CN114505783A - Scratch-resistant retaining ring - Google Patents
Scratch-resistant retaining ring Download PDFInfo
- Publication number
- CN114505783A CN114505783A CN202210089338.3A CN202210089338A CN114505783A CN 114505783 A CN114505783 A CN 114505783A CN 202210089338 A CN202210089338 A CN 202210089338A CN 114505783 A CN114505783 A CN 114505783A
- Authority
- CN
- China
- Prior art keywords
- ring
- retaining ring
- grinding
- scratch
- strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003678 scratch resistant effect Effects 0.000 title claims abstract description 35
- 239000007767 bonding agent Substances 0.000 claims abstract description 8
- 239000004033 plastic Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 229910001105 martensitic stainless steel Inorganic materials 0.000 claims description 6
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 5
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims description 5
- 229920002530 polyetherether ketone Polymers 0.000 claims description 5
- 239000006227 byproduct Substances 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 10
- 238000005498 polishing Methods 0.000 description 27
- 238000005488 sandblasting Methods 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000007517 polishing process Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 4
- 238000006748 scratching Methods 0.000 description 3
- 230000002393 scratching effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention provides a scratch-resistant retaining ring, which comprises a rigid ring and an elastic ring; the elastic ring comprises a first bonding surface and a grinding surface; the rigid ring comprises a second bonding surface and a fixing surface; the first bonding surface and the second bonding surface are tightly adhered and fixed through a bonding agent; at least three strip-shaped grooves which are obliquely arranged are arranged on the grinding surface at equal intervals; the connection part of the strip-shaped groove and the upper surface of the grinding surface is not provided with a fillet. According to the retaining ring provided by the invention, through improving the connection part of the strip-shaped groove and the upper surface of the grinding surface (making the chamfer angle into 0), the grinding effect of the retaining ring on the grinding pad is increased, grinding byproducts are more effectively removed, and the scratch of the retaining ring on a wafer in the grinding process is reduced and improved.
Description
Technical Field
The invention belongs to the technical field of semiconductor processing, relates to a retaining ring, and particularly relates to a scratch-resistant retaining ring.
Background
Integrated circuits are typically formed on a silicon substrate by sequentially depositing conductive, semiconductive or insulative layers on the substrate, with one process step involving depositing a fill layer on a non-planar surface and planarizing the fill layer until the non-planar surface is exposed. For example, a conductive fill layer may be deposited over the patterned insulating layer to fill the trenches or holes in the insulating layer, and then polished until the raised pattern of the insulating layer is exposed. After planarization, the portions of the conductive layer remaining between the raised patterns of the insulating layer form vias, plugs, and lines to provide conductive paths between thin film circuits on the substrate. In addition, planarization can also be used to lithographically planarize the substrate surface.
Chemical mechanical polishing is a commonly used planarization method in which a polishing head holds a wafer and presses the wafer against a polishing pad. The wafer is received in a retaining ring on the polishing head during polishing, the retaining ring serving to receive and position the wafer. During polishing, the polishing liquid and deionized water are continuously in contact with the retainer ring, and therefore the retainer ring needs to have certain corrosion resistance.
The existing retaining ring is formed by bonding a rigid material ring and an elastic material ring together through a specific adhesive, and the structure has the advantages that the bonding area is small, the degumming phenomenon is easy to occur in the use process, and the adhesive on the bonding surface is easy to directly contact with external chemical substances such as deionized water, polishing solution and the like in the polishing process, so that after a plurality of polishing cycles, due to the corrosion effect of the chemical solution, the adhesive on the bonding surface is damaged, the upper layer material and the lower layer material are separated, and the service life of the retaining ring is shortened. In addition, the retaining ring can scratch or even damage the wafer during the polishing process, which causes waste of resources.
CN 214322993U discloses a retaining ring comprising a rigid ring and an elastic ring; the rigid ring comprises a first bonding surface, and at least 2 annular grooves are radially distributed on the first bonding surface; the elastic ring comprises a second bonding surface, and annular bulges matched with the annular grooves are radially distributed on the second bonding surface; the first bonding surface is provided with a first sand blasting layer, the second bonding surface is provided with a second sand blasting layer, the roughness Ra of the first sand blasting layer and the roughness Ra of the second sand blasting layer are both 4-8 mu m, and the first bonding surface and the second bonding surface are tightly attached and fixed through a bonding agent.
CN 111571427a discloses a retaining ring comprising a first ring and a second ring; the first ring is formed by performing sand blasting treatment on a bonding part; the second ring is formed by sand blasting treatment on the bonding part; the roughness Ra of the bonded part of the first ring subjected to sand blasting treatment is 4-8 μm; the roughness Ra of the bonded part of the second ring subjected to sand blasting treatment is 4-8 mu m; the first ring comprises a first annular concave step and a second annular concave step which are arranged in sequence; the step surface and the side surface of the first annular concave step and the side surface of the second annular concave step are bonding parts of the first ring. The retaining ring strictly limits the roughness of the bonded part after sand blasting through sand blasting treatment of the bonded part in the retaining ring, and improves the service life of the retaining ring.
CN 211661824U discloses a retaining ring, in which an annular groove is formed on an elastic ring, and a dovetail groove is formed inwards along the center of the annular groove, wherein the annular groove and an annular protrusion on a rigid ring are bonded by an adhesive, so that the bonding area is increased; and the dovetail can let the adhesive get into wherein, can strengthen horizontal pulling force after the adhesive solidification, be difficult to come unstuck, make elasticity ring and rigidity ring bond more firmly to the life of retaining ring has been improved.
CN 212947226U discloses a retaining ring comprising an elastic ring and a rigid ring: the central position on the rigid ring is provided with an annular groove: the elastic ring is provided with an annular boss matched with the annular groove of the rigid ring, the annular boss is provided with a first groove and a second groove, the bonding area of the rigid ring and the elastic ring is increased, and the service life of the retaining ring is prolonged.
The above patent documents all disclose different structures of the retaining ring, the main purpose of which is to improve the service life of the retaining ring, and in the above retaining ring, the connection of the groove and the surface is chamfered. None of the above patents addresses the problem of reducing or improving the scratching of the wafer by the retaining ring during polishing. Therefore, it is an object of the present invention to provide a retaining ring that reduces or improves the scratching of the wafer during polishing.
Disclosure of Invention
In view of the deficiencies of the prior art, it is an object of the present invention to provide a scratch resistant retaining ring. The scratch resistant retaining ring may reduce or improve the problem of wafer scratching by the retaining ring during polishing.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a scratch-resistant retaining ring, which comprises a rigid ring and an elastic ring;
the elastic ring comprises a first bonding surface and a grinding surface;
the rigid ring comprises a second bonding surface and a fixing surface;
the first bonding surface and the second bonding surface are tightly adhered and fixed through a bonding agent;
at least three strip-shaped grooves which are obliquely arranged are arranged on the grinding surface at equal intervals;
the connection part of the strip-shaped groove and the upper surface of the grinding surface is not provided with a fillet.
According to the scratch-resistant retaining ring, the connecting part of the strip-shaped groove and the upper surface of the grinding surface is improved (the chamfer angle is made to be 0), so that the grinding effect of the retaining ring on a grinding pad is increased, grinding byproducts are removed more effectively, and the scratch of the retaining ring on a wafer in the grinding process is reduced and improved.
Preferably, the axial depth of the strip-like grooves is 2.3-3.5mm, and may be, for example, 2.3mm, 2.4mm, 2.5mm, 2.6mm, 2.7mm, 2.8mm, 2.9mm, 3.0mm, 3.1mm, 3.2mm, 3.3mm, 3.4mm or 3.5mm, but is not limited to the values listed, and other values not listed in the numerical range are equally applicable.
Preferably, the radial width of the strip-like groove is 2.8-3.5mm, and may be, for example, 2.8mm, 2.9mm, 3.0mm, 3.1mm, 3.2mm, 3.3mm, 3.4mm or 3.5mm, but is not limited to the values recited, and other values not recited in the range of values are equally applicable.
Preferably, the roughness of the polished surface is 3 to 10 μm, and may be, for example, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm, 8 μm, 8.5 μm, 9 μm, 9.5 μm or 10 μm, but is not limited to the values recited, and other values not recited within the range of values are equally applicable.
Preferably, the material of the elastic ring comprises PPS plastic or PEEK plastic.
Preferably, the fixing surface is provided with at least three fixing grooves at equal intervals.
Preferably, the rigid ring is made of a material including martensitic stainless steel or a PEEK material.
Preferably, the roughness of the fixing surface is 3 to 10 μm, and may be, for example, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm, 8 μm, 8.5 μm, 9 μm, 9.5 μm or 10 μm, but is not limited to the values listed, and other values not listed in the numerical range are also applicable.
Preferably, the rigid ring has a thickness of 11-15mm, for example 11mm, 11.5mm, 12mm, 12.5mm, 13mm, 13.5mm, 14mm, 14.5mm or 15mm, but is not limited to the values recited, and other values not recited within the range of values are equally applicable.
Preferably, the elastic ring has a thickness of 5.1 to 6.5mm, and may be, for example, 5.1mm, 5.2mm, 5.3mm, 5.4mm, 5.5mm, 5.6mm, 5.7mm, 5.8mm, 5.9mm, 6.0mm, 6.1mm, 6.2mm, 6.3mm, 6.4mm or 6.5mm, but is not limited to the values recited, and other values not recited within the range of values are equally applicable.
The scratch-resistant retaining ring provided by the invention is used for fixing the wafer, and the surface of the wafer is ground to a certain thickness through relative rotation, so that the purpose of flattening the surface of the wafer is achieved. In the mechanical grinding process, the grinding surface of the retaining ring is pressed on the grinding pad, the grinding pad is mainly used for grinding the retaining ring through diamond trimming into a disc, grinding byproducts in the grinding process are removed, and scratches of the silicon wafer caused by the grinding byproducts are reduced; the retaining ring also has the function of polishing the polishing pad, and has a certain effect of removing polishing byproducts.
In the mechanical grinding process, if the chamfer angle of the strip-shaped groove on the grinding surface of the retaining ring is too large, the pressure of the retaining ring on a grinding pad is insufficient in the grinding process, so that the scratch problem caused by grinding byproducts is generated, and the quality of a wafer is influenced. According to the scratch-resistant retaining ring provided by the invention, the pressure of the retaining ring on a grinding pad is enhanced by not arranging the chamfer angle on the strip-shaped groove, and the scratch of the retaining ring on a wafer in the grinding process is reduced and improved.
The recitation of numerical ranges herein includes not only the above-recited numerical values, but also any numerical values between non-recited numerical ranges, and is not intended to be exhaustive or to limit the invention to the precise numerical values encompassed within the range for brevity and clarity.
Compared with the prior art, the invention has the beneficial effects that:
the scratch-resistant retaining ring provided by the invention improves the connection part of the strip-shaped groove and the upper surface of the grinding surface (the chamfer angle is made to be 0), so that the grinding effect of the retaining ring on a grinding pad is increased, grinding byproducts are more effectively removed, and the scratch of the retaining ring on a wafer in the grinding process is reduced and improved.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitation of the present invention.
Example 1
The present embodiments provide a scratch resistant retaining ring comprising a rigid ring and an elastomeric ring;
the elastic ring comprises a first bonding surface and a grinding surface;
the rigid ring comprises a second bonding surface and a fixing surface;
the first bonding surface and the second bonding surface are tightly adhered and fixed through a bonding agent;
18 obliquely arranged strip-shaped grooves are formed in the grinding surface at equal intervals;
the connection part of the strip-shaped groove and the upper surface of the grinding surface is not provided with a fillet.
The axial depth of the strip-shaped groove is 3.0mm, and the radial width of the strip-shaped groove is 3.2 mm.
The roughness of the grinding surface is 4 μm.
The elastic ring is made of PPS plastic.
The fixed surface is provided with 18 fixed slots at equal intervals.
The rigid ring is made of martensitic stainless steel;
the roughness of the fixing surface was 4 μm.
The thickness of the rigid ring is 12.5 mm; the thickness of the elastic ring is 4.5 mm.
The scratch-resistant retaining ring provided by the embodiment increases the polishing effect of the retaining ring on the polishing pad, more effectively removes the polishing by-products, and reduces and improves the scratch of the retaining ring on the wafer in the polishing process.
With the scratch-resistant retaining ring provided by the embodiment, the mounting success rate is 98%.
The upper probability is: after the machine station is replaced with a new retaining ring, the machine station needs to perform machine inspection once, and the machine inspection content comprises the following steps: and if the scratch number, the flatness and the flatness of the wafer are within the specified allowable range, the successful assembly is indicated.
Example 2
The present embodiments provide a scratch resistant retaining ring comprising a rigid ring and an elastomeric ring;
the elastic ring comprises a first bonding surface and a grinding surface;
the rigid ring comprises a second bonding surface and a fixing surface;
the first bonding surface and the second bonding surface are tightly adhered and fixed through a bonding agent;
3 obliquely arranged strip-shaped grooves are formed in the grinding surface at equal intervals;
the connection part of the strip-shaped groove and the upper surface of the grinding surface is not provided with a fillet.
The axial depth of the strip-shaped groove is 2.3mm, and the radial width of the strip-shaped groove is 2.8 mm.
The roughness of the grinding surface is 3 μm.
The elastic ring is made of PEEK plastic.
The fixed surface is equidistantly provided with 3 fixed slots.
The rigid ring is made of martensitic stainless steel;
the roughness of the fixing surface was 3 μm.
The thickness of the rigid ring is 11 mm; the thickness of the elastic ring is 4 mm.
The scratch-resistant retaining ring provided by the embodiment increases the polishing effect of the retaining ring on the polishing pad, more effectively removes the polishing by-products, and reduces and improves the scratch of the retaining ring on the wafer in the polishing process.
With the scratch resistant retaining ring provided in this example, the machine installation success rate was 96%.
Example 3
The present embodiments provide a scratch resistant retaining ring comprising a rigid ring and an elastomeric ring;
the elastic ring comprises a first bonding surface and a grinding surface;
the rigid ring comprises a second bonding surface and a fixing surface;
the first bonding surface and the second bonding surface are tightly adhered and fixed through a bonding agent;
12 obliquely arranged strip-shaped grooves are formed in the grinding surface at equal intervals;
the connection part of the strip-shaped groove and the upper surface of the grinding surface is not provided with a fillet.
The axial depth of the strip-shaped groove is 3.5mm, and the radial width of the strip-shaped groove is 3.5 mm.
The roughness of the grinding surface is 10 μm.
The elastic ring is made of PPS plastic.
12 fixing grooves are arranged on the fixing surface at equal intervals.
The rigid ring is made of martensitic stainless steel;
the roughness of the fixing surface is 10 μm.
The thickness of the rigid ring is 15 mm; the thickness of the elastic ring is 7 mm.
The scratch-resistant retaining ring provided by the embodiment increases the polishing effect of the retaining ring on the polishing pad, more effectively removes the polishing by-products, and reduces and improves the scratch of the retaining ring on the wafer in the polishing process.
With the scratch resistant retaining ring provided in this example, the machine installation success rate was 96%.
Example 4
The present embodiments provide a scratch resistant retaining ring comprising a rigid ring and an elastomeric ring;
the elastic ring comprises a first bonding surface and a grinding surface;
the rigid ring comprises a second bonding surface and a fixing surface;
the first bonding surface and the second bonding surface are tightly attached and fixed through a bonding agent;
12 obliquely arranged strip-shaped grooves are formed in the grinding surface at equal intervals;
the connection part of the strip-shaped groove and the upper surface of the grinding surface is not provided with a fillet.
The axial depth of the strip-shaped groove is 2.8mm, and the radial width of the strip-shaped groove is 3.1 mm.
The roughness of the grinding surface is 8 μm.
The elastic ring is made of PPS plastic.
The fixed surface is provided with 18 fixed slots at equal intervals.
The rigid ring is made of martensitic stainless steel;
the roughness of the fixing surface is 8 μm.
The thickness of the rigid ring is 13.5 mm; the thickness of the elastic ring is 4.2 mm.
The scratch-resistant retaining ring provided by the embodiment increases the polishing effect of the retaining ring on the polishing pad, more effectively removes the polishing by-products, and reduces and improves the scratch of the retaining ring on the wafer in the polishing process.
With the scratch resistant retaining ring provided by the embodiment, the mounting success rate is 95%.
Comparative example 1
This comparative example provides a retaining ring which differs from example 1 only in that: in the comparative example, the joint of the strip-shaped groove and the upper surface of the grinding surface is provided with a fillet, and the fillet is 0.2 mm.
With the scratch-resistant retaining ring provided by the embodiment, the success rate of mounting the retaining ring is 9%.
Comparative example 2
This comparative example provides a retaining ring which differs from example 1 only in that: in the comparative example, the joint of the strip-shaped groove and the upper surface of the grinding surface is provided with a fillet, and the fillet is 0.6 mm.
With the scratch-resistant retaining ring provided by the embodiment, the success rate of mounting the retaining ring is 2%.
In conclusion, the scratch-resistant retaining ring provided by the invention improves the connection part of the strip-shaped groove and the upper surface of the grinding surface (the chamfer angle is made to be 0), so that the grinding effect of the retaining ring on the grinding pad is increased, grinding byproducts are more effectively removed, and the scratch of the retaining ring on a wafer in the grinding process is reduced and improved.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A scratch resistant retaining ring, comprising a rigid ring and an elastomeric ring;
the elastic ring comprises a first bonding surface and a grinding surface;
the rigid ring comprises a second bonding surface and a fixing surface;
the first bonding surface and the second bonding surface are tightly adhered and fixed through a bonding agent;
at least three strip-shaped grooves which are obliquely arranged are arranged on the grinding surface at equal intervals;
the connection part of the strip-shaped groove and the upper surface of the grinding surface is not provided with a fillet.
2. The scratch resistant retaining ring of claim 1, wherein the axial depth of the strip-like groove is 2.3-3.5 mm.
3. A scratch-resistant retaining ring according to claim 1 or 2, characterized in that the radial width of the strip-shaped groove is 2.8-3.5 mm.
4. The retainer ring according to any of claims 1 to 3, wherein the abrasive surface has a roughness of 3 to 10 μm.
5. The scratch resistant retaining ring of any one of claims 1-4, wherein the resilient ring comprises PPS plastic or PEEK plastic.
6. Scratch-resistant retaining ring according to one of claims 1 to 5, characterized in that the retaining surface is provided with at least three retaining grooves at equal intervals.
7. The scratch resistant retaining ring of any one of claims 1-6, wherein the rigid ring comprises a martensitic stainless steel or a PEEK material.
8. The scratch-resistant retaining ring according to any one of claims 1 to 7, wherein the fixing surface has a roughness of 3 to 10 μm.
9. The scratch resistant retaining ring of any one of claims 1-8, wherein the rigid ring has a thickness of 11-15 mm.
10. The scratch resistant retaining ring of any one of claims 1-9, wherein the elastomeric ring has a thickness of 5.1-6.5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210089338.3A CN114505783A (en) | 2022-01-25 | 2022-01-25 | Scratch-resistant retaining ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210089338.3A CN114505783A (en) | 2022-01-25 | 2022-01-25 | Scratch-resistant retaining ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114505783A true CN114505783A (en) | 2022-05-17 |
Family
ID=81549542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210089338.3A Pending CN114505783A (en) | 2022-01-25 | 2022-01-25 | Scratch-resistant retaining ring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114505783A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW493487U (en) * | 2000-10-21 | 2002-07-01 | Shui-Yuan Chen | Positioning ring structure for wafer grinding |
| US20040219870A1 (en) * | 2003-04-30 | 2004-11-04 | Chen Hung Chih | Two part retaining ring |
| CN201848764U (en) * | 2010-07-16 | 2011-06-01 | 中芯国际集成电路制造(上海)有限公司 | Locating ring for chemical mechanical polishing |
| CN209425232U (en) * | 2018-12-19 | 2019-09-24 | 吴庚平 | A kind of novel retaining ring and the chemical-mechanical polishing mathing equipped with the retaining ring |
| CN111571427A (en) * | 2020-05-22 | 2020-08-25 | 宁波江丰电子材料股份有限公司 | Retaining ring |
| CN211661824U (en) * | 2019-12-18 | 2020-10-13 | 宁波江丰电子材料股份有限公司 | Retaining ring |
| CN212947226U (en) * | 2020-08-31 | 2021-04-13 | 宁波江丰电子材料股份有限公司 | Retaining ring |
| CN214322993U (en) * | 2020-11-30 | 2021-10-01 | 宁波江丰电子材料股份有限公司 | Retaining ring |
-
2022
- 2022-01-25 CN CN202210089338.3A patent/CN114505783A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW493487U (en) * | 2000-10-21 | 2002-07-01 | Shui-Yuan Chen | Positioning ring structure for wafer grinding |
| US20040219870A1 (en) * | 2003-04-30 | 2004-11-04 | Chen Hung Chih | Two part retaining ring |
| CN201848764U (en) * | 2010-07-16 | 2011-06-01 | 中芯国际集成电路制造(上海)有限公司 | Locating ring for chemical mechanical polishing |
| CN209425232U (en) * | 2018-12-19 | 2019-09-24 | 吴庚平 | A kind of novel retaining ring and the chemical-mechanical polishing mathing equipped with the retaining ring |
| CN211661824U (en) * | 2019-12-18 | 2020-10-13 | 宁波江丰电子材料股份有限公司 | Retaining ring |
| CN111571427A (en) * | 2020-05-22 | 2020-08-25 | 宁波江丰电子材料股份有限公司 | Retaining ring |
| CN212947226U (en) * | 2020-08-31 | 2021-04-13 | 宁波江丰电子材料股份有限公司 | Retaining ring |
| CN214322993U (en) * | 2020-11-30 | 2021-10-01 | 宁波江丰电子材料股份有限公司 | Retaining ring |
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