CN114488635A - Broken line repairing method and display panel - Google Patents
Broken line repairing method and display panel Download PDFInfo
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- CN114488635A CN114488635A CN202011270918.XA CN202011270918A CN114488635A CN 114488635 A CN114488635 A CN 114488635A CN 202011270918 A CN202011270918 A CN 202011270918A CN 114488635 A CN114488635 A CN 114488635A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
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Abstract
The invention provides a broken line repairing method and a display panel, wherein the broken line repairing method comprises the following steps: determining a pre-repair area in the display panel, arranging a repair metal lead wire without an overlapping design in the pre-repair area, and separating the repair metal lead wire and a signal wire by an insulating layer; and welding the repair metal lead and the signal wire together through the welding layer to complete the broken wire repair. The broken wire repairing method avoids the overlapping of the repaired metal lead wires, thereby eliminating parasitic capacitance, improving the repairing success rate and improving the grade of repaired products.
Description
Technical Field
The invention belongs to the technical field of display, and relates to a broken line repairing method and a display panel.
Background
The AMOLED display panel is popular with consumers because of its advantages of wide viewing angle, wide color gamut, short response time, thinness, lightness, flexibility, etc. The AMOLED display panel is not only used for small-sized consumer electronics products such as a bracelet and a mobile phone, but also gradually appears in front of consumers as more and more AMOLED screens with medium and large sizes are provided.
For a small-size mobile phone screen, a medium-size screen has more signal lines and the like, and the signal lines are longer; in the manufacturing process, the influence of particles is very large, if one signal line is damaged, the middle-sized and large-sized panels need to be scrapped, and therefore, the shipment yield of the current middle-sized and large-sized AMOLED panels is not high.
In order to improve the yield of medium and large size screens, panel enterprises have proposed repairing damaged signal lines; the repair technique needs to combine the IC function, the process is complex, and the repaired effect is not ideal due to design reasons. For example, the repair metal lead is in an overlapping design, and parasitic capacitance is generated after repair, so that the grade of the repair wire is influenced, the grade of the screen is further influenced, and even the repair fails.
Therefore, in the art, it is desired to develop a repair method that reduces the parasitic capacitance generated by repairing a metal wire and improves the success rate of repair.
Disclosure of Invention
In view of the shortcomings of the prior art, the present invention provides a method for repairing a broken line and a display panel. The broken wire repairing method avoids the overlapping of the repaired metal lead wires, thereby eliminating parasitic capacitance, improving the repairing success rate and improving the grade of repaired products.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, the present invention provides a broken wire repairing method, including:
determining a pre-repair area in the display panel, arranging a repair metal lead wire without an overlapping design in the pre-repair area, and separating the repair metal lead wire and a signal wire by an insulating layer; and welding the repair metal lead and the signal wire together through the welding layer to complete the broken wire repair.
In the invention, the repair metal lead wire without an overlapping design is arranged at the position to be repaired, so that the generation of parasitic capacitance caused by overlapping arrangement can be eliminated, the influence of the parasitic capacitance on the grade of a repair wire is eliminated, and the grade of a repair product is improved.
Preferably, the method for arranging the repair metal lead of the non-overlapping design is as follows: the IC end is led out of a repairing wire, the repairing wire is wired around the periphery of a panel display area (AA), and when the repairing metal lead in the pre-repairing area is not used, the repairing metal lead is separated from the signal wire in the plane by an insulating layer and is not conducted.
Preferably, the repair metal lead is a metal lead or a metal alloy lead;
preferably, the repair metal lead is a single layer lead or a lead comprising at least two layers;
preferably, the metal lead is a molybdenum or titanium lead;
preferably, the metal alloy lead is a titanium/aluminum/titanium alloy lead or a molybdenum/aluminum/molybdenum alloy lead.
Preferably, the material of the insulating layer is silicon oxide or silicon nitride.
Preferably, the material of the welding layer is a metal or a metal alloy.
Preferably, the material of the welding layer is any one of tungsten, molybdenum, tungsten-molybdenum alloy or silver.
Preferably, the part where the repair metal lead and the signal wire are closest to or overlap is selected, and the repair metal lead and the signal wire are welded together through the welding layer.
Preferably, the method for welding the repair metal lead and the signal wire together through the welding layer is as follows: and carrying out laser drilling on the repaired metal lead and the signal line in the pre-repaired area, then carrying out welding layer metal deposition at the laser drilling hole by using laser auxiliary film forming equipment, and welding the repaired metal lead and the signal line together through a welding layer to form a conductive path.
In the invention, the insulating layer of the repair area is removed during laser drilling, the metal of the repair lead and the signal wire is exposed, and the repair metal lead and the signal wire are welded together through the welding layer to form a conductive path.
In the present invention, the laser energy can be determined according to the machine and the thickness of the film, for example: 0.01mJ, 0.05mJ, 0.1mJ, 0.2 mJ.
Preferably, the laser wavelength is in the infrared, visible or ultraviolet wavelength band.
Preferably, the laser-drilled holes have a diameter of 2 to 20 μm, such as 2 μm, 5 μm, 8 μm, 10 μm, 13 μm, 15 μm, 18 μm or 20 μm.
In the invention, laser auxiliary film forming equipment is used for carrying out welding layer metal deposition at a laser drilling hole, a metal-containing gas source or metal solution/sol forms a metal film under the irradiation of high energy of laser, and a repairing metal lead and a signal wire are welded together through the welding layer metal film to form a conductive path.
Preferably, the thickness of the solder layer is 10nm to 1 μm, such as 15nm, 20nm, 40nm, 60nm, 80nm, 100nm, 300nm, 500nm, 800nm or 1 μm.
Preferably, the repair metal lead line width is 3-20 μm, such as 3 μm, 5 μm, 8 μm, 10 μm, 13 μm, 15 μm, 18 μm or 20 μm.
In the invention, the line width of the repair metal lead is designed within the range, so that a larger repair area can be ensured, the large repair area is beneficial to improving the welding success rate, and the welding resistance is reduced.
In another aspect, the present invention provides a display panel, which is repaired by the above-mentioned broken line repairing method.
The display panel repaired by the method can eliminate parasitic capacitance and ensure the performance and the grade of the panel.
Compared with the prior art, the invention has the following beneficial effects:
in the invention, the repair metal lead wire without an overlapping design is arranged at the position to be repaired, so that the generation of parasitic capacitance caused by overlapping arrangement can be eliminated, the influence of the parasitic capacitance on the grade of a repair wire is eliminated, and the grade of a repair product is improved.
Drawings
Fig. 1 is a schematic diagram of a repair area and a repair line arrangement in a display panel.
FIG. 2 is a schematic diagram of a repair metal lead of a non-overlapping design;
FIG. 3 is a schematic view of a repair lead separated from a signal line by an insulating layer;
FIG. 4 is a schematic illustration of laser drilling of repair metal leads and signal lines in a pre-repair area;
FIG. 5 is a schematic cross-sectional view of a repair metal lead bonded to a signal wire by a bonding layer;
FIG. 6 is a cross-sectional view of a repair metal lead and signal wire being soldered together by a solder layer;
fig. 7 is a schematic diagram of a repair metal lead of the overlay design of comparative example 1.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Example 1
In this embodiment, a broken line repairing method is provided, where the broken line repairing method includes:
determining a pre-repair area in a display panel, as shown in fig. 1, where area 1 is the pre-repair area, and arranging a repair metal lead (as shown in fig. 2) in the pre-repair area, where the repair metal lead has a width of 5 μm, and the specific arrangement method is as follows: as shown in fig. 1, a repair wire is led out from an IC terminal, and is routed around the periphery of a display area of a panel, when the repair lead of a pre-repair area is not used, the repair lead is separated from a signal line in the plane by an insulating layer and is not conducted (as shown in fig. 3), when repairing, the repair metal lead and the signal line are selected to be closest to each other, laser drilling is performed on the repair metal lead and the signal line of the pre-repair area (as shown in fig. 4), then welding layer metal deposition is performed at the laser drilling hole by using laser-assisted film forming equipment, the repair metal lead and the signal line are welded together through a welding layer (as shown in fig. 5), and the welding layer is shown in a cross-sectional view of fig. 6. The insulating layer is made of silicon oxide, the welding layer is made of tungsten, laser wavelength is an ultraviolet light waveband during laser drilling, the diameter of the laser drilling is 8 microns, and the thickness of the welding layer is 400 nm.
Example 2
In this embodiment, a method for repairing a broken wire is provided, where the method for repairing a broken wire includes:
determining a pre-repair area in a display panel, as shown in fig. 1, where area 1 is the pre-repair area, and arranging a repair metal lead (as shown in fig. 2) in the pre-repair area, where the repair metal lead has a width of 10 μm, and the specific arrangement method is as follows: as shown in fig. 1, a repair line is led out from an IC terminal, and is routed around the periphery of a display area of a panel, when the repair line in a pre-repair area is not used, the repair line is separated from a signal line in the plane by an insulating layer and is not conducted (as shown in fig. 3), when the repair line is repaired, the repair metal lead and the signal line in the pre-repair area are selected to be closest to each other, laser drilling is performed on the repair metal lead and the signal line in the pre-repair area (as shown in fig. 4), then welding layer metal deposition is performed at the laser drilling hole by using laser-assisted film forming equipment, the repair metal lead and the signal line are welded together through a welding layer (as shown in fig. 5), and the welding layer is shown in fig. 6. The insulating layer is made of silicon nitride, the welding layer is made of molybdenum, laser wavelength is an ultraviolet light waveband during laser drilling, the diameter of the laser drilling is 10 microns, and the thickness of the welding layer is 100 nm.
Example 3
In this embodiment, a broken line repairing method is provided, where the broken line repairing method includes:
determining a pre-repair area in a display panel, as shown in fig. 1, where area 1 is the pre-repair area, and arranging a repair metal lead (as shown in fig. 2) in a non-overlapping design in the pre-repair area, where the width of the repair metal lead is 15 μm, where the specific arrangement method is: as shown in fig. 1, a repair line is led out from an IC terminal, and is routed around the periphery of a display area of a panel, when the repair line in a pre-repair area is not used, the repair line is separated from a signal line in the plane by an insulating layer and is not conducted (as shown in fig. 3), when the repair line is repaired, the repair metal lead and the signal line in the pre-repair area are selected to be closest to each other, laser drilling is performed on the repair metal lead and the signal line in the pre-repair area (as shown in fig. 4), then welding layer metal deposition is performed at the laser drilling hole by using laser-assisted film forming equipment, the repair metal lead and the signal line are welded together through a welding layer (as shown in fig. 5), and the welding layer is shown in fig. 6. The insulating layer is made of silicon oxide, the welding layer is made of tungsten-molybdenum alloy, laser wavelength is an ultraviolet light waveband during laser drilling, the diameter of the laser drilling is 8 microns, and the thickness of the welding layer is 80 nm.
Example 4
In this embodiment, a broken line repairing method is provided, where the broken line repairing method includes:
determining a pre-repair area in a display panel, as shown in fig. 1, where area 1 is the pre-repair area, and arranging repair metal leads (as shown in fig. 2) in the pre-repair area, where the repair metal leads are not overlapped, and the width of the repair metal leads is 8 μm, and the specific arrangement method is as follows: as shown in fig. 1, a repair line is led out from an IC terminal, and is routed around the periphery of a display area of a panel, when the repair line in a pre-repair area is not used, the repair line is separated from a signal line in the plane by an insulating layer and is not conducted (as shown in fig. 3), when the repair line is repaired, the repair metal lead and the signal line in the pre-repair area are selected to be closest to each other, laser drilling is performed on the repair metal lead and the signal line in the pre-repair area (as shown in fig. 4), then welding layer metal deposition is performed at the laser drilling hole by using laser-assisted film forming equipment, the repair metal lead and the signal line are welded together through a welding layer (as shown in fig. 5), and the welding layer is shown in fig. 6. The material of the insulating layer is silicon oxide, the material of the welding layer is silver, the laser wavelength is an ultraviolet light waveband during laser drilling, the diameter of the laser drilling is 20 micrometers, and the thickness of the welding layer is 600 nm.
Example 5
In this embodiment, a broken line repairing method is provided, where the broken line repairing method includes:
determining a pre-repair area in a display panel, as shown in fig. 1, where area 1 is the pre-repair area, and arranging repair metal leads (as shown in fig. 2) in the pre-repair area, where the repair metal leads are not overlapped, and the width of the repair metal leads is 3 μm, and the specific arrangement method is as follows: as shown in fig. 1, a repair line is led out from an IC terminal, and is routed around the periphery of a display area of a panel, when the repair line in a pre-repair area is not used, the repair line is separated from a signal line in the plane by an insulating layer and is not conducted (as shown in fig. 3), when the repair line is repaired, the repair metal lead and the signal line in the pre-repair area are selected to be closest to each other, laser drilling is performed on the repair metal lead and the signal line in the pre-repair area (as shown in fig. 4), then welding layer metal deposition is performed at the laser drilling hole by using laser-assisted film forming equipment, the repair metal lead and the signal line are welded together through a welding layer (as shown in fig. 5), and the welding layer is shown in fig. 6. The insulating layer is made of silicon nitride, the welding layer is made of tungsten-molybdenum alloy, laser wavelength is an ultraviolet light waveband during laser drilling, the diameter of the laser drilling is 5 micrometers, and the thickness of the welding layer is 800 nm.
Example 6
In this embodiment, a broken line repairing method is provided, where the broken line repairing method includes:
determining a pre-repair area in a display panel, as shown in fig. 1, where area 1 is the pre-repair area, and arranging repair metal leads (as shown in fig. 2) in the pre-repair area, where the repair metal leads are not overlapped, and the width of the repair metal leads is 20 μm, and the specific arrangement method is as follows: as shown in fig. 1, a repair line is led out from an IC terminal, and is routed around the periphery of a display area of a panel, when the repair line in a pre-repair area is not used, the repair line is separated from a signal line in the plane by an insulating layer and is not conducted (as shown in fig. 3), when the repair line is repaired, the repair metal lead and the signal line in the pre-repair area are selected to be closest to each other, laser drilling is performed on the repair metal lead and the signal line in the pre-repair area (as shown in fig. 4), then welding layer metal deposition is performed at the laser drilling hole by using laser-assisted film forming equipment, the repair metal lead and the signal line are welded together through a welding layer (as shown in fig. 5), and the welding layer is shown in fig. 6. The insulating layer is made of silicon nitride, the welding layer is made of silver, laser wavelength is an ultraviolet light waveband during laser drilling, the diameter of the laser drilling is 2 micrometers, and the thickness of the welding layer is 1 micrometer.
Comparative example 1
In this comparative example, unlike example 1, an overlapping repair lead design as shown in fig. 7, i.e., a repair lead overlapping a signal lead, was employed. The arrangement can generate parasitic capacitance, influence the grade of a repair line, further influence the grade of a screen, and even cause repair failure.
The applicant states that the present invention is illustrated by the above examples of the process of the present invention, but the present invention is not limited to the above process steps, i.e. it is not meant that the present invention must rely on the above process steps to be carried out. It will be apparent to those skilled in the art that any modification of the present invention, equivalent substitutions of selected materials and additions of auxiliary components, selection of specific modes and the like, which are within the scope and disclosure of the present invention, are contemplated by the present invention.
Claims (10)
1. A broken wire repairing method is characterized by comprising the following steps:
determining a pre-repair area in the display panel, arranging a repair metal lead wire without overlapping design in the pre-repair area, and separating the repair metal lead wire and a signal wire by an insulating layer; and welding the repair metal lead and the signal wire together through the welding layer to finish the broken wire repair.
2. The method for repairing a broken wire according to claim 1, wherein the method for arranging the repairing metal lead of the non-overlapping design is as follows: the IC end is led out to repair wires which are arranged around the periphery of the display area of the panel, and when the repair metal lead wires in the pre-repair area are not used, the repair metal lead wires are separated from the signal wires in the plane by an insulating layer and are not conducted.
3. The broken wire repairing method according to claim 1 or 2, wherein the repairing metal lead is a metal lead or a metal alloy lead;
preferably, the repair metal lead is a single layer lead or a lead comprising at least two layers;
preferably, the metal lead is a molybdenum or titanium lead;
preferably, the metal alloy lead is a titanium/aluminum/titanium alloy lead or a molybdenum/aluminum/molybdenum alloy lead.
4. The method according to any one of claims 1 to 3, wherein the insulating layer is made of silicon oxide or silicon nitride.
5. The method for repairing a broken wire according to any one of claims 1 to 4, wherein a material of the welding layer is a metal or a metal alloy.
6. The method for repairing a broken wire according to any one of claims 1 to 5, wherein a material of the welding layer is any one of tungsten, molybdenum, a tungsten-molybdenum alloy, or silver.
7. The method for repairing a broken wire according to any one of claims 1 to 6, wherein a portion where the repair metal lead and the signal line are closest to each other or overlap is selected, and the repair metal lead and the signal line are soldered together by a solder layer.
8. The broken wire repairing method according to any one of claims 1 to 7, wherein the method of soldering the repairing metal lead and the signal wire together by the soldering layer is: laser drilling is carried out on the repaired metal lead and the signal line in the pre-repaired area, then welding layer metal deposition is carried out at the laser drilling position by using laser auxiliary film forming equipment, and the repaired metal lead and the signal line are welded together through a welding layer to form a conductive path;
preferably, the laser wavelength during laser drilling is in an infrared, visible or ultraviolet light band;
preferably, the diameter of the laser drilling is 2-20 μm;
preferably, the thickness of the solder layer is 10nm to 1 μm.
9. The broken wire repairing method according to any one of claims 1 to 8, wherein the line width of the repairing metal lead is 3 to 20 μm.
10. A display panel repaired by the disconnection repairing method according to any one of claims 1 to 9.
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| CN202011270918.XA CN114488635A (en) | 2020-11-13 | 2020-11-13 | Broken line repairing method and display panel |
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010058158A (en) * | 1999-12-24 | 2001-07-05 | 박종섭 | Lcd panel having redundancy line for data line open repair |
| CN101592797A (en) * | 2008-05-27 | 2009-12-02 | 上海广电Nec液晶显示器有限公司 | Liquid crystal indicator and restorative procedure |
| CN202093287U (en) * | 2011-04-01 | 2011-12-28 | 京东方科技集团股份有限公司 | Liquid crystal display device and liquid crystal displayer |
| CN103278987A (en) * | 2013-05-24 | 2013-09-04 | 京东方科技集团股份有限公司 | Array substrate, repair method for broken lines of array substrate and display device |
| CN104637436A (en) * | 2013-11-06 | 2015-05-20 | 乐金显示有限公司 | Organic light emitting display device and method of manufacturing the same |
| CN105786253A (en) * | 2016-02-29 | 2016-07-20 | 上海中航光电子有限公司 | Array substrate, display panel, touch center coordinate determination method and display device |
| CN109154729A (en) * | 2016-10-10 | 2019-01-04 | 京东方科技集团股份有限公司 | The restorative procedure of display panel and its signal wire, display device |
| CN109375395A (en) * | 2018-11-20 | 2019-02-22 | 深圳市华星光电技术有限公司 | Broken wire repair method |
| CN109445212A (en) * | 2018-12-12 | 2019-03-08 | 惠科股份有限公司 | Display device, repairing method thereof and display |
| CN208937877U (en) * | 2018-11-28 | 2019-06-04 | 京东方科技集团股份有限公司 | A kind of array substrate, display panel and display device |
| CN110456583A (en) * | 2019-06-11 | 2019-11-15 | 惠科股份有限公司 | Display panel, repairing method thereof and display device |
-
2020
- 2020-11-13 CN CN202011270918.XA patent/CN114488635A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010058158A (en) * | 1999-12-24 | 2001-07-05 | 박종섭 | Lcd panel having redundancy line for data line open repair |
| CN101592797A (en) * | 2008-05-27 | 2009-12-02 | 上海广电Nec液晶显示器有限公司 | Liquid crystal indicator and restorative procedure |
| CN202093287U (en) * | 2011-04-01 | 2011-12-28 | 京东方科技集团股份有限公司 | Liquid crystal display device and liquid crystal displayer |
| CN103278987A (en) * | 2013-05-24 | 2013-09-04 | 京东方科技集团股份有限公司 | Array substrate, repair method for broken lines of array substrate and display device |
| CN104637436A (en) * | 2013-11-06 | 2015-05-20 | 乐金显示有限公司 | Organic light emitting display device and method of manufacturing the same |
| CN105786253A (en) * | 2016-02-29 | 2016-07-20 | 上海中航光电子有限公司 | Array substrate, display panel, touch center coordinate determination method and display device |
| CN109154729A (en) * | 2016-10-10 | 2019-01-04 | 京东方科技集团股份有限公司 | The restorative procedure of display panel and its signal wire, display device |
| CN109375395A (en) * | 2018-11-20 | 2019-02-22 | 深圳市华星光电技术有限公司 | Broken wire repair method |
| CN208937877U (en) * | 2018-11-28 | 2019-06-04 | 京东方科技集团股份有限公司 | A kind of array substrate, display panel and display device |
| CN109445212A (en) * | 2018-12-12 | 2019-03-08 | 惠科股份有限公司 | Display device, repairing method thereof and display |
| CN110456583A (en) * | 2019-06-11 | 2019-11-15 | 惠科股份有限公司 | Display panel, repairing method thereof and display device |
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