CN114496866A - Chip constant temperature carries a set mechanism - Google Patents
Chip constant temperature carries a set mechanism Download PDFInfo
- Publication number
- CN114496866A CN114496866A CN202210068038.7A CN202210068038A CN114496866A CN 114496866 A CN114496866 A CN 114496866A CN 202210068038 A CN202210068038 A CN 202210068038A CN 114496866 A CN114496866 A CN 114496866A
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- CN
- China
- Prior art keywords
- plate
- supporting
- seat
- heating
- positioning side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a chip constant temperature disc carrying mechanism, which comprises: the invention relates to a material tray receiving seat, a positioning side plate, a heating plate bottom plate and a servo motor, wherein two sides of the top of the material tray receiving seat are provided with a supporting seat, a transmission shaft is arranged between the centers of the supporting seats, two ends of the transmission shaft are positioned outside the supporting seats, a top supporting plate is arranged at the top of the supporting seats, the positioning side plate is arranged outside the supporting seats, a heating bottom plate is arranged between the positioning side plates and above the top supporting plate, heating rods are arranged at two sides inside the heating bottom plate, and a temperature sensing rod is arranged at the center inside the heating bottom plate. So that the material tray is in a constant temperature state.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a chip constant-temperature disk loading mechanism.
Background
After the chips are processed and manufactured, the chips need to be tested and classified one by one so as to intensively put the good chips in order and place the bad chips in a classified manner according to the types of the test problems. The existing sorting machine generally comprises a feeding device, a transferring device, a testing device, a sorting and discharging device and the like. The transfer device is responsible for conveying the chips to be tested between the feeding device and the testing device and also responsible for conveying the tested chips between the testing device and the sorting and discharging device. The chip is generally placed on a carrier plate for transportation.
The existing loading disc of the sorting testing mechanism has no constant temperature function, a test pen-shape meter touches a chip placed on a copper plate (the copper plate is connected with one polarity, and the pen-shape meter is connected with one polarity) in the testing process to test various electrical properties and curve data of the test pen-shape meter, the pen-shape meter can generate a sparking phenomenon in the high-voltage testing process, the testing result can be mistaken, the correctness of the testing result can not be ensured, and the chip can be damaged in serious cases.
Disclosure of Invention
The invention aims to provide a chip constant-temperature disk loading mechanism to solve the problems that the loading disk of the existing sorting testing mechanism in the background art has no constant-temperature function, so that the testing result is wrong and the correctness of the testing result cannot be ensured.
In order to achieve the purpose, the invention provides the following technical scheme: chip constant temperature carries a set mechanism includes: charging tray receiving seat, location curb plate, hot plate bottom plate and servo motor, charging tray receiving seat top both sides are equipped with the supporting seat, be equipped with the transmission shaft between the supporting seat central authorities, the transmission shaft both ends are located the supporting seat outside and are equipped with the cam, the supporting seat top is equipped with the top backup pad, the supporting seat outside is equipped with the location curb plate, it is equipped with the heating bottom plate to lie in the top backup pad top between the curb plate of location, the inside both sides of heating bottom plate are equipped with the heating stick, the inside central authorities of heating bottom plate are equipped with the temperature sensing stick, heating bottom plate top surface central authorities are equipped with the conducting strip, it is equipped with the charging tray to lie in the conducting strip top between the curb plate top of location, charging tray receiving seat top one side is equipped with servo motor, be equipped with synchronous drive belt wheelset between servo motor power output shaft and the transmission shaft.
Preferably, the top of the tray receiving seat is provided with a motor mounting seat at the mounting part of the servo motor.
Preferably, the connecting parts of the two sides of the outer wall of the supporting seat and the positioning side plates are provided with slide rails, one side of the outer wall of the lower half part of the supporting seat is provided with a reset screw, and the middle part of the supporting seat, which is positioned at the mounting part of the transmission shaft, is provided with a bearing seat.
Preferably, the sliding blocks are arranged at the connecting parts of the two sides of the outer wall of the positioning side plate and the supporting seat, and the reset spring is arranged on one side of the bottom of the positioning side plate.
Preferably, positioning grooves are formed in two sides of the top of each positioning side plate.
Preferably, a supporting plate is arranged at the center of the bottom of the positioning side plate and above the cam.
Preferably, the heating temperature of the heating rod is 30-60 ℃.
Preferably, the heat conducting sheet is made of brass.
Preferably, two ends of the sliding rail are provided with limit screws.
Preferably, the lower half part of the support seat is provided with threaded holes in the reset screw mounting position array.
Compared with the prior art, the invention has the beneficial effects that:
the invention realizes that when the chip constant temperature disc carrying mechanism is used, a material disc is conveyed to the upper part of a heat conducting sheet through the guide of a positioning side plate, a transmission shaft is driven to rotate through a servo motor so as to drive the cam to rotate, the positioning side plate is pulled through the matching of a return spring and a return screw so as to lower the positioning side plate and drive the material disc to lower, the bottom of the material disc is contacted with the heat conducting sheet, the heat conducting sheet is heated through the heating rod, the material disc is in a constant temperature state through the temperature control of a temperature sensing rod, after the test is finished, the transmission shaft is driven to rotate reversely through the servo motor so as to drive the positioning side plate to ascend through the cam, the material disc is ascended, the material disc can conveniently enter the next test station, the whole disc carrying mechanism ensures the constant temperature state of the material disc in the test process through the heating of the heating rod and the ascending and descending of the positioning side plate, the phenomenon of striking sparks appears when preventing to test, guarantees that the test is accurate, prevents that the chip from striking sparks the damage.
Drawings
FIG. 1 is an overall exploded view of the present invention;
FIG. 2 is an isometric view of the present invention in its entirety;
FIG. 3 is an overall front view of the present invention;
fig. 4 is an overall right side view of the invention.
In the figure: 1-a tray receiving seat; 101-a motor mount; 2-a support seat; 201-a slide rail; 202-a reduction screw; 203-a bearing seat; 3, driving a shaft; 4-a cam; 5, positioning a side plate; 501-a slide block; 502-a return spring; 6-top support plate; 7-heating the soleplate; 8-a thermally conductive sheet; 9-heating rod; 10-a temperature sensing bar; 11-a material tray; 12-a servo motor; 13-synchronous pulley set.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: chip constant temperature carries a set mechanism includes: a material tray receiving seat 1 and a positioning side plate 5, heating plate bottom plate 7 and servo motor 12, there is supporting seat 2 in 1 top both sides of charging tray receiving seat through the screw connection, be connected with transmission shaft 3 through the bearing between 2 central authorities of supporting seat, 3 both ends of transmission shaft are located 2 outside joints of supporting seat and have cam 4, there is top support plate 6 at 2 tops of supporting seat through the screw connection, 2 outside sliding connection of supporting seat has location curb plate 5, it has heating bottom plate 7 to lie in 6 tops of top support plate between the curb plate 5 of location through the screw connection, 7 inside both sides of heating bottom plate are pegged graft and are had heating rod 9, 7 inside central authorities of heating bottom plate are pegged graft and are had temperature sensing rod 10, 7 top surface central joints of heating bottom plate have conducting strip 8, it has charging tray 11 to lie in 8 tops of conducting strip between 2 tops of location curb plate, there is servo motor 12 in 1 top one side of charging tray receiving seat through the screw connection, the joint has synchronous driving belt wheelset 13 between servo motor 12 power output shaft and the transmission shaft 3.
The top of the tray receiving seat 1 is positioned at the mounting part of the servo motor 12 and is connected with a motor mounting seat 101 through a screw, the two sides of the outer wall of the supporting seat 2 are connected with the connecting part of the positioning side plate 5 through a screw and are connected with a sliding rail 201, one side of the outer wall of the lower half part of the supporting seat 2 is in threaded connection with a reset screw 202, and the middle part of the supporting seat 2 is positioned at the mounting part of the transmission shaft 3 and is connected with a bearing seat 203 through a screw.
The position is connected with supporting seat 2 to 5 outer wall both sides of location curb plate has slider 501 through screw connection for direction when 5 lift of location curb plate, 5 bottom one side joints of location curb plate have reset spring 502, an automatic re-setting for location curb plate 5, the constant head tank has been seted up to 5 top both sides of location curb plate, the location of the charging tray 11 of being convenient for, 5 bottom central authorities of location curb plate are located cam 4 and put and have the backup pad through screw connection, be convenient for contact with cam 4, the change of the vulnerable part of being convenient for is restoreed.
The heating temperature of the heating rod 9 is 30-60 degrees centigrade, for example, 45 degrees centigrade, the heat conducting fin 8 is made of brass, heat conduction is facilitated, two ends of the sliding rail 201 are in threaded connection with limiting screws for preventing the sliding block 501 from being separated from the sliding rail 201, the lower half portion of the supporting seat 2 is located at the mounting position of the reset screw 202 and is provided with threaded holes for adjusting the position of the reset screw 202, and therefore the reset spring 502 is suitable for reset springs 502 with different sizes.
The working principle is as follows: when the chip constant-temperature tray carrying mechanism is used, the tray 11 is conveyed to the position above the heat conducting sheet 8 through the guiding of the positioning side plate 5, the servo motor 12 drives the transmission shaft 3 to rotate, so as to drive the cam 4 to rotate, the positioning side plate 5 is pulled through the matching of the reset spring 502 and the reset screw 202, so as to lower the positioning side plate 5, the tray 11 is driven to lower, so that the bottom of the tray 11 is contacted with the heat conducting sheet 8, the heat conducting sheet 8 is heated through the heating rod 9, the tray 11 is in a constant-temperature state through the temperature control of the temperature sensing rod 10, after the test is finished, the transmission shaft 3 is driven to reversely rotate through the servo motor 12, so that the cam 4 drives the positioning side plate 5 to raise, the tray 11 is raised, the tray 11 can conveniently enter the next test station, the whole tray carrying mechanism ensures the constant-temperature state of the tray 11 in the test process through the heating of the heating rod 9 and the lifting of the positioning side plate 5, the phenomenon of striking sparks appears when preventing to test, guarantees that the test is accurate, prevents that the chip from striking sparks the damage.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. Chip constant temperature carries a set mechanism includes: charging tray receiving seat (1), location curb plate (5), hot plate bottom plate (7) and servo motor (12), its characterized in that: the material tray receiving seat is characterized in that supporting seats (2) are arranged on two sides of the top of the material tray receiving seat (1), a transmission shaft (3) is arranged between the centers of the supporting seats (2), cams (4) are arranged at two ends of the transmission shaft (3) and positioned on the outer sides of the supporting seats (2), a top supporting plate (6) is arranged at the top of the supporting seats (2), positioning side plates (5) are arranged outside the supporting seats (2), a heating bottom plate (7) is arranged between the positioning side plates (5) and positioned above the top supporting plate (6), heating rods (9) are arranged on two sides inside the heating bottom plate (7), a temperature sensing rod (10) is arranged in the center inside the heating bottom plate (7), heat conducting fins (8) are arranged in the center of the top surface of the heating bottom plate (7), a material tray (11) is arranged above the heat conducting fins (8) between the tops of the positioning side plates (5), and a servo motor (12) is arranged on one side of the top of the material tray receiving seat (1), a synchronous transmission belt wheel set (13) is arranged between the power output shaft of the servo motor (12) and the transmission shaft (3).
2. The chip constant-temperature disc carrying mechanism according to claim 1, wherein: the top of the tray receiving seat (1) is provided with a motor mounting seat (101) at the mounting part of the servo motor (12).
3. The chip constant-temperature disc carrying mechanism according to claim 1, wherein: the supporting seat is characterized in that sliding rails (201) are arranged at connecting positions of two sides of the outer wall of the supporting seat (2) and the positioning side plates (5), reset screws (202) are arranged on one side of the outer wall of the lower half portion of the supporting seat (2), and a bearing seat (203) is arranged at a mounting position, located on the transmission shaft (3), in the middle of the supporting seat (2).
4. The chip constant-temperature disc carrying mechanism according to claim 1, wherein: the sliding block (501) is arranged at the connecting part of the two sides of the outer wall of the positioning side plate (5) and the supporting seat (2), and the reset spring (502) is arranged on one side of the bottom of the positioning side plate (5).
5. The chip constant-temperature disc carrying mechanism according to claim 1, wherein: positioning grooves are formed in two sides of the top of the positioning side plate (5).
6. The chip constant-temperature disc carrying mechanism according to claim 1, wherein: and a supporting plate is arranged at the center of the bottom of the positioning side plate (5) and above the cam (4).
7. The chip constant-temperature disc carrying mechanism according to claim 1, wherein: the heating temperature of the heating rod (9) is 30-60 ℃.
8. The chip constant-temperature disc carrying mechanism according to claim 1, wherein: the heat conducting fins (8) are made of brass.
9. The chip constant-temperature disc carrying mechanism according to claim 3, wherein: and two ends of the sliding rail (201) are provided with limit screws.
10. The chip constant-temperature disc carrying mechanism according to claim 3, wherein: the lower half part of the supporting seat (2) is arranged at the mounting part of the reset screw (202) and is provided with threaded holes in an array mode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202210068038.7A CN114496866B (en) | 2022-01-20 | 2022-01-20 | Chip constant temperature carries a set mechanism |
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CN202210068038.7A CN114496866B (en) | 2022-01-20 | 2022-01-20 | Chip constant temperature carries a set mechanism |
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CN114496866A true CN114496866A (en) | 2022-05-13 |
CN114496866B CN114496866B (en) | 2023-03-28 |
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Citations (11)
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KR20050013686A (en) * | 2003-07-29 | 2005-02-05 | 삼성전자주식회사 | chemical vapor deposition fabricating equipment for manufacturing of semiconductor device |
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CN205518463U (en) * | 2016-03-16 | 2016-08-31 | 深圳市摩码科技有限公司 | A constant temperature charging tray device for coating |
KR20180069991A (en) * | 2016-12-15 | 2018-06-26 | 에이피티씨 주식회사 | Separable wafer susceptor and semiconductor process chamber apparatus including the same |
CN111751713A (en) * | 2020-08-12 | 2020-10-09 | 深圳市诺泰芯装备有限公司 | Chip high-temperature testing device and method |
CN111948513A (en) * | 2020-07-24 | 2020-11-17 | 武汉锐科光纤激光技术股份有限公司 | Chip temperature control equipment |
CN212364512U (en) * | 2020-08-12 | 2021-01-15 | 深圳市诺泰芯装备有限公司 | Chip high temperature testing device |
CN213583721U (en) * | 2020-11-06 | 2021-06-29 | 深圳市诺泰芯装备有限公司 | Floating disc carrying mechanism for temperature sensing chip |
CN213780279U (en) * | 2020-11-06 | 2021-07-23 | 深圳市诺泰芯装备有限公司 | Carry interior chip testing arrangement of dish |
CN113658896A (en) * | 2021-08-19 | 2021-11-16 | 上海稷以科技有限公司 | Heating carrier disc for wafer processing |
CN215464211U (en) * | 2021-08-02 | 2022-01-11 | 厦门传茗生物科技有限公司 | Homogenizer with constant temperature device |
-
2022
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Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20050013686A (en) * | 2003-07-29 | 2005-02-05 | 삼성전자주식회사 | chemical vapor deposition fabricating equipment for manufacturing of semiconductor device |
US20060113290A1 (en) * | 2004-12-01 | 2006-06-01 | Shareef Iqbal A | Heated chuck for laser thermal processing |
CN205518463U (en) * | 2016-03-16 | 2016-08-31 | 深圳市摩码科技有限公司 | A constant temperature charging tray device for coating |
KR20180069991A (en) * | 2016-12-15 | 2018-06-26 | 에이피티씨 주식회사 | Separable wafer susceptor and semiconductor process chamber apparatus including the same |
CN111948513A (en) * | 2020-07-24 | 2020-11-17 | 武汉锐科光纤激光技术股份有限公司 | Chip temperature control equipment |
CN111751713A (en) * | 2020-08-12 | 2020-10-09 | 深圳市诺泰芯装备有限公司 | Chip high-temperature testing device and method |
CN212364512U (en) * | 2020-08-12 | 2021-01-15 | 深圳市诺泰芯装备有限公司 | Chip high temperature testing device |
CN213583721U (en) * | 2020-11-06 | 2021-06-29 | 深圳市诺泰芯装备有限公司 | Floating disc carrying mechanism for temperature sensing chip |
CN213780279U (en) * | 2020-11-06 | 2021-07-23 | 深圳市诺泰芯装备有限公司 | Carry interior chip testing arrangement of dish |
CN215464211U (en) * | 2021-08-02 | 2022-01-11 | 厦门传茗生物科技有限公司 | Homogenizer with constant temperature device |
CN113658896A (en) * | 2021-08-19 | 2021-11-16 | 上海稷以科技有限公司 | Heating carrier disc for wafer processing |
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CN114496866B (en) | 2023-03-28 |
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