CN114531771A - Flexible circuit board and preparation method and application thereof - Google Patents
Flexible circuit board and preparation method and application thereof Download PDFInfo
- Publication number
- CN114531771A CN114531771A CN202111642944.5A CN202111642944A CN114531771A CN 114531771 A CN114531771 A CN 114531771A CN 202111642944 A CN202111642944 A CN 202111642944A CN 114531771 A CN114531771 A CN 114531771A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- stainless steel
- copper
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000010963 304 stainless steel Substances 0.000 claims abstract description 37
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 claims abstract description 37
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000012544 monitoring process Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 17
- 229910052802 copper Inorganic materials 0.000 abstract description 17
- 239000010949 copper Substances 0.000 abstract description 17
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 16
- 239000010935 stainless steel Substances 0.000 abstract description 16
- 238000003466 welding Methods 0.000 abstract description 11
- 238000001514 detection method Methods 0.000 abstract description 8
- 230000007547 defect Effects 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 2
- 238000005260 corrosion Methods 0.000 abstract description 2
- 230000007774 longterm Effects 0.000 abstract 1
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 241000237536 Mytilus edulis Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000020638 mussel Nutrition 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Battery Mounting, Suspending (AREA)
Abstract
The invention discloses a flexible circuit board, wherein a stainless steel plate (hereinafter referred to as 304 stainless steel) meeting ASTM A276304 (corresponding to GB/T24511-2017, S30408) is adopted to replace a copper plate or a copper-clad plate as a conductive material, so that a stainless steel conductive circuit can be directly welded to a power battery cell assembly by adopting an ultrasonic wave or laser welding process without welding a nickel sheet between the flexible circuit board and a battery cell, welding points are reduced, the reliability is improved, the volume and the cost of the flexible circuit board are reduced, the flexible circuit board is suitable for a power battery detection unit structure which is gradually compact, defects caused in the welding process of the flexible circuit board and the nickel sheet and circuit faults caused in the long-term use process can be reduced, and the durability is improved; meanwhile, the 304 stainless steel has higher toughness, temperature resistance and corrosion resistance compared with copper, and the stability of the flexible circuit board is improved.
Description
Technical Field
The invention relates to the technical field of flexible circuit boards, in particular to a flexible circuit board and a preparation method and application thereof.
Background
The temperature monitoring unit of the flexible electronic circuit board for the power battery has the characteristics of light weight, convenience in installation and module integration, and replaces the traditional method of hardening the electronic circuit board by a wire harness.
However, the conductive material commonly used in the flexible circuit board structure is pure copper (copper clad laminate or copper plate is etched to obtain copper conductive circuit), but when pure copper is used as the conductive material, the nickel sheet needs to be soldered on the copper conductive circuit by soldering, and then the nickel sheet can be welded on the circuit assembly by ultrasonic or laser (see the attached figure 1 of the specification). On one hand, circuit defects may be caused due to irregular soldering, and particularly, circuit faults are caused due to welding point loosening defects caused by heat accumulation and high-frequency vibration in the driving process in a high-temperature sealed power battery detection unit mechanism; on the other hand, in the prior art, the welding process of the flexible circuit board and the nickel sheet is mainly manual, so that the nickel sheet cannot be designed to be too small, and the nickel sheet and the copper sheet are difficult to bend without damage after the conventional copper plate and the nickel sheet are welded, so that the length and the width of the nickel sheet need to be reserved in the power battery temperature detection unit. Therefore, the volume of the power battery temperature detection unit is increased, and the power battery temperature detection unit is difficult to apply to the power battery temperature detection unit with the increasingly compact internal structure.
Therefore, the method for connecting the flexible circuit board and the battery cell without the nickel sheet has great application value.
304 stainless steel is a versatile stainless steel, one grade of stainless steel produced according to the american ASTM standard or china GB/T24511-2017, S30408. In order to maintain the corrosion resistance inherent to stainless steel, 17.5 to 19.5% of chromium and 8.0 to 10.5% by weight of nickel must be contained in addition to the iron element. 304 stainless steel is suitable for food processing, storage and transportation, and is commonly: plate heat exchangers, corrugated pipes, household goods ( class 1, 2 tableware, cabinets, indoor pipelines, water heaters, boilers, bathtubs), automobile accessories (windshield wipers, mufflers, molded articles), medical appliances, etc., 304 stainless steel is a state-approved food-grade stainless steel.
However, in the prior art, no patent and report that a 304 stainless steel plate is adopted to replace a copper-clad plate or a copper plate as a flexible circuit board conducting circuit is provided.
Disclosure of Invention
The invention aims to overcome the technical defects and provides a flexible circuit board with a 304 stainless steel plate replacing a copper plate or a copper-clad plate, and a preparation method and application thereof.
The invention is realized by the following technical scheme:
a flexible circuit board comprises a 304 stainless steel conductive circuit and an insulating film in sequence from the center of the flexible circuit board to the outside.
The 304 stainless steel adopted by the invention contains 67.0-71.5% of iron element, 17.5-19.5% of chromium element and 8.0-10.5% of nickel element.
The resistivity of the 304 stainless steel is equal to about 0.73 omega m/mm at the temperature of 20 DEG C2. As the material of the conductive circuit of the flexible circuit board, the resistivity of 304 stainless steel is required to be not more than 0.85 ohm m/mm2So as to reduce the resistance and reduce the heat generation during continuous monitoring.
The longitudinal elastic modulus of the 304 stainless steel is 19-21KN/mm2. The longitudinal elastic modulus of the 304 stainless steel is larger than that of a copper plate or a copper-clad plate, so that the flexible circuit board adopting the 304 stainless steel as a conducting circuit is more suitable for being applied to a power battery temperature detection unit structure with high-frequency vibration.
Similar to the conducting circuit made of the traditional copper plate or copper-clad plate, the width of the 304 stainless steel conducting circuit is 0.15-15.00mm (including the connecting bonding pad).
The 304 stainless steel conductive circuit (hereinafter referred to as stainless steel bridge) directly extends to the outside of the insulation film covered by the flexible circuit board, and the extending part can be directly welded with the electrode without welding a nickel sheet.
The width of the 304 stainless steel bridge plate extending to the outside of the insulation film covered by the flexible circuit board is between 6.0 and 15.0 mm. According to the specification and the attached figure 2, taking a 304 stainless steel conducting circuit with the thickness of 0.20mm as an example, the width of the stainless steel sheet extending out of the insulating film is larger than that of the conducting circuit covered by the soft board insulating film, and the length and the width are matched with the size of the electrode so as to be suitable for being directly welded on the electrode.
The preparation method of the flexible circuit board comprises the following steps:
a: attaching a 304 stainless steel plate to one side of the 304 stainless steel plate with an insulating film under high temperature and high pressure;
b: etching 304 stainless steel plate to make conductive circuit;
c: attaching an insulating film to the other side under high temperature and high pressure;
d: and punching the shape to obtain the flexible circuit board.
According to the invention, the nickel sheet is omitted, so that the space occupied by the nickel sheet is omitted, and the integrated stainless steel fin part can be properly bent even after the stainless steel bridge sheet is welded with the electrode, so that the size is further reduced. Therefore, the flexible circuit board has the advantages of small size, thinness and easiness in bending due to no need of welding nickel sheets, and is suitable for a temperature monitoring unit of a power battery.
The invention has the following beneficial effects:
the conductive circuit of the flexible electronic circuit board for monitoring the temperature of the stainless steel power battery can realize that the stainless steel conductive circuit is directly welded to the power battery detection unit battery pack by adopting an ultrasonic wave or laser welding process without welding a nickel sheet on the stainless steel conductive circuit, thereby reducing the cost of the flexible circuit board.
Drawings
FIG. 1: the reference numeral 1 is a copper conductive circuit with a thickness of 0.035 mm, the reference numeral 2 is a nickel sheet, and the reference numeral 3 is an electrode.
FIG. 2: reference numeral 1 is a 0.20mm thick 304 stainless steel conductive trace, and reference numeral 2 is an electrode.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications can be made by persons skilled in the art without departing from the spirit of the invention. All falling within the scope of the present invention.
304 stainless steel plate: longitudinal elastic die with thickness of 0.20mmIn an amount of about 20KN/mm2Resistivity of about 0.73. omega. m/mm2。
Etching liquid: purchased from mussel.
Insulating film A: polyimide with thickness of 0.025-0.125mm, including adhesive epoxy resin;
insulating film B: polyester with a thickness of 0.025-0.125mm, including a binder acrylic.
The preparation method of the flexible circuit board comprises the following steps:
o: cutting the 304 stainless steel plate into corresponding sizes according to product requirements.
A: at a temperature of 190 ℃ and a pressure of 35kg/cm2Attaching an insulating film to one side of the 304 stainless steel plate;
b: a conducting circuit is manufactured by exposing, developing and etching a 304 stainless steel plate, the width of the conducting circuit is 0.35mm, a stainless steel bridge piece which is welded with an electrode is reserved to be rectangular, the width of the stainless steel bridge piece is 6mm, and the extension length of the stainless steel bridge piece is 13 mm.
C: at a temperature of 190 ℃ and a pressure of 35kg/cm2A descending insulating film is attached to the other side; and both sides of the part welded with the battery core are not covered by the insulating film.
D: and (5) punching the appearance.
Therefore, the flexible circuit board prepared by adopting 304 stainless steel to replace the copper plate can be produced by the traditional copper plate process, and the main difference lies in the difference of the etching liquid. The flexible circuit board obtained by the method is directly welded on the electrode through laser, the welding strength is higher than that of the traditional nickel sheet, but the space occupied by the nickel sheet is reduced, the length and the width of the bridge sheet extending out of the flexible circuit board are matched with the size of the electrode, and the flexible circuit board is suitable for a more compact power battery temperature monitoring element unit. Through the method, the traditional insulating film material can be suitable, so that the technical scheme of the invention has great applicability.
Claims (9)
1. A flexible circuit board is characterized by comprising 304 stainless steel conducting circuits and insulating films in sequence from the center of the flexible circuit board to the outside.
2. The flexible circuit board of claim 1, wherein the 304 stainless steel comprises 67.0-71.5% of iron, 17.5-19.5% of chromium, and 8.0-10.5% of nickel.
3. The flexible circuit board of claim 1, wherein the 304 stainless steel has an electrical resistivity of 0.85 Ω m/mm or less at 20 ℃2。
4. The flexible circuit board of claim 1, wherein said 304 stainless steel has a longitudinal elastic modulus of 19-21KN/mm at 20 ℃2。
5. The flexible circuit board of claim 1, wherein the width of the 304 stainless steel conductive traces is 0.15-15.00 mm.
6. The flexible circuit board of claim 1, wherein the 304 stainless steel conductive traces extend directly beyond the insulating film covering the flexible circuit board.
7. The flexible circuit board of claim 6, wherein the width of the 304 stainless steel bridge piece extending beyond the insulating film covered by the flexible circuit board is between 6.0 mm and 15.0 mm.
8. A method for manufacturing a flexible circuit board according to claims 1 to 7, comprising the steps of:
a: attaching a 304 stainless steel plate to one side of the 304 stainless steel plate with an insulating film under high temperature and high pressure;
b: etching 304 stainless steel plate to make conductive circuit;
c: the insulating film is attached to the other side under high temperature and high pressure;
d: and punching the shape to obtain the flexible circuit board.
9. Use of a flexible circuit board according to claims 1-7, characterised by a temperature monitoring unit for power cells.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111642944.5A CN114531771B (en) | 2021-12-30 | 2021-12-30 | Flexible circuit board and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111642944.5A CN114531771B (en) | 2021-12-30 | 2021-12-30 | Flexible circuit board and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114531771A true CN114531771A (en) | 2022-05-24 |
| CN114531771B CN114531771B (en) | 2024-06-28 |
Family
ID=81621766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111642944.5A Active CN114531771B (en) | 2021-12-30 | 2021-12-30 | Flexible circuit board and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114531771B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1662117A (en) * | 2004-02-27 | 2005-08-31 | 日东电工株式会社 | Wired circuit substate |
| US20190036289A1 (en) * | 2017-07-31 | 2019-01-31 | Ibiden Co., Ltd. | Flexible printed wiring board, electronic device having flexible printed wiring board, and method for manufacturing electronic device having flexible printed wiring board |
| CN209105492U (en) * | 2018-09-03 | 2019-07-12 | 上海安费诺永亿通讯电子有限公司 | A kind of electronic circuit and data transmission unit |
| CN209627820U (en) * | 2019-01-22 | 2019-11-12 | 厦门市铂联科技股份有限公司 | A kind of flexible circuit board |
| CN111465174A (en) * | 2020-04-21 | 2020-07-28 | 深圳光韵达激光应用技术有限公司 | Manufacturing method of high-heat-dissipation single-sided circuit board |
-
2021
- 2021-12-30 CN CN202111642944.5A patent/CN114531771B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1662117A (en) * | 2004-02-27 | 2005-08-31 | 日东电工株式会社 | Wired circuit substate |
| US20190036289A1 (en) * | 2017-07-31 | 2019-01-31 | Ibiden Co., Ltd. | Flexible printed wiring board, electronic device having flexible printed wiring board, and method for manufacturing electronic device having flexible printed wiring board |
| CN209105492U (en) * | 2018-09-03 | 2019-07-12 | 上海安费诺永亿通讯电子有限公司 | A kind of electronic circuit and data transmission unit |
| CN209627820U (en) * | 2019-01-22 | 2019-11-12 | 厦门市铂联科技股份有限公司 | A kind of flexible circuit board |
| CN111465174A (en) * | 2020-04-21 | 2020-07-28 | 深圳光韵达激光应用技术有限公司 | Manufacturing method of high-heat-dissipation single-sided circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114531771B (en) | 2024-06-28 |
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