CN114563598A

CN114563598A - Alignment adjustment method, device and equipment

Info

Publication number: CN114563598A
Application number: CN202011353894.4A
Authority: CN
Inventors: 熊海军; 沈洪星; 张作军; 刘晏
Original assignee: Hefei Sineva Intelligent Machine Co Ltd
Current assignee: Hefei Sineva Intelligent Machine Co Ltd
Priority date: 2020-11-27
Filing date: 2020-11-27
Publication date: 2022-05-31

Abstract

The invention discloses a method, a device and equipment for aligning and adjusting, which are used for realizing high-precision alignment of a jig on a product under the condition of lower hardware installation precision. The method comprises the following steps: adjusting the position of the current jig so that the position and the COF product have a fixed position relation; controlling the jig to move to an initial position, and controlling each pin of the jig to be aligned with the center of each exposure point pad of the COF product according to the pre-acquired moving offset of the jig; the initial position is the position of the jig determined according to the position of a pin which is positioned in the pad area and is not aligned with the center of the pad; the quantity and the distribution rule of each pin needle of the jig are the same as those of each pad; the moving offset is determined by deviation values between pin needles of the jig located at the initial position and corresponding mark points on the pad on the COF product, which are acquired by a microscope.

Description

Alignment adjustment method, device and equipment

Technical Field

The invention relates to the technical field of display detection of semiconductor products and liquid crystal panels, in particular to a method, a device and equipment for alignment adjustment.

Background

For the semiconductor industry or the liquid crystal panel display industry, generally, in the automatic production of Chip On Film (COF) products, a detection device performs open circuit/short circuit detection on the COF products through electrical detection before welding Integrated Circuit (IC) chips, and determines whether defective products are generated, the detection premise is that a sensor needs to be detected to be aligned with a circuit, so that alignment of a jig and the COF products needs to be realized by using alignment adjustment equipment, and alignment of the sensor and the circuit is finally realized. The jig is loaded with a plurality of tiny pin needles, and the position distribution of the pin needles is consistent with the distribution of the Pad of the COF product. The electrical detection is mainly to contact the circuit Pad through a tiny Pin needle, and the judgment of circuit open circuit and short circuit is obtained through comparing the voltage waveform of receiving voltage with the voltage waveform of discharging voltage.

At present, the commonly used counterpoint adjustment mode is to shoot pin and Pad simultaneously through counterpoint camera, image through shooting directly reads pin coordinate and Pad coordinate, judge whether tool and product point position keep at same position, when using the camera to acquire positional information, if the precision of camera can't satisfy the counterpoint precision of tool and product, because the precision that camera directly reads pin coordinate and Pad coordinate can introduce the camera and the precision of camera motion axis, and also can't guarantee pin and Pad alignment owing to the precision influence of other mechanical structure that the control camera removed after the camera aligns, then can't accurately realize the counterpoint of tool and product, thereby can't accurately carry out electrical detection.

Disclosure of Invention

The invention provides a method, a device and equipment for aligning and adjusting, which are used for realizing high-precision alignment of a jig on a product under the condition of lower hardware installation precision, effectively improving the alignment precision and accelerating the development cycle of the equipment.

In a first aspect, an alignment adjustment method provided in an embodiment of the present invention includes:

adjusting the position of the current jig so that the position and the COF product have a fixed position relation;

controlling the jig to move to an initial position, and controlling each pin of the jig to be aligned with the center of each exposure point pad of the COF product according to the pre-acquired moving offset of the jig;

the initial position is the position of the jig determined according to the position of a pin which is positioned in the pad area and is not aligned with the center of the pad; the quantity and the distribution rule of each pin needle of the jig and each pad are the same; the moving offset is determined by deviation values between pin needles of the jig located at the initial position and corresponding mark points on the pad on the COF product, which are acquired by a microscope.

The moving offset in the embodiment of the invention is measured by a microscope, so that the alignment adjustment can be carried out aiming at smaller circuits, the high-precision alignment of the jig is realized, the development cycle of the product is finally accelerated, the design and manufacturing cost of the product is reduced, and the difficulty in part processing, assembly and debugging is reduced.

As an alternative embodiment, the movement offset is determined by:

controlling the jig to move to a position where the at least two pins are completely aligned with the corresponding mark points according to the distance between the at least two pins and the corresponding mark points on the at least two pads, wherein the distance is determined through a microscope, and the line position relationship between the pads corresponding to the at least two pins is fixed;

and determining the movement offset of the jig according to the total amount of the jig moving on the X axis, the Y axis and the theta axis respectively, wherein the theta axis is used for representing the rotation angle of the jig on the plane formed by the X axis and the Y axis.

As an alternative embodiment, it is determined that the at least two pins are completely aligned with the corresponding marker points by:

if an alignment instruction is received, determining that the at least two pin needles are completely aligned with the corresponding mark points; and/or the presence of a gas in the gas,

and determining that the at least two pin needles are completely aligned with the corresponding mark points by measuring voltage or current based on a circuit loop formed by completely aligning the pin needles with the pad.

As an optional implementation, adjusting the position of the current jig includes:

and adjusting the positions of at least two CCD cameras which have a preset fixed position relation with the current jig so as to align the vision center of the CCD cameras with at least two mark points on the COF product respectively.

As an optional implementation manner, determining the movement offset of the jig according to the total amount of movement of the jig in the X axis, the Y axis, and the θ axis respectively includes:

determining the total amount of movement of the jig on the X axis as the movement offset on the X axis;

determining the total amount of the jig moving on the Y axis as the movement offset on the Y axis;

and determining the total amount of the jig moving on the theta axis as the movement offset on the theta axis.

In a second aspect, an alignment adjustment apparatus provided in an embodiment of the present invention includes:

the adjusting unit is used for adjusting the position of the current jig so that the position and the COF product have a fixed position relation;

the control unit is used for controlling the jig to move to an initial position and controlling each pin of the jig to be aligned with each exposure point pad center of the COF product according to the pre-acquired movement offset of the jig; the initial position is the position of the jig determined according to the position of a pin which is positioned in the pad area and is not aligned with the center of the pad; the quantity and the distribution rule of each pin needle of the jig and each pad are the same; the moving offset is determined by deviation values between pin needles of the jig located at the initial position and corresponding mark points on the pad on the COF product, which are acquired by a microscope.

As an optional implementation manner, the control unit is specifically configured to determine the movement offset by:

and determining the movement offset of the jig according to the total amount of the jig moving on the X axis, the Y axis and the theta axis respectively, wherein the theta axis is used for representing the rotation angle of the jig on a plane formed by the X axis and the Y axis.

As an optional implementation manner, the control unit is specifically configured to determine that the at least two pin needles are completely aligned with the corresponding mark points by:

As an optional implementation manner, the adjusting unit is specifically configured to:

As an optional implementation manner, the control unit is specifically configured to determine, according to total amounts of movement of the jig in the X axis, the Y axis, and the θ axis, a movement offset of the jig:

In a third aspect, an embodiment of the present invention further provides a bit alignment adjustment apparatus, including a processor and a memory, where the memory is used to store a program executable by the processor, and the processor is used to read the program in the memory and execute the following steps:

controlling the jig to move to an initial position, and controlling each pin of the jig to be aligned with the center of each exposure point pad of the COF product according to the pre-acquired moving offset of the jig; the initial position is the position of the jig determined according to the position of a pin which is positioned in the pad area and is not aligned with the center of the pad; the quantity and the distribution rule of each pin needle of the jig and each pad are the same;

the moving offset is determined by deviation values between pin needles of the jig located at the initial position and corresponding mark points on the pad on the COF product, which are acquired by a microscope.

As an optional implementation, the processor is specifically configured to determine the movement offset by:

As an alternative embodiment, the processor is specifically configured to determine that the at least two pins are completely aligned with the corresponding marking points by:

As an optional implementation, the processor is specifically configured to:

As an optional implementation manner, the processor is specifically configured to determine, according to total amounts of movement of the jig in the X axis, the Y axis, and the θ axis respectively, a movement offset of the jig:

In a fourth aspect, an embodiment of the present invention further provides a computer storage medium, on which a computer program is stored, where the computer program is used to implement the steps of the method in the first aspect when the computer program is executed by a processor.

These and other aspects of the present application will be more readily apparent from the following description of the embodiments.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments will be briefly introduced below, and it is apparent that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings may be obtained according to the drawings without inventive labor.

Fig. 1 is a flowchart of an alignment adjustment method according to an embodiment of the present invention;

fig. 2 is a schematic view of a COF product according to an embodiment of the present invention;

fig. 3 is a flowchart of a specific alignment adjustment method according to an embodiment of the present invention;

fig. 4 is a schematic diagram illustrating an alignment adjustment apparatus according to an embodiment of the present invention;

fig. 5 is a schematic diagram of an alignment adjusting apparatus according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The term "and/or" in the embodiments of the present invention describes an association relationship of associated objects, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.

The application scenario described in the embodiment of the present invention is for more clearly illustrating the technical solution of the embodiment of the present invention, and does not form a limitation on the technical solution provided in the embodiment of the present invention, and it can be known by a person skilled in the art that with the occurrence of a new application scenario, the technical solution provided in the embodiment of the present invention is also applicable to similar technical problems. In the description of the present invention, the term "plurality" means two or more unless otherwise specified.

Example 1

Alignment adjustment of a jig is a method for aligning the jig with a product in the process of detecting the open circuit/short circuit of the product circuit by detection equipment. In the automatic production of COF products, detection equipment is used for detecting products before welding IC chips, mainly performing circuit disconnection/short circuit detection and confirming whether defective products are generated in the equipment of the previous process such as cutting and cleaning of an exposure machine. The common alignment mode of the jig is to achieve a high-precision mounting position of the jig by improving the precision of mechanical parts and structures, and then to realize the alignment of the jig and a product through the alignment function of the CCD image alignment system. If the alignment function of the CCD image alignment system can not meet the alignment precision of the jig and the product, the hardware precision of the equipment needs to be improved, and the mounting precision of the jig (the mounting precision of the jig on the equipment) or the positioning precision of a COF product relative to the jig (the positioning precision of the COF product relative to the jig in the working process of the equipment) is repeatedly adjusted to achieve the purpose of aligning the jig and the product.

The electrical detection applied to the semiconductor industry or the liquid crystal panel display industry generally carries out open-circuit and short-circuit detection on a circuit, a jig type detection generally applies an electrified loop at two ends of the circuit, one end of the electrified loop discharges electricity, a plurality of tiny pin needles are loaded on the jig, and the position distribution of the pin needles is consistent with the distribution of a product Pad. The electrical detection is mainly to contact the circuit Pad through a tiny Pin needle, and the judgment of circuit open circuit and short circuit is obtained through comparing the voltage waveform of receiving voltage with the voltage waveform of discharging voltage. But along with the circuit is more and more tiny, the counterpoint between tool and the product requires more and more highly, and current counterpoint adjustment technique can use multiple complementary unit to lead to the error to add up much and installation debugging precision to realize the degree of difficulty through the mode that the point location coordinate directly reads or carries out coordinate conversion through theoretical analysis.

In order to solve the above technical problems, embodiments of the present invention provide an alignment adjustment method, which can be applied to detect a line with a smaller circuit and a narrower pitch, can improve the yield of a product, avoid waste of defective products in a subsequent process due to a previous process, and provide more circuit detection result suggestions for the previous process to improve process parameters.

As shown in fig. 1, an embodiment of the present invention provides a method for adjusting alignment, which can be applied to a CCD image alignment system that cannot meet the requirement of alignment accuracy, and the method of the present embodiment is used to implement high-accuracy alignment adjustment, and the implementation flow of the method is as follows:

step 100, adjusting the position of the current jig so that the position and the COF product have a fixed position relationship;

step 101, controlling the jig to move to an initial position, and controlling each pin of the jig to align with the center of each exposure point pad of the COF product according to the pre-acquired movement offset of the jig; the initial position is the position of the jig determined according to the position of a pin which is positioned in the pad area and is not aligned with the center of the pad; the quantity and the distribution rule of each pin of the jig are the same as those of each pad, and the pins of the jig are designed and manufactured according to the distribution rule of the pads of the COF product; the moving offset is determined by a deviation value between a pin needle of the jig at the initial position acquired by a microscope and a mark point on a pad of a corresponding COF product.

It should be noted that, in the embodiment of the present invention, before the jig is controlled to move to the initial position, the position of the jig needs to be adjusted, and since there may be a deviation in the position where different products are placed each time, the position of the jig needs to be adjusted first, so that the positional relationship between the position of the jig and the COF product is fixed, and it is ensured that the movement offset of the jig relative to each product is fixed.

As an optional embodiment, controlling the alignment of each pin needle of the jig with each exposure point pad of the COF product includes:

and controlling at least two pin needles of the jig to be aligned with the mark points at the centers of at least two pads of the COF product corresponding to the pin needles one by one, wherein the line position relationship between the at least two pads is fixed.

As an optional implementation manner, the position of the current jig is adjusted by the following method:

and adjusting the positions of at least two CCD cameras which have a preset fixed position relation with the current jig so as to respectively align the center of the visual field of the CCD cameras with at least two mark points on the COF product.

Optionally, the initial position in the embodiment of the present invention is a position of the jig determined according to a position of a pin needle that is located in the pad area and is not aligned with the center of the pad; in the implementation, it can be determined by the CCD image alignment system that the jig moves to the initial position, and the jig and the COF product have a deviation, which is implemented as follows:

1) if the COF product reaches the position to be detected, performing coarse positioning;

specifically, whether the mark point of the COF product is in the visual field range of a CCD image alignment system (namely whether the mark point is in the visual field range of a CCD camera) is judged, if so, the following steps are executed when the coarse positioning precision meets the requirement, and if not, the coarse positioning is executed;

optionally, the number of the mark points is at least two, and the line position relationship between any two mark points is fixed.

2) Determining that the jig moves to an initial position through a CCD camera;

specifically, the CCD image alignment system aligns the mark points of the COF product, and controls a jig which has a preset fixed position relation with the camera to move to an initial position, wherein the initial position is the position of the jig where the pin of the jig and the mark points of the COF product have deviation.

It is easy to understand that, the number and the distribution rule of the pins of the jig in this embodiment are the same as those of the pads of the COF product; namely, the pin needles of the jig can correspond to the pads one by one.

Optionally, the COF product in the embodiment of the present invention includes at least two mark points, where any mark point is located on a pad, and the standard for aligning the jig with the COF product is determined by aligning pin needles of the jig with the mark points, and since the number and the distribution rule of the pin needles of the jig and the pads of the COF product are the same, at least two pin needles are required to be aligned with the mark points of the pads at corresponding positions, so that it can be said that the jig is aligned with the COF product.

As an optional implementation manner, in the embodiment of the present invention, the movement offset is determined by:

1) controlling the jig to move to the position where the at least two pins are completely aligned with the corresponding mark points according to the distance between the at least two pins and the corresponding mark points on the at least two pads;

wherein the distance is determined by a microscope, and the line position relationship between the pads corresponding to the at least two pins is fixed;

it should be noted that the pad in this embodiment may be a circular area, and the complete alignment of the pin and the pad means that the pin is aligned with the central point of the pad, that is, the pin can contact with the central point of the pad, the mark point may be a cross, and the intersection point of the mark point is the central point of the pad.

In the implementation, whether the pin mark is aligned with the COF product Pad or not is observed by using a microscope, and a certain deviation exists in a visual observation mode by using the microscope, but the deviation value is in a controllable range after the deviation value is amplified by using the microscope. In one case, if the microscope cannot calculate and measure the deviation value, the X-axis, Y-axis and θ -axis adjustments are performed after estimating the deviation value by visual observation, and the jig may be moved by controlling the jig several times to align the jig pin with the COF product Pad. Another kind of condition is, if the microscope possesses the communication intelligence function, can directly read the deviation value, then according to the direct pin that acquires of microscope and the distance between the mark point on the pad that corresponds, adjust the tool and align with the COF product.

Optionally, it is determined that the at least two pin needles are completely aligned with the corresponding marker points by:

the method 1, if an alignment instruction is received, determining that the at least two pins are completely aligned with the corresponding mark points;

and the alignment instruction is sent out after the pin marks of the at least two pin needles are completely aligned with the corresponding mark points according to the determination of a microscope, wherein the pin marks are generated by the transparent materials which are pricked on the corresponding mark points through the pin needles.

Specifically, the flexible transparent adhesive tape can be bonded on a product, a certain pin mark can be formed above the flexible transparent adhesive tape by the aid of a pin binding jig, and a microscope is used for observing whether the pin mark is aligned with a Pad of a COF product.

And 2, determining that the at least two pin needles are completely aligned with the corresponding mark points by measuring voltage or current based on a circuit loop formed by completely aligning the pin needles with the pads.

In implementation, based on a circuit loop formed by the pin and the pad being completely aligned, if a voltage signal is applied to one end of the circuit and a signal related to the voltage signal is received at the other end of the circuit, it is determined that the pin and the pad are completely aligned.

And 3, if an alignment instruction is received and a circuit loop formed by completely aligning the pin needle and the pad is based on, determining that the at least two pin needles are completely aligned with the corresponding mark points by measuring voltage or current.

2) Determining the movement offset of the jig according to the total amount of movement of the jig on the X axis, the Y axis and the theta axis respectively;

wherein the theta axis is used for representing the rotation angle of the jig on a plane formed by the X axis and the Y axis.

In practice, if the jig is moved X times on the X axis, Y times on the Y axis, and θ times on the θ axis, the total amount of movement on the X axis, the Y axis, and the θ axis, i.e., the total distance moved X times on the X axis, the total distance moved Y times on the Y axis, and the total angle moved θ times on the θ axis, respectively, need to be calculated. Wherein x, y and theta are integers or decimal numbers which are more than or equal to zero.

As an optional implementation manner, controlling the jig to move to a position where the at least two pins are completely aligned with the corresponding mark points according to the distance between the at least two pins and the corresponding mark points on the at least two pads includes the following steps:

if the distance between the pin needles and the corresponding mark points is larger than a preset value, controlling the jig to move to the position where the at least two pin needles are completely aligned with the corresponding mark points according to a first step length, wherein the jig can be controlled to move for multiple times, and can also be controlled to move for one time, and the specific moving times are determined by the distance and the first step length;

if the distance between the pin needles and the corresponding mark points is smaller than a preset value, controlling the jig to move to a position where the at least two pin needles are completely aligned with the corresponding mark points according to a second step length, wherein the jig can be controlled to move for multiple times, and can also be controlled to move for one time, and the specific moving times are determined by the distance and the first step length;

wherein the second step size is smaller than the first step size.

As an alternative implementation manner, in the embodiment of the present invention, the movement of the jig in the X axis, the Y axis, and the θ axis is controlled by motors in the X axis, the Y axis, and the θ axis.

In the specific implementation process, after a COF product to be detected reaches a position to be detected, firstly, determining that a mark point of the COF product is located in the visual field range of a CCD image alignment system, then, initially aligning the mark point of the COF product through the CCD image alignment system, at the moment, because the accuracy does not meet the requirement, the jig and the COF product are not aligned and still have deviation, and finally, driving the jig to move along the directions of an X axis, a Y axis and a theta axis through motors of the X axis, the Y axis and the theta axis so as to reach the center of the mark point of the COF product and align with the center of the visual field of a camera of the CCD image alignment system.

Embedding the determined distance delta X moving along the X-axis direction, the determined distance delta Y moving along the Y-axis direction and the determined angle delta theta moving along the theta-axis direction into a software program, wherein before embedding the delta X, the delta Y and the delta theta into the software program, a motor encoder needs to be ensured to be positioned at a zero-point reference point, and a subsequent motor return point needs to be positioned at the zero-point reference point.

Optionally, the software program may be a PLC program or a PC control program, so that the CCD image alignment system cooperates with the X-axis motor, the Y-axis motor, and the θ -axis motor to work, and first, the alignment between the center of the product mark point and the center of the camera view of the CCD image alignment system is completed, and then the X-axis motor, the Y-axis motor, and the θ -axis motor drive the jig to move Δ X, Δ Y, and Δ θ, respectively, so that the jig pin and the COF product Pad are aligned, and the high-precision alignment between the jig pin and the product Pad is completed.

As shown in fig. 2, the embodiment of the invention provides a schematic view of a COF product, where 200 represents that a jig pin and a Pad are in an aligned state and is a pin position, and a region 201 represents the Pad.

As shown in fig. 3, an embodiment of the present invention further provides a specific alignment adjustment method, which includes the following steps:

300, determining that the COF product to be detected reaches the position to be detected;

step 301, adjusting the position of the current jig so that the position has a fixed position relationship with the COF product;

step 302, controlling the jig to move to an initial position, wherein the initial position is the position of the jig determined according to the position of a pin which is located in the pad area and is not aligned with the center of the pad;

303, acquiring a deviation value between a pin needle of the jig positioned at the initial position and a mark point on a pad of a corresponding COF product through a microscope;

step 304, controlling the jig to move on the corresponding coordinate axis according to the deviation value;

wherein the coordinate axes comprise an X axis, a Y axis and a theta axis;

305, determining the movement offset of the jig according to the total amount of the jig moving on the X axis, the Y axis and the theta axis respectively;

and step 306, controlling each pin of the jig to be aligned with each exposure point pad of the COF product according to the initial position of the jig and the moving offset.

Example 2

Based on the same inventive concept, the embodiment of the present invention further provides a position alignment apparatus, and since the apparatus is the apparatus in the method in the embodiment of the present invention, and the principle of the apparatus to solve the problem is similar to that of the method, the implementation of the apparatus may refer to the implementation of the method, and repeated details are not repeated.

As shown in fig. 4, the apparatus includes:

an adjusting unit 400, configured to adjust a position of a current jig so that the position and a COF product have a fixed position relationship;

a control unit 401, configured to control the jig to move to an initial position, and control, according to a movement offset of the jig obtained in advance, each pin of the jig to align with each exposure point pad of the COF product; the initial position is the position of the jig determined according to the position of a pin which is positioned in the pad area and is not aligned with the center of the pad; the quantity and the distribution rule of each pin needle of the jig and each pad are the same; the moving offset is determined by deviation values between pin needles of the jig located at the initial position and corresponding mark points on the pad on the COF product, which are acquired by a microscope.

As an optional embodiment, the control unit is specifically configured to determine that the at least two pin needles are completely aligned with the corresponding mark points by:

Example 3

Based on the same inventive concept, the embodiment of the present invention further provides a device for adjusting alignment, and since the device is a device in the method in the embodiment of the present invention, and the principle of the device for solving the problem is similar to that of the method, the implementation of the device may refer to the implementation of the method, and repeated details are not repeated.

As shown in fig. 5, the apparatus comprises a processor 500 and a memory 501 for storing programs executable by the processor, the processor being configured to read the programs in the memory and to perform the following steps:

As an optional implementation, the processor is specifically configured to determine that the at least two pin needles are completely aligned with the corresponding marker points by:

and determining that the at least two pin needles are completely aligned with the corresponding mark points by measuring voltage or current based on a circuit loop formed by completely aligning the pin needles with the pads.

As an optional implementation manner, the processor is specifically configured to:

An embodiment of the present invention further provides a computer storage medium, on which a computer program is stored, where the computer program, when executed by a processor, implements the following steps:

As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, optical storage, and the like) having computer-usable program code embodied therein.

The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.

These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.

These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. An alignment adjustment method, comprising:

2. The method of claim 1, wherein the movement offset is determined by:

3. The method of claim 2, wherein the at least two pin needles are determined to be fully aligned with the corresponding marker points by:

4. The method of claim 1, wherein adjusting the position of the current fixture comprises:

5. The method of claim 2, wherein determining the amount of movement offset of the fixture based on the total amount of movement of the fixture in the X-axis, Y-axis, and θ -axis, respectively, comprises:

6. An alignment adjustment device, comprising:

the control unit is used for controlling the jig to move to an initial position and controlling each pin of the jig to be aligned with each exposure point pad center of the COF product according to the pre-acquired movement offset of the jig; the initial position is the position of the jig determined according to the position of a pin which is positioned in the pad area and is not aligned with the center of the pad; the quantity and the distribution rule of the pin needles of each jig are the same as those of the pads; the moving offset is determined by deviation values between pin needles of the jig located at the initial position and corresponding mark points of the pad on the COF product, which are acquired by a microscope.

7. The apparatus according to claim 6, wherein the control unit is specifically configured to determine the movement offset by:

8. A registration adjustment apparatus, comprising a processor and a memory, wherein the memory is used for storing programs executable by the processor, and wherein the processor is used for reading the programs in the memory and executing the following steps:

9. The device of claim 8, wherein the processor is specifically configured to determine the movement offset by:

10. A computer storage medium having a computer program stored thereon, the program, when executed by a processor, implementing the steps of the method according to any one of claims 1 to 5.