CN114513926B

CN114513926B - Heat dissipation joint debugging method, system, device and storage medium for multiple devices in cabinet

Info

Publication number: CN114513926B
Application number: CN202011280843.3A
Authority: CN
Inventors: 韩云超; 林沛庆; 卢冬明
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-11-16
Filing date: 2020-11-16
Publication date: 2023-10-13
Anticipated expiration: 2040-11-16
Also published as: CN114513926A; WO2022100740A1

Abstract

The embodiment of the application provides a heat dissipation joint debugging method, a heat dissipation joint debugging system, a heat dissipation joint debugging device and a heat dissipation joint debugging storage medium for a plurality of devices in a cabinet. The method comprises the following steps: the method comprises the steps of obtaining working parameters of each device in the cabinet, wherein the working parameters at least comprise: the current temperature of each device and the rotating speed of the heat dissipation device corresponding to each device; judging whether the current temperatures of the plurality of devices are higher than the preset temperatures corresponding to the devices; if the current temperature of one of the plurality of devices is higher than the preset temperature corresponding to the device, the rotation speed of the heat dissipation device corresponding to all or part of the devices in the plurality of devices is adjusted upwards according to the rotation speed of the heat dissipation device corresponding to the device. According to the embodiment of the application, through linkage speed regulation among a plurality of devices in the cabinet, the problem that the rotating speed of individual devices is abnormally high or is abnormally low when the heat dissipation speed of the plurality of devices in the cabinet is regulated is avoided, so that the noise in the devices in the cabinet can be effectively reduced, and the heat dissipation capacity in the devices in the cabinet is improved.

Description

Heat dissipation joint debugging method, system, device and storage medium for multiple devices in cabinet

Technical Field

The present application relates to the field of communications technologies, and in particular, to a method, a system, an apparatus, and a storage medium for heat dissipation joint debugging of multiple devices in a cabinet.

Background

With the continuous development of communication technology, high speed, low latency and large capacity have become the main direction of the competing layout of large telecommunication equipment vendors in the transport network field. With the consequent significant increase in the demand for high performance, high integration devices. For example, communication devices with high integration are currently popular in the market, and the market demand is strong.

In the prior art, a plurality of devices with the same or different functions are usually placed in one cabinet. The high integration level of a cabinet with multiple frames greatly improves the product integration level and the market competitiveness, but the problem of heat dissipation is still a great challenge in the industry at present. In order to dispel the heat to equipment, every equipment is inside all to be provided with fan subassembly, and fan subassembly includes at least one fan for equipment heat dissipation cooling to avoid the too high unsafe hidden danger or the accident that takes place of temperature in the equipment. In general, the fan assembly in each device in the cabinet is independently operated to perform rotational speed adjustment so as to complete temperature regulation and control of each device. For example, when three devices are arranged in the cabinet, fan assemblies are arranged in the three devices, if the temperature of one device is too high or too low, the temperature in the device is regulated and controlled by regulating the rotating speed of the fan assemblies in the device, and if the temperature of the other two devices is normal, the fan assemblies in the two devices still maintain the original rotating speed and working state. The mode is easy to cause the problems of obvious increase of noise in the equipment under normal temperature or insufficient heat dissipation capacity in the equipment under high temperature.

Disclosure of Invention

The embodiment of the application provides a heat dissipation joint debugging method, a heat dissipation joint debugging system, a heat dissipation joint debugging device and a heat dissipation joint debugging storage medium for a plurality of devices in a cabinet, which can reduce noise in the devices and improve heat dissipation capacity in the devices.

A first aspect of an embodiment of the present application provides a heat dissipation joint adjustment method for a plurality of devices, which is applied to heat dissipation of a plurality of devices in a cabinet, including: acquiring working parameters of each device in the cabinet, wherein the working parameters at least comprise: the temperature of each device and the rotating speed of the heat dissipation device corresponding to each device; judging whether the current temperatures of the plurality of devices are higher than preset temperatures corresponding to the devices or not; if the current temperature of one of the plurality of devices is higher than the preset temperature corresponding to the device, the rotating speed of all the devices or part of the heat dissipation devices corresponding to the devices in the plurality of devices is adjusted upwards according to the rotating speed of the heat dissipation devices corresponding to the devices.

According to the heat radiation joint debugging method for the plurality of devices, when the current temperature of one of the plurality of devices in the cabinet is higher than the preset temperature corresponding to the device, the rotation speed of all the devices or the heat dissipation devices corresponding to part of the devices in the plurality of devices is adjusted upwards according to the rotation speed of the heat dissipation devices corresponding to the device, and when the temperature of one of the devices is too high (for example, the temperature of the device positioned at the top of the cabinet is too high) under normal temperature conditions, the rotation speed of the fan of all the devices or part of the devices in the cabinet is adjusted to realize the temperature regulation of the equipment of the cabinet, so that the increase of the rotation speeds of the fans corresponding to other devices in the cabinet can also perform heat radiation to a certain extent for the devices positioned at the top of the cabinet, the rotation speed of the fan in the device positioned at the top of the cabinet is not too high, the problem of noise rise in the device under normal temperature conditions can be avoided, and the whole noise of the whole cabinet can be reduced. In addition, under the high temperature condition, if the temperature of the equipment positioned at the top of the cabinet is too high but the temperature of the equipment positioned at the bottom of the cabinet is not too high, the embodiment of the application realizes the temperature regulation and control of the equipment of the cabinet by regulating the fan rotating speeds of all the equipment or part of the equipment in the cabinet.

In a possible implementation manner, the determining whether the current temperatures of the plurality of devices are higher than the preset temperatures corresponding to the devices further includes: and if the current temperature of each device in the plurality of devices is lower than the preset temperature corresponding to the device, the rotating speed of the heat dissipating device corresponding to each device is adjusted downwards according to the rotating speed of the heat dissipating device corresponding to each device.

Like this, if the current temperature of every equipment in a plurality of equipment all is less than the preset temperature that the equipment corresponds, all carry out down regulation with the heat abstractor that every equipment corresponds, compare in prior art if the temperature of one of a plurality of equipment is less than the preset temperature that this equipment corresponds in a plurality of equipment, all carry out down regulation with the heat abstractor that this equipment corresponds, can reduce the regulation number of times to the heat abstractor's that the equipment corresponds rotational speed, improve work efficiency to a certain extent.

In a possible implementation manner, the determining whether the current temperatures of the plurality of devices are higher than the preset temperatures corresponding to the devices further includes: and if the current temperature of part of the equipment in the plurality of equipment is lower than the preset temperature corresponding to the equipment, the rotating speed of the heat dissipation device corresponding to the part of the equipment is adjusted downwards according to the rotating speed of the heat dissipation device corresponding to the part of the equipment.

In this way, if the current temperature of some of the devices is lower than the preset temperature corresponding to the device, the rotation speed of the heat dissipating device corresponding to the some device is adjusted downward.

In one possible implementation manner, when the current temperature of one of the devices is higher than the preset temperature corresponding to the device, the rotation speeds of the heat dissipation devices corresponding to all the devices in the devices are adjusted upwards, the rotation speeds of the heat dissipation devices corresponding to the devices are sequentially reduced or sequentially increased, and the rotation speed difference between the heat dissipation devices corresponding to two adjacent devices in the devices is kept constant.

Or when the current temperature of one of the devices is higher than the preset temperature corresponding to the device, the rotation speed of the heat dissipating device corresponding to some of the devices is adjusted upwards, the rotation speed of the heat dissipating device corresponding to some of the devices is reduced or increased in sequence, and the rotation speed difference between the heat dissipating devices corresponding to two adjacent devices in some of the devices is kept constant.

In one possible implementation manner, when the temperatures of all the devices in the plurality of devices are lower than the preset temperatures corresponding to the devices, the rotation speeds of the heat dissipation devices corresponding to all the devices in the plurality of devices are adjusted downwards, the rotation speeds of the heat dissipation devices corresponding to the plurality of devices are sequentially reduced or sequentially increased, and the rotation speed difference between the heat dissipation devices corresponding to two adjacent devices in the part of devices is kept constant.

When the temperature of a part of the devices is lower than the preset temperature corresponding to the devices, the rotating speeds of the heat dissipation devices corresponding to the devices in the devices are adjusted downwards, the rotating speeds of the heat dissipation devices corresponding to the devices in the devices are reduced or increased in sequence, and the rotating speed difference between the heat dissipation devices corresponding to the adjacent two devices in the devices is kept constant.

In one possible implementation, the number of devices within the cabinet is at least three; when the current temperature of one of the at least three devices is higher than the preset temperature corresponding to the device, the rotation speeds of the heat dissipating devices corresponding to all the at least three devices are adjusted upwards, the rotation speeds of the heat dissipating devices corresponding to the plurality of devices are sequentially reduced or sequentially increased, and the rotation speed difference between one of the heat dissipating devices corresponding to the plurality of devices and the two adjacent heat dissipating devices is the same.

Or when the current temperature of one of the at least three devices is higher than the preset temperature corresponding to the device, the rotation speed of the heat dissipating device corresponding to part of the at least three devices is adjusted upwards, the rotation speed of the heat dissipating device corresponding to part of the devices is reduced or increased in sequence, and the rotation speed difference between one of the heat dissipating devices corresponding to part of the devices and the two adjacent heat dissipating devices is the same.

In one possible implementation, the number of devices within the cabinet is at least three; when the temperature of all the devices in the at least three devices is lower than the preset temperature corresponding to the devices, the rotation speeds of the heat dissipation devices corresponding to all the devices in the at least three devices are adjusted downwards, the rotation speeds of the heat dissipation devices corresponding to the devices are sequentially reduced or sequentially increased, and the rotation speed difference between one of the heat dissipation devices corresponding to the devices and two adjacent heat dissipation devices is the same.

Or when the temperature of part of the equipment in the at least three equipment is lower than the preset temperature corresponding to the equipment, the rotating speeds of the heat dissipating devices corresponding to the part of the equipment in the at least three equipment are all adjusted downwards, the rotating speeds of the heat dissipating devices corresponding to the part of the equipment are sequentially reduced or sequentially increased, and the rotating speed difference between one of the heat dissipating devices corresponding to the part of the equipment and two adjacent heat dissipating devices is the same.

In one possible implementation, the method further includes: acquiring the temperature of each device after being adjusted up or down in a preset time period; judging whether the current temperature of each device is higher than the preset temperature corresponding to the device; if the current temperature of one of the devices is higher than the preset temperature corresponding to the device, continuing to adjust the rotating speed of the heat dissipating device corresponding to each device upwards until the temperature of the device is lower than or equal to the preset temperature corresponding to the device; or if the current temperature of each device is lower than the preset temperature corresponding to the device, continuing to downwards regulate the rotating speed of the heat dissipating device corresponding to each device.

Through the setting, the temperature of equipment in the cabinet can be monitored and regulated more accurately, and the problems that unsafe accidents occur due to overhigh equipment temperature and the power consumption of the heat dissipation device is wasted due to overlow equipment temperature are avoided.

In one possible implementation manner, before or after the acquiring the operating parameter of each device in the cabinet, the method further includes: partitioning the plurality of devices within the cabinet; wherein the plurality of devices form at least one partition, and at least two devices are located in at least one of the partitions.

The determining whether the current temperatures of the plurality of devices are higher than the preset temperatures corresponding to the devices includes: and judging whether the current temperature of the equipment in each partition is higher than a preset temperature corresponding to the equipment.

If the current temperature of one of the devices is higher than the preset temperature corresponding to the device, the rotation speed of all the devices or part of the heat dissipation devices corresponding to the devices in the plurality of devices is adjusted upwards according to the rotation speed of the heat dissipation devices corresponding to the devices, including: if the current temperature of one of the devices in any one of the partitions is higher than the preset temperature corresponding to the device, the rotation speed of the heat dissipating devices corresponding to all the devices in any one of the partitions is adjusted upwards according to the rotation speed of the heat dissipating devices corresponding to the devices.

Through carrying out the subregion to a plurality of equipment in the rack, when the current temperature of one of them equipment in any one subregion is higher than the preset temperature that equipment corresponds, need not to all carry out the upregulation to the heat abstractor that equipment corresponds in other subregions in the rack, only need carry out the upregulation with the heat abstractor that all equipment corresponds in this subregion, through independent speed governing between each subregion, can reduce the noise of equipment in the rack to a certain extent, improve the whole heat dissipation ability of equipment in the rack.

In a possible implementation manner, the determining whether the current temperature of the device in each partition is higher than a preset temperature corresponding to the device further includes: and if the current temperature of each device in any one of the partitions is lower than the preset temperature corresponding to the device, the rotating speed of the heat dissipating devices corresponding to all the devices in any one of the partitions is adjusted downwards according to the rotating speed of the heat dissipating devices corresponding to the devices.

Like this, if the current temperature of every equipment in each subregion is less than the preset temperature that equipment corresponds in each subregion, need not to carry out down-regulation to the rotational speed of heat abstractor that equipment corresponds in other subregions in the rack, only need carry out down-regulation with the rotational speed of heat abstractor that all equipment corresponds in this subregion, through independent speed regulation between each subregion, can reduce the regulation number of times to the rotational speed of heat abstractor that equipment corresponds to improve work efficiency to a certain extent.

In one possible implementation manner, when the number of the devices in one of the partitions is at least three, the rotation speeds of the heat dissipating devices corresponding to all the devices in the one of the partitions are sequentially increased or decreased, and the rotation speed difference between one of the heat dissipating devices in the one of the partitions and the two adjacent heat dissipating devices is the same.

In one possible implementation manner, when the number of the devices in one of the partitions is at least three, the rotational speed difference of the heat dissipating devices corresponding to all the devices in one of the partitions is sequentially increased or decreased, and the rotational speed difference between one of the heat dissipating devices in one of the partitions and the adjacent two heat dissipating devices is the same.

In one possible implementation, the method further includes: acquiring the temperature of each device after being adjusted up or down in a preset time period; judging whether the current temperature of each device is higher than a preset temperature corresponding to the device; if the current temperature of one of the devices in any one of the partitions is higher than the preset temperature corresponding to the device, continuing to adjust the rotating speed of the heat dissipating device corresponding to each device in any one of the partitions upwards until the temperature of the device is lower than or equal to the preset temperature corresponding to the device; or if the current temperature of each device in any one of the partitions is lower than the preset temperature corresponding to the device, continuously regulating the rotation speed of the heat dissipating device corresponding to each device in any one of the partitions.

Through the setting, the temperature of equipment in each partition in the cabinet can be monitored and regulated more accurately, and the problems that unsafe accidents occur due to overhigh equipment temperature and the power consumption of the heat dissipation device is wasted due to overlow equipment temperature are avoided.

In one possible implementation manner, after the determining whether the current temperature of the device in each partition is higher than a preset temperature corresponding to the device, the method further includes: and sending a joint debugging message to each device in any one of the partitions so that each device can adjust the rotating speed of the corresponding heat dissipating device based on the joint debugging message.

In one possible implementation, the method further includes: if the rotation speed of the heat dissipating device corresponding to one of the devices in any one of the partitions reaches the maximum value or the minimum value, the other devices in any one of the partitions continue to conduct joint debugging on the rotation speeds of the heat dissipating devices corresponding to the other devices according to the joint debugging message.

In this way, if the rotation speed of the heat dissipating device corresponding to one of the devices in any one of the partitions has reached the maximum value, the rotation speed of the heat dissipating device corresponding to the other device in the partition is continuously adjusted in a joint way, so that the problem that the rotation speed of one of the devices in the partition reaches full speed, but the rotation speed of the heat dissipating device corresponding to the other device cannot be adjusted upwards when the temperature of the device in the partition is still too high can be avoided, and unsafe accidents caused by the too high temperature of the device in the partition can be avoided. If the rotating speed of the heat dissipating device corresponding to one of the devices in any one of the partitions has reached the minimum value, the rotating speeds of the heat dissipating devices corresponding to the other devices in the partition are continuously subjected to joint adjustment, so that the problem that the rotating speed of one of the devices in the partition reaches the minimum speed, but the rotating speeds of the heat dissipating devices corresponding to the other devices cannot be subjected to downward adjustment when the temperature of the device in the partition is still too low can be avoided, and the waste of the power consumption of the heat dissipating devices corresponding to the devices in the partition is avoided.

In one possible implementation, the joint tone message includes at least: a rotational speed difference command; the sending a joint debugging message to each device in any one of the partitions, so that each device adjusts the rotating speed of the corresponding heat dissipating device based on the joint debugging message, including: sending the rotating speed difference instruction to each device in any one of the partitions so that each device can adjust the rotating speed of the corresponding heat dissipating device based on the rotating speed difference instruction; the rotating speed difference instruction is used for setting the rotating speed difference between the two adjacent devices in the same partition, which correspond to the heat dissipation devices respectively.

In one possible implementation, the joint debugging message further includes a partition instruction. The sending a joint debugging message to each device in any one of the partitions, so that each device adjusts the rotating speed of the corresponding heat dissipating device based on the joint debugging message, including: sending the partition instruction to each device in any one partition in each partition, and adjusting the rotating speed of the corresponding heat dissipating device by the device in any one partition based on the partition instruction if the current temperature of the device in any one partition is higher or lower than the preset temperature.

In one possible embodiment, the rotational speed difference is 0 to 30%.

A second aspect of an embodiment of the present application provides a communication system, including at least: communication device and cabinet; the cabinet is internally provided with a plurality of devices, and the devices are arranged in a stacked manner; the communication device is arranged in at least part of the plurality of devices and is used for performing joint debugging on the temperature of at least part of the devices.

A third aspect of an embodiment of the present application provides a communication apparatus, applied to a communication system as described above, including: the device comprises a memory and a processor, wherein the memory stores a computer program, and the processor realizes the steps of the heat dissipation joint debugging method of a plurality of devices in the cabinet when executing the computer program.

A fourth aspect of the present application provides a computer readable storage medium storing a computer program, where the computer program when executed by a processor implements the steps of the method for joint debugging heat dissipation of a plurality of devices in a cabinet described in any one of the above.

These and other aspects, implementations, and advantages of the exemplary embodiments will become apparent from the following description of the embodiments, taken in conjunction with the accompanying drawings. It is to be understood that the specification and drawings are solely for purposes of illustration and not as a definition of the limits of the embodiments of the application, for which reference should be made to the appended claims. Additional aspects and advantages of embodiments of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of the application. Furthermore, the aspects and advantages of the embodiments of the application may be realized and attained by means of the instrumentalities and combinations particularly pointed out in the appended claims.

Drawings

Fig. 1 is a schematic flow chart of a heat dissipation joint debugging method for a plurality of devices in a cabinet according to an embodiment of the application;

fig. 2 is a schematic flow chart of a heat dissipation joint debugging method for a plurality of devices in a cabinet according to an embodiment of the application;

fig. 3 is a schematic flow chart of a heat dissipation joint debugging method for a plurality of devices in a cabinet according to an embodiment of the application;

FIG. 4 is a schematic diagram of a plurality of devices in a cabinet according to an embodiment of the application;

FIG. 5 is a schematic diagram of another configuration of a plurality of devices in a cabinet according to an embodiment of the application;

fig. 6 is a schematic flow chart of a heat dissipation joint debugging method for a plurality of devices in a cabinet according to an embodiment of the application;

fig. 7 is a schematic flow chart of a heat dissipation joint debugging method for a plurality of devices in a cabinet according to an embodiment of the application;

fig. 8 is a schematic flow chart of a heat dissipation joint debugging method for a plurality of devices in a cabinet according to an embodiment of the application;

fig. 9 is a schematic flow chart of a heat dissipation joint debugging method for a plurality of devices in a cabinet according to an embodiment of the application;

fig. 10 is a schematic flow chart of a heat dissipation joint debugging method for a plurality of devices in a cabinet according to an embodiment of the application;

FIG. 11 is a schematic diagram of another configuration of a plurality of devices in a cabinet according to an embodiment of the application;

FIG. 12 is a schematic view of another configuration of a plurality of devices in a cabinet according to an embodiment of the application;

FIG. 13 is a schematic view of another configuration of a plurality of devices in a cabinet according to an embodiment of the application;

fig. 14 is a schematic flow chart of a heat dissipation joint debugging method for a plurality of devices in a cabinet according to an embodiment of the application;

fig. 15 is a schematic flow chart of a heat dissipation joint debugging method for a plurality of devices in a cabinet according to an embodiment of the application;

fig. 16 is a schematic structural diagram of a communication device according to an embodiment of the present application.

Reference numerals illustrate:

100-a cabinet; 10-partitioning; 101-a first partition; 102-a second partition; 103-a third partition; 201-a first device; 202-a second device; 203-a third device; 204-fourth device; 205-fifth device; 30-an air guiding frame; 301-a first air guiding frame; 302-a second air guiding frame; 40-communication means; 401-a processor; 402-memory.

Detailed Description

The terminology used in the description of the embodiments of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application, as will be described in detail with reference to the accompanying drawings.

With the increasing maturation and commercialization of communication technology, high speed, low latency and large capacity are becoming the main direction of the competing layout of large telecommunication equipment vendors in the transport network area. With this is a significant increase in the demands for high performance, high integration cabinets, and subracks. For example, according to market research and display, the current demand for cabinets with high integration level in a cabinet-level multi-frame configuration such as one cabinet is improved by about 25% compared with the conventional cabinets in a cabinet-one-frame configuration, and the cabinets with high integration level in a cabinet-level multi-frame configuration such as one cabinet are deeply favored by the market, so that the market demand is strong.

The scheme of one-cabinet multi-frame configuration is capable of obviously improving the product integration level and the market competitiveness, and meanwhile, the cabinet-level heat dissipation capability becomes a bottleneck point of one-cabinet multi-frame configuration, so that the problem needs to be solved. In the prior art, the rotating speed of each equipment frame in the cabinet is independently regulated, namely, each equipment frame independently completes speed regulation and temperature control. The fan frame in each device in the cabinet independently operates to perform rotation speed adjustment so as to complete temperature regulation and control of each device. For example, if the temperature of one of the devices in the cabinet is too high or too low, the temperature in the device is regulated and controlled only by regulating the rotation speed of the fan in the fan frame of the device, and if the temperature of the other devices is normal, the fans in the other devices still maintain the original rotation speed and working state and do not regulate.

However, there is often a hot air cascade between devices inside the cabinet, that is, cold air outside the cabinet must be heated by another device before entering a certain device, so that the temperature of the device rises more than the temperature of cold air outside the cabinet, and then the temperature of a device closer to the position of the air inlet of the cabinet is generally relatively lower, and the temperature of a device farther from the position of the air inlet of the cabinet is relatively higher. Taking the case that the air inlet is positioned at the bottom of the cabinet, the temperatures of a plurality of devices from the bottom of the cabinet to the top of the cabinet are sequentially increased. When the temperature in the equipment is regulated and controlled by adjusting the rotation speed of the fan in the fan frame of the equipment under the normal temperature condition, the rotation speed of the fan in the equipment positioned at the top of the equipment cabinet is far higher than that of the fan in the equipment positioned at the bottom of the equipment cabinet. In this way, the fan in the equipment at the top of the cabinet has high rotating speed, and the noise generated by the fan can be obviously increased, so that the whole noise of the whole cabinet can be increased. Moreover, under high temperature conditions, if the equipment temperature at the top of the cabinet is too high but the equipment temperature at the bottom of the cabinet is not too high. In the prior art, only the rotating speed of equipment with higher temperature at the top of the cabinet is regulated. Thus, the rotation speed of the equipment at the bottom of the cabinet does not reach full speed, and the heat dissipation capacity of the equipment cannot be maximally realized, which results in insufficient overall heat dissipation capacity of the whole cabinet.

Based on the above, the embodiment of the application provides a heat dissipation joint debugging method for a plurality of devices in a cabinet. The method is applied to heat dissipation of a plurality of devices in the cabinet. Specifically, when the current temperature of one of the plurality of devices in the cabinet is higher than the preset temperature corresponding to the device, the rotation speed of the heat dissipation device corresponding to all or part of the devices in the plurality of devices is adjusted upwards according to the rotation speed of the heat dissipation device corresponding to the device. Through the setting, when the temperature of one device is too high (for example, the temperature of the device positioned at the top of the cabinet is too high) under the normal temperature condition, the fan rotation speed of all or part of devices in the cabinet is regulated to realize the temperature regulation of the cabinet device. Like this, the fan rotational speed increase that other equipment in the rack corresponds also can carry out the heat dissipation to a certain extent for the equipment that is located the rack top, and the fan rotational speed does not need too high in the equipment that is located the rack top like this, can avoid the problem that the noise risees in the equipment under the normal atmospheric temperature condition to can reduce the whole noise of whole rack. In addition, under the high temperature condition, if the temperature of the equipment positioned at the top of the cabinet is too high but the temperature of the equipment positioned at the bottom of the cabinet is not too high, the embodiment of the application realizes the temperature regulation and control of the equipment of the cabinet by regulating the fan rotating speeds of all the equipment or part of the equipment in the cabinet. Compared with the prior art, only the rotating speed of equipment with higher temperature at the top of the cabinet is adjusted, and the overall heat dissipation capacity of equipment in the cabinet can be improved. That is, the embodiment of the application avoids the problem that the rotation speed of individual equipment is abnormally high or the rotation speed of individual equipment is abnormally low when the heat dissipation and the speed regulation of a plurality of equipment in the cabinet are carried out by linkage and mutual speed regulation among the equipment in the cabinet, effectively improves the mutual aid capability among the equipment in the cabinet, remarkably improves the heat dissipation capability in the cabinet under the high temperature condition, and reduces the noise in the cabinet under the normal temperature condition.

The following describes the technical scheme of the present application and how the technical scheme of the present application solves the above technical problems in detail with specific embodiments. The following embodiments may be implemented independently or combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

Referring to fig. 1, in an embodiment of the present application, a heat dissipation joint debugging method for a plurality of devices in a cabinet includes:

s101: the method comprises the steps of obtaining working parameters of each device in the cabinet, wherein the working parameters at least comprise: the temperature of each device and the rotational speed of the heat sink corresponding to each device.

It will be appreciated that the number of devices within the cabinet should be at least two.

In an embodiment of the application, each device includes a fan assembly. The fan assembly may include at least one fan. The fan is used for radiating and cooling equipment, so that unsafe hidden dangers or unsafe accidents caused by overhigh temperature in the equipment are avoided. Of course, in other embodiments, the fan assembly may be disposed outside the apparatus, and the heat dissipation device may be other devices besides the fan assembly, and the specific location of the fan assembly and the specific structure and type of the heat dissipation device in the embodiments of the present application are not limited, so long as the effect of heat dissipation and cooling of the apparatus can be achieved.

S102: judging whether the current temperatures of the plurality of devices are higher than the preset temperatures corresponding to the devices; if the current temperature of one of the plurality of devices is higher than the preset temperature corresponding to the device, the rotation speed of the heat dissipation device corresponding to all or part of the devices in the plurality of devices is adjusted upwards according to the rotation speed of the heat dissipation device corresponding to the device.

Specifically, taking an example in which the cabinet includes two devices, referring to fig. 4, if the current temperature of one of the two devices (for example, the first device 201) is higher than the preset temperature corresponding to the first device 201, the rotational speeds of the two heat dissipation devices corresponding to the two devices in the cabinet 100 are adjusted upwards according to the rotational speeds of the two heat dissipation devices corresponding to the first device 201. Further, taking the number of devices in the cabinet as three as an example, referring to fig. 5, if the current temperature of one of the three devices (for example, the first device 201) is higher than the preset temperature corresponding to the first device 201, the rotational speeds of the three heat dissipation devices corresponding to the three devices in the cabinet 100 are all adjusted upwards according to the rotational speeds of the heat dissipation devices corresponding to the first device 201.

Or in some embodiments, if the current temperature of one of the plurality of devices is higher than the preset temperature corresponding to the device, the rotation speed of the heat dissipating device corresponding to the part of the devices in the plurality of devices is adjusted upwards according to the rotation speed of the heat dissipating device corresponding to the device. It should be noted that, a part of the devices refers to at least two devices in the cabinet. That is, if the current temperature of one of the plurality of devices is higher than the preset temperature corresponding to the device, the rotation speeds of the heat dissipation devices corresponding to at least two devices in the plurality of devices are adjusted upwards according to the rotation speeds of the heat dissipation devices corresponding to the devices. Specific examples of this case are specifically given in the following embodiments, and will not be described here.

In an embodiment of the present application, referring to fig. 2, before or after S102, the heat dissipation joint adjustment of the plurality of devices in the cabinet further includes:

S103A: and if the current temperature of each device in the plurality of devices is lower than the preset temperature corresponding to the device, the rotating speed of the heat dissipation device corresponding to each device is adjusted downwards according to the rotating speed of the heat dissipation device corresponding to each device.

Specifically, taking the number of devices in the cabinet as two as an example, referring to fig. 4, if the current temperature of each device (for example, the first device 201 and the second device 202) in the two devices is lower than the preset temperature corresponding to the first device 201 and the second device 202, the rotation speeds of the heat dissipation devices corresponding to the two devices in the cabinet 100 are adjusted down according to the rotation speeds of the heat dissipation devices corresponding to the first device 201 and the second device 202. Further, taking the number of devices in the cabinet as three as an example, referring to fig. 5, if the current temperature of each of the three devices (for example, the first device 201, the second device 202 and the third device 203) is lower than the preset temperatures corresponding to the first device 201, the second device 202 and the third device 203, the rotational speeds of the heat sinks corresponding to the three devices in the cabinet 100 are adjusted down according to the rotational speeds of the heat sinks corresponding to the first device 201, the second device 202 and the third device 203.

Alternatively, referring to fig. 3, before or after S102, the heat dissipation joint debugging method for a plurality of devices in the cabinet further includes:

S103B: and if the current temperatures of the partial devices in the plurality of devices are lower than the preset temperatures corresponding to the devices, the rotating speeds of the heat dissipation devices corresponding to the partial devices are adjusted downwards according to the rotating speeds of the heat dissipation devices corresponding to the partial devices.

It should be noted that, a part of the devices refers to at least two devices among a plurality of devices in the cabinet. That is, if the current temperatures of at least two devices in the plurality of devices are lower than the preset temperatures corresponding to the devices, the rotation speeds of the heat dissipation devices corresponding to the at least two devices in the plurality of devices are adjusted downwards according to the rotation speeds of the heat dissipation devices corresponding to the at least two devices. Also, specific examples of this case are specifically given in the following embodiments, and are not described here in detail.

After the rotation speed of the heat dissipating device corresponding to the apparatus is adjusted up or down, as the temperature of the apparatus itself may change along with the operation of different programs, there may still be a situation that the preset temperature of the apparatus cannot be met after the rotation speed of the heat dissipating device corresponding to the apparatus is adjusted up or down, so, on the basis of the above embodiment, as shown in fig. 6, the heat dissipating joint adjustment method for a plurality of apparatuses in the cabinet further includes:

s104: and acquiring the temperature of each device after the up-regulation or the down-regulation in a preset time period.

The preset time period can be 15s, 30s, 45s or 60s, and the like, and the numerical value of the preset time period is not limited in the embodiment of the application, and can be flexibly set according to the requirements of actual application scenes.

S105: judging whether the current temperature of each device is higher than the preset temperature corresponding to the device; if the current temperature of one of the devices is higher than the preset temperature corresponding to the device, the rotating speed of the heat dissipation device corresponding to each device is continuously adjusted upwards until the temperature of the device is lower than or equal to the preset temperature corresponding to the device.

Specifically, taking the number of devices in the cabinet as two as an example, referring to fig. 4, if the current temperature of one of the two devices (for example, the first device 201) is higher than the preset temperature corresponding to the first device 201, the rotation speeds of the heat dissipation devices corresponding to the two devices in the cabinet 100 are continuously adjusted upwards according to the rotation speeds of the heat dissipation devices corresponding to the first device 201. Further, taking the number of devices in the cabinet as three as an example, referring to fig. 5, if the current temperature of one of the three devices (for example, the first device 201) is higher than the preset temperature corresponding to the first device 201, the rotation speeds of the heat dissipation devices corresponding to the three devices in the cabinet 100 are all continuously adjusted upwards according to the rotation speeds of the heat dissipation devices corresponding to the first device 201. In this way, the temperature of the equipment in the cabinet 100 can be monitored and regulated more accurately, and unsafe accidents caused by too high equipment temperature can be avoided.

Alternatively, as shown in fig. 7, before or after S105, the heat dissipation joint debugging method of the plurality of devices in the cabinet further includes:

s106: if the current temperature of each device is lower than the preset temperature corresponding to the device, continuing to downwards regulate the rotating speed of the heat dissipating device corresponding to each device.

Specifically, taking the number of devices in the cabinet as two as an example, referring to fig. 4, if the current temperature of each device (for example, the first device 201 and the second device 202) in the two devices is lower than the preset temperature corresponding to the first device 201 and the second device 202, the rotation speeds of the heat dissipation devices corresponding to the two devices in the cabinet 100 are continuously adjusted downwards according to the rotation speeds of the heat dissipation devices corresponding to the first device 201 and the second device 202. Further, taking the number of devices in the cabinet as three as an example, referring to fig. 5, if the current temperature of each of the three devices (for example, the first device 201, the second device 202 and the third device 203) is lower than the preset temperatures corresponding to the first device 201, the second device 202 and the third device 203, the rotation speeds of the heat dissipation devices corresponding to the three devices in the cabinet 100 are continuously adjusted downwards according to the rotation speeds of the heat dissipation devices corresponding to the first device 201, the second device 202 and the third device 203. In this way, the temperature of the equipment in the cabinet 100 can be monitored and regulated more accurately, and the problem that the power consumption of the heat dissipating device is wasted due to the fact that the temperature of the equipment is too low is avoided.

In one possible implementation manner, when the current temperature of one of the plurality of devices is higher than the preset temperature, the rotation speeds of the heat dissipation devices corresponding to all the devices in the plurality of devices are adjusted upwards, the rotation speeds of the heat dissipation devices corresponding to all the devices are sequentially reduced or sequentially increased, and the rotation speed difference between the heat dissipation devices corresponding to the two adjacent devices respectively is kept constant.

The sequentially decreasing or sequentially increasing rotation speeds of the heat dissipating devices corresponding to all the devices means that all the devices sequentially decrease or sequentially increase according to the setting positions of the devices in the cabinet, wherein taking the number of the devices in the cabinet as two (see fig. 4) as an example, the rotation speeds of the heat dissipating devices corresponding to the two devices in the cabinet 100 can be sequentially decreased from top to bottom, that is, the rotation speed of the heat dissipating device corresponding to the first device 201 > the rotation speed of the heat dissipating device corresponding to the second device 202. Taking the number of devices in the cabinet as three (see fig. 5) as an example, the rotational speeds of the heat dissipating devices corresponding to the three devices in the cabinet 100 may be sequentially reduced from top to bottom, that is, the rotational speed of the heat dissipating device corresponding to the first device 201 > the rotational speed of the heat dissipating device corresponding to the second device 202 > the rotational speed of the heat dissipating device corresponding to the third device 203.

Or when the current temperature of one of the plurality of devices is higher than the preset temperature corresponding to the device, the rotating speeds of the heat dissipation devices corresponding to part of the devices are adjusted upwards, the rotating speeds of the heat dissipation devices corresponding to the part of the devices are sequentially reduced or sequentially increased, and the rotating speed difference between the heat dissipation devices corresponding to two adjacent devices in the part of the devices is kept constant.

And when the temperature of all the devices in the plurality of devices is lower than the preset temperature corresponding to the devices, the rotation speeds of the heat dissipation devices corresponding to all the devices in the plurality of devices are adjusted downwards, the rotation speeds of the heat dissipation devices corresponding to all the devices are sequentially reduced or sequentially increased, and the rotation speed difference between the heat dissipation devices corresponding to two adjacent devices in the plurality of devices is kept constant.

When the temperature of part of the equipment in the plurality of equipment is lower than the preset temperature corresponding to the equipment, the rotating speeds of the heat dissipation devices corresponding to the part of the equipment in the plurality of equipment are all adjusted downwards, the rotating speeds of the heat dissipation devices corresponding to the part of equipment are sequentially reduced or sequentially increased, and the rotating speed difference between the heat dissipation devices corresponding to the two adjacent equipment in the part of equipment is kept constant.

It is easy to understand that the rotation speed difference between the heat dissipating devices corresponding to the two adjacent devices is kept constant, which means that in the process of adjusting up or down the rotation speed of the heat dissipating device corresponding to the device, the rotation speed difference between the heat dissipating devices corresponding to the two adjacent devices is a constant value, that is, the adjustment amplitude of the rotation speed of the heat dissipating device corresponding to a certain device is the same as the adjustment amplitude of the rotation speed of the heat dissipating device corresponding to the device adjacent to the certain device.

Further, when the number of the devices in the cabinet is at least three, the rotation speed difference between one of the heat dissipating devices corresponding to all the devices in the at least three devices and the two adjacent heat dissipating devices is the same. That is, the rotational speed difference between the heat dissipating devices corresponding to two adjacent devices is the same as the rotational speed difference between the heat dissipating devices corresponding to two other adjacent devices. For example, taking the number of devices in the cabinet as three (see fig. 5), the rotational speed difference between the heat dissipating device corresponding to the second device 202 and the adjacent two heat dissipating devices (i.e., the first device 201 and the third device 203) is the same, that is, the rotational speed difference between the heat dissipating device corresponding to the second device 202 and the heat dissipating device corresponding to the first device 201 is the same as the rotational speed difference between the heat dissipating device corresponding to the second device 202 and the heat dissipating device corresponding to the third device 203. I.e. the rotational speed difference between one of the heat sinks and the two adjacent heat sinks is the same. For example, if the difference in rotational speed between the heat sink corresponding to the second device 202 and the heat sink corresponding to the first device 201 is 1000RPM, the difference in rotational speed between the heat sink corresponding to the second device 202 and the heat sink corresponding to the third device 203 is also 1000RPM. Of course, in some examples, the rotational speed difference between two adjacent heat sinks may also be 2000RPM or 3000RPM.

Or in other embodiments, when the number of devices in the cabinet is at least three, the rotation speed difference between one of the heat dissipating devices corresponding to part of the devices in the at least three devices and the two adjacent heat dissipating devices is the same. Specific examples of this case are specifically given in the following embodiments, and will not be described here.

On the basis of the embodiment, the embodiment of the application also provides a heat dissipation joint debugging method for a plurality of devices in the cabinet. As shown in fig. 8, before or after acquiring the operation parameters of each device in the cabinet (S101), the method further includes:

s201: partitioning a plurality of devices in a cabinet; wherein the plurality of devices form at least one partition, and at least two devices are located in the at least one partition.

Illustratively, when at least two devices within a cabinet are partitioned, if the number of devices within the cabinet is two, the two devices are formed into one partition 10 (see fig. 4); if the number of devices in the cabinet is three, the three devices may be formed into one partition having three devices therein (see fig. 5), or may be formed into two partitions having two devices therein (see fig. 11). Similarly, if the number of devices in the cabinet is N, the N devices may be formed into at least one partition, up to N-1 partitions, and at least two devices are in at least one partition of the N-1 partitions.

The specific partitioning manner and the partitioning basis when partitioning a plurality of devices in the cabinet may be various, and a partitioning example is given as a reference in the embodiment of the present application, however, it should be noted that the achievable partitioning manner is not limited to this kind in any way.

In an optional implementation manner, how to partition may be determined according to the position of the air guiding frame in the cabinet, as shown in fig. 9, S201 may specifically include:

s2011: and acquiring the position of the air guide frame in the cabinet.

The cabinet is provided with an air inlet and an air outlet, generally, the air inlet is located at the bottom of the cabinet, the air outlet is located at the top of the cabinet, and in addition, an air guiding frame can be arranged in the cabinet, and can be used as the air outlet of the cabinet below the air guiding frame and the air inlet of the cabinet above the air guiding frame, as shown in fig. 12, one air guiding frame 30 is arranged in the cabinet, or, as shown in fig. 13, two air guiding frames (a first air guiding frame 301 and a second air guiding frame 302) are arranged in the cabinet.

S2012: dividing the plurality of devices into N+1 partitions according to the positions of the air guide frames, wherein N is the number of the air guide frames.

Specifically, the devices above the air guiding frame and the devices below the air guiding frame may be respectively divided into two different partitions, for example, as shown in fig. 12, if one air guiding frame 30 is provided in the cabinet, then a plurality of devices in the cabinet may be divided into two partitions (i.e. a first partition 101 and a second partition 102), where the air guiding frame may be used as an air inlet of the first partition 101 and an air outlet of the second partition 102. Alternatively, as shown in fig. 13, two air guiding frames (a first air guiding frame 301 and a second air guiding frame 302) are provided in the cabinet, so that a plurality of devices in the cabinet can be divided into three partitions (i.e. a first partition 101, a second partition 102 and a third partition 103), wherein the first air guiding frame 301 can be used as an air inlet of the first partition 101 and an air outlet of the second partition 102, and the second air guiding frame 302 can be used as an air inlet of the second partition 102 and an air outlet of the third partition 103 in the cabinet.

On the basis of the above embodiment, S102 specifically includes:

s202: judging whether the current temperature of the equipment in each partition is higher than the preset temperature corresponding to the equipment; if the current temperature of one of the devices in any one of the partitions is higher than the preset temperature corresponding to the device, the rotating speeds of the heat dissipation devices corresponding to all the devices in any one partition are adjusted upwards according to the rotating speeds of the heat dissipation devices corresponding to the devices.

Through carrying out the subregion to a plurality of equipment in the rack, the current temperature of one of them equipment in each subregion is higher than the preset temperature that the equipment corresponds, then all the heat abstractor's that correspond in the equipment corresponds the heat abstractor's in any one subregion rotational speed all carries out the upregulation, under normal atmospheric temperature condition, when the temperature of one of them equipment in any one subregion is too high, then adjust the heat abstractor's that all the equipment corresponds in this subregion rotational speed and realize the temperature regulation and control to the equipment in this subregion, so, the heat abstractor rotational speed that other equipment corresponds in this subregion increases also can carry out the heat dissipation to a certain extent for this one of them equipment, the heat abstractor rotational speed that is located this one of them equipment corresponds does not need too high, can avoid the problem that the noise risen in the equipment under normal atmospheric temperature condition, thereby can reduce the whole noise of whole rack. In addition, under the high temperature condition, if one of the equipment temperatures in any one of the subareas is too high but the other equipment temperatures are not too high, the embodiment of the application realizes the temperature regulation and control of the equipment in the subarea by regulating the rotating speeds of the heat dissipation devices corresponding to all the equipment in the subarea, and compared with the prior art, the method and the device can improve the overall heat dissipation capacity of the equipment in the cabinet by only regulating the rotating speeds of the heat dissipation devices corresponding to the equipment with higher temperature.

It should be noted that, here, that is, the above description, if the current temperature of one of the devices is higher than the preset temperature corresponding to the device, the rotation speed of the heat dissipation device corresponding to the part of the devices in the plurality of devices is adjusted upwards according to the rotation speed of the heat dissipation device corresponding to the device. Specifically, taking the example that the number of devices in the cabinet is three and two partitions are formed (the first device 201 and the second device 202 are located in the first partition 101, and the third device 203 is located in the second partition 102), referring to fig. 11, if the current temperature of one of the devices (for example, the first device 201) in the first partition 101 is higher than the preset temperature corresponding to the first device 201, the rotation speeds of the heat dissipation devices corresponding to the two devices (the first device 201 and the second device 202) in the first partition 101 are both adjusted up according to the rotation speeds of the heat dissipation devices corresponding to the first device 201. Further, taking the example that the number of devices in the cabinet is five and two partitions (the first device 201, the second device 202 and the third device 203 are located in the first partition 101, and the fourth device 204 and the fifth device 205 are located in the second partition 102) as shown in fig. 12, if the current temperature of one of the devices (for example, the first device 201) in the first partition 101 is higher than the preset temperature corresponding to the first device 201, the rotation speeds of the heat dissipation devices corresponding to the three devices (the first device 201, the second device 202 and the third device 203) in the first partition 101 are all adjusted up according to the rotation speeds of the heat dissipation devices corresponding to the first device 201.

In an embodiment of the present application, referring to fig. 10, before or after S202, the heat dissipation joint adjustment of the plurality of devices in the cabinet further includes:

s203: and if the current temperature of each device in any one of the partitions is lower than the preset temperature corresponding to the device, the rotating speeds of the heat dissipation devices corresponding to all the devices in any one partition are adjusted downwards according to the rotating speeds of the heat dissipation devices corresponding to the devices.

In this way, if the current temperature of each device in any one of the partitions is lower than the preset temperature corresponding to the device, the rotation speed of the heat dissipating device corresponding to each device in the partition is adjusted downwards.

It should be noted that, here, that is, the above description, if the current temperatures of the partial devices in the plurality of devices are all lower than the preset temperatures corresponding to the devices, the rotation speeds of the heat dissipation devices corresponding to the partial devices are all adjusted downward according to the rotation speeds of the heat dissipation devices corresponding to the partial devices. Specifically, taking the example that the number of devices in the cabinet is three and two partitions are formed (the first device 201 and the second device 202 are located in the first partition 101, and the third device 203 is located in the second partition 102), referring to fig. 11, if the current temperature of each device (for example, the first device 201 and the second device 202) in the first partition 101 is lower than the preset temperature corresponding to the device, the rotation speeds of the heat sinks corresponding to all devices (the first device 201 and the second device 202) in the first partition 101 are adjusted down according to the rotation speeds of the heat sinks corresponding to the devices. Further, taking the example that the number of devices in the cabinet is five and two partitions (the first device 201, the second device 202 and the third device 203 are located in the first partition 101, and the fourth device 204 and the fifth device 205 are located in the second partition 102) as shown in fig. 12, if the current temperature of each device (for example, the second device 202 and the third device 203 of the first partition 101) is lower than the preset temperature corresponding to the device, the rotation speeds of the heat sinks corresponding to all devices (the first device 201, the second device 202 and the third device 203) in the first partition 101 are adjusted down according to the rotation speeds of the heat sinks corresponding to the devices.

After the rotation speed of the heat dissipating device corresponding to the equipment in any one partition is adjusted up or down, as the temperature of the equipment itself may change along with the running of different programs, there may still be a situation that the preset temperature of the equipment cannot be met after the rotation speed of the heat dissipating device corresponding to the equipment is adjusted up or down, so, on the basis of the above embodiment, referring to fig. 14, the heat dissipating joint adjustment method of multiple pieces of equipment in the cabinet further includes:

s204: and acquiring the temperature of each device after the up-regulation or the down-regulation in a preset time period.

The step is similar to S104, and will not be described here again.

S205: judging whether the current temperature of each device is higher than the preset temperature corresponding to the device; if the current temperature of one of the devices in any one of the partitions is higher than the preset temperature corresponding to the device, the rotating speed of the heat dissipating device corresponding to each of the devices in any one of the partitions is continuously adjusted upwards until the temperature of the device is lower than or equal to the preset temperature corresponding to the device.

Specifically, taking the example that the number of devices in the cabinet is three, and two partitions are formed (the first device 201 and the second device 202 are located in the first partition 101, and the third device 203 is located in the second partition 102), referring to fig. 11, if the current temperature of one of the devices (for example, the first device 201) in the first partition 101 is higher than the preset temperature corresponding to the first device 201, the rotation speed of the heat dissipation device corresponding to each device (the first device 201 and the second device 202) in the first partition 101 is continuously adjusted upwards according to the rotation speed of the heat dissipation device corresponding to the first device 201 in the first partition 101. Further, taking the example that the number of devices in the cabinet is five and two partitions (the first device 201, the second device 202 and the third device 203 are located in the first partition 101, and the fourth device 204 and the fifth device 205 are located in the second partition 102) as shown in fig. 12, if the current temperature of one of the devices (for example, the first device 201) in the first partition 101 is higher than the preset temperature corresponding to the first device 201, the rotation speeds of the heat dissipation devices corresponding to the three devices (the first device 201, the second device 202 and the third device 203) in the first partition 101 are all continuously adjusted upwards according to the rotation speeds of the heat dissipation devices corresponding to the first device 201 in the first partition 101.

Alternatively, referring to fig. 15, before or after S205, the heat dissipation joint debugging method for a plurality of devices in the cabinet further includes:

s206: if the current temperature of each device in any one partition is lower than the preset temperature corresponding to the device, continuing to downwards regulate the rotating speed of the heat dissipating device corresponding to each device in any one partition.

Specifically, taking the example that the number of devices in the cabinet is three, and two partitions are formed (the first device 201 and the second device 202 are located in the first partition 101, and the third device 203 is located in the second partition 102), referring to fig. 11, if the current temperature of each device (for example, the first device 201 and the second device 202) in the first partition 101 is lower than the preset temperature corresponding to the device, the rotation speeds of the heat sinks corresponding to all the devices (the first device 201 and the second device 202) in the first partition 101 are continuously adjusted downwards according to the rotation speeds of the heat sinks corresponding to the devices in the first partition 101. Further, taking the example that the number of devices in the cabinet is five and two partitions (the first device 201, the second device 202 and the third device 203 are located in the first partition 101, and the fourth device 204 and the fifth device 205 are located in the second partition 102) as shown in fig. 12, if the current temperature of each device (for example, the first device 201 and the second device 202) in the first partition 101 is lower than the preset temperature corresponding to the device, the rotation speeds of the heat sinks corresponding to all devices (the first device 201, the second device 202 and the third device 203) in the first partition 101 are continuously adjusted downwards according to the rotation speeds of the heat sinks corresponding to the devices in the first partition 101.

In one possible implementation manner, when the number of devices in one of the partitions is at least three, and the current temperature of one of the at least three devices in one of the partitions is higher than the preset temperature corresponding to the device, the rotation speeds of the heat dissipating devices corresponding to all the devices in one of the partitions are adjusted upward, the rotation speeds of the heat dissipating devices corresponding to all the devices in one of the partitions are sequentially increased or decreased, and the rotation speed difference between one of the heat dissipating devices in one of the partitions and the two adjacent heat dissipating devices is the same.

In one possible implementation manner, when the number of devices in one of the partitions is at least three, and the temperature of all devices in at least three devices in one of the partitions is lower than the preset temperature corresponding to the devices, the rotation speeds of the heat dissipating devices corresponding to all devices in one of the partitions are adjusted downwards, the rotation speed difference of the heat dissipating devices corresponding to all devices in one of the partitions is sequentially increased or decreased, and the rotation speed difference between one of the heat dissipating devices in one of the partitions and the two adjacent heat dissipating devices is the same.

The sequentially decreasing or sequentially increasing rotation speeds of the heat dissipating devices corresponding to all the devices in one of the partitions means that at least three devices in one of the partitions sequentially decrease or sequentially increase according to the setting positions of the at least three devices in the cabinet, wherein, taking the cabinet having two partitions (the first partition 101 and the second partition 102) and the number of the devices in the first partition 101 being three (see fig. 12) as an example, the rotation speeds of the heat dissipating devices corresponding to the three devices in the first partition 101 may sequentially decrease from top to bottom, that is, the rotation speed of the heat dissipating device corresponding to the first device 201 > the rotation speed of the heat dissipating device corresponding to the second device 202 > the rotation speed of the heat dissipating device corresponding to the third device 203.

In addition, in the embodiment of the application, the rotation speed difference between the heat dissipation devices corresponding to two adjacent devices in the same partition is the same as the rotation speed difference between the heat dissipation devices corresponding to the other two adjacent devices. For example, taking an example in which two partitions (the first partition 101 and the second partition 102) are provided in the cabinet, and the number of devices in the first partition 101 is three (see fig. 12), the rotational speed difference between the heat dissipating device corresponding to the second device 202 and the adjacent two heat dissipating devices (i.e., the first device 201 and the third device 203) is the same, that is, the rotational speed difference between the heat dissipating device corresponding to the second device 202 and the heat dissipating device corresponding to the first device 201 is the same as the rotational speed difference between the heat dissipating device corresponding to the second device 202 and the heat dissipating device corresponding to the third device 203.

On the basis of the above embodiment, after determining whether the current temperature of the device in each partition is higher than the preset temperature corresponding to the device, the method further includes: and sending the joint debugging message to each device in any one of the partitions so that each device can adjust the rotating speed of the corresponding heat radiating device based on the joint debugging message.

An embodiment of the present application provides a communication system, including at least: the equipment comprises a communication device and a cabinet, wherein a plurality of equipment is arranged in the cabinet, the equipment is arranged in a stacked mode, the communication device is arranged in at least part of the equipment in the equipment, and the communication device is used for performing joint adjustment on the temperature of at least part of the equipment.

In the embodiment of the application, the temperature of equipment in the cabinet can be adjusted through the communication device. Specifically, the communication device sends a joint debugging message to each device in any one of the partitions, so that each device adjusts the rotation speed of the corresponding heat dissipating device based on the joint debugging message.

Wherein, the joint debugging message at least comprises: in other words, in the embodiment of the present application, the rotational speed difference command may be sent to each device in any one of the respective partitions, so that each device adjusts the rotational speed of the corresponding heat dissipating device based on the rotational speed difference command. The rotating speed difference instruction is used for setting the rotating speed difference between the corresponding heat dissipation devices of two adjacent devices in the same partition.

In the embodiment of the application, the rotation speed difference value can be 0-30%. It should be noted that, the value of the rotational speed difference value can be flexibly set according to the specific configuration in the cabinet. Taking an example that the cabinet includes five devices and is divided into two partitions (see fig. 12), in an embodiment of the present application, a rotation speed difference between heat dissipating devices corresponding to two adjacent devices in the same partition may be 0, that is, a rotation speed of a heat dissipating device corresponding to a first device 201=a rotation speed of a heat dissipating device corresponding to a second device 202=a rotation speed of a heat dissipating device corresponding to a third device 203, and a rotation speed of a heat dissipating device corresponding to a fourth device 204=a rotation speed of a heat dissipating device corresponding to a fifth device 205.

In addition, in one possible implementation, the joint tone message further includes: in other words, in the embodiment of the present application, the partition instruction may be sent to each device in any one of the partitions, and if the current temperature of the device in any one of the partitions is higher than or lower than the preset temperature, the device in any one of the partitions adjusts the rotation speed of the corresponding heat dissipating device based on the partition instruction.

It can be understood that if the rotation speed of the heat dissipating device corresponding to one of the devices in any one of the partitions reaches a maximum value or a minimum value, the other devices in any one of the partitions continue to perform joint debugging on the rotation speeds of the heat dissipating devices corresponding to the other devices according to the joint debugging message.

In the embodiment of the application, the setting mode of the joint tone message comprises, but is not limited to, the following several possible implementation modes.

One possible implementation is: the joint tone message is one or more fixed parameters embedded in the communication device, i.e. the functional parameters contained in the joint tone message are fully defined in the communication device. For example, the communication device defines how the plurality of devices in the cabinet are partitioned (1 partition, 2 partitions, 3 partitions, etc.), and defines different rotational speed differences (0, 10%, 20%, 30%, etc.) in the partitions for different partition scenes, so as to form different speed regulation strategies, and the user can select a required speed regulation strategy in the control device.

Another possible implementation is: the communication device is provided with a user interface, and the communication device can acquire the user-defined configuration parameters of the user side through the user interface. The flexible configuration scheme can ensure that the heat dissipation capacity of equipment in the cabinet is optimal.

In summary, test and comparison results of the heat dissipation joint debugging method for a plurality of devices in a cabinet provided by the embodiment of the application and the heat dissipation method for a plurality of devices in a cabinet in the prior art are shown in the following table:

taking the cabinet configuration shown in fig. 12, and neither of the cabinets is provided with a dust screen as an example, comparing the data of the present application with the data of the prior art, it can be seen that by adopting the method provided by the present application, the rotation speed of the heat dissipating device (such as a fan) corresponding to the equipment in the cabinet is co-tuned, the air volume obtainable by the equipment with higher temperature (the first equipment 201 or the fourth equipment 204) in the cabinet is 90%, the equipment in the cabinet can bear the temperature of 40 ℃ for a long period and 45 ℃ for a short period in the machine room, and the noise in the cabinet is only 83dBA at the normal temperature of 25 ℃. After the rotating speed of the heat radiator corresponding to the equipment in the cabinet is regulated by adopting the method in the prior art, the air volume which can be obtained by the equipment with higher temperature in the cabinet is 67.5 percent, the equipment in the cabinet can bear the temperature of 35 ℃ for a long time and 40 ℃ for a short time in a machine room, and the noise in the cabinet is 87dBA at the normal temperature of 25 ℃. Therefore, compared with the prior art, the heat dissipation joint debugging method for the plurality of devices in the cabinet can improve the air quantity in the cabinet, improve the high-temperature heat dissipation capacity of the devices in the cabinet and reduce noise in the cabinet to a certain extent.

In addition, with continued reference to the table above, it can be obtained that the arrangement of the dust screen in the cabinet can reduce or weaken the above effects to a certain extent, but still has certain advantages compared with the prior art.

Fig. 16 further provides a communication device 40 according to an embodiment of the present application, which is applied to the communication system in the above embodiment. The communication device 40 may include a processor 401 and a memory 402. The memory 402 stores a computer program, and the processor 401 executes the computer program to implement the steps of the heat dissipation joint debugging method for the devices in the cabinet in the above embodiment.

In one embodiment, the present application further provides a computer readable storage medium, where a computer program is stored, where the computer program is executed by a processor to implement the steps of the heat dissipation joint debugging method for a plurality of devices in a cabinet in the foregoing embodiment.

The embodiments of the application may be implemented or realized in any number of ways, including as a matter of course, such that the apparatus or elements recited in the claims are not necessarily oriented or configured to operate in any particular manner. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more unless specifically stated otherwise.

The terms first, second, third, fourth and the like in the description and in the claims and in the above-described figures, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the application described herein may be implemented, for example, in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The present application is described above with reference to block diagrams and/or flowchart illustrations of methods, apparatus (systems) and/or computer program products according to embodiments of the application. It will be understood that one block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, and/or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer and/or other programmable data processing apparatus, create means for implementing the functions/acts specified in the block diagrams and/or flowchart block or blocks.

Accordingly, the present application may be embodied in hardware and/or in software (including firmware, resident software, micro-code, etc.). Still further, the present application may take the form of a computer program product on a computer-usable or computer-readable storage medium having computer-usable or computer-readable program code embodied in the medium for use by or in connection with an instruction execution system. In the context of the present application, a computer-usable or computer-readable medium may be any medium that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device.

While various embodiments of the present application have been described in detail in connection with a number of flowcharts, it should be understood that these flowcharts and the associated descriptions of the corresponding embodiments are for ease of understanding only and should not be construed as limiting the present application in any way. Each step in the flowcharts is not necessarily performed, and some steps may be skipped, for example. Moreover, the order of execution of the steps is not fixed nor limited to that shown in the drawings, and should be determined by its functions and inherent logic.

The various embodiments described herein may be combined or performed in any combination or cross-wise manner, and the order of execution of the various embodiments and the order of execution of the various steps of the various embodiments are not necessarily fixed, nor are they limited to what is shown in the figures, the order of execution of the various embodiments and the order of cross-execution of the various steps of the various embodiments should be determined in terms of their functions and inherent logic.

Although the application has been described in connection with specific features and embodiments thereof, it will be apparent that various modifications and combinations can be made without departing from the spirit and scope of the application. Accordingly, the specification and drawings are merely exemplary illustrations of the present application as defined in the appended claims and are considered to cover any and all modifications, variations, combinations, or equivalents that fall within the scope of the application. It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the scope of the application. Thus, it is intended that the present application also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims

1. The heat dissipation joint debugging method for the plurality of devices in the cabinet is applied to heat dissipation of the plurality of devices in the cabinet and is characterized by comprising the following steps of:

Acquiring working parameters of each device in the cabinet, wherein the working parameters at least comprise: the current temperature of each device and the rotating speed of the heat dissipation device corresponding to each device;

judging whether the current temperatures of the plurality of devices are higher than preset temperatures corresponding to the devices or not;

if the current temperature of one of the plurality of devices is higher than the preset temperature corresponding to the device, the rotation speeds of the heat dissipation devices corresponding to all the devices in the plurality of devices are adjusted upwards according to the rotation speeds of the heat dissipation devices corresponding to the devices, the rotation speeds of the heat dissipation devices corresponding to the plurality of devices are sequentially reduced or sequentially increased, and the rotation speed difference between the heat dissipation devices corresponding to two adjacent devices in the plurality of devices is kept constant; or alternatively

And the rotating speeds of the heat dissipation devices corresponding to the equipment in the plurality of equipment are adjusted upwards according to the rotating speeds of the heat dissipation devices corresponding to the equipment, the rotating speeds of the heat dissipation devices corresponding to the equipment in the plurality of equipment are reduced or increased in sequence, and the rotating speed difference between the heat dissipation devices corresponding to the adjacent two equipment in the plurality of equipment is kept constant.

2. The method for joint adjustment of heat dissipation of a plurality of devices in a cabinet according to claim 1, wherein the determining whether the current temperatures of the plurality of devices are higher than the preset temperatures corresponding to the devices further comprises:

and if the current temperature of each device in the plurality of devices is lower than the preset temperature corresponding to the device, the rotating speed of the heat dissipating device corresponding to each device is adjusted downwards according to the rotating speed of the heat dissipating device corresponding to each device.

3. The method for joint adjustment of heat dissipation of a plurality of devices in a cabinet according to claim 1, wherein the determining whether the current temperatures of the plurality of devices are higher than the preset temperatures corresponding to the devices further comprises:

and if the current temperature of part of the equipment in the plurality of equipment is lower than the preset temperature corresponding to the equipment, the rotating speed of the heat dissipation device corresponding to the part of the equipment is adjusted downwards according to the rotating speed of the heat dissipation device corresponding to the part of the equipment.

4. The heat dissipation joint adjustment method of a plurality of devices in a cabinet according to any one of claims 2-3, wherein when the temperature of all the devices in the plurality of devices is lower than the preset temperature corresponding to the devices, the rotation speeds of the heat dissipation devices corresponding to all the devices in the plurality of devices are adjusted downwards, the rotation speeds of the heat dissipation devices corresponding to the plurality of devices are sequentially reduced or sequentially increased, and the rotation speed difference between the heat dissipation devices corresponding to two adjacent devices in the plurality of devices is kept constant;

5. A method of heat sink joint debugging of a plurality of devices in a cabinet according to any one of claims 2-3, wherein the number of devices in the cabinet is at least three;

when the current temperature of one of the at least three devices is higher than the preset temperature corresponding to the device, the rotation speeds of the heat dissipation devices corresponding to all the at least three devices are adjusted upwards, the rotation speeds of the heat dissipation devices corresponding to the plurality of devices are sequentially reduced or sequentially increased, and the rotation speed difference between one of the heat dissipation devices corresponding to the plurality of devices and two adjacent heat dissipation devices is the same;

6. A method of heat sink joint debugging of a plurality of devices in a cabinet according to any one of claims 2-3, wherein the number of devices in the cabinet is at least three;

when the temperature of all the devices in the at least three devices is lower than the preset temperature corresponding to the devices, the rotation speeds of the heat dissipation devices corresponding to all the devices in the at least three devices are adjusted downwards, the rotation speeds of the heat dissipation devices corresponding to the devices are sequentially reduced or sequentially increased, and the rotation speed difference between one of the heat dissipation devices corresponding to the devices and two adjacent heat dissipation devices is the same;

when the temperature of a part of the equipment in the at least three equipment is lower than the preset temperature corresponding to the equipment, the rotating speeds of the radiating devices corresponding to the equipment in the at least three equipment are all adjusted downwards, the rotating speeds of the radiating devices corresponding to the equipment in the part are sequentially reduced or sequentially increased, and the rotating speed difference between one of the radiating devices corresponding to the equipment and two adjacent radiating devices is the same.

7. A method of heat sink joint debugging of a plurality of devices in a cabinet according to any one of claims 1-3, further comprising:

Acquiring the temperature of each device after being adjusted up or down in a preset time period;

judging whether the current temperature of each device is higher than the preset temperature corresponding to the device;

if the current temperature of one of the devices is higher than the preset temperature corresponding to the device, continuing to adjust the rotating speed of the heat dissipating device corresponding to each device upwards until the temperature of the device is lower than or equal to the preset temperature corresponding to the device; or if the current temperature of each device is lower than the preset temperature corresponding to the device, continuing to downwards regulate the rotating speed of the heat dissipating device corresponding to each device.

8. A method for heat dissipation joint adjustment of a plurality of devices in a cabinet according to any one of claims 1 to 3, wherein before or after obtaining the working parameters of each device in the cabinet, the method further comprises:

partitioning the plurality of devices within the cabinet; wherein the plurality of devices form at least one partition, and at least two devices are arranged in at least one partition;

the determining whether the current temperatures of the plurality of devices are higher than the preset temperatures corresponding to the devices includes:

Judging whether the current temperature of the equipment in each partition is higher than a preset temperature corresponding to the equipment;

if the current temperature of one of the devices is higher than the preset temperature corresponding to the device, the rotation speed of all the devices or part of the heat dissipation devices corresponding to the devices in the plurality of devices is adjusted upwards according to the rotation speed of the heat dissipation devices corresponding to the devices, including:

if the current temperature of one of the devices in any one of the partitions is higher than the preset temperature corresponding to the device, the rotation speed of the heat dissipating devices corresponding to all the devices in any one of the partitions is adjusted upwards according to the rotation speed of the heat dissipating devices corresponding to the devices.

9. The method for joint adjustment of heat dissipation of a plurality of devices in a cabinet according to claim 8, wherein the determining whether the current temperature of the device in each partition is higher than a preset temperature corresponding to the device further comprises:

and if the current temperature of each device in any one of the partitions is lower than the preset temperature corresponding to the device, the rotating speed of the heat dissipating devices corresponding to all the devices in any one of the partitions is adjusted downwards according to the rotating speed of the heat dissipating devices corresponding to the devices.

10. The method for joint adjustment of heat dissipation of a plurality of devices in a cabinet according to claim 9, wherein when the number of the devices in one of the partitions is at least three and the current temperature of one of the at least three devices in the one of the partitions is higher than the preset temperature corresponding to the device, the rotational speeds of the heat dissipation devices corresponding to all the devices in the one of the partitions are adjusted upward, the rotational speeds of the heat dissipation devices corresponding to all the devices in the one of the partitions are sequentially increased or decreased, and the rotational speed difference between one of the heat dissipation devices in the one of the partitions and the adjacent two heat dissipation devices is the same.

11. The heat dissipation joint adjustment method of a plurality of devices in a cabinet according to claim 9 or 10, wherein when the number of the devices in one of the partitions is at least three and the temperature of all the devices in the at least three devices in the one of the partitions is lower than the preset temperature corresponding to the devices, the rotation speeds of the heat dissipation devices corresponding to all the devices in the one of the partitions are adjusted down, the rotation speed difference of the heat dissipation devices corresponding to all the devices in the one of the partitions is sequentially increased or decreased, and the rotation speed difference between one of the heat dissipation devices in the one of the partitions and the two adjacent heat dissipation devices is the same.

12. The method for heat dissipation joint debugging of a plurality of devices in a cabinet according to claim 9 or 10, further comprising:

judging whether the current temperature of each device is higher than a preset temperature corresponding to the device;

if the current temperature of one of the devices in any one of the partitions is higher than the preset temperature corresponding to the device, continuing to adjust the rotating speed of the heat dissipating device corresponding to each device in any one of the partitions upwards until the temperature of the device is lower than or equal to the preset temperature corresponding to the device; or if the current temperature of each device in any one of the partitions is lower than the preset temperature corresponding to the device, continuously regulating the rotation speed of the heat dissipating device corresponding to each device in any one of the partitions.

13. The method for joint adjustment of heat dissipation of a plurality of devices in a cabinet according to claim 8, wherein after determining whether the current temperature of the devices in each partition is higher than a preset temperature corresponding to the devices, further comprises:

And sending a joint debugging message to each device in any one of the partitions so that each device can adjust the rotating speed of the corresponding heat dissipating device based on the joint debugging message.

14. The method of heat sink joint debugging of a plurality of devices in a cabinet of claim 13, further comprising:

if the rotation speed of the heat dissipating device corresponding to one of the devices in any one of the partitions reaches the maximum value or the minimum value, the other devices in any one of the partitions continue to conduct joint debugging on the rotation speeds of the heat dissipating devices corresponding to the other devices according to the joint debugging message.

15. The method for heat dissipation joint debugging of a plurality of devices in a cabinet according to claim 13 or 14, wherein the joint debugging message at least comprises: a rotational speed difference command;

the sending a joint debugging message to each device in any one of the partitions, so that each device adjusts the rotating speed of the corresponding heat dissipating device based on the joint debugging message, including:

sending the rotating speed difference instruction to each device in any one of the partitions so that each device can adjust the rotating speed of the corresponding heat dissipating device based on the rotating speed difference instruction; the rotating speed difference instruction is used for setting the rotating speed difference between the two adjacent devices in the same partition, which correspond to the heat dissipation devices respectively.

16. The method for heat dissipation joint debugging of a plurality of devices in a cabinet of claim 15, wherein the joint debugging message further comprises: a partition instruction;

sending the partition instruction to each device in any one partition in each partition, and adjusting the rotating speed of the corresponding heat dissipating device by the device in any one partition based on the partition instruction if the current temperature of the device in any one partition is higher or lower than the preset temperature.

17. The method for joint heat dissipation adjustment of a plurality of devices in a cabinet according to claim 15, wherein the rotational speed difference is 0-30%.

18. A communication system comprising at least: communication device and cabinet;

the cabinet is internally provided with a plurality of devices, and the devices are arranged in a stacked manner;

the communication device is arranged in at least part of the plurality of devices and is used for performing joint debugging on the temperature of at least part of the devices.

19. A communication device for use in the communication system of claim 18, the communication device comprising: a memory storing a computer program, and a processor implementing the steps of the heat dissipation joint debugging method of a plurality of devices in a cabinet of any one of claims 1-17 when the processor executes the computer program.

20. A computer readable storage medium storing a computer program, wherein the computer program when executed by a processor performs the steps of the heat dissipation joint debugging method of a plurality of devices in a cabinet as claimed in any one of claims 1-17.