CN114498279A - Laser device and system for metal surface strengthening - Google Patents
Laser device and system for metal surface strengthening Download PDFInfo
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- CN114498279A CN114498279A CN202210358186.2A CN202210358186A CN114498279A CN 114498279 A CN114498279 A CN 114498279A CN 202210358186 A CN202210358186 A CN 202210358186A CN 114498279 A CN114498279 A CN 114498279A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0064—Anti-reflection devices, e.g. optical isolaters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0057—Temporal shaping, e.g. pulse compression, frequency chirping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0071—Beam steering, e.g. whereby a mirror outside the cavity is present to change the beam direction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/081—Construction or shape of optical resonators or components thereof comprising three or more reflectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
- H01S3/2308—Amplifier arrangements, e.g. MOPA
- H01S3/2316—Cascaded amplifiers
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Lasers (AREA)
Abstract
The invention relates to a laser device and a system for metal surface strengthening, wherein the laser device comprises a laser source, a light splitter, an amplifying component and a beam combiner which are arranged along a propagation light path, wherein the amplifying component comprises a first amplifying component and a second amplifying component; the laser source is used for emitting a first laser beam, the beam splitter is used for splitting the first laser beam into a first laser beam and a second laser beam, the first amplification assembly is used for splitting the first laser beam to obtain high laser energy, the second amplification assembly is used for splitting the second laser beam to obtain high laser energy, and the beam combiner is used for splitting the first laser beam and the second laser beam to obtain high laser energy. The invention can realize single-path high-energy laser output while effectively utilizing the internal space of the laser.
Description
Technical Field
The invention relates to the technical field of lasers, in particular to a laser device and a system for metal surface strengthening.
Background
The high-energy solid laser of flash lamp pump is a laser widely used in scientific research and industry, and the laser can output high-energy nanosecond laser pulse and is generally used in laser shock strengthening, laser plasma research, laser damage threshold research, laser annealing and other fields. The existing high-energy solid laser of flash lamp pumping realizes the generation and amplification of laser by fixedly clamping a xenon lamp and a laser crystal through a light-gathering cavity, and then carries out multi-stage amplification, thereby realizing the output of high energy. The existing high-energy solid laser of flash lamp pump has the following disadvantages: the number of structures required to amplify the laser energy is large and bulky, and these structures require a large space to be occupied by the laser.
Disclosure of Invention
The invention aims to provide a laser device and a system for metal surface strengthening, so as to realize single-path high-energy laser output while effectively utilizing the internal space of a laser.
The object of the present invention is achieved by the following technical means. The laser device comprises a laser source, a light splitter, an amplifying assembly and a beam combiner, wherein the laser source, the light splitter, the amplifying assembly and the beam combiner are arranged along a propagation light path; the laser source is used for emitting a first laser beam, the beam splitter is used for splitting the first laser beam into a first laser beam and a second laser beam, the first amplification assembly is used for splitting the first laser beam to obtain high laser energy, the second amplification assembly is used for splitting the second laser beam to obtain high laser energy, and the beam combiner is used for splitting the first laser beam and the second laser beam to obtain high laser energy.
In some embodiments, the laser device further comprises a chopper for adjusting a pulse width of the first laser beam emitted to the laser source.
In some embodiments, the laser apparatus further includes a first isolator, a pre-amplifier, and a second isolator, which are sequentially disposed, where the first isolator is configured to isolate the first laser beam emitted from the wave clipper, the pre-amplifier is configured to pre-amplify the first laser beam isolated by the first isolator, and the second isolator is configured to isolate the first laser beam pre-amplified by the pre-amplifier.
In some embodiments, the beam splitter is configured to split the first laser beam isolated via the second isolator into a first laser split and a second laser split.
In some embodiments, the first amplification assembly includes a plurality of amplifiers arranged sequentially along the direction of propagation of the laser beam and having amplification levels that increase in stages.
In some embodiments, the first amplification assembly further comprises a plurality of isolators for isolating the laser beams.
In some embodiments, the laser apparatus further comprises a beam shaper for shaping the second laser beam and outputting the shaped second laser beam.
In some embodiments, the first isolator and the second isolator include a first analyzer, a half-wave plate, a faraday rotator, and a second analyzer, which are sequentially disposed along a propagation direction of the laser beam.
In some embodiments, the laser source comprises a resonant cavity consisting of a total reflection mirror and a graded reflection lens arranged in tandem, wherein the graded reflection lens serves as an output mirror.
The invention also provides a system for metal surface strengthening, which comprises the laser device.
The beneficial effects of the invention at least comprise:
1. the laser beam emitted by the laser source is firstly split into two paths of beam splitting lasers, and then the two paths of beam splitting lasers are respectively amplified, and then the two paths of amplified beam splitting lasers are combined, so that the output of a single-path high-energy laser is realized, the internal space of the laser is effectively utilized, the cost of the laser is reduced, and the final laser spot distribution effect can be compensated in a certain range.
2. By arranging the wave clipper behind the laser source, the pulse width of the first laser beam emitted by the laser source can be adjusted.
3. Through setting up first isolator, can prevent that first laser beam from being reflected back to the resonant cavity of laser source, can effectively reduce the damage that causes resonant cavity and clipper, through setting up the second isolator, can prevent that first laser beam from being reflected back to the pre-amplifier, can effectively reduce the damage that causes the pre-amplifier.
4. The resonant cavity is composed of the total reflection mirrors and the gradual change reflection lens which are arranged in the front and back, wherein the gradual change reflection lens is used as an output mirror, so that the formed resonant cavity has good mode distinguishing capability and disturbance resistance, and a laser beam can be output with great mode volume and high efficiency.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understandable, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic structural diagram of a laser device according to an embodiment of the present invention.
Detailed Description
To further illustrate the technical means of the present invention, the following detailed description of the laser device and the system for metal surface strengthening according to the present invention is provided with reference to the accompanying drawings and preferred embodiments.
As shown in fig. 1, the laser apparatus according to the present invention includes a laser source 1, a beam splitter 2, an amplifying assembly 3, and a beam combiner 4, which are disposed along a propagation path of a laser beam, and the amplifying assembly 3 includes a first amplifying assembly 31 and a second amplifying assembly 32. The laser source 1 is configured to emit a first laser beam 11, the beam splitter 2 is configured to split the first laser beam 11 into a first laser beam splitter 111 and a second laser beam splitter 112, the first amplification component 31 is configured to split the first laser beam 111 to obtain high laser energy, the second amplification component 32 is configured to split the second laser beam 112 to obtain high laser energy, and the beam combiner 4 is configured to combine the first laser beam splitter 111 and the second laser beam splitter 112, which obtain high laser energy, into a second laser beam 41.
According to the invention, the laser beam emitted by the laser source is firstly split into two paths of split lasers, and then the two paths of split lasers are respectively amplified, and then the two paths of amplified split lasers are combined, so that the output of a single-path high-energy (40-50J) laser is realized, thus the internal space of the laser is effectively utilized, the cost of the laser is reduced, and the final laser spot distribution effect can be compensated within a certain range.
The laser source 1 comprises a resonant cavity, a condensing cavity, a xenon lamp and a laser crystal, wherein the resonant cavity is composed of a total reflection mirror and a gradual change reflection lens which are arranged in front and back, the gradual change reflection lens is used as an output mirror, and the formed resonant cavity has good mode distinguishing capacity and disturbance resistance, so that a laser beam can be output with great mode volume and high efficiency. The light-gathering cavity is a ceramic cavity body and is made of sintered ceramic materials, and the surface of the inner side wall of the cavity body is provided with a special glaze layer. The cavity of the light-gathering cavity is soaked in cooling water and is used for wrapping the xenon lamp and the laser crystal to form a closed pumping light reflection space, pumping light emitted by the xenon lamp is reflected to the laser crystal, and the laser crystal is irradiated to generate laser gain. The xenon lamp is a cylindrical glass tube, xenon is filled in the xenon lamp, and electric energy can be converted into light energy. The laser crystal absorbs the light energy which is radiated by a xenon lamp and takes 810nm as a main spectrum to generate stimulated radiation and emit laser; the special doped glass tube is wrapped around the laser crystal and can absorb ultraviolet rays radiated by a xenon lamp, and the electro-optic conversion efficiency is improved. As shown in fig. 1, in one or more embodiments, the laser apparatus of the present invention further includes a wave clipper 5, the wave clipper 5 may be disposed behind the laser source 1 and used for adjusting a pulse width of the first laser beam 11 emitted from the laser source 1, and the wave clipper 5 realizes the adjustment of the pulse width through a high-speed wave-clipping circuit board and an optical device. In particular, the chopper 5 may adjust the pulse width of the first laser beam within a range of 10-30 ns. The clipper 5 can control the isolation ratio by debugging so as to realize better clipping effect.
As shown in fig. 1, in one or more embodiments, the laser apparatus of the present invention further includes a first isolator 6, a pre-amplifier 7, and a second isolator 8, which are sequentially disposed along a propagation path of the laser beam, where the first isolator 6 is configured to isolate the first laser beam 11 emitted from the chopper 5, so as to prevent the first laser beam 11 from being reflected back to the resonant cavity of the laser source 1, and damage to the resonant cavity and the chopper 5 can be effectively reduced. The pre-amplifier 7 is used for pre-amplifying the first laser beam 11 isolated by the first isolator 6, and the pre-amplifier 7 can enable the first laser beam 11 to obtain certain energy. A laser crystal with the diameter larger than 9mm is arranged in the preamp 7. The second isolator 8 is used for isolating the first laser beam 11 pre-discharged by the pre-discharger 7, so that the first laser beam 11 is prevented from being reflected back to the pre-discharger 7, and damage to the pre-discharger 7 can be effectively reduced.
As shown in fig. 1, the beam splitter 2 is configured to split the first laser beam 11 isolated by the second isolator 8 into a first laser beam splitter 111 and a second laser beam splitter 112, where the first laser beam splitter 111 and the second laser beam splitter 112 may have the same energy or different energies. The beam splitter 2 may be a beam splitter or a polarizing plate.
In one or more embodiments, the first amplifying assembly 31 is used for making the first laser beam splitter 111 obtain high laser energy, and includes a plurality of amplifiers with amplification levels increasing step by step, which are sequentially arranged along the propagation optical path of the laser beam, and illustratively, the first amplifying assembly 31 includes a first-stage amplifier 311, a second-stage amplifier 312, a third-stage amplifier 313, and a fourth-stage amplifier 314, which are sequentially arranged along the propagation direction of the laser beam.
There may be a plurality of the first-stage amplifier 311, the second-stage amplifier 312, the third-stage amplifier 313, and the fourth-stage amplifier 314, and in a preferred embodiment, there may be 4 of the first-stage amplifier 311, the second-stage amplifier 312, the third-stage amplifier 313, and the fourth-stage amplifier 314. The first-stage amplifier 311 and the second-stage amplifier 312 both use laser crystals with the same diameter larger than 16mm, and therefore the first-stage amplifier 311 and the second-stage amplifier 312 can make the first laser beam splitter 111 obtain the same energy. The three-stage amplifier 313 and the four-stage amplifier 314 both use laser crystals having the same diameter and larger than 24mm, and therefore the three-stage amplifier 313 and the four-stage amplifier 314 can make the first laser beam splitter 111 obtain the same energy.
In one or more embodiments, first amplification assembly 31 further includes a plurality of isolators for isolating first laser beam splitter 111. Illustratively, the first amplifying assembly 31 further includes a third isolator 315 and a fourth isolator 316, the third isolator 315 is disposed between the second-stage amplifier 312 and the third-stage amplifier 313, and is used for isolating the first laser beam splitter 111 amplified by the second-stage amplifier 312, so as to prevent the first laser beam splitter 111 from being reflected back to the second-stage amplifier 312, and thus damage to the second-stage amplifier 312 can be effectively reduced. The fourth isolator 316 is disposed behind the four-stage amplifier 314 and is configured to isolate the first laser beam splitter 111 amplified by the four-stage amplifier 314, so as to prevent the first laser beam splitter 111 from being reflected back to the four-stage amplifier 314, and thus damage to the four-stage amplifier 314 can be effectively reduced. The first laser beam splitting 111 passing through the first amplifying assembly 31 can obtain high laser energy and maintain the quality of laser light while reducing damage and damages to optical elements.
As shown in fig. 1, in one or more embodiments, the second amplifying assembly 32 is used for making the second laser beam splitter 112 obtain high laser energy, and includes a plurality of amplifiers with amplification levels increasing step by step, which are sequentially arranged along the propagation direction of the laser beam, and exemplarily, the second amplifying assembly 32 includes a first-stage amplifier 321, a second-stage amplifier 322, a third-stage amplifier 323, and a fourth-stage amplifier 324 which are sequentially arranged along the propagation direction of the laser beam.
The first-stage amplifier 321, the second-stage amplifier 322, the third-stage amplifier 323, and the fourth-stage amplifier 324 may be provided in plural, and in a preferred embodiment, the first-stage amplifier 321, the second-stage amplifier 322, the third-stage amplifier 323, and the fourth-stage amplifier 324 may be provided in 4. The first-stage amplifier 321 and the second-stage amplifier 322 both use laser crystals with the same diameter larger than 16mm, and therefore the first-stage amplifier 321 and the second-stage amplifier 322 can make the second laser beam splitter 112 obtain the same energy. The three-stage amplifier 323 and the four-stage amplifier 324 use the same crystal diameter, which is larger than 24mm, so that the three-stage amplifier 323 and the four-stage amplifier 324 can make the second laser beam splitter 112 obtain the same energy.
In one or more embodiments, the second amplification assembly 32 further includes a plurality of isolators for isolating the second laser beam splitter 112. Illustratively, the second amplifying assembly 32 further includes a fifth isolator 325 and a sixth isolator 326, the fifth isolator 325 is disposed between the second amplifier 322 and the third amplifier 323 for isolating the second laser beam splitter 112 amplified by the second amplifier 322, so as to prevent the second laser beam splitter 112 from being reflected back to the second amplifier 322, which can effectively reduce the damage to the second amplifier 322. The sixth isolator 326 is disposed behind the fourth-stage amplifier 324, and is configured to isolate the second laser beam splitter 112 amplified by the fourth-stage amplifier 324, so as to prevent the second laser beam splitter 112 from being reflected back to the fourth-stage amplifier 324, and thus, damage to the fourth-stage amplifier 324 can be effectively reduced. The second laser beam splitter 112 passing through the second amplifying assembly 32 can obtain high laser energy and maintain the quality of the laser, and simultaneously reduce damage to optical elements.
In one or more embodiments, as shown in fig. 1, the laser apparatus of the present invention further includes a beam shaper 9, and the beam shaper 9 is configured to shape the second laser beam 41 to meet the requirements of various applications and output the shaped second laser beam 41.
It should be noted that the first amplification element 31 and the second amplification element 32 need to control the input spot size, the output spot size, and the divergence angle of each amplifier to achieve a better amplification effect. The isolators used in the invention can achieve better isolation effect by adjusting and controlling the isolation ratio, and the isolators at different positions need to be selected to be proper in size according to the diameter of the laser crystal. The isolator may include a first analyzer, a half-wave plate, a faraday rotator, and a second analyzer sequentially arranged along a propagation direction of the laser beam, wherein the first analyzer and the second analyzer are configured to detect whether the laser beam is polarized light, the half-wave plate is configured to change a polarization state of the laser beam, and the faraday rotator is configured to rotate the polarization state of the laser beam.
The invention also provides a system for metal surface strengthening, wherein the laser device is used for carrying out impact strengthening on the surface of metal.
The use of words such as "including," comprising, "" having, "and the like in connection with the present invention is an open-ended term that refers to and is used interchangeably with" including, but not limited to. The words "or" and "as used herein mean, and are used interchangeably with, the word" and/or, "unless the context clearly dictates otherwise.
The previous description of the disclosed aspects is provided to enable any person skilled in the art to practice the present invention. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the invention. Thus, the present invention is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A laser device is characterized by comprising a laser source, a beam splitter, an amplifying assembly and a beam combiner, wherein the laser source, the beam splitter, the amplifying assembly and the beam combiner are arranged along a propagation light path;
the laser source is used for emitting a first laser beam, the beam splitter is used for splitting the first laser beam into a first laser beam and a second laser beam, the first amplification assembly is used for splitting the first laser beam to obtain high laser energy, the second amplification assembly is used for splitting the second laser beam to obtain high laser energy, and the beam combiner is used for splitting the first laser beam and the second laser beam to obtain high laser energy.
2. The laser device of claim 1, further comprising a chopper for modulating a pulse width of the first laser beam exiting the laser source.
3. The laser device according to claim 2, further comprising a first isolator, a pre-amplifier, and a second isolator, which are sequentially disposed, wherein the first isolator is configured to isolate the first laser beam emitted from the wave clipper, the pre-amplifier is configured to pre-discharge the first laser beam isolated by the first isolator, and the second isolator is configured to isolate the first laser beam pre-discharged by the pre-amplifier.
4. The laser device according to claim 3, wherein the beam splitter is configured to split the first laser beam, which is isolated by the second isolator, into a first laser beam split and a second laser beam split.
5. The laser device of claim 1, wherein the first amplification assembly comprises a plurality of amplifiers arranged sequentially along the direction of propagation of the laser beam and having amplification levels that increase in steps.
6. The laser device of claim 5, wherein the first amplification assembly further comprises a plurality of isolators for isolating the laser beams.
7. The laser apparatus of claim 1, further comprising a beam shaper for shaping the second laser beam and outputting the shaped second laser beam.
8. The laser device according to claim 3, wherein the first isolator and the second isolator comprise a first analyzer, a half-wave plate, a Faraday rotator, and a second analyzer, which are sequentially arranged along a propagation direction of the laser beam.
9. The laser device according to claim 1, wherein the laser source comprises a resonant cavity consisting of a total reflection mirror and a graded reflection lens arranged in tandem, wherein the graded reflection lens serves as an output mirror.
10. A system for metal surface strengthening, characterized in that it comprises a laser device according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210358186.2A CN114498279A (en) | 2022-04-07 | 2022-04-07 | Laser device and system for metal surface strengthening |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210358186.2A CN114498279A (en) | 2022-04-07 | 2022-04-07 | Laser device and system for metal surface strengthening |
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| CN210024108U (en) * | 2019-06-03 | 2020-02-07 | 常州英诺激光科技有限公司 | Laser processing system |
| US20200300993A1 (en) * | 2019-03-18 | 2020-09-24 | Aeva, Inc. | Lidar apparatus with an optical amplifier in the return path |
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2022
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Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101854030A (en) * | 2010-05-04 | 2010-10-06 | 长春德信光电技术有限公司 | Laser light source device of high-power semiconductor |
| CN102244362A (en) * | 2011-06-14 | 2011-11-16 | 西北大学 | Three-level multi-channel principal oscillation-power amplification coherent compound myriawatt-level optical fiber laser |
| CN103033944A (en) * | 2012-12-04 | 2013-04-10 | 广东汉唐量子光电科技有限公司 | Polarization beam-combination device for pulsed laser |
| CN105428975A (en) * | 2015-12-23 | 2016-03-23 | 上海朗研光电科技有限公司 | High-power femtosecond fiber laser device |
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