CN114489292B - Heat dissipation regulation and control method, system, device and server - Google Patents

Heat dissipation regulation and control method, system, device and server Download PDF

Info

Publication number
CN114489292B
CN114489292B CN202210043942.2A CN202210043942A CN114489292B CN 114489292 B CN114489292 B CN 114489292B CN 202210043942 A CN202210043942 A CN 202210043942A CN 114489292 B CN114489292 B CN 114489292B
Authority
CN
China
Prior art keywords
pcie
pcie device
temperature
server
information acquisition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202210043942.2A
Other languages
Chinese (zh)
Other versions
CN114489292A (en
Inventor
刘永敬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Inspur Intelligent Technology Co Ltd
Original Assignee
Suzhou Inspur Intelligent Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Inspur Intelligent Technology Co Ltd filed Critical Suzhou Inspur Intelligent Technology Co Ltd
Priority to CN202210043942.2A priority Critical patent/CN114489292B/en
Publication of CN114489292A publication Critical patent/CN114489292A/en
Application granted granted Critical
Publication of CN114489292B publication Critical patent/CN114489292B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a heat dissipation regulation and control method, a system, a device and a server, wherein the type of M PCIE devices currently externally connected with the server and the positions of the M PCIE devices in N hardware interfaces are obtained, physical links correspondingly connected between each PCIE device and a BMC are determined according to the positions, information obtaining threads corresponding to each PCIE device are determined according to the types, so that for each PCIE device, the BMC obtains alarm temperature and operation temperature of each PCIE device through the physical links corresponding to the PCIE device according to information obtaining rules of the information obtaining threads corresponding to the PCIE device, and finally controls a fan module to regulate speed according to the alarm temperature and the operation temperature of each PCIE device. Compared with the prior art, the scheme does not need to pre-establish the temperature regulation table in the firmware of the BMC, solves the problems of firmware update required to be carried out due to maintenance of the temperature regulation table and firmware update carried out by a client, is convenient for the client to use and avoids the waste of human resources.

Description

Heat dissipation regulation and control method, system, device and server
Technical Field
The present invention relates to the field of heat dissipation control, and in particular, to a method, a system, a device, and a server for controlling heat dissipation.
Background
The server includes PCIE devices (Peripheral Component Interconnect Express, high-speed serial computer expansion bus standard) for implementing different functions, such as a CPU, a network card, etc., if the temperatures of these devices are too high, the devices may not work, and further affect the working performance and market competitiveness of the server, so in order to implement temperature control of each device in the server, the BMC (Baseboard Management Controller ) may perform corresponding control on the fan module according to the temperature adjustment point of the device. Different PCIE devices have different temperature adjusting points, and the same PCIE device from different manufacturers also has different temperature adjusting points, if one temperature adjusting point is set at will for different devices, namely, the wind power blown by a fan is the same for each device, which leads to redundancy of heat dissipation for some devices, namely, the rotating speed of the fan is too high and the power consumption is too high; for some devices, the heat dissipation is insufficient, i.e., the device is likely to be scrapped due to excessive temperature.
Therefore, in the prior art, a temperature adjustment table is built for the temperature adjustment points of different PCIE devices according to different manufacturers in advance, and the temperature adjustment table is stored in firmware of the BMC, so that the BMC obtains the temperature adjustment points and performs wind speed control of a subsequent fan module. However, the method has the defect that the PCIE equipment accessed to the server at each time has temperature regulation information of the PCIE equipment and the manufacturer, otherwise, the BMC regulates the speed of the fan according to a default temperature regulation point, so that the speed regulation result is very inaccurate, and the heat dissipation of the PCIE equipment cannot be accurately realized; and if the information is required to be added in the temperature adjustment table, the firmware of the BMC needs to be updated again and released, and the client needs to carry out corresponding firmware updating, so that the client is inconvenient to use and the related maintenance and updating are wasted.
Disclosure of Invention
The invention aims to provide a heat dissipation regulation and control method, a system, a device and a server, which do not need to pre-establish a temperature regulation table in firmware of a BMC, solve the problems of firmware update required by maintaining the temperature regulation table and corresponding firmware update required by a client in the prior art, are convenient for the client to use, and avoid the waste of human resources for upgrading and maintaining.
In order to solve the technical problems, the invention provides a heat dissipation regulation and control method, which is applied to a BMC in a server, wherein the server also comprises a fan module and N hardware interfaces for externally connecting PCIE equipment, N is more than or equal to 1, N is an integer, and the heat dissipation regulation and control method comprises the following steps:
acquiring the types of M PCIE devices currently externally connected with the server and the positions of the M PCIE devices in N hardware interfaces, wherein M is more than or equal to 1 and less than or equal to N, and M is an integer;
determining physical links correspondingly connected between each PCIE device and the BMC according to the positions of the PCIE devices;
determining information acquisition threads which are respectively corresponding to the PCIE devices and used for capturing data according to the types of the PCIE devices, wherein the information acquisition rules of different information acquisition threads are different;
for each PCIE device, acquiring the alarm temperature and the running temperature of the PCIE device through the physical link corresponding to the PCIE device according to the information acquisition rule of the information acquisition thread corresponding to the PCIE device;
and controlling the fan module to regulate the speed according to the alarm temperature and the running temperature of each PCIE device.
Preferably, the obtaining the type of the M PCIE devices and the positions of the M PCIE devices in the N hardware interfaces, where the PCIE devices are currently connected to the server includes:
and acquiring the types of M PCIE devices which are externally connected with the server and the positions of the M PCIE devices in N hardware interfaces from a nonvolatile storage medium of the server.
Preferably, determining, according to the location of each PCIE device, a physical link corresponding to the connection between each PCIE device and the BMC includes:
and determining the physical links correspondingly connected between each PCIE device and the BMC from the interface-link corresponding relations pre-stored in the nonvolatile storage medium of the server according to the positions of the PCIE devices.
Preferably, the information obtaining thread is a II2C information obtaining thread or a PCIE information obtaining thread.
Preferably, for each PCIE device, after acquiring the alarm temperature and the running temperature of the PCIE device through the physical link corresponding to the PCIE device according to an information acquisition rule of an information acquisition thread corresponding to the PCIE device, the method further includes:
and the control prompt module prompts the alarm temperature and the running temperature of each PCIE device.
Preferably, the prompting module is a display module.
Preferably, the alarm temperatures comprise P alarm temperatures, wherein P is more than or equal to 1 and P is an integer, and when P is more than 1, j is less than j+1st alarm temperature, 1 is more than or equal to j and less than or equal to P-1 and j is an integer;
controlling the fan module to regulate speed according to the alarm temperature and the running temperature of each PCIE device, including:
for the ith PCIE device, 1.ltoreq.i.ltoreq.M, i being an integer, the following steps are executed:
when p=1 and the running temperature is not less than the alarm temperature, determining that the ith PCIE equipment is to control the fan module to run at a first preset speed;
when P is more than 1 and the j-th alarm temperature is less than or equal to the operation temperature and less than the j+1-th alarm temperature, determining that the ith PCIE equipment is to operate at the j+1-th preset speed;
when P is more than 1 and the running temperature is more than or equal to the P-th alarm temperature, determining that the ith PCIE equipment is to run at a j+2-th preset speed, wherein the j+1-th preset speed is less than the j+2-th preset speed;
and controlling the fan module to regulate the speed according to the maximum value of the speed to be controlled for the operation of the fan module determined by each PCIE device.
In order to solve the technical problem, the invention also provides a heat dissipation regulation and control system, which comprises:
the first acquisition unit is used for acquiring the types of M PCIE devices currently externally connected with the server and the positions of the M PCIE devices in N hardware interfaces, wherein M is more than or equal to 1 and less than or equal to N, and M is an integer;
the first determining unit is used for determining physical links correspondingly connected between each PCIE device and the BMC according to the positions of the PCIE devices;
the second determining unit is used for determining information acquisition threads which are respectively corresponding to the PCIE equipment and used for capturing data according to the type of the PCIE equipment, wherein the information acquisition rules of different information acquisition threads are different;
the second obtaining unit is configured to obtain, for each PCIE device, an alarm temperature and an operating temperature of the PCIE device through the physical link corresponding to the PCIE device according to an information obtaining rule of an information obtaining thread corresponding to the PCIE device;
and the speed regulation control unit is used for controlling the fan module to regulate speed according to the alarm temperature and the running temperature of each PCIE device.
In order to solve the technical problem, the invention also provides a heat dissipation regulation device, which comprises:
a memory for storing a computer program;
and the processor is used for executing the steps of the heat dissipation regulation and control method.
In order to solve the technical problems, the invention also provides a server which comprises a BMC, a fan module, N hardware interfaces for externally connecting PCIE equipment and the heat dissipation regulation and control device.
The invention provides a heat dissipation regulation and control method, a system, a device and a server, wherein the scheme firstly acquires the types of M PCIE devices currently externally connected with the server and the positions of the M PCIE devices in N hardware interfaces, then determines physical links correspondingly connected between each PCIE device and a BMC according to the positions, determines information acquisition threads respectively corresponding to each PCIE device and used for capturing data according to the types, and then for each PCIE device, the BMC acquires alarm temperature and operation temperature of each PCIE device through a physical link corresponding to the PCIE device according to information acquisition rules of the information acquisition threads corresponding to the PCIE device, and finally controls a fan module to regulate speed according to the alarm temperature and the operation temperature of each PCIE device. Compared with the prior art, the scheme can determine the alarm temperature and the running temperature of each PCIE device and regulate the speed of the fan module according to the alarm temperature and the running temperature without pre-establishing a temperature regulation table in firmware of the BMC, solves the problems of firmware update required to be performed and corresponding firmware update required to be performed by a client due to maintaining the temperature regulation table in the prior art, is convenient for the use of the client, and avoids the waste of human resources for upgrading and maintaining.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required in the prior art and the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a heat dissipation control method provided by the invention;
fig. 2 is a schematic structural diagram of a heat dissipation control system according to the present invention;
fig. 3 is a schematic structural diagram of a heat dissipation adjusting device according to the present invention.
Detailed Description
The core of the invention is to provide a heat dissipation regulation and control method, a system, a device and a server, a temperature regulation table is not required to be established in firmware of a BMC in advance, the problems of firmware update required by maintaining the temperature regulation table and corresponding firmware update required by a client in the prior art are solved, the use by the client is convenient, and the waste of human resources for upgrading and maintaining is avoided.
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, fig. 1 is a flowchart of a heat dissipation adjusting method according to the present invention.
The heat dissipation regulation and control method is applied to BMC in a server, the server further comprises a fan module and N hardware interfaces for externally connecting PCIE equipment, N is more than or equal to 1, N is an integer, and the heat dissipation regulation and control method comprises the following steps:
s11: obtaining the types and the positions of M PCIE devices currently externally connected with a server in N hardware interfaces, wherein M is more than or equal to 1 and less than or equal to N, and M is an integer;
s12: determining physical links correspondingly connected between each PCIE device and the BMC according to the positions of the PCIE devices;
s13: determining information acquisition threads which are respectively corresponding to each PCIE device and used for capturing data according to the type of each PCIE device, wherein the information acquisition rules of different information acquisition threads are different;
s14: for each PCIE device, acquiring the alarm temperature and the running temperature of the PCIE device through a physical link corresponding to the PCIE device according to an information acquisition rule of an information acquisition thread corresponding to the PCIE device;
s15: and controlling the fan module to regulate the speed according to the alarm temperature and the running temperature of each PCIE device.
In this embodiment, considering that in the prior art, a temperature adjustment table established according to different manufacturers and for temperature adjustment points of different PCIE devices needs to be stored in firmware of the BMC in advance, if the currently external PCIE device is not in the temperature adjustment table, the BMC adjusts the speed of the fan according to a default temperature adjustment point, so that the speed adjustment result is inaccurate; if the information is required to be added in the temperature regulation table, the firmware needs to be updated again and released, and then the corresponding firmware is updated by the client, so that the follow-up maintenance and the use of the client are inconvenient. In order to solve the technical problems, the invention provides a heat dissipation regulation method which can dynamically adapt to heat dissipation strategies according to different external PCIE devices.
Specifically, the N hardware interfaces are used for accessing various PCIE devices, and the fan module is used for dissipating heat, so in this scheme, the type of M PCIE devices currently externally connected to the server and the positions of the M PCIE devices in the N hardware interfaces are first obtained, where the PCIE devices may be network cards or RAIDs (Redundant Arrays of Independent Disks, disk arrays), and the application is not limited in particular herein; then, determining physical links correspondingly connected between each PCIE device and the BMC according to the positions of the PCIE devices; determining information acquisition threads which are respectively corresponding to the PCIE devices and used for capturing data according to the types of the PCIE devices, wherein the information acquisition threads can be II2C information acquisition threads or PCIE information acquisition threads, and specifically adopting which information acquisition threads are related to the types of the PCIE devices; then, for each PCIE device, according to the information acquisition rule of the information acquisition thread corresponding to the PCIE device, acquiring the alarm temperature and the operation temperature of the PCIE device through the physical link corresponding to the PCIE device, and dynamically acquiring the alarm temperature and the operation temperature of each PCIE device; and finally, controlling the fan module to regulate the speed according to the alarm temperature and the running temperature of each PCIE device.
In summary, compared with the prior art, the heat dissipation regulation and control method has the advantages that the temperature regulation table is not required to be established in the firmware of the BMC in advance, the alarm temperature and the running temperature of each PCIE device can be dynamically determined, the fan module can be regulated accordingly, the problems of firmware update required to be carried out due to maintenance of the temperature regulation table and corresponding firmware update required to be carried out by a client in the prior art are solved, the use of the client is facilitated, and the waste of human resources for upgrading and maintenance is avoided.
Based on the above embodiments:
as a preferred embodiment, obtaining the types and the positions of M PCIE devices externally connected to the current server in N hardware interfaces includes:
and acquiring the types of M PCIE devices externally connected with the current server and the positions of the M PCIE devices in N hardware interfaces from a nonvolatile storage medium of the server.
In the present application, the types of M PCIE devices externally connected to the current server and the positions of the M PCIE devices in the N hardware interfaces may be directly obtained from a nonvolatile storage medium (i.e., a memory) of the server, and it should be noted that, if the server stores in advance the types of M PCIE devices externally connected to the current server and the positions of M PCIE devices in the N hardware interfaces in other memories, the BMC only needs to perform data capturing from the other memories, which is not limited in this application.
Therefore, the type of M PCIE devices externally connected with the current server and the positions of the M PCIE devices in N hardware interfaces can be simply and reliably obtained directly in the mode, so that follow-up actions can be realized.
As a preferred embodiment, determining, according to a location where each PCIE device is located, a physical link corresponding to a connection between each PCIE device and the BMC includes:
and determining the physical links correspondingly connected between each PCIE device and the BMC from the interface-link corresponding relations pre-stored in the nonvolatile storage medium of the server according to the positions of the PCIE devices.
In this embodiment, considering that, for N hardware interfaces, an interface-link correspondence is pre-stored in a nonvolatile storage medium in a server, where the interface-link correspondence includes physical link information corresponding to each hardware interface by a BMC, therefore, in this application, a physical link corresponding to a connection between each PCIE device and the BMC may be determined from the interface-link correspondence pre-stored in the nonvolatile storage medium of the server according to a location where each PCIE device is located, and the implementation method is simple and reliable.
As a preferred embodiment, the information acquiring thread is a II2C information acquiring thread or a PCIE information acquiring thread.
In this embodiment, considering that when the types of external PCIE devices are different, the information acquiring threads for capturing data to be loaded are also different, therefore, in this application, the information acquiring threads for capturing data corresponding to each PCIE device respectively are required to be determined according to the type of each PCIE device, and the information acquiring rules of the different information acquiring threads are different, where the information acquiring threads may be II2C information acquiring threads or PCIE information acquiring threads, and the data may be simply and effectively captured according to the type of each PCIE device to implement information monitoring.
As a preferred embodiment, for each PCIE device, after obtaining the alarm temperature and the running temperature of the PCIE device through the physical link corresponding to the PCIE device according to the information obtaining rule of the information obtaining thread corresponding to the PCIE device, the method further includes:
the control prompt module prompts the alarm temperature and the running temperature of each PCIE device.
In this embodiment, in order to more intuitively display the alarm temperature and the operation temperature of each PCIE device, after the alarm temperature and the operation temperature of the PCIE device are obtained through the physical link corresponding to the PCIE device according to the information obtaining rule of the information obtaining thread corresponding to the PCIE device in this application, the processor may also control the prompting module to prompt the alarm temperature and the operation temperature of each PCIE device, so that the display is more intuitive, and a developer or a user is convenient to master the alarm temperature and the operation temperature of each PCIE device and perform subsequent processing and the like.
As a preferred embodiment, the prompt module is a display module.
In the application, the prompt module can be a display module for directly displaying the alarm temperature and the running temperature of each PCIE device, so that the display is more visual; it should be noted that, the prompt module here may also be a voice module, and the alarm temperature and the running temperature of each PCIE device are directly displayed in a voice broadcast mode, which is not limited herein.
As a preferred embodiment, the alarm temperatures comprise P alarm temperatures, wherein P is more than or equal to 1 and P is an integer, and when P is more than 1, the jth alarm temperature is less than the jth+1th alarm temperature, 1 is less than or equal to j is less than or equal to P-1 and j is an integer;
controlling the fan module to regulate speed according to the alarm temperature and the running temperature of each PCIE device comprises the following steps:
for the ith PCIE device, 1.ltoreq.i.ltoreq.M and i is an integer, the following steps are performed:
when P=1 and the running temperature is more than or equal to the alarm temperature, determining that the ith PCIE equipment is to control the fan module to run at a first preset speed;
when P is more than 1 and the j-th alarm temperature is less than or equal to the operation temperature less than the j+1-th alarm temperature, determining that the i-th PCIE equipment is to operate at the j+1-th preset speed;
when P is more than 1 and the running temperature is more than or equal to the P-th alarm temperature, determining that the ith PCIE equipment is to run at a j+2 preset speed, wherein the j+1 preset speed is less than the j+2 preset speed;
and the control fan module adjusts the speed according to the maximum value of the speed of the fan module to be controlled, which is determined by each PCIE device.
In this embodiment, considering that each PCIE device includes P alert temperatures, in order to finally determine the rotational speed of the fan module, it is necessary to determine that each PCIE device is to control the rotational speed of the fan module first, so, for the ith PCIE device, when p=1 and the running temperature is not less than the alert temperature, it is described that the PCIE device includes only one alert temperature, and then it is determined that the ith PCIE device is to control the fan module to run at the first preset speed, and it is described that a specific value of the first preset speed is not limited, and the method is set according to actual needs and accords with the control logic;
when P is more than 1 and the j-th alarm temperature is less than or equal to the operation temperature less than the j+1-th alarm temperature, determining that the i-th PCIE equipment is to operate at the j+1-th preset speed; when P is more than 1 and the running temperature is more than or equal to the P-th alarm temperature, determining that the ith PCIE equipment is to run according to the j+2 preset speed, wherein the j+1 preset speed is less than the j+2 preset speed. After the rotational speeds of the fan modules to be controlled by the PCIE equipment are obtained, the BMC controls the fan modules to carry out speed regulation according to the maximum value of the speeds of the fan modules to be controlled, which are determined by the PCIE equipment.
Specifically, taking p=3 as an example for illustration, each PCIE device includes three alarm temperatures, and the first alarm temperature is less than the second alarm temperature and less than the third alarm temperature, so when the first alarm temperature is less than or equal to the operation temperature and less than the second alarm temperature, it is determined that the ith PCIE device intends to control the fan module to operate at the second preset speed; when the second alarm temperature is less than or equal to the operation temperature and less than the third alarm temperature, determining that the ith PCIE equipment is to control the fan module to operate at a third preset speed; when the running temperature is greater than or equal to the third alarm temperature, determining that the ith PCIE equipment is to control the fan module to run at a fourth preset speed, wherein the second preset speed is less than the third preset speed and less than the fourth preset speed. It should be noted that relational terms such as first and second, third, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. After the rotational speeds of the fan modules to be controlled by each PCIE device are obtained, when the maximum value of the speeds determined by all PCIE devices to be controlled by the fan modules to be controlled is the fourth preset speed, it is indicated that the operating temperature of the PCIE device corresponding to the fourth preset speed is not less than the third alarm temperature of the PCIE device, so that the fan modules are controlled to operate according to the fourth preset speed; when the maximum value of the speeds of the fan modules to be controlled determined by all PCIE equipment is a third preset speed, controlling the fan modules to operate according to the third preset speed; and when the maximum value of the speeds of the fan modules to be controlled, which are determined by all PCIE equipment, is a second preset speed, controlling the fan modules to operate according to the second preset speed. When the fan module is to be adjusted according to the duty cycle, the second preset speed may be adjusted according to 80% of the duty cycle, the third preset speed may be adjusted according to 90% of the duty cycle, and the fourth preset speed may be adjusted according to 100% of the duty cycle, which is not particularly limited herein, and may satisfy the logic requirement defined above.
It should be further noted that, for the speed regulation of the rotational speed of the fan module when the operating temperature of the PCIE device is below the P alert temperatures, the present application is not limited in particular, and may be set according to the actual speed regulation requirement, for example, the speed regulation of the rotational speed of the fan module may be performed according to a speed-temperature speed regulation curve.
In addition, each PCIE device based on practical application consideration includes P alarm temperatures, and further, although some PCIE devices may include only two alarm temperatures, in future practical application, each PCIE device includes three alarm temperatures, which is more in accordance with the requirement of speed regulation in production and life, and the speed regulation effect can be more accurate and better, which is also a trend of future development; if the system includes different numbers of alarm temperatures for different PCIE devices in use, the fan module is controlled to perform speed regulation according to the maximum value of the speed to be controlled for operation of the fan module determined by each PCIE device after the alarm temperatures and the operation temperatures of each PCIE device are obtained according to the logic in the present application, which is not particularly limited herein.
Therefore, the fan module can be controlled to regulate the speed according to the alarm temperature and the running temperature of each PCIE device in a simple and reliable mode, and the speed regulation effect is better.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a heat dissipation control system according to the present invention.
This heat dissipation regulation and control system includes:
the first obtaining unit 21 is configured to obtain types of M PCIE devices currently connected to the server and positions of the M PCIE devices in the N hardware interfaces, where M is greater than or equal to 1 and less than or equal to N, and M is an integer;
the first determining unit 22 is configured to determine, according to the location where each PCIE device is located, a physical link correspondingly connected between each PCIE device and the BMC;
a second determining unit 23, configured to determine, according to the type of each PCIE device, an information acquiring thread corresponding to each PCIE device, where information acquiring rules of different information acquiring threads are different;
the second obtaining unit 24 is configured to obtain, for each PCIE device, an alarm temperature and an operating temperature of the PCIE device through a physical link corresponding to the PCIE device according to an information obtaining rule of an information obtaining thread corresponding to the PCIE device;
and the speed regulation control unit 25 is used for controlling the fan module to regulate speed according to the alarm temperature and the running temperature of each PCIE device.
For the description of the heat dissipation control system provided in the present invention, reference is made to the embodiment of the heat dissipation control method, and the description is omitted herein.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a heat dissipation adjusting device according to the present invention.
This heat dissipation regulation and control device includes:
a memory 31 for storing a computer program;
a processor 32 for performing the steps of the heat dissipation regulation method as described above.
For the description of the heat dissipation adjusting device provided in the present invention, reference is made to the embodiment of the heat dissipation adjusting method, and the description is omitted herein.
The invention also provides a server, which comprises a BMC, a fan module, N hardware interfaces for externally connecting PCIE equipment, and the heat dissipation regulation and control device.
For the description of the server provided in the present invention, reference is made to the embodiments of the heat dissipation adjustment method described above, and the description thereof is omitted here.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
It should also be noted that in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative elements and steps are described above generally in terms of functionality in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (9)

1. The utility model provides a heat dissipation regulation and control method which characterized in that is applied to the BMC in the server, the server still includes fan module and is used for external PCIE equipment's N hardware interface, N is 1 or more and N is the integer, the heat dissipation regulation and control method includes:
acquiring the types of M PCIE devices currently externally connected with the server and the positions of the M PCIE devices in N hardware interfaces, wherein M is more than or equal to 1 and less than or equal to N, and M is an integer;
determining physical links correspondingly connected between each PCIE device and the BMC according to the positions of the PCIE devices;
determining information acquisition threads which are respectively corresponding to the PCIE devices and used for capturing data according to the types of the PCIE devices, wherein the information acquisition rules of different information acquisition threads are different; the information acquisition thread is a II2C information acquisition thread or a PCIE information acquisition thread;
for each PCIE device, acquiring the alarm temperature and the running temperature of the PCIE device through the physical link corresponding to the PCIE device according to the information acquisition rule of the information acquisition thread corresponding to the PCIE device;
and controlling the fan module to regulate the speed according to the alarm temperature and the running temperature of each PCIE device.
2. The heat dissipation regulation method of claim 1, wherein obtaining the type of the M PCIE devices currently connected to the server and the positions of the M PCIE devices in the N hardware interfaces comprises:
and acquiring the types of M PCIE devices which are externally connected with the server and the positions of the M PCIE devices in N hardware interfaces from a nonvolatile storage medium of the server.
3. The heat dissipation regulation method of claim 1, wherein determining a physical link corresponding to a connection between each PCIE device and the BMC according to a location where each PCIE device is located, comprises:
and determining the physical links correspondingly connected between each PCIE device and the BMC from the interface-link corresponding relations pre-stored in the nonvolatile storage medium of the server according to the positions of the PCIE devices.
4. The heat dissipation regulation method of claim 1, wherein for each PCIE device, after acquiring the alarm temperature and the running temperature of the PCIE device through the physical link corresponding to the PCIE device according to an information acquisition rule of an information acquisition thread corresponding to the PCIE device, further includes:
and the control prompt module prompts the alarm temperature and the running temperature of each PCIE device.
5. The heat dissipation control method of claim 4, wherein the prompt module is a display module.
6. The heat dissipation regulation method of any one of claims 1 to 5, wherein the alarm temperatures include P alarm temperatures, wherein P is equal to or greater than 1 and P is an integer, and when P > 1, j < j+1th alarm temperature, 1.ltoreq.j.ltoreq.p-1 and j is an integer;
controlling the fan module to regulate speed according to the alarm temperature and the running temperature of each PCIE device, including:
for the ith PCIE device, 1.ltoreq.i.ltoreq.M, i being an integer, the following steps are executed:
when p=1 and the running temperature is not less than the alarm temperature, determining that the ith PCIE equipment is to control the fan module to run at a first preset speed;
when P is more than 1 and the j-th alarm temperature is less than or equal to the operation temperature and less than the j+1-th alarm temperature, determining that the ith PCIE equipment is to control the fan module to operate at the j+1-th preset speed;
when P is more than 1 and the running temperature is more than or equal to the P-th alarm temperature, determining that the ith PCIE equipment is to control the fan module to run at a j+2-th preset speed, wherein the j+1-th preset speed is less than the j+2-th preset speed;
and controlling the fan module to regulate the speed according to the maximum value of the speed to be controlled for the operation of the fan module determined by each PCIE device.
7. The utility model provides a heat dissipation regulation and control system which characterized in that is applied to the BMC in the server, the server still includes fan module and is used for external PCIE equipment's N hardware interface, N is 1 or more and N is the integer, includes:
the first acquisition unit is used for acquiring the types of M PCIE devices currently externally connected with the server and the positions of the M PCIE devices in N hardware interfaces, wherein M is more than or equal to 1 and less than or equal to N, and M is an integer;
the first determining unit is used for determining physical links correspondingly connected between each PCIE device and the BMC according to the positions of the PCIE devices;
the second determining unit is used for determining information acquisition threads which are respectively corresponding to the PCIE equipment and used for capturing data according to the type of the PCIE equipment, wherein the information acquisition rules of different information acquisition threads are different; the information acquisition thread is a II2C information acquisition thread or a PCIE information acquisition thread;
the second obtaining unit is configured to obtain, for each PCIE device, an alarm temperature and an operating temperature of the PCIE device through the physical link corresponding to the PCIE device according to an information obtaining rule of an information obtaining thread corresponding to the PCIE device;
and the speed regulation control unit is used for controlling the fan module to regulate speed according to the alarm temperature and the running temperature of each PCIE device.
8. A heat dissipation regulation device, characterized by comprising:
a memory for storing a computer program;
a processor configured to execute the steps of the heat dissipation regulation method according to any one of claims 1 to 6.
9. The server is characterized by comprising a BMC, a fan module, N hardware interfaces for connecting PCIE equipment, and the heat dissipation regulation device according to claim 8.
CN202210043942.2A 2022-01-14 2022-01-14 Heat dissipation regulation and control method, system, device and server Active CN114489292B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210043942.2A CN114489292B (en) 2022-01-14 2022-01-14 Heat dissipation regulation and control method, system, device and server

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210043942.2A CN114489292B (en) 2022-01-14 2022-01-14 Heat dissipation regulation and control method, system, device and server

Publications (2)

Publication Number Publication Date
CN114489292A CN114489292A (en) 2022-05-13
CN114489292B true CN114489292B (en) 2023-08-04

Family

ID=81512007

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210043942.2A Active CN114489292B (en) 2022-01-14 2022-01-14 Heat dissipation regulation and control method, system, device and server

Country Status (1)

Country Link
CN (1) CN114489292B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016169222A1 (en) * 2015-04-24 2016-10-27 北京百度网讯科技有限公司 Method and device for controlling server fan of complete machine cabinet
CN106762765A (en) * 2016-12-26 2017-05-31 郑州云海信息技术有限公司 Server fan under being configured for different type board regulates and controls method and system
CN110389637A (en) * 2019-06-26 2019-10-29 苏州浪潮智能科技有限公司 A kind of automatic setting method, BMC and the server of server radiating strategy
CN113900718A (en) * 2021-09-30 2022-01-07 苏州浪潮智能科技有限公司 Method, system and device for decoupling asset information of BMC (baseboard management controller) and BIOS (basic input/output system)

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016169222A1 (en) * 2015-04-24 2016-10-27 北京百度网讯科技有限公司 Method and device for controlling server fan of complete machine cabinet
CN106762765A (en) * 2016-12-26 2017-05-31 郑州云海信息技术有限公司 Server fan under being configured for different type board regulates and controls method and system
CN110389637A (en) * 2019-06-26 2019-10-29 苏州浪潮智能科技有限公司 A kind of automatic setting method, BMC and the server of server radiating strategy
CN113900718A (en) * 2021-09-30 2022-01-07 苏州浪潮智能科技有限公司 Method, system and device for decoupling asset information of BMC (baseboard management controller) and BIOS (basic input/output system)

Also Published As

Publication number Publication date
CN114489292A (en) 2022-05-13

Similar Documents

Publication Publication Date Title
US10120676B2 (en) Method of updating baseboard management controller firmware for fan speed control
US8006112B2 (en) System and method for managing blades after a power supply unit failure
US7596687B2 (en) System and method for information handling system interoperable firmware storage
GB2432441A (en) System for managing the cooling of an information handling system by adapting the system profile when the system configuration changes
US10013261B2 (en) Techniques for managing or controlling computing devices
TW201339820A (en) Adaptive voltage scaling using a serial interface
JP2006221641A (en) Control of cooling system for computer
US20090319637A1 (en) Computer system and method for accessing system information of the computer system
CN108958429A (en) A kind of cooling control method, system and equipment and storage medium
CN108446010A (en) Information processing method and electronic equipment
CN115941464B (en) Intelligent network card power supply state control method and device, electronic equipment and storage medium
US20150120747A1 (en) Techniques for searching data associated with devices in a heterogeneous data center
CN110389637A (en) A kind of automatic setting method, BMC and the server of server radiating strategy
US20210068302A1 (en) Predictive fan control using workload profiles
CN114489292B (en) Heat dissipation regulation and control method, system, device and server
US20220066530A1 (en) Information processing apparatus and method
CN110285536A (en) A kind of control method and device of temperature control equipment
CN114510134A (en) Method, device and storage medium for adjusting single-board fan
CN109992170A (en) A kind of control method for fan and control device
CN106776227B (en) A kind of method and system for realizing different type fan intelligent recognition
CN104597983A (en) Regulation method of revolving speed of computer and mainboard system
CN114911332B (en) Method and system for regulating and controlling server fan, electronic equipment and storage medium
CN116627770A (en) Network card temperature prediction method and device, computer equipment and storage medium
CN114996096A (en) Server, and fan speed regulation method and circuit of server
CN113900718B (en) Decoupling method, system and device for BMC and BIOS asset information

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant