CN114559147B - Preparation method of copper alloy composite board - Google Patents
Preparation method of copper alloy composite board Download PDFInfo
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- CN114559147B CN114559147B CN202210239501.XA CN202210239501A CN114559147B CN 114559147 B CN114559147 B CN 114559147B CN 202210239501 A CN202210239501 A CN 202210239501A CN 114559147 B CN114559147 B CN 114559147B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 183
- 239000002184 metal Substances 0.000 claims abstract description 183
- 239000000758 substrate Substances 0.000 claims abstract description 84
- 239000011248 coating agent Substances 0.000 claims abstract description 75
- 238000000576 coating method Methods 0.000 claims abstract description 75
- 239000003575 carbonaceous material Substances 0.000 claims abstract description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000010949 copper Substances 0.000 claims abstract description 32
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 239000010410 layer Substances 0.000 claims abstract description 30
- 238000003466 welding Methods 0.000 claims abstract description 25
- 239000002360 explosive Substances 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
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- 239000002344 surface layer Substances 0.000 claims abstract description 7
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- 238000000034 method Methods 0.000 claims description 12
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- 239000002041 carbon nanotube Substances 0.000 claims description 6
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- 239000000523 sample Substances 0.000 description 6
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- 238000003763 carbonization Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 229910017813 Cu—Cr Inorganic materials 0.000 description 4
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 4
- 239000003814 drug Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229910017526 Cu-Cr-Zr Inorganic materials 0.000 description 3
- 229910017810 Cu—Cr—Zr Inorganic materials 0.000 description 3
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
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- 229910000676 Si alloy Inorganic materials 0.000 description 3
- 229910001069 Ti alloy Inorganic materials 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 229910000599 Cr alloy Inorganic materials 0.000 description 2
- 229910017945 Cu—Ti Inorganic materials 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
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- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
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- 238000004381 surface treatment Methods 0.000 description 2
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- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 description 1
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- 229910017532 Cu-Be Inorganic materials 0.000 description 1
- 229910017985 Cu—Zr Inorganic materials 0.000 description 1
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- XOBKSJJDNFUZPF-UHFFFAOYSA-N Methoxyethane Chemical compound CCOC XOBKSJJDNFUZPF-UHFFFAOYSA-N 0.000 description 1
- 229920000557 Nafion® Polymers 0.000 description 1
- 229910018098 Ni-Si Inorganic materials 0.000 description 1
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- NWGKJDSIEKMTRX-AAZCQSIUSA-N Sorbitan monooleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O NWGKJDSIEKMTRX-AAZCQSIUSA-N 0.000 description 1
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- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
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- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/06—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of high energy impulses, e.g. magnetic energy
- B23K20/08—Explosive welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/24—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The invention relates to a preparation method of a copper alloy composite board, and belongs to the technical field of copper-based materials. The preparation method of the invention comprises the following steps: placing a metal coating plate on a metal substrate, covering the metal coating plate, placing explosive, detonating the explosive to perform explosive welding and compounding to obtain a composite plate, and removing the metal coating plate on the surface layer of the composite plate; the metal coating plate comprises a metal plate matrix and a conductive carbon material layer coated on the metal plate matrix; a conductive carbon material layer of the metal-coated sheet for contacting the metal substrate is coated at least at the area of the metal sheet base for contacting the metal substrate. According to the invention, the metal plate substrate coated with the conductive carbon material layer and the copper-based metal coated plate are subjected to explosion welding, so that the interface bonding strength of the conductive carbon material and the metal substrate can be enhanced, the high-temperature conductivity of the copper alloy composite plate can be enhanced by adding the conductive carbon material into the copper alloy composite plate, and the commercial production of the large-size copper alloy composite plate can be realized.
Description
Technical Field
The invention relates to a preparation method of a copper alloy composite board, and belongs to the technical field of copper-based materials.
Background
Copper and copper alloy materials are widely applied to the fields of aerospace, high-speed railways, ultra/extra-high voltage appliances, weaponry, automobiles, electronic information and the like because of good electric conductivity and mechanical properties. With the rapid development of the above fields, copper alloy materials are required to have more excellent matching of strength, conductivity and current-carrying frictional wear properties. At present, the copper alloy materials commercially applied in the fields are mainly precipitation-strengthened copper alloys (Cu-Cr, cu-Zr, cu-Ni-Si and the like), and the alloy plates tend to generate abrasion failure problems due to surface friction temperature rise under the current-carrying friction condition. To solve the above problems, there are two approaches in the current research: first, a surface treatment is performed on the copper alloy surface. However, the common surface treatment method can reduce the conductivity of the copper alloy or has poor interfacial bonding force, which is difficult to be applied in a production manner; and secondly, replacing the copper-based composite material with excellent performance. However, the current preparation method of the copper-based composite material is often limited by equipment specifications, so that large-specification blanks are difficult to prepare.
Disclosure of Invention
The invention aims to provide a preparation method of a copper alloy composite board, which can realize the commercial production of the copper alloy composite board with large specification and size and added with conductive carbon materials.
In order to achieve the above purpose, the technical scheme adopted by the preparation method of the copper alloy composite board of the invention is as follows:
the preparation method of the copper alloy composite board comprises the following steps: placing a metal coating plate on a metal substrate, covering the metal coating plate, placing explosive on the metal coating plate, detonating the explosive to perform explosive welding compounding to obtain a composite plate, and removing the metal coating plate on the surface layer of the composite plate; the metal substrate is a pure copper substrate or a copper alloy substrate; the metal coating plate comprises a metal plate substrate and a conductive carbon material layer coated on the metal plate substrate; a conductive carbon material layer of the metal-coated sheet for contacting the metal substrate is coated at least at the area of the metal sheet base for contacting the metal substrate.
According to the preparation method of the copper alloy composite board, the metal board substrate coated with the conductive carbon material layer and the metal substrate are subjected to explosion welding, so that the interface bonding strength of the conductive carbon material and the metal substrate can be enhanced, the high-temperature conductivity of the copper alloy composite board is enhanced by adding the conductive carbon material into the copper alloy composite board, the conductive carbon material is diffused into the copper alloy composite board by huge impact force during explosion welding, the wear resistance of the copper alloy composite board is improved, the friction coefficient and the material loss are reduced, and meanwhile, the large-size copper alloy composite board can be realized, and the problem of commercial production of the large-size copper alloy composite board is solved.
It will be appreciated that the copper-based substrate of the present invention may be in the form of a strip and that the metal-coated sheets contacting the metal substrate may be one or more, but that the conductive carbon material layers of these metal-coated sheets are applied to at least the area of the metal sheet matrix for contact with the metal substrate.
Preferably, the metal substrate is a pure copper substrate, a Cu-Cr alloy substrate, a Cu-Zr alloy substrate, a Cu-Cr-Zr alloy substrate or a Cu-Ni-Si alloy substrate. For example, the pure copper substrate is a T2 pure copper substrate.
Preferably, the metal sheathing is a pure copper sheathing or a copper alloy sheathing.
Preferably, the metal plate substrate is a copper alloy plate or a titanium alloy plate.
Preferably, the copper alloy plate is a pure copper plate, a Cu-Cr alloy plate, a Cu-Ti alloy plate, a Cu-Cr-Zr alloy plate, a Cu-Ni-Si alloy plate or a Cu-Be alloy plate. For example, the Cu-Cr alloy plate is a Cu-0.76wt.% Cr alloy plate, the Cu-Ti alloy plate is a Cu-1wt.% Ti alloy plate, the Cu-Cr-Zr alloy plate is a Cu-0.33wt.% Cr-0.54wt.% Zr alloy plate, and the Cu-Ni-Si alloy plate is a Cu-3.1wt.% Ni-0.75wt.% Si alloy plate.
Preferably, the thickness of the conductive carbon material layer is 0.05-0.2mm, for example 0.1mm or 0.15mm. Preferably, the conductive carbon material in the conductive carbon material layer is one or any combination of carbon nanotubes, graphite, graphene and graphene oxide. The carbon nanotubes are one or any combination of single-wall carbon nanotubes, few-wall carbon nanotubes and multi-wall carbon nanotubes. The graphene is reduced graphene oxide. The graphite is graphite nano-sheets. The graphite, graphene, and graphene oxide are micron-sized particles, and the average particle diameter is preferably 5 to 50. Mu.m, and more preferably 20 to 30. Mu.m, for example, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, or 50. Mu.m. The carbon nano-tube is nano-grade particle, the tube diameter is preferably 2-20nm, and the length is preferably 0.3-4 μm.
Preferably, a groove is formed on one surface of the metal substrate facing the metal coating plate. Further preferably, the grooves are uniformly formed on the surface of the metal substrate. The grooves may be through grooves.
Preferably, the metal-coated sheet has only one piece; the placement is tiled.
Preferably, the metal coating plate has two or more plates; the placement is by laying a stack of metal coated plates onto a metal substrate. When two or more metal plates are stacked, a composite layer of the metal coating plate with a layered structure can be formed on the surface layer of the metal substrate. Further, a support body is arranged between any two adjacent metal coating plates. The support body is used for supporting the alloy coating plates stacked above and enabling a certain interval to be arranged between two adjacent metal coating plates, so that impact force is effectively applied.
Preferably, at least one of the opposite faces of the metal sheet matrix of any adjacent two metal-coated sheets is coated with a layer of conductive carbon material. The spacing between any adjacent two metal-coated sheets is preferably in the range 2.5-5mm.
Preferably, the metal coating plate has two or more plates; the groove is used for allowing the metal coating plate to be partially inserted into the metal substrate; the placement is by inserting each metal coated plate into the recess. The surface of the metal substrate facing the metal coating plate is a plane. It will be appreciated that the two largest parallel sides of the metal coated sheet during the insertion process are perpendicular to or at an acute angle to the side of the metal substrate facing the metal coated sheet. The metal coated plates are parallel to each other after insertion.
Preferably, the metal-coated sheet has a flat side in addition to the two largest opposing parallel sides, the flat sides of each metal-coated sheet being coplanar and each metal-coated sheet being on the same side of the plane in which the respective flat side lies after each metal-coated sheet is inserted into the recess of the metal substrate. After each metal-coated plate is inserted into the groove of the metal substrate, each flat side surface is parallel to the surface of the metal substrate facing the metal-coated plate. When the flat side surfaces are coplanar, the explosive welding explosive is uniformly placed, and the metal coating plate can be subjected to ordered plastic deformation in the explosive welding process.
Preferably, the number of the grooves is identical to the number of the metal coating plates, and each groove is inserted into only one metal coating plate when the metal coating plates are placed on the metal substrate. The shape of each groove is matched with the shape of the insertion part of the corresponding inserted metal coating plate.
Preferably, any two grooves are parallel or collinear with each other. Further, any two grooves are parallel to each other.
Preferably, the metal-coated sheet is coated with a layer of conductive carbon material on both of its largest opposing parallel sides.
Preferably, the conductive carbon material layer coated on the metal plate matrix forms a coating on the metal plate matrix. When the conductive carbon material layer completely coats the metal plate matrix, a layered structure with a self-lubricating function can be formed on the surface layer of the metal substrate, so that the wear resistance of the copper alloy composite board is greatly improved.
Preferably, the conductive carbon material layer coated on the metal plate substrate is formed by applying a coating liquid containing a conductive carbon material on the metal plate substrate and then performing a heat treatment.
Preferably, the coating liquid mainly comprises conductive carbon materials, a dispersing agent, an adhesive and a solvent. The solvent is one or any combination of water, methanol, ethanol, isopropanol, glycol, methyl ether, diethyl ether, methylethyl ether, acetone, butanone, methyl ethyl ketone, chloroform, carbon tetrachloride, benzene, toluene, tetrahydrofuran, dimethylformamide, dimethyl sulfoxide, acetic acid and methyl formate. The adhesive is an organic adhesive. The adhesive is one or any combination of cellulose, chitosan, nafion, epoxy resin, phenolic resin and polyurethane. The dispersing agent is an organic dispersing agent. The dispersing agent is one or any combination of sodium dodecyl benzene sulfonate, cetyl trimethyl ammonium bromide, polyvinyl alcohol, polyethylene glycol, polyethylene and pyrrolidone, span 80 and Triton X-100.
Further, the heating treatment is carbonization treatment. It is understood that the carbonization treatment, that is, the heating treatment performed in an oxygen-free atmosphere, forms a conductive carbon material layer on the metal plate substrate together with the conductive carbon material after the organic component in the coating liquid is carbonized during the carbonization treatment.
Drawings
FIG. 1 is a schematic view showing a state after stacking metal coated plates on an alloy substrate and placing pure copper alloy clad plates on the metal coated plates in step 4) of example 1;
FIG. 2 is a schematic structural diagram of the composite board produced in step 4) of example 1;
FIG. 3 is a schematic view showing a state after stacking metal coated plates on an alloy substrate and placing pure copper alloy clad plates on the metal coated plates in step 5) of example 3;
FIG. 4 is a schematic structural diagram of the composite board produced in step 5) of example 3;
the explosive-free composite metal base plate comprises a 1-detonator, a 2-explosive, a 3-explosive frame, a 4-pure copper cladding plate, a 5-metal coating plate, a 6-support body, a 7-metal base plate, an 8-foundation, a 9-explosion welding composite pure copper cladding plate, a 10-metal coating plate composite layer and a 11-explosion welding composite metal base plate.
Detailed Description
The technical scheme of the invention is further described below in connection with the specific embodiments.
Example 1
The preparation method of the copper alloy composite board comprises the following steps:
1) Taking a metal substrate (length 300 mm. Times. Width 300 mm. Times. Thickness 15 mm) and a metal plate substrate (length 300 mm. Times. Width 350 mm. Times. Thickness 3 mm), and cleaning the surfaces of the metal substrate and the metal plate substrate; the adopted metal substrate is a T2 pure copper substrate, and the metal plate base body is a Cu-0.76wt.% Cr alloy plate;
2) Preparing a coating liquid: uniformly mixing conductive carbon material, solvent, dispersing agent and adhesive to obtain plating solution; the adopted conductive carbon material is graphene with the average particle diameter of 30 mu m, the solvent is N-methyl-2-pyrrolidone, the dispersing agent is sodium dodecyl benzene sulfonate, and the adhesive is epoxy resin;
3) Complete coating of the surface of the metal plate substrate: coating the plating solution prepared in the step 2) on each surface of a metal plate substrate, and then placing the metal plate substrate in a heating furnace protected by inert gas for carbonization treatment to obtain a metal coating plate with the surface of the metal plate substrate completely coated with a conductive carbon material layer; the thickness of the conductive carbon material layer is 0.2mm;
4) Explosion welding: as shown in fig. 1, a metal base plate 7 is placed on a foundation 8, 4 metal coating plates 5 prepared in the step 3) are stacked on the metal base plate 7, each metal coating plate 5 is supported by a support body 6 at the edge so that two adjacent metal coating plates are separated by 5mm, then the metal coating plates are covered by a pure copper coating plate 4, a medicine frame 3 is prevented from being placed on the pure copper coating plate, an explosive 2 is placed in the medicine frame 3 on the pure copper coating plate 4, and explosive welding and compounding are carried out by detonating one end of the detonator 1 to obtain a composite plate, so that the high-strength connection between the metal coating plates and the metal base plate 7 is realized; the structure of the obtained composite board is shown in fig. 2, and comprises a metal substrate 11 after explosion welding and compounding, a metal coating board compound layer 10 formed by compounding 4 metal coating boards and a pure copper coating board 9 after explosion welding and compounding.
5) And (3) removing the covering plate: and after the explosion welding process, removing the pure copper cladding plate 9 after the explosion welding compounding of the surface layer of the obtained composite plate by adopting a machining method.
Example 2
The method for producing the copper alloy composite sheet material of this example differs from the method for producing the copper alloy composite sheet material of example 1 only in that: step 4) of the embodiment, firstly, forming 8 grooves on a metal substrate; 8 metal coating plates obtained in the step 2) are stacked on a metal substrate (completely covering the grooves), the adjacent two metal coating plates are supported by a supporting body at the edge between the metal coating plates to be 5mm apart, then the metal coating plates are covered by a pure copper coating plate, a medicine frame is prevented from being placed on the pure copper coating plate, an explosive 2 is placed in the medicine frame on the pure copper coating plate, and then explosive welding compounding is carried out by detonating a detonator from one end.
The shape of each groove on the metal substrate is the same, the interface of the grooves is rectangular, the width of the groove is 20mm, the depth of the groove is 3mm, and the length of the groove is 300mm; any two grooves are parallel to each other, and the distance between every two adjacent grooves is 10mm; the grooves are sequentially arranged along the length extension direction of the metal substrate.
Example 3
The preparation method of the copper alloy composite board comprises the following steps:
1) Cleaning the surface of a cuboid metal plate substrate (80 mm long by 30mm wide by 3mm thick); the adopted metal plate matrix is a Cu-1wt.% Ti alloy plate;
2) Preparing a coating liquid: uniformly mixing conductive carbon material, solvent, dispersing agent and adhesive to obtain plating solution; the adopted conductive carbon material is graphene with an average particle size of 20 mu m, the solvent is N-methyl-2-pyrrolidone, the dispersing agent is sodium dodecyl benzene sulfonate, and the adhesive is epoxy resin;
3) Complete coating of the surface of the metal plate substrate: coating the six sides of the metal plate matrix with the coating solution prepared in the step 2), and then placing the metal plate matrix in a heating furnace protected by inert gas for carbonization treatment to obtain a metal coating plate with a conductive carbon material layer completely coating the metal plate matrix; the thickness of the conductive carbon material layer is 0.2mm;
4) 8 identical grooves with the length of 80mm are formed in parallel on a metal substrate (the length is 100mm, the width is 80mm, the thickness is 20 mm), the grooves extend along a straight line, the section in the vertical extending direction is rectangular (the height is 2mm, the width is 4 mm), any two grooves are parallel to each other, and the distance between every two adjacent grooves is 2mm; each groove is sequentially arranged along the length extension direction of the metal substrate and is a through groove; the adopted metal substrate is a T2 pure copper substrate;
5) Explosion welding: as shown in fig. 3, a metal substrate 7 is placed on a foundation 8, one surface provided with a groove faces upwards, then 8 metal coated plates 5 prepared in the step 3) are inserted into the grooves of 8 metal substrates 9 in a one-to-one correspondence manner, then a supporting body for supporting a pure copper coated plate 4 is arranged on the metal substrates 9, the pure copper coated plate 4 is covered on the metal coated plate 5, a powder frame 3 is placed on the pure copper coated plate 4, an explosive 2 is placed in the powder frame 3 on the pure copper coated plate 4, and explosive welding and compounding are carried out by detonating one end of the detonator 1 to obtain a composite plate, so that the high-strength connection between the metal coated plate and the metal substrate is realized; the structure of the obtained composite board is shown in fig. 4, and comprises a metal substrate 11 after explosion welding and compositing, a metal coating board composite layer 10 formed by 8 metal coating boards and a pure copper cladding board 9 after explosion welding and compositing;
6) And (3) removing the covering plate: after the explosion welding process, the pure copper cladding plate 9 after the explosion welding and compounding of the surface layer of the composite plate is removed by adopting a machining method.
Example 4
The preparation method of the copper alloy composite sheet material of this embodiment differs from the preparation method of the copper alloy composite sheet material of embodiment 3 only in that: the metal plate matrix used was a Cu-0.33wt.% Cr-0.54wt.% Zr alloy plate.
Example 5
The method for producing the copper alloy composite sheet material of this example differs from the method for producing the copper alloy composite sheet material of example 2 only in that: the conductive carbon material adopted in the embodiment is carbon nano tube (diameter of 2-20nm, length of 0.3-4 μm), the solvent is N-methyl-2-pyrrolidone, the dispersing agent is sodium dodecyl benzene sulfonate, and the adhesive is epoxy resin; the metal plate matrix used was a Cu-3.1wt.% Ni-0.75wt.% Si alloy plate.
Example 6
The method for producing the copper alloy composite sheet material of this example differs from the method for producing the copper alloy composite sheet material of example 1 only in that: the thickness of the conductive carbon material layer is 0.1mm.
Example 7
The method for producing the copper alloy composite sheet material of this example differs from the method for producing the copper alloy composite sheet material of example 1 only in that: the metal plate matrix used was a Cu-3.1wt.% Ni-0.75wt.% Si alloy plate.
Example 8
The method for producing the copper alloy composite sheet material of this example differs from the method for producing the copper alloy composite sheet material of example 1 only in that: the gap between two adjacent metal coated plates was 2.5mm.
Experimental example
The copper alloy composite sheets prepared in examples 1 to 8 were each tested for conductivity, hardness and coefficient of friction, and wear rate, and the surface metal sheathing was removed after explosion welding and polished flat (for measurement). According to the national standard of GB/T32791-2016, a Sigma 2008 B1 eddy current tester is adopted to carry out surface conductivity measurement on a sample which is polished and flattened, and the measuring probe is phi 8mm and the frequency is 60KHz. Hardness measurement is carried out according to the national standard GB/T5586-1998, and the hardness of the material is tested by using an HVS-1000 digital microhardness meter under the test condition of 100g load and 10s dwell time. The pin-disk electric wear tester of NBIT FTM CF200 was used for the current-carrying frictional wear test. The pin sample is a composite plate after explosive welding, the disk sample is QCr0.5, the experimental condition is that the load is 0.63MPa, the linear speed is 10m/s, the current is 10A, the friction time is 20s, the volumetric wear rate of the pin sample is calculated through the volumetric change of the pin sample before and after the test, and the average friction coefficient is calculated according to the torque change in the test process. The test results are shown in Table 1.
TABLE 1 basic surface Properties and Current-carrying Friction wear Properties of explosive composite Board
| Examples | Conductivity (% IACS) | Hardness (Hv) | Coefficient of friction | Wear rate (10) -3 mm 3 ·m -1 ) |
| Example 1 | 83 | 125 | 0.35 | 0.128 |
| Example 2 | 80 | 127 | 0.37 | 0.115 |
| Example 3 | 20 | 300 | 0.45 | 0.231 |
| Example 4 | 83 | 110 | 0.38 | 0.125 |
| Example 5 | 43 | 220 | 0.42 | 0.207 |
| Example 6 | 80 | 122 | 0.33 | 0.132 |
| Example 7 | 45 | 225 | 0.43 | 0.212 |
| Example 8 | 82 | 122 | 0.36 | 0.11 |
Claims (5)
1. A preparation method of a copper alloy composite board is characterized by comprising the following steps: the method comprises the following steps: placing a metal coating plate on a metal substrate, covering the metal coating plate, placing explosive on the metal coating plate, detonating the explosive to perform explosive welding compounding to obtain a composite plate, and removing the metal coating plate on the surface layer of the composite plate;
the metal substrate is a pure copper substrate or a copper alloy substrate;
the metal coating plate comprises a metal plate substrate and a conductive carbon material layer coated on the metal plate substrate; a conductive carbon material layer of the metal coating plate for contacting the metal substrate is coated at least on the area of the metal plate base for contacting the metal substrate;
a groove is formed in one surface of the metal substrate, which faces the metal coating plate, and the metal coating plate is provided with two or more metal coating plates; the groove is used for allowing the metal coating plate to be partially inserted into the metal substrate; the placing is to insert each metal-coated plate into the groove;
the number of the grooves is consistent with that of the metal coating plates, and when the metal coating plates are placed on the metal substrate, each groove is only inserted into one metal coating plate;
the two largest parallel sides of the metal coating plate are perpendicular to the surface of the metal substrate facing the metal coating plate in the inserting process or the metal coating plates are parallel after the inserting process.
2. The method for producing a copper alloy composite sheet according to claim 1, wherein: the conductive carbon material in the conductive carbon material layer is one or any combination of carbon nano tube, graphite, graphene and graphene oxide.
3. The method for producing a copper alloy composite sheet material according to claim 1 or 2, characterized in that: at least one of the opposite sides of the metal plate substrate of any adjacent two metal-coated plates is coated with a conductive carbon material layer.
4. A method of producing a copper alloy composite sheet according to claim 3, wherein: the metal-coated sheet is coated with a layer of conductive carbon material on all of its two largest opposing parallel sides.
5. The method for producing a copper alloy composite sheet according to claim 4, wherein: the conductive carbon material layer coated on the metal plate matrix forms cladding on the metal plate matrix.
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