CN114566308A - Scratch-resistant COP conductive film and preparation method thereof - Google Patents
Scratch-resistant COP conductive film and preparation method thereof Download PDFInfo
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- CN114566308A CN114566308A CN202210254682.3A CN202210254682A CN114566308A CN 114566308 A CN114566308 A CN 114566308A CN 202210254682 A CN202210254682 A CN 202210254682A CN 114566308 A CN114566308 A CN 114566308A
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- 230000003678 scratch resistant effect Effects 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title abstract description 4
- 230000003287 optical effect Effects 0.000 claims abstract description 58
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical group [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 238000004544 sputter deposition Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 56
- 239000000758 substrate Substances 0.000 claims description 30
- 239000000377 silicon dioxide Substances 0.000 claims description 28
- 235000012239 silicon dioxide Nutrition 0.000 claims description 27
- 238000000576 coating method Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 229910003437 indium oxide Inorganic materials 0.000 claims description 5
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 5
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 5
- 229910001887 tin oxide Inorganic materials 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 156
- 239000012790 adhesive layer Substances 0.000 description 15
- 239000002042 Silver nanowire Substances 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- AZWHFTKIBIQKCA-UHFFFAOYSA-N [Sn+2]=O.[O-2].[In+3] Chemical compound [Sn+2]=O.[O-2].[In+3] AZWHFTKIBIQKCA-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
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Abstract
The invention discloses a scratch-resistant COP conductive film and a preparation method thereof, wherein the scratch-resistant COP conductive film comprises a COP base material layer, the COP base material layer is provided with a first optical surface and a second optical surface which are opposite, a hardening layer, an optical matching layer, a sputtering bonding layer and a conductive layer are respectively and sequentially coated on the first optical surface and the second optical surface in an overlapping mode, the thickness of the hardening layer is 0.3-3 mu m, the refractive index is 1.48-1.54, the thickness of the optical matching layer is 60-100nm, the refractive index is 1.6-1.7, the thickness of the sputtering bonding layer is 5-20 nm, the refractive index is 1.45-1.7, the conductive layer is an indium tin oxide layer, the thickness of the indium tin oxide layer is 20-30 nm, and the refractive index is 1.9. The scratch-resistant COP conductive film can effectively improve the hardness of the surface of the COP conductive film, so that the surface of the COP conductive film has higher wear resistance and is not easy to scratch in the production process, and rainbow marks can not appear at any angle of the sight line of human eyes and the observation angle of a screen.
Description
Technical Field
The invention relates to a conductive film, in particular to a scratch-resistant COP conductive film and a preparation method thereof.
Background
The polyester film (PET film) is a base film or a bottom film of a plurality of functional films in a plurality of flexible display screens, wherein the most common ITO film (indium tin oxide semiconductor transparent conductive film) of the touch core of the mobile phone panel screen is prepared by sputtering a conductive material indium tin oxide on the surface of the film by taking the PET film as a base material. In the prior art, ITO is replaced by silver nanowires AgNWs to be used as a conductive material, but the problems that the silver nanowires are difficult to form narrow frames and etching marks are obvious need to be further improved, and the base material of the silver nanowire conductive film is mainly a PET film.
The COP has the characteristics of high transparency, low birefringence, low water absorption, high rigidity, high heat resistance, good water vapor tightness and the like, so that the COP can be used as a substrate instead of PET in the fields with special requirements on high transparency and ultraviolet-resistant conductive films. However, the COP substrate, which is a conventional transparent conductive film, is easily scratched during the production process, resulting in excessive defective products of the COP film.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art that is already known to a person skilled in the art.
Disclosure of Invention
The invention aims to provide a scratch-resistant COP conductive film, which can effectively improve the hardness of the surface of the COP conductive film, so that the surface of the COP conductive film has more wear resistance and is not easy to scratch in the production process, and rainbow marks can not appear at any angle of the sight line of human eyes and the observation angle of a screen.
In order to achieve the purpose, the scratch-resistant COP conductive film comprises a COP substrate layer, wherein the COP substrate layer is provided with a first optical surface and a second optical surface which are opposite, a hardening layer, an optical matching layer, a sputtering bonding layer and a conductive layer are sequentially coated on the first optical surface and the second optical surface in an overlapping mode, the thickness of the hardening layer is 0.3-3 mu m, the refractive index is 1.48-1.54, the thickness of the optical matching layer is 60-100nm, the refractive index is 1.6-1.7, the thickness of the sputtering bonding layer is 5-20 nm, the refractive index is 1.45-1.7, the conductive layer is an indium tin oxide layer, and the thickness of the indium tin oxide layer is 20-30 nm.
In one or more embodiments, the thickness of the COP substrate layer is 50 to 188 μm.
In one or more embodiments, the hardbanding has a thickness of 1 to 2 μm and a refractive index of 1.5.
In one or more embodiments, the optical matching layer has a thickness of 80nm and a refractive index of 1.65.
In one or more embodiments, the sputtered bonding layer is a silicon dioxide layer, the thickness of the silicon dioxide layer is 10-20 nm, and the refractive index is 1.46.
In one or more embodiments, the ito layer has a thickness of 24 to 26nm and a refractive index of 1.9.
In one or more embodiments, the indium tin oxide layer has a wt% ratio of indium oxide to tin oxide in the range of 90:10 to 98:2, preferably a wt% ratio of indium oxide to tin oxide of 93: 7.
The invention also provides a method for preparing the scratch-resistant COP conductive film, which comprises the following steps:
s1: respectively coating a hard layer on the first optical surface and the second optical surface of the COP substrate layer through a coating process;
s2: coating an optical matching layer on one surface of the hardened layer, which is far away from the COP base material layer, through a coating process;
s3: plating the silicon dioxide layer on one surface of the optical matching layer, which is far away from the hardened layer, by a magnetron sputtering process;
s4: and plating the indium tin oxide layer on one surface of the silicon dioxide layer, which is far away from the optical matching layer, by a magnetron sputtering process, and thus completing the manufacturing.
Compared with the prior art, the scratch-resistant COP conductive film can effectively improve the hardness of the surface of the COP conductive film, so that the surface of the COP conductive film has higher wear resistance and is not easily scratched in the production process, and rainbow grains can not appear at any angle of the sight line of human eyes and the observation angle of a screen.
Drawings
Fig. 1 is a schematic structural view of a scratch-resistant COP conductive film according to an embodiment of the present invention.
Detailed Description
The following detailed description of the present invention is provided in conjunction with the accompanying drawings, but it should be understood that the scope of the present invention is not limited to the specific embodiments.
Throughout the specification and claims, unless explicitly stated otherwise, the term "comprise" or variations such as "comprises" or "comprising", etc., will be understood to imply the inclusion of a stated element or component but not the exclusion of any other element or component.
As shown in fig. 1, an embodiment of the present invention provides a scratch-resistant COP conductive film, including a COP substrate layer 10, wherein the COP substrate layer 10 has a first optical surface 10a and a second optical surface 10b opposite to each other, and the first optical surface 10a and the second optical surface 10b are respectively coated with a hardening layer 20a, 20b, an optical matching layer 30a, 30b, a sputtering adhesion layer 40a, 40b, and a conductive layer 50a, 50b in sequence.
In one embodiment, the thickness of the COP substrate layer 10 is 50-188 μm. The thickness of the hardened layers 20a, 20b is 0.3 to 3 μm, and the refractive index is 1.48 to 1.54, and preferably, the thickness of the hardened layers 20a, 20b is 1 to 2 μm, and the refractive index is 1.5. The optical matching layers 30a, 30b have a thickness of 60 to 100nm and a refractive index of 1.6 to 1.7, and preferably, the optical matching layers 30a, 30b have a thickness of 80nm and a refractive index of 1.65. The sputtering bonding layers 40a and 40b are silicon dioxide layers, the thickness of the silicon dioxide layers is 5-20 nm, the refractive index is 1.45-1.7, and preferably, the thickness of the silicon dioxide layers is 10-20 nm, and the refractive index is 1.46. The conductive layers 50a and 50b are ito layers having a thickness of 20 to 30nm, preferably 24 to 26nm, and a refractive index of 1.9.
In one embodiment, the indium oxide-tin oxide layer has a ratio of indium oxide to tin oxide of 90:10 to 98:2 by weight, and preferably has a ratio of indium oxide to tin oxide of 97:3 by weight, and has a post-crystallization resistance of 25 to 150 ohms, a pencil hardness of 1H to 2H, and no rainbow marks.
The invention also provides a method for preparing the scratch-resistant COP conductive film, which comprises the following steps: s1: respectively coating a hard layer on the first optical surface and the second optical surface of the COP substrate layer through a coating process; s2: coating an optical matching layer on one surface of the hardened layer, which is far away from the COP base material layer, through a coating process; s3: plating the silicon dioxide layer on one surface of the optical matching layer, which is far away from the hardened layer, through a magnetron sputtering process; s4: and plating the indium tin oxide layer on one surface of the silicon dioxide layer, which is far away from the optical matching layer, by a magnetron sputtering process, and thus completing the manufacturing.
Example 1:
the thickness of the COP substrate layer 10 was 50. The hardbanding layers 20a, 20b have a thickness of 0.3 μm and a refractive index of 1.48. The optical matching layers 30a, 30b have a thickness of 60nm and a refractive index of 1.6. The sputtered adhesive layers 40a and 40b were silicon dioxide layers having a thickness of 5nm and a refractive index of 1.45. The conductive layers 50a and 50b are indium tin oxide layers, the thickness of which is 20nm, and the refractive index of which is 1.9. The hardness of the obtained scratch-resistant COP conductive film is 1H.
Example 2:
the thickness of the COP substrate layer 10 was 125. The hardbanding layers 20a, 20b have a thickness of 0.3 μm and a refractive index of 1.48. The optical matching layers 30a, 30b have a thickness of 60nm and a refractive index of 1.6. The sputtered adhesive layers 40a and 40b were silicon dioxide layers having a thickness of 5nm and a refractive index of 1.45. The conductive layers 50a and 50b are indium tin oxide layers, the thickness of which is 20nm, and the refractive index of which is 1.9. The hardness of the obtained scratch-resistant COP conductive film is 1H.
Example 3:
the thickness of the COP substrate layer 10 was 125. The hardbanding layers 20a, 20b have a thickness of 1 μm and a refractive index of 1.5. The optical matching layers 30a, 30b have a thickness of 60nm and a refractive index of 1.6. The sputtered adhesive layers 40a and 40b were silicon dioxide layers having a thickness of 5nm and a refractive index of 1.45. The conductive layers 50a and 50b are indium tin oxide layers, the thickness of which is 20nm, and the refractive index of which is 1.9. The hardness of the obtained scratch-resistant COP conductive film is 2H.
Example 4:
the thickness of the COP substrate layer 10 was 125. The hardbanding layers 20a, 20b have a thickness of 2 μm and a refractive index of 1.5. The optical matching layers 30a, 30b have a thickness of 60nm and a refractive index of 1.6. The sputtered adhesive layers 40a and 40b are silicon dioxide layers having a thickness of 5nm and a refractive index of 1.45. The conductive layers 50a and 50b are indium tin oxide layers having a thickness of 20nm and a refractive index of 1.9. The hardness of the obtained scratch-resistant COP conductive film is 2H.
Example 5:
the thickness of the COP substrate layer 10 was 125. The hardbanding layers 20a, 20b have a thickness of 3 μm and a refractive index of 1.5. The optical matching layers 30a, 30b have a thickness of 60nm and a refractive index of 1.6. The sputtered adhesive layers 40a and 40b were silicon dioxide layers having a thickness of 5nm and a refractive index of 1.45. The conductive layers 50a and 50b are indium tin oxide layers having a thickness of 20nm and a refractive index of 1.9. The hardness of the obtained scratch-resistant COP conductive film is 2H.
Example 6:
the thickness of the COP substrate layer 10 was 125. The hardbanding layers 20a, 20b are 2 μm thick and have a refractive index of 1.54. The optical matching layers 30a, 30b have a thickness of 60nm and a refractive index of 1.6. The sputtered adhesive layers 40a and 40b are silicon dioxide layers having a thickness of 5nm and a refractive index of 1.45. The conductive layers 50a and 50b are indium tin oxide layers, the thickness of which is 20nm, and the refractive index of which is 1.9. The hardness of the obtained scratch-resistant COP conductive film is 2H.
Example 7:
the thickness of the COP substrate layer 10 was 125. The hardbanding layers 20a, 20b have a thickness of 2 μm and a refractive index of 1.5. The optical matching layers 30a, 30b have a thickness of 80nm and a refractive index of 1.65. The sputtered adhesive layers 40a and 40b were silicon dioxide layers having a thickness of 5nm and a refractive index of 1.45. The conductive layers 50a and 50b are indium tin oxide layers, the thickness of which is 20nm, and the refractive index of which is 1.9. The hardness of the obtained scratch-resistant COP conductive film is 2H.
Example 8:
the thickness of the COP substrate layer 10 was 125. The hardbanding layers 20a, 20b have a thickness of 2 μm and a refractive index of 1.5. The optical matching layers 30a, 30b have a thickness of 100nm and a refractive index of 1.65. The sputtered adhesive layers 40a and 40b were silicon dioxide layers having a thickness of 5nm and a refractive index of 1.45. The conductive layers 50a and 50b are indium tin oxide layers, the thickness of which is 20nm, and the refractive index of which is 1.9. The hardness of the obtained scratch-resistant COP conductive film is 2H.
Example 9:
the thickness of the COP substrate layer 10 was 125. The hardbanding layers 20a, 20b have a thickness of 2 μm and a refractive index of 1.5. The optical matching layers 30a, 30b have a thickness of 80nm and a refractive index of 1.7. The sputtered adhesive layers 40a and 40b were silicon dioxide layers having a thickness of 5nm and a refractive index of 1.45. The conductive layers 50a and 50b are indium tin oxide layers, the thickness of which is 20nm, and the refractive index of which is 1.9. The hardness of the obtained scratch-resistant COP conductive film is 2H.
Example 10:
the thickness of the COP substrate layer 10 was 125. The hardbanding layers 20a, 20b have a thickness of 2 μm and a refractive index of 1.5. The optical matching layers 30a, 30b have a thickness of 80nm and a refractive index of 1.65. The sputtered adhesive layers 40a and 40b were silicon dioxide layers having a thickness of 5nm and a refractive index of 1.45. The conductive layers 50a and 50b are indium tin oxide layers, the thickness of which is 20nm, and the refractive index of which is 1.9. The hardness of the obtained scratch-resistant COP conductive film is 2H.
Example 11:
the thickness of the COP substrate layer 10 was 125. The hardbanding layers 20a, 20b have a thickness of 2 μm and a refractive index of 1.5. The optical matching layers 30a, 30b have a thickness of 80nm and a refractive index of 1.65. The sputtered adhesive layers 40a, 40b were silicon dioxide layers having a thickness of 10nm and a refractive index of 1.46. The conductive layers 50a and 50b are indium tin oxide layers, the thickness of which is 20nm, and the refractive index of which is 1.9. The hardness of the obtained scratch-resistant COP conductive film is 2H.
Example 12:
the thickness of the COP substrate layer 10 was 125. The hardbanding layers 20a, 20b have a thickness of 2 μm and a refractive index of 1.5. The optical matching layers 30a, 30b had a thickness of 80nm and a refractive index of 1.65. The sputtered adhesive layers 40a, 40b were silicon dioxide layers having a thickness of 15nm and a refractive index of 1.46. The conductive layers 50a and 50b are indium tin oxide layers having a thickness of 20nm and a refractive index of 1.9. The hardness of the obtained scratch-resistant COP conductive film is 2H.
Example 13:
the thickness of the COP substrate layer 10 was 125. The hardbanding layers 20a, 20b have a thickness of 2 μm and a refractive index of 1.5. The optical matching layers 30a, 30b have a thickness of 80nm and a refractive index of 1.65. The sputtered adhesive layers 40a, 40b were silica layers having a thickness of 20nm and a refractive index of 1.7. The conductive layers 50a and 50b are indium tin oxide layers, the thickness of which is 20nm, and the refractive index of which is 1.9. The hardness of the obtained scratch-resistant COP conductive film is 2H.
Example 14:
the thickness of the COP substrate layer 10 was 125. The hardbanding layers 20a, 20b have a thickness of 2 μm and a refractive index of 1.5. The optical matching layers 30a, 30b have a thickness of 80nm and a refractive index of 1.65. The sputtered adhesive layers 40a, 40b were silicon dioxide layers having a thickness of 15nm and a refractive index of 1.46. The conductive layers 50a and 50b are indium tin oxide layers, the thickness of each indium tin oxide layer is 25nm, and the refractive index of each indium tin oxide layer is 1.9. The hardness of the obtained scratch-resistant COP conductive film is 2H.
Example 15:
the thickness of the COP substrate layer 10 was 125. The hardbanding layers 20a, 20b have a thickness of 2 μm and a refractive index of 1.5. The optical matching layers 30a, 30b have a thickness of 80nm and a refractive index of 1.65. The sputtered adhesive layers 40a, 40b were silicon dioxide layers having a thickness of 15nm and a refractive index of 1.46. The conductive layers 50a and 50b are indium tin oxide layers, the thickness of which is 30nm, and the refractive index of which is 1.9. The hardness of the obtained scratch-resistant COP conductive film is 2H.
Comparative example 1:
the thickness of the COP substrate layer was 125. The thickness of the hardened layer was 2 μm and the refractive index was 1.5. The optical matching layer had a thickness of 80nm and a refractive index of 1.65. The thickness of the sputtered adhesion layer was 15nm and the refractive index was 1.46. And (5) a protective film layer. The hardness of the obtained COP conductive film was 1H.
Compared with the prior art, the scratch-resistant COP conductive film can effectively improve the hardness of the surface of the COP conductive film, so that the surface of the COP conductive film has higher wear resistance and is not easy to scratch in the production process, and rainbow marks can not appear at any angle of the sight line of human eyes and the observation angle of a screen.
The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and its practical application to enable one skilled in the art to make and use various exemplary embodiments of the invention and various alternatives and modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.
Claims (8)
1. The scratch-resistant COP conductive film is characterized by comprising a COP substrate layer, wherein the COP substrate layer is provided with a first optical surface and a second optical surface which are opposite, a hardening layer, an optical matching layer, a sputtering bonding layer and a conductive layer are sequentially coated on the first optical surface and the second optical surface in an overlapping mode, the thickness of the hardening layer is 0.3-3 mu m, the refractive index is 1.48-1.54, the thickness of the optical matching layer is 60-100nm, the refractive index is 1.6-1.7, the thickness of the sputtering bonding layer is 5-20 nm, the refractive index is 1.45-1.7, the conductive layer is an indium tin oxide layer, and the thickness of the indium tin oxide layer is 20-30 nm.
2. The scratch-resistant COP conductive film according to claim 1, wherein the thickness of the COP substrate layer is 50 to 188 μm.
3. The scratch-resistant COP conductive film according to claim 1, wherein the hardened layer has a thickness of 1 to 2 μm and a refractive index of 1.5.
4. The scratch-resistant COP conductive film according to claim 1, wherein the optical matching layer has a thickness of 80nm and a refractive index of 1.65.
5. The scratch-resistant COP conductive film according to claim 1, wherein the sputtered adhesion layer is a silicon dioxide layer, the thickness of the silicon dioxide layer is 10-20 nm, and the refractive index is 1.46.
6. The scratch-resistant COP conductive film according to claim 1, wherein the thickness of the ITO layer is 24 to 26nm, and the refractive index of the ITO layer is 1.9.
7. The scratch-resistant COP conductive film according to claim 1, wherein the indium tin oxide layer contains indium oxide and tin oxide in a wt% ratio within a range of 90:10 to 98: 2.
8. A method of making the scratch-resistant COP conductive film of claim 5, comprising the steps of:
s1: respectively coating a hard layer on the first optical surface and the second optical surface of the COP substrate layer through a coating process;
s2: coating an optical matching layer on one surface of the hardened layer, which is far away from the COP base material layer, through a coating process;
s3: plating the silicon dioxide layer on one surface of the optical matching layer, which is far away from the hardened layer, by a magnetron sputtering process;
s4: and plating the indium tin oxide layer on one surface of the silicon dioxide layer, which is far away from the optical matching layer, by a magnetron sputtering process, and thus completing the manufacturing.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202601231U (en) * | 2012-05-11 | 2012-12-12 | 南昌欧菲光科技有限公司 | Novel double-faced indium tin oxide (ITO) conducting film with four-layer film system structure |
| CN203433832U (en) * | 2013-05-10 | 2014-02-12 | 深圳市豪威薄膜技术有限公司 | Flexible transparent conductive thin film and touch-controlled panel |
| CN205384883U (en) * | 2016-01-16 | 2016-07-13 | 汕头万顺包装材料股份有限公司 | Two -sided ITO conductive film that contains particle |
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- 2022-03-15 CN CN202210254682.3A patent/CN114566308B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202601231U (en) * | 2012-05-11 | 2012-12-12 | 南昌欧菲光科技有限公司 | Novel double-faced indium tin oxide (ITO) conducting film with four-layer film system structure |
| CN203433832U (en) * | 2013-05-10 | 2014-02-12 | 深圳市豪威薄膜技术有限公司 | Flexible transparent conductive thin film and touch-controlled panel |
| CN205384883U (en) * | 2016-01-16 | 2016-07-13 | 汕头万顺包装材料股份有限公司 | Two -sided ITO conductive film that contains particle |
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