CN114543568A - Hexagonal system jet flow micro-channel radiator based on additive manufacturing technology - Google Patents

Hexagonal system jet flow micro-channel radiator based on additive manufacturing technology Download PDF

Info

Publication number
CN114543568A
CN114543568A CN202210189178.XA CN202210189178A CN114543568A CN 114543568 A CN114543568 A CN 114543568A CN 202210189178 A CN202210189178 A CN 202210189178A CN 114543568 A CN114543568 A CN 114543568A
Authority
CN
China
Prior art keywords
microchannel
hexagonal system
hexagonal
water inlet
additive manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210189178.XA
Other languages
Chinese (zh)
Inventor
李九如
曲久鹤
陈巨辉
于广滨
钟坦谊
张凯强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harbin University of Science and Technology
Original Assignee
Harbin University of Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harbin University of Science and Technology filed Critical Harbin University of Science and Technology
Priority to CN202210189178.XA priority Critical patent/CN114543568A/en
Publication of CN114543568A publication Critical patent/CN114543568A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735Jet impingement
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0225Microheat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

Abstract

The invention relates to the technical field of additive manufacturing technology and microchannel heat dissipation, in particular to a hexagonal system jet flow microchannel heat radiator based on the additive manufacturing technology, which comprises a water inlet, a water outlet, a microchannel cold plate, a cover plate, hexagonal system ribs and an internal water flow microchannel, wherein the water inlet is positioned in the center of the cover plate, water flow impacts the microchannel cold plate in an impact jet flow mode through the water inlet, the hexagonal system ribs are positioned on the microchannel cold plate and are in an axisymmetric structure, the internal water flow microchannel with a branch structure is divided through the hexagonal system ribs, the water outlet is symmetrically arranged on the periphery of the microchannel cold plate, and the water flow flows to the periphery of the microchannel cold plate through the internal water flow microchannel and then flows out through the water outlet arranged on the periphery of the microchannel cold plate.

Description

Hexagonal system jet flow micro-channel radiator based on additive manufacturing technology
Technical Field
The invention relates to the field of additive manufacturing technology and microchannel heat dissipation technology, in particular to a hexagonal system jet flow microchannel heat sink based on additive manufacturing technology.
Background
Thermal management techniques face significant challenges as the heat flux delivered by microelectronic devices increases rapidly. Conventional heatsinks, pin fin arrays, fan assisted heatsinks have approached their limit of about 100W/cm 2. The impinging jet stream can effectively destroy the boundary layer, and increase the disturbance inside the fluid, so that the heat transfer capability is enhanced. The boundary layer is damaged by the impact of the low-temperature fluid at the jet stagnation point, so that the temperature can be well controlled, and the cooling effect is excellent.
The heat radiator plays a key role in efficient and stable operation of the equipment, and often determines the performance of the equipment. The additive manufacturing technology utilizes laser heat source layer-by-layer cladding alloy powder to realize rapid and mold-free integrated near-net forming of compact metal parts with complex structures. The microchannel cold plate is formed by adopting the additive manufacturing technology, so that the integral forming from a three-dimensional model to a real object can be realized, the organization compactness of the microchannel cold plate exceeds that of a casting alloy, the problem of liquid leakage cannot occur, and the microchannel cold plate has the characteristics of high processing and forming speed, low cost and the like.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a hexagonal system jet flow micro-channel radiator based on an additive manufacturing technology, which aims to improve heat exchange and temperature uniformity, realize impact jet flow and hexagonal system micro-channel design by changing the inlet and outlet directions of a working medium, realize integrated processing and forming of the micro-channel radiator by adopting a 3D printing technology and further solve the problems of low heat exchange rate, slow heat dissipation and the like in the conventional heat dissipation device.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a hexagonal system efflux microchannel radiator based on vibration material disk technique, includes water inlet, delivery port, microchannel cold drawing, apron, hexagonal system rib and inside rivers microchannel, the water inlet is located apron centre department, and rivers pass through the water inlet and strike with the mode of assaulting the efflux the microchannel cold drawing, the hexagonal system rib is located the microchannel cold drawing and is the axisymmetric structure, through the inside rivers microchannel that has the branch structure is divided to the hexagonal system rib, four symmetrical arrangement of delivery port totally are peripheral in the microchannel cold drawing, and rivers pass through inside rivers microchannel flows to the microchannel cold drawing peripherally, flows through the delivery port of arranging here afterwards.
Compared with the prior art, the invention aims to provide a hexagonal system jet flow micro-channel radiator based on an additive manufacturing technology, which has the following beneficial effects:
the design of the hexagonal system microchannel structure ensures that fluid in the microchannel is continuously subjected to streaming in the flowing process, strengthens the impact of the fluid on the channel, effectively strengthens the heat exchange capability of the microchannel, improves the heat exchange efficiency and the temperature uniformity of the microchannel radiator, simultaneously destroys the development of a fluid thermal boundary layer in the microchannel by impact jet flow, and improves the critical heat flow density of the radiator.
The invention adopts the additive manufacturing technology for integrated processing, and utilizes the laser heat source to clad alloy powder layer by layer so as to realize the rapid integrated molding of the compact metal part with the complex structure without a grinding tool. The technology realizes the integrated molding from a three-dimensional model to a real object, the organization compactness is high, the problem of liquid leakage is avoided, the sealing problem of a cold plate and a cover plate is not needed to be considered, the processing of a micro-channel cold plate closed cavity is realized, and the processing efficiency and the batch production are greatly improved.
Drawings
FIG. 1 is a schematic view of the structure of the present invention.
FIG. 2 is an outline view of an integrated structure of the present invention.
FIG. 3 is a top view of a microchannel cold plate.
In the figure: 1 water inlet, 2 cover plates, 3 micro-channel cold plates, 4 water outlets, 5 internal water flow micro-channels and 6 self-hexagonal crystal system ribs.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, a hexagonal system jet micro-channel heat sink based on additive manufacturing technology includes a water inlet 1, a water outlet 4, a micro-channel cold plate 3, a cover plate 2, hexagonal system ribs 6, and internal water flow micro-channels 5, where the water inlet 1 is located in the center of the cover plate 2, water flow impacts the micro-channel cold plate 3 through the water inlet 1 in an impact jet manner, the hexagonal system ribs 6 are located on the micro-channel cold plate 3, the internal water flow micro-channels 5 with branch structures are separated from the hexagonal system ribs 6, the water outlets 4 are arranged on the periphery of the micro-channel cold plate 3, and the water flow flows to the periphery of the micro-channel cold plate 3 through the internal water flow micro-channels 5 and then flows out through the water outlets 4 arranged therein.
Furthermore, the hexagonal system ribs 6 are distributed in an axial symmetry manner, so that water flow is uniformly distributed, and the heat dissipation uniformity is improved.
Furthermore, the hexagonal system ribs 6 close to the water inlet 1 are provided with round corners so as to reduce the erosion of the hexagonal system ribs 6 caused by water flow.
Furthermore, the radiator adopts the additive manufacturing integral forming technology.
In conclusion, due to the design of the hexagonal system microchannel structure, fluid in the microchannel is continuously subjected to streaming in the flowing process, so that the impact of the fluid on the channel is enhanced, the heat exchange capability of the microchannel is effectively enhanced, the heat exchange efficiency and the temperature uniformity of the microchannel radiator are improved, meanwhile, the impact jet flow destroys the development of a fluid thermal boundary layer in the microchannel, the critical heat flow density of the radiator is improved, the material increase manufacturing technology is adopted for integrated processing, and alloy powder is clad layer by using a laser heat source, so that the rapid and grinding tool-free integrated forming of the compact metal part with the complex structure is realized. The technology realizes the integrated molding from a three-dimensional model to a real object, the organization compactness is high, the problem of liquid leakage is avoided, the sealing problem of a cold plate and a cover plate is not needed to be considered, the processing of a micro-channel cold plate closed cavity is realized, and the processing efficiency and the batch production are greatly improved.
It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The term "comprising", without further limitation, means that the element so defined is not excluded from the group consisting of additional identical elements in the process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents. .

Claims (2)

1. The utility model provides a hexagonal system efflux microchannel radiator based on vibration material disk technique, includes water inlet, delivery port, microchannel cold drawing, apron, hexagonal system rib and inside rivers microchannel, and the water inlet is located apron centre department, and rivers pass through the water inlet and strike with the mode of assaulting the efflux microchannel cold drawing, hexagonal system rib are located the microchannel cold drawing, divide the inside rivers microchannel that has branch structure through the hexagonal system rib, and the delivery port is totally four to be arranged in the microchannel cold drawing periphery, and rivers flow to the microchannel cold drawing periphery through inside rivers microchannel, flow through the delivery port of arranging here after that and flow.
2. The hexagonal fluidic microchannel heat sink of claim 1, wherein the hexagonal fluidic microchannel heat sink comprises: the hexagonal ribs are distributed in an axial symmetry manner; the hexagonal system rib close to the water inlet is provided with a fillet; the radiator adopts the additive manufacturing integral forming technology.
CN202210189178.XA 2022-03-01 2022-03-01 Hexagonal system jet flow micro-channel radiator based on additive manufacturing technology Pending CN114543568A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210189178.XA CN114543568A (en) 2022-03-01 2022-03-01 Hexagonal system jet flow micro-channel radiator based on additive manufacturing technology

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210189178.XA CN114543568A (en) 2022-03-01 2022-03-01 Hexagonal system jet flow micro-channel radiator based on additive manufacturing technology

Publications (1)

Publication Number Publication Date
CN114543568A true CN114543568A (en) 2022-05-27

Family

ID=81662452

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210189178.XA Pending CN114543568A (en) 2022-03-01 2022-03-01 Hexagonal system jet flow micro-channel radiator based on additive manufacturing technology

Country Status (1)

Country Link
CN (1) CN114543568A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102735074A (en) * 2012-06-29 2012-10-17 中国华能集团清洁能源技术研究院有限公司 Water-cooling radiator of temperature difference generating module
CN103996665A (en) * 2014-06-09 2014-08-20 电子科技大学 Enhanced heat dissipation device with pulsating flows and wavy-wall microchannels adopted
US20140307388A1 (en) * 2013-04-11 2014-10-16 Chia-Pin Chiu Fluid-cooled heat dissipation device
CN113438872A (en) * 2021-07-01 2021-09-24 合肥工业大学 Jet flow cold plate with gradually-reduced outlet type micro channel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102735074A (en) * 2012-06-29 2012-10-17 中国华能集团清洁能源技术研究院有限公司 Water-cooling radiator of temperature difference generating module
US20140307388A1 (en) * 2013-04-11 2014-10-16 Chia-Pin Chiu Fluid-cooled heat dissipation device
CN103996665A (en) * 2014-06-09 2014-08-20 电子科技大学 Enhanced heat dissipation device with pulsating flows and wavy-wall microchannels adopted
CN113438872A (en) * 2021-07-01 2021-09-24 合肥工业大学 Jet flow cold plate with gradually-reduced outlet type micro channel

Similar Documents

Publication Publication Date Title
CN107223004B (en) Microchannel surface type spray cooling enhanced heat transfer device and method
CN109149325B (en) A kind of mixed structure micro-channel heat sink
CN202816913U (en) Microchannel liquid-cooled heat sink device
CN104465562B (en) A kind of staggered MCA of chain type
CN110325020B (en) Composite jet cooling heat sink for high heat flux heat dissipation
CN108807309B (en) Self-similar micro-channel heat sink with jet flow structure
CN104658992A (en) Novel micro heat sink provided with pin-fin array
CN112151478B (en) Micro-channel radiator and preparation method and application thereof
CN103415190A (en) Abnormal channel array jet flow impact cold plate
CN108759533A (en) A kind of microchannel cold plates, radiator and device based on 3D bulk prints
CN108551750B (en) A kind of enhancing jet stream radiator heat-dissipation efficient appliances, radiating subassembly and production method
CN110828401B (en) Ultra-high heat flow density micro-channel heat sink cold plate
CN110662403A (en) Jet cooling device for array turbulence column
CN112928082A (en) Liquid cooling plate and power module
CN211982360U (en) Micro-channel heat sink with turbulence device
CN209896047U (en) Manifold type micro-channel micro radiator with complex structure
CN108601289B (en) Microchannel heat sink with special shunting structure
CN106911058B (en) W-shaped runner heat sink
CN114543568A (en) Hexagonal system jet flow micro-channel radiator based on additive manufacturing technology
CN113490394A (en) Vein bionic microchannel coupling jet flow heat exchange system
CN108598053A (en) A kind of efficient microchannel jet stream is heat sink
CN107863329B (en) Novel fin type micro-jet heat sink and manufacturing method
CN112788918B (en) Porous medium turbulent flow jet cooling device
KR102539336B1 (en) Semiconductor device thermal management module and manufacturing method thereof
Qi et al. Numerical investigation on submerged jet cooling for avionics devices

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination