CN114563902B - Projection optical machine and projection equipment - Google Patents
Projection optical machine and projection equipment Download PDFInfo
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- CN114563902B CN114563902B CN202210239187.5A CN202210239187A CN114563902B CN 114563902 B CN114563902 B CN 114563902B CN 202210239187 A CN202210239187 A CN 202210239187A CN 114563902 B CN114563902 B CN 114563902B
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- heat
- housing
- heat dissipation
- optical element
- fan
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
Abstract
The utility model provides a projection ray apparatus and projection equipment, projection ray apparatus includes the casing, a plurality of optical element and radiator unit, be formed with accommodation space in the casing, a plurality of optical element disposes in accommodation space, and be located the illumination light path, radiator unit, including fan and at least one radiator unit, the fan disposes in accommodation space, the fan is used for providing the air current that circulates and pass through optical element in accommodation space, the radiator unit sets up on the casing, and at least part is located the flow path of air current, and be located the air current entering side of one or more optical element. The problem that the optical element is damaged and the service life is low due to the fact that the internal temperature of the projection optical machine is high in the prior art is solved, and then the effects of improving the heat dissipation and the service life of the optical element are achieved.
Description
Technical Field
The disclosure belongs to the field of projection technology, and particularly relates to a projection optical machine and projection equipment.
Background
With the rapid development of projection technology, the brightness of a projection light machine is continuously improved as a core component of a projection device, so that the temperature of an imaging chip and optical elements such as lenses, fly-eye lenses, reflectors and the like of the projection light machine is higher. At present, the temperature of an imaging chip is generally controlled directly through a semiconductor refrigerating sheet, but the heat dissipation of an optical element in a projection optical machine cannot be considered, the optical element works in a high-temperature environment, the service life of the optical element is limited, and the performance of projection equipment is affected.
Disclosure of Invention
The embodiment of the disclosure provides a projection optical machine and projection equipment, which are used for solving the problems of damage to optical elements and low service life caused by high internal temperature of the projection optical machine.
In a first aspect, an embodiment of the present disclosure provides a projection light machine, including:
a housing in which an accommodation space is formed;
a plurality of optical elements arranged in the accommodating space and positioned on the illumination light path;
the heat dissipation assembly comprises a fan and at least one heat dissipation piece, wherein the fan is configured in the accommodating space and is used for providing air flow which circulates in the accommodating space and passes through the optical element, and the heat dissipation piece is arranged on the shell, is at least partially positioned on a flowing path of the air flow and is positioned on one or more air flow inlet sides of the optical element.
Optionally, the heat sink comprises a heat conducting means disposed on an inner surface of the housing.
Optionally, the heat dissipation part further comprises a heat dissipation device, the heat dissipation device is arranged on the outer surface of the shell, and the heat conduction device and the heat dissipation device are respectively located on two side surfaces of the same part of the shell.
Optionally, the heat dissipation assembly further includes a first semiconductor refrigeration sheet disposed between the heat dissipation device and the housing; and/or the first semiconductor refrigeration piece is arranged between the heat conduction device and the shell, and the first semiconductor refrigeration piece is used for conducting heat of the heat conduction device to the heat dissipation device.
Optionally, the heat conducting device comprises a plurality of fins, and heat dissipation channels are formed between adjacent fins, and the direction of the heat dissipation channels is parallel to the direction of the air flow.
Optionally, the plurality of optical elements include a fly-eye lens and a prism assembly sequentially disposed on the illumination light path, and the heat sink is disposed on the air flow entrance side of the fly-eye lens and/or the prism assembly.
Optionally, the plurality of optical elements further include a reflector located on the illumination light path, the light emitted by the fly-eye lens is reflected by the reflector and enters the prism assembly, and the prism assembly is located on the air inlet side of the fan.
Optionally, the fan further comprises an imaging chip, wherein the imaging chip is located on the air inlet side of the fan, an imaging surface of the imaging chip is located on the flowing path of the air flow, the imaging surface is parallel to the flowing direction of the air flow, and one of the heat dissipation pieces is located on the air flow inlet side of the imaging chip.
Optionally, the heat dissipation assembly further includes a heat conduction layer, one side of the heat conduction layer is attached to the optical element, and the other side of the heat conduction layer is attached to the housing; and/or the optical element is connected with the shell through a fixing piece, one side of the heat conducting layer is attached to the optical element, and the other side of the heat conducting layer is attached to the fixing piece.
Optionally, the heat dissipation assembly further comprises a flow guiding piece, a flow passage is formed between the flow guiding piece, the optical element and the shell, and the air flow circularly flows in the flow passage.
Optionally, the fan is arranged outside the shell, and the fan provides air flow acting on the outside of the shell.
In a second aspect, an embodiment of the present disclosure further provides a projection apparatus, including a lens assembly and a projection light engine as set forth in any one of the preceding claims, where the lens assembly is disposed on a light emitting side of an illumination light path of the projection light engine.
According to the projection optical machine and the projection equipment, the heat radiating component is arranged in the shell and comprises the fan and at least one heat radiating piece, the fan forms air flow which circulates through the optical element in the accommodating space in the shell, heat generated by the optical element is taken away, the heat in the shell is radiated to the outside of the shell by the heat radiating piece, the heat in the shell is transmitted to the inside of the shell to radiate, and meanwhile, the heat radiating piece is arranged on the air flow inlet side of one or more optical elements, so that the temperature of the air flow passing through the optical element is reduced, the temperature of the optical element is further reduced, the problems that the optical element is damaged and the service life is low due to high temperature in the projection optical machine are solved, and the effects of improving the heat radiation of the optical element and prolonging the service life are achieved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings that are required to be used in the description of the embodiments will be briefly described below. It will be apparent to those skilled in the art from this disclosure that the drawings described below are merely examples of some of the embodiments of the present disclosure and that other drawings may be made from these drawings without the exercise of inventive faculty.
For a more complete understanding of the present disclosure and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts throughout the following description.
Fig. 1 is a schematic view of a projection apparatus according to an embodiment of the present disclosure.
Fig. 2 is an exploded view of a projection device provided by an embodiment of the present disclosure.
Fig. 3 is a side view of a projection light engine according to an embodiment of the present disclosure.
Fig. 4 is an axial view of a projection light engine according to an embodiment of the disclosure.
Fig. 5 is a schematic diagram of a heat conducting layer of a projection optical engine according to an embodiment of the disclosure.
Fig. 6 is a schematic diagram of a first arrangement of a first semiconductor refrigeration sheet provided in an embodiment of the present disclosure.
Fig. 7 is a schematic diagram of a second arrangement of first semiconductor refrigeration tablets provided in an embodiment of the present disclosure.
Wherein the figures are referenced as follows:
the projector 100, the housing 110, the accommodation space 111, the body 112, the cover 113, the optical element 120, the fly eye lens 121, the prism assembly 122, the mirror 123, the fixing member 124, the heat dissipating assembly 130, the fan 131, the heat dissipating member 132, the heat conducting member 1320, the fin 1321, the heat dissipating passage 1322, the heat dissipating member 1323, the first semiconductor cooling fin 133, the heat conducting layer 134, the flow guiding member 136, the flow passage 1360, the non-flow passage area 1110, the first flow guiding plate 1361, the second flow guiding plate 1362, the imaging chip 140, the heat dissipating device 141, the heat dissipating member 1411, the second semiconductor cooling fin 1410, the heat insulating cotton 1412, and the lens assembly 200.
Detailed Description
The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure. It will be apparent that the described embodiments are merely some, but not all embodiments of the present disclosure. Based on the embodiments in this disclosure, all other embodiments that a person of ordinary skill in the art would obtain without making any inventive effort are within the scope of the disclosure.
The embodiment of the disclosure provides a projection optical machine and projection equipment, so as to solve the problems of damage and short service life of optical elements caused by high internal temperature of the projection optical machine. The following description will be given with reference to the accompanying drawings.
Aiming at the defects that in the prior art, as the optical element of the projection equipment is fixed on the shell of the projection optical machine, the heat conduction thermal resistance between the optical element and the shell is high, the heat exchange between the optical element and the shell through thermal radiation is not facilitated, the internal temperature of the projection optical machine is higher, the heat dissipation of the optical element is not facilitated, the optical element works in a high-temperature environment, the service life of the optical element is reduced, and the performance of the projection equipment is influenced; according to the heat dissipation device, the heat dissipation assembly 130 is arranged in the shell 110, the heat dissipation assembly 130 comprises the fan 131 and the heat dissipation piece 132, the fan 131 forms air flow inside the shell 110, the heat dissipation piece 132 is arranged on the air inlet side of the optical element 120, heat inside the shell 110 is transferred to the outside of the shell 110 through the heat dissipation piece 132, the air flow flows through the optical element 120, the temperature of the optical element 120 is reduced, and therefore the heat dissipation problem of the inside of the shell 110 and the optical element 120 can be solved, and the service life of the optical element 120 is prolonged.
Based on the above-mentioned inventive concept, an embodiment of the present disclosure provides a projection apparatus, please refer to fig. 1, fig. 2 and fig. 3, fig. 1 is a schematic diagram of the projection apparatus provided by the embodiment of the present disclosure, fig. 2 is an exploded view of the projection apparatus provided by the embodiment of the present disclosure, and fig. 3 is a side view of a projection light machine provided by the embodiment of the present disclosure. The projection apparatus includes a projection light machine 100 and a lens assembly 200, wherein the projection light machine 100 includes a housing 110, a plurality of optical elements 120, a heat dissipation assembly 130, an imaging chip 140 and a light source (not shown), the light source (not shown) is used for providing an illumination light beam, the plurality of optical elements 120 are disposed on an illumination light path, the imaging chip 140 is used for converting the illumination light beam into an image light beam, and the imaging chip 140 may be a liquid crystal reflective light valve (Liquid Crystal on Silicon, LCOS), a liquid crystal transmissive light valve (Liquid Crystal Display, LCD), a digital micromirror device (Digtial Micromirror Devices, DMD) or the like. The lens assembly 200 is disposed on the light-emitting side of the illumination light path of the projector 100 for projecting the image beam. Lens assembly 200 may include one or more optical lenses of the same or different diopters and various combinations thereof, including, for example, non-planar lenses such as biconcave lenses, biconvex lenses, meniscus lenses, convex-concave lenses, plano-convex lenses, and plano-concave lenses, and various combinations thereof. Of course, the lens assembly 200 may also include a planar optical lens to reflect or penetrate radiation to project the image beam out of the projection device. However, the present disclosure is not limited to the form of the lens assembly 200 and the kind thereof. The light source (not shown) comprises a laser diode, such as a laser diode array. However, the present disclosure is not limited thereto.
For a more clear description of the structure of the projector 100, the projector 100 will be described with reference to the accompanying drawings.
Referring to fig. 2 and 3, fig. 2 is an exploded view of a projection light engine according to an embodiment of the disclosure, and fig. 3 is a side view of the projection light engine according to an embodiment of the disclosure.
The projection light machine 100 provided in the embodiments of the present disclosure includes a housing 110, a plurality of optical elements 120 and a heat dissipation assembly 130, wherein an accommodating space 111 is formed in the housing 110, the plurality of optical elements 120 are disposed in the accommodating space 111 and located on an illumination light path, the heat dissipation assembly 130 includes a fan 131 and at least one heat dissipation member 132, the fan 131 is disposed in the accommodating space 111, the fan 131 is configured to provide an air flow circulating in the accommodating space 111 and passing through the optical elements 120, and the heat dissipation member 132 is disposed on the housing 110 and at least partially located on a flow path of the air flow and located on an air flow inlet side of one or more optical elements 120. It may also be understood that the fan 131 is installed in the housing 110 and located in the accommodating space 111, after the fan 131 is started, an air flow is formed in the accommodating space 111, the air flow flows through the optical element 120, heat of the optical element 120 is taken away by a thermal convection mode, the optical element 120 is cooled, the heat dissipation element 132 is disposed on the housing 110, the air flow flows through the heat dissipation element 132, the heat dissipation element 132 transfers the temperature in the housing 110 to the outside of the housing 110 by a thermal conduction mode, so as to cool the air flow, the heat dissipation element 132 is disposed before one, a plurality or all of the air inlet sides of the optical element 120, the air flow flowing through the optical element 120 is cooled by the heat dissipation element 132, and then flows through the optical element 120, so that more heat of the optical element 120 can be taken away, the heat dissipation effect of the optical element 120 is further improved, the optical element 120 is prevented from being damaged due to high temperature, and the service life of the optical element 120 is improved.
It can be understood that the projection optical engine 100 includes a housing 110, a plurality of optical elements 120 and a heat dissipation component 130, the housing 110 includes a body 112 with an opening at one side and a cover plate 113 plugged on the opening, the body 112 is a slot body, the body 112 and the cover plate 113 enclose an accommodating space 111, the plurality of optical elements 120 are installed in the body 112, the plurality of optical elements 120 may include a prism, a reflector, a galvanometer, a fly eye lens, etc., the specific type of the optical elements 120 may be designed according to the type of the projection apparatus, the plurality of optical elements 120 are all located on the illumination optical path for changing the propagation direction of the illumination beam, the heat dissipation component 130 includes a fan 131 and a heat dissipation element 132, the fan 131 may be an axial fan, a mini centrifugal fan or a piezoelectric ceramic fan, the number, power and model of the specific fan 131 may be different according to the size of the inner space of the housing 110, and the number of the heat dissipation element 132 may also be set according to the size of the accommodating space 111, which the present disclosure does not limit the number of the fan 131 and the heat dissipation element 132.
In some embodiments, the plurality of optical elements 120 includes a fly-eye lens 121 and a prism assembly 122 disposed in sequence on the illumination light path, and a heat sink 132 is disposed on the air flow entry side of the fly-eye lens 121 and/or the prism assembly 122. It may also be understood that, the several optical elements 120 in the present disclosure include a fly-eye lens 121 and a prism assembly 122, where the fly-eye lens 121 and the prism assembly 122 are mounted inside the housing 110, a light source is disposed at the front end of the fly-eye lens 121, and an illumination beam emitted by the light source is incident into the prism assembly 122 through the fly-eye lens 121, where the number of the fly-eye lenses 121 may be plural, the prism assembly 122 may also include plural prisms, and the number and disposed positions of the specific fly-eye lenses 121 and the prisms 122 may be different designs according to the model or type of the projection device, one heat sink 132 may be disposed, when one heat sink 132 is disposed, may be disposed on the air-flow entrance side of the fly-eye lens 121 or on the air-flow entrance side of the prism assembly 122, or on the air-flow entrance side of some prism or all prisms of the prism assembly 122 may be disposed according to the use requirement.
It is understood that a heat sink 132 may be provided, and the heat sink 132 may extend from the air inlet side of the fly-eye lens 121 to the air inlet side or the air outlet side of the prism assembly 122 to enhance the heat dissipation effect of the optical element 120.
On the basis of the above embodiment, the plurality of optical elements 121 further includes a reflector 123 located on the illumination light path, the light emitted from the fly-eye lens 121 is reflected by the reflector 123 and enters the prism assembly 122, the reflector 123 is located at one side of the fly-eye lens 121, and the prism assembly 122 is located at the air inlet side of the fan 131. It may also be understood that the plurality of optical elements 121 include a fly-eye lens 121, a reflecting mirror 123 and a prism assembly 122 disposed on the illumination light path, and the illumination light beam sequentially passes through the fly-eye lens 121, the reflecting mirror 123, the prism assembly 122 and the imaging chip 140 and then exits to the lens assembly 200 through the prism assembly 122. The imaging chip 140 in the above embodiment is an LCOS chip or a DMD chip. In other embodiments, the imaging chip 140 may also be an LCD chip. The air inlet of the fan 131 faces one side of the prism assembly 122, a heat dissipation member 132 is disposed between the air outflow side of the prism assembly 122 and the air inflow side of the fly-eye lens 121 to dissipate heat of the fly-eye lens 121, and another heat dissipation member 132 is disposed between the air outflow side of the reflector 123 and the air inflow side of the lens assembly 122 to dissipate heat of the lens assembly 122, it can be appreciated that the heat dissipation member 132 is disposed between the air outflow side of the fly-eye lens 121 and the air inflow side of the reflector 123 to dissipate heat of the reflector 123, and the heat dissipation effect of the optical element 120 is provided by disposing the heat dissipation member 132 on the air inflow side of the optical element 120, so that the service life of the optical element 120 is prolonged, the use of the fly-eye lens 121 made of plastic material in the high-brightness projector 100 is possible, and the cost of the projector 100 is reduced.
In some embodiments, the heat sink 132 includes a thermally conductive device 1320, the thermally conductive device 1320 being disposed on an inner surface of the housing 110. It may also be understood that, the heat conducting device 1320 extending toward the inside of the housing 110 is disposed on the inner surface of the housing 110, the heat conducting device 1320 is located on the flow path of the air flow, the heat conducting device 1320 transfers the heat of the air flow to the outside of the housing 110 in a heat conduction manner, so as to achieve cooling of the inside of the housing 110, the heat conducting device 1320 may be disposed on the air flow inlet side of one or more or each optical element 120, so that the air flow returns to a lower temperature after passing through the last optical element 120 after the temperature of the air flow rises, and then passes through the next optical element 120, thereby improving the heat dissipation effect of the optical element 120 and prolonging the service life of the optical element 120. In addition, a fan (not shown) may be disposed outside the housing 110, where the fan provides an air flow acting on the outside of the housing 110, the air flow outside the housing 110 flows through the outer surface of the housing 110, and the heat of the housing 110 is taken away by thermal convection, so that the air flow provided by the fan further improves the heat dissipation effect of the device 1323 and the heat dissipation device 141, improves the imaging effect of the imaging chip 140, reduces the temperature of the optical element 120, prolongs the service life of the optical element 120, and improves the performance of the projector 100.
In the above embodiment, the heat conducting device 1320 includes a plurality of fins 1321, and heat dissipation channels 1322 are formed between adjacent fins 1321, and the direction of the heat dissipation channels 1322 is parallel to the airflow method. It may also be understood that the heat conducting device 1320 includes a plurality of fins 1321 disposed at intervals, the fins 1321 are disposed on the inner surface of the housing 110, the fins 1321 extend toward the inside of the housing 110, the adjacent fins 1321 and the inner wall of the housing 110 enclose a slot-shaped heat dissipation channel 1322, the air flow generated by the fan 131 flows through the heat dissipation channel 1322, and the flow direction of the air flow in the heat dissipation channel 1322 is the same as the flow direction of the air flow flowing through the optical element 120, so that the air flow is prevented from being disturbed due to the heat conducting device 1320, and the heat dissipation effect of the optical element 120 is prevented from being affected. In addition, the length of the fin 1321 extends along the air flow direction, the fin 1321 may be located between the two optical elements 120, or may extend from the entrance side of one optical element 120 to the entrance side of the other optical element, the fin 1321 is made of a heat conductive material, the fin 1321 may be integrally formed with the housing 110 by injection molding, and as a deformation, the fin 1321 may also be bonded on the inner surface of the housing 110 by a heat conductive adhesive.
In some embodiments, heat dissipation element 132 further includes a heat dissipation element 1323, where heat dissipation element 1323 is disposed on an outer surface of housing 110, and heat conduction element 1320 and heat dissipation element 1323 are respectively located on two sides of the same portion of housing 110 (in other embodiments, only one of heat conduction element 1320 and heat dissipation element 1323 may be disposed). It may also be understood that, the heat conducting device 1320 extending toward the inside of the housing 110 is disposed on the inner surface of the housing 110, the heat conducting device 1320 is located on the air flow path, the heat dissipating device 1323 extending toward the outside of the housing 110 is disposed on the outer surface of the housing 110, the heat conducting device 1320 and the heat dissipating device 1323 are located on two sides of the same portion of the housing 110, the heat conducting device 1320 exchanges heat with the air flow in the housing 110 to transfer the heat in the housing 110 to the housing 110, the heat dissipating device 1323 exchanges heat with the external environment of the housing 110 to dissipate the heat of the housing 110, so as to reduce the temperature of the housing 110, reduce the influence of the heat dissipation problem on the optical element 120 and other devices in the housing 110, and improve the imaging effect of the projection device. In addition, a fan may be disposed outside the housing 110, where the fan provides an air flow acting on the outside of the housing 110, and the air flow outside the housing 110 flows through the heat dissipation device 1323, so that heat of the heat dissipation device 1323 is taken away by a thermal convection manner, and the heat dissipation effect of the housing 110 is further improved.
In particular, referring to fig. 4, fig. 4 is an axial view of a projection light engine according to an embodiment of the disclosure. The heat conducting device 1320 and the heat dissipating device 1323 have the same structure, each of which includes a plurality of fins 1321, the fins 1321 located inside the housing 110 are arranged at intervals, the adjacent fins 1321 and the inner wall of the housing 110 enclose a slot-shaped heat dissipating channel 1322, the air flow generated by the fan 131 flows through the heat dissipating channel 1322, and the flowing direction of the air flow in the heat dissipating channel 1322 is the same as the flowing direction of the air flow through the optical element 120, so that the air flow is prevented from being disturbed due to the obstruction of the air flow by the heat conducting device 1320, and the heat dissipating effect of the optical element 120 is prevented from being affected. The heat dissipation device 1323 includes a plurality of fins 1321 located at the outer side of the housing 110, the fins 1321 are spaced apart, the adjacent fins 1321 and the outer side of the housing 110 enclose a slot-shaped heat dissipation channel 1322, when a fan is disposed at the outer side of the housing 110, the direction of the air flow generated by the fan is the same as the direction of the heat dissipation channel 1322, so that the air flow disorder caused by the obstruction of the air flow at the outer side of the housing 110 by the heat dissipation device 1323 is avoided, and the heat dissipation effect of the optical element 120 is affected.
Referring to fig. 6, fig. 6 is a schematic diagram of a first arrangement of a first semiconductor refrigeration sheet according to an embodiment of the present disclosure.
In some embodiments, the heat dissipating assembly 130 further includes a first semiconductor cooling fin 133, the first semiconductor cooling fin 133 being disposed between the heat conducting device 1320 and the housing 110 and configured to conduct heat of the heat conducting device 1320 to the heat dissipating device 1323. It may also be understood that the heat dissipation assembly 130 includes a heat dissipation member 132 and a first semiconductor cooling fin 133, the heat conduction device 1320 is disposed on an inner surface of the housing 110, the first semiconductor cooling fin 133 is disposed on the inner surface of the housing 110, a hot surface of the first semiconductor cooling fin 133 is attached to the inner surface of the housing 110, a heat conduction pad (not shown) is disposed on an outer surface of the housing 110, a cold surface of the first semiconductor cooling fin 133 is attached to the heat conduction device 1320, the cold surface of the first semiconductor cooling fin 133 is attached to the heat conduction device 1320 through the heat conduction pad (not shown), that is, the cold surface of the first semiconductor cooling fin 133 is attached to the fin 1321 separated from the inner surface of the housing 110, and a micro air conditioning structure is formed by using the first semiconductor cooling fin 133, so that the air flow temperature flowing through the next optical element 120 is further reduced, the heat dissipation effect of the optical element 120 is improved, and the service life of the optical element 120 is prolonged.
It will be appreciated that when the heat dissipation device 1323 is not provided, the first semiconductor cooling fin 133 is disposed between the heat conduction device 1320 and the housing 110 and is used to conduct heat of the heat conduction device 1320 to the housing 110, the first semiconductor cooling fin 133 may be disposed on an inner surface or an outer surface of the housing 110, a fitting position of the first semiconductor cooling fin 133 on the housing 110 corresponds to a position of the heat conduction device 1320 on the housing 110, and the first semiconductor cooling fin 133 is used to cool the heat conduction device 1320, so that an air flow temperature flowing through the next optical element 120 is reduced, and a heat dissipation effect of the optical element 120 is improved.
Referring to fig. 7, fig. 7 is a schematic diagram of a second arrangement of first semiconductor refrigeration sheets according to an embodiment of the present disclosure.
In some embodiments, heat sink assembly 130 further includes a first semiconductor cooling fin 133, first semiconductor cooling fin 133 disposed between heat sink 1323 and housing 110, first semiconductor cooling fin 133 configured to conduct heat from heat conducting device 1320 to heat sink 1323. It may also be understood that, when the heat dissipation assembly 130 includes the heat dissipation component 132 and the first semiconductor cooling fin 133, the heat dissipation component 1323 is disposed on the outer surface of the housing 110, the first semiconductor cooling fin 133 is located between the heat dissipation component 1323 and the outer surface of the housing 110, and the first semiconductor cooling fin 133 and the heat conduction component 1320 are located on two sides of the same portion of the housing 110, the cold surface of the first semiconductor cooling fin 133 is attached to the outer surface of the housing 110, the first semiconductor cooling fin 133 is attached to the outer surface of the housing 110 through a heat conduction pad (not shown), the hot surface of the first semiconductor cooling fin 133 is attached to the heat dissipation component 1323, that is, the hot surface of the first semiconductor cooling fin 133 is attached to the fin 1321 separated from the outer surface of the housing 110, the heat conduction component 1320 transfers heat to the housing 110, so as to cool the heat dissipation component 1320, the hot surface of the first semiconductor cooling fin 133 transfers heat to the device 1323, and forms a micro air conditioner structure with the first semiconductor cooling fin 133, so as to further reduce the temperature of the airflow flowing through the next optical element 120, improve the heat dissipation effect of the optical element 120, and prolong the service life of the heat dissipation element 120.
In some embodiments, when the semiconductor refrigeration sheet is used to directly control the temperature of the imaging chip 140 in the prior art, because the imaging chip 140 is located at the inner part of the projection optical engine housing, it is difficult to seal the imaging chip 140 due to the optical path design requirement, so that the temperature of the imaging chip 140 is lower than the air temperature inside the projection optical engine housing, and the imaging chip is easy to generate a condensation phenomenon. By disposing the heat dissipation assembly 130 in the housing 110, the heat dissipation assembly 130 includes the fan 131, and the fan 131 forms an air flow inside the housing 110, and the air flow flows through the imaging surface of the imaging chip 140, thereby reducing the possibility of condensation. Referring to fig. 2, the projector 100 further includes an imaging chip 140, the imaging chip 140 is located on the air inlet side of the fan 131, the imaging surface of the imaging chip 140 is located on the air flow path, the imaging surface is parallel to the air flow direction, and one of the heat dissipation elements 132 is located on the air flow inlet side of the imaging chip 140.
Specifically, an opening is provided on the housing 110, the imaging chip 140 is mounted at the opening, the imaging surface of the imaging chip 140 is located in the housing 110, the imaging surface is located at one side of the lens assembly 122, the imaging chip 140 converts the illumination beam into an image beam, a heat dissipation device 141 for dissipating heat of the imaging chip 140 is provided at one side of the imaging chip 140 away from the imaging surface, the heat dissipation device 141 comprises heat insulation cotton 1412, a radiator 1411 and a second semiconductor refrigerating piece 1410, the cold surface of the second semiconductor refrigerating piece 1410 is attached to one side of the imaging chip 140, the hot surface of the second semiconductor refrigerating piece 1410 is attached to the radiator 1411, heat insulation cotton 1412 is provided around the second semiconductor refrigerating piece 1410, the second semiconductor refrigerating piece 1410 is separated from the housing 110, the second semiconductor refrigerating piece 1410 dissipates heat for the imaging chip 140, in the present disclosure, airflow is formed in the housing 110 through the heat dissipation assembly 130, the airflow flows through the imaging surface of the imaging chip 140, the phenomenon of the imaging surface of the imaging chip 140 is avoided, performance of the projection device is improved, in addition, the imaging chip 140 is arranged at the air inlet side of the fan 131, the heat dissipation piece 132 is located at the air inlet side of the imaging chip 140, the air flow enters the imaging device, the imaging device is further improved, the heat dissipation performance is improved, and the image device is further improved, and the image device is cooled by the heat dissipation performance is further improved.
Referring to fig. 5, fig. 5 is a schematic diagram of a heat conducting layer of a projection optical engine according to an embodiment of the disclosure.
In some embodiments, heat dissipation assembly 130 further includes a thermally conductive layer 134, one side of thermally conductive layer 134 being bonded to optical element 120 and the other side of thermally conductive layer 134 being bonded to housing 110; and/or, the optical element 120 is connected with the housing 110 through the fixing member 124, one side of the heat conducting layer 134 is attached to the optical element 120, and the other side of the heat conducting layer 134 is attached to the fixing member 124.
Specifically, the plurality of optical elements 121 include a fly-eye lens 121, a reflecting mirror 123 and a prism assembly 122, which are positioned on the illumination light path, and the illumination light beam is sequentially emitted to the lens assembly 200 through the prism assembly 122 after passing through the fly-eye lens 121, the reflecting mirror 123, the prism assembly 122 and the imaging chip 140, and the fly-eye lens 121 is connected with the housing 110 through the heat conducting layer 134, so that the heat conduction of the fly-eye lens 121 to the housing 110 is enhanced, the temperature of the fly-eye lens 121 is effectively reduced, the service life of the fly-eye lens 121 is prolonged, the use of the fly-eye lens 121 made of plastic materials in a high-brightness projection optical machine is possible, and the cost of the projection optical machine is reduced. The prism subassembly 122 is connected with the casing 110 through the mounting 124, the mounting 124 is shell fragment structure or draw-in groove structure, the shell fragment structure passes through the screw and is fixed with the casing 110, compare in prism subassembly 122 and the direct thermal resistance of heat conduction of casing 110 very high, set up heat conduction layer 134 between prism subassembly 122 and mounting 124 in this disclosure, increase the area of contact between prism subassembly 122 and the shell fragment structure, reduce the thermal resistance of heat conduction of prism subassembly 122 to casing 110, part heat of prism subassembly 122 passes through heat conduction layer 134 and transmits for mounting 124, transmit for casing 110 through mounting 124, scatter from the casing, further reduce the problem of prism subassembly 122. In addition, the material of the heat conducting layer 134 may be a compressible material such as heat conducting foam, a heat conducting pad volatilized by inorganic or organic matters, and heat conducting glue.
Referring to fig. 3 and 4, fig. 3 is a side view of a projection light engine according to an embodiment of the disclosure, and fig. 4 is an axial view of the projection light engine according to an embodiment of the disclosure.
In some embodiments, the heat sink assembly 130 further includes a flow guide 136, the flow guide 136 and the optical element 120 forming a flow channel 1360 between the optical element and the housing 110, and the air flow circulates in the flow channel 1360. It can be understood that the guide 136 is disposed in the housing 110, the guide 136 and the optical element 120 are disposed at intervals between the housing 110 and the housing 110, the guide 136 and the optical element 120 divide the accommodating space 111 in the housing 110 into a flow channel 1360 and a non-flow channel 1110, the fan 131 is mounted in the flow channel 1360, and the side wall of the flow channel 1360 utilizes the housing 110 and the optical element 120 reasonably by means of a part of the structure of the housing 110 and the accommodating space 111 inside the housing, so that the volume of the housing 110 is not required to be increased, the product structure is compact, and the installation and maintenance are convenient. As a modification, a flow channel 1360 may be formed inside the housing 110 by the flow guide 136, and the fan 131 and the optical element 120 are also mounted inside the flow channel 1360.
On the basis of the above embodiment, the plurality of optical elements 121 include the fly eye lens 121, the reflecting mirror 123 and the prism assembly 122 disposed on the illumination light path, the illumination light beam is sequentially emitted to the lens assembly 200 through the prism assembly 122 after passing through the fly eye lens 121, the reflecting mirror 123, the prism assembly 122 and the imaging chip 140, the guide 136 includes the first guide plate 1361 and the second guide plate 1362, the first guide plate 1361 is mounted on the housing 110, the first guide plate 1361 is disposed at a distance from the upper plate body of the housing 110, the prism assembly 122 and the fan 131 are disposed above the first guide plate 1361, the fan 131 is mounted on the upper surface of the first guide plate 1361, and the prism assembly 122 is disposed on the air inlet side of the fan 131, the lower surface of one end of the first guide plate 1361 has the plate body extending toward the side of the reflecting mirror 123, the extended plate body of the first deflector 1361 is connected with the upper end of the reflector 123 to prevent air flow from flowing out from the gap between the reflector 123 and the first deflector 1361, the lower surface of the other end of the first deflector 1361 is provided with a plate body extending to one side of the fly-eye lens 121, the extended plate body of the first deflector 1361 is connected with the upper end of the fly-eye lens 121 to prevent air flow from flowing out from the gap between the reflector 123 and the first deflector 1361, a second deflector 1362 is arranged between the lower end of the reflector 123 and the lower end of the fly-eye lens 121, two ends of the second deflector 1362 are respectively connected with the eyes of the reflector 123 and the fly-eye lens 121 to prevent air flow from flowing out from the gap between the reflector 123 and the end of the fly-eye lens 121 respectively and the end of the second deflector 1362, the structure of the deflector 136 is simple, the installation is convenient, and the occupied space is small.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
In the description of the present disclosure, the terms "first," "second," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features.
The foregoing has described in detail the projection light engine and projection device provided by the embodiments of the present disclosure, and specific examples have been applied herein to illustrate the principles and embodiments of the present disclosure, the above examples being provided only to assist in understanding the methods of the present disclosure and the core ideas thereof; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope in accordance with the ideas of the present disclosure, the present disclosure should not be construed as limiting the present disclosure in summary.
Claims (10)
1. A projection light engine, comprising:
a housing in which an accommodation space is formed;
a plurality of optical elements arranged in the accommodating space and positioned on the illumination light path;
a heat dissipation assembly including a fan and at least one heat dissipation member, wherein the fan is configured in the accommodating space, the fan is used for providing air flow circulating in the accommodating space and passing through the optical elements, and the heat dissipation member is arranged on the shell, at least partially positioned on the flowing path of the air flow and positioned on the air flow inlet side of one or more optical elements;
the heat dissipation assembly further comprises a flow guide piece, a flow channel is formed between the flow guide piece, the optical element and the shell, the air flow circularly flows in the flow channel, the flow guide piece comprises a first flow guide plate, the first flow guide plate is arranged on the shell, the first flow guide plate and the upper plate body of the shell are arranged at intervals, one optical element and a fan are positioned above the first flow guide plate, the lower surfaces of the two ends of the first flow guide plate are respectively provided with plate bodies extending towards the optical elements on the two sides, and the extending plate bodies of the first flow guide plate are connected with the optical elements on the two sides;
the heat sink includes a thermally conductive device disposed on an inner surface of the housing, the thermally conductive device disposed on an airflow-entry side of the or each optical element.
2. The projection light engine of claim 1, wherein the heat sink further comprises a heat sink device disposed on an outer surface of the housing, and the heat conducting device and the heat sink device are respectively disposed on two sides of the same portion of the housing.
3. The projection light engine of claim 2, wherein the heat sink assembly further comprises a first semiconductor cooling fin disposed between the heat sink and the housing; and/or the first semiconductor refrigeration piece is arranged between the heat conduction device and the shell, and the first semiconductor refrigeration piece is used for conducting heat of the heat conduction device to the heat dissipation device.
4. The projection light engine of claim 1, wherein the heat conducting device comprises a plurality of fins, and a heat dissipation channel is formed between adjacent fins, and the direction of the heat dissipation channel is parallel to the air flow direction.
5. The projector according to claim 1, wherein the plurality of optical elements includes a fly-eye lens and a prism assembly disposed in sequence on the illumination light path, and the heat sink is disposed on the air-flow entrance side of the fly-eye lens and/or the prism assembly.
6. The projection light engine of claim 5, wherein the plurality of optical elements further comprises a reflector positioned on the illumination light path, wherein the light rays emitted from the fly-eye lens are reflected by the reflector into the prism assembly, and wherein the prism assembly is positioned on the air intake side of the fan.
7. The projection light engine of claim 1, further comprising an imaging chip, the imaging chip being located on an air inlet side of the fan, an imaging surface of the imaging chip being located on a flow path of the air flow, the imaging surface being parallel to a flow direction of the air flow, wherein one of the heat dissipation elements is located on the air flow inlet side of the imaging chip.
8. The projection light engine of claim 1, wherein the heat dissipation assembly further comprises a heat conductive layer, one side of the heat conductive layer being attached to the optical element, the other side of the heat conductive layer being attached to the housing; and/or the optical element is connected with the shell through a fixing piece, one side of the heat conducting layer is attached to the optical element, and the other side of the heat conducting layer is attached to the fixing piece.
9. The projection light engine of claim 1, further comprising a fan disposed outside the housing, the fan providing an air flow acting on the outside of the housing.
10. A projection device comprising a lens assembly and a projection engine as claimed in any one of claims 1-9, said lens assembly being arranged on the light exit side of the illumination path of said projection engine.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210239187.5A CN114563902B (en) | 2022-03-11 | 2022-03-11 | Projection optical machine and projection equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210239187.5A CN114563902B (en) | 2022-03-11 | 2022-03-11 | Projection optical machine and projection equipment |
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| CN114563902B true CN114563902B (en) | 2023-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210239187.5A Active CN114563902B (en) | 2022-03-11 | 2022-03-11 | Projection optical machine and projection equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP7400787B2 (en) * | 2021-09-29 | 2023-12-19 | セイコーエプソン株式会社 | projector |
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| CN114563902A (en) | 2022-05-31 |
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