KR101086784B1 - Method for optical interconnecting of Planar Lightwave Circuit device - Google Patents

Abstract

According to the present invention, a single planar optical circuit device and a groove for optical fiber alignment are simultaneously manufactured by using a single imprint mold in the manufacture of a planar lightwave circuit (PLC) device to enable optical coupling. An optical connection method of an optical circuit device, the method comprising: forming a circular replica first pattern using a circular silicon master, and forming a circular replication second pattern using a circular replication first pattern; Forming a lower clad using a second replica pattern; forming a core layer in a channel cavity of the lower clad and stacking an upper clad to form a planar optical circuit device chip; the circular replica first pattern Cutting the input and output terminals of the optical fiber and mounting the optical fiber in the groove; and aligning the groove on which the optical fiber is mounted with the planar optical circuit device chip. It includes; the step of the optical coupling.

Description

Method for optical interconnecting of Planar Lightwave Circuit device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a planar lightwave circuit (PLC) device. Specifically, a planar optical circuit device and a groove for optical fiber alignment are simultaneously manufactured using a single imprint mold so that optical coupling can be performed. An optical connection method of a planar optical circuit element.

Currently, planar lightwave circuit devices have been actively researched for high-speed processing of large amounts of information. Such research has attracted much attention in terms of device manufacturing technology using polymers from the viewpoint of low cost and high efficiency.

Currently, imprint technology is emerging among device manufacturing methods using polymers. Imprint technology is a technique that directly transfers a micro pattern by physically contacting a mold having a microstructure with a polymer, and is emerging as a next-generation process technology in micro / nano patterning technology with a simple process, a short process time, and a low process cost. It is becoming.

The pattern duplication by the imprint process is directly dependent on the mold, and can be realized up to several nm resolution. However, precise optical coupling technology between an optical source, a planar optical circuit device, and an optical detector is required to realize the function of the planar optical circuit device.

At present, the optical coupling technology is mainly progressed by bonding a V-groove or a U-groove in which a planar optical circuit type polymer optical device and an optical fiber are mounted.

The butt coupling method, which is the most common method of optical connection between a planar optical circuit device and an optical fiber, is illustrated in FIGS. 1 to 3.

1 shows an optical lithography process in a method for fabricating a planar optical circuit device of the prior art.

In the planar optical circuit device fabrication process, a photosensitive polymer is coated on a substrate, and a planar optical circuit device is manufactured by repeatedly performing a photo process, an etching process, and a coating of a polymer having optical properties.

Specifically, the formation of an adhesion promoter (adhesion promoter) to increase the adhesion on the substrate-> Under clad coating-> Core coating of optical properties-> Photo on the core layer Coating the resist (PR)-> Soft baking to evaporate and cure the solvent in the pot resist-> Photoresist exposure-> Exposure by irradiation with ultraviolet (UV) light using an exposure mask Post exposure baking-> Development & Inspection for Photoresist Pattern Formation-> Removal of Solvents, Moisture, Solvents, etc. remaining in the Photoresist Pattern without being dissolved during development Hardbaking-> Core etching using patterned photoresist pattern-> Removing photoresist pattern and core pattern development (Development & Inspection)-> Upper cladding A boot (Upper clad coating) and proceeds to the process of forming the optical element chip (Optical device chip).

2 shows an optical lithography process among the methods for fabricating grooves for optical fiber alignment.

The photosensitive polymer is coated in the same manner as in the process of FIG. 1, and the groove substrate for optical fiber alignment is manufactured by repeatedly performing a photo process and an etching process.

Specifically, in order to increase adhesion between the substrate and the photoresist, a HMDS (Hexamethyldisilazane) layer priming process is performed on the substrate .--> Photoresist (PR) is coated on the HMDS (Hexamethyldisilazane) layer. Soft baking for evaporating and curing the solvent-> Photoresist exposure-> post exposure baking by irradiation with Ultra Violet (UV) light using an exposure mask- -> Development & Inspection for Photoresist Pattern Formation-> Hard Baking to Remove Solvent, Water, Solvent, etc. Substrate etching using patterned photoresist pattern and removing photoresist pattern to form groove pattern (Development & Inspection & Groove) It is a row.

FIG. 3 illustrates a butt coupling method of directly bonding the planar optical circuit device chip fabricated in FIG. 1 and the groove substrate for optical fiber alignment fabricated in FIG. 2.

The butt coupling method fabricates a planar optical circuit device, fabricates a fiber groove having a pitch equal to a core pitch interval of the planar optical circuit device, and mounts optical fibers to planar optical circuits. Although bonding to the furnace element has an advantage of enabling precise optical coupling, a complex process of a planar optical circuit device fabrication process and a groove fabrication process is required.

The planar optical circuit device chip fabrication, groove fabrication, and optical coupling methods of the prior art as described above with reference to FIGS. There is a limit to the increase in costs.

Therefore, simple and high efficiency optical coupling research should be performed to realize optical characteristics of the polymer optical device.

The present invention is to solve the problems of the conventional groove fabrication, and optical coupling method, and to simplify the optical connection method of the optical fiber device chip and optical fiber for the fabrication of the planar optical circuit device, It is an object of the present invention to provide a planar optical circuit device chip manufacturing method.

 An object of the present invention is to fabricate a planar optical circuit device chip by an imprint process, and to use the imprinted pattern produced during the planar optical circuit device chip fabrication process as an optical fiber mounting groove. The purpose is to provide a connection method.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of optically connecting a planar optical circuit device by using a single imprint mold and simultaneously manufacturing a planar optical circuit device and a groove for optical fiber alignment to perform optical coupling. .

The optical connection method of a planar optical circuit device according to the present invention for achieving the above object is to form a circular replica first pattern using a circular silicon master (original master), a circular replication agent using a circular replication first pattern. Forming a lower clad using the circular replica second pattern; forming a core layer in a channel cavity of the lower clad and stacking an upper clad to form a planar optical circuit device chip Cutting the input and output ends of the circular replica first pattern and mounting an optical fiber in a groove; and aligning and optically coupling the groove on which the optical fiber is mounted and the planar optical circuit device chip. It is characterized by.

Here, the original silicon master (original master), characterized in that the positive type imprint master having a linear multi-channel or splitter (splitter) structure.

The circular replica first pattern may be formed by a hot embossing process using a thermoplastic polymer at a pressure of 10 bar to 30 bar at a temperature of 10 ° C. to 50 ° C. higher than the glass transition temperature of the thermoplastic polymer. .

The circular replica second pattern may be formed using a polydimethylsiloxane (PDMS) polymer material.

The forming of the lower cladding may include: applying a UV curable resin onto a surface of the circular replica second pattern, and performing an exposure process to ultraviolet rays to form the UV curable resin. ) Is hardened from a liquid state to a solid state.

The pattern manufactured by the UV curable resin restores the pattern shape and dimensions of the circular replica first pattern and is used as a lower clad of the planar optical circuit device chip.

The core of the optical fiber mounted on the groove and the planar optical circuit device chip have the same core dimension and pitch as those of the portion to which the groove is coupled.

The optical connection method of the planar optical circuit device according to the present invention has the following effects.

First, the planar optical circuit device chip fabrication process and the fiber groove fabrication process may be performed in a single imprint process.

Second, the process can be simplified by proceeding the planar optical circuit device chip fabrication process and the fiber groove fabrication process in a single imprint process.

Third, manufacturing the planar optical circuit device by a single imprint process has the effect of reducing process time and process cost.

Fourth, when applying a technology for manufacturing a planar optical circuit element by a single imprint process, it is possible to manufacture a precise fiber groove regardless of the type and core pitch of the planar optical circuit device.

1 is a process cross-sectional view for manufacturing a planar optical circuit device chip of the prior art.
2 is a cross-sectional view of a process for manufacturing fiber grooves for optical fiber alignment in the prior art.
3 is a block diagram showing an optical coupling configuration of a planar optical circuit element and an optical fiber of the prior art
4 is a process cross-sectional view for manufacturing a planar optical circuit device according to the present invention.

Hereinafter, a preferred embodiment of the optical connection method of the planar optical circuit device according to the present invention will be described in detail.

Features and advantages of the optical connection method of the planar optical circuit element according to the present invention will become apparent from the detailed description of each embodiment below.

4 is a cross-sectional view of a process for manufacturing a planar optical circuit device according to the present invention.

According to the present invention, a single imprint mold is used to simultaneously fabricate grooves for aligning a planar optical circuit and an optical fiber, thereby enabling optical coupling.

4 illustrates an optical coupling method of a planar optical circuit device according to an exemplary embodiment of the present invention, which has a silicon master having an 1x2 splitter structure and fabricates a 1x2 optical splitter. Explain.

First, as shown in (a) and (b) of FIG. 4, an imprint process of replicating a structure in a thermoplastic polymer is performed using a single imprint mold (original master).

That is, a circular replica first pattern 42 is formed by performing a hot embossing process on the thermoplastic polymer using the circular silicon master 41.

At this time, the circular silicon master 41 uses a positive type imprint master having a straight multichannel or splitter structure in which a pattern portion protrudes. The imprint process is performed at a pressure of 10 bar to 30 bar at a temperature of 10 ° C. to 50 ° C. higher than the glass transition temperature of the thermoplastic polymer.

In the embodiment of the present invention, a thermoplastic polymer material uses polymethylmethacrylate (PMMA) or polycarbonate (PC) having a glass transition temperature of 105 °, but is not limited thereto. Do.

Then, as shown in (c) of FIG. 4, using a replicated circular replica first pattern 42 is replicated in an elastomeric polymer pattern (PDMS stamp).

That is, the circular replica first pattern 42 in which the polymer pattern is present is used instead of the mold to replicate the elastic replica pattern to form the circular replica second pattern 43.

Here, the elastomer polymer is a polydimethylsiloxane (PDMS) polymer material.

At this time, the elastic polymer restores the dimensions and shape of the circular silicon master 41.

Here, the elastomeric polymer constituting the circular replication second pattern 43 can be easily separated from the circular replication first pattern 42 by the elastic property and low surface energy.

Subsequently, as shown in (d) (e) of FIG. 4, the structure is replicated with UV curable resin by using a circular replica second pattern 43 made of a replicated elastomeric polymer, instead of a mold, to planar photolithography. The bottom clad of the device is manufactured.

That is, the pattern is replicated with UV curable resin using the circular replica second pattern 43 to form a replication pattern 44 for use as a lower clad layer.

Here, the replication of the circular replica second pattern 43 by the UV curable resin is applied to the ultraviolet curable resin (UV curable resin) on the surface of the circular replication second pattern 43, and to the ultraviolet When the exposure process is performed, the UV curable resin is cured from the liquid state to the solid state.

At this time, the pattern manufactured by UV curable resin restores the pattern shape and dimensions of the circular replica first pattern 42 and is also used as the lower clad 44a of the planar optical circuit device chip. .

As shown in FIG. 4 (f), the filling of the core 45 and the upper clad 46 are made by using an ultraviolet curable resin in the manufactured lower clad 44a and a planar optical circuit. Form a device chip.

That is, an ultraviolet curable resin (UV curable resin) to be used as the core 45 is filled in the channel cavity of the manufactured lower clad 44a, and the upper clad 46 is laminated and then subjected to an ultraviolet exposure process. A planar optical circuit device chip is fabricated.

Here, the manufacturing of the upper clad 46 is the same as the manufacturing method of the lower clad 44a, but using a polymer sheet having no pattern.

Subsequently, as shown in FIG. 4 (g) (h), the input and output end portions of the circular replica first pattern 42 are cut and used as grooves of the optical fiber to form an optical fiber. ) And then fix it.

Here, the core dimensions and the pitches have the same characteristics at the input end and the output end of the circular replica first pattern 42 planar optical circuit device.

As shown in FIG. 4I, a groove in which the optical fiber 47 is mounted is optically coupled to align the input and output end portions of the planar optical circuit device chip, respectively.

In the optical coupling method of the planar lightwave circuit device of the present invention, a planar optical circuit device chip is manufactured by a process using a single imprint mold, and an imprinted pattern produced during the planar optical circuit device chip manufacturing process is manufactured. It can be used as a groove for fiber mounting.

It will be understood that the present invention is implemented in a modified form without departing from the essential features of the present invention as described above.

Therefore, the described embodiments should be considered in descriptive sense only and not for purposes of limitation, and the scope of the present invention is shown in the claims rather than the foregoing description, and all differences within the equivalent scope are included in the present invention. It should be interpreted.

41. Circular Silicon Master 42. Circular Replica First Pattern
43. Circular Replica Second Pattern 44a. Lower clad
45.Core 46.Upper Clad
47. Fiber

Claims (7)

Forming a circular replica first pattern using a circular silicon master and forming a circular replica second pattern using a circular replica first pattern;
Forming a bottom clad using the circular replica second pattern;
Forming a core layer in the channel cavity of the lower clad and stacking the upper clad to form a planar optical circuit device chip;
Cutting the input and output ends of the circular replica first pattern and mounting an optical fiber in a groove;
And aligning and optically coupling the groove on which the optical fiber is mounted and the planar optical circuit device chip. The method of claim 1, wherein the original silicon master (original master),
A positive connection type imprint master having a linear multichannel or splitter structure. The method of claim 1, wherein the circular replica first pattern,
A method of optically connecting a planar optical circuit device using a thermoplastic polymer material, by hot embossing at a pressure of 10 bar to 30 bar at a temperature of 10 ° C. to 50 ° C. higher than the glass transition temperature of the thermoplastic polymer. The method of claim 1, wherein the circular replica second pattern is formed using a polydimethylsiloxane (PDMS) polymer material. The method of claim 1, wherein forming the lower cladding,
Applying UV curable resin onto the surface of the circular replica second pattern,
And a process of curing the ultraviolet curable resin from a liquid state to a solid state by performing an exposure process to ultraviolet rays. The pattern made by the UV curable resin restores the pattern shape and dimensions of the circular replica first pattern and is used as a lower clad of the planar optical circuit device chip. Optical connection method of planar optical circuit element. The optical connection method of claim 1, wherein the optical fiber mounted on the groove and the core of the planar optical circuit device chip have the same core dimension and pitch as that of the portion to which the groove is coupled.

Images