when the optical module leaves the factory, and the whole life cycle of the module is not changed. Usually, the transmit pre-emphasis TXEM and the receive CTLE in the optical module are also tuned to a value that can make the transceiver performance of the optical module be in an optimal state, which is usually shown as the optimal transmit optical eye pattern and receive sensitivity of the optical module. This value is a fixed value, i.e., at all temperature ranges (industrial grade-40 deg.c to 85 deg.c), the transmit pre-emphasis TXEM is a fixed value, and the receive CTLE is a fixed value.

However, experiments find that if the transmitting pre-emphasis TXEM and the receiving CTLE of the optical module are set to a fixed value, the optical module has poor transmitting performance or receiving performance in a certain temperature region (usually a high temperature region or a low temperature region), even can not meet the index requirement, or the optical module can meet the index requirement, but the optical module has poor performance and does not meet the index requirement when transmitting the service through a certain length of optical fiber.

Through experiments and theoretical analysis, the loss and impedance matching of the whole signal link in the optical module change under severe temperature conditions such as high temperature or low temperature, and especially for the optical module with high speed and long transmission distance, the loss and the impedance matching change caused by temperature change finally cause the overall performance degradation of the module.

In order to solve the above-mentioned problems, the embodiments of the present application provide an optical module, which controls the intensities of input and output signals by adjusting the pre-emphasis EM and the equalization CTLE, so as to form an optimal match with signal lines inside the device single board and the module, and ensure that the performance (the eye pattern of emitted light, the sensitivity of received light, and signal transmission, etc.) of the optical module is in an optimal state.

Fig. 6 is a schematic diagram of a local structure of a circuit board in an optical module according to an embodiment of the present application, and fig. 7 is a schematic diagram of a local structure of an optical module according to an embodiment of the present application. As shown in fig. 6 and 7, the MCU320 on the circuit board 300 includes a temperature sensor and a first register, the temperature sensor is used for acquiring a temperature parameter, and the first register stores a transmit pre-emphasis setting value, where the transmit pre-emphasis setting value is set corresponding to the temperature parameter. In the working process of the optical module, the MCU320 reads the emission pre-emphasis setting value corresponding to the temperature parameter from the first register according to the temperature parameter acquired by the temperature sensor in real time.

The laser driving chip 330 is disposed on the circuit board 300 and electrically connected to the MCU320, and includes an emission pre-emphasis regulator, where after the MCU320 obtains an emission pre-emphasis setting value corresponding to a temperature parameter, the emission pre-emphasis setting value is transmitted to the emission pre-emphasis regulator, and the emission pre-emphasis regulator adjusts the intensity of the output modulation current according to the emission pre-emphasis setting value, so as to adjust the intensity of the high frequency component of the current signal input to the laser chip 340.

The laser chip 340 is electrically connected with the laser driving chip 330, and the laser chip 340 emits an optical signal of a corresponding intensity according to the adjusted modulation current to change the intensity of the emitted optical signal.

In this way, the upper computer transmits an electric signal to the golden finger 310 on the circuit board 300, the golden finger 310 is electrically connected with the MCU320 through a signal line, the MCU320 reads the emission pre-emphasis setting value at the corresponding temperature from the first register according to the working temperature acquired by the temperature sensor, and writes the emission pre-emphasis setting value into the emission pre-emphasis regulator of the laser driving chip 330 to enable the emission pre-emphasis setting value to be effective, so that different emission pre-emphasis setting values are called at different temperatures, and finally normal and stable operation of the optical module in a full-temperature area is realized.

In some embodiments, the transmission pre-emphasis setting value stored in the first register in the MCU320 may be set in one-to-one correspondence with the temperature parameter acquired by the temperature sensor, so as to read different transmission pre-emphasis setting values at different temperatures, thereby implementing three-temperature compensation of the transmitted optical signal.

In some embodiments, the transmission pre-emphasis setting value stored in the first register in the MCU320 may also be set corresponding to the range of the temperature parameter acquired by the temperature sensor, that is, the temperature in the preset range corresponds to one transmission pre-emphasis setting value, which is listed as an example in the following table:

In the optical module provided by the embodiment of the application, the first register is provided in the MCU to store the emission pre-emphasis setting value corresponding to the temperature, in the working process of the optical module, according to the working temperature acquired by the temperature sensor in the MCU, the MCU reads the corresponding emission pre-emphasis setting value from the first register according to the acquired working temperature and writes the emission pre-emphasis setting value into the emission pre-emphasis regulator of the laser driving chip, the emission pre-emphasis regulator adjusts the output modulation current intensity according to the emission pre-emphasis setting value, and the laser chip emits the optical signal with the corresponding intensity according to the adjusted modulation current, so that the emission signal is optimally matched with the circuit board and the signal circuit in the optical module, the emission performance (emission light eye pattern, signal transmission and the like) of the optical module is ensured to be in an optimal state, and the three-temperature compensation function of the emission optical signal is realized, thereby realizing the normal and stable operation of the optical module in the full-temperature area.

Likewise, not only can different emission pre-emphasis setting values be set at different temperatures to enable the emission optical signal to form optimal matching with the signal line inside the optical module, but also different receiving equalization setting values can be set at different temperatures to enable the electric signal after the conversion of the receiving optical signal to form optimal matching with the signal line inside the optical module.

Fig. 8 is a schematic diagram of a partial structure of a circuit board in an optical module according to an embodiment of the present application, and fig. 9 is a block diagram of a partial structure of an optical module according to an embodiment of the present application. As shown in fig. 8 and 9, the MCU320 on the circuit board 300 includes a temperature sensor for acquiring a temperature parameter and a second register storing a receiving equalization setting value, which is set corresponding to the temperature parameter. In the working process of the optical module, the MCU reads a receiving balance set value corresponding to the temperature parameter from the second register according to the temperature parameter acquired by the temperature sensor in real time.

The receiving chip (PD) 360 is disposed on the circuit board 300, and is used for converting the received optical signal into an electrical signal, that is, the external optical signal is transmitted to the receiving chip 360, the optical signal is converted into an electrical signal through the receiving chip 360, the electrical signal is transmitted to the receiving driving chip 350 on the circuit board 300, and the electrical signal is adjusted through the receiving driving chip 350.

The receiving driving chip 350 is disposed on the circuit board 300 and electrically connected to the MCU320 and the receiving chip 360, and includes a receiving equalization regulator, where after the MCU320 obtains a receiving equalization setting value corresponding to a temperature parameter, the receiving equalization setting value is sent to the receiving equalization regulator, and the receiving equalization regulator adjusts the intensity of the high frequency component of the converted electrical signal according to the receiving equalization setting value, so that the intensity of the high frequency component and the low frequency component of the electrical signal are at an equalized level, so as to directly perform gain on the high frequency component of the electrical signal through an internal circuit.

In this way, the receiving chip 360 converts the received optical signal into an electrical signal, the electrical signal is transmitted to the receiving driving chip 350, the mcu320 reads the receiving equalization setting value at the corresponding temperature from the second register according to the working temperature acquired by the temperature sensor, and writes the receiving equalization setting value into the receiving equalization regulator of the receiving driving chip 350 to take effect, the receiving driving chip 350 after taking effect performs high-frequency intensity adjustment on the converted electrical signal, the adjusted electrical signal is transmitted to the golden finger 310 via the signal line, and the electrical signal is transmitted to the upper computer via the golden finger 310.

In some embodiments, the optical module provided by the embodiment of the present application further includes a transimpedance amplifier, where the transimpedance amplifier is disposed on the circuit board 300 and electrically connected to the receiving chip 360 and the receiving driving chip 350, the receiving chip 360 converts the received optical signal into an electrical signal, the electrical signal is transmitted to the transimpedance amplifier, the transimpedance amplifier amplifies the electrical signal, the amplified electrical signal is transmitted to the receiving driving chip 350, the receiving equalization regulator in the receiving driving chip 350 receives a receiving equalization setting value from the MCU320, and adjusts the high-frequency intensity of the amplified electrical signal according to the receiving equalization setting value.

In some embodiments, the receiving equalization setting values stored in the second register in the MCU320 may be set in one-to-one correspondence with the temperature parameters acquired by the temperature sensor, so as to read different receiving equalization setting values at different temperatures, thereby implementing three-temperature compensation of the received optical signal.

In some embodiments, the receiving equalization setting value stored in the second register in the MCU320 may also be set corresponding to the range of the temperature parameter acquired by the temperature sensor, that is, the temperature in the preset range corresponds to one receiving equalization setting value, which is listed as an example in the following table:

Temperature/. Degree.C	Receiving equalization settings
		-40	α
-39	α
		-38	β
-37	β
		-36	β
-35	γ
		-34	γ
-33	γ
		-32	γ
-31	γ
		-30	δ
-29	δ
		.	.
.	.
		.	.
80	σ
		81	σ
82	σ
		83	τ
84	τ
		85	τ

In the optical module provided by the embodiment of the application, the second register is provided in the MCU to store the receiving balance set value corresponding to the temperature, in the working process of the optical module, according to the working temperature acquired by the temperature sensor in the MCU, the MCU reads the corresponding receiving balance set value from the second register according to the acquired working temperature, and writes the receiving balance set value into the receiving balance regulator of the receiving driving chip to make the receiving balance set value effective; the receiving chip converts an external optical signal into an electric signal, the electric signal is transmitted to the receiving driving chip, and the receiving driving chip adjusts the intensity of the converted electric signal according to the effective receiving equalization regulator, so that the received electric signal is optimally matched with the circuit board and the signal lines inside the optical module, the receiving performance (receiving sensitivity, signal transmission and the like) of the optical module is ensured to be in an optimal state, the three-temperature compensation function of the received optical signal is realized, and the normal and stable operation of the optical module in a full-temperature area is realized.

Setting different transmit pre-emphasis setting values or receive equalization setting values at different temperatures is not limited to application to individual optical transmit or receive components, but may also be applied to optical transmit-receive components to ensure that the transmit-receive performance of the optical module is in an optimal state.

Fig. 10 is a schematic diagram of a local structure of a circuit board in an optical module according to an embodiment of the present application, and fig. 11 is a block diagram of a local structure of an optical module according to an embodiment of the present application. As shown in fig. 10 and 11, the MCU320 on the circuit board 300 includes a temperature sensor, a first register and a second register, the temperature sensor is used for acquiring a temperature parameter, the first register stores a transmit pre-emphasis setting value, and the second register stores a receive equalization setting value, where the transmit pre-emphasis setting value, the receive equalization setting value and the temperature parameter are set correspondingly. In the working process of the optical module, the MCU320 reads the transmitting pre-emphasis setting value corresponding to the temperature parameter from the first register and the receiving balance setting value corresponding to the temperature parameter from the second register according to the temperature parameter acquired by the temperature sensor in real time.

The transceiver driving chip 370 is disposed on the circuit board 300 and electrically connected to the MCU320, and includes a transmitting pre-emphasis regulator and a receiving equalization regulator, where the transmitting pre-emphasis regulator is configured to receive a transmitting pre-emphasis setting value from the MCU320, and adjust an output modulation current intensity according to the transmitting pre-emphasis setting value; the receiving equalization adjuster is configured to receive a receiving equalization setting value from the MCU320, and adjust the high-frequency intensity of the converted electrical signal according to the receiving equalization setting value.

The laser chip 340 is electrically connected to the transceiver driving chip 370, and is configured to emit an optical signal with a corresponding intensity according to the adjusted modulation current.

The receiving chip 360 is electrically connected to the transmitting/receiving driving chip 370, and converts the received optical signal into an electrical signal.

In this way, the upper computer transmits an electric signal to the golden finger 310 on the circuit board 300, the golden finger 310 is electrically connected with the MCU320 through a signal line, the MCU320 reads an emission pre-emphasis setting value at a corresponding temperature from the first register according to the working temperature acquired by the temperature sensor, the emission pre-emphasis setting value is written into an emission pre-emphasis regulator of the transceiver driving chip 370 to be effective, the effective transceiver driving chip 370 outputs an adjusted adjusting current to the laser chip 340, and the laser chip 340 emits an optical signal with a corresponding intensity according to the adjusted adjusting current; the receiving chip 360 converts the received optical signal into an electrical signal, the electrical signal is transmitted to the transceiver driving chip 370, the mcu320 reads a receiving equalization setting value at a corresponding temperature from the second register according to the working temperature acquired by the temperature sensor, and writes the receiving equalization setting value into a receiving equalization regulator of the transceiver driving chip 370 to take effect, the transceiver driving chip 370 after taking effect performs high-frequency intensity adjustment on the converted electrical signal, the adjusted electrical signal is transmitted to the golden finger 310 through a signal line, and the electrical signal is transmitted to the upper computer through the golden finger 310.

In the optical module provided by the embodiment of the application, the intensity of the input and output signals of the optical module is controlled by adjusting the emission pre-emphasis setting value and the receiving equalization setting value, so that the optical module is optimally matched with the signal lines in the equipment single board and the module, the performance (an emission light eye diagram, the receiving sensitivity, the signal transmission and the like) of the module is ensured to be in an optimal state, and the normal and stable operation of the optical module in a full-temperature area is ensured.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims (9)

1. An optical module, comprising:

A circuit board;

The MCU is arranged on the circuit board and comprises a temperature sensor and a first register, wherein the temperature sensor is used for acquiring temperature parameters, and the first register stores a transmitting pre-emphasis setting value; the MCU is used for reading a corresponding transmitting pre-emphasis setting value from the first register according to the temperature parameter;

The laser driving chip is arranged on the circuit board and is electrically connected with the MCU, the laser driving chip comprises an emission pre-emphasis regulator, the value of the emission pre-emphasis regulator is not a fixed value, the emission pre-emphasis regulator is used for receiving the emission pre-emphasis setting value, and the intensity of the high-frequency component of the output modulation current is regulated according to the emission pre-emphasis setting value;

And the laser chip is electrically connected with the laser driving chip and is used for transmitting optical signals with corresponding intensity according to the adjusted modulation current so as to change the intensity of the transmitted optical signals.

2. The optical module of claim 1, wherein the transmit pre-emphasis setting is set in a one-to-one correspondence with the temperature parameter.

3. The optical module of claim 1, wherein the transmit pre-emphasis setting value is set corresponding to a preset range of the temperature parameter.

4. The optical module of claim 1, wherein the temperature sensor obtains a temperature parameter of-40 ℃ to 85 ℃.

5. An optical module, comprising:

A circuit board;

The MCU is arranged on the circuit board and comprises a temperature sensor and a second register, wherein the temperature sensor is used for acquiring temperature parameters, and the second register is stored with a receiving balance setting value; the MCU is used for reading a corresponding receiving balance set value from the second register according to the temperature parameter;

the receiving chip is arranged on the circuit board and is used for converting the received optical signals into electric signals;

The receiving driving chip is arranged on the circuit board and is electrically connected with the MCU and the receiving chip, the receiving driving chip comprises a receiving balance regulator, the value of the receiving balance regulator is not a fixed value, and the receiving balance regulator is used for receiving the receiving balance set value and adjusting the high-frequency intensity of the converted electric signal according to the receiving balance set value.

6. The optical module of claim 5, further comprising:

And the transimpedance amplifier is arranged on the circuit board, is electrically connected with the receiving chip and the receiving driving chip and is used for amplifying the electric signal from the receiving chip and transmitting the amplified electric signal to the receiving driving chip for adjustment.

7. The optical module of claim 5, wherein the receive equalization settings are set in a one-to-one correspondence with the temperature parameter.

8. The optical module of claim 5, wherein the receive equalization setting value is set corresponding to a preset range of the temperature parameter.

9. An optical module, comprising:

A circuit board;

The MCU is arranged on the circuit board and comprises a temperature sensor, a first register and a second register, wherein the temperature sensor is used for acquiring temperature parameters, the first register stores a transmitting pre-emphasis setting value, and the second register stores a receiving balance setting value; the MCU is used for reading a corresponding transmitting pre-emphasis setting value from the first register according to the temperature parameter, and reading a corresponding receiving balance setting value from the second register according to the temperature parameter;

the receiving and transmitting driving chip is arranged on the circuit board and is electrically connected with the MCU, the receiving and transmitting driving chip comprises a transmitting pre-emphasis regulator and a receiving balance regulator, the value of the transmitting pre-emphasis regulator and the value of the receiving balance regulator are not fixed values, the transmitting pre-emphasis regulator is used for receiving the transmitting pre-emphasis setting value, and the intensity of the high-frequency component of the output modulation current is adjusted according to the transmitting pre-emphasis setting value; the receiving equalization regulator is used for receiving the receiving equalization setting value and adjusting the high-frequency intensity of the converted electric signal according to the receiving equalization setting value;

the laser chip is electrically connected with the receiving and transmitting driving chip and is used for transmitting optical signals with corresponding intensity according to the adjusted modulation current so as to change the intensity of the transmitted optical signals;

And the receiving chip is electrically connected with the receiving and transmitting driving chip and is used for converting the received optical signals into electric signals.