CN114563842A - A graded refractive index polymer waveguide and method of making the same - Google Patents

Abstract

The present application discloses a graded refractive index polymer waveguide and a manufacturing method thereof, including: providing a waveguide substrate with a base positioning hole; fabricating a polymer waveguide lower cladding on the surface of the waveguide substrate; The surface away from the waveguide substrate is coated with a waveguide core layer material with ultraviolet photosensitivity; the waveguide core layer material is thermally embossed with a flexible transfer film mold to form a waveguide core layer with an imprinted waveguide link structure; Conduct heat treatment on the waveguide core layer of the imprinted waveguide link structure; perform pre-exposure treatment on the heat-treated waveguide; coat the waveguide upper cladding on the surface of the waveguide core layer after the pre-exposure treatment; to cure. Through the above manufacturing method, the graded-index polymer waveguide with stable performance can be manufactured in batches, which has good economic benefits.

Description

A graded refractive index polymer waveguide and method of making the same

technical field

The invention relates to the technical field of optical waveguides, in particular to a graded refractive index polymer waveguide and a manufacturing method thereof.

Background technique

The polymer-based organic optical waveguide not only has the characteristics of excellent mechanical properties, good heat resistance, easy integration, adjustable refractive index, and highly flexible wiring, but also the preparation process is compatible with traditional PCB processing technology, which can meet the requirements of high-density and complex communication equipment. Requirements for interconnecting links, suitable for mass production.

Although a variety of polymer waveguide forming processes have been developed, most of them are based on photolithography, template replication and direct writing techniques, such as photobleaching, lithography, reactive ion etching, laser ablation, UV laser Direct writing technology, etc., the polymer waveguides prepared by the above process technologies are all step-type waveguides, and their cross-sections are often designed to be square or rectangular. And the sidewall roughness of these polymer waveguides tends to be larger, so the transmission loss is correspondingly larger. At the same time, in a dense waveguide link, due to the large roughness of the sidewall of the waveguide, the optical signal is scattered at the interface and enters the cladding area, so that the cladding mode is converted into the guided mode transmitted adjacent to the waveguide, that is, mode conversion occurs and cause serious crosstalk.

Compared with the step waveguide, the graded waveguide has a stronger binding ability to the optical signal, which can confine the optical signal to propagate near the centerline of the waveguide, thereby reducing the adverse effects caused by the roughness of the sidewall, thereby improving the isolation of the waveguide. Effectively reduce the crosstalk and loss of the waveguide. In addition, compared with the step-type waveguide, the transmission bandwidth of the graded waveguide is larger, and the coupling loss is smaller when coupled with the circular fiber. At the same time, the graded waveguide is also beneficial to shorten the propagation delay difference between the light of each transmission mode, and is beneficial to reduce the dispersion between different transmission modes. However, the fabrication methods of graded-index waveguides are still very limited.

For example, the method of fabricating a high-bandwidth parabolic graded-index waveguide using a polymer optical fiber preform in a cladding solution barrel by heating melt extrusion and interfacial gel technology requires the production of an optical fiber preform, which is not suitable for most polymerization However, there is a large gap between the spacing and the corresponding position of the extruded waveguides, and there are problems such as difficulty in coupling. Using special photosensitive materials to fabricate a polymer waveguide with a horizontal gradient of refractive index and a vertical step by optical addressing method, special waveguide materials need to be used in the fabrication process, and the fabrication cost is high, which is not suitable for mass production. The fabrication method of near-circular refractive index graded polymer waveguides prepared by 3D micro-hole direct writing technology has slow fabrication speed, many control factors, and the fabricated waveguides have large positional deviations, which is very difficult for the coupling between multi-channel waveguides and standard devices. It is difficult to achieve large-scale application.

SUMMARY OF THE INVENTION

In order to solve the technical problems of high manufacturing cost and incapability of mass production of graded waveguides in the prior art, the present application proposes a graded refractive index polymer waveguide and a manufacturing method thereof.

In order to solve the above problems, the present application provides a method for fabricating a graded-index polymer waveguide, including: providing a waveguide substrate with a base positioning hole; fabricating a polymer waveguide lower cladding layer on the surface of the waveguide substrate ; Coat the surface of the lower cladding layer of the waveguide away from the waveguide substrate with a waveguide core layer material with UV photosensitivity; use a flexible transfer film mold to hot emboss the waveguide core layer material to form a pressure-sensitive material. The waveguide core layer of the imprinted waveguide link structure is heat-treated; the heat-treated waveguide core layer is pre-exposed; the waveguide core layer after the pre-exposure is pre-exposed The surface is coated with a waveguide upper cladding layer; the waveguide core layer and the waveguide upper cladding layer are cured.

Preferably, the step of thermally embossing the waveguide core layer material with a flexible transfer film mold to form the waveguide core layer of the imprinted waveguide link structure with a plurality of grating lines includes: converting the flexible transfer film to the waveguide core layer. The imprinting mold is peeled off from the waveguide core layer to form the waveguide core layer of the imprinted waveguide link structure with a plurality of grating lines.

Preferably, the substrate is any one of FR-4 substrate, Si substrate, organic glass substrate and ITO glass substrate.

Preferably, the material of the flexible transfer film mold is any one of polydimethylsiloxane polymer and silicone rubber, the flexible transfer film mold has a grid-shaped groove, and the flexible transfer film mold The depth of the grooves of the film mold is similar to the thickness of the waveguide core layer, and the deviation between the two is in the range of 5 microns.

Preferably, the flexible transfer film mold is made by direct writing on the surface of any one of silicon-based glass, quartz glass, silicon wafer or metal by femtosecond laser.

Preferably, the core layer material is any one of siloxane-based polymer, epoxy-based polymer, acrylic/ester-based polymer or benzocyclobutene-based polymer.

Preferably, the waveguide core layer material forms a dry film under ultraviolet light irradiation, and the thickness of the dry film is in the range of 5-100 microns.

The present application also provides a graded-index polymer waveguide, the graded-index polymer waveguide comprising a waveguide substrate, a waveguide lower cladding layer, a waveguide core layer and a waveguide upper cladding layer,

The waveguide core layer has an imprinted waveguide link structure with a plurality of grating lines, which is arranged between the waveguide lower cladding layer and the waveguide upper cladding layer, and the waveguide upper cladding layer occurs at the imprinted waveguide link. Interface diffusion; wherein, the imprinted waveguide link structure of the waveguide core layer is thermally imprinted by a flexible transfer film mold.

Preferably, the waveguide lower cladding layer is arranged on the surface of the waveguide substrate, the waveguide core layer is arranged on the surface of the waveguide lower cladding layer away from the waveguide substrate, and the waveguide upper cladding layer is arranged away from the waveguide substrate. the surface of the waveguide core layer of the waveguide lower cladding layer.

Preferably, the waveguide substrate is any one of FR-4 substrate, Si substrate, plexiglass substrate or ITO glass substrate, and the waveguide core layer is siloxane-based polymer, epoxy resin Any one of acrylic polymer, acrylic/ester polymer or benzocyclobutene polymer.

The beneficial effects of the present application are: thermally imprinting the waveguide core layer with a flexible transfer film mold to form an imprinted waveguide link structure, and protecting the waveguide core layer by the waveguide upper cladding layer and the waveguide lower cladding layer, which can form a stable The graded refractive index polymer waveguide can be mass-produced, and the flexible transfer film mold and the waveguide core layer are easy to separate, and the flexible transfer film mold can be reused, which saves the cost of repeated production and has good economic effects.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.

FIG. 1 is a schematic flowchart of an embodiment of a method for fabricating a graded-index polymer waveguide according to the present application;

2a is a schematic structural diagram of a waveguide substrate of the present application;

FIG. 2b is a schematic structural diagram of a graded-index polymer waveguide comprising a waveguide lower cladding according to the present application;

FIG. 2c is a schematic structural diagram of a waveguide core layer material of the present application;

FIG. 2d is a schematic structural diagram of the alignment of the flexible transfer film mold and the waveguide core material of the present application;

FIG. 2e is a schematic structural diagram of the flexible transfer film mold and the waveguide core layer after lamination of the application;

2f is a schematic structural diagram of a graded-index polymer waveguide with an imprinted waveguide link structure of the present application;

2g is a schematic structural diagram of the imprinted waveguide core layer after heat treatment of the present application;

FIG. 2h is a schematic structural diagram of the imprinted waveguide core layer subjected to exposure treatment of the present application;

FIG. 2i is a schematic structural diagram of the graded-index polymer waveguide after coating the upper cladding layer of the waveguide according to the present application;

FIG. 3 is a schematic structural diagram of an embodiment of the graded refractive index polymer waveguide of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of this application.

The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. As used in the examples of this application and the appended claims, the singular forms "a," "the," and "the" are intended to include the plural forms as well, unless the above clearly dictates otherwise, "a plurality of" "Generally includes at least two, but does not exclude the case of including at least one.

It should be understood that the term "and/or" used in this document is only an association relationship to describe the associated objects, indicating that there may be three kinds of relationships, for example, A and/or B, which may indicate that A exists alone, and A and B exist at the same time. B, there are three cases of B alone. In addition, the character "/" in this document generally indicates that the related objects are an "or" relationship.

It should be understood that the terms "comprising", "comprising" or any other variation used herein are intended to encompass a non-exclusive inclusion such that a process, method, article or device comprising a series of elements includes not only those elements, but also Other elements not expressly listed or inherent to such a process, method, article or apparatus are also included. Without further limitation, an element defined by the phrase "comprises" does not preclude the presence of additional identical elements in a process, method, article, or device that includes the element.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearance of the phrase in each place in the specification is not necessarily all referring to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

As shown in FIG. 1 , FIG. 1 is a schematic flowchart of an embodiment of a method for fabricating a graded-index polymer waveguide according to the present application. The method includes the following steps:

Step S11: Provide a waveguide substrate with base positioning holes.

Referring further to FIG. 2a, FIG. 2a is a schematic structural diagram of a waveguide substrate. As shown in Fig. 2a, the waveguide substrate is a flat substrate. In this embodiment, the waveguide substrate has a base positioning hole, and the base positioning hole is used to fix the waveguide substrate and the graded-index polymer waveguide on the base plate. Designate the position to facilitate the flexible transfer film mold to emboss the designated position of the waveguide core layer. In this embodiment, a polymer waveguide with graded refractive index is fabricated on a waveguide substrate, and the material of the waveguide substrate is any one of FR-4 substrate, Si substrate, organic glass substrate and ITO glass substrate. Before fabricating the graded-index polymer waveguide on the surface of the waveguide substrate, it is necessary to perform ultrasonic cleaning or ion cleaning and surface activation treatment on the waveguide substrate.

Step S12: forming a polymer waveguide lower cladding layer on the surface of the waveguide substrate.

Please further refer to FIG. 2b. FIG. 2b is a schematic structural diagram of a graded-index polymer waveguide including a waveguide lower cladding layer. As shown in FIG. 2b, a waveguide lower cladding layer is coated on the surface of the waveguide substrate, and the waveguide lower cladding layer is A polymer film, in this embodiment, the thickness of the waveguide lower cladding film is between 5-100 microns, and in other embodiments, the thickness of the waveguide lower cladding film can be adjusted according to actual production requirements. The waveguide lower cladding layer can have interfacial diffusion with the waveguide core material at the interface junction.

Step S13 : coating the waveguide core layer material with UV photosensitivity on the surface of the lower cladding layer of the waveguide away from the waveguide substrate.

Please further refer to FIG. 2c, which is a schematic structural diagram of a waveguide core material. As shown in Figure 2c, a layer of UV-sensitive material is coated on the surface of the lower cladding layer of the waveguide to obtain a structural schematic diagram of the graded-index polymer waveguide including the waveguide core material. In this embodiment, the material of the waveguide core layer is a siloxane-based polymer, an epoxy-based polymer, and a methacrylic acid (ester)-based polymer, and may also be other materials in other embodiments. The waveguide core material has UV sensitivity and can form a dry film under UV light irradiation. In this embodiment, the waveguide core layer material can form a dry film with a thickness of 5-100 microns under ultraviolet light irradiation. In another embodiment, the thickness of the waveguide core layer can be adapted according to actual needs. Here Not limited.

Step S14 : thermally embossing the waveguide core layer material with a flexible transfer film mold to form a waveguide core layer having an imprinted waveguide link structure.

Please refer to Fig. 2d, Fig. 2e and Fig. 2f further. The waveguide core layer film is thermally embossed by a flexible transfer film mold, and the structure of the waveguide core layer with the imprinted waveguide link structure is obtained as shown in Fig. 2f. The specific fabrication process is shown in Figures 2d and 2e. The steps of using a flexible transfer film mold to thermally emboss the waveguide core layer material to form a waveguide core layer with an imprinted waveguide link structure include: the first step: The waveguide substrate is placed on a highly flat base, and the waveguide substrate is fixed in a designated position through the positioning holes on the waveguide substrate, so as to facilitate the alignment of the flexible transfer film mold. In the second step, the flexible transfer film mold is carefully placed on the conveyor belt of a flat-plate vacuum laminator with a plate surface alignment recognition system, and the mold is contacted with the surface of the polymer core film by a CCD positioning system to achieve precise Counterpoint. Please refer to FIG. 2d. FIG. 2d is a schematic structural diagram of the alignment of the flexible transfer film mold and the waveguide core layer material. The third step is to hot emboss the flexible transfer film mold and the substrate structure containing the waveguide core layer under a certain vacuum, temperature and pressure, so that the flexible transfer film mold and the waveguide core layer are closely attached and slowly sink into the waveguide core layer. In the material, the grooves of the flexible transfer film mold are completely filled with the waveguide core layer material, please refer to Figure 2e, which is a schematic structural diagram of the flexible transfer film mold and the waveguide core layer after lamination. The fourth step is to sufficiently cool the polymer waveguide substrate containing the waveguide core layer, and then peel off the flexible imprinted film mold from the polymer waveguide substrate to form an imprinted waveguide chain with multiple grating lines on the core layer film For the circuit structure, please refer to FIG. 2f, which is a schematic structural diagram of a graded-index polymer waveguide with an imprinted waveguide link structure.

In this embodiment, the flexible transfer film mold is made by direct writing on the surface of any one of silicon-based glass, quartz glass, silicon wafer or metal by ultrafast femtosecond laser. In other embodiments, it can be It is prepared by other methods, which is not limited here. Preferably, the thickness of the flexible transfer film mold is between 2-5 mm. The material of the flexible transfer film is any one of polydimethylsiloxane polymer or silicone rubber.

In this embodiment, the flexible transfer film has a reverse imprinted waveguide link structure, which can form an imprinted waveguide link structure with a plurality of grating lines on the surface of the waveguide core layer.

As a mold for making the waveguide core layer, the flexible transfer film mold has a plurality of grid-shaped grooves. In this embodiment, the depth of the grooves of the flexible transfer film mold is slightly larger than the thickness of the prefabricated waveguide core layer film. , the difference between the thickness of the flexible transfer film mold groove and the thickness of the waveguide core layer film is between 2-5 microns. In this embodiment, the width of the mold groove of the flexible transfer film is slightly smaller than the width of the prefabricated waveguide core layer. Preferably, the difference between the width of the flexible transfer film mold groove and the width of the prefabricated waveguide core layer is between 5-10 microns.

In this embodiment, using the soft lithography technology to process the polymer waveguide in step S14 is beneficial to realize the mass production of the polymer waveguide. The smooth sidewall interface layer makes it easier to separate the waveguide core layer from the flexible imprinting film mold, reducing the dependence of the waveguide sidewall on the high precision of the flexible imprinting film mold. In this embodiment, the waveguide core layer of the imprinted waveguide chain with smooth sidewalls can be obtained without a very fine flexible transfer film mold, which improves the production of imprinted waveguide chains while reducing the demand for fine templates. Road structure yield. In this embodiment, the method of directly imprinting the waveguide core layer film by an imprinting mold has a short production period, a simple preparation process, and a high production process precision, which is convenient to realize the Roll-to-Roll processing technology, and, in the processing process There is no need to use complex forming processes such as photolithography and dry etching, and the flexible transfer film used can be reused many times, which has good economic benefits.

Step S15: Heat treatment on the waveguide core layer having the imprinted waveguide link structure.

Please refer to Fig. 2g further, heat treatment is performed on the waveguide core layer with the imprinted waveguide link structure, so that the surface morphology of the waveguide core layer becomes a near-circular structure, the structure is shown in Fig. 2g, and Fig. 2g is the heat treatment. Schematic diagram of the structure of the imprinted waveguide core layer. In this embodiment, the waveguide core layer having the imprinted waveguide link structure is preferably heat-treated by using a thermal oven. In this embodiment, the topography of the surface of the waveguide core layer can be regulated under heating, so as to smooth the surface of the waveguide core layer and make the topography of the waveguide core layer form an approximately circular structure. In this embodiment, by heat-treating the waveguide core layer, the surface of the waveguide core layer and the surface in contact with the upper cladding layer of the waveguide form a near-circular structure, and the near-circular structure is still naturally formed after the interface diffuses, so as to facilitate the connection with the optical fiber. and other standard devices for coupling.

Step S16: Pre-exposure processing is performed on the heat-treated waveguide core layer.

Please further refer to FIG. 2h, which is a schematic structural diagram of the imprinted waveguide core layer subjected to exposure processing. A pre-exposure treatment is performed on the heat-treated imprinted waveguide core layer, so that the waveguide core layer is in a semi-cured state. On the one hand, the morphology of the waveguide can be restrained, and on the other hand, it can maintain good permeability, which is conducive to the interfacial diffusion between the core layer structure and the cladding material after the coating of the upper cladding layer, so as to form a gradient with a certain thickness refractive index layer. In this embodiment, preferably, UV equipment is used to apply a dose of 20-50% of the radiation energy required for complete curing of the imprinted waveguide adhesive to perform pre-exposure treatment.

In this embodiment, the waveguide core layer can be physically cured after heat treatment in step S15 , and the material of the waveguide core layer can be cross-linked and cured after pre-exposure treatment in step S16 to form a half The cross-linking product is cured so that the waveguide core layer and the waveguide cladding layer can diffuse at the interface interface. In this embodiment, the material of the waveguide core layer is cured by light and heat, so that the surface of the waveguide core layer forms a semi-cured near-circular structure. In other embodiments, thermal curing treatment or light curing treatment can be used alone to fix the surface of the waveguide core layer, and the specific implementation can be selected according to the material of the waveguide core layer, which is not limited herein.

Step S17 : coating a waveguide upper cladding layer on the surface of the waveguide core layer after the pre-exposure treatment.

Please refer to FIG. 2i further. FIG. 2i is a schematic structural diagram of the graded-index polymer waveguide after coating the upper cladding layer of the waveguide. Specifically, a layer of waveguide upper cladding is coated on the surface of the waveguide core layer, and the structure is shown in Figure 2i. In this embodiment, the material of the coated upper cladding layer of the waveguide and the material of the waveguide core layer can undergo interface diffusion under heating conditions, so that a waveguide core layer structure with gradient change in refractive index is formed at the interface of the waveguide core layer. In this embodiment, a graded refractive index layer with a certain thickness is formed by free diffusion of the waveguide core layer and the cladding material at the interface, thereby forming a polymer waveguide with a graded refractive index. The interfacial diffusion at the interface between the waveguide core layer and the waveguide cladding layer (mainly the lower cladding layer) is determined by its own material properties. The fabrication method of interfacial diffusion between the waveguide core layer and the waveguide cladding layer by heating is simple and easy to control. In the fabrication process, it is only necessary to control the curing process conditions of the core layer and the cladding layer to realize a polymer waveguide with graded refractive index.

Step S18: curing the waveguide core layer and the waveguide upper cladding layer.

Preferably, the waveguide core layer and the waveguide upper cladding layer are cured by ultraviolet light irradiation or heating, and after curing, a polymer waveguide with graded refractive index can be obtained.

The beneficial effects of this embodiment: the imprinted waveguide link structure is formed by thermally imprinting the waveguide core layer with a flexible transfer film mold, which can realize mass production of polymer waveguides, and the flexible transfer film mold can be reused, saving the flexibility of manufacturing The cost of the transfer film mold, in the process of forming the waveguide core layer with the imprinted waveguide link structure, the use of hot stamping can make the sidewall surface of the waveguide core layer smooth, thereby reducing the low-roughness waveguide fabrication. Mold dependency. In addition, the phenomenon of interface diffusion occurs at the interface of the semi-cured waveguide core layer and the waveguide cladding material to form a polymer waveguide with a nearly circular structure and a graded refractive index. The method is simple to operate, easy to control, and has good economic benefits.

The present application further provides a graded refractive index polymer waveguide, the structure of which is shown in FIG. 3 , and FIG. 3 is a schematic structural diagram of an embodiment of the graded refractive index polymer waveguide of the present application.

The graded-index polymer waveguide 30 includes a waveguide substrate 1 , a waveguide lower cladding layer 2 , a waveguide core layer 3 and a waveguide upper cladding layer 4 . The waveguide lower cladding layer 2 is located on the surface of the waveguide substrate 1, the waveguide core layer 3 is located on the surface of the waveguide upper cladding layer 4 away from the waveguide substrate 3, and the waveguide upper cladding layer 4 is located on the surface of the waveguide core layer 3 away from the waveguide substrate 1. The waveguide lower cladding layer 2 together forms a protective layer of the waveguide core layer 3 to wrap the waveguide core layer 3 . The waveguide core layer 3 has an imprinted waveguide link structure with multiple grating lines.

The material of the waveguide core layer 3 is any one of siloxane-based polymer, epoxy-based polymer, and methacrylic acid (ester)-based polymer, which has ultraviolet photosensitivity, and can form a certain thickness under ultraviolet light irradiation dry film. In this embodiment, the waveguide core layer 3 is a dry film composed of an imprinted waveguide link structure with a plurality of grating lines, and preferably, the thickness of the dry film is 5-100 microns. The imprinted waveguide link structure of the waveguide core layer 3 is made by hot imprinting with a flexible transfer film mold under certain vacuum, temperature and pressure. The imprinted waveguide links obtained by one-time hot embossing have the same structure, and can mass-produce the graded-index polymer waveguides, and the flexible transfer film mold can be used repeatedly, which greatly saves the production cost.

The flexible transfer film mold is made by a direct writing process, specifically, it is made by direct writing on the surface of glass or other substances by an ultra-fast femtosecond laser. In this embodiment, the transfer film mold may be a polydi Any material of methyl siloxane polymer and silicone rubber may be other materials in other embodiments. In this embodiment, the substrate for making the flexible transfer film mold can be made of silicon-based glass, quartz glass, silicon wafer, or metal.

Optionally, the material of the waveguide substrate 1 is any one of FR-4 substrate, Si substrate, organic glass substrate or ITO glass substrate. The side surface of the waveguide substrate 1 away from the upper cladding layer of the waveguide has a plurality of positioning holes for fixing the waveguide substrate on a highly flat base. The flexible transfer film mold also has alignment holes, which can fix the flexible transfer film mold on the conveyor belt of the flat-plate vacuum lamination machine of the alignment recognition system, and use the CCD positioning system to connect the flexible transfer film mold to the waveguide core layer film. Precise alignment is performed and the flexible transfer film mold is brought into contact with the surface of the waveguide core layer for thermal embossing. By positioning the positioning holes, the alignment position of the waveguide core layer and the flexible transfer film mold can be effectively controlled, so as to control the fabrication shape of the imprinted waveguide link structure and enable it to be mass-produced.

In this embodiment, preferably, the waveguide core layer is a dry film with a thickness of 5-100 microns. It can make the surface smooth by its own surface tension under the condition of heating.

The beneficial effects of this embodiment are: the graded-index polymer waveguide provided by this embodiment is not only simple to manufacture, but also has good mechanical properties, good heat resistance, and flexible wiring, which can meet the requirements of high-density and complex interconnection of communication equipment. link requirements.

The above descriptions are only the embodiments of the present application, and are not intended to limit the scope of patent protection of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present application, or directly or indirectly applied to other related The technical field is similarly included in the scope of patent protection of this application.

Claims (10)

1. A method for manufacturing a graded-index polymer waveguide,

providing a waveguide substrate with a base station positioning hole;

manufacturing a waveguide lower cladding on the surface of the waveguide substrate;

coating a waveguide core layer material with ultraviolet photosensitivity on the surface of the waveguide lower cladding layer far away from the waveguide substrate;

hot-embossing the waveguide core layer material by using a flexible transfer printing film mold to form a waveguide core layer with an embossed waveguide link structure;

carrying out heat treatment on the waveguide core layer with the imprinted waveguide link structure;

pre-exposing the waveguide core layer after the heat treatment;

coating a waveguide upper cladding on the surface of the waveguide core layer subjected to pre-exposure treatment;

and curing the waveguide core layer and the waveguide upper cladding layer.

2. The method of claim 1, wherein the step of hot embossing the waveguide core material with a flexible transfer film mold to form a waveguide core layer of an embossed waveguide link structure having a plurality of grating lines comprises:

and separating the flexible transfer printing film mold from the waveguide core layer to form the waveguide core layer of the imprinted waveguide link structure with a plurality of grating lines.

3. The method of claim 1, wherein the step of forming the graded-index polymer waveguide comprises,

the substrate is any one of an FR-4 substrate, a Si substrate, an organic glass substrate and an ITO glass substrate.

4. The method of claim 1, wherein the step of forming the graded-index polymer waveguide comprises,

the flexible transfer printing film mold is made of any one of polydimethylsiloxane polymer and silicone rubber, and is provided with a grid-type groove.

5. The method of claim 4, wherein the flexible transfer film mold is formed by direct writing on a surface of any one of silicon-based glass, quartz glass, silicon wafer, or metal by femtosecond laser.

6. The method of claim 1, wherein the step of forming the graded-index polymer waveguide comprises,

the waveguide core layer material is any one of siloxane polymers, epoxy resin polymers, acrylic acid/ester polymers or benzocyclobutene polymers.

7. The method of claim 1, wherein the waveguide core material is formed into a dry film under uv irradiation, the dry film having a thickness in the range of 5-100 μm.

8. A graded-index polymer waveguide comprising a waveguide substrate, a waveguide lower cladding, a waveguide core layer, and a waveguide upper cladding,

the waveguide core layer is provided with an embossed waveguide link structure with a plurality of grating lines, is arranged between the waveguide lower cladding layer and the waveguide upper cladding layer, and generates interface diffusion with the waveguide upper cladding layer at the embossed waveguide link;

the impressed waveguide link structure of the waveguide core layer is formed by hot-pressing a flexible transfer printing film mould.

9. The graded-index polymer waveguide of claim 8, wherein the waveguide lower cladding layer is disposed on a surface of the waveguide substrate, the waveguide core layer is disposed on a surface of the waveguide lower cladding layer remote from the waveguide substrate, and the waveguide upper cladding layer is disposed on a surface of the waveguide core layer remote from the waveguide lower cladding layer.

10. The index-graded polymer waveguide of claim 8,

the waveguide substrate is any one of an FR-4 substrate, a Si substrate, an organic glass substrate or an ITO glass substrate, and the waveguide core layer is any one of siloxane polymers, epoxy resin polymers, acrylic acid/ester polymers or benzocyclobutene polymers.

Images