CN113917622B - Optical module - Google Patents

Optical module Download PDF

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Publication number
CN113917622B
CN113917622B CN202010657294.0A CN202010657294A CN113917622B CN 113917622 B CN113917622 B CN 113917622B CN 202010657294 A CN202010657294 A CN 202010657294A CN 113917622 B CN113917622 B CN 113917622B
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China
Prior art keywords
laser
pin
chip
current
current pin
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CN202010657294.0A
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Chinese (zh)
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CN113917622A (en
Inventor
董雅倩
朱晓勐
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Hisense Broadband Multimedia Technology Co Ltd
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Hisense Broadband Multimedia Technology Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4286—Optical modules with optical power monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H01S5/0261—Non-optical elements, e.g. laser driver components, heaters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/0607—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature

Abstract

The application provides an optical module, which is provided with a laser chip electrically connected with a bias current pin of a laser driving chip and outputs laser based on the bias current provided by the bias current pin; and a photocurrent output pin of the monitoring light detection chip is electrically connected with a monitoring current pin and a feedback current pin of the laser driving chip respectively, and the monitoring light detection chip is used for monitoring the optical power of the laser output by the laser chip and outputting corresponding photocurrent to the photocurrent output pin. In addition, the laser driving chip is configured to adjust the current value of the feedback current pin to increase the current value flowing through the monitoring current pin when the temperature of the laser chip is greater than or equal to the preset temperature, so that when the current value of the monitoring current pin is increased, the current value of the bias current pin is reduced, the target optical power value of the laser output by the corresponding laser chip is reduced, and the laser chip is prevented from entering a saturation state.

Description

Optical module
Technical Field
The application relates to the technical field of optical fiber communication, in particular to an optical module.
Background
Due to the increasing demand for communication bandwidth in the field of optical fiber communication, global optical communication is in a rapid development period. In the field of high-speed data communication, in order to ensure that data can be transmitted at a high speed over a long distance, optical modules are generally used in the field to realize the transmission and reception of light with different wavelengths.
The existing optical module generally refers to an integrated module for photoelectric conversion, and for optical signal transmission, a laser is generally used to convert an electrical signal from an upper computer into an optical signal. Because the slope efficiency of a semiconductor laser has a characteristic of decreasing with a temperature increase, an Automatic Power Control (APC) circuit is generally provided in an optical module so as to stabilize the optical Power of an optical signal output by the laser. For the APC loop, a negative feedback is formed by collecting a backlight circuit of a laser by using a laser driver chip (driver), so as to achieve the purpose of controlling the output power of the laser.
Because the light-emitting power of the front cavity surface (also called light-emitting surface) of the laser and the light-emitting power of the back and front surfaces are in a linear relationship, the driver compares the backlight current output by the backlight monitoring light detection chip (MPD) with a target value to form negative feedback, so that the purpose of stabilizing the light-emitting power of the laser is achieved. For example, when the temperature increases, the slope efficiency of the laser decreases, the output power of the corresponding laser decreases, the backlight current of the same MPD decreases, and the driver increases the bias current to increase the output power of the laser, or vice versa.
However, at high temperatures, the output power of the laser has reached the plateau even if the bias current is increased. The output light power can not reach the target value, at this time, the driver falls into an endless loop, and the bias current is continuously increased until the maximum bias current which can be output by the driver, so that the laser enters a saturation state, and the output light power falls.
Disclosure of Invention
In view of the foregoing problems, embodiments of the present application provide an optical module.
The optical module provided by the embodiment of the application mainly comprises:
a circuit board;
the laser driving chip is arranged on the circuit board, is provided with a bias current pin, a monitoring current pin and a feedback current pin electrically connected with the monitoring current pin, and is used for adjusting the bias current of the bias current pin based on the current value received by the monitoring current pin;
the laser chip is electrically connected with the bias current pin and is used for outputting laser based on the bias current provided by the bias current pin;
a photocurrent output pin of the monitoring light detection chip is electrically connected with the monitoring current pin respectively and is used for monitoring the luminous power of the laser output by the laser chip and outputting corresponding photocurrent to the photocurrent output pin;
the laser driving chip is further configured to adjust a current value of the feedback current pin when the temperature of the laser chip is greater than or equal to a preset temperature, so as to increase the current value flowing through the monitoring current pin.
The optical module provided by the embodiment of the application configures a bias current pin, a monitoring current pin and a feedback current pin through a laser driving chip arranged on a circuit board. The laser chip is electrically connected with a bias current pin of the laser driving chip and outputs laser based on the bias current provided by the bias current pin; the monitoring current pin of the laser driving chip is electrically connected with the feedback current pin and the photocurrent output pin of the monitoring light detection chip respectively, and the monitoring light detection chip is used for monitoring the luminous power of the laser output by the laser chip and outputting the corresponding photocurrent to the photocurrent output pin. In addition, the laser driving chip is configured to adjust the current value of the feedback current pin to increase the current value flowing through the monitoring current pin when the temperature of the laser chip is greater than or equal to the preset temperature, so that when the laser driving chip monitors that the current value of the monitoring current pin is increased, the laser driving chip considers that the optical power of the laser output by the laser chip is increased, the current value of the bias current pin is further reduced, and the target optical power value of the laser output by the corresponding laser chip is reduced. Therefore, the optical module provided by the embodiment can reduce the target optical power value of the laser chip at high temperature, so as to prevent the laser chip from entering a saturation state.
Drawings
In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any creative effort.
Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;
FIG. 2 is a schematic diagram of an optical network unit;
fig. 3 is a schematic structural diagram of an optical module provided in an embodiment of the present application;
fig. 4 is an exploded structural schematic diagram of an optical module provided in an embodiment of the present application;
fig. 5 is a schematic partial structural diagram of an optical module according to an embodiment of the present invention;
FIG. 6 is an exploded view of portion A of FIG. 5;
fig. 7 is a schematic circuit diagram of a laser chip according to an embodiment of the present disclosure;
fig. 8 is a schematic circuit diagram of another embodiment of the present disclosure for preventing high temperature saturation of a laser chip.
Detailed Description
The technical solutions in the embodiments will be described clearly and completely with reference to the drawings in the embodiments, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
One of the core elements of optical fiber communication is the conversion of optical-electrical signals. Optical signals carrying information are transmitted in the optical fiber/optical waveguide in the optical fiber communication, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of the light in the optical fiber. The information processing devices such as computers use electrical signals, which require the interconversion between electrical signals and optical signals during the signal transmission process.
The optical module realizes the above photoelectric conversion function in the technical field of optical fiber communication, and the interconversion between an optical signal and an electrical signal is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on a circuit board, main electrical connections comprise power supply, I2C signals, data signal transmission, grounding and the like, the electrical connection mode realized by the golden finger becomes a standard mode of the optical module industry, and on the basis of the standard mode, the circuit board is a necessary technical characteristic in most optical modules.
Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103;
one end of the optical fiber is connected with the far-end server, one end of the network cable is connected with the local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber and the network cable; and the connection between the optical fiber and the network cable is completed by an optical network unit with an optical module.
An optical port of the optical module 200 is connected with the optical fiber 101 and establishes bidirectional optical signal connection with the optical fiber; the electrical port of the optical module 200 is accessed into the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the connection between the optical fiber and the optical network unit; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and information is not changed in the photoelectric conversion process.
The optical network unit is provided with an optical module interface 102, which is used for accessing an optical module and establishing bidirectional electric signal connection with the optical module; the optical network unit is provided with a network cable interface 104 for accessing a network cable and establishing bidirectional electric signal connection with the network cable; the optical module is connected with the network cable through the optical network unit, specifically, the optical network unit transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network unit is used as an upper computer of the optical module to monitor the work of the optical module.
Thus, a bidirectional signal transmission channel is established between the remote server and the local information processing equipment through the optical fiber, the optical module, the optical network unit and the network cable.
Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.
Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.
The optical module 200 is inserted into an optical network unit, specifically, an electrical port of the optical module is inserted into an electrical connector in the cage 106, and an optical port of the optical module is connected with the optical fiber 101.
The cage 106 is positioned on the circuit board, enclosing the electrical connectors on the circuit board in the cage; the optical module is inserted into the cage, the optical module is fixed by the cage, and heat generated by the optical module is conducted to the cage through the optical module housing, and finally diffused through the heat sink 107 on the cage.
Fig. 3 is a schematic structural diagram of an optical module 200 according to an embodiment of the present disclosure, and fig. 4 is an exploded structural diagram of the optical module 200 according to the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in an embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 30, a light emitting module 40, and a light receiving module 50.
The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the lower shell.
The two openings may be two openings (204, 205) located at the same end of the optical module, or two openings located at different ends of the optical module; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network unit; the other opening is an optical port 205 for external optical fiber access to connect the optical transmitting assembly 40 and the optical receiving assembly 50 inside the optical module; optoelectronic devices such as circuit board 30, light emitting assembly 40 and light receiving assembly 50 are located in the package cavity.
The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 30, the light emitting assembly 40, the light receiving assembly 50 and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form an outermost packaging protection shell of the optical module; the upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; generally, the shell of the optical module cannot be made into an integrated structure, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation structure and the electromagnetic shielding structure cannot be installed, and the production automation is not facilitated.
The unlocking handle 203 is located on the outer wall of the wrapping cavity/lower shell 202 and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.
The unlocking handle 203 is provided with a clamping structure matched with the upper computer cage; the tail end of the unlocking handle is pulled to enable the unlocking handle to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer through a clamping structure of the unlocking handle; by pulling the unlocking handle, the clamping structure of the unlocking handle moves along with the unlocking handle, so that the connection relation between the clamping structure and the upper computer is changed, the clamping relation between the optical module and the upper computer is relieved, and the optical module can be drawn out from the cage of the upper computer.
The circuit board 30 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as the microprocessor MCU2045, the laser driver chip, the limiting amplifier, the clock data recovery CDR, the power management chip, and the data processing chip DSP).
The circuit board 30 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.
The circuit board 30 is generally a rigid circuit board, which can also realize a bearing function due to its relatively hard material, for example, the rigid circuit board can stably bear a chip; when the light emitting assembly 40 and the light receiving assembly 50 are located on the circuit board, the rigid circuit board can also provide a smooth bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.
A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.
The optical transmitter module 40 and the optical receiver module 50 are respectively used for transmitting and receiving optical signals. In this embodiment, the light emitting module 40 is packaged by a housing, and the light emitting module 40 is electrically connected to the circuit board 30 through a flexible circuit board, however, in other embodiments, the circuit board 30 may also extend into the housing of the light emitting module 40, and is electrically connected to components in the housing through a wire bonding made of a metal material, for example, through a gold wire; alternatively, the light emitting assembly 40 may be packaged in a non-hermetic manner.
Fig. 5 is a schematic partial structure diagram of an optical module according to an embodiment of the present invention. As shown in fig. 5, a laser driver chip 302 is disposed on the circuit board 30, the laser driver chip 302 can be electrically connected to the circuit board 30 by a metal wire, and electrically connected to the golden finger 301 by a trace disposed on the circuit board 30, and the golden finger 301 receives an electrical signal from an upper computer and drives the laser chip in the light emitting module 40 to emit laser based on the electrical signal. Fig. 6 is an exploded view of a portion a of fig. 5. As shown in fig. 6, the optical transmitter assembly 40 in this embodiment includes an optical transmitter 41 and an optical transmission component 42, wherein the optical transmitter 41 is in a coaxial TO package type, and it should be noted that only the stem 413 is shown in the figure, and the cap is not shown in the figure. The stem 413 of the light emitter 41 is typically designed as an oblate cylindrical structure for carrying the various devices in the light emitter. The stem 413 is provided with a semi-cylindrical pillar, wherein the pillar may be integrated with the stem 413, and the laser chip 411 may be attached to the pillar through a substrate. The front cavity surface of the laser chip 411 faces the optical transmission component 42, light emitted by the laser chip enters the optical fiber through the optical transmission component 42, in addition, a monitoring optical detection chip 412 is further arranged on the tube seat 413 of the light emitter 41, a light sensing surface of the monitoring optical detection chip 412 faces the backlight surface of the laser chip 411, and monitoring of the light emitting optical power of the front cavity surface of the laser chip 411 (referred to as light emitting optical power of the laser chip 411 for short) is achieved by monitoring the light emitting optical power of the backlight surface of the laser chip 411 through the monitoring optical detection chip 412. Of course, in other embodiments, a part of the light emitted from the front cavity surface of the laser chip 411 may be separated by a lens, a mirror, or the like to be used as monitoring light, and irradiated to the photosensitive surface of the monitoring light detection chip 412.
When there is no APC compensation temperature table design in the laser driver chip 302, in order to prevent the problem that the laser driver chip 302 continuously increases the bias current to cause the laser chip 411 to enter a saturation state at a high temperature, and the optical power drops, the embodiment of the present application sets a compensation circuit between the laser driver chip 302 and the monitoring light detecting chip 412, so as to solve the problem of high temperature saturation of the laser chip 411 due to the increase of the ambient temperature.
Fig. 7 is a schematic circuit diagram for preventing a laser chip from high temperature saturation according to an embodiment of the present disclosure. As shown in fig. 7, the Laser driver chip 302 of this embodiment is provided with a Bias current pin Bias +, a monitor current pin MPD, a feedback current pin DAC, and a positive modulation current pin Laser + and a negative modulation current pin Laser-for controlling the extinction ratio ER of the Laser chip 411.
The anode of the laser chip 411 is electrically connected to the power supply pin on the gold finger 301, wherein a current source may be disposed on the circuit board 30, and an output end of the current source is connected to the power supply pin on the gold finger 301, and an output end of the current source is connected to the anode of the laser chip 411, or the anode of the laser chip 411 is directly powered by the power supply pin on the gold finger 301. The cathode of the laser chip 411 is electrically connected to the Bias current pin Bias + of the laser driver chip 302. The laser driver chip 302 can adjust the optical power output by the laser chip 411 by adjusting the magnitude of the Bias current input on the Bias current pin Bias +. For example, since the slope efficiency of the laser chip 411 decreases with an increase in temperature, it is necessary to increase the bias current when the temperature of the laser chip 411 increases in order to ensure the stability of the output optical power of the laser chip 411.
In this embodiment, the temperature of the working environment around the laser chip 411 may be the temperature of the laser chip 411, for example, the temperature detected by a thermistor provided on the housing of the optical module or a thermistor inside a Microprocessor (MCU) of the optical module may be the temperature of the laser chip 411, or the temperature detected by a temperature monitoring element provided specifically near the laser chip 411 may be the temperature of the laser chip 411.
In addition, the anode of the Laser chip 411 is electrically connected to the positive modulation current pin Laser + of the Laser driver chip 302, and the cathode is electrically connected to the negative modulation current pin Laser-of the Laser driver chip 302. The Laser driver chip 302 changes the current values of the positive modulation current pin Laser + and the negative modulation current pin Laser-based on the high-frequency electrical signal from the upper computer, so as to change the current value passed by the Laser chip 411. For example, when the current values of the positive modulation current pin Laser + and the negative modulation current pin Laser-are 0, the current flowing through the Laser chip 411 is Ibias, and the Laser chip 411 emits weak light; when the current values of the positive modulation current pin Laser + and the negative modulation current pin Laser-are Imod, the current flowing through the Laser chip 411 is Ibias + Imod, the Laser chip 411 emits strong light, and then the conversion from an electrical signal to an optical signal is realized, so that the modulation of the signal is completed. Of course, the feedback current pin is not limited to being in a differential manner.
The cathode of the monitoring photo-detection chip 412 is electrically connected to the power supply pin on the gold finger 301, wherein the specific connection manner between the monitoring photo-detection chip and the gold finger 301 may refer to the connection manner between the laser chip 411 and the gold finger 301, which is not limited in this embodiment. The anode of the monitoring light detecting chip 412 is used as its photocurrent output pin, and the monitoring current pin MPD of the laser driving chip 302 is electrically connected to its feedback current pin DAC and the photocurrent output pin of the monitoring light detecting chip 412, respectively.
The monitoring optical detection chip 412 is used for monitoring the optical power of the laser output by the laser chip 411 and outputting the corresponding optical powerTo its photocurrent output pin. The monitoring light detecting chip 412 of the present embodiment can input current to the feedback current pin DAC of the laser driving chip 302 through the resistors R4 and R5, and the magnitude of the current value Isink is controlled by the laser driving chip 302. Thus, the current I finally flowing into the MPD of the laser driver chip 302 2 = current I output from monitoring current pin MPD of monitoring photo-detecting chip 412 1 -Isink。
Setting the laser driver chip 302 to decrease the current value Isink flowing into the feedback current pin DAC when the temperature of the laser chip 411 is greater than or equal to the preset temperature, so that the current I flowing into the monitoring current pin MPD of the laser driver chip 302 2 The optical power of the laser output from the laser chip 411 will increase, and the laser driver chip 302 will consider that the optical power of the laser output from the laser chip 411 increases, and further will decrease the current value of the Bias current pin Bias +, accordingly, the target optical power value of the laser output from the laser chip 411 will decrease. For current value control of the feedback current pin DAC of the laser driver chip 302, a microprocessor inside the optical module may send a control signal to the laser driver chip 302 according to the temperature of the laser chip 411, or components such as a register and a processor are integrated inside the laser driver chip 302, that is, the current value of the feedback current pin DAC may be controlled according to the temperature of the laser chip 411.
Therefore, the optical module provided by this embodiment can reduce the target optical power value of the laser chip 411 at high temperature, thereby preventing the laser chip from entering a saturation state.
In addition, in order to ensure the stability of the light output power of the laser chip 411, when the temperature of the laser chip 411 of the laser driver chip 302 is greater than or equal to the preset temperature, the current value Isink of the feedback current pin DAC is a fixed value, that is, at normal temperature and low temperature, the laser driver chip 302 may monitor the current I output by the monitoring current pin MPD of the optical detection chip 412 according to the current I 1 The current value of the Bias current pin Bias + is adjusted to realize the adjustment of the light output power of the laser chip 411, so thatWhich reaches the target optical power value.
Further, in order to prevent the target optical power value of the laser chip 411 from decreasing too fast at a high temperature, in this embodiment, the preset temperature is set to be lower than the corresponding temperature value when the laser chip 411 reaches the saturation state, for example, the corresponding temperature value when the laser chip 411 reaches the saturation state is 85 ℃, then the preset temperature is 70 ℃, that is, when the temperature of the laser chip 411 reaches 70 ℃, the laser driver chip 302 starts to decrease the current value Isink flowing into the feedback current pin DAC thereof, and as the temperature of the laser chip 411 increases, the Isink is gradually decreased, so as to realize slow decrease of the target optical power value of the laser chip 411.
In addition, in order to achieve the stability of the extinction ratio ER of the optical signal output by the Laser chip 411, the current values Imod of the positive modulation current pin Laser + and the negative modulation current pin Laser-of the Laser driver chip 302 are also changed along with the change of the target optical power value of the Laser chip 411. That is, when the temperature of the Laser chip 411 is greater than or equal to the preset temperature, the target optical power value of the Laser chip 411 is decreased, so the current values Imod of the positive modulation current pin Laser + and the negative modulation current pin Laser-are also decreased accordingly. Further, according to the above-described manner in which the target optical power value of the laser chip 411 is set to slowly decrease with an increase in temperature, the current value Imod output by the feedback current pin of the laser driver chip 302 decreases with an increase in temperature of the laser chip 411.
Fig. 8 is a schematic circuit diagram of another embodiment of the present disclosure for preventing high temperature saturation of a laser chip. As shown in fig. 8, the main difference between the present embodiment and the above embodiments is that the laser driving chip 302 may feed back a current to the current pin DAC via a resistor R5, and the magnitude of the current value Isource is regulated and controlled by the laser driving chip 302. Of course, in other embodiments, no resistor R5 or other electronic components may be provided at the DAC end of the feedback current pin of the laser driver chip 302.
Thus, the current I finally flowing into the MPD of the laser driver chip 302 2 = monitor current of monitor photo-detection chip 412Current I output by pin MPD 1 +Isource。
When the temperature of the laser chip 411 is greater than or equal to the preset temperature, the laser driver chip 302 is set to increase the current value Isource output by the feedback current pin DAC thereof, so that the current I flowing into the monitoring current pin MPD of the laser driver chip 302 2 The optical power of the laser output from the laser chip 411 will increase, and the laser driver chip 302 will consider that the optical power of the laser output from the laser chip 411 increases, and further will decrease the current value of the Bias current pin Bias +, accordingly, the target optical power value of the laser output from the laser chip 411 will decrease. Therefore, the optical module provided by this embodiment can reduce the target optical power value of the laser chip 411 at high temperature, thereby preventing the laser chip from entering a saturation state.
In addition, in order to ensure the stability of the light output power of the laser chip 411, when the temperature of the laser driver chip 302 is greater than or equal to the preset temperature, the current value Isource of the feedback current pin DAC is set to be a fixed value.
Further, in order to prevent the target optical power value of the laser chip 411 from decreasing too fast at a high temperature, the present embodiment sets the preset temperature to be smaller than the corresponding temperature value when the laser chip 411 reaches the saturation state, and with the increase of the temperature of the laser chip 411, isource is gradually increased to realize the slow decrease of the target optical power value of the laser chip 411.
It should be noted that the laser driving chip 302 in the above embodiment is not limited to be integrated in one chip, and may be composed of a plurality of independent chips in other embodiments. In addition, the packaging manner for the optical module is not limited to the manner presented in the above embodiments.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims (8)

1. A light module, comprising:
a circuit board;
the laser driving chip is arranged on the circuit board, is provided with a bias current pin, a monitoring current pin and a feedback current pin electrically connected with the monitoring current pin, and is used for adjusting the bias current of the bias current pin based on the current value received by the monitoring current pin;
the laser chip is electrically connected with the bias current pin and is used for outputting laser based on the bias current provided by the bias current pin;
a photocurrent output pin of the monitoring light detection chip is electrically connected with the monitoring current pin respectively and is used for monitoring the luminous power of the laser output by the laser chip and outputting corresponding photocurrent to the photocurrent output pin;
the laser driving chip is further used for adjusting the current value of the feedback current pin when the temperature of the laser chip is greater than or equal to a preset temperature so as to increase the current value flowing through the monitoring current pin;
the feedback current pin and the photocurrent output pin both input current to the monitoring current pin;
the adjusting the current value of the feedback current pin comprises:
and increasing the current value output by the feedback current pin.
2. The optical module according to claim 1, wherein the preset temperature is lower than a corresponding temperature value when the laser chip reaches a saturation state;
when the temperature of the laser chip is greater than or equal to a preset temperature, the current value output by the feedback current pin is increased along with the increase of the temperature of the laser chip.
3. The optical module according to claim 1, wherein the photocurrent output from the photocurrent output pin flows to the feedback current pin and the monitoring current pin respectively;
the laser driving chip is used for reducing the current value flowing into the feedback current pin when the temperature of the laser chip is greater than or equal to a preset temperature.
4. The optical module according to claim 3, wherein the preset temperature is less than a corresponding temperature value when the laser chip reaches a saturation state;
when the temperature of the laser chip is greater than or equal to a preset temperature, the current value input by the feedback current pin is reduced along with the increase of the temperature of the laser chip.
5. The optical module according to claim 1, wherein a current value of the feedback current pin is a fixed value when the temperature of the laser chip is less than the preset temperature.
6. The optical module according to any one of claims 1 to 5, wherein a gold finger is provided on the circuit board, wherein:
and the cathode of the monitoring light detection chip is electrically connected with a power supply pin in the golden finger, and the anode of the monitoring light detection chip is used as the photocurrent output pin.
7. The optical module according to any one of claims 1 to 5, wherein a gold finger is provided on the circuit board, wherein:
and the anode of the laser chip is electrically connected with a power supply pin in the golden finger, and the cathode of the laser chip is electrically connected with the bias current pin.
8. The optical module as claimed in claim 7, wherein the laser driver chip further comprises:
the positive modulation current pin is electrically connected with the anode of the laser chip;
the negative modulation current pin is electrically connected with a lead of the laser chip;
wherein the laser driving chip is further configured to: and adjusting the current values of the positive modulation current pin and the negative modulation current pin according to the bias current of the bias current pin.
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CN117061009B (en) * 2023-10-11 2023-12-19 成都观岩科技有限公司 Optical modulation amplitude control method and framework of optical communication transmitter laser driver

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