CN114510089A - Coupling temperature control system and method - Google Patents
Coupling temperature control system and method Download PDFInfo
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- CN114510089A CN114510089A CN202111673077.1A CN202111673077A CN114510089A CN 114510089 A CN114510089 A CN 114510089A CN 202111673077 A CN202111673077 A CN 202111673077A CN 114510089 A CN114510089 A CN 114510089A
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- G05D23/19—Control of temperature characterised by the use of electric means
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Abstract
The invention relates to the technical field of semiconductor manufacturing, in particular to a coupling temperature control system and a method. On the basis of realizing the functions of the temperature control system and the waste gas treatment equipment, the energy of the waste gas treatment equipment is used for heating the circulating liquid in the temperature control system, so that the comprehensive utilization and energy-saving control of energy are effectively realized.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a coupling temperature control system and a coupling temperature control method.
Background
Waste gas produced in the manufacturing process of the integrated circuit is treated by waste gas treatment equipment at home and abroad, the waste gas is subjected to harmless treatment by treatment modes such as combustion washing, electric heating and plasma decomposition, the waste gas has high energy after being treated by the modes such as combustion, electric heating and plasma decomposition, and in the traditional waste gas treatment equipment, the treated waste gas is directly cooled by a spraying system and then is discharged, so that the energy is greatly wasted. Because the waste gas energy of the waste gas treatment equipment is huge, the heat of the waste gas can be equivalent to the heat generated by a heater of 20kW, the heat of the waste gas is far more than the heat generated by a heater in the traditional temperature control equipment, the heat of the waste gas is usually less than 5kW,
the refrigerating capacity of the temperature control equipment of the etching process is designed according to the maximum load capacity in the etching process, in the etching process manufacturing procedure of the integrated circuit manufacturing, the etching load is loaded according to the process steps, a large amount of time is not loaded according to the maximum process load in the process, meanwhile, a part of time is in a no-load transition state, under the conditions of no load and less than full load, the refrigerating capacity in the refrigerating system of the temperature control equipment is not utilized by 100 percent, and therefore the energy waste is also realized.
Disclosure of Invention
The invention provides a coupling temperature control system and a coupling temperature control method, which are used for solving the defects that in waste gas treatment equipment for semiconductor manufacturing in the prior art, the treated waste gas is directly cooled and discharged, so that energy is greatly wasted, and meanwhile, the quick temperature rise speed of a temperature control system is low, so that the temperature of the temperature control equipment is accurately controlled and quickly raised. And the energy of the waste gas treatment equipment is used for heating the circulating liquid in the temperature control system, so that the effects of comprehensive utilization of energy and energy-saving control are effectively realized.
The invention provides a coupling temperature control system which comprises a refrigerating device, a heating device and a circulating device, wherein the refrigerating device comprises a compressor, a heat release passage of a condenser and a heat absorption passage of a heat exchanger which are sequentially communicated to form a first refrigerating loop, the circulating device comprises a heat exchange passage of the heat exchanger, a water tank, a first pump body and a circulating liquid loop formed by sequentially communicating a load, the heating device comprises waste gas treatment equipment, and the waste gas treatment equipment is communicated with the heat release passage of the heat exchanger.
According to the coupling temperature control system provided by the invention, the waste gas treatment equipment comprises a combustion chamber and a spray tower, wherein the gas outlet of the combustion chamber is communicated with the inlet of the spray tower through the heat release passage of the heat exchanger.
According to the coupling temperature control system provided by the invention, a first valve body is arranged on a pipeline for communicating the inlet of the spray tower with the heat release passage of the heat exchanger.
According to the coupling temperature control system provided by the invention, a pipeline, which is communicated with the heat release passage of the heat exchanger, of the inlet of the spray tower is also provided with a fan, and the first valve body and the fan are sequentially arranged along the flow direction of gas in the pipeline.
According to the coupling temperature control system provided by the invention, the waste gas treatment equipment further comprises a water pool, and the gas outlet of the combustion cavity is communicated with the gas inlet of the spray tower through the water pool.
According to the coupling temperature control system provided by the invention, a first temperature detection piece is arranged on a pipeline for communicating the first pump body with the load.
According to the coupling temperature control system provided by the invention, a second valve body is arranged on a pipeline communicating an outlet of a heat release passage of the condenser with an inlet of a heat absorption passage of the heat exchanger.
According to the coupling temperature control system provided by the invention, the refrigerating device further comprises an evaporator, the compressor, the heat release passage of the condenser and the heat absorption passage of the evaporator are sequentially communicated to form a second refrigerating circuit, a spray assembly is arranged in the spray tower, and the water pool, the heat release passage of the evaporator, the second pump body and the spray assembly are sequentially communicated.
According to the coupling temperature control system provided by the invention, a third valve body is arranged on a pipeline for communicating the outlet of the heat release passage of the condenser with the inlet of the heat absorption passage of the evaporator.
According to the coupling temperature control system provided by the invention, a fourth valve body and a second temperature detection piece are sequentially arranged on a pipeline of the second pump body communicated with the spray assembly along the liquid flow direction.
According to the coupling temperature control system provided by the invention, the heat exchanger is a multi-channel plate type heat exchanger.
The invention also provides a coupling temperature control method, which is applied to the coupling temperature control system and comprises the following steps:
s1, acquiring the actual temperature of the outlet of the circulating device;
s2, obtaining a target value difference value of the outlet temperature according to the actual temperature and the target temperature of the outlet of the circulating device;
and S3, controlling the opening degree of the first valve body of the heating device and the second valve body of the refrigerating device according to the target value difference of the outlet temperature.
The coupling temperature control system provided by the invention can fully utilize the energy of the waste gas in the waste gas treatment equipment while realizing the waste gas treatment of the etching process equipment, and the waste gas with high energy is used for heating the circulating liquid of the temperature control system. The heater that traditional special temperature control system of semiconductor adopted is less than 5kW usually, and exhaust gas treatment equipment's waste gas energy is huge, the heat of waste gas can be equivalent to the heat that 20 kW's heater produced, be greater than the heat that heater produced among the traditional temperature control system, at the in-process that utilizes waste gas energy, temperature control system's rapid heating up's effect can be realized, and when circulation liquid flows into the control of realization rapid heating up in the heat exchanger, rapid heating up's speed can improve more than 3 times, it is faster than traditional temperature control system's rapid heating up speed, realize temperature control equipment's temperature accurate control and rapid heating up control. On the basis of realizing the functions of the temperature control system and the waste gas treatment equipment, the energy of the waste gas treatment equipment is used for heating the circulating liquid in the temperature control system, so that the comprehensive utilization and energy-saving control of energy are effectively realized.
In addition to the technical problems addressed by the present invention, the technical features constituting the technical solutions and the advantages brought by the technical features of the technical solutions described above, other technical features of the present invention and the advantages brought by the technical features of the present invention will be further described with reference to the accompanying drawings or will be understood by the practice of the present invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a coupled temperature control system according to the present invention;
FIG. 2 is a second schematic structural diagram of a coupled temperature control system according to the present invention;
reference numerals:
100. a refrigeration device; 110. a compressor; 120. a condenser; 130. a heat exchanger; 140. a second valve body; 150. an evaporator; 160. a second pump body; 170. a third valve body; 180. a fourth valve body; 190. a second temperature detection member;
200. a circulation device; 210. a water tank; 220. a first pump body; 230. a load; 250. a first temperature detection member; 260. a third temperature detection member;
300. a heating device; 320. an exhaust gas treatment device; 330. a first valve body; 340. a fan; 321. a combustion chamber; 322. a spray tower; 323. a pool; 324. and a spraying assembly.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. Specific meanings of the above terms in the embodiments of the present invention can be understood in specific cases by those of ordinary skill in the art.
In embodiments of the invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Further, in the description of the embodiments of the present invention, unless otherwise specified, "a plurality", and "a plurality" mean two or more, and "a plurality", "several", and "several groups" mean one or more.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
As shown in fig. 1, the coupled temperature control system according to the embodiment of the present invention includes a refrigeration apparatus 100, a heating apparatus 300, and a circulation apparatus 200, where the refrigeration apparatus 100 includes a first refrigeration loop formed by sequentially communicating a heat release path of a compressor 110 and a heat absorption path of a condenser 120 with a heat absorption path of a heat exchanger 130, the circulation apparatus 200 includes a circulation fluid loop formed by sequentially communicating a heat exchange path of the heat exchanger 130, a water tank 210, a first pump 220, and a load 230 with one another, the heating apparatus 300 includes an exhaust gas treatment device 320, and the exhaust gas treatment device 320 is communicated with the heat release path of the heat exchanger 130.
The coupling temperature control system of the embodiment of the invention is used as important equipment in the manufacturing process of the etching process of the semiconductor integrated circuit, and can carry out harmless treatment on waste gas of the etching process equipment in the manufacturing process of the integrated circuit, accurately control the temperature in the reaction cavity of the etching process equipment and ensure the accurate control of the temperature of the reaction cavity.
The load 230 is an etching process device, the cooling liquid circularly flows in the first refrigeration loop of the refrigeration device 100, the high-temperature and high-pressure cooling liquid output by the compressor 110 releases heat through the heat release path of the condenser 120, the cooling liquid passes through the heat absorption path of the heat exchanger 130 after being cooled, and exchanges heat with the circulating liquid in the heat exchange path of the heat exchanger 130 to reduce the temperature of the circulating liquid, then the cooling liquid returns to the compressor 110, the circulating liquid enters the water tank 210 after being cooled, is pumped out through the first pump body 220 and conveyed to the etching process device to cool the reaction cavity of the etching process device, the high-temperature circulating liquid flowing out of the etching process device flows into the heat exchange path of the heat exchanger 130 again, and the circulating liquid circularly flows in the circulating liquid loop to realize the cooling control of the reaction cavity of the etching process device.
The waste gas of the waste gas treatment equipment 320 enters the heat release passage of the heat exchanger 130 to exchange heat with the circulating liquid in the heat exchange passage, so that the temperature of the circulating liquid is raised, the waste gas returns to the waste gas treatment equipment 320, the circulating liquid is heated and then enters the water tank 210, the circulating liquid is pumped out through the first pump body 220 and conveyed to the etching process equipment, the temperature of the reaction cavity of the etching process equipment is raised, the circulating liquid circularly flows in the circulating liquid loop, and the temperature rise control of the reaction cavity of the etching process equipment is realized.
The circulating liquid can absorb heat and raise temperature as well as release heat to lower temperature in the heat exchanger 130, that is, in the temperature raising process, the heat exchange channel of the heat exchanger 130 is used as the heat absorption channel, and in the temperature lowering process, the heat exchange channel of the heat exchanger 130 is used as the heat release channel. When the reaction chamber of the etching process equipment needs rapid temperature rise control, the first refrigeration loop is closed, the heating device 300 is opened, that is, only the circulating liquid flowing out of the etching process equipment in the heat exchanger 130 exchanges heat with the waste gas discharged from the waste gas treatment equipment 320, and the circulating liquid is heated in the heat exchanger 130, so that rapid temperature rise is realized. When the reaction chamber of the etching process equipment needs rapid cooling control, the first refrigeration loop is opened, the heating device 300, that is, only the circulating liquid flowing out of the etching process equipment in the heat exchanger 130 exchanges heat with the cooling liquid flowing out of the condenser 120, and the circulating liquid is cooled in the heat exchanger 130, so that rapid cooling is realized.
According to the invention, the energy of the waste gas in the waste gas treatment equipment 320 is fully utilized while the waste gas treatment of the etching process equipment is realized, and the waste gas with high energy is used for heating the circulating liquid of the temperature control system. The heater that traditional special temperature control system of semiconductor adopted is less than 5kW usually, and exhaust gas treatment equipment 320's exhaust gas energy is huge, the heat of waste gas can be equivalent to the heat that 20 kW's heater produced, be greater than the heat that heater produced among traditional temperature control system, at the in-process that utilizes exhaust gas energy, temperature control system's fast heating's effect can be realized, and when circulation liquid flowed into the control that realizes fast heating in heat exchanger 130, fast heating's speed can improve more than 3 times, it is faster than traditional temperature control system's fast heating speed, realize temperature control equipment's temperature accurate control and fast heating control. On the basis of realizing the functions of the temperature control system and the waste gas treatment equipment 320, the energy of the waste gas treatment equipment 320 is used for heating the circulating liquid in the temperature control system, so that the comprehensive utilization and energy-saving control of energy sources are effectively realized.
According to one embodiment of the present invention, the exhaust gas treatment device 320 comprises a combustion chamber 321 and a spray tower 322, wherein an air outlet of the combustion chamber 321 is communicated with an inlet of the spray tower 322 through a heat release passage of the heat exchanger 130. In this embodiment, after the waste gas of the etching process equipment enters the combustion chamber 321 for combustion reaction, a large amount of heat is generated and enters the heat release passage of the heat exchanger 130 along with the waste gas, the heat exchange is performed with the circulating liquid in the heat exchanger 130, the circulating liquid is heated and flows into the water tank 210, the waste gas passes through the heat exchanger 130 and then enters the spray tower 322, the spray tower 322 sprays the waste gas, and the waste gas is cooled and purified and then is discharged by the spray tower 322.
According to one embodiment of the present invention, a first valve body 330 is disposed on a pipeline connecting an inlet of the spray tower 322 and a heat release path of the heat exchanger 130. In this embodiment, the opening degree of the first valve body 330 is controlled to accurately control the amount of the exhaust gas entering the heat exchanger 130, so as to control the amount of heat exchange between the circulating liquid and the exhaust gas in the heat exchanger 130, and to accurately control the temperature of the reaction chamber of the etching process equipment.
In this embodiment, the first valve body 330 may be an electrically operated valve.
According to an embodiment provided by the invention, a fan 340 is further arranged on a pipeline through which an inlet of the spray tower 322 is communicated with a heat release passage of the heat exchanger 130, and the first valve body 330 and the fan 340 are sequentially arranged along a gas flow direction in the pipeline. In this embodiment, the fan 340 provides power for the flow of the exhaust gas from the heat releasing path of the heat exchanger 130 to the spray tower 322, i.e., provides power for the flow of the exhaust gas between the exhaust gas treatment device 320 and the heat exchanger 130.
According to an embodiment of the present invention, the waste gas treatment device 320 further includes a water tank 323, and the gas outlet of the combustion chamber 321 is communicated with the gas inlet of the spray tower 322 through the water tank 323. In this embodiment, a water pool 323 is disposed below the air outlet of the combustion chamber 321 and the air inlet of the spray tower 322, the spray tower 322 sprays the exhaust gas, and the spray liquid falls into the water pool 323 to be stored and deposited. The side wall of the air outlet of the combustion cavity 321 is additionally provided with one end of an outlet connecting air outlet pipeline, the other end of the air outlet pipeline is connected with the inlet of the heat release passage of the heat exchanger 130, the outlet of the heat release passage of the heat exchanger 130 is connected with one end of an air inlet pipeline, the other end of the air inlet pipeline penetrates through the water pool 323 to reach the air inlet of the spray tower 322, and the fan 340 and the first valve body 330 are both arranged on the pipe section of the air inlet pipeline, which is positioned outside the water pool 323.
According to an embodiment of the present invention, a first temperature detecting member 250 is disposed on a pipeline of the first pump body 220 communicating with the load 230. In this embodiment, the first temperature detecting element 250 is used to detect the temperature of the circulating liquid pumped out by the first pump body 220 before entering the etching process equipment, that is, the first temperature detecting element 250 detects the outlet temperature of the circulating device 200, and the opening of the first valve body 330 can be adjusted by detecting the temperature by the first temperature detecting element 250, so as to control the temperature of the circulating liquid entering the etching process equipment.
In this embodiment, the first temperature detecting member 250 may be a temperature sensor. The pipeline of the load 230 communicating with the heat exchange path of the heat exchanger 130 is further provided with a third temperature detecting element 260, which can also adopt a temperature sensor, and has a function of detecting the temperature of the circulating liquid flowing out of the etching process equipment, namely the return temperature of the circulating device 200.
According to an embodiment of the present invention, a second valve body 140 is disposed on a pipeline connecting an outlet of the heat releasing path of the condenser 120 and an inlet of the heat absorbing path of the heat exchanger 130. In this embodiment, after the cooling liquid delivered from the compressor 110 exchanges heat with the refrigerant in the heat absorption path of the condenser 120 in the heat release path of the condenser 120, the temperature of the cooling liquid decreases, and the cooling liquid is depressurized through the second valve body 140 and the flow rate of the cooling liquid entering the heat absorption path of the heat exchanger 130 is controlled, so as to control the heat exchange amount between the cooling liquid and the circulating liquid in the heat exchanger 130. The opening degree of the second valve body 140 can be adjusted by detecting the temperature by the first temperature detector 250.
In this embodiment, the second valve body 140 may be an electronic expansion valve.
As shown in fig. 2, according to an embodiment of the present invention, the refrigeration apparatus 100 further includes an evaporator 150, the compressor 110, the heat releasing path of the condenser 120, and the heat absorbing path of the evaporator 150 are sequentially communicated to form a second refrigeration circuit, a spray assembly 324 is disposed in the spray tower 322, and the water tank 323, the heat releasing path of the evaporator 150, the second pump body 160, and the spray assembly 324 are sequentially communicated. In this embodiment, the compressor 110 in the refrigeration apparatus 100 conveys the high-temperature and high-pressure cooling liquid to be cooled by the condenser 120 and then divided into two paths, one path of the cooling liquid passes through the second valve body 140 and then enters the heat exchanger 130 to exchange heat with the circulating liquid, the cooling liquid after heat exchange returns to the compressor 110 to form a first refrigeration loop, the other path of the cooling liquid passes through the heat absorption path of the evaporator 150, the spraying liquid in the water tank 323 enters the heat release path of the evaporator 150 to exchange heat with the cooling liquid, the cooling liquid after heat exchange returns to the compressor 110 to form a second refrigeration loop, the spraying liquid is cooled and then pumped into the spraying assembly 324 arranged in the spraying tower 322 through the second pump body 160, and the waste gas entering the spraying tower 322 is sprayed, cooled and purified.
According to the invention, the evaporator 150 is arranged in the refrigerating device 100 to form a second refrigerating loop, so that redundant refrigerating capacity of the refrigerating device 100 is fully utilized, the second refrigerating loop is used for cooling the spraying liquid of the water pool 323 in the waste gas treatment equipment 320, the treated spraying liquid is used for spraying and cooling the waste gas, and therefore, the redundant refrigerating capacity of the temperature control system is comprehensively utilized. On the basis of realizing the functions of the temperature control system and the waste gas treatment equipment 320, the heat of the waste gas treatment equipment 320 is used for heating circulating liquid in the temperature control equipment, and the redundant refrigerating capacity in the refrigerating device 100 is used for cooling and spraying the waste gas in the waste gas treatment equipment 320, so that the comprehensive utilization of energy is further realized. The redundant refrigerating capacity of the refrigerating device 100 is fully utilized for cooling the waste gas of the waste gas treatment equipment 320, the redundant refrigerating capacity of the temperature control system is effectively utilized, and the problem that the redundant refrigerating capacity in the temperature control system is repeatedly and circularly evaporated and compressed in the refrigerating device 100 and cannot be effectively utilized is solved.
According to an embodiment of the present invention, a third valve body 170 is provided on a pipeline connecting an outlet of the heat-releasing path of the condenser 120 and an inlet of the heat-absorbing path of the evaporator 150. In this embodiment, after the cooling liquid in the refrigeration system passes through the condenser 120, one path of the cooling liquid passes through the second valve body 140 and enters the heat exchanger 130 to be evaporated, so as to cool the circulating liquid in the circulating device 200; the other path enters the evaporator 150 through the third valve body 170 to evaporate, and the temperature of the spray liquid in the water tank 323 in the waste gas treatment equipment 320 is reduced. In this embodiment, the opening degree of the third valve body 170 is 100% to the opening degree of the second valve body 140, which not only realizes the required cooling capacity in the precise temperature control process of the temperature control system, but also fully utilizes the redundant cooling capacity of the temperature control system, thereby fully utilizing the energy.
In this embodiment, the third valve body 170 may be an electronic expansion valve.
According to an embodiment of the present invention, a fourth valve body 180 and a second temperature detecting member 190 are sequentially disposed on a pipeline of the second pump body 160 communicating with the spray assembly 324 along a liquid flow direction. In this embodiment, the high-temperature spray liquid in the water tank 323 enters the heat release path of the evaporator 150 to exchange heat with the cooling liquid in the heat absorption path of the evaporator 150, and the spray liquid is pumped out through the second pump body 160 after being cooled, and flows into the spray assembly 324 in the spray tower 322 to spray and cool the exhaust gas after flowing through the fourth valve body 180 and the second temperature detection member 190. The fourth valve body 180 can control the flow rate of the spray liquid and prevent the spray liquid from flowing back to the evaporator 150, and the second temperature detector 190 is used to detect the temperature of the spray liquid pumped out by the second pump body 160, i.e., the temperature of the spray liquid before entering the spray assembly 324, so as to control the opening degree of the third valve body 170, thereby adjusting the heat exchange amount of the evaporator 150 and further controlling the temperature of the spray liquid.
In this embodiment, the fourth valve body 180 may be an electrically operated valve. The second temperature sensing member 190 may employ a temperature sensor.
According to one embodiment provided by the present invention, heat exchanger 130 is a multi-channel plate heat exchanger. In this embodiment, the multi-channel plate heat exchanger has three heat exchange plate bodies located inside the housing, which may be in the form of coil plates, one heat exchange plate being a heat exchange path of the heat exchanger 130, and circulating liquid flowing inside, one heat exchange plate being a heat release path of the heat exchanger 130, and circulating exhaust gas inside, and the other heat exchange plate being a heat absorption path of the heat exchanger 130, and circulating coolant inside. In other embodiments, the heat exchanger 130 may also adopt other heat exchange devices, and it is sufficient that the heat exchange conditions of multi-path gas-liquid heat are satisfied.
The embodiment of the invention also provides a coupling temperature control method, and an applied coupling temperature control system comprises the following steps:
s1, acquiring an actual temperature of the outlet of the circulation device 200;
s2, obtaining a target value difference of the outlet temperature according to the actual temperature and the target temperature of the outlet of the circulating device 200;
s3, the opening degrees of the first valve body 330 of the heating device 300 and the second valve body 140 of the cooling device 100 are controlled according to the target value difference of the outlet temperature.
In the coupling temperature control method of the present invention, a target temperature SV of the circulating liquid at the outlet of the circulating device 200 is set, an actual temperature PV of the circulating liquid at the outlet of the circulating device 200 is detected by the first temperature detector 250, and a difference between the actual temperature PV and the target temperature SV is obtained to obtain a target value difference E ═ SV-PV of the circulating liquid temperature at the outlet of the circulating device 200. And calling a PID algorithm to calculate a numerical value of the control output Aout based on the target value difference of the temperature of the circulating liquid at the outlet of the circulating device 200, adjusting the Aout, and calculating Eout and Mout respectively, wherein the Eout is used for adjusting the opening of the second valve body 140, the Mout is used for adjusting the opening of the first valve body 330, the Mout is reduced when the Eout is increased, and the Mout is increased when the Eout is reduced, so that the circulating liquid is controlled to perform different links of refrigeration and temperature rise, and the temperature of the circulating liquid entering the etching process equipment is accurately controlled. By changing the correction coefficient, different loading capacities of the coupled temperature control system can be realized, and the rapid and stable control of the temperature can be realized.
When in use, the valve body is not limited to be a stop valve, an electric valve, an electromagnetic valve or other valves which can be opened and closed.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (12)
1. A coupled temperature control system, comprising: including refrigerating plant, heating device and circulating device, refrigerating plant includes the first refrigeration return circuit that the heat release route of compressor, condenser, the heat absorption route of heat exchanger communicate formation in proper order, circulating device includes the heat transfer route, water tank, the first pump body and the load of heat exchanger communicate the circulation liquid return circuit that forms in proper order, heating device includes exhaust-gas treatment equipment, exhaust-gas treatment equipment with the heat release route intercommunication of heat exchanger.
2. The coupled temperature control system of claim 1, wherein: the waste gas treatment equipment comprises a combustion chamber and a spray tower, wherein a gas outlet of the combustion chamber is communicated with an inlet of the spray tower through a heat release passage of the heat exchanger.
3. The coupled temperature control system of claim 2, wherein: and a first valve body is arranged on a pipeline for communicating the inlet of the spray tower with the heat release passage of the heat exchanger.
4. The coupled temperature control system of claim 3, wherein: the pipeline that the import of spray column and the heat release route of heat exchanger communicate still is equipped with the fan, first valve body with the fan sets gradually along the gas flow direction in the pipeline.
5. The coupled temperature control system of claim 2, wherein: the waste gas treatment equipment further comprises a water tank, and the gas outlet of the combustion cavity is communicated with the gas inlet of the spray tower through the water tank.
6. The coupled temperature control system of claim 1, wherein: and a first temperature detection piece is arranged on a pipeline of the first pump body and the load communication.
7. The coupled temperature control system of claim 1, wherein: and a second valve body is arranged on a pipeline communicated with the outlet of the heat release passage of the condenser and the inlet of the heat absorption passage of the heat exchanger.
8. The coupled temperature control system of claim 5, wherein: the refrigerating device further comprises an evaporator, the compressor, a heat release passage of the condenser and a heat absorption passage of the evaporator are sequentially communicated to form a second refrigerating circuit, a spray assembly is arranged in the spray tower, and the water pool, the heat release passage of the evaporator, a second pump body and the spray assembly are sequentially communicated.
9. The coupled temperature control system of claim 8, wherein: and a third valve body is arranged on a pipeline communicated with the outlet of the heat release passage of the condenser and the inlet of the heat absorption passage of the evaporator.
10. The coupled temperature control system of claim 9, wherein: and a fourth valve body and a second temperature detection piece are sequentially arranged on a pipeline communicated with the spray assembly along the liquid flow direction on the second pump body.
11. The coupled temperature control system of any one of claims 1 to 10, wherein: the heat exchanger is a multi-channel plate heat exchanger.
12. A coupling temperature control method is characterized in that: the coupled temperature control system of any one of the preceding claims 1 to 11, comprising:
s1, acquiring the actual temperature of the outlet of the circulating device;
s2, obtaining a target value difference value of the outlet temperature according to the actual temperature and the target temperature of the outlet of the circulating device;
and S3, controlling the opening degree of the first valve body of the heating device and the second valve body of the refrigerating device according to the target value difference of the outlet temperature.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014219147A (en) * | 2013-05-08 | 2014-11-20 | 株式会社アピステ | Temperature controller |
| CN111912141A (en) * | 2020-08-06 | 2020-11-10 | 中国人民解放军海军工程大学 | Gas turbine becomes cyclic energy and synthesizes ladder utilization system |
| CN112416029A (en) * | 2021-01-25 | 2021-02-26 | 北京京仪自动化装备技术有限公司 | Temperature control system and temperature control method for semiconductor production |
| CN213687977U (en) * | 2020-11-18 | 2021-07-13 | 苏州领跑者能源科技有限公司 | Novel high-temperature waste gas treatment and waste heat recovery system |
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2021
- 2021-12-31 CN CN202111673077.1A patent/CN114510089B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014219147A (en) * | 2013-05-08 | 2014-11-20 | 株式会社アピステ | Temperature controller |
| CN111912141A (en) * | 2020-08-06 | 2020-11-10 | 中国人民解放军海军工程大学 | Gas turbine becomes cyclic energy and synthesizes ladder utilization system |
| CN213687977U (en) * | 2020-11-18 | 2021-07-13 | 苏州领跑者能源科技有限公司 | Novel high-temperature waste gas treatment and waste heat recovery system |
| CN112416029A (en) * | 2021-01-25 | 2021-02-26 | 北京京仪自动化装备技术有限公司 | Temperature control system and temperature control method for semiconductor production |
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