CN114489292A

CN114489292A - Heat dissipation regulation and control method, system and device and server

Info

Publication number: CN114489292A
Application number: CN202210043942.2A
Authority: CN
Inventors: 刘永敬
Original assignee: Suzhou Inspur Intelligent Technology Co Ltd
Current assignee: Suzhou Inspur Intelligent Technology Co Ltd
Priority date: 2022-01-14
Filing date: 2022-01-14
Publication date: 2022-05-13
Anticipated expiration: 2042-01-14
Also published as: CN114489292B

Abstract

The invention discloses a heat dissipation regulation method, a system, a device and a server, wherein the types of M PCIE devices currently externally connected with the server and the positions of the M PCIE devices in N hardware interfaces are obtained, a physical link correspondingly connected between each PCIE device and a BMC is determined according to the positions, an information acquisition thread corresponding to each PCIE device is determined according to the types, therefore, for each PCIE device, the BMC obtains the alarm temperature and the operating temperature of the PCIE device through the physical link corresponding to the PCIE device according to the information acquisition rule of the information acquisition thread corresponding to the PCIE device, and finally, the fan module is controlled to regulate the speed according to the alarm temperature and the operating temperature of each PCIE device. Compared with the prior art, the scheme does not need to establish the temperature adjusting table in advance in the firmware of the BMC, solves the problems of firmware updating and firmware upgrading performed by a client due to maintenance of the temperature adjusting table, is convenient for the client to use, and avoids waste of human resources.

Description

Heat dissipation regulation and control method, system, device and server

Technical Field

The invention relates to the field of heat dissipation control, in particular to a heat dissipation regulation and control method, a heat dissipation regulation and control system, a heat dissipation regulation and control device and a server.

Background

The server includes PCIE devices (Peripheral Component Interconnect Express, high-speed serial computer expansion bus standard) for implementing different functions, such as a CPU, a network card, and the like, and if the temperatures of these devices are too high, the performance of these devices may be directly affected, and in a serious case, the devices may not work, so that the working performance and market competitiveness of the server are affected, and therefore, in order to implement temperature control on each device in the server, a BMC (Baseboard Management Controller) may correspondingly control the fan module according to the temperature adjustment point of the device. Different PCIE equipment has different temperature regulation points and the same PCIE equipment from different manufacturers also has different temperature regulation points, if one temperature regulation point is set for different equipment at will, namely the wind power blown by the fan is the same for each equipment, the heat dissipation redundancy for some equipment is caused, namely the rotating speed of the fan is too high and the power consumption is too large; for some equipment, the heat dissipation is not enough, that is, the equipment is likely to be scrapped due to over-high temperature.

Therefore, in the prior art, a temperature adjustment table is established in advance according to different manufacturers for temperature adjustment points of different PCIE devices, and the temperature adjustment table is stored in the firmware of the BMC, so that the BMC can obtain the temperature adjustment points and perform subsequent wind speed control of the fan module. However, the method has the defects that the PCIE devices accessing the server each time need to ensure that the temperature adjustment information of the PCIE devices and the manufacturer exists in the temperature adjustment table, otherwise, the BMC adjusts the speed of the fan according to the default temperature adjustment point, which causes the speed adjustment result to be very inaccurate and cannot accurately realize the heat dissipation of the PCIE devices; moreover, if the information is added to the temperature adjustment table, the firmware of the BMC needs to be updated again and issued, and the client also needs to perform corresponding firmware upgrade, which brings inconvenience to the client in use and wastes manpower for performing related maintenance and upgrade.

Disclosure of Invention

The invention aims to provide a heat dissipation regulation and control method, a system, a device and a server, which do not need to establish a temperature regulation table in advance in a firmware of a BMC (baseboard management controller), solve the problems that in the prior art, the firmware needs to be updated due to maintenance of the temperature regulation table and the corresponding firmware needs to be upgraded by a client, are convenient for the client to use, and avoid waste of human resources for upgrading and maintaining.

In order to solve the technical problem, the invention provides a heat dissipation regulation and control method, which is applied to a BMC in a server, wherein the server further comprises a fan module and N hardware interfaces for externally connecting PCIE equipment, N is not less than 1 and is an integer, and the heat dissipation regulation and control method comprises the following steps:

obtaining types of M PCIE equipment currently and externally connected with the server and positions of the M PCIE equipment in N hardware interfaces, wherein M is more than or equal to 1 and less than or equal to N, and M is an integer;

determining a physical link correspondingly connected between each PCIE device and the BMC according to the position of each PCIE device;

determining information acquisition threads which are respectively corresponding to the PCIE devices and used for capturing data according to the types of the PCIE devices, wherein the information acquisition rules of different information acquisition threads are different;

for each PCIE device, acquiring the alarm temperature and the operating temperature of the PCIE device through the physical link corresponding to the PCIE device according to the information acquisition rule of the information acquisition thread corresponding to the PCIE device;

and controlling the fan module to regulate the speed according to the alarm temperature and the operating temperature of each PCIE device.

Preferably, the obtaining the types of M PCIE devices externally connected to the server and the positions of the M PCIE devices in the N hardware interfaces includes:

and obtaining the types of M PCIE equipment externally connected with the server and the positions of the M PCIE equipment in the N hardware interfaces from a nonvolatile storage medium of the server.

Preferably, determining the physical link correspondingly connected between each PCIE device and the BMC according to the location of each PCIE device includes:

and determining a physical link correspondingly connected between each PCIE device and the BMC from an interface-link corresponding relation pre-stored in a nonvolatile storage medium of the server according to the position of each PCIE device.

Preferably, the information acquisition thread is an II2C information acquisition thread or a PCIE information acquisition thread.

Preferably, for each PCIE device, after acquiring the alarm temperature and the operating temperature of the PCIE device through the physical link corresponding to the PCIE device according to the information acquisition rule of the information acquisition thread corresponding to the PCIE device, the method further includes:

and the control prompt module prompts the alarm temperature and the operating temperature of each PCIE device.

Preferably, the prompting module is a display module.

Preferably, the alarm temperatures include P alarm temperatures, wherein P is more than or equal to 1 and is an integer, and when P is more than 1, the jth alarm temperature is less than the jth +1 alarm temperature, j is more than or equal to 1 and is less than or equal to P-1, and j is an integer;

controlling the fan module to regulate the speed according to the alarm temperature and the operating temperature of each PCIE device, including:

for the ith PCIE equipment, i is more than or equal to 1 and less than or equal to M, and i is an integer, executing the following steps:

when the P is equal to 1 and the operating temperature is greater than or equal to the alarm temperature, determining that the ith PCIE equipment is to control the fan module to operate at a first preset speed;

when P is larger than 1 and the operation temperature is not larger than the jth alarm temperature and is smaller than the jth +1 alarm temperature, determining that the ith PCIE equipment is to operate at a jth +1 preset speed;

when P is more than 1 and the operating temperature is more than or equal to the P-th alarm temperature, determining that the i-th PCIE equipment is supposed to operate at a j + 2-th preset speed, wherein the j + 1-th preset speed is less than the j + 2-th preset speed;

and controlling the fan module to regulate the speed according to the maximum value of the speed determined by each PCIE device and used for controlling the fan module to operate.

In order to solve the above technical problem, the present invention further provides a heat dissipation regulation system, including:

the first obtaining unit is used for obtaining types and positions of M PCIE devices currently and externally connected with the server in N hardware interfaces, wherein M is more than or equal to 1 and less than or equal to N, and M is an integer;

a first determining unit, configured to determine, according to a location where each PCIE device is located, a physical link correspondingly connected between each PCIE device and the BMC;

a second determining unit, configured to determine, according to the type of each PCIE device, information acquisition threads that are respectively corresponding to each PCIE device and used for capturing data, where information acquisition rules of different information acquisition threads are different;

a second obtaining unit, configured to, for each PCIE device, obtain an alarm temperature and an operating temperature of the PCIE device through the physical link corresponding to the PCIE device according to an information obtaining rule of an information obtaining thread corresponding to the PCIE device;

and the speed regulation control unit is used for controlling the fan module to regulate the speed according to the alarm temperature and the operating temperature of each PCIE device.

In order to solve the above technical problem, the present invention further provides a heat dissipation control device, including:

a memory for storing a computer program;

and the processor is used for executing the steps of the heat dissipation regulation and control method.

In order to solve the technical problem, the invention further provides a server, which comprises a BMC, a fan module, N hardware interfaces for externally connecting PCIE devices, and the heat dissipation control device described above.

The invention provides a heat dissipation regulation method, a system, a device and a server, wherein the scheme comprises the steps of firstly obtaining the types of M PCIE devices which are currently and externally connected with the server and the positions of the M PCIE devices in N hardware interfaces, then determining a physical link which is correspondingly connected between each PCIE device and a BMC according to the positions, determining information obtaining threads which are respectively corresponding to each PCIE device and are used for capturing data according to the types, then for each PCIE device, the BMC obtains the alarm temperature and the operating temperature of the PCIE device through the physical link corresponding to the PCIE device according to the information obtaining rule of the information obtaining thread corresponding to the PCIE device, and finally controlling a fan module to regulate the speed according to the alarm temperature and the operating temperature of each PCIE device. Compared with the prior art, according to the scheme, the alarm temperature and the operation temperature of each PCIE device can be determined without pre-establishing a temperature adjusting table in the firmware of the BMC, and the speed of the fan module is adjusted accordingly, so that the problems that in the prior art, due to maintenance of the temperature adjusting table, firmware updating needs to be carried out and corresponding firmware upgrading needs to be carried out by a client are solved, convenience is brought to the client, and waste of manpower resources for upgrading and maintaining is avoided.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed in the prior art and the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a flowchart of a method for regulating and controlling heat dissipation according to the present invention;

fig. 2 is a schematic structural diagram of a heat dissipation regulation system provided in the present invention;

fig. 3 is a schematic structural diagram of a heat dissipation control device according to the present invention.

Detailed Description

The core of the invention is to provide a heat dissipation regulation and control method, a system, a device and a server, which do not need to establish a temperature regulation table in advance in the firmware of the BMC, solve the problems of firmware update required by maintenance of the temperature regulation table and corresponding firmware upgrade required by a client in the prior art, are convenient for the client to use, and avoid waste of human resources for upgrade and maintenance.

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, fig. 1 is a flowchart of a heat dissipation control method according to the present invention.

The heat dissipation regulation and control method is applied to a BMC in a server, the server further comprises a fan module and N hardware interfaces for externally connecting PCIE equipment, N is not less than 1 and is an integer, and the heat dissipation regulation and control method comprises the following steps:

s11: obtaining types of M PCIE equipment currently and externally connected with a server and positions of the M PCIE equipment in N hardware interfaces, wherein M is more than or equal to 1 and less than or equal to N, and M is an integer;

s12: determining a physical link correspondingly connected between each PCIE device and the BMC according to the position of each PCIE device;

s13: determining information acquisition threads which are respectively corresponding to the PCIE equipment and used for capturing data according to the type of the PCIE equipment, wherein the information acquisition rules of different information acquisition threads are different;

s14: for each PCIE device, acquiring the alarm temperature and the operating temperature of the PCIE device through a physical link corresponding to the PCIE device according to the information acquisition rule of the information acquisition thread corresponding to the PCIE device;

s15: and controlling the fan module to regulate the speed according to the alarm temperature and the running temperature of each PCIE device.

In this embodiment, it is considered that in the prior art, a temperature adjustment table which is established according to different manufacturers and for temperature adjustment points of different PCIE devices needs to be stored in a firmware of the BMC in advance, and at this time, if the currently externally connected PCIE device is not in the temperature adjustment table, the BMC may adjust the speed of the fan according to a default temperature adjustment point, so that the speed adjustment result is not accurate; and if information is added to the temperature adjusting table, the firmware needs to be updated again and issued, and then corresponding firmware upgrading is carried out by a client, so that subsequent maintenance and client use are inconvenient. In order to solve the technical problem, the invention provides a heat dissipation regulation and control method which can dynamically adapt a heat dissipation strategy according to different external PCIE equipment.

Specifically, N hardware interfaces are used to access various PCIE devices, and a fan module is used to dissipate heat, so that in the scheme, types of M PCIE devices currently externally connected to the server and positions of the M PCIE devices in the N hardware interfaces are first obtained, where the PCIE devices may be network cards or RAID (Redundant Arrays of Independent Disks), and the present application is not particularly limited herein; then, determining a physical link correspondingly connected between each PCIE device and the BMC according to the position of each PCIE device; determining information acquisition threads which are respectively corresponding to the PCIE devices and used for capturing data according to the types of the PCIE devices, wherein the information acquisition threads can be II2C information acquisition threads or PCIE information acquisition threads, and specifically which information acquisition threads are adopted is related to the types of the PCIE devices; then, for each PCIE device, the alarm temperature and the operating temperature of the PCIE device are obtained through the physical link corresponding to the PCIE device according to the information obtaining rule of the information obtaining thread corresponding to the PCIE device, and the alarm temperature and the operating temperature of each PCIE device are dynamically obtained; and finally, controlling the fan module to regulate the speed according to the alarm temperature and the operating temperature of each PCIE device.

In summary, the present application provides a method for regulating and controlling heat dissipation, and compared with the prior art, the method for regulating and controlling heat dissipation can dynamically determine the alarm temperature and the operating temperature of each PCIE device and accordingly regulate the speed of the fan module without pre-establishing a temperature adjustment table in the firmware of the BMC, thereby solving the problems of firmware update required for maintaining the temperature adjustment table and corresponding firmware upgrade required for a client in the prior art, facilitating the use of the client, and avoiding waste of human resources for upgrading and maintaining.

On the basis of the above-described embodiment:

as a preferred embodiment, the obtaining the types and positions of M PCIE devices externally connected to the current server in N hardware interfaces includes:

the types of M PCIE devices externally connected with the server and the positions of the M PCIE devices in N hardware interfaces are obtained from a nonvolatile storage medium of the server.

In the present application, the types and positions of the M PCIE devices externally connected to the server at present in the N hardware interfaces may be directly obtained from a nonvolatile storage medium (i.e., a memory) of the server, and it should be noted that, if the server stores the types and positions of the M PCIE devices externally connected to the server in other memories in advance in the N hardware interfaces, the BMC only needs to capture data from the other memories, and the present application is not particularly limited herein.

Therefore, the types of the M PCIE devices externally connected with the current server and the positions of the M PCIE devices in the N hardware interfaces can be simply and reliably obtained directly through the method, so that the subsequent action is facilitated.

As a preferred embodiment, determining a physical link correspondingly connected between each PCIE device and the BMC according to a location where each PCIE device is located includes:

and determining the physical link correspondingly connected between each PCIE device and the BMC from the interface-link corresponding relation pre-stored in the nonvolatile storage medium of the server according to the position of each PCIE device.

In this embodiment, it is considered that, for N hardware interfaces, an interface-link correspondence relationship is pre-stored in a nonvolatile storage medium in a server, where the interface-link correspondence relationship includes physical link information corresponding to the BMC and each hardware interface, and therefore, in the present application, a physical link corresponding to the connection between each PCIE device and the BMC may be determined from the interface-link correspondence relationship pre-stored in the nonvolatile storage medium of the server according to a location of each PCIE device, and the implementation method is simple and reliable.

As a preferred embodiment, the information acquisition thread is an II2C information acquisition thread or a PCIE information acquisition thread.

In this embodiment, it is considered that when types of external PCIE devices are different, information obtaining threads for capturing data that need to be loaded are also different, and therefore, in this application, information obtaining threads for capturing data that respectively correspond to each PCIE device need to be determined according to the type of each PCIE device, information obtaining rules of different information obtaining threads are different, where the information obtaining threads may be II2C information obtaining threads or PCIE information obtaining threads, and data can be simply and effectively captured according to the types of each PCIE device to implement information monitoring.

As a preferred embodiment, for each PCIE device, after acquiring the alarm temperature and the operating temperature of the PCIE device through the physical link corresponding to the PCIE device according to the information acquisition rule of the information acquisition thread corresponding to the PCIE device, the method further includes:

the control prompt module prompts the alarm temperature and the operation temperature of each PCIE device.

In this embodiment, in order to more intuitively display the alarm temperature and the operating temperature of each PCIE device, in this application, after the alarm temperature and the operating temperature of the PCIE device are acquired through the physical link corresponding to the PCIE device according to the information acquisition rule of the information acquisition thread corresponding to the PCIE device, the processor further controls the prompt module to prompt the alarm temperature and the operating temperature of each PCIE device, so that the display is more intuitive, and a developer or a user can conveniently grasp the alarm temperature and the operating temperature of each PCIE device and perform subsequent processing and the like.

As a preferred embodiment, the prompting module is a display module.

The prompting module can be a display module, the alarm temperature and the operation temperature of each PCIE device can be directly displayed, and the display is more visual; it should be noted that the prompt module here may also be a voice module, and directly shows the alarm temperature and the operating temperature of each PCIE device in a form of voice broadcast, which is not particularly limited herein.

As a preferred embodiment, the alarm temperature comprises P alarm temperatures, wherein P is more than or equal to 1 and is an integer, when P is more than 1, the jth alarm temperature is less than the jth +1 alarm temperature, j is more than or equal to 1 and is less than or equal to P-1, and j is an integer;

controlling the fan module to regulate the speed according to the alarm temperature and the running temperature of each PCIE device, comprising:

for the ith PCIE equipment, i is more than or equal to 1 and less than or equal to M, and i is an integer, the following steps are executed:

when the P is equal to 1 and the operating temperature is not lower than the alarm temperature, determining that the ith PCIE equipment is supposed to control the fan module to operate at a first preset speed;

when P is more than 1 and the operation temperature is less than or equal to the jth alarm temperature and less than the jth +1 alarm temperature, determining that the ith PCIE equipment is to operate at the jth +1 preset speed;

when P is more than 1 and the operating temperature is more than or equal to the P alarm temperature, determining that the ith PCIE equipment is supposed to operate at the j +2 preset speed, wherein the j +1 preset speed is less than the j +2 preset speed;

and the fan control module regulates the speed according to the maximum value of the speed of the fan module to be controlled, which is determined by each PCIE device.

In this embodiment, it is considered that each PCIE device includes P alarm temperatures, and in order to finally determine the rotation speed of the fan module, it is required to first determine the rotation speed of each PCIE device to control the fan module, so for an ith PCIE device, when P is 1 and the operating temperature is greater than or equal to the alarm temperature, it is described that the PCIE device includes only one alarm temperature, and then it is determined that the ith PCIE device is to control the fan module to operate at a first preset speed, it is described that the application does not limit a specific numerical value of the first preset speed, and the specific numerical value is set according to actual needs and is in accordance with control logic;

when P is more than 1 and the operation temperature is less than or equal to the jth alarm temperature and less than the jth +1 alarm temperature, determining that the ith PCIE equipment is to operate at the jth +1 preset speed; and when the P is more than 1 and the operation temperature is more than or equal to the P alarm temperature, determining that the ith PCIE equipment is to be operated according to the j +2 preset speed, wherein the j +1 preset speed is less than the j +2 preset speed. After the rotating speed of each PCIE equipment fan module to be controlled is obtained, the BMC controls the fan module to regulate the speed according to the maximum value of the rotating speed of the fan module to be controlled, which is determined by each PCIE equipment.

Specifically, for example, taking P ═ 3 as an example, each PCIE device includes three alarm temperatures, and the first alarm temperature is less than the second alarm temperature and less than the third alarm temperature, so that when the first alarm temperature is less than or equal to the operating temperature and less than the second alarm temperature, it is determined that the i-th PCIE device is to control the fan module to operate at the second preset speed; when the second alarm temperature is less than or equal to the operating temperature and less than the third alarm temperature, determining that the ith PCIE equipment is to control the fan module to operate at a third preset speed; and when the operating temperature is greater than or equal to a third alarm temperature, determining that the ith PCIE equipment is to control the fan module to operate at a fourth preset speed, wherein the second preset speed is less than the third preset speed and less than the fourth preset speed. It is noted that relational terms such as first and second, third, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. After the rotating speed of each PCIE equipment fan module to be controlled is obtained, when the maximum value of the rotating speed of the fan module to be controlled, which is determined by all the PCIE equipment, is the fourth preset speed, the operation temperature of the PCIE equipment corresponding to the fourth preset speed is not less than the third alarm temperature of the PCIE equipment, so that the fan module is controlled to operate according to the fourth preset speed; when the maximum value of the speed of the fan module to be controlled to operate, which is determined by all PCIE equipment, is a third preset speed, the fan module is controlled to operate according to the third preset speed; and when the maximum value of the speed of the fan module to be controlled to operate, which is determined by all PCIE equipment, is a second preset speed, controlling the fan module to operate according to the second preset speed. It should be noted that, when the fan module is adjusted according to the duty ratio, the second preset speed may be adjusted according to the duty ratio of 80% for the fan module, the third preset speed may be adjusted according to the duty ratio of 90% for the fan module, and the fourth preset speed may be adjusted according to the duty ratio of 100% for the fan module.

It should be further noted that, for the speed regulation of the rotation speed of the fan module when the operating temperature of the PCIE device is below the P alarm temperatures, the application is not particularly limited herein, and the setting is performed according to an actual speed regulation requirement, for example, the speed regulation may be performed on the rotation speed of the fan module according to a rotation speed-temperature speed regulation curve.

In addition, each PCIE device considered based on the actual application includes P alarm temperatures, and further, although some PCIE devices may include only two alarm temperatures at present, from the actual application in the future, each PCIE device includes three alarm temperatures, which is more suitable for the speed regulation requirement in the production life, and the speed regulation effect can be more accurate and better, which is also a trend of future development; if different PCIE devices include different numbers of alarm temperatures in use, only the fan module is controlled to adjust the speed according to the maximum value of the speed at which the fan module is to be controlled to operate, which is determined by each PCIE device, after the alarm temperature and the operating temperature of each PCIE device are obtained according to the logic in the present application, which is not particularly limited in this application.

Therefore, the fan module can be simply and reliably controlled to regulate the speed according to the alarm temperature and the running temperature of each PCIE device, and the speed regulation effect is better.

Referring to fig. 2, fig. 2 is a schematic structural diagram of a heat dissipation regulation system according to the present invention.

This heat dissipation regulation and control system includes:

a first obtaining unit 21, configured to obtain types and positions of M PCIE devices currently externally connected to a server in N hardware interfaces, where M is greater than or equal to 1 and less than or equal to N, and M is an integer;

a first determining unit 22, configured to determine, according to a position where each PCIE device is located, a physical link correspondingly connected between each PCIE device and the BMC;

a second determining unit 23, configured to determine, according to the type of each PCIE device, information obtaining threads that are respectively corresponding to each PCIE device and used for capturing data, where information obtaining rules of different information obtaining threads are different;

a second obtaining unit 24, configured to, for each PCIE device, obtain the alarm temperature and the operating temperature of the PCIE device through the physical link corresponding to the PCIE device according to the information obtaining rule of the information obtaining thread corresponding to the PCIE device;

and the speed regulation control unit 25 is used for controlling the fan module to regulate the speed according to the alarm temperature and the operating temperature of each PCIE device.

For the introduction of the heat dissipation regulation and control system provided in the present invention, reference is made to the embodiments of the heat dissipation regulation and control method described above, and details are not repeated here.

Referring to fig. 3, fig. 3 is a schematic structural diagram of a heat dissipation control device according to the present invention.

This heat dissipation regulation and control device includes:

a memory 31 for storing a computer program;

and a processor 32 for executing the steps of the heat dissipation regulation method.

For the introduction of the heat dissipation control device provided in the present invention, please refer to the embodiment of the heat dissipation control method, which is not described herein again.

The invention also provides a server which comprises the BMC, the fan module, the N hardware interfaces for externally connecting the PCIE equipment and the heat dissipation regulation and control device.

For the introduction of the server provided in the present invention, please refer to the above embodiments of the heat dissipation control method, which are not described herein again.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.

It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation regulation and control method is characterized by being applied to a BMC in a server, wherein the server further comprises a fan module and N hardware interfaces for being externally connected with PCIE equipment, N is not less than 1 and is an integer, and the heat dissipation regulation and control method comprises the following steps:

acquiring types of M PCIE equipment currently and externally connected with the server and positions of the M PCIE equipment in N hardware interfaces, wherein M is more than or equal to 1 and less than or equal to N, and M is an integer;

2. The method according to claim 1, wherein obtaining types of M PCIE devices externally connected to the server and positions of the M PCIE devices in the N hardware interfaces includes:

3. The method according to claim 1, wherein determining the physical link, which is correspondingly connected between each PCIE device and the BMC, according to the location of each PCIE device comprises:

4. The method according to claim 1, wherein the information acquisition thread is a II2C information acquisition thread or a PCIE information acquisition thread.

5. The method according to claim 1, wherein, for each PCIE device, after acquiring the alarm temperature and the operating temperature of the PCIE device through the physical link corresponding to the PCIE device according to an information acquisition rule of an information acquisition thread corresponding to the PCIE device, the method further includes:

6. The method according to claim 1, wherein the prompt module is a display module.

7. The heat dissipation regulation and control method of any one of claims 1 to 6, wherein the alarm temperatures include P alarm temperatures, where P is greater than or equal to 1 and P is an integer, and when P is greater than 1, the jth alarm temperature is less than the jth +1 th alarm temperature, j is greater than or equal to 1 and less than or equal to P-1 and j is an integer;

when P is equal to 1 and the operating temperature is greater than or equal to the alarm temperature, determining that the ith PCIE equipment is to control the fan module to operate at a first preset speed;

when P is more than 1 and the operation temperature is less than or equal to the jth alarm temperature and less than the jth +1 alarm temperature, determining that the ith PCIE equipment is to operate at a preset speed of j + 1;

8. A heat dissipation regulation system, comprising:

9. A heat dissipation modulating device, comprising:

a memory for storing a computer program;

a processor for performing the steps of the method of any of claims 1 to 7.

10. A server, comprising a BMC, a fan module, N hardware interfaces for external PCIE devices, and the heat dissipation control apparatus according to claim 9.