CN114526767A - Vibration and temperature integrated sensor based on two-wire system analog signal transmission - Google Patents
Vibration and temperature integrated sensor based on two-wire system analog signal transmission Download PDFInfo
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Abstract
The invention provides a vibration and temperature integrated sensor based on two-wire system analog signal transmission, which comprises a sensor and a data acquisition device, wherein both the sensor and the data acquisition device are provided with an IEPE (IEPE) interface, the IEPE interface is connected with a two-wire system coaxial cable, the sensor and the data acquisition device are connected through the two-wire system coaxial cable, and the sensor is provided with a vibration sensitive device and a temperature sensitive device; the two-wire system coaxial cable is provided with 2 wires which are respectively a signal power supply positive connection wire and a signal power supply negative connection wire. The invention can save the number of wire cores of the signal cable, reduce the wire diameter, reduce the influence of the weight of the cable on the frequency response range of the vibration sensor, ensure that the analog signal does not influence the signal bandwidth, and obviously reduce the cost of the cable.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a vibration and temperature integrated sensor based on two-wire system analog signal transmission.
Background
Vibration and temperature sensors are used as important tools for health diagnosis of mechanical equipment, and play an increasingly important role in industrial production, and vibration and temperature integrated sensors are paid more and more attention by engineers due to the advantages of high integration level, convenience in installation and the like. However, most of the traditional vibration and temperature integrated sensors are three-wire system, four-wire system analog signal transmission or two-wire system digital signal transmission.
Three-wire system analog signal vibration temperature integral type sensor mainly by vibration (power) signal just, GND and three wires of temperature signal output, built-in vibration sensor part adopts traditional IEPE interface, and sensor power and signal output share same root wire promptly, and power and GND are shared to temperature sensing part and vibration sensor part, and a single signal line of temperature signal is exported with the form of voltage.
The four-wire system analog signal vibration temperature integrated sensor is similar to the three-wire system vibration temperature integrated sensor, except that the power supply of the temperature sensor part is not shared with the vibration sensing part, but a conducting wire is independently arranged. The four wires of the four-wire vibration temperature integrated sensor are defined as follows: vibration (power) signal positive, GND, temperature signal and temperature power.
The digital signal transmission sensor adopts an RS485 field bus as a transmission interface, firstly converts temperature and vibration signals in the sensor into digital signals, and then transmits the digital signals through the RS485 interface, so that the sensor has three obvious defects: 1. a data acquisition processing circuit is required to be integrated in the sensor, the sensor is complex in circuit and large in size, and the vibration acquisition frequency response range is influenced; 2. the bandwidth of the RS485 signal cable is narrow, and high-frequency vibration original data cannot be transmitted out in time; 3. additional power supply cables are required and the actual number of cables is not reduced.
Disclosure of Invention
The invention solves the problems that the existing vibration temperature integrated sensor is large in size, cannot transmit original data and needs an additional power supply cable, and provides a vibration temperature integrated sensor based on two-wire system analog signal transmission, which can save the number of wire cores of a signal cable, reduce the wire diameter, reduce the influence of the weight of the cable on the frequency response range of the vibration sensor, enable analog signals not to influence the signal bandwidth, and remarkably reduce the cost of the cable.
In order to realize the purpose, the following technical scheme is provided:
a vibration and temperature integrated sensor based on two-wire system analog signal transmission comprises a sensor and a data acquisition device, wherein both the sensor and the data acquisition device are provided with IEPE interfaces, two-wire system coaxial cables are connected to the IEPE interfaces, the sensor and the data acquisition device are connected through the two-wire system coaxial cables, and the sensor is provided with a vibration sensitive device and a temperature sensitive device; the two-wire system coaxial cable is provided with 2 wires which are respectively a signal power supply positive connection wire and a signal power supply negative connection wire.
The communication interface is an IEPE interface, temperature signals and vibration signals can be transmitted to the data acquisition device from the sensor by using 2 wires of the two-wire coaxial cable, and the data acquisition device supplies power to the sensor at the same time.
Preferably, the sensor is further provided with a power management module, the power management module is powered by a signal power supply positive connection wire, and the power management module distributes power to other power utilization elements of the sensor.
Preferably, the sensor is provided with a low-pass filter circuit, a band-pass filter circuit and an addition circuit, the vibration sensitive device is connected to the first input end of the addition circuit through the band-pass filter circuit, the temperature sensitive device is connected to the second input end of the addition circuit through the low-pass filter circuit, and the output end of the addition circuit is connected to the positive connection wire of the signal power supply.
Preferably, the data acquisition device is provided with a signal conditioning module, an analog-to-digital conversion module and a processor, wherein the input end of the signal conditioning module and the positive connection of the signal power supply are connected in parallel with a constant current source, the output end of the signal conditioning module is connected to the input end of the analog-to-digital conversion module, and the output end of the analog-to-digital conversion module is connected to the processor.
Preferably, the addition circuit comprises a signal superposition unit and a signal power amplification unit, the signal superposition unit superposes the temperature signal subjected to low-pass filtering and the vibration signal subjected to band-pass filtering to obtain a temperature vibration superposition signal, and the signal power amplification unit amplifies the temperature vibration superposition signal and transmits the temperature vibration superposition signal to a signal power supply positive connection wire.
Preferably, the processor is provided with a low-pass digital filter and a band-pass digital filter, the temperature vibration superposition signal is conditioned by the signal conditioning module and converted by the analog-to-digital conversion module to become a temperature vibration superposition digital signal, the temperature vibration superposition digital signal passes through the low-pass digital filter to obtain a temperature signal, and the temperature vibration superposition digital signal passes through the band-pass digital filter to obtain a vibration signal.
The invention has the beneficial effects that: the quantity of the wire cores of the signal cable is saved, the wire diameter is reduced, the influence of the weight of the cable on the frequency response range of the vibration sensor is reduced, the analog signal does not influence the signal bandwidth, and the cost of the cable can be obviously reduced.
Drawings
FIG. 1 is a hardware configuration diagram of the embodiment;
FIG. 2 is a time domain signal waveform diagram of an embodiment;
FIG. 3 is a signal frequency domain waveform diagram of an embodiment;
FIG. 4 is a diagram of a signal synthesis process of an embodiment;
fig. 5 is a signal parsing process diagram of an embodiment.
Detailed Description
Example (b):
the embodiment provides a vibration and temperature integrated sensor based on two-wire system analog signal transmission, which is shown in fig. 1 and comprises a sensor and a data acquisition device, wherein the sensor and the data acquisition device are both provided with an IEPE interface, two-wire system coaxial cables are connected to the IEPE interface, and the two-wire system coaxial cables are provided with 2 conducting wires which are respectively a signal power supply positive connection wire and a signal power supply negative connection wire; the sensor is provided with a power supply management module, a vibration sensitive device, a temperature sensitive device, a low-pass filter circuit, a band-pass filter circuit and an addition circuit; the input end of the power supply management module is connected with a positive connection wire of a signal power supply, and the power supply management module distributes power for the vibration sensitive device, the temperature sensitive device, the low-pass filter circuit, the band-pass filter circuit and the addition circuit; the output end of the vibration sensitive device is connected to the input end of the band-pass filter circuit, and the output end of the band-pass filter circuit is connected to the first input end of the addition circuit; the output end of the temperature sensitive device is connected to the input end of the low-pass filter circuit, the output end of the low-pass filter circuit is connected to the second input end of the addition circuit, and the output end of the addition circuit is connected to the positive wiring of the signal power supply; the data acquisition device is provided with a signal conditioning module, an analog-to-digital conversion module and a processor, wherein the input end of the signal conditioning module and the positive wiring of a signal power supply are connected in parallel with a constant current source, the output end of the signal conditioning module is connected with the input end of the analog-to-digital conversion module, and the output end of the analog-to-digital conversion module is connected with the processor. The addition circuit comprises a signal superposition unit and a signal power amplification unit, the signal superposition unit superposes the temperature signal subjected to low-pass filtering and the vibration signal subjected to band-pass filtering to obtain a temperature vibration superposition signal, and the signal power amplification unit amplifies the temperature vibration superposition signal and transmits the temperature vibration superposition signal to a signal power supply positive connection wire. The processor is provided with a low-pass digital filter and a band-pass digital filter, the temperature vibration superposition signal is conditioned by the signal conditioning module and converted by the analog-to-digital conversion module to become a temperature vibration superposition digital signal, the temperature vibration superposition digital signal passes through the low-pass digital filter to obtain a temperature signal, and the temperature vibration superposition digital signal passes through the band-pass digital filter to obtain a vibration signal.
The sensing part of the vibration temperature integrated sensor uses the traditional piezoelectric vibration sensor, the communication interface of the invention is an IEPE interface, the IEPE interface is a signal interface of two leads shared by vibration signal output and vibration sensor power supply, the main working principle is that a constant current source is introduced from a signal power supply lead, the vibration signal is collected and then output in a voltage form after the sensor works, the output is a voltage waveform with certain voltage bias, and because the vibration signal is a dynamic alternating signal, the direct current bias part has no practical significance and can be directly filtered out in the using process. The invention utilizes the DC offset part of the output signal to transmit the temperature signal, the time domain signal waveform is shown in figure 2, and the signal frequency domain waveform is shown in figure 3. The temperature signal is a signal which changes slowly, the frequency range represented on the frequency spectrum is in a low frequency band, the vibration signal is a high frequency signal, and the range represented on the frequency spectrum is in a high frequency band. Therefore, the two signals can be combined and transmitted on the same signal cable. After the signals are collected, the two signals can be restored through a band-pass filter, so that the function of transmitting the two signals by sharing the same wire is realized.
In the signal synthesis process of the present invention, as shown in fig. 4, the temperature signal obtained from the temperature sensitive device is a signal with a full frequency band, and in order to prevent the interference of the high frequency part of the temperature signal to the vibration signal, the temperature signal is low-pass filtered, and only the lower frequency part is reserved. Similarly, in order to prevent the interference of the low-frequency part in the vibration signal to the temperature signal and the aliasing caused by the excessively high out-of-band signal, the vibration signal is firstly subjected to band-pass filtering. And the temperature signal and the vibration signal are subjected to signal superposition after being filtered. The signal power amplification is to improve the loading capacity and ensure that the long-distance transmission is not distorted.
In the signal analysis process of the present invention, as shown in fig. 5, firstly, analog-to-digital conversion is performed on an input analog signal to obtain a digital signal, then, a low-pass digital filter is used to filter a high-frequency vibration signal, so as to obtain a temperature signal, and the digital signal is subjected to band-pass filtering, so as to obtain a vibration signal of a specific frequency band.
In this embodiment:
the output sensitivity of a temperature sensitive device in the vibration temperature one-way sensor is 100 mV/DEG C; the output voltage at 25 ℃ is 8V. The output sensitivity of the internal vibration sensitive device is 100 mV/g; the frequency response range is 2-10 kHz. When the temperature of the sensor is 25 ℃; 160Hz, amplitude of 1 g. The output of the temperature sensitive device is 8V, and the output of the temperature sensitive device is a sine wave with the amplitude of 100mV and the frequency of 160 Hz. Performing low-pass filtering on the temperature signal, and setting the cut-off frequency of a filter to be 1 Hz; setting the lower cut-off frequency of a band-pass filter of the vibration sensor to be 2Hz and the upper cut-off frequency to be 10 kHz; after filtering, the two signals are introduced into an adder for synthesis, and the obtained signals are output after power amplification through an operational amplifier. The output obtained at this time was a sinusoidal voltage signal with an 8V voltage offset of 100mV amplitude and 160Hz frequency. The signal is received in the acquisition terminal and is subjected to analog-to-digital conversion, the converted digital signal is subjected to low-pass digital filtering to obtain a 0-1 Hz signal, the filtered data is averaged to obtain a temperature signal voltage 8V, and the temperature is 25 ℃ after conversion. The converted digital signal passes through a digital filter with the lower line cut-off frequency of 2Hz and the upper line cut-off frequency of 10kHz, so that a sine wave with the amplitude of 100mV and the frequency of 160Hz can be obtained, and a sine vibration signal with the vibration of 160Hz and the amplitude of 1g can be obtained through unit conversion.
Claims (6)
1. A vibration and temperature integrated sensor based on two-wire system analog signal transmission is characterized by comprising a sensor and a data acquisition device, wherein both the sensor and the data acquisition device are provided with IEPE interfaces, two-wire system coaxial cables are connected to the IEPE interfaces, the sensor and the data acquisition device are connected through the two-wire system coaxial cables, and the sensor is provided with a vibration sensitive device and a temperature sensitive device; the two-wire system coaxial cable is provided with 2 wires which are respectively a signal power supply positive connection wire and a signal power supply negative connection wire.
2. The two-wire analog signal transmission-based vibration and temperature integrated sensor as claimed in claim 1, wherein the sensor is further provided with a power management module, the power management module is powered by a signal power positive connection, and the power management module distributes power to other power utilization elements of the sensor.
3. The two-wire analog signal transmission-based vibration and temperature integrated sensor as claimed in claim 1 or 2, wherein the sensor is provided with a low-pass filter circuit, a band-pass filter circuit and an adding circuit, the vibration sensitive device is connected to the first input end of the adding circuit through the band-pass filter circuit, the temperature sensitive device is connected to the second input end of the adding circuit through the low-pass filter circuit, and the output end of the adding circuit is connected to a signal power supply positive connection wire.
4. The two-wire analog signal transmission-based vibration and temperature integrated sensor as claimed in claim 3, wherein the data acquisition device is provided with a signal conditioning module, an analog-to-digital conversion module and a processor, an input end of the signal conditioning module and a signal power positive connection are connected in parallel with a constant current source, an output end of the signal conditioning module is connected to an input end of the analog-to-digital conversion module, and an output end of the analog-to-digital conversion module is connected to the processor.
5. The two-wire analog signal transmission-based vibration and temperature integrated sensor according to claim 3, wherein the adding circuit comprises a signal superposition unit and a signal power amplification unit, the signal superposition unit superposes the low-pass filtered temperature signal and the band-pass filtered vibration signal to obtain a temperature vibration superposition signal, and the signal power amplification unit amplifies the temperature vibration superposition signal and transmits the temperature vibration superposition signal to a signal power positive connection wire.
6. The two-wire analog signal transmission-based vibration temperature integrated sensor according to claim 5, wherein the processor is provided with a low-pass digital filter and a band-pass digital filter, the temperature vibration superposition signal is conditioned by the signal conditioning module and converted by the analog-to-digital conversion module to become a temperature vibration superposition digital signal, the temperature vibration superposition digital signal passes through the low-pass digital filter to obtain a temperature signal, and the temperature vibration superposition digital signal passes through the band-pass digital filter to obtain a vibration signal.
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| CN2526226Y (en) * | 2002-01-23 | 2002-12-18 | 曹贤文 | Composite sensor for detecting bearing failure and temp rise |
| CN1963417A (en) * | 2006-11-16 | 2007-05-16 | 国家纳米技术与工程研究院 | Apparatus for measuring libration by optical fibre and measuring method |
| CN103644963A (en) * | 2013-11-28 | 2014-03-19 | 陕西千山航空电子有限责任公司 | A module and a method for acquiring and processing a vibration signal of the rotating component of a helicopter |
| CN206223291U (en) * | 2016-12-08 | 2017-06-06 | 上海华阳检测仪器有限公司 | Vialog |
| CN111896098A (en) * | 2020-07-31 | 2020-11-06 | 河北工业大学 | Embedded remote monitoring system for vibration signals |
| CN213363809U (en) * | 2020-11-26 | 2021-06-04 | 江苏江凌测控科技股份有限公司 | Current type multi-parameter sensor for monitoring rotating machinery |
-
2021
- 2021-12-24 CN CN202111599569.0A patent/CN114526767A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1274075A (en) * | 2000-04-24 | 2000-11-22 | 谭维克 | Multi-signal processing circuit, compund sensor and following detector thereof |
| CN2526226Y (en) * | 2002-01-23 | 2002-12-18 | 曹贤文 | Composite sensor for detecting bearing failure and temp rise |
| CN1963417A (en) * | 2006-11-16 | 2007-05-16 | 国家纳米技术与工程研究院 | Apparatus for measuring libration by optical fibre and measuring method |
| CN103644963A (en) * | 2013-11-28 | 2014-03-19 | 陕西千山航空电子有限责任公司 | A module and a method for acquiring and processing a vibration signal of the rotating component of a helicopter |
| CN206223291U (en) * | 2016-12-08 | 2017-06-06 | 上海华阳检测仪器有限公司 | Vialog |
| CN111896098A (en) * | 2020-07-31 | 2020-11-06 | 河北工业大学 | Embedded remote monitoring system for vibration signals |
| CN213363809U (en) * | 2020-11-26 | 2021-06-04 | 江苏江凌测控科技股份有限公司 | Current type multi-parameter sensor for monitoring rotating machinery |
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