CN114517041B - Film forming composition, preparation method and application thereof - Google Patents
Film forming composition, preparation method and application thereof Download PDFInfo
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- CN114517041B CN114517041B CN202011295071.0A CN202011295071A CN114517041B CN 114517041 B CN114517041 B CN 114517041B CN 202011295071 A CN202011295071 A CN 202011295071A CN 114517041 B CN114517041 B CN 114517041B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D135/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D135/06—Copolymers with vinyl aromatic monomers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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Abstract
The invention relates to a film forming composition, a preparation method and application thereof. The film forming composition with high solid content, proper viscosity and easy spraying construction is obtained by proportioning 30-50 parts by mass of acrylic resin, 1-2 parts by mass of metal chelating agent, 3-5 parts by mass of coupling agent, 40-60 parts by mass of leveling agent, crosslinking agent and solvent. In the spraying construction, the film forming composition has good spraying effect, and the problems of broken spraying lines, nozzle blockage and the like are not easy to occur. The film forming composition is sprayed on the surface of a substrate, and a film layer with good stability, excellent adhesive force, high transparency and yellowing resistance can be formed on the surface of the substrate. Then, the electronic equipment can be made to show various appearances and textures by matching with coating processing.
Description
Technical Field
The invention relates to the technical field of film processing, in particular to a film forming composition, a preparation method and application thereof.
Background
With the popularization of electronic devices, consumers have increasingly demanded the appearance of the electronic devices. In order to meet the diversified requirements of appearance, the processing of the film layer is particularly important. The film layer with excellent performance has good stability and adhesive force, and meanwhile, the signal transmission of the electronic equipment is not influenced. However, the conventional film layer has poor stability and poor adhesion, and particularly when film coating is required on the surface of the film layer to improve the appearance of the electronic device, the conventional film layer is more difficult to maintain stable, and even the substrate under the film layer is adversely affected during the film coating process.
Disclosure of Invention
Based on this, it is necessary to provide a film-forming composition, a method for preparing the same and use thereof. The film forming composition can form a film layer with good stability and excellent adhesive force on the surface of a substrate. After the film forming composition forms a film layer on the surface of the substrate, the film forming composition is matched with subsequent film coating processing, so that the electronic equipment can show various appearances and textures.
In order to solve the technical problems, the invention adopts the following technical scheme:
the invention aims to provide a film forming composition, which comprises the following components in parts by weight: 30-50 parts of acrylic resin, 1-2 parts of metal chelating agent, 1-2 parts of coupling agent, 0.1-0.5 part of leveling agent, 3-5 parts of cross-linking agent and 40-60 parts of solvent.
In one embodiment, the film-forming composition comprises the following components in parts by weight: 35-45 parts of acrylic resin, 1-1.5 parts of metal chelating agent, 1-1.5 parts of coupling agent, 0.2-0.5 part of flatting agent, 4-5 parts of cross-linking agent and 50-60 parts of solvent.
In one embodiment, the film-forming composition comprises the following components in parts by weight: 40 parts of acrylic resin, 1 part of metal chelating agent, 1 part of coupling agent, 0.5 part of leveling agent, 5 parts of cross-linking agent and 52.5 parts of solvent.
In one embodiment, the acrylic resin has a structure represented by formula (1);
wherein l, m, n, o are positive integers; r is alkyl.
In one embodiment, the acrylic resin has a weight average molecular weight of 6000 to 15000; and/or the number of the groups of groups,
the acid value of the acrylic resin is 20mgKOH/g-80mgKOH/g; and/or the number of the groups of groups,
the solid content of the acrylic resin is 20% -60%.
In one embodiment, the metal chelator is at least one of titanium acetylacetonate, zirconium acetylacetonate, aluminum acetylacetonate, iron acetylacetonate, and magnesium acetylacetonate; and/or the number of the groups of groups,
the cross-linking agent is epoxy resin; and/or the number of the groups of groups,
the coupling agent is a silane coupling agent.
In one embodiment, the solvent is at least one of an ester, an alcohol, an ether, a ketone, and an amide.
In one embodiment, the solvent has a boiling point of 150 ℃ to 230 ℃.
An object of the present invention is to provide a method for producing a film-forming composition, comprising the steps of:
respectively preparing 30-50 parts by mass of acrylic resin, 1-2 parts by mass of metal chelating agent, 0.1-0.5 part by mass of coupling agent, 3-5 parts by mass of leveling agent, 40-60 parts by mass of cross-linking agent and solvent;
mixing the acrylic resin, the metal chelating agent, the coupling agent, the leveling agent, the crosslinking agent, and the solvent.
It is an object of the present invention to provide a film-forming composition as described in any of the above embodiments and/or the use of a film-forming composition obtained by a method as described in any of the above embodiments for the preparation of a film layer.
An object of the present invention is to provide a film layer sprayed from the film forming composition described in any of the above embodiments and/or the film forming composition obtained by the above preparation method.
In one embodiment, the membrane layer is an OC0 layer.
It is an object of the present invention to provide a housing comprising a film layer as described in any of the embodiments above and a substrate, the film layer being located on at least one surface of the substrate.
In one embodiment, the film layer has a thickness of 1 μm to 2 μm.
In one embodiment, the housing further comprises a coating layer, and the coating layer is located on a surface of the coating layer away from the substrate.
An object of the present invention is to provide a method for preparing a shell according to any of the above embodiments, the method comprising the steps of:
transferring the film-forming composition to at least one surface of the substrate to obtain a shell preform;
and baking the shell preform.
In one embodiment, the film-forming composition is sprayed onto at least one surface of the substrate.
In one embodiment, the baking includes the steps of: performing first baking on the shell preform, and then performing second baking;
the temperature of the first baking is 100-120 ℃ and the time is 3-5 min;
the temperature of the second baking is 200-250 ℃ and the time is 30-60 min.
An object of the present invention is to provide an electronic device comprising a film layer as described in any of the embodiments above and/or a housing as described in any of the embodiments above.
According to the invention, the film forming composition with high solid content, proper viscosity and easy spraying construction is obtained by proportioning 30-50 parts by mass of acrylic resin, 1-2 parts by mass of metal chelating agent, 0.1-0.5 part by mass of coupling agent, 3-5 parts by mass of leveling agent, 40-60 parts by mass of cross-linking agent and solvent. In the spraying construction, the film forming composition has good spraying effect, and the problems of broken spraying lines, nozzle blockage and the like are not easy to occur. The film forming composition is sprayed on the surface of a substrate, and a film layer with good stability, excellent adhesive force, high transparency and yellowing resistance can be formed on the surface of the substrate. Then, the electronic equipment can be made to show various appearances and textures by matching with coating processing.
After the film forming composition is sprayed and processed into a film layer, the film layer with excellent hardness can be obtained through solidification.
According to the preparation method of the film forming composition, after 30-50 parts by mass of acrylic resin, 1-2 parts by mass of metal chelating agent, 1-2 parts by mass of coupling agent, 0.1-0.5 part by mass of leveling agent, 3-5 parts by mass of crosslinking agent and 40-60 parts by mass of solvent are prepared, the film forming composition can be obtained by mixing the components. The preparation method is simple and feasible, and is suitable for industrial popularization.
Detailed Description
In order that the invention may be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments that are illustrated in the appended drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
In the description of the present invention, a list of items connected by the terms "at least one of," "at least one of," or other similar terms may mean any combination of the listed items. For example, if items A and B are listed, the phrase "at least one of A and B" means either only A, or only B, or both A and B. In other examples, if items A, B and C are listed, then the phrase "at least one of A, B and C" means a alone, or B alone, or C alone, or a and B (excluding C), or a and C (excluding B), or B and C (excluding a), or all of a and B and C. While item a may contain a single unit or multiple units. Item B may comprise a single unit or multiple units. Item C may comprise a single unit or multiple units.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
An embodiment of the invention provides a film forming composition, which comprises the following components in parts by mass: 30-50 parts of acrylic resin, 1-2 parts of metal chelating agent, 1-2 parts of coupling agent, 0.1-0.5 part of leveling agent, 3-5 parts of cross-linking agent and 40-60 parts of solvent.
In the embodiment, the film forming composition with high solid content, proper viscosity and easy spraying construction is obtained by respectively proportioning 30-50 parts by mass of acrylic resin, 1-2 parts by mass of metal chelating agent, 1-2 parts by mass of coupling agent, 0.1-0.5 part by mass of leveling agent, 3-5 parts by mass of cross-linking agent and 40-60 parts by mass of solvent. The film forming composition is sprayed on the surface of a substrate, and a film layer with good stability, excellent adhesive force, high transparency and yellowing resistance can be formed on the surface of the substrate. Then, the electronic equipment can be made to show various appearances and textures by matching with coating processing.
Further, the film forming composition comprises the following components in parts by weight: 35-45 parts of acrylic resin, 1-1.5 parts of metal chelating agent, 1-1.5 parts of coupling agent, 0.2-0.5 part of flatting agent, 4-5 parts of cross-linking agent and 50-60 parts of solvent.
Further, the film forming composition comprises the following components in parts by weight: 38-40 parts of acrylic resin, 1-1.2 parts of metal chelating agent, 1-1.2 parts of coupling agent, 0.3-0.5 part of leveling agent, 4.5-5 parts of cross-linking agent and 50-55 parts of solvent.
Specifically, the film forming composition comprises the following components in parts by weight: 40 parts of acrylic resin, 1 part of metal chelating agent, 1 part of coupling agent, 0.5 part of leveling agent, 5 parts of cross-linking agent and 52.5 parts of solvent.
As a specific example of the present invention, a film-forming composition is composed of the following components in parts by mass: 30-50 parts of acrylic resin, 1-2 parts of metal chelating agent, 1-2 parts of coupling agent, 0.1-0.5 part of leveling agent, 3-5 parts of cross-linking agent and 40-60 parts of solvent.
In a specific example, the film-forming composition consists of the following components in parts by weight: 35-45 parts of acrylic resin, 1-1.5 parts of metal chelating agent, 1-1.5 parts of coupling agent, 0.2-0.5 part of flatting agent, 4-5 parts of cross-linking agent and 50-60 parts of solvent.
In a specific example, the film-forming composition consists of the following components in parts by weight: 38-40 parts of acrylic resin, 1-1.2 parts of metal chelating agent, 1-1.2 parts of coupling agent, 0.3-0.5 part of leveling agent, 4.5-5 parts of cross-linking agent and 50-55 parts of solvent.
In a specific example, the film-forming composition consists of the following components in parts by weight: 40 parts of acrylic resin, 1 part of metal chelating agent, 1 part of coupling agent, 0.5 part of leveling agent, 5 parts of cross-linking agent and 52.5 parts of solvent.
In a specific example, the acrylic resin has a carboxyl group in its structure.
As a preferable example, the acrylic resin has a structure represented by formula (1);
wherein l, m, n, o is a positive integer; r is alkyl.
In the description of the invention, R is alkyl, which may be a straight chain saturated hydrocarbon structure; "alkyl" may also be a branched or cyclic hydrocarbon structure. Specifically, an "alkyl" group may be a straight-chain saturated hydrocarbon structure having a plurality of carbon atoms; "alkyl" may also be a branched or cyclic hydrocarbon structure having multiple carbon atoms. In some specific examples, an "alkyl" group may be a straight chain saturated hydrocarbon structure having 1 to 20 carbon atoms; "alkyl" may also be a branched or cyclic hydrocarbon structure having 3 to 20 carbon atoms. For example, the alkyl group may be an alkyl group of 1 to 20 carbon atoms, an alkyl group of 1 to 10 carbon atoms, an alkyl group of 1 to 5 carbon atoms, an alkyl group of 5 to 20 carbon atoms, an alkyl group of 5 to 15 carbon atoms, or an alkyl group of 5 to 10 carbon atoms. When an alkyl group having a specific carbon number is specified, all geometric isomers having that carbon number are encompassed. Thus, for example, reference to "butyl" is intended to include n-butyl, sec-butyl, isobutyl, tert-butyl and cyclobutyl. "propyl" is meant to include n-propyl, isopropyl and cyclopropyl. Alkyl groups include, but are not limited to, methyl, ethyl, n-propyl, isopropyl, cyclopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, cyclobutyl, n-pentyl, isopentyl, neopentyl, cyclopentyl, methylcyclopentyl, ethylcyclopentyl, n-hexyl, isohexyl, cyclohexyl, n-heptyl, octyl, cyclopropyl, cyclobutyl, norbornyl, and the like. In addition, "alkyl" may be optionally substituted.
In a specific example, the weight average molecular weight of the acrylic resin is 6000 to 15000. The weight average molecular weight of the acrylic resin is 6000 to 15000 in terms of polystyrene as measured by gel permeation chromatography. For example, the weight average molecular weight of the acrylic resin may be 7000, 8000, 9000, 10000, 11000, 12000, 13000, 14000. When the weight average molecular weight of the acrylic resin is less than 6000, the adhesion performance with the base material is poor, and the adhesion force of the obtained film layer is poor. For example, when the substrate is glass, the acrylic resin has a weight average molecular weight of less than 6000, the film-forming composition has poor adhesion to glass, and the resulting film has poor adhesion. When the weight average molecular weight of the acrylic resin is higher than 15000, the viscosity of the film-forming composition is too high to facilitate spray application.
In a specific example, the acrylic resin has an acid value of 20mgKOH/g to 80mgKOH/g. The acrylic resin having an acid value of 20mgKOH/g to 80mgKOH/g can give a film-forming composition excellent in adhesion and can improve the stability of the film-forming composition. When the acid value of the film-forming composition is less than 20mgKOH/g, the improvement of the adhesion of the film-forming composition is not favored; when the acid value of the film-forming composition is more than 80mgKOH/g, the stability of the film-forming composition is lowered, and particularly the moisture resistance of the film layer is lowered, which is disadvantageous for improving the stability of the film layer.
In a specific example, the acrylic resin has a solids content of 20% to 60%. For example, the solids content of the acrylic resin may be 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%.
As a preferable embodiment, among the components of the film-forming composition, the acrylic resin is selected from acrylic resins having a structure represented by formula (1), and the acrylic resin having a structure represented by formula (1) has a weight average molecular weight of 6000 to 15000, an acid value of 20mgKOH/g to 80mgKOH/g, and a solid content of 20% to 60%.
In a specific example, the metal chelator is at least one of titanium acetylacetonate, zirconium acetylacetonate, aluminum acetylacetonate, iron acetylacetonate, and magnesium acetylacetonate. The addition of the metal chelating agent causes the metal chelating agent to react with other components such as acrylic resin in the film forming composition to form a three-dimensional mesh structure, and the three-dimensional mesh structure is introduced into the film layer, so that the film density of the film layer can be improved, and further, the chemical resistance, the moist heat resistance and the artificial sweat resistance of the film layer can be improved. Further, when the film-forming composition forms a film layer, the reaction degree of the metal chelating agent can be improved by the curing process, the film density of the film layer can be further improved, and the chemical resistance, the wet heat resistance and the artificial sweat resistance of the film layer can be further improved.
Preferably, the metal chelator is aluminum acetylacetonate and/or zirconium acetylacetonate. When the film layer is required to have high transparency, the metal chelating agent is aluminum acetylacetonate and/or zirconium acetylacetonate, so that the transparency of the film layer can be improved.
Further, when the film layer is required to have a color, the metal chelating agent is iron acetylacetonate and/or magnesium acetylacetonate.
In one specific example, the cross-linking agent is an epoxy resin. Further, the cross-linking agent is biphenyl type epoxy resin. The biphenyl type epoxy resin can improve the moisture resistance of the film and improve the stability of the film. As a specific example, the crosslinking agent is NC-3000 series epoxy resin of japan chemical corporation and/or YX-4000H epoxy resin of mitsubishi corporation, the NC-3000 series epoxy resin has a biphenyl structure-containing phenolic resin as a main chain, has high hydrophobicity, can reduce hygroscopicity of the film layer, and the NC-3000 series epoxy resin is compounded with other components in the film-forming composition, can exhibit high crosslinking density, and can improve stability and yellowing resistance of the film layer.
In a specific example, the coupling agent is a silane coupling agent. Preferably, the coupling agent is a ketimine type silane coupling agent. When the film forming composition forms a film, the ketimine silane coupling agent can react with carboxyl in the acrylic resin, so that the film density of the film layer is further improved. In particular, the film forming composition is baked to form a film, so that the reaction of the ketimine type silane coupling agent and carboxyl in the acrylic resin can be further promoted, and the film density of the film layer can be further improved. In a specific example, the coupling agent may be, but is not limited to, KBE-9103P coupling agent from Xinyue chemical industries, inc.
In a specific example, the leveling agent is selected from the group consisting of nonionic perfluoroalkyl and lipophilic group oligomers leveling agents, for example, the leveling agent may be MEGAFACEF-477 of Dain ink chemical Co., ltd.
In a specific example, the solvent is at least one of an ester, an alcohol, an ether, a ketone, and an amide. Preferably, the solvent is at least one of a fatty alcohol, (poly) alkylene glycol ether and lactone. Further, the solvent is an amide-based polar solvent and/or a lactone-based polar solvent.
In a specific example, the solvent has a boiling point of 150 ℃ to 230 ℃. The boiling point of the solvent is lower than 150 ℃, and the solvent is dried too fast, so that the spraying construction is not facilitated; the boiling point of the solvent is higher than 230 ℃, the volatilization is too slow, and the film layer is easy to have solvent residues.
In another embodiment, the present invention provides a method for preparing a film-forming composition, comprising the steps of:
respectively preparing 30-50 parts by mass of acrylic resin, 1-2 parts by mass of metal chelating agent, 0.1-0.5 part by mass of coupling agent, 3-5 parts by mass of leveling agent, 40-60 parts by mass of cross-linking agent and solvent;
mixing acrylic resin, metal chelating agent, coupling agent, leveling agent, cross-linking agent and solvent.
In a specific example, the following parts by weight are prepared: 35-45 parts of acrylic resin, 1-1.5 parts of metal chelating agent, 1-1.5 parts of coupling agent, 0.2-0.5 part of flatting agent, 4-5 parts of cross-linking agent and 50-60 parts of solvent.
In a specific example, the following parts by weight are prepared: 38-40 parts of acrylic resin, 1-1.2 parts of metal chelating agent, 1-1.2 parts of coupling agent, 0.3-0.5 part of leveling agent, 4.5-5 parts of cross-linking agent and 50-55 parts of solvent.
In a specific example, the following parts by weight are prepared: 40 parts of acrylic resin, 1 part of metal chelating agent, 1 part of coupling agent, 0.5 part of leveling agent, 5 parts of cross-linking agent and 52.5 parts of solvent.
In a specific example, the method of preparing the film-forming composition further includes the step of mixing the acrylic resin, the metal chelating agent, the coupling agent, the leveling agent, the crosslinking agent, and the solvent, followed by filtration.
Preferably, the filtration is carried out using a filter cartridge of 0.2 μm to 1. Mu.m. Further preferably, the filtration is carried out using a 0.5 μm filter element.
The invention also provides an application of the film-forming composition and/or the film-forming composition obtained by the preparation method in preparation of a film layer.
In another embodiment of the present invention, a film layer is provided, which is sprayed from the film-forming composition and/or the film-forming composition obtained by the preparation method.
In one specific example, the membrane layer is an OC0 layer. The OC0 layer is a spray-coating anti-breaking layer.
Another embodiment of the present invention provides a housing comprising the above film layer and a substrate, wherein the film layer is located on at least one surface of the substrate.
In a specific example, the substrate is a glass substrate, a ceramic substrate, a metal substrate, or a plastic substrate. It is to be understood that the substrate may be a substrate after the steps of transfer printing, plating, etc., that is, the substrate may be a substrate having a functional layer.
In a specific example, the film layer has a thickness of 1 μm to 2 μm.
In a specific example, the housing further includes a coating layer, the coating layer being located on a surface of the coating layer remote from the substrate. In order to make the product have various appearances and good hardness, a coating layer is usually processed on the surface of the substrate by adopting a coating mode. However, it is difficult to obtain a good plating effect by directly processing the plating layer on the surface of the substrate, and the substrate is adversely affected. In particular, in order to obtain various appearances of products, NVCM (discontinuous coating technology) mode is a mainstream trend, and NVCM can obtain metallic appearance without affecting signal transmission effect. However, NVCM mode tends to reduce the strength of the substrate, resulting in difficulty in improving or even reducing the final product properties. The conventional film layer performs poorly as a transition layer of the coating layer. The transition layer of the film layer as the film coating layer can enable the film coating layer to show better performance on the basis of keeping the stable performance of the base material.
In still another embodiment of the present invention, a method for preparing the above-mentioned shell is provided, which includes the following steps:
transferring the film-forming composition to at least one surface of a substrate to obtain a shell preform;
baking the shell preform.
In one specific example, the film-forming composition is sprayed onto at least one surface of the substrate. The film forming composition has good spraying effect, is not easy to cause the problems of broken spraying lines, nozzle blockage and the like, and has good spraying construction performance.
In one specific example, the baking includes the steps of: the shell preform is subjected to first baking and then subjected to second baking; the temperature of the first baking is 100-120 ℃ and the time is 3-5 min; the second baking temperature is 200-250 deg.c for 30-60 min.
In still another embodiment, the invention provides an electronic device, which includes the film layer and/or the housing obtained by the method for manufacturing the housing.
It is understood that the electronic device may be, but is not limited to, a mobile phone, a notebook computer, a tablet computer, a battery pack, a display, and the like. In a specific example, the film layer and/or the case serve as a casing and/or a protective cover plate for the electronic product. When the substrate is a transparent substrate, the film layer and/or the housing may serve as a display screen for an electronic device.
The following are specific examples.
Example 1
In this embodiment, the film-forming composition comprises the following components in percentage by mass: 40 parts of acrylic resin, 1 part of metal chelating agent, 1 part of coupling agent, 0.5 part of leveling agent, 5 parts of cross-linking agent and 52.5 parts of solvent.
Wherein the acrylic resin has a structure represented by the formula (1) and has a solid content of 40%, an acid value of 50mgKOH/g and a weight average molecular weight of 11000. The metal chelating agent is aluminum acetylacetonate. The coupling agent is KBE-9103P coupling agent. The leveling agent is F-477 leveling agent. The cross-linking agent is NC-3000 epoxy resin. The solvent is ethyl 3-ethoxypropionate.
After the raw materials are uniformly mixed, the mixture is filtered by a filter element with the diameter of 0.5 mu m. A film-forming composition is obtained.
Example 2
Compared with embodiment 1, this embodiment is different in that: the film forming composition comprises the following components in percentage by mass: 38 parts of acrylic resin, 1.5 parts of metal chelating agent, 1.2 parts of coupling agent, 0.3 part of leveling agent, 4 parts of crosslinking agent and 55 parts of solvent.
Example 3
Compared with embodiment 1, this embodiment is different in that: the metal chelating agent is magnesium acetylacetonate.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (16)
1. A film-forming composition characterized by: comprises the following components in parts by weight: 30-50 parts of acrylic resin, 1-2 parts of metal chelating agent, 1-2 parts of coupling agent, 0.1-0.5 part of leveling agent, 3-5 parts of cross-linking agent and 40-60 parts of solvent;
the acid value of the acrylic resin is 20mgKOH/g-80mgKOH/g;
the weight average molecular weight of the acrylic resin is 6000-15000;
the acrylic resin has a structure represented by formula (1);
wherein l, m, n, o are positive integers; r is alkyl;
the metal chelating agent is at least one of titanium acetylacetonate, zirconium acetylacetonate, aluminum acetylacetonate, iron acetylacetonate and magnesium acetylacetonate; the cross-linking agent is epoxy resin.
2. The film-forming composition of claim 1, wherein: comprises the following components in parts by weight: 35-45 parts of acrylic resin, 1-1.5 parts of metal chelating agent, 1-1.5 parts of coupling agent, 0.2-0.5 part of flatting agent, 4-5 parts of cross-linking agent and 50-60 parts of solvent.
3. The film-forming composition of claim 2, wherein: comprises the following components in parts by weight: 40 parts of acrylic resin, 1 part of metal chelating agent, 1 part of coupling agent, 0.5 part of leveling agent, 5 parts of cross-linking agent and 52.5 parts of solvent.
4. A film-forming composition according to any one of claims 1 to 3, wherein: the solid content of the acrylic resin is 20% -60%.
5. A film-forming composition according to any one of claims 1 to 3, wherein: the coupling agent is a silane coupling agent.
6. A film-forming composition according to any one of claims 1 to 3, wherein: the solvent is at least one of ester, alcohol, ether, ketone and amide.
7. The film-forming composition of claim 6, wherein: the boiling point of the solvent is 150-230 ℃.
8. A film layer, characterized in that: a spray-coated film-forming composition as claimed in any one of claims 1 to 7.
9. The film layer of claim 8, wherein: the film layer is a spraying anti-breaking layer.
10. A housing, characterized in that: comprising a film layer according to any of claims 8-9 and a substrate, said film layer being located on at least one surface of said substrate.
11. The housing of claim 10, wherein the film layer has a thickness of 1 μm to 2 μm.
12. The housing according to any one of claims 10-11, wherein: the coating layer is positioned on the surface of the coating layer far away from the base material.
13. A method of manufacturing a shell according to any one of claims 10 to 12, wherein: the method comprises the following steps:
transferring the film-forming composition to at least one surface of the substrate to obtain a shell preform;
and baking the shell preform.
14. A method of making a shell as defined in claim 13, wherein: the film-forming composition is sprayed onto at least one surface of the substrate.
15. A method of manufacturing a shell according to any one of claims 13 to 14, wherein: the baking includes the steps of: performing first baking on the shell preform, and then performing second baking;
the temperature of the first baking is 100-120 ℃ and the time is 3-5 min;
the temperature of the second baking is 200-250 ℃ and the time is 30-60 min.
16. An electronic device, characterized in that: comprising a film layer according to any of claims 8-9 and/or a housing according to any of claims 10-12.
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| JP5648494B2 (en) * | 2011-01-25 | 2015-01-07 | 住友化学株式会社 | Adhesive sheet, optical film with adhesive, and optical laminate |
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