CN114560636A - 一种低反特清中性色三银低辐射镀膜玻璃及制备方法 - Google Patents
一种低反特清中性色三银低辐射镀膜玻璃及制备方法 Download PDFInfo
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- 229910052709 silver Inorganic materials 0.000 title claims abstract description 28
- 239000004332 silver Substances 0.000 title claims abstract description 28
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 15
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Abstract
本发明提供了一种低反特清中性色三银低辐射镀膜玻璃及制备方法,属于磁控溅射镀膜技术领域;一种低反特清中性色三银低辐射镀膜玻璃,包括玻璃基片层和镀膜层,镀膜层自玻璃基片层向外依次复合有十六个膜层,其中第一层为第一电介质层,第二层为第一低辐射层,第三层为第一阻挡保护层,第四层、第五层和第六层组成第二电介质层,第七层为第二低辐射层,第八层为第三低辐射层,第九层为第二阻挡保护层,第十层、第十一层和第十二层组成第三电介质层,第十三层为第四低辐射层,第十四层为第二阻挡保护层,第十五层为第三电介质层,第十六层为抗划伤耐摩擦层。本发明玻璃呈中性色,且具有光透性优良等优点。
Description
技术领域
本发明属于磁控溅射镀膜技术领域,具体涉及一种低反特清中性色三银低辐射镀膜玻璃及制备方法。
背景技术
作为一种优良的建筑材料,玻璃由于其良好的通透性,具有透光防风雪的功能,被广泛应用于建筑上。随着现代科技水平的发展,玻璃被赋予各种新的内涵,其中low-E玻璃以其美观大方的颜色、较好的质感以及优良的节能特性,在建筑幕墙领域已受到广泛应用。Low-E玻璃又称低辐射玻璃,常使用磁控溅射法在玻璃基片表面沉积出纳米膜层,进而改变玻璃的光学、电学、机械和化学等方面的性能,达到装饰、节能、环保等目的。
作为节能建筑材料,low-E玻璃的节能特性与普通玻璃及热反射镀膜玻璃相比,Low-E玻璃对远红外辐射具有极高的反射率。可保持室内温度稳定,减少建筑加热或制冷的能耗,起到了非常优秀的节能降耗作用。而特清Low-E玻璃在保障绝佳的保温性能的同时具有较高的可见光透射率,所以采光效果好,适用于北方寒冷地区和部分地域的高通透性建筑,突出自然采光效果。现有技术的缺点:
1)现有高透三银低辐射镀膜玻璃透过颜色仍难以满足客户需求。
2)现有高透三银膜系普遍存在耐氧化性差,单片保存时间短。
发明内容
本发明的目的是针对现有的技术存在的上述问题,提供一种低反特清中性色三银低辐射镀膜玻璃及制备方法,本发明所要解决的技术问题是如何通过镀膜层排列及镀膜工艺的优化设计,使整个镀膜玻璃呈中性色,且具有良好的光透性。
本发明的目的可通过下列技术方案来实现:一种低反特清中性色三银低辐射镀膜玻璃,其特征在于,本镀膜玻璃包括玻璃基片层和镀膜层,所述镀膜层自所述玻璃基片层向外依次复合有十六个膜层,其中第一层为第一电介质层,第二层为第一低辐射层,第三层为第一阻挡保护层,第四层、第五层和第六层组成第二电介质层,第七层为第二低辐射层,第八层为第三低辐射层,第九层为第二阻挡保护层,第十层、第十一层和第十二层组成第三电介质层,第十三层为第四低辐射层,第十四层为第二阻挡保护层,第十五层为第三电介质层,第十六层为抗划伤耐摩擦层。
在上述一种低反特清中性色三银低辐射镀膜玻璃,所述第一层为ZnAlOx层,镀膜厚度为5到20纳米;所述第二层为Ag层,镀膜厚度为3到10纳米;所述第三层为AZO层,镀膜厚度为5到8纳米;所述第四层为SiNx层,镀膜厚度为30到45纳米;所述第五层为ZnSnOx层,镀膜厚度为15到20纳米;所述第六层为ZnAlOx层,镀膜厚度为15到20纳米;所述第七层为Ag层,镀膜厚度为2到10纳米;所述第八层为Cu层,镀膜厚度为2到10纳米;所述第九层为AZO层,镀膜厚度为5到8纳米;所述第十层为SiNx层,镀膜厚度为30到50纳米;所述第十一层为ZnSnOx层,镀膜厚度为20到30纳米;所述第十二层为ZnAlOx层,镀膜厚度为15到25纳米;所述第十三层为Ag层,镀膜厚度为4到10纳米;所述第十四层为AZO层,镀膜厚度为5到8纳米;所述第十五层为ZnAlOx层,镀膜厚度为30到50纳米;所述第十六层为ZrOx层,镀膜厚度为5到10纳米。
本镀膜玻璃的镀膜层中,除了设有三个银(Ag)层外,还有一铜(Cu)层,使得其低辐射层达到四层,节能效果更佳;更重要的,其中膜系中央,设有紧贴的银(Ag)层与铜(Cu)层同时搭配其他各膜层材料及厚度的设计,使得其整个镀膜玻璃呈中性色;再者,本镀膜玻璃采用AZO层替代氧化镍铬作为本镀膜玻璃的阻挡保护层,使其在具有对本镀膜玻璃中低辐射层保护、防止其氧化的同时克服了氧化镍铬具有吸光的弊端,使本镀膜玻璃具有高透过、低反射性能;最后,本镀膜玻璃中,镀膜层的最外层采用氧化锆材料,使其整个膜系的抗氧化、耐磨性能得到大幅提升。
在上述一种低反特清中性色三银低辐射镀膜玻璃中,其制备方法包括如下步骤:
1)、磁控溅射镀膜层;
A、磁控溅射第一层:
靶材数量:交流旋转靶1~2个;靶材配置为锌铝(ZnAl);工艺气体比例:氩气和氧气,氩气和氧气的比例为1.1.8;溅射气压为3~5×10-3mbar;
B、磁控溅射第二层:
靶材数量:直流平面靶1个;靶材配置为银(Ag);工艺气体比例:纯氩气;溅射气压为2~3×10-3mbar;
C、磁控溅射第三层:
靶材数量:交流旋转靶1个;靶材配置氧化锌铝(ZnAlOx);工艺气体比例:纯氩气;溅射气压为3~5×10-3mbar;
D、磁控溅射第四层:
靶材数量:交流旋转靶5~6个;靶材配置为硅铝(SiAl);工艺气体比例:氩气和氧气,氩气和氧气的比例为1.0.75;溅射气压为3~5×10-3mbar;
E、磁控溅射第五层:
靶材数量:交流旋转靶2~3个;靶材配置为锌锡(ZnSn);工艺气体比例:氩气和氧气,氩气和氧气的比例为1:1.8;溅射气压为2~3×10-3mbar;
F、磁控溅射第六层:
靶材数量:交流旋转靶2~3个;靶材配置为锌铝(ZnAl);工艺气体比例:氩气和氧气,氩气和氧气的比例为1:1.8;溅射气压为3~5×10-3mbar;
G、磁控溅射第七层:
靶材数量:直流平面靶1个;靶材配置为银(Ag);工艺气体比例:纯氩气;溅射气压为2~3×10-3mbar;
H、磁控溅射第八层:
靶材数量:交流旋转靶1个;靶材配置为铜(Cu);工艺气体比例:纯氩气;溅射气压为2~3×10-3mbar;镀膜厚度为5~10nm;
I、磁控溅射第九层:
靶材数量:交流旋转靶1个;靶材配置为氧化锌铝(ZnAlOx);工艺气体比例:纯氩气;溅射气压为2~3×10-3mbar;
J、磁控溅射第十层:
靶材数量:交流旋转靶4~6个;靶材配置硅铝(SiAl);工艺气体比例:氩气和氮气,氩气和氮气的比例为1:0.75;溅射气压为3~5×10-3mbar;
K、磁控溅射第十一层:
靶材数量:交流旋转靶2~3个;靶材配置为锌锡(ZnSn);工艺气体比例:氩气和氧气,氩气和氧气的比例为1:1.8;溅射气压为2~3×10-3mbar;
L、磁控溅射第十二层:
靶材数量:交流旋转靶2~3个;靶材配置为锌铝(ZnAl);工艺气体比:氩气和氧气,氩气和氧气的比例为1:1.8;溅射气压为3~5×10-3mbar;
M、磁控溅射第十三层:
靶材数量:直流平面靶1个;靶材配置为银(Ag);工艺气体比:纯氩气;溅射气压为2~3×10-3mbar;
N、磁控溅射第十四层:
靶材数量:交流旋转靶1个;靶材配置为氧化锌铝(ZnAlOx);工艺气体比:纯氩气;溅射气压为3~5×10-3mbar;
O、磁控溅射第十五层:
靶材数量:交流旋转靶5~6个;靶材配置为硅铝(SiAl);工艺气体比:氩气和氮气,氩气和氮气的比例为1:0.75;溅射气压为3~5×10-3mbar;
P、磁控溅射第十六层:
靶材数量:交流旋转靶1个;靶材配置为硅铝(SiAl);工艺气体比:氩气和氮气,氩气和氮气的比例为1:0.04;溅射气压为3~5×10-3mbar;
2、总膜层厚度控制在189-334nm,一般溅射室传动走速控制在4.0-5.0m/min。
由于本镀膜玻璃的膜层透过率较高,使用超白玻璃原片生产时产品室外观察多角度为中性灰色。
本发明优点:
1、本专利技术产品6mm单片超白玻璃透过率60%-70%。
2、多角度外观颜色为中性色,其中透过色a*∈[0,-2],b*∈[-0.5,2.5];膜面颜色a*∈[+1,-5],b*∈[+1,-5];玻面颜色a*∈[+1,-1],b*∈[-5,-8];玻面小角度颜色a*∈[+1,-1],b*∈[0,-3]。
3、耐氧化性能好,车间放置实验,时间大于120小时(湿度≥70%,温度≥20℃)。
附图说明
图1是本低辐射镀膜玻璃层状结构示意图。
图中,G、玻璃基片层;1、第一层;2、第二层;3、第三层;4、第四层;5、第五层;6、第六层;7、第七层;8、第八层;9、第九层;10、第十层;11、第十一层;12、第十二层;13、第十三层;14、第十四层;15、第十五层;16、第十六层。
具体实施方式
以下是本发明的具体实施例并结合附图,对本发明的技术方案作进一步的描述,但本发明并不限于这些实施例。
如图1所示,一种低反特清中性色三银低辐射镀膜玻璃,包括玻璃基片层G和镀膜层,镀膜层自玻璃基片层G向外依次复合有十六个膜层,其中第一层1为第一电介质层,第二层2为第一低辐射层,第三层3为第一阻挡保护层,第四层4、第五层5和第六层6组成第二电介质层,第七层7为第二低辐射层,第八层8为第三低辐射层,第九层9为第二阻挡保护层,第十层10、第十一层11和第十二层12组成第三电介质层,第十三层13为第四低辐射层,第十四层14为第二阻挡保护层,第十五层15为第三电介质层,第十六层16为抗划伤耐摩擦层。
第一层1为ZnAlOx层,镀膜厚度为5到20纳米;第二层2为Ag层,镀膜厚度为3到10纳米;第三层3为AZO层,镀膜厚度为5到8纳米;第四层4为SiNx层,镀膜厚度为30到45纳米;第五层5为ZnSnOx层,镀膜厚度为15到20纳米;第六层6为ZnAlOx层,镀膜厚度为15到20纳米;第七层7为Ag层,镀膜厚度为2到10纳米;第八层8为Cu层,镀膜厚度为2到10纳米;第九层9为AZO层,镀膜厚度为5到8纳米;第十层10为SiNx层,镀膜厚度为30到50纳米;第十一层11为ZnSnOx层,镀膜厚度为20到30纳米;第十二层12为ZnAlOx层,镀膜厚度为15到25纳米;第十三层13为Ag层,镀膜厚度为4到10纳米;第十四层14为AZO层,镀膜厚度为5到8纳米;第十五层15为ZnAlOx层,镀膜厚度为30到50纳米;第十六层16为ZrOx层,镀膜厚度为5到10纳米。
本镀膜玻璃的镀膜层中,除了设有三个银(Ag)层外,还有一铜(Cu)层,使得其低辐射层达到四层,节能效果更佳;更重要的,其中膜系中央,设有紧贴的银(Ag)层与铜(Cu)层同时搭配其他各膜层材料及厚度的设计,使得其整个镀膜玻璃呈中性色;再者,本镀膜玻璃采用AZO层替代氧化镍铬作为本镀膜玻璃的阻挡保护层,使其在具有对本镀膜玻璃中低辐射层保护、防止其氧化的同时克服了氧化镍铬具有吸光的弊端,使本镀膜玻璃具有高透过、低反射性能;最后,本镀膜玻璃中,镀膜层的最外层采用氧化锆材料,使其整个膜系的抗氧化、耐磨性能得到大幅提升。
在上述一种低反特清中性色三银低辐射镀膜玻璃中,其制备方法包括如下步骤:
1)、磁控溅射镀膜层;
A、磁控溅射第一层1:
靶材数量:交流旋转靶1~2个;靶材配置为锌铝(ZnAl);工艺气体比例:氩气和氧气,氩气和氧气的比例为1.1.8;溅射气压为3~5×10-3mbar;
B、磁控溅射第二层2:
靶材数量:直流平面靶1个;靶材配置为银(Ag);工艺气体比例:纯氩气;溅射气压为2~3×10-3mbar;
C、磁控溅射第三层3:
靶材数量:交流旋转靶1个;靶材配置氧化锌铝(ZnAlOx);工艺气体比例:纯氩气;溅射气压为3~5×10-3mbar;
D、磁控溅射第四层4:
靶材数量:交流旋转靶5~6个;靶材配置为硅铝(SiAl);工艺气体比例:氩气和氧气,氩气和氧气的比例为1.0.75;溅射气压为3~5×10-3mbar;
E、磁控溅射第五层5:
靶材数量:交流旋转靶2~3个;靶材配置为锌锡(ZnSn);工艺气体比例:氩气和氧气,氩气和氧气的比例为1:1.8;溅射气压为2~3×10-3mbar;
F、磁控溅射第六层6:
靶材数量:交流旋转靶2~3个;靶材配置为锌铝(ZnAl);工艺气体比例:氩气和氧气,氩气和氧气的比例为1:1.8;溅射气压为3~5×10-3mbar;
G、磁控溅射第七层7:
靶材数量:直流平面靶1个;靶材配置为银(Ag);工艺气体比例:纯氩气;溅射气压为2~3×10-3mbar;
H、磁控溅射第八层8:
靶材数量:交流旋转靶1个;靶材配置为铜(Cu);工艺气体比例:纯氩气;溅射气压为2~3×10-3mbar;镀膜厚度为5~10nm;
I、磁控溅射第九层9:
靶材数量:交流旋转靶1个;靶材配置为氧化锌铝(ZnAlOx);工艺气体比例:纯氩气;溅射气压为2~3×10-3mbar;
J、磁控溅射第十层10:
靶材数量:交流旋转靶4~6个;靶材配置硅铝(SiAl);工艺气体比例:氩气和氮气,氩气和氮气的比例为1:0.75;溅射气压为3~5×10-3mbar;
K、磁控溅射第十一层11:
靶材数量:交流旋转靶2~3个;靶材配置为锌锡(ZnSn);工艺气体比例:氩气和氧气,氩气和氧气的比例为1:1.8;溅射气压为2~3×10-3mbar;
L、磁控溅射第十二层12:
靶材数量:交流旋转靶2~3个;靶材配置为锌铝(ZnAl);工艺气体比:氩气和氧气,氩气和氧气的比例为1:1.8;溅射气压为3~5×10-3mbar;
M、磁控溅射第十三层13:
靶材数量:直流平面靶1个;靶材配置为银(Ag);工艺气体比:纯氩气;溅射气压为2~3×10-3mbar;
N、磁控溅射第十四层14:
靶材数量:交流旋转靶1个;靶材配置为氧化锌铝(ZnAlOx);工艺气体比:纯氩气;溅射气压为3~5×10-3mbar;
O、磁控溅射第十五层15:
靶材数量:交流旋转靶5~6个;靶材配置为硅铝(SiAl);工艺气体比:氩气和氮气,氩气和氮气的比例为1:0.75;溅射气压为3~5×10-3mbar;
P、磁控溅射第十六层16:
靶材数量:交流旋转靶1个;靶材配置为硅铝(SiAl);工艺气体比:氩气和氮气,氩气和氮气的比例为1:0.04;溅射气压为3~5×10-3mbar;
2、总膜层厚度控制在189-334nm,一般溅射室传动走速控制在4.0-5.0m/min。
由于本镀膜玻璃的膜层透过率较高,使用超白玻璃原片生产时产品室外观察多角度为中性灰色。
本文中所描述的具体实施例仅仅是对本发明精神作举例说明。本发明所属技术领域的技术人员可以对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代,但并不会偏离本发明的精神或者超越所附权利要求书所定义的范围。
Claims (3)
1.一种低反特清中性色三银低辐射镀膜玻璃,其特征在于,本镀膜玻璃包括玻璃基片层(G)和镀膜层,所述镀膜层自所述玻璃基片层(G)向外依次复合有十六个膜层,其中第一层(1)为第一电介质层,第二层(2)为第一低辐射层,第三层(3)为第一阻挡保护层,第四层(4)、第五层(5)和第五层(6)组成第二电介质层,第七层(7)为第二低辐射层,第八层(8)为第三低辐射层,第九层(9)为第二阻挡保护层,第十层(10)、第十一层(11)和第十二层(12)组成第三电介质层,第十三层(13)为第四低辐射层,第十四层(14)为第二阻挡保护层,第十五层(15)为第三电介质层,第十六层(16)为抗划伤耐摩擦层。
2.根据权利要求1所述一种低反特清中性色三银低辐射镀膜玻璃,其特征在于,所述第一层(1)为ZnAlOx层,镀膜厚度为5到20纳米;所述第二层(2)为Ag层,镀膜厚度为3到10纳米;所述第三层(3)为AZO层,镀膜厚度为5到8纳米;所述第四层(4)为SiNx层,镀膜厚度为30到45纳米;所述第五层(5)为ZnSnOx层,镀膜厚度为15到20纳米;所述第五层(6)为ZnAlOx层,镀膜厚度为15到20纳米;所述第七层(7)为Ag层,镀膜厚度为2到10纳米;所述第八层(8)为Cu层,镀膜厚度为2到10纳米;所述第九层(9)为AZO层,镀膜厚度为5到8纳米;所述第十层(10)为SiNx层,镀膜厚度为30到50纳米;所述第十一层(11)为ZnSnOx层,镀膜厚度为20到30纳米;所述第十二层(12)为ZnAlOx层,镀膜厚度为15到25纳米;所述第十三层(13)为Ag层,镀膜厚度为4到10纳米;所述第十四层(14)为AZO层,镀膜厚度为5到8纳米;所述第十五层(15)为ZnAlOx层,镀膜厚度为30到50纳米;所述第十六层(16)为ZrOx层,镀膜厚度为5到10纳米。
3.一种制备权利要求1或权利要求2所述的低反特清中性色三银低辐射镀膜玻璃的方法,其特征在于,本方法包括如下步骤:
1)、磁控溅射镀膜层;
A、磁控溅射第一层(1):
靶材数量:交流旋转靶1~2个;靶材配置为锌铝(ZnAl);工艺气体比例:氩气和氧气,氩气和氧气的比例为1.1.8;溅射气压为3~5×10-3mbar;
B、磁控溅射第二层(2):
靶材数量:直流平面靶1个;靶材配置为银(Ag);工艺气体比例:纯氩气;溅射气压为2~3×10-3mbar;
C、磁控溅射第三层(3):
靶材数量:交流旋转靶1个;靶材配置氧化锌铝(ZnAlOx);工艺气体比例:纯氩气;溅射气压为3~5×10-3mbar;
D、磁控溅射第四层(4):
靶材数量:交流旋转靶5~6个;靶材配置为硅铝(SiAl);工艺气体比例:氩气和氧气,氩气和氧气的比例为1.0.75;溅射气压为3~5×10-3mbar;
E、磁控溅射第五层(5):
靶材数量:交流旋转靶2~3个;靶材配置为锌锡(ZnSn);工艺气体比例:氩气和氧气,氩气和氧气的比例为1:1.8;溅射气压为2~3×10-3mbar;
F、磁控溅射第五层(6):
靶材数量:交流旋转靶2~3个;靶材配置为锌铝(ZnAl);工艺气体比例:氩气和氧气,氩气和氧气的比例为1:1.8;溅射气压为3~5×10-3mbar;
G、磁控溅射第七层(7):
靶材数量:直流平面靶1个;靶材配置为银(Ag);工艺气体比例:纯氩气;溅射气压为2~3×10-3mbar;
H、磁控溅射第八层(8):
靶材数量:交流旋转靶1个;靶材配置为铜(Cu);工艺气体比例:纯氩气;溅射气压为2~3×10-3mbar;镀膜厚度为5~10nm;
I、磁控溅射第九层(9):
靶材数量:交流旋转靶1个;靶材配置为氧化锌铝(ZnAlOx);工艺气体比例:纯氩气;溅射气压为2~3×10-3mbar;
J、磁控溅射第十层(10):
靶材数量:交流旋转靶4~6个;靶材配置硅铝(SiAl);工艺气体比例:氩气和氮气,氩气和氮气的比例为1:0.75;溅射气压为3~5×10-3mbar;
K、磁控溅射第十一层(11):
靶材数量:交流旋转靶2~3个;靶材配置为锌锡(ZnSn);工艺气体比例:氩气和氧气,氩气和氧气的比例为1:1.8;溅射气压为2~3×10-3mbar;
L、磁控溅射第十二层(12):
靶材数量:交流旋转靶2~3个;靶材配置为锌铝(ZnAl);工艺气体比:氩气和氧气,氩气和氧气的比例为1:1.8;溅射气压为3~5×10-3mbar;
M、磁控溅射第十三层(13):
靶材数量:直流平面靶1个;靶材配置为银(Ag);工艺气体比:纯氩气;溅射气压为2~3×10-3mbar;
N、磁控溅射第十四层(14):
靶材数量:交流旋转靶1个;靶材配置为氧化锌铝(ZnAlOx);工艺气体比:纯氩气;溅射气压为3~5×10-3mbar;
O、磁控溅射第十五层(15):
靶材数量:交流旋转靶5~6个;靶材配置为硅铝(SiAl);工艺气体比:氩气和氮气,氩气和氮气的比例为1:0.75;溅射气压为3~5×10-3mbar;
P、磁控溅射第十六层(16):
靶材数量:交流旋转靶1个;靶材配置为硅铝(SiAl);工艺气体比:氩气和氮气,氩气和氮气的比例为1:0.04;溅射气压为3~5×10-3mbar;
2)、总膜层厚度控制在189-334nm,一般溅射室传动走速控制在4.0-5.0m/min。
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