CN114496863B - Wafer picking and placing position determining method and related equipment - Google Patents
Wafer picking and placing position determining method and related equipment Download PDFInfo
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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Abstract
The invention provides a method for determining a wafer picking and placing position and related equipment, wherein the method comprises the following steps: determining the lowest wafer taking position of the current wafer box according to the difference between the reference position of the wafer box bracket and the first position; acquiring a second position difference between the wafer taking positions of two adjacent clamping grooves of the current wafer box; acquiring a third position difference between a wafer taking position and a wafer placing position of the same clamping groove of the current wafer box; and determining the wafer taking position and the wafer placing position of each clamping groove of the current wafer box according to the lowest wafer taking position, the second position difference and the third position difference of the current wafer box. The method for determining the wafer picking and placing position can greatly reduce the workload of a manual teaching manipulator, reduce the manual participation degree of equipment debugging and the requirement on manual proficiency, greatly reduce the time cost and the labor cost of the teaching manipulator, and further reduce the difficulty and the cost of wafer batch production.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a method and a device for determining a wafer taking and placing position, a storage medium, electronic equipment and wafer taking and placing equipment.
Background
At present, in a photoresist removing device, in order to implement a photoresist removing process for a wafer, a manipulator is required to take the wafer out of a wafer box and then put the wafer into a process chamber for processing.
However, since the wafers in the wafer cassette are vertically layered in height, the robot is required to move to different heights to pick the wafers, and when there are many wafer picking and placing positions in the wafer cassette, all the positions need to be taught manually, which results in a large time and labor cost for teaching the robot, and further reduces the production cost of the wafers.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art or the related art.
To this end, the first aspect of the invention provides a wafer pick-and-place position determining method.
A second aspect of the present invention provides a wafer pick-and-place position determining apparatus.
A third aspect of the invention provides a storage medium.
A fourth aspect of the invention provides an electronic device.
A fifth aspect of the present invention provides a wafer pick-and-place apparatus.
In view of this, a method for determining a wafer pick-and-place position is provided according to a first aspect of an embodiment of the present application, including:
determining the lowest wafer taking position of the current wafer box according to the reference position of the wafer box bracket and a first position difference, wherein the first position difference is an actually measured distance between the reference position and the lowest wafer taking position of the initial wafer box;
acquiring a second position difference between the wafer taking positions of two adjacent clamping grooves of the current wafer box;
acquiring a third position difference between a wafer taking position and a wafer placing position of the same clamping groove of the current wafer box;
and determining the wafer taking position and the wafer placing position of each clamping groove of the current wafer box according to the lowest wafer taking position, the second position difference and the third position difference of the current wafer box.
In one possible embodiment, the method for determining the wafer pick-and-place position further includes:
controlling the manipulator to move along the height direction of the current wafer box so that a plurality of mechanical arms of the manipulator sequentially contact and press the pressure sensor of the wafer box bracket;
recording a first height position corresponding to the mechanical arm under the condition that each mechanical arm is pressed to the pressure sensor;
an average of the plurality of first height positions is determined as a reference position.
In one possible embodiment, the method for determining the wafer pick-and-place position further includes:
adjusting the manipulator along the height direction of the initial wafer box so that the manipulator is positioned at the lowest wafer taking position of the initial wafer box;
recording a second height position of the manipulator under the condition that the manipulator is located at the lowest wafer taking position of the initial wafer box;
a first position difference is determined based on the second height position and the reference position.
In one possible embodiment, the first elevation position and the second elevation position are both determined based on Z-axis position information of the manipulator.
In a possible embodiment, the step of determining the wafer picking position and the wafer placing position of each card slot of the current wafer cassette according to the lowest wafer picking position, the second position difference and the third position difference of the current wafer cassette includes:
determining the number of the card slots below the current card slot;
calculating the product of the number of the card slots and the second position difference;
and determining the sum of the product and the lowest wafer taking position of the current wafer box as the wafer taking position of the current card slot.
In a possible embodiment, the step of determining the wafer picking position and the wafer placing position of each card slot of the current wafer cassette according to the lowest wafer picking position, the second position difference and the third position difference of the current wafer cassette further includes:
and determining the sum of the product and the difference between the lowest wafer taking position and the third position of the current wafer box as the wafer placing position of the current clamping groove.
According to a second aspect of the embodiments of the present application, a device for determining a wafer pick-and-place position is provided, including:
the first determining unit is used for determining the lowest wafer taking position of the current wafer box according to the reference position of the wafer box support and a first position difference, and the first position difference is an actually measured distance between the reference position and the lowest wafer taking position of the initial wafer box;
the first acquisition unit is used for acquiring a second position difference between the wafer taking positions of two adjacent clamping grooves of the current wafer box;
the second obtaining unit is used for obtaining a third position difference between the wafer taking position and the wafer placing position of the same clamping groove of the current wafer box;
and the second determining unit is used for determining the wafer taking position and the wafer placing position of each clamping groove of the current wafer box according to the lowest wafer taking position, the second position difference and the third position difference of the current wafer box.
According to a third aspect of embodiments of the present application, a storage medium is provided, the storage medium including a stored program, wherein when the program runs, an apparatus on which the storage medium is controlled performs the method as set forth in any one of the above first aspects.
According to a fourth aspect of embodiments of the present application, an electronic device is provided, where the electronic device includes at least one processor and at least one memory connected to the processor, where the processor is configured to call program instructions in the memory to perform the method as set forth in any one of the first aspects.
According to a fifth aspect of the embodiments of the present application, there is provided a wafer picking and placing apparatus, including:
the electronic device as set forth in the fourth aspect above.
Compared with the prior art, the invention at least comprises the following beneficial effects: the invention provides a method for determining a wafer taking and placing position, which comprises the following steps: determining the lowest wafer taking position of the current wafer box according to the reference position of the wafer box bracket and the first position difference, wherein the first position difference is the actual measurement distance between the reference position and the lowest wafer taking position of the initial wafer box; acquiring a second position difference between the wafer taking positions of two adjacent clamping grooves of the current wafer box; acquiring a third position difference between a wafer taking position and a wafer placing position of the same clamping groove of the current wafer box; and determining the wafer taking position and the wafer placing position of each clamping groove of the current wafer box according to the lowest wafer taking position, the second position difference and the third position difference of the current wafer box. Therefore, the wafer taking and placing position determining method provided by the invention can automatically determine the lowest wafer taking position of the current wafer box based on the reference position and the first position difference, greatly reduces the workload of the manual teaching manipulator, further can determine the lowest wafer taking position of the current wafer box by determining the reference position and combining the first position difference after the wafer box is replaced, and can automatically determine the wafer taking position and the wafer placing position of each clamping groove of the current wafer box by further combining the second position difference and the third position difference, thereby reducing the manual participation degree of equipment debugging and the requirement on manual proficiency, greatly reducing the time cost and the labor cost of the teaching manipulator, and further reducing the difficulty and the cost during wafer batch production.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the exemplary embodiments. The drawings are only for purposes of illustrating exemplary embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 is a schematic flow chart of a wafer pick-and-place position determining method according to an embodiment of the present disclosure;
fig. 2 is a schematic structural block diagram of a wafer pick-and-place position determining apparatus according to an embodiment of the present disclosure;
FIG. 3 is a block diagram of an electronic device according to an embodiment of the disclosure;
fig. 4 is a schematic usage scenario diagram of a wafer pick-and-place position determining method according to an embodiment of the present disclosure;
fig. 5 is a schematic configuration diagram of the robot shown in fig. 4.
Wherein, the correspondence between the reference numbers and the part names in fig. 4 and 5 is:
100 wafer cassette holders; 200 a wafer cassette; 300 a manipulator; 400 wafers;
110 a stent body; 120 a sensor mount; 130 a pressure sensor; 140 a metal patch; 150 contact ball; 210 a card slot; 310 a master hand; 320 pairs of hands; 330 a robotic arm; 340 connecting rod.
Detailed Description
Exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
According to a first aspect of the embodiments of the present application, a method for determining a wafer pick-and-place position is provided, as shown in fig. 1, the method includes:
step 101: determining the lowest wafer taking position of the current wafer box according to the reference position of the wafer box bracket and the first position difference, wherein the first position difference is the actual measurement distance between the reference position and the lowest wafer taking position of the initial wafer box;
in particular, the reference position of the cassette holder may be determined in combination with the position of a pressure sensor of the cassette holder, which is used to detect whether the robot arm is level, it being understood that the reference position is a relatively fixed position of the cassette holder.
It should be noted that, as shown in fig. 4, the initial pod may be a pod for performing a wafer pick-and-place position determination operation based on the pod holder 100 for the first time, a plurality of identical slots 210 are generally disposed in the interior of the pod 200 at equal intervals along the height direction, the slots 210 are used for loading the wafer 400, when the pod 200 participates in the processing of the wafer 400, the pod 200 is mounted on the pod holder 100, the lowest pick-up position is a pick-up position of the lowest slot of the plurality of slots, and the lowest pick-up position is located above the pressure sensor 130 of the pod holder 100.
The cassettes 200 are usually standard components, and the plurality of cassettes 200 used in the process of processing the wafer 400 are all identical in structural parameters, and the first position difference is set to the actual measurement distance between the reference position and the lowest wafer pickup position of the initial cassette, and is also effective for the current cassette when the cassette holder 100 is not changed.
Furthermore, the lowest wafer taking position of the current wafer box can be determined according to the difference between the reference position and the first position, and teaching of the lowest wafer taking position of the current wafer box to the manipulator 300 is avoided.
Step 102: acquiring a second position difference between the wafer taking positions of two adjacent clamping grooves of the current wafer box;
specifically, the second position difference is used to represent a height distance between two adjacent wafer taking positions in the current wafer cassette, as shown in fig. 4, since the plurality of wafer taking positions 210 in the wafer cassette 200 are arranged at equal intervals, and the structures of the plurality of wafer taking positions 210 are the same, the height distance between any two adjacent wafer taking positions in the current wafer cassette can be represented by the second position difference, and since the wafer cassette 200 is generally a standard component, the second position difference also has high applicability after the wafer cassette 200 is replaced.
Step 103: acquiring a third position difference between a wafer taking position and a wafer placing position of the same clamping groove of the current wafer box;
specifically, the third position difference is used to represent a height distance between a wafer taking position and a wafer placing position of the same card slot in the current wafer cassette, as shown in fig. 4, since the structures of the plurality of card slots 210 in the wafer cassette 200 are the same, the height distance between the wafer taking position and the wafer placing position of any card slot in the current wafer cassette can be represented by the third position difference, and since the wafer cassette 200 is generally a standard component, the third position difference also has high applicability after the wafer cassette 200 is replaced.
It should be noted that, as shown in fig. 4, in the wafer cassette 200, in order to facilitate the robot 300 to pick and place the wafer 400, the pick position of each card slot 210 is generally set lower than the place position. Moreover, under the condition that the wafer 400 is loaded in the clamping groove 210, a certain height difference exists between the bottom surface and the top surface of the wafer 400 and the wafer taking position and the wafer placing position of the clamping groove 210 respectively, so that in the process of long-term use of the wafer box 200, if the clamping groove 210 is worn, the height difference can be utilized, the surface of the wafer 400 is prevented from being collided with by the manipulator 300 in the process of taking and placing the wafer 400, and the yield of products is improved.
Step 104: and determining the wafer taking position and the wafer placing position of each clamping groove of the current wafer box according to the lowest wafer taking position, the second position difference and the third position difference of the current wafer box.
Specifically, under the condition that the lowest wafer taking position of the current wafer box is determined, the wafer taking position and the wafer placing position of each clamping groove of the current wafer box can be automatically determined by combining the obtained second position difference and the obtained third position difference, the teaching of each position of the manipulator is avoided, and the workload of teaching the manipulator is greatly reduced.
In conclusion, the method for determining the wafer picking and placing positions provided by the invention can automatically determine the lowest wafer picking position of the current wafer box based on the reference position and the first position difference, so that the workload of an artificial teaching manipulator is greatly reduced, further, after the wafer box is replaced, the lowest wafer picking position of the current wafer box can be determined by determining the reference position and combining the first position difference, and further, the wafer picking position and the wafer placing position of each clamping groove of the current wafer box can be automatically determined by combining the second position difference and the third position difference, so that the artificial participation degree of equipment debugging and the requirement on the artificial proficiency are reduced, the time cost and the labor cost of the teaching manipulator are greatly reduced, and further, the difficulty and the cost during wafer batch production are reduced.
It should be noted that, as shown in fig. 4, since the wafer cassette 200 is usually a standard component, the second position difference and the third position difference may be obtained in many ways, for example, by adjusting design parameters of the wafer cassette 200, or by performing batch measurement statistics on the wafer cassette 200, and the way of obtaining the second position difference and the third position difference is not limited herein.
In some examples, the wafer pick-and-place position determining method further includes:
controlling the manipulator to move along the height direction of the current wafer box so that a plurality of mechanical arms of the manipulator sequentially contact and press the pressure sensor of the wafer box bracket; recording a first height position corresponding to the mechanical arm under the condition that each mechanical arm is pressed to the pressure sensor; an average of the plurality of first height positions is determined as a reference position.
Specifically, under the condition that the wafer box is replaced, the position and the posture of the manipulator usually change to a certain extent, before the manipulator is used for taking and placing wafers, the manipulator is controlled to move along the current height direction of the wafer box, so that a plurality of mechanical arms of the manipulator sequentially contact and press the pressure sensors of the wafer box support, and under the condition that each mechanical arm contacts and presses the pressure sensor, the first height positions corresponding to the manipulator are respectively recorded, so that a plurality of first height positions can be obtained.
Furthermore, on one hand, whether the plurality of mechanical arms of the manipulator have good horizontal conditions or not can be judged according to the plurality of first height positions, and reference is provided for horizontal adjustment of the manipulator; on the other hand, the average value of the plurality of first height positions can be determined as the reference position, and the reference position can be updated under the condition that the posture of the manipulator changes, so that the adaptability of the reference position is further improved, and the determination accuracy of each wafer taking position and each wafer placing position of the current wafer box is improved.
Meanwhile, as the manipulator is used for a long time, the structures such as joints and the mechanical arm of the manipulator are inevitably worn, the reference position is determined based on the first height position of the manipulator, and the negative influence of the wear on the determination accuracy of the sheet taking position and the sheet placing position can be reduced.
It should be noted that, as shown in fig. 5, the robot 300 for picking and placing wafers generally includes a connecting rod 340, a main hand 310 and an auxiliary hand 320, wherein the main hand 310 and the auxiliary hand 320 respectively have two robot arms 330, the main hand 310 and the auxiliary hand 320 are symmetrically disposed at two sides of the connecting rod 340, and the two robot arms 330 of the main hand 310 and the two robot arms 330 of the auxiliary hand 320 are symmetrically disposed at two ends of the connecting rod 340. As required by design, the horizontal positions of the four mechanical arms 330 should be consistent in the case where the link 340 is horizontally disposed, but in practice, there will be some difference in the horizontal positions of the four mechanical arms 330 due to factors such as assembly accuracy and long-term use. Therefore, the pod rack 100 typically includes a pressure sensor 130 for determining whether the robot 300 is level.
As shown in fig. 4, the pod holder 100 includes a holder body 110, a sensor holder 120, a pressure sensor 130, a metal patch 140, and a contact ball 150, wherein the sensor holder 120 is disposed on the holder body 110, the pressure sensor 130 is disposed inside the sensor holder 120, the metal patch 140 is disposed above the pressure sensor 130, two ends of the metal patch 140 are fixed to the sensor holder 120, the contact ball 150 is disposed on the metal patch 140, and one side of the contact ball 150 abuts against the pressure sensor 130.
Therefore, in the process of controlling the robot 300 to move in the current height direction of the wafer cassette, the robot arm 330 of the robot 300 presses the contact ball 150, and the contact force is transmitted to the pressure sensor 130, so as to generate a pressure signal, and the robot 300 is adjusted to sequentially press the contact balls 150 by the plurality of robot arms 330 of the robot 300, thereby forming a contact pressure on the pressure sensor 130, and recording the corresponding first height position of the robot 300 at each contact pressure. Since the outer surface of the contact ball 150 is a spherical surface, when the robot arm 330 presses the contact ball 150, the contact ball 150 can form a point contact, so that an error caused by the surface flatness of the pressure sensor 130 can be avoided compared to a case where the surface of the pressure sensor 130 is directly pressed.
It is understood that the mechanical arm touch pressure sensor includes direct touch pressure and indirect touch pressure.
Further, the plurality of pressure sensors 130 may be provided, and the distribution of the plurality of pressure sensors 130 may be adapted to the structure of the robot 300, so that the plurality of robot arms 330 may sequentially contact and press each pressure sensor 130 in a process of moving the robot 300 in the height direction of the wafer cassette 200 at a time, thereby reducing the number of times of controlling the robot 300 to ascend and descend in the height direction of the wafer cassette 200.
It is understood that the metal patch 140 and the contact ball 150 may not be provided, and the mechanical arm 330 directly contacts and presses the pressure sensor 130.
In some examples, the wafer pick-and-place position determining method further includes: adjusting the manipulator along the height direction of the initial wafer box so that the manipulator is positioned at the lowest wafer taking position of the initial wafer box; recording a second height position of the manipulator under the condition that the manipulator is positioned at the lowest wafer taking position of the initial wafer box; a first position difference is determined based on the second height position and the reference position.
Specifically, under the condition that the current wafer box is the initial wafer box, the manipulator can be adjusted to move in the height direction of the initial wafer box, and under the condition that the manipulator is located at the lowest wafer taking position of the initial wafer box, the second height position of the manipulator is recorded, the first position difference is determined based on the reference position and the second height position to obtain the first position difference, then each wafer taking position and each wafer placing position of the initial wafer box can be further determined based on the second position difference and the third position difference, and the obtained first position difference is determined to be used for the wafer box subsequently participating in wafer production, so that the workload of the subsequent position determining process is reduced.
It should be noted that the process of adjusting the manipulator to locate the manipulator at the lowest wafer-taking position of the initial wafer cassette may be manually completed, or may be completed by using additional visual inspection equipment in cooperation with a controller of the manipulator, and the specific adjustment manner may be various, and is not limited herein.
In some examples, the first elevation position and the second elevation position are each determined from Z-axis position information of the manipulator.
Specifically, the first height position and the second height position can be determined according to the Z-axis position information of the manipulator, and it can be understood that the Z-axis of the manipulator is a coordinate axis when the manipulator moves in the height direction, so that the determination of the first height position and the second height position can be completed without establishing an additional reference system, and further the reference position, the film taking position and the film placing position related to the first height position and the second height position can be represented by the Z-axis position information of the manipulator, and further after the determination of the taking and placing positions, the manipulator is controlled to perform the taking and placing work according to each position, and the coordinate conversion work can be avoided.
In some examples, the foregoing step 104, comprises: determining the number of the card slots below the current card slot; calculating the product of the number of the card slots and the second position difference; and determining the sum of the product and the lowest wafer taking position of the current wafer box as the wafer taking position of the current card slot.
Specifically, in the process of determining the wafer taking position of each card slot of the current wafer box, the number of the card slots below the current card slot may be determined first, as shown in fig. 4, since the structure of each card slot 210 is the same and the interval is the same, the position difference between the wafer taking position of the current card slot and the lowest wafer taking position of the current wafer box may be obtained by calculating the product of the number of the card slots below the current card slot and the second position difference, and then the lowest wafer taking position of the current wafer box and the product are summed, so that the wafer taking position of the current card slot may be obtained. By the mode, the wafer taking position of each clamping groove is determined one by one, namely, each clamping groove is sequentially used as the current clamping groove along the direction from the lowest clamping groove to the highest clamping groove of the current wafer box, the wafer taking position is calculated one by one, and the wafer taking position of each clamping groove of the current wafer box can be obtained. Moreover, the determining algorithm is low in calculation difficulty and small in calculation amount, and is easy to realize and simultaneously beneficial to improving the calculation efficiency.
For example, if the lowest pick-up position ZC1 of the current wafer cassette is set, and the pick-up position of the current card slot is set to ZCi, the number of card slots below the current card slot is (i-1), i is a positive integer, and if the second position difference ZW1 is set, the following steps are performed:
ZCi=（i-1）ZW1+ ZC1
in some examples, the foregoing step 104 further includes:
and determining the sum of the product and the difference between the lowest wafer taking position and the third position of the current wafer box as the wafer placing position of the current clamping groove.
Specifically, in the process of determining the wafer placing position of each card slot of the current wafer cassette, as shown in fig. 4, since the card slots 210 have the same structure and the same interval, the product and the sum of the lowest wafer taking position and the third position difference of the current wafer cassette can be further calculated as the wafer placing position of the current card slot, and then the wafer placing positions of the card slots can be determined one by the foregoing manner, that is, each card slot can be sequentially used as the current card slot along the direction from the lowest card slot to the highest card slot of the current wafer cassette, and the wafer placing positions of the card slots of the current wafer cassette can be calculated one by one. Moreover, the determining algorithm is low in calculation difficulty and small in calculation amount, and is easy to realize and simultaneously beneficial to improving the calculation efficiency.
Illustratively, in combination with the above, if the card placing position of the current card slot is ZFi, and the third position difference is ZW2, there are:
ZFi=（i-1）ZW1+ ZC1+ZW2
further, as an example of the wafer pick-and-place position determining method provided in the first aspect, the method may be performed as follows, and includes:
step 1: judging whether the manipulator 300 is horizontal;
specifically, the step of determining whether the robot 300 is level may be implemented based on Pin Search (robot level difference verification function) logic. As shown in fig. 4, the pod holder 100 has 2 metal pads 140 with contact balls 150, and a pressure sensor 130 is provided right under the metal pads 140 to control the robot 300 to descend along the Z-axis, in which a robot arm 330 of a master hand 310 presses the contact balls 150 to obtain a Z-axis position ZP 1; the robot 300 is controlled to continue to descend and the other robot arm 330 presses against the contact ball 150 to obtain another Z-axis position ZP 2; when the manipulator 300 is rotated, the auxiliary hand 320 obtains two Z-axis positions ZD1 and ZD2 in the same operation. And taking out the subtraction of the highest point and the lowest point, wherein the difference is the maximum level difference of the manipulator 300. The Pin Search logic is controlled by software and electricity together and is automated.
It is understood that ZP1, ZP2, ZD1, and ZD2 are a plurality of first elevation positions.
It should be noted that, as shown in fig. 5, the manipulator 300 of the machine station adopted in the present example includes a main hand 310 and an auxiliary hand 320; the main hand 310 and the sub-hand 320 each have 2 left and right robot arms 330, and 4 robot arms 330 in total.
Step 2: determining the average position ZZ of the contact ball 150;
specifically, on the premise that Pin Search has been performed, the average position ZZ of the contact ball 150 of the wafer cassette holder 100 may be obtained by (ZP 1+ ZP2+ ZD1+ ZD 2)/4 = ZZ.
It will be appreciated that ZZ is the aforementioned reference position.
And step 3: determining a wafer taking position ZC1 of a lowest card slot of the wafer cassette 200, and determining a difference ZWF between ZC1 and ZZ;
specifically, the Z-axis position of the robot 300 is manually adjusted up and down, the robot 300 is extended and observed to see whether the robot 300 is at the pick-up position of the lowest slot of the wafer cassette 200, and if not, the Z-axis position of the robot 300 is adjusted again to obtain the pick-up position ZC1 of the lowest slot of the wafer cassette 200. At the same time, a ZZ difference ZWF = ZC1-ZZ between the pick-up position ZC1 of the lowest card slot of the wafer cassette 200 and the average position of the contact balls 150 of the cassette holder 100 is obtained.
It is understood that the wafer box 200 is an initial wafer box, and therefore, a first position difference of the wafer box 200 needs to be determined, and the aforementioned ZWF is the first position difference.
And 4, step 4: the pick-up and drop-in positions of each card slot 210 are determined.
Specifically, since the pitch ZW1 of each card slot 210 of the wafer cassettes 200 of the same size is the same, the difference between the pick-up position of each layer is ZW1, and the difference between the pick-up position of each layer is ZW 1. Meanwhile, the distance ZW2 between the pick-up position and the release position of a single card slot 210 is also the same, so that the release position ZF1= ZW2+ ZC1 of the lowest card slot of the wafer cassette 200 can be obtained. Furthermore, based on the pick-up position ZC1 of the lowest card slot of the wafer cassette 200, the pick-up positions of all the card slots 210 are obtained by adding ZW1 to each layer; based on the placement position ZF1 of the lowest slot of the wafer cassette 200, the placement positions of all the slots 210 are obtained by adding ZW1 for each layer.
In addition, since the Pin Search is performed automatically, the Pin Search may be performed after each replacement of the pod 200 and before the wafer 400 is picked and placed, so as to obtain the average position ZZ of the contact balls 150 of the pod holder 100. Through ZZ and the ZWF determined before, the pick-up position ZC1 of the lowest card slot of the wafer cassette 200 can be obtained, and then pick-up and place positions of all the card slots 210 are obtained according to step 4.
According to a second aspect of the embodiments of the present application, there is provided a wafer pick-and-place position determining apparatus, as shown in fig. 2, including:
a first determining unit 201, configured to determine a lowest wafer taking position of a current wafer cassette according to a reference position of a wafer cassette holder and a first position difference, where the first position difference is an actually measured distance between the reference position and the lowest wafer taking position of an initial wafer cassette;
the first obtaining unit 202 is configured to obtain a second position difference between the wafer taking positions of two adjacent card slots of the current wafer cassette;
a second obtaining unit 203, configured to obtain a third position difference between a wafer taking position and a wafer placing position of the same card slot of the current wafer cassette;
the second determining unit 204 is configured to determine a wafer taking position and a wafer placing position of each card slot of the current wafer cassette according to the lowest wafer taking position, the second position difference, and the third position difference of the current wafer cassette.
The wafer taking and placing position determining device provided by the invention can automatically determine the lowest wafer taking position of the current wafer box based on the reference position and the first position difference, so that the workload of an artificial teaching manipulator is greatly reduced, further, after the wafer box is replaced, the reference position is determined and the first position difference is combined to determine the lowest wafer taking position of the current wafer box, and further, the second position difference and the third position difference are combined to automatically determine the wafer taking position and the wafer placing position of each clamping groove of the current wafer box, so that the manual participation degree of equipment debugging and the requirement on manual proficiency are reduced, the time cost and the labor cost of the teaching manipulator are greatly reduced, and further, the difficulty and the cost in batch production of wafers are reduced.
In some possible examples, the wafer pick-and-place position determining apparatus further includes:
the first control unit is used for controlling the mechanical arm to move along the height direction of the current wafer box so as to enable the mechanical arms of the mechanical arm to sequentially touch and press the pressure sensor of the wafer box support;
the first recording unit is used for recording a first height position corresponding to the mechanical arm under the condition that each mechanical arm is pressed to the pressure sensor;
and a third determining unit for determining an average value of the plurality of first height positions as a reference position.
In some possible examples, the wafer pick-and-place position determining apparatus further includes:
the second control unit is used for adjusting the manipulator along the height direction of the initial wafer box so as to enable the manipulator to be located at the lowest wafer taking position of the initial wafer box;
the second recording unit is used for recording a second height position of the manipulator under the condition that the manipulator is positioned at the lowest wafer taking position of the initial wafer box;
a fourth determination unit for determining the first position difference based on the second height position and the reference position.
In some possible examples, the first elevation position and the second elevation position are both determined from Z-axis position information of the manipulator.
In some possible examples, the second determining unit 204 includes:
the first determining module is used for determining the number of the card slots below the current card slot;
the calculation module is used for calculating the product of the number of the card slots and the second position difference;
and the second determination module is used for determining the sum of the product and the lowest wafer taking position of the current wafer box as the wafer taking position of the current card slot.
In some possible examples, the second determining unit 204 further includes:
and the third determining module is used for determining that the sum of the product and the difference between the lowest wafer taking position and the third position of the current wafer box is the wafer placing position of the current clamping groove.
According to a third aspect of embodiments of the present application, a storage medium is provided, the storage medium including a stored program, wherein when the program is executed, an apparatus in which the storage medium is located is controlled to perform the method as set forth in any one of the above first aspects.
According to a fourth aspect of the embodiments of the present application, an electronic device 500 is proposed, as shown in fig. 3, the electronic device 500 includes at least one processor 501 and at least one memory 502 connected to the processor 501, where the processor 501 is configured to call program instructions in the memory 502 to perform the method proposed in any one of the first aspects.
According to a fifth aspect of the embodiments of the present application, there is provided a wafer picking and placing apparatus, including: the electronic device 500 as set forth in the fourth aspect above.
Since the wafer picking and placing device includes the electronic device 500 provided in the fourth aspect, and the electronic device 500 is used for executing the method provided in any one of the first aspects, the wafer picking and placing device has all the beneficial effects of the wafer picking and placing position determining method provided in any one of the first aspects, and details are not repeated here.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus and electronic devices according to embodiments of the application; it will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions; these computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable flow management apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable flow management apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. For example, the above-described embodiments of the apparatus are merely illustrative, and for example, the above-described division of the units is only one type of division of logical functions, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of some interfaces, devices or units, and may be an electric or other form.
In a typical configuration, an electronic device may include one or more processors (CPUs), memory, and a bus; the electronic device may also include input/output interfaces, network interfaces, and the like.
The memory may include volatile memory in a computer readable medium, Random Access Memory (RAM) and/or nonvolatile memory such as Read Only Memory (ROM) or flash memory (flash RAM), and the memory includes at least one memory chip; memory is an example of a storage medium.
Storage media, including permanent and non-permanent, removable and non-removable media, may implement the information storage by any method or technology; the information may be computer readable instructions, data structures, modules of a program, or other data; examples of computer storage media include, but are not limited to, phase change memory (PRAM), Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), Read Only Memory (ROM), Electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), Digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information that can be accessed by a computing device; as defined herein, a storage medium does not include a transitory computer readable medium such as a modulated data signal and a carrier wave.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims and drawings of the present application, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order; it will be appreciated that the data so used may be interchanged under appropriate circumstances such that the embodiments described herein may be implemented in other sequences than those illustrated or described herein.
It should be noted that, for simplicity of description, the above-mentioned method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present application is not limited by the order of acts described, as some steps may occur in other orders or concurrently depending on the application. Further, those skilled in the art should also appreciate that the embodiments described in the specification are preferred embodiments and that the acts and modules referred to are not necessarily required in this application.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus; without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element.
Those skilled in the art will appreciate that embodiments of the present application may be provided as a method, apparatus, or electronic device; accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects; furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
Computer program code for carrying out operations for embodiments of the present application may be written in any combination of one or more programming languages, including an object oriented programming language such as Common Lisp, Python, C + +, Objective-C, Smalltalk, Delphi, Java, Swift, C #, Perl, Ruby, JavaScript, and PHP, etc., a conventional procedural programming language such as Fortran, ALGOL, COBOL, PL/I, BASIC, Pascal, C, etc., and any other programming language such as Lisp, Tcl, Prolog, Visual BASIC, NET, SQL, R, etc.; the program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server; in the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet service provider).
The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the present disclosure, and are intended to be included within the scope of the present disclosure as set forth in the appended claims.
Claims (9)
1. A method for determining a wafer picking and placing position is characterized by comprising the following steps:
determining the lowest wafer taking position of the current wafer box according to the reference position of the wafer box bracket and a first position difference, wherein the first position difference is the actual measurement distance between the reference position and the lowest wafer taking position of the initial wafer box;
acquiring a second position difference between the wafer taking positions of two adjacent clamping grooves of the current wafer box;
acquiring a third position difference between the wafer taking position and the wafer placing position of the same clamping groove of the current wafer box;
determining a wafer taking position and a wafer placing position of each clamping groove of the current wafer box according to the lowest wafer taking position, the second position difference and the third position difference of the current wafer box;
controlling a manipulator to move along the height direction of the current wafer box so that a plurality of mechanical arms of the manipulator sequentially contact and press a pressure sensor of the wafer box bracket;
recording a first height position corresponding to the mechanical arm under the condition that each mechanical arm is pressed to the pressure sensor;
determining an average of a plurality of the first height positions as the reference position.
2. The method as claimed in claim 1, further comprising:
adjusting the manipulator along the height direction of the initial wafer box so that the manipulator is located at the lowest wafer taking position of the initial wafer box;
recording a second height position of the manipulator under the condition that the manipulator is located at the lowest wafer taking position of the initial wafer box;
determining the first position difference based on the second height position and the reference position.
3. The wafer pick-and-place position determining method as claimed in claim 2,
the first height position and the second height position are both determined according to Z-axis position information of the manipulator.
4. The method as claimed in claim 1, wherein the step of determining the pick-and-place position of each of the pockets of the current wafer cassette according to the lowest pick-and-place position of the current wafer cassette, the second position difference and the third position difference comprises:
determining the number of the card slots below the current card slot;
calculating the product of the number of the clamping grooves and the second position difference;
and determining the sum of the product and the lowest wafer taking position of the current wafer box as the wafer taking position of the current clamping groove.
5. The method as claimed in claim 4, wherein the step of determining the pick-and-place position of each of the pockets of the current wafer cassette according to the lowest pick-and-place position of the current wafer cassette, the second position difference and the third position difference further comprises:
and determining the sum of the product, the lowest wafer taking position of the current wafer box and the third position difference as the wafer placing position of the current clamping groove.
6. A wafer pick-and-place position determining apparatus, comprising:
the first determining unit is used for determining the lowest wafer taking position of the current wafer box according to the reference position of the wafer box support and a first position difference, wherein the first position difference is the actual measurement distance between the reference position and the lowest wafer taking position of the initial wafer box;
the first obtaining unit is used for obtaining a second position difference between the wafer taking positions of two adjacent clamping grooves of the current wafer box;
the second obtaining unit is used for obtaining a third position difference between the wafer taking position and the wafer placing position of the same clamping groove of the current wafer box;
a second determining unit, configured to determine, according to the lowest wafer taking position of the current wafer cassette, the second position difference, and the third position difference, a wafer taking position and a wafer placing position of each card slot of the current wafer cassette;
the first control unit is used for controlling the mechanical arm to move along the height direction of the current wafer box so as to enable the plurality of mechanical arms of the mechanical arm to sequentially touch and press the pressure sensor of the wafer box support;
the first recording unit is used for recording a first height position corresponding to the mechanical arm under the condition that each mechanical arm is pressed to the pressure sensor;
a third determining unit configured to determine an average value of the plurality of first height positions as the reference position.
7. A storage medium, characterized in that the storage medium comprises a stored program, wherein a device on which the storage medium is located is controlled to perform the method according to any one of claims 1 to 5 when the program is run.
8. An electronic device comprising at least one processor and at least one memory coupled to the processor, wherein the processor is configured to invoke program instructions in the memory and perform the method of any of claims 1 to 5.
9. A wafer pick and place apparatus, comprising:
the electronic device of claim 8.
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| CN202210401881.2A CN114496863B (en) | 2022-04-18 | 2022-04-18 | Wafer picking and placing position determining method and related equipment |
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| CN106695806A (en) * | 2015-11-15 | 2017-05-24 | 重庆松瑞汽车销售有限公司 | Method for improving mechanical arm teaching efficiency |
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| CN113192863A (en) * | 2021-03-29 | 2021-07-30 | 北京北方华创微电子装备有限公司 | Control method of wafer transmission system and semiconductor process equipment |
| CN114156216A (en) * | 2022-02-10 | 2022-03-08 | 绍兴中芯集成电路制造股份有限公司 | Automatic film taking method, automatic film taking control system and computer storage medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106695806A (en) * | 2015-11-15 | 2017-05-24 | 重庆松瑞汽车销售有限公司 | Method for improving mechanical arm teaching efficiency |
| CN107731722A (en) * | 2016-08-11 | 2018-02-23 | 北京北方华创微电子装备有限公司 | A kind of manipulator takes piece method and film releasing method and device |
| CN113192863A (en) * | 2021-03-29 | 2021-07-30 | 北京北方华创微电子装备有限公司 | Control method of wafer transmission system and semiconductor process equipment |
| CN114156216A (en) * | 2022-02-10 | 2022-03-08 | 绍兴中芯集成电路制造股份有限公司 | Automatic film taking method, automatic film taking control system and computer storage medium |
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Address after: 226000 No.1 Jinshan Road, zuegang street, Rudong County, Nantong City, Jiangsu Province Patentee after: Jiangsu Yiwen Microelectronics Technology Co.,Ltd. Patentee after: Wuxi Yiwen Microelectronics Technology Co.,Ltd. Address before: 226000 No.1 Jinshan Road, zuegang street, Rudong County, Nantong City, Jiangsu Province Patentee before: Jiangsu Yiwen Microelectronics Technology Co.,Ltd. Patentee before: WUXI YIWEN ELECTRONIC TECHNOLOGY Co.,Ltd. |
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