CN114557609B

CN114557609B - Waffle machine

Info

Publication number: CN114557609B
Application number: CN202210156303.7A
Authority: CN
Inventors: 郭建刚; 李裕祥; 郑映文
Original assignee: Guangdong Xinbao Electrical Appliances Holdings Co Ltd
Current assignee: Guangdong Xinbao Electrical Appliances Holdings Co Ltd
Priority date: 2022-02-21
Filing date: 2022-02-21
Publication date: 2024-02-06
Anticipated expiration: 2042-02-21
Also published as: CN114557609A

Abstract

The embodiment of the application provides a wafer machine, include: a processing zone for processing the wafer slurry; a slurry adding device for providing wafer slurry to the processing area; the first sensor is used for acquiring a first weight signal of the change of the processing area, and the first weight signal is used for indicating the weight value of the currently added wafer slurry in the processing area; a controller for receiving the first weight signal; the controller judges that the weight of the wafer slurry added in the processing area reaches a preset weight value based on the first weight signal, and controls the slurry adding device to stop adding the wafer slurry into the processing area; and the display screen is used for providing an interactive interface for the user to carry out interactive operation, and the controller responds to the interactive operation and controls the processing area to heat based on the corresponding control strategy. The wafer machine can avoid overflow of wafer slurry and waste; meanwhile, interactive operation of a user is received through the interactive interface of the display screen, so that waffles can be prepared according to the requirements of the user, and the user experience is good.

Description

Waffle machine

Technical Field

The embodiment of the application relates to the technical field of household appliances, in particular to a wafer machine.

Background

The wafer machine may heat the wafer slurry through the processing zone to produce a shaped wafer.

However, the wafer slurry is generally relatively viscous and difficult to clean, and thus, when the wafer slurry is added to the processing area of the wafer machine, if it is added in excess, it may overflow from the processing area, resulting in contamination of the surface of the wafer machine and the table on which the wafer machine is placed. Moreover, after a few of waffle slurry is dried, the waffle slurry is difficult to clean completely, so that the problem of mildew and odor is caused, and the influence on human health is possibly caused.

In the prior art, a ring of grooves is typically added around the processing zone of the wafer machine to collect overflowed wafer slurry. However, the wafer slurry in the grooves is easily heated unevenly, may not be completely heated and cooked, and can only be thrown away. Moreover, if the overflow wafer slurry exceeds the holding limit of the grooves, it still overflows onto the surface and table of the wafer machine, and the above technical problems cannot be solved well.

Disclosure of Invention

In view of the foregoing problems with the prior art, embodiments of the present application provide a wafer machine that can automatically control the weight of wafer slurry added to a processing zone.

In order to solve the above problems, the technical solution provided in the embodiments of the present application is:

in one aspect, embodiments of the present application provide a wafer machine, including:

a processing zone for processing the wafer slurry;

a slurry adding device for providing wafer slurry to the processing area;

the first sensor is used for acquiring a first weight signal of the change of the processing area, and the first weight signal is used for indicating the weight value of the currently added wafer slurry in the processing area;

a controller for receiving the first weight signal; the controller judges that the weight of the added wafer slurry in the processing area reaches a preset weight value based on the first weight signal, and controls the slurry adding device to stop adding the wafer slurry into the processing area;

and the display screen is used for providing an interactive interface for the user to carry out interactive operation, and the controller responds to the interactive operation and controls the processing area to heat based on the corresponding control strategy.

In the wafer machine disclosed by the embodiment of the application, in the pulping process, the variable weight value of the processing area can be obtained through the first sensor, so that the controller can control the weight value of the wafer pulp added to the processing area by the pulping device not to exceed the preset weight value, and overflow of the wafer pulp and waste are avoided; meanwhile, interactive operation of a user is received through the interactive interface of the display screen, so that the controller controls the processing area to heat the wafer slurry based on the selection of the user, and therefore wafers can be prepared according to the requirements of the user, and the user experience is good.

In some embodiments, the display interface of the display screen includes a plurality of first operation objects, and the user performs a selection operation by using the interactive interface;

the controller responds to the taste appointed by the operation of selecting the first operation object, and displays the type of ingredients required by the taste and the corresponding weight value through the display screen so as to be convenient for a user to check.

In some embodiments, the wafer machine further comprises:

the second sensor is used for acquiring a second weight signal of the change of the pulping device, and the second weight signal is used for indicating the weight value of the ingredients currently added by the pulping device;

the controller receives the second weight signal, compares and displays the current weight value of the ingredients based on the corresponding ingredients and the corresponding weight value through the display screen, and is convenient for comparison and check when a user weighs the ingredients to confirm whether the adding of the ingredients is completed or not, and meanwhile the tedious process of weighing and configuring the ingredients by additionally using the container and the scale is avoided.

In some embodiments, when comparing and displaying the current weight value of the ingredients based on the required ingredients and the corresponding weight values, the method further comprises:

the controller judges the current weight value of the ingredients based on the weight value of the corresponding ingredients, and when the current weight value of the ingredients is close to the required weight value, a prompt signal is sent out to prompt a user, so that the user is reminded of adding a small amount of ingredients to avoid excessive addition.

In some embodiments, if the user-specified taste does not show the type of ingredients and corresponding weight values required on the display screen;

and when the controller receives the second weight signal, only the weight value of the currently added ingredients is displayed through the display screen, so that a user can customize the required taste.

In some embodiments, the interactive interface is capable of receiving a first user input for specifying a number of actions to be performed;

based on the production quantity value, the controller displays the types of ingredients required by the taste and the weight value corresponding to the production quantity value through a display screen, so that a user can directly input the number of the required baking, and a plurality of waffles are baked.

In some embodiments, the slurrying apparatus further comprises an agitator;

the controller controls the stirrer to stir ingredients based on a ingredients addition completion instruction input by a user so as to prepare the wafer slurry. After the user confirms that the ingredients are added, the automatic stirring can be realized, the user is not required to operate, and the degree of automation is high.

In some embodiments, the controller is further configured to receive a temperature detection value for the processing zone; based on a pulping instruction input by a user, when the temperature of a processing area reaches a preset temperature value, the pulping device is controlled to add wafer pulp to the processing area so as to automatically start processing wafer, the temperature of a wafer machine is not required to be checked and waited by the user, and user experience is improved.

In some embodiments, the display screen provides an interactive interface for a user to interactively operate to cause the controller to control the processing zone to heat based on a corresponding control strategy, comprising:

the interactive interface comprises a plurality of second operation objects for users to select by utilizing the interactive interface;

the controller responds to the operation of selecting the second operation object to specify the burning degree, and the burning degree is obtained by baking through the processing area according to the corresponding control strategy.

The wafer machine can automatically execute the processing program based on the burn-in degree determined by the user, high automation is achieved, and user experience is good.

In some embodiments, the interactive interface is capable of receiving a second user input for specifying a heating time;

the controller controls the heating time of the processing area according to the heating time so that a user sets the processing time according to own preference to obtain the wafer with the required burning degree.

Drawings

Fig. 1 is a schematic structural view of a waffle machine according to an embodiment of the application;

FIG. 2 is a block diagram of a wafer machine according to an embodiment of the present application;

fig. 3 is a block diagram of a Hua Fuji control circuit according to an embodiment of the present application;

fig. 4 is a diagram of operation steps of the wafer machine according to the embodiment of the present application.

Fig. 5 is an enlarged view of a portion of the display 50 of fig. 4.

Reference numerals illustrate:

100 waffle machine, 10 processing district, 11 heating element, 20 sizing apparatus, 30 first sensors, 40 controllers, 50 display screen, 51 interactive interface, 52 display interface, 60 second sensors.

Detailed Description

Various aspects and features of the present application are described herein with reference to the accompanying drawings.

It should be understood that various modifications may be made to the embodiments of the application herein. Therefore, the above description should not be taken as limiting, but merely as exemplification of the embodiments. Other modifications within the scope and spirit of this application will occur to those skilled in the art.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the application and, together with a general description of the application given above and the detailed description of the embodiments given below, serve to explain the principles of the application.

These and other characteristics of the present application will become apparent from the following description of a preferred form of embodiment, given as a non-limiting example, with reference to the accompanying drawings.

It is also to be understood that, although the present application has been described with reference to some specific examples, a person skilled in the art will certainly be able to achieve many other equivalent forms of the present application, having the characteristics as set forth in the claims and hence all coming within the field of protection defined thereby.

The foregoing and other aspects, features, and advantages of the present application will become more apparent in light of the following detailed description when taken in conjunction with the accompanying drawings.

Specific embodiments of the present application will be described hereinafter with reference to the accompanying drawings; however, it is to be understood that the disclosed embodiments are merely exemplary of the application, which can be embodied in various forms. Well-known and/or repeated functions and constructions are not described in detail to avoid obscuring the application with unnecessary or excessive detail. Therefore, specific structural and functional details disclosed herein are not intended to be limiting, but merely serve as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present application in virtually any appropriately detailed structure.

The specification may use the word "in one embodiment," "in another embodiment," "in yet another embodiment," or "in other embodiments," which may each refer to one or more of the same or different embodiments as per the application.

The wafer machine 100 provided according to some embodiments of the present application is described with reference to fig. 1 to 5.

Referring to fig. 1 to 5, an embodiment of the present application provides a wafer machine 100, including: a processing zone 10, a sizing device 20, a first sensor 30, a controller 40 and a display screen 50.

The processing zone 10 is used to process wafer slurry. In some specific applications, the processing zone 10 may be provided with a base plate (not shown) and a corresponding cover plate (not shown) that can be used for heating, with the heating element 11 heating the base plate and cover plate. The shape of the bottom plate and the cover plate are adapted, and the specific shape can be configured according to the design of a technician, for example, the shape can be round or square. In practice, the wafer slurry is poured onto the base plate, the cover plate is then closed, and the base plate and cover plate are heated by the heating element 11 to heat the wafer slurry. Thus, the skilled person can determine the preset weight value of the added wafer slurry in advance according to the capacity of the soleplate so that the processing zone 10 will not overflow when processing based on the wafer slurry of the preset weight value.

The slurry applicator 20 is used to provide wafer slurry to the processing zone 10. In some specific applications, the slurrying device 20 may be provided with a vessel for Cheng Fanghua f slurry, above the processing zone 10, for example. In some applications, the slurry adding device 20 may be provided with a valve switch (not shown) for circulating the wafer slurry. By opening or closing the valve switch, the slurry adding device 20 can add the wafer slurry to the processing zone 10 or stop the supply of the wafer slurry to the processing zone 10. Of course, in the wafer machine 100 according to the embodiment of the present application, the sizing device 20 may be located above the side of the processing area 10, or may have other positional relationships with the processing area 10, and the wafer slurry in the sizing device 20 may be led out to the processing area 10, which is not limited herein.

The first sensor 30 is connected to the processing area 10 and is used for acquiring a first weight signal of the change of the processing area 10. For example, in some practical applications, the first sensor 30 may be a pressure sensor. For detecting the changing weight value of the processing zone 10, the pressure sensor may be provided in the processing zone 10, preferably in the bottom of the floor of the processing zone 10, ensuring that the floor is supported by the pressure sensor. The pressure sensor is thus able to detect the currently increased weight value of the soleplate during the addition of the wafer slurry in the processing zone 10, and obtain a first weight signal, i.e. the currently added weight value of the wafer slurry in the processing zone 10. It should be understood that the first sensor 30 in the embodiment of the present application may be another type of sensor, and may detect a weight value of the change in the processing area 10, which is only used herein as an example.

And a controller 40 electrically connected to the first sensor 30 for receiving the first weight signal and respectively connected to the slurrying device 20 and the processing area 10 to be able to control the slurrying process of the slurrying device 20 and the processing process of the processing area 10. The controller 40 of the embodiment of the present application may be a central processing unit, a micro control unit, or the like.

In this embodiment, the controller 40 controls the sizing device 20 to stop adding the wafer slurry to the processing zone 10 when judging that the weight of the wafer slurry added to the processing zone 10 reaches a preset weight value based on the first weight signal. The setting of the preset weight value in the embodiment of the present application is not specifically required, for example, the preset weight value may be set according to the weight value of the wafer slurry that can be contained in the processing area 10, so as to ensure that the wafer slurry can be filled between the upper plate and the bottom plate of the processing area 10, and will not overflow in the adding and processing processes.

In some implementations, the controller 40 controls the sizing device 20 to add wafer slurry to the processing zone 10 by controlling the opening of a valve switch of the sizing device 20. During the addition of the wafer slurry, the controller 40 determines the weight value of the wafer slurry currently being added to the processing zone 10 by receiving the first weight signal transmitted by the first sensor 30. And when the weight value of the currently added wafer slurry reaches the preset weight value, closing a valve switch of the slurry adding device 20, so that the slurry adding device 20 stops adding the wafer slurry to the processing area 10.

And a display screen 50 for providing an interactive interface 51 for the user to interactively operate, and the controller 40 controls the processing area 10 to be heated based on the corresponding control strategy in response to the interactive operation. In this embodiment, the interactive interface 51 is provided with a key for inputting an operation command, so that the user performs interactive operations such as clicking or selecting to input a corresponding control command. The controller 40 determines a corresponding control strategy based on a user's instruction to control the processing zone 10 to heat, so as to heat the wafer slurry by controlling the heating temperature and the heating time period in the strategy, thereby obtaining the finished wafer. In addition, the controller 40 may also drive the display interface 52 of the display 50 to display the operation process accordingly according to the interactive operations such as clicking or selecting by the user.

In the process of pulping by the wafer machine 100 of the embodiment, the variable weight value of the processing area 10 can be obtained through the first sensor 30, so that the controller 40 can control the weight value of the wafer slurry added to the processing area 10 by the pulping device 20 not to exceed the preset weight value, thereby avoiding overflow of the wafer slurry and waste; meanwhile, the interactive operation of the user is received through the interactive interface 51 of the display screen 50, so that the controller 40 controls the processing area 10 to perform heating operation on the wafer slurry based on the selection of the user, and the wafer is prepared according to the requirement of the user, and the user experience is good.

In some embodiments, to facilitate the user selecting the taste of the wafer, the display interface 52 of the display 50 includes a plurality of first operation objects for the user to perform a selection operation using the keys on the interactive interface 51. The controller 40 responds to the taste designated by the operation of selecting the first operation object, and displays the type of ingredients required for the taste and the corresponding weight value through the display 50. In this embodiment, the taste of the wafer may be configured according to an existing recipe, and may specifically include "classical, belgium, chocolate, buttermilk" and the like. The first operation objects correspond to preset waffles with various tastes, and a user can select the corresponding first operation objects according to own preference so as to select the corresponding tastes. After the user selects the taste, the controller 40 invokes various ingredients and corresponding weight values required to make the wafer of the taste according to the user's selection operation, and displays the ingredients and the corresponding weight values on the display screen 50 for the user to view. For example, after the user selects the first operation object corresponding to the "classical" taste, the controller 40 may list, on the screen, the ingredients and the corresponding weight values required for making a wafer with the taste according to the user's selection, and prompt the user to add the ingredients in order with a cursor, for example: 50g of flour, 2g of fermented flour, 5g of butter, 10g of fine granulated sugar, 50g of eggs, 50g of milk and the like.

In some embodiments, the interactive interface 51 is capable of receiving a first user input for specifying an action number value;

based on the production quantity value, the controller 40 displays the kind of ingredients required for the taste and the weight value corresponding to the production quantity value through the display 50.

This example aims at directly listing the types and weight values of all ingredients according to the number of wafers that the user desires to process. In some specific applications, the interactive interface 51 may provide a numeric keypad for the user to enter numbers; or the addition and subtraction symbols can be provided beside the number of the manufacture, so that the user can input the corresponding numbers by using the addition and subtraction symbols. In other specific applications, as shown in fig. 5, the wafer machine 100 of the embodiments of the present application may also be provided with an up or down arrow key on the interactive interface to indicate "increase" or "decrease". After the user selects the number of pre-bakes and confirms, the controller 40 increases the "number of pre-bakes" displayed on the display 50 according to the number of operations performed by the user on the key with the arrow up, or decreases the "number of pre-bakes" displayed on the display 50 according to the number of operations performed by the user on the key with the arrow down.

The user performs an input operation based on the number of wafers to be processed and produced, and inputs a corresponding number for the item of the pre-baked number by an increase or decrease operation on the interactive interface 51 to specify the production number value of the wafers. The controller 40 calculates the weight value of each ingredient required for producing a wafer based on the production quantity value designated by the user, determines the taste selected by the user and the type of the ingredients after the number and the weight value corresponding to the production quantity value, and displays the weight value on the display 50. For example, after the user selects the first operation object corresponding to the "classical" taste, the number of pre-baked wafers is adjusted to be 5 through the interactive interface 51, that is, the number of wafers to be made is designated to be 5. Based on the number of preparations confirmed by the user, the ingredients required for preparing 5 wafers of "classical" taste and the corresponding weight values are displayed on the display 50, such as, for example, 250g of flour, 10g of baking powder, 25g of butter, 50g of fine granulated sugar, 250g of eggs, 250g of milk, etc.

In some embodiments, to facilitate the weighing of the various ingredients required to make the wafer by the user, the wafer machine 100 further comprises: a second sensor 60 for acquiring a second weight signal varying by the slurrying device 20, the second weight signal being indicative of a weight value of the ingredients currently added by the slurrying device 20; the controller 40 receives the second weight signal and compares and displays the current weight value of the ingredients based on the corresponding ingredients and the corresponding weight values through the display interface 52 of the display 50. The present embodiment is directed to weighing based on the respective weight values of the various ingredients displayed by the display interface 52 using the second sensor 60 to avoid the cumbersome process of weighing and configuring the ingredients with additional use of containers and scales.

In some implementations, the wafer machine 100 of the present application includes a collection circuit and a control circuit, and the processing zone 10 and the sizing device 20 are connected to the control circuit and the display 50 through the collection circuit. The acquisition circuit is provided with communication means and the control circuit is provided with a controller 40. The acquisition circuit acquires weight signals of the processing area 10 and the slurry adding device 20 respectively, and transmits the weight signals to the controller 40 through the control circuit. The controller 40 is connected to the display 50 through a control circuit to receive an input from a user, to complete the addition and agitation of ingredients based on the second weight signal obtained from the slurry adding device 20 to form a wafer slurry, and then to control the slurry adding device 20 to add the wafer slurry to the processing zone 10, and to control the slurry adding device 20 to stop adding the wafer slurry according to the first weight signal obtained from the processing zone 10, and then to control the heating process of the processing zone 10 according to the corresponding control strategy to obtain a finished wafer, and the entire process is correspondingly displayed through the interactive interface 51 on the display 50.

In the embodiment of the present application, in order to facilitate the operation of the user, the interactive interface 51 is further provided with "confirm", "slurry" and "return" keys. The "confirm" key is used to confirm the current operation of the wafer machine 100, the "slurry" key is used to confirm the completion of the ingredient addition, and a slurry instruction is input, and the "return" key is used to return to the previous operation, and to return to the initialization interface of the display 50 on a long press.

In this embodiment, the sizing device 20 may be provided with a container for weighing in order to facilitate weighing of the various ingredients. The second sensor 60 may refer to the first sensor 30 and employ a pressure sensor, where the pressure sensor is preferably located at the bottom of the weighing vessel so that the vessel is supported by the pressure sensor so that the pressure sensor can detect a changing weight value within the vessel and acquire a second weight signal to acquire the real-time weight of the ingredient currently being added. It is understood that the second sensor 60 in this embodiment may be another type of sensor, and may detect a weight value of the slurry adding device 20 that changes during the process of adding the ingredients, which is only used herein as an example.

After receiving the second weight signal, controller 40 determines the weight of the presently added ingredient and displays a comparison after the corresponding ingredient is displayed on display interface 52. In some implementations, for example, on-screen display: flour 50g, baking powder 2g, butter 5g, fine granulated sugar 10g, egg 50g, milk 50g, and controller 40 displays "___ _" after the row of "flour 50g" where the cursor of display screen 50 is located, so as to display the real-time weighing value, i.e., at this time, "flour 50g" displayed on display screen 50 is changed to "flour 50g ___ _". When the user adds flour to the weighed container, the controller 40 determines the real-time weight of the currently weighed ingredient by receiving the second weight signal from the second sensor 60, and displays it on "___ _, and the user checks the same by" flour 50g ___ _ ", and confirms whether the addition of the ingredient" flour "is completed.

In some embodiments, to alert the user that an excess is being added when ingredients are being added, the method further includes, when comparing the current weight value of the ingredients based on the desired ingredients and the corresponding weight values:

the controller 40 determines the current weight value of the ingredients based on the weight value of the corresponding ingredients, and sends a prompt signal to prompt the user when the current weight value of the ingredients is close to the required weight value.

In this embodiment, an audio indicator (not shown), such as a buzzer, may be provided on the use interface of the waffle machine 100, so as to be used when prompting the user. When the controller 40 determines that the current weight value of the ingredient is close to the required weight based on the second weight signal, it controls the display 50 to flash or change from one color to another, or controls the buzzer to sound "beep" to prompt the user to perform a small amount of addition next, avoiding excessive addition of the ingredient.

After the flour is added, the user can press the "confirm" button of the interactive interface to enter the weighing process of the next ingredient, such as "fermented flour", displayed on the display screen 50, and at this time, the cursor on the display screen 50 will also move to the next row where the "fermented flour" is located. The controller 40 controls the current weighing weight value to return to zero on the display 50 to weigh the next ingredient "baking powder".

In some embodiments, if the user-specified taste does not indicate the type of ingredients desired and the corresponding weight values on the display 50;

when the controller 40 receives the second weight signal, only the currently added ingredient weight value is displayed through the display 50.

In this embodiment, the taste corresponding to the first operation object further includes a custom "DIY" mode, and in the "DIY" mode, ingredients for making the wafer may be configured according to a recipe that the user prefers to find or want to try. After the user selects the first operation object corresponding to the "DIY" mode, the weight of any required ingredients and the corresponding weight values are not displayed on the display interface 52. At this point, the cursor displayed on display interface 52 is in the first row, followed by "___ _" for displaying the weight of ingredients in real time. When the user adds the ingredients, the "___" on the display interface 52 displays the real-time weight value of the added ingredients, and when the user determines that the addition of the ingredients is completed, the user presses the confirm key, the cursor still stays on the first row, and the controller 40 controls the currently weighed weight value to return to zero on the display interface 52, so that the user can weigh the next ingredients.

In some embodiments, the slurrying device 20 further comprises an agitator;

the controller 40 controls the pulsator to agitate ingredients based on an ingredient addition completion command inputted by a user to manufacture the wafer slurry.

This example is directed to stirring all ingredients added to make a wafer slurry. In this embodiment, the user confirms that the addition of ingredients is complete through the interactive interface 51 after all ingredients have been added. After the controller 40 confirms that the user has completed the ingredient addition process, it controls the agitator to agitate the ingredients in the container based on the preset time, and the wafer slurry is obtained after the agitation is completed.

In some embodiments, the controller 40 is further configured to receive a temperature measurement of the processing zone 10; and controlling the sizing device 20 to add the wafer sizing agent to the processing area 10 when the temperature of the processing area 10 reaches a preset temperature value based on a sizing instruction input by a user.

In this embodiment, before grouting, the user needs to confirm whether the bottom plate and the cover plate of the machining area 10 are placed, and after the bottom plate and the cover plate are placed at corresponding positions, the user can press a grouting button on the interactive interface 51 according to the display state on the display interface 52 to input a grouting instruction. In this embodiment, the processing region 10 may be provided with a temperature sensor to detect the temperature of the processing region 10. After receiving the slurry adding instruction, the controller 40 confirms whether the actual temperature value of the processing zone 10 reaches a preset temperature value based on the temperature detection value received from the temperature sensor. When the temperature of the processing zone 10 reaches a preset temperature value, the controller 40 controls the sizing device 20 to add the wafer slurry to the processing zone 10 based on a user's instruction.

In some embodiments, the display screen 50 provides an interactive interface 51 for a user to interactively operate to cause the controller 40 to control the heating of the processing zone 10 based on a corresponding control strategy, including:

the interactive interface 51 includes a plurality of second operation objects for the user to use the interactive interface 51 to perform a selection operation;

the controller 40 designates a degree of burn-in, which is obtained by baking through the processing area 10 according to a corresponding control strategy, in response to an operation of selecting the second operation object.

In this embodiment, to facilitate the user to select the cooking level of the wafer, the interactive interface 51 includes a plurality of second operation objects for the user to select. The wafer is baked to different degrees depending on the heating temperature and the heating time. The user may select the corresponding second operation object according to his own preference to select the corresponding degree of burn-in, for example, "dark", "light" or "medium". Different degrees of burn-in correspond to different control strategies, such as different heating temperatures, or different heating durations, or different heating temperatures and heating durations.

In some embodiments, the interactive interface 51 is capable of receiving a second user input for specifying a heating time;

the controller 40 controls the heating time period of the processing zone 10 according to the heating time.

In this embodiment, when considering that the preferred cooking level of the user does not match the preset cooking level, the user can adjust the heating time through the interactive interface 51 to obtain the wafer at the desired cooking level. The heating time displayed on the display interface 52 may be increased or decreased, for example, based on the corresponding heating time of the "medium" degree of burn, to input the desired heating time to obtain a wafer of slightly deeper degree of burn than the "medium". The controller 40 controls the heating time of the processing zone 10 according to the heating time input by the user to heat the wafer slurry, thereby obtaining the wafer of the degree of baking required by the user.

As shown in fig. 4, the wafer machine 100 according to the embodiment of the present application may have the following specific operation steps when a specific application is performed, for example, when a user performs wafer preparation:

1. the waffle machine 100 is powered on and the buzzer sounds a short sound of "drop" and the screen of the display 50 is initialized.

2. An initialization interface appears on the display 50 to prompt the user that cooking may begin. The default wafer production number value and the burn-in degree are displayed on the display interface 52 of the display 50, and the user can adjust the production number value by using the "up" or "down" key on the interactive interface 51, and can also adjust the required burn-in degree as required, for example, adjust the processing time corresponding to the timing value under the "standard" burn-in degree, so as to adjust the heating time of the processing area 10, so as to produce a burn-in which is slightly darker or slightly lighter than the burn-in degree under the "standard" mode as required. After the adjustment is completed, a 'confirm' button is pressed, and when the set manufacturing number value and the burn-in/timing number value are both greater than 0, the heating element 11 of the processing area 10 starts to heat, the processing area 10 starts to enter preheating, and an audible and visual prompt can be performed through an indication lamp and/or a buzzer arranged on a use interface, or the prompt can be performed through the color change of the display screen 50.

3. The display interface 52 displays a first operation object corresponding to each taste for the user to select, for example, displaying: the instant food has the advantages of being convenient for users to customize different tastes according to preference.

4. When the user determines a taste by clicking on the first operation object, for example: after determining the "classical" taste, the controller 40 will list on the screen the ingredients and weights required for the taste according to the number of wafer preparations set by the user, and prompt the user with a cursor to add ingredients in the order, such as: 50g of flour, 2g of fermented flour, 5g of butter, 10g of fine granulated sugar, 50g of eggs, 50g of milk and the like. When the user adds flour, "flour 50g" shows "___ _" on the line of the face fabric where the cursor is located, i.e., from "flour 50g" to "flour 50g ___ _". The controller 40 obtains a second weight signal via a second sensor 60 on the slurrying device 20 to determine the weight of the ingredients in real time and displays it on the display interface 52 via the following "___.

4-1, when the menu selected by the user through clicking the first operation object is in a DIY mode, a DIY interface appears on the screen, a cursor is kept on the first row, and a numerical value consistent with the weight of the added ingredients appears along with the added ingredients until the user presses a 'confirm' button, and the number of the cursor is cleared, so that the user can weigh the next ingredient conveniently.

5. When the dosage approaches 50g, the buzzer sounds a drop, or the display screen 50 blinks or changes color, prompting the user to finish the dosage of the current ingredient, at this time, the user presses the "confirm" button, i.e. enters the dosage step of the next ingredient, the cursor moves to the next item, and the reading returns to zero automatically, so that the user can weigh the next ingredient according to the type of the ingredient displayed on the display interface 52.

6. After all the ingredients are added, the user presses the slurry adding button to determine that the ingredients are added, and a stirring reminding interface appears on the screen.

7. The controller 40 controls the agitator to agitate the added ingredients, and after the agitation is completed, the user confirms that the ingredients are being agitated completely, presses the "confirm" button, and a "slurry reminder" appears on the display interface 52 of the display screen 50 to remind the user that a slurry instruction is about to be input. At this point the user needs to prepare for pulping, for example: confirm whether the floor and ceiling of the processing zone 10 are in place, etc., and after readiness, the user may press the "slurry" key to enter a slurry command.

8. The controller 40 automatically acquires the temperature of the processing zone 10 to determine whether the processing zone 10 has completed preheating. When the preheating is completed, the controller 40 causes the slurry adding device 20 to pour the stirred wafer slurry into the processing zone 10 through the control circuit.

9. The first sensor 30 detects a weight value of the wafer slurry poured into the processing zone 10 and sends a first weight signal to the controller 40. The controller 40 determines that the weight value of the wafer slurry in the processing area 10 reaches a preset value according to the first weight signal, and then stops the slurry feeding device 20 from discharging slurry. If the user is not satisfied with the grouting amount, the user can press the grouting button for a long time to forcedly grouting. In the pulping process, a pulping button is pressed to pause pulping. The user needs to modify the previous step, and can press a return button to return to the previous step; long presses of the "back" button may stop the program being executed by the wafer machine 100 and the display 50 may return to the initialization interface for the user to reset.

The controller 40 then automatically executes the frying and baking program based on the corresponding control strategy according to the burn-in degree specified by the user, and processes the materials at the heating temperature or for the processing time. Or the controller 40 controls the processing area 10 to process according to the corresponding processing time according to the processing time designated by the user.

10. When the frying and baking are finished, the buzzer sounds a sound of ' drop ', prompts the user, and displays ' manufacturing is finished-! "information prompt.

11. Finally, the cooking is completed, the user opens the cover plate and removes the wafer from the base plate.

The waffle machine 100 of the embodiment of the application can complete automatic stirring through control of the controller, and can realize high automation by combining an automatic pulping process.

The above embodiments are only exemplary embodiments of the present application and are not intended to limit the present application, the scope of which is defined by the claims. Various modifications and equivalent arrangements may be made to the present application by those skilled in the art, which modifications and equivalents are also considered to be within the scope of the present application.

Claims

1. A wafer machine, comprising:

a processing zone for processing the wafer slurry;

a slurry adding device for providing wafer slurry to the processing area;

the display screen is used for providing an interactive interface for a user to perform interactive operation, and the controller responds to the interactive operation and controls the processing area to heat based on a corresponding control strategy, wherein the interactive operation is used for the user to input a control instruction; wherein,

the pulping device also comprises a stirrer;

the controller controls the stirrer to stir ingredients based on a ingredients addition completion instruction input by a user so as to prepare the wafer slurry.

2. The wafer machine of claim 1 wherein,

the display interface of the display screen comprises a plurality of first operation objects, and a user can select and operate by utilizing the interactive interface;

the controller responds to the taste appointed by the operation of selecting the first operation object, and displays the type of ingredients required by the taste and the corresponding weight value through a display screen.

3. The wafer machine of claim 2, further comprising:

the controller receives the second weight signal and compares and displays the current weight value of the ingredients based on the corresponding ingredients and the corresponding weight value through the display screen.

4. A wafer machine according to claim 3, wherein the comparison of the current ingredient weight values based on the desired ingredient and the corresponding weight values further comprises:

the controller judges the current weight value of the ingredients based on the weight value of the corresponding ingredients, and sends out a prompt signal to prompt a user when the current weight value of the ingredients is close to the required weight value.

5. A wafer machine according to claim 3, wherein if the user-specified taste does not show the type of ingredients required and the corresponding weight values on the display screen;

and when the controller receives the second weight signal, only the weight value of the currently added ingredient is displayed through a display screen.

6. The wafer machine of claim 2, wherein the interactive interface is capable of receiving a first user input for specifying a number of actions;

based on the production quantity value, the controller displays the type of ingredients required by the taste and the weight value corresponding to the production quantity value through a display screen.

7. The wafer machine of claim 1 wherein the controller is further configured to receive a temperature measurement of the processing zone; and controlling the pulping device to add the wafer pulp into the processing area when the temperature of the processing area reaches a preset temperature value based on a pulping instruction input by a user.

8. The wafer machine of any one of claims 1-7 wherein the display screen provides an interactive interface for user interaction to cause the controller to control heating of the processing zone based on the corresponding control strategy, comprising:

9. The wafer machine of claim 8, wherein the interactive interface is capable of receiving a second user input, the second user input for specifying a heating time;

and the controller controls the heating time of the processing area according to the heating time.