CN114510089B - Coupling temperature control system and method - Google Patents
Coupling temperature control system and method Download PDFInfo
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- CN114510089B CN114510089B CN202111673077.1A CN202111673077A CN114510089B CN 114510089 B CN114510089 B CN 114510089B CN 202111673077 A CN202111673077 A CN 202111673077A CN 114510089 B CN114510089 B CN 114510089B
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- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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Abstract
The invention relates to the technical field of semiconductor manufacturing, in particular to a coupling temperature control system and a method, wherein the coupling temperature control system comprises a refrigerating device, a heating device and a circulating device, the refrigerating device comprises a first refrigerating loop formed by sequentially communicating a heat release passage of a compressor, a condenser and a heat absorption passage of a heat exchanger, the circulating device comprises a circulating liquid loop formed by sequentially communicating a heat exchange passage of the heat exchanger, a water tank, a first pump body and a load, the heating device comprises waste gas treatment equipment, and the waste gas treatment equipment is communicated with the heat release passage of the heat exchanger. On the basis of realizing the functions of the temperature control system and the functions of the waste gas treatment equipment, the energy of the waste gas treatment equipment is used for heating circulating liquid in the temperature control system, so that comprehensive utilization of energy and energy-saving control are effectively realized.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a coupling temperature control system and a coupling temperature control method.
Background
Waste gas generated in the integrated circuit manufacturing process is treated by waste gas treatment equipment at home and abroad, harmless treatment is carried out on the waste gas by adopting treatment modes such as combustion water washing, electric heating, plasma decomposition and the like, the waste gas has high energy after being treated by the modes such as combustion, electric heating, plasma decomposition and the like, and in the traditional waste gas treatment equipment, the treated waste gas is directly cooled by a spraying system and then discharged, so that the energy is greatly wasted. Because the waste gas of the waste gas treatment equipment has huge energy, the heat of the waste gas can be equivalent to the heat generated by a heater with the power of 20kW, the heater adopted by the traditional temperature control equipment special for the semiconductor is usually less than 5kW, the heat of the waste gas is far greater than the heat generated by the heater in the traditional temperature control equipment,
the refrigerating capacity of the temperature control equipment of the etching process is designed according to the maximum load capacity in the etching process, in the etching process of integrated circuit manufacture, the etched load is loaded according to the process steps, a great amount of time exists in the process and is not loaded according to the maximum process load, and meanwhile, part of time is in an idle rotation state, and the refrigerating capacity in the refrigerating system of the temperature control equipment is not 100% utilized under the conditions of no load and no full load, so that the energy is wasted.
Disclosure of Invention
The invention provides a coupling temperature control system and a method, which are used for solving the defects that in the waste gas treatment equipment manufactured by semiconductors in the prior art, the treated waste gas is directly cooled and discharged, so that energy is greatly wasted, and meanwhile, the rapid temperature rising speed of the temperature control system is low, so that the temperature of the temperature control equipment is accurately controlled and the rapid temperature rising control is realized. And the energy of the waste gas treatment equipment is used for heating the circulating liquid in the temperature control system, so that the effects of comprehensive utilization of energy and energy-saving control are effectively realized.
The invention provides a coupling temperature control system which comprises a refrigerating device, a heating device and a circulating device, wherein the refrigerating device comprises a first refrigerating loop formed by sequentially communicating a heat release passage of a compressor, a condenser and a heat absorption passage of a heat exchanger, the circulating device comprises a circulating liquid loop formed by sequentially communicating a heat exchange passage of the heat exchanger, a water tank, a first pump body and a load, and the heating device comprises waste gas treatment equipment which is communicated with the heat release passage of the heat exchanger.
According to the coupling temperature control system provided by the invention, the waste gas treatment equipment comprises a combustion cavity and a spray tower, and the air outlet of the combustion cavity is communicated with the inlet of the spray tower through the heat release passage of the heat exchanger.
According to the coupling temperature control system provided by the invention, the pipeline for communicating the inlet of the spray tower with the heat release passage of the heat exchanger is provided with the first valve body.
According to the coupling temperature control system provided by the invention, a fan is further arranged on a pipeline, wherein the inlet of the spray tower is communicated with the heat release passage of the heat exchanger, and the first valve body and the fan are sequentially arranged along the gas flow direction in the pipeline.
According to the coupling temperature control system provided by the invention, the waste gas treatment equipment further comprises a water tank, and the air outlet of the combustion cavity is communicated with the air inlet of the spray tower through the water tank.
According to the coupling temperature control system provided by the invention, the pipeline for communicating the first pump body with the load is provided with the first temperature detection part.
According to the coupling temperature control system provided by the invention, the pipeline, in which the outlet of the heat release passage of the condenser is communicated with the inlet of the heat absorption passage of the heat exchanger, is provided with the second valve body.
According to the coupling temperature control system provided by the invention, the refrigerating device further comprises an evaporator, the compressor, the heat release passage of the condenser and the heat absorption passage of the evaporator are sequentially communicated to form a second refrigerating loop, a spraying assembly is arranged in the spraying tower, and the water pool, the heat release passage of the evaporator, the second pump body and the spraying assembly are sequentially communicated.
According to the coupling temperature control system provided by the invention, the pipeline, in which the outlet of the heat release passage of the condenser is communicated with the inlet of the heat absorption passage of the evaporator, is provided with the third valve body.
According to the coupling temperature control system provided by the invention, the pipeline, which is communicated with the spraying assembly, of the second pump body is sequentially provided with the fourth valve body and the second temperature detection part along the liquid flow direction.
According to the coupling temperature control system provided by the invention, the heat exchanger is a multi-channel plate heat exchanger.
The invention also provides a coupling temperature control method, which is applied to the coupling temperature control system and comprises the following steps:
s1, acquiring the actual temperature of an outlet of a circulating device;
s2, obtaining a target value difference value of the outlet temperature according to the actual temperature and the target temperature of the outlet of the circulating device;
and S3, controlling the opening degree of the first valve body of the heating device and the opening degree of the second valve body of the refrigerating device according to the target value difference value of the outlet temperature.
According to the coupling temperature control system provided by the invention, the energy of the waste gas in the waste gas treatment equipment is fully utilized while the waste gas treatment of the etching process equipment is realized, and the waste gas with high energy is used for heating the circulating liquid of the temperature control system. The heater that traditional semiconductor special temperature control system adopted is usually less than 5kW, and exhaust-gas treatment equipment's waste gas energy is huge, and the heat of waste gas can be equivalent to the heat that 20 kW's heater produced, is far greater than the heat that heater produced in traditional temperature control system, in the in-process that utilizes waste gas energy, can realize temperature control system's quick heating up's effect, and when circulating fluid flows into the control that realizes quick heating up in the heat exchanger in addition, quick heating up's speed can improve more than 3 times, and is faster than traditional temperature control system's quick heating up speed, realizes temperature control equipment's temperature accuracy control and quick heating up control. On the basis of realizing the functions of the temperature control system and the functions of the waste gas treatment equipment, the energy of the waste gas treatment equipment is used for heating circulating liquid in the temperature control system, so that comprehensive utilization of energy and energy-saving control are effectively realized.
In addition to the technical problems, features of the constituent technical solutions and advantages brought by the technical features of the technical solutions described above, other technical features of the present invention and advantages brought by the technical features of the technical solutions will be further described with reference to the accompanying drawings or will be understood through practice of the present invention.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a coupled temperature control system according to the present invention;
FIG. 2 is a schematic diagram of a coupled temperature control system according to a second embodiment of the present invention;
reference numerals:
100. a refrigerating device; 110. a compressor; 120. a condenser; 130. a heat exchanger; 140. a second valve body; 150. an evaporator; 160. a second pump body; 170. a third valve body; 180. a fourth valve body; 190. a second temperature detecting member;
200. a circulation device; 210. a water tank; 220. a first pump body; 230. a load; 250. a first temperature detecting member; 260. a third temperature detecting member;
300. a heating device; 320. an exhaust gas treatment device; 330. a first valve body; 340. a blower; 321. a combustion chamber; 322. a spray tower; 323. a pool; 324. and a spray assembly.
Detailed Description
Embodiments of the present invention are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the invention but are not intended to limit the scope of the invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In describing embodiments of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled," "coupled," and "connected" should be construed broadly, and may be either a fixed connection, a removable connection, or an integral connection, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in embodiments of the present invention will be understood in detail by those of ordinary skill in the art.
In embodiments of the invention, unless expressly specified and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
Furthermore, in the description of the embodiments of the present invention, unless otherwise indicated, the meaning of "a plurality of", "a plurality of" means two or more, and the meaning of "a plurality of", "a plurality of" means one or more ".
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
As shown in fig. 1, the coupled temperature control system provided by the embodiment of the invention includes a refrigeration device 100, a heating device 300 and a circulation device 200, where the refrigeration device 100 includes a first refrigeration loop formed by sequentially communicating a heat release path of a compressor 110, a condenser 120 and a heat absorption path of a heat exchanger 130, the circulation device 200 includes a circulation liquid loop formed by sequentially communicating a heat exchange path of the heat exchanger 130, a water tank 210, a first pump 220 and a load 230, the heating device 300 includes an exhaust gas treatment device 320, and the exhaust gas treatment device 320 is communicated with the heat release path of the heat exchanger 130.
The coupling temperature control system provided by the embodiment of the invention is used as important equipment in the manufacturing and etching process of the semiconductor integrated circuit, and is used for carrying out innocent treatment on waste gas of etching process equipment in the manufacturing of the integrated circuit, and simultaneously, accurately controlling the temperature in the reaction cavity of the etching process equipment and ensuring the accurate control of the temperature of the reaction cavity.
The load 230 is etching process equipment, the cooling liquid circularly flows in the first refrigerating loop of the refrigerating device 100, the high-temperature and high-pressure cooling liquid output by the compressor 110 releases heat through the heat release passage of the condenser 120, after cooling down, the cooling liquid passes through the heat absorption passage of the heat exchanger 130 and exchanges heat with the circulating liquid in the heat exchange passage of the heat exchanger 130, so that the temperature of the circulating liquid is reduced, then the cooling liquid returns to the compressor 110, the circulating liquid enters the water tank 210 after cooling down, is pumped out through the first pump body 220 and is conveyed into the etching process equipment, the reaction cavity of the etching process equipment is cooled down, the high-temperature circulating liquid flowing out of the etching process equipment flows into the heat exchange passage of the heat exchanger 130 again, and the circulating liquid circularly flows in the circulating liquid loop, so that the cooling control of the reaction cavity of the etching process equipment is realized.
The waste gas of the waste gas treatment device 320 enters the heat release passage of the heat exchanger 130 to exchange heat with the circulating liquid in the heat exchange passage, so that the temperature of the circulating liquid is increased, the waste gas returns to the waste gas treatment device 320, the circulating liquid enters the water tank 210 after being heated, is pumped out through the first pump body 220 and conveyed into the etching process device, the reaction cavity of the etching process device is heated, the circulating liquid circularly flows in the circulating liquid loop, and the heating control of the reaction cavity of the etching process device is realized.
The circulating liquid can absorb heat and raise temperature in the heat exchanger 130 and release heat and lower temperature, namely, in the process of raising temperature, the heat exchange channel of the heat exchanger 130 is used as a heat absorption channel, and in the process of lowering temperature, the heat exchange channel of the heat exchanger 130 is used as a heat release channel. When the reaction chamber of the etching process equipment needs rapid temperature rise control, the first refrigeration loop is closed, the heating device 300 is opened, namely, only circulating liquid flowing out from the etching process equipment in the heat exchanger 130 exchanges heat with waste gas discharged from the waste gas treatment equipment 320, and the circulating liquid is heated in the heat exchanger 130, so that rapid temperature rise effect is realized. When the reaction chamber of the etching process equipment needs to be rapidly cooled, the first refrigeration loop is opened, the heating device 300 is closed, that is, only the circulating liquid flowing out of the etching process equipment in the heat exchanger 130 exchanges heat with the cooling liquid flowing out of the condenser 120, and the circulating liquid is cooled in the heat exchanger 130, so that a rapid cooling effect is realized.
The invention fully utilizes the energy of the waste gas in the waste gas treatment equipment 320 while realizing the waste gas treatment of the etching process equipment, and uses the waste gas with high energy for heating the circulating liquid of the temperature control system. The heater that traditional semiconductor special temperature control system adopted is usually less than 5kW, and the waste gas energy of exhaust treatment equipment 320 is huge, and the heat of waste gas can be equivalent to the heat that 20 kW's heater produced, is far greater than the heat that heater produced in traditional temperature control system, in the in-process that utilizes waste gas energy, can realize temperature control system's quick heating up's effect, and when circulating fluid flows into the control of realizing quick heating up in heat exchanger 130 in addition, quick heating up's speed can improve more than 3 times, and is faster than traditional temperature control system's quick heating up speed, realizes temperature control equipment's temperature accuracy control and quick heating up control. On the basis of realizing the functions of the temperature control system and the functions of the exhaust gas treatment equipment 320, the energy of the exhaust gas treatment equipment 320 is used for heating circulating liquid in the temperature control system, so that comprehensive utilization of energy and energy-saving control are effectively realized.
According to one embodiment of the present invention, the exhaust gas treatment device 320 includes a combustion chamber 321 and a spray tower 322, and an air outlet of the combustion chamber 321 communicates with an inlet of the spray tower 322 through a heat release passage of the heat exchanger 130. In this embodiment, after the waste gas of the etching process equipment enters the combustion chamber 321 to perform combustion reaction, a great amount of heat is generated, and enters the heat release path of the heat exchanger 130 along with the waste gas, and exchanges heat with the circulating liquid in the heat exchanger 130, the circulating liquid heats up and flows into the water tank 210, the waste gas enters the spray tower 322 after passing through the heat exchanger 130, the spray tower 322 sprays the waste gas, and the waste gas is discharged from the spray tower 322 after being cooled and purified.
According to one embodiment of the present invention, a first valve body 330 is provided on a line where an inlet of the spray tower 322 communicates with a heat release passage of the heat exchanger 130. In this embodiment, by controlling the opening of the first valve body 330, the amount of the exhaust gas entering the heat exchanger 130 is precisely controlled, so as to control the heat exchange amount of the circulating liquid and the exhaust gas in the heat exchanger 130, thereby precisely controlling the temperature of the reaction chamber of the etching process equipment.
In this embodiment, the first valve body 330 may be an electrically operated valve.
According to an embodiment of the present invention, a fan 340 is further disposed on a pipeline where an inlet of the spray tower 322 is communicated with the heat release passage of the heat exchanger 130, and the first valve body 330 and the fan 340 are sequentially disposed along a gas flow direction in the pipeline. In this embodiment, fan 340 powers the flow of exhaust gas from the heat release path of heat exchanger 130 to spray tower 322, i.e., the flow of exhaust gas between exhaust gas treatment device 320 and heat exchanger 130.
According to one embodiment of the present invention, the exhaust gas treatment device 320 further includes a water tank 323, and the air outlet of the combustion chamber 321 is further communicated with the air inlet of the spray tower 322 through the water tank 323. In this embodiment, a water tank 323 is disposed below the air outlet of the combustion chamber 321 and the air inlet of the spray tower 322, the spray tower 322 sprays the exhaust gas, and the sprayed liquid falls into the water tank 323 to store the sediment. The side wall of the air outlet of the combustion cavity 321 is additionally provided with one end of an outlet connection air outlet pipeline, the other end of the air outlet pipeline is connected with the inlet of the heat release passage of the heat exchanger 130, the outlet of the heat release passage of the heat exchanger 130 is connected with one end of an air inlet pipeline, the other end of the air inlet pipeline passes through the water tank 323 to reach the air inlet of the spray tower 322, and the fan 340 and the first valve body 330 are both arranged on a pipe section of the air inlet pipeline outside the water tank 323.
According to one embodiment of the present invention, a first temperature detecting member 250 is disposed on a pipeline where the first pump body 220 communicates with the load 230. In this embodiment, the first temperature detecting element 250 is used for detecting the temperature of the circulating liquid after being pumped out by the first pump body 220 and before entering the etching process equipment, that is, the first temperature detecting element 250 detects the outlet temperature of the circulating device 200, and the opening degree of the first valve body 330 can be adjusted by detecting the temperature by the first temperature detecting element 250, so as to control the temperature of the circulating liquid entering the etching process equipment.
In this embodiment, the first temperature detecting member 250 may employ a temperature sensor. A third temperature detecting member 260 is further disposed on the pipeline of the load 230, which is in communication with the heat exchange path of the heat exchanger 130, and a temperature sensor may be used as well, to detect the temperature of the circulating liquid flowing out of the etching process equipment, i.e. the temperature of the return port of the circulating device 200.
According to an embodiment of the present invention, a second valve 140 is disposed on a pipe in which an outlet of the heat release passage of the condenser 120 is communicated with an inlet of the heat absorption passage of the heat exchanger 130. In this embodiment, after the cooling liquid sent from the compressor 110 exchanges heat with the refrigerant in the heat absorption path of the condenser 120 in the heat release path of the condenser 120, the temperature of the cooling liquid is reduced, the pressure of the cooling liquid is reduced by the second valve 140, the flow rate of the cooling liquid entering the heat absorption path of the heat exchanger 130 is controlled, and then the heat exchange amount of the cooling liquid and the circulating liquid in the heat exchanger 130 is controlled. The opening degree of the second valve body 140 can be adjusted by detecting the temperature by the first temperature detecting member 250.
In this embodiment, the second valve body 140 may be an electronic expansion valve.
As shown in fig. 2, according to an embodiment of the present invention, the refrigeration apparatus 100 further includes an evaporator 150, a compressor 110, a heat release passage of the condenser 120, and a heat absorption passage of the evaporator 150 are sequentially connected to form a second refrigeration circuit, a spray assembly 324 is disposed in a spray tower 322, and a water tank 323, the heat release passage of the evaporator 150, the second pump 160, and the spray assembly 324 are sequentially connected. In this embodiment, the cooling liquid conveyed by the compressor 110 in the refrigeration device 100 is cooled by the condenser 120 and then divided into two paths, one path of cooling liquid passes through the second valve body 140 and then enters the heat exchanger 130 to exchange heat with the circulating liquid, the heat exchange is performed, the cooling liquid returns to the compressor 110 to form a first refrigeration loop, the other path of cooling liquid passes through the heat absorption path of the evaporator 150, the spraying liquid in the water tank 323 enters the heat release path of the evaporator 150 to exchange heat with the cooling liquid, the cooling liquid after heat exchange returns to the compressor 110 to form a second refrigeration loop, the spraying liquid is pumped into the spraying assembly 324 arranged in the spraying tower 322 through the second pump body 160 after being cooled, and the waste gas entering the spraying tower 322 is sprayed, cooled and purified.
The invention forms a second refrigerating loop through the arrangement of the evaporator 150 in the refrigerating device 100, fully utilizes the redundant refrigerating capacity of the refrigerating device 100, is used for cooling the spray liquid of the water tank 323 in the waste gas treatment equipment 320, and then sprays and cools the waste gas by the treated spray liquid, thereby comprehensively utilizing the redundant refrigerating capacity of the temperature control system. On the basis of realizing the functions of a temperature control system and the functions of the waste gas treatment equipment 320, the invention uses the heat of the waste gas treatment equipment 320 to heat circulating liquid in the temperature control equipment, uses the redundant refrigerating capacity in the refrigerating device 100 to cool and spray the waste gas in the waste gas treatment equipment 320, and further realizes the comprehensive utilization of energy. The redundant refrigerating capacity of the refrigerating device 100 is fully utilized for cooling the exhaust gas of the exhaust gas treatment equipment 320, the redundant refrigerating capacity sum of the temperature control system is effectively utilized, and the problems that the redundant refrigerating capacity in the temperature control system is repeatedly evaporated and compressed in the refrigerating device 100 and cannot be effectively utilized are avoided.
According to an embodiment of the present invention, a third valve 170 is provided on a pipe in which an outlet of the heat release passage of the condenser 120 communicates with an inlet of the heat absorption passage of the evaporator 150. In this embodiment, after the cooling liquid in the refrigeration system passes through the condenser 120, one path of cooling liquid passes through the second valve body 140 and enters the heat exchanger 130 to evaporate, so as to cool the circulating liquid in the circulating device 200; the other path passes through the third valve 170 and enters the evaporator 150 to evaporate, and the spray liquid from the water tank 323 in the exhaust gas treatment device 320 is cooled. In this embodiment, the opening of the third valve body 170 is 100% -the opening of the second valve body 140, which not only realizes the refrigerating capacity required by the accurate temperature control process of the temperature control system, but also fully utilizes the redundant refrigerating capacity of the temperature control system, so as to fully utilize the energy.
In this embodiment, the third valve 170 may be an electronic expansion valve.
According to one embodiment of the present invention, the pipeline of the second pump 160 in communication with the spray assembly 324 is provided with a fourth valve 180 and a second temperature detecting member 190 in sequence along the flow direction of the liquid. In this embodiment, the high Wen Penlin liquid in the water tank 323 enters the heat release passage of the evaporator 150, exchanges heat with the cooling liquid in the heat absorption passage of the evaporator 150, and after being cooled, the spraying liquid is pumped out through the second pump 160, flows through the fourth valve 180 and the second temperature detecting member 190, and then flows into the spraying assembly 324 in the spraying tower 322 to spray and cool the waste gas. The fourth valve body 180 can control the flow rate of the spray liquid and prevent the spray liquid from flowing back to the evaporator 150, and the second temperature detecting member 190 is used for detecting the temperature of the spray liquid pumped out by the second pump body 160, that is, the temperature of the spray liquid before entering the spray assembly 324, so as to control the opening of the third valve body 170, realize the adjustment of the heat exchange amount of the evaporator 150, and further control the temperature of the spray liquid.
In this embodiment, the fourth valve body 180 may be an electrically operated valve. The second temperature detecting member 190 may employ a temperature sensor.
According to one embodiment provided by the present invention, the heat exchanger 130 is a multi-pass plate heat exchanger. In this embodiment, three heat exchange plates are located inside the housing, which may be in the form of a coil, one heat exchange plate is a heat exchange passage of the heat exchanger 130, an internal circulation fluid is circulated, one heat exchange plate is a heat release passage of the heat exchanger 130, an internal circulation exhaust gas is circulated, and the other heat exchange plate is a heat absorption passage of the heat exchanger 130, and an internal circulation cooling fluid is circulated. In other embodiments, the heat exchanger 130 may also employ other heat exchange devices, which can satisfy the multi-path gas-liquid heat exchange condition.
The embodiment of the invention also provides a coupling temperature control method, which is applied to a coupling temperature control system and comprises the following steps:
s1, acquiring the actual temperature of an outlet of the circulating device 200;
s2, obtaining a target value difference value of the outlet temperature according to the actual temperature and the target temperature of the outlet of the circulating device 200;
and S3, controlling the opening degrees of the first valve body 330 of the heating device 300 and the second valve body 140 of the refrigerating device 100 according to the target value difference value of the outlet temperature.
In the coupling temperature control method of the present invention, a target temperature SV of the circulating liquid at the outlet of the circulating device 200 is set, an actual circulating liquid temperature PV at the outlet of the circulating device 200 is detected by the first temperature detecting member 250, and a difference between the actual temperature PV and the target temperature SV is obtained, thereby obtaining a target value difference e=sv-PV of the circulating liquid temperature at the outlet of the circulating device 200. And (3) calling a PID algorithm to calculate the value of the control output Aout based on the target value difference of the circulating liquid temperature at the outlet of the circulating device 200, and adjusting the Aout to respectively calculate Eout and Mout, wherein Eout is used for adjusting the opening degree of the second valve body 140, and Mout is used for adjusting the opening degree of the first valve body 330, wherein Mout is reduced when Eout is increased, and Mout is increased when Eout is decreased, so that the circulating liquid is controlled to perform different refrigerating and heating links, and the accurate control of the circulating liquid temperature entering the etching process equipment is realized. Different carrying capacities of the coupling temperature control system can be realized through the change of the correction coefficient, and the rapid and stable control of the temperature can be realized.
When in use, the valve body is not limited to be a stop valve, an electric valve, an electromagnetic valve or other types of valves which can be opened and closed.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. The utility model provides a coupling temperature control system which characterized in that: the device comprises a refrigerating device, a heating device and a circulating device, wherein the refrigerating device comprises a first refrigerating loop formed by sequentially communicating a heat release passage of a compressor, a condenser and a heat absorption passage of a heat exchanger, the circulating device comprises a circulating liquid loop formed by sequentially communicating a heat exchange passage of the heat exchanger, a water tank, a first pump body and a load, the heating device comprises waste gas treatment equipment, and the waste gas treatment equipment is communicated with the heat release passage of the heat exchanger; the waste gas treatment equipment comprises a combustion chamber and a spray tower, wherein an air outlet of the combustion chamber is communicated with an inlet of the spray tower through a heat release passage of the heat exchanger, the waste gas treatment equipment further comprises a water tank, an air outlet of the combustion chamber is communicated with an air inlet of the spray tower through the water tank, the refrigeration device further comprises an evaporator, the heat release passage of the compressor, the heat release passage of the condenser and the heat absorption passage of the evaporator are sequentially communicated to form a second refrigeration loop, a spray assembly is arranged in the spray tower, and the water tank, the heat release passage of the evaporator, a second pump body and the spray assembly are sequentially communicated.
2. The coupled temperature control system of claim 1, wherein: and a first valve body is arranged on a pipeline, wherein the inlet of the spray tower is communicated with the heat release passage of the heat exchanger.
3. The coupled temperature control system of claim 2, wherein: and a fan is further arranged on a pipeline, wherein the inlet of the spray tower is communicated with the heat release passage of the heat exchanger, and the first valve body and the fan are sequentially arranged along the gas flow direction in the pipeline.
4. The coupled temperature control system of claim 1, wherein: and a first temperature detection part is arranged on a pipeline for communicating the first pump body with the load.
5. The coupled temperature control system of claim 1, wherein: and a second valve body is arranged on a pipeline for communicating the outlet of the heat release passage of the condenser with the inlet of the heat absorption passage of the heat exchanger.
6. The coupled temperature control system of claim 1, wherein: and a third valve body is arranged on a pipeline for communicating the outlet of the heat release passage of the condenser with the inlet of the heat absorption passage of the evaporator.
7. The coupled temperature control system of claim 6, wherein: and a fourth valve body and a second temperature detection part are sequentially arranged on a pipeline, communicated with the spraying assembly, of the second pump body along the liquid flow direction.
8. The coupled temperature control system according to any one of claims 1 to 7, wherein: the heat exchanger is a multi-channel plate heat exchanger.
9. A coupling temperature control method is characterized in that: the coupled temperature control system according to any of the preceding claims 1 to 8, comprising:
s1, acquiring the actual temperature of an outlet of a circulating device;
s2, obtaining a target value difference value of the outlet temperature according to the actual temperature and the target temperature of the outlet of the circulating device;
and S3, controlling the opening degree of the first valve body of the heating device and the opening degree of the second valve body of the refrigerating device according to the target value difference value of the outlet temperature.
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