CN114473127B - Welding and clamping device for high-density flying probe test dense needle seat and circuit board - Google Patents
Welding and clamping device for high-density flying probe test dense needle seat and circuit board Download PDFInfo
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- CN114473127B CN114473127B CN202210247862.9A CN202210247862A CN114473127B CN 114473127 B CN114473127 B CN 114473127B CN 202210247862 A CN202210247862 A CN 202210247862A CN 114473127 B CN114473127 B CN 114473127B
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- circuit board
- seat
- clamping
- liquid cooling
- clamping part
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Abstract
The invention relates to a welding and clamping device for a high-density flying probe test density needle seat and a circuit board, which is used for clamping the density needle seat and the circuit board, wherein the density needle seat comprises a flying probe, a flying probe seat for fixing the flying probe, a connecting seat integrally formed with the flying probe seat, and a connecting column fixed on the connecting seat and spliced with the circuit board, and the extending direction of the flying probe seat is vertical to the extending direction of the connecting seat; the device includes a clamping portion and a cooling portion, the clamping portion including: a first clamping portion, a second clamping portion, a third clamping portion, the cooling portion comprising: the outer circulation liquid cooling mechanism, the liquid cooling cavity communicated with the outer circulation liquid cooling mechanism and the cooling liquid circulating in the outer circulation liquid cooling mechanism and the liquid cooling cavity are formed in the clamping part.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a high-density flying probe test density needle seat and circuit board welding and clamping device.
Background
When the circuit board is tested by the flying probe, whether the circuit board is short-circuited or not is tested by the probe head on the dense probe seat. As circuit boards become more and more precise, the precision between the pins used for flying probe testing also becomes higher and higher, which results in the connecting pins electrically connected to the pins also becoming more and more precise. The spliced pole of dense needle file is used for welding the dense needle file on the circuit board, and traditional has lead welding, and the dense needle file passes through reflow oven welded fastening on the circuit board, and lead-free welding has however generally replaced has lead welding, and lead-free welded temperature is higher for ambient temperature in the reflow oven is higher than in the past, and other electronic components on the circuit board can't bear the high temperature in the current reflow oven, therefore current dense needle file all is fixed on the circuit board through manual welding. However, the efficiency of manual welding is too low to meet the production requirements, so that automatic welding equipment special for welding the dense-pin base and the circuit board appears.
However, the height of the connecting column of the high-density probe is extremely small, so that the connecting column extends out after penetrating through the circuit board, the height of a welding part for soldering is smaller, once the surface of the circuit board is not smooth enough, the extremely small fall can cause that a large number of welding parts are not in line with the requirement, and the connecting column cannot be effectively welded with the circuit board. The existing automatic welding equipment special for welding the dense needle seat and the circuit board can only achieve 90% of yield at most, however, one high-density probe usually has thousands of welding points, and 10% of defective rate means that at least hundreds of welding points need to be manually repaired and welded, so that the production efficiency is seriously influenced. Meanwhile, because the connecting columns of the high-density probe are extremely dense and have extremely small spacing, poor tin connection short circuit is easily caused, and extremely high position precision is guaranteed in the clamping process of the circuit board.
Therefore, it is necessary to provide a welding and clamping device for the high-density flying probe test dense needle seat and the circuit board, which is suitable for the high-density dense needle seat, can overcome high-temperature deformation and can ensure extremely high flatness of the circuit board.
Disclosure of Invention
The invention aims to provide a welding and clamping device for a high-density flying probe test dense needle seat and a circuit board, which is suitable for the high-density dense needle seat, can overcome high-temperature deformation and can ensure extremely high flatness of the circuit board.
According to one aspect of the invention, a high-density flying probe test density needle seat and circuit board welding clamping device is provided, the device is used for clamping a density needle seat and a circuit board, the density needle seat comprises a flying probe, a flying probe seat for fixing the flying probe, a connecting seat integrally formed with the flying probe seat, and a connecting column fixed on the connecting seat and spliced with the circuit board, and the extending direction of the flying probe seat is perpendicular to the extending direction of the connecting seat; the device includes a clamping portion and a cooling portion, the clamping portion including:
the first clamping part is arranged on one side, close to the connecting seat, of the circuit board and is abutted against one end, far away from the flying needle seat, of the connecting seat;
the second clamping part is arranged on one side, away from the connecting seat, of the circuit board and is arranged at an interval with the flying probe seat, and the circuit board is clamped between the first clamping part and the second clamping part;
the third clamping part is abutted against one end, departing from the connecting seat, of the flying needle seat and comprises a flying needle positioning hole, and a flying needle of the flying needle seat is inserted into the flying needle positioning hole;
the cooling portion includes: the outer circulating liquid cooling mechanism, the liquid cooling cavity communicated with the outer circulating liquid cooling mechanism and the cooling liquid circulating in the outer circulating liquid cooling mechanism and the liquid cooling cavity are arranged in the clamping part; the first clamping portion, the second clamping portion and the third clamping portion are all made of stainless steel materials.
More preferably, the liquid cooling chamber comprises: the outer circulation liquid cooling mechanism is communicated with the first liquid cooling cavity, the second liquid cooling cavity and the third liquid cooling cavity respectively.
Preferably, the device further comprises a supporting portion arranged between the first clamping portion and the third clamping portion and respectively arranged at intervals with the first clamping portion and the third clamping portion, the supporting portion is abutted to one end, deviating from the connecting column, of the connecting seat, the liquid cooling cavity further comprises a fourth liquid cooling cavity formed in the supporting portion, the fourth liquid cooling cavity is communicated with the external circulation liquid cooling mechanism, and the supporting portion is made of stainless steel materials.
Preferably, the external circulation liquid cooling mechanism comprises a frame, a radiating pipe arranged on the frame and a water pump connected with the radiating pipe, and the water pump pushes the cooling liquid to circulate in the liquid cooling cavity and the radiating pipe.
Preferably, the circuit board comprises a board body, a connecting positioning hole penetrating through the board body and inserted into the connecting column, and a mounting positioning hole penetrating through the board body; the connecting column comprises a first fixing part fixed with the connecting seat, a first positioning part inserted in the connecting positioning hole and a welding part extending out of the circuit board.
Preferably, the first clamping portion comprises a first bottom surface deviating from one surface of the second clamping portion, the supporting portion comprises a second bottom surface deviating from one surface of the sealing needle seat, the third clamping portion comprises a third bottom surface deviating from one surface of the flying needle positioning hole along the first direction, and the first bottom surface, the second bottom surface and the third bottom surface are coplanar; the first direction is a direction approaching to/departing from one end of the connecting seat connected with the circuit board along one end of the connecting seat abutted against the supporting part.
Preferably, the connecting seat comprises a first abutting surface abutting against the first clamping part, a second abutting surface abutting against the supporting part, and a third abutting surface abutting against the circuit board; the fly needle seat includes a fourth abutment surface that abuts the third clamping portion.
Preferably, the flying needle comprises a second fixing part and a second positioning part, the second fixing part is fixed with the flying needle seat, and the second positioning part is inserted into the flying needle positioning hole; the device further comprises a first bolt, the first clamping part and the third clamping part are respectively provided with a first screw hole formed by extending along a second direction, and the first screw hole is matched with the first bolt; the first clamping part and the third clamping part clamp the sealing needle seat along the second direction through the matching of the first bolt and the first screw hole; a first central axis of the first bolt passes through a midpoint of the first abutting surface in the first direction; the second direction is a direction from the first abutting surface toward/away from the fourth abutting surface.
Preferably, the device further comprises a second bolt, the first clamping portion and the second clamping portion are respectively provided with a second screw hole formed by extending along a first direction, and the second screw hole is matched with the second bolt; the first clamping part and the second clamping part clamp the circuit board along a first direction through the matching of the second bolt and the second screw hole; the second screw hole is matched with the second bolt.
Preferably, the number of the installation positioning holes is multiple, the device further comprises a third bolt, the first clamping portion and the second clamping portion are respectively provided with a third screw hole formed by extending along a first direction, the number of the third screw holes is multiple, the number of the third screw holes corresponds to the number of the installation positioning holes, the third screw holes are arranged on the first clamping portion and the second clamping portion along a third direction, and a second central axis of each third screw hole corresponds to and coincides with a third central axis of each installation positioning hole; the third direction is perpendicular to the second direction and the first direction respectively.
The invention has the beneficial effects that:
the circuit board and the sealing needle seat are clamped through the first clamping part, the second clamping part and the third clamping part; the flying needle is inserted into the flying needle positioning hole, so that the flying needle seat is prevented from being heated and deformed in the welding process; the liquid cooling cavity is formed in the clamping part, and the cooling liquid circularly dissipates heat between the liquid cooling cavity and the external circulating liquid cooling mechanism, so that the temperature of the circuit board and the sealing needle seat in the welding process is reduced, and the welding precision of the circuit board and the sealing needle seat is prevented from being influenced by high-temperature deformation; by adopting the stainless steel as the materials of the first clamping part, the second clamping part and the third clamping part, the heat conduction effect of the liquid cooling cavity is improved by utilizing the good heat conduction performance of the stainless steel while the flatness of the clamping surface is kept by utilizing the high-strength characteristic of the stainless steel.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of the structure of the sealing pin holder of the present invention inserted on a circuit board;
FIG. 2 is a schematic structural view of the sealing needle holder of the present invention;
FIG. 3 is a schematic view of the mating structure of the first clamping portion, the second clamping portion and the third clamping portion of the present invention;
FIG. 4 is a schematic view of a mechanism on one side of a third clamping portion according to the present invention;
FIG. 5 is a schematic top view of the sealing-needle holder clamped on a circuit board according to the present invention;
FIG. 6 isbase:Sub>A schematic cross-sectional view A-A of FIG. 5;
FIG. 7 is a schematic cross-sectional view taken along line B-B in FIG. 5;
FIG. 8 is a schematic diagram of the connection of the external circulation liquid cooling structure according to the present invention;
FIG. 9 is a block diagram showing the structure of a cooling part according to the present invention;
fig. 10 is a schematic structural diagram of an external circulation liquid cooling structure according to the present invention.
F1, a first direction; f2, a second direction; f3, a third direction; 100. a device; 10. a dense needle seat; 20. a circuit board; 110. a clamping portion; 120. a cooling section; 30. a first clamping portion; 40. a second clamping portion; 50. a third clamping portion; 60. a support portion; 70. a liquid cooling chamber; 80. an external circulation liquid cooling mechanism; 90. cooling liquid; 11. flying needles; 12. a fly needle seat; 13. a connecting seat; 14. connecting columns; 131. a first abutting surface; 132. a second abutting surface; 133. a third abutting surface; 121. a fourth abutting surface; 21. connecting the positioning holes; 22. installing a positioning hole; 23. a plate body; 91. a first bolt; 92. a first screw hole; 93. a second bolt; 94. a second screw hole; 95. a third bolt; 96. a third screw hole; 111. a second fixed part; 112. a second positioning portion; 141. a first fixed part; 142. a first positioning portion; 143. welding the part; l1, a first central axis; l2 and a second central axis; l3, a third central axis; H. a midpoint; 71. a first liquid-cooled chamber; 72. a second liquid cooling chamber; 73. a third liquid cooling chamber; 74. a fourth liquid-cooled chamber; 51. positioning a flying needle hole; 81. a frame; 82. a radiating pipe; 83. a water pump;
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The invention provides a welding and clamping device for a high-density flying probe test density needle seat and a circuit board, which is used for clamping the density needle seat and the circuit board, wherein the density needle seat comprises a flying probe, a flying probe seat for fixing the flying probe, a connecting seat integrally formed with the flying probe seat, and a connecting column fixed on the connecting seat and spliced with the circuit board, and the extending direction of the flying probe seat is vertical to the extending direction of the connecting seat; the device includes a clamping portion and a cooling portion, the clamping portion including:
the first clamping part is arranged on one side of the circuit board close to the connecting seat and is abutted with one end, far away from the fly needle seat, of the connecting seat;
the second clamping part is arranged on one side, away from the connecting seat, of the circuit board and is arranged at an interval with the flying probe seat, and the circuit board is clamped between the first clamping part and the second clamping part;
the third clamping part is abutted against one end, departing from the connecting seat, of the flying needle seat and comprises a flying needle positioning hole, and a flying needle of the flying needle seat is inserted into the flying needle positioning hole;
the cooling portion includes: the outer circulating liquid cooling mechanism, the liquid cooling cavity communicated with the outer circulating liquid cooling mechanism and the cooling liquid circulating in the outer circulating liquid cooling mechanism and the liquid cooling cavity are arranged in the clamping part; the first clamping portion, the second clamping portion and the third clamping portion are all made of stainless steel materials.
In the structure, the circuit board and the sealing needle holder are clamped through the first clamping part, the second clamping part and the third clamping part; the flying needle is inserted into the flying needle positioning hole, so that the flying needle seat is prevented from being heated and deformed in the welding process; the liquid cooling cavity is formed in the clamping part, and the cooling liquid circularly dissipates heat between the liquid cooling cavity and the external circulating liquid cooling mechanism, so that the temperature of the circuit board and the sealing needle seat in the welding process is reduced, and the welding precision of the circuit board and the sealing needle seat is prevented from being influenced by high-temperature deformation; by adopting the stainless steel as the materials of the first clamping part, the second clamping part and the third clamping part, the heat conduction effect of the liquid cooling cavity is improved by utilizing the good heat conduction performance of the stainless steel while the flatness of the clamping surface is kept by utilizing the high-strength characteristic of the stainless steel.
Referring to fig. 1-10, the invention provides a clamping device 100 for welding a high-density flying probe 11 test dense-probe seat 10 and a circuit board 20,
specifically, the device 100 is used for clamping the sealed needle holder 10 and the circuit board 20 so as to facilitate the welding of the sealed needle holder 10 and the circuit board 20.
Specifically, the dense needle holder 10 is a high-density dense needle holder 10, which is soldered to the circuit board 20 and then used together with the circuit board 20 for flying needle 11 testing of other circuit boards 20.
Specifically, the sealing pin seat 10 includes a flying pin 11, a flying pin seat 12 for fixing the flying pin 11, a connection seat 13 integrally formed with the flying pin seat 12, and a connection post 14 fixed to the connection seat 13 and inserted into the circuit board 20, wherein the extending direction of the flying pin seat 12 is perpendicular to the extending direction of the connection seat 13;
specifically, the flying probe 11 is fixed on the flying probe seat 12, the connecting seat 13 is integrally formed with the flying probe seat 12, one end of the connecting column 14 is fixed with the connecting seat 13, the other end of the connecting column 14 is inserted into the circuit board 20, the connecting column 14 extends out of the circuit board 20, and the extending direction of the flying probe seat 12 is perpendicular to the extending direction of the connecting seat 13; referring to fig. 1, the extending direction of the flyer seat 12 should be understood as a first direction F1 in fig. 6, and the extending direction of the coupling seat 13 should be understood as a second direction F2 in fig. 6, so as to form an "L" shaped structure in which the extending direction of the flyer seat 12 is perpendicular to the extending direction of the coupling seat 13.
Specifically, the circuit board 20 includes a board body 23, a connection positioning hole 21 penetrating through the board body 23 and inserted into the connection post 14, and an installation positioning hole 22 penetrating through the board body 23; the connecting column 14 includes a first fixing portion 141 fixed to the connecting seat 13, a first positioning portion 142 inserted into the connecting positioning hole 21, and a soldering portion 143 protruding out of the circuit board 20.
The apparatus 100 includes a clamping portion 110 and a cooling portion 120.
The clamping portion 110 includes: a first clamping portion 30, a second clamping portion 40 and a third clamping portion 50.
Specifically, the first clamping portion 30 is disposed on one side of the circuit board 20 close to the connecting seat 13 and abuts against one end of the connecting seat 13 far away from the flying-needle seat 12; the second clamping portion 40 is disposed on a side of the circuit board 20 away from the connecting seat 13 and spaced from the femto base 12, and the circuit board 20 is clamped between the first clamping portion 30 and the second clamping portion 40; the third clamping portion 50 abuts against one end, away from the connecting seat 13, of the flying needle seat 12, and the first clamping portion 30 and the second clamping portion 40 clamp the circuit board 20 oppositely, so that the welding surface between the circuit board 20 and the dense needle seat 10 keeps high flatness, and meanwhile, the thermal deformation degree of the circuit board 20 in the first direction F1 in the welding process is reduced. The tight needle seat 10 is clamped oppositely by the first clamping part 30 and the third clamping part 50, so that the welding surface of the tight needle seat 10 and the circuit board 20 keeps higher flatness, and meanwhile, the tight needle seat 10 is prevented from being heated and deformed in the second direction F2 in the welding process.
Specifically, the third clamping portion 50 includes a flying probe positioning hole 51, and the flying probe 11 of the flying probe seat 12 is inserted into the flying probe positioning hole 51; by arranging the flying needle positioning hole 51 in the third clamping part 50 and inserting the flying needle 11 of the flying needle base 12 into the flying needle positioning hole 51, the flying needle 11 is limited by the wall of the flying needle positioning hole 51 during welding, so that the flying needle base 12 is prevented from being heated and deformed during welding.
The cooling part 120 includes: an external circulating liquid cooling mechanism 80, a liquid cooling chamber 70 communicated with the external circulating liquid cooling mechanism 80, and a cooling liquid 90 circulating in the external circulating liquid cooling mechanism 80 and the liquid cooling chamber 70, wherein the liquid cooling chamber 70 is formed in the clamping portion 110; through forming liquid cooling chamber 70 in clamping part 110, through cooling liquid 90 circulation heat dissipation between liquid cooling chamber 70 and the outer bad liquid cooling mechanism to reduce the temperature of circuit board 20 and dense needle seat 10 in the welding process, avoid circuit board 20 and dense needle seat 10 because of high temperature deformation influence welding precision.
Specifically, the first clamping portion 30, the second clamping portion 40, and the third clamping portion 50 are all made of stainless steel. By adopting stainless steel with high strength as the material of the first clamping part 30, the second clamping part 40 and the third clamping part 50, the surfaces of the first clamping part 30, the second clamping part 40 and the third clamping part 50 are ensured to be processed smoothly, and deformation after multiple welding uses is avoided. Meanwhile, the specific heat capacity of the stainless steel is 460 J.kg < -1 > K < -1 >, and the cooling cavity is formed in the clamping part 110 made of the stainless steel, so that heat generated in the welding process can be rapidly transmitted to the liquid cooling cavity 70 through the clamping part 110, and the heat is released to the air through the cooling liquid 90 in the liquid cooling cavity 70 and the external circulation cooling mechanism communicated with the liquid cooling cavity 70. Therefore, the heat conduction effect of the liquid cooling cavity 70 is improved by utilizing the good heat conduction performance of the stainless steel while the flatness of the clamping surface is kept by utilizing the high strength characteristic of the stainless steel.
More preferably, the liquid-cooling chamber 70 comprises: the outer circulation liquid cooling mechanism 80 comprises a first liquid cooling cavity 71 formed in the first clamping portion 30, a second liquid cooling cavity 72 formed in the second clamping portion 40, and a third liquid cooling cavity 73 formed in the third clamping portion 50, wherein the first liquid cooling cavity 71, the second liquid cooling cavity 72 and the third liquid cooling cavity 73 are respectively communicated with the outer circulation liquid cooling mechanism 80. In the welding process, the high temperature of the welding spot is transmitted to the first clamping part 30, the second clamping part 40 and the third clamping part 50 made of stainless steel through the circuit board 20 and the sealed needle holder 10, and then transmitted to the cooling liquid 90 through the first liquid cooling cavity 71 formed in the first clamping part 30, the second liquid cooling cavity 72 formed in the second clamping part 40 and the third liquid cooling cavity 73 formed in the third clamping part 50, the cooling liquid 90 circulates between the liquid cooling cavity 70 and the external circulation liquid cooling mechanism 80, and the heat is dissipated to the air through the external circulation liquid cooling mechanism 80, so that the influence of the high temperature of the welding spot on the circuit board 20 and the sealed needle holder 10 in the welding process is reduced, and the higher welding precision is kept.
More preferably, the device 100 further includes a supporting portion 60 disposed between the first clamping portion 30 and the third clamping portion 50 and spaced from the first clamping portion 30 and the third clamping portion 50, the supporting portion 60 abuts against an end of the connecting seat 13 deviating from the connecting post 14, the liquid cooling chamber 70 further includes a fourth liquid cooling chamber 74 formed in the supporting portion 60, the fourth liquid cooling chamber 74 is communicated with the external circulation liquid cooling mechanism 80, and the supporting portion 60 is made of stainless steel. By arranging the supporting portion 60 and the third clamping portion 50 at an interval, the supporting portion 60 is prevented from abutting against the third clamping portion 50, so that the third clamping portion 50 can completely abut against one end of the fly needle seat 12 away from the connecting seat 13. The first clamping portion 30 and the third clamping portion 50 are clamped oppositely, so that the connecting seat 13 is clamped. Meanwhile, the fourth liquid cooling cavity 74 is formed in the supporting portion 60, and the cooling liquid 90 circularly dissipates heat between the fourth liquid cooling cavity 74 and the external circulating liquid cooling mechanism, so that the temperature of the sealing needle seat 10 which is abutted to the supporting portion 60 in the welding process is reduced, and the welding precision of the sealing needle seat 10 is prevented from being influenced by high-temperature deformation.
Specifically, the external circulation liquid cooling mechanism 80 of the present invention may adopt a conventional liquid cooling mechanism in the art, and in this embodiment, the external circulation liquid cooling mechanism 80 is specifically an external circulation water cooling mechanism, and the cooling liquid 90 is water. Illustratively, the external circulation liquid cooling mechanism 80 of the present embodiment specifically includes a frame 81, a heat dissipating pipe 82 mounted on the frame 81, and a water pump 83 connected to the heat dissipating pipe 82, wherein the water pump 83 pushes a cooling liquid 90 to circulate in the liquid cooling chamber 70 and the heat dissipating pipe 82.
Preferably, the first clamping portion 30 includes a first bottom surface facing away from the second clamping portion 40, the supporting portion 60 includes a second bottom surface facing away from the sealing needle seat 10, the third clamping portion 50 includes a third bottom surface facing away from the flying needle positioning hole 51 along the first direction F1, and the first bottom surface, the second bottom surface and the third bottom surface are coplanar; the first direction F1 is a direction toward/away from an end of the connecting base 13 connected to the circuit board 20 along an end of the connecting base 13 connected to the supporting portion 60.
Preferably, the connecting seat 13 includes a first abutting surface 131 abutting against the first clamping portion 30, a second abutting surface 132 abutting against the supporting portion 60, and a third abutting surface 133 abutting against the circuit board 20; the femto base 12 includes a fourth abutment surface 121 that abuts against the third clamping portion 50. The connection seat 13 is limited in the first direction F1 by the abutment of the supporting portion 60 and the second abutting surface 132 and the abutment of the circuit board 20 and the third abutting surface 133. The connection seat 13 is limited in the second direction F2 by the abutment of the first clamping portion 30 and the first abutting surface 131 and the abutment of the third clamping portion 50 and the fourth abutting surface 121. Therefore, the tight needle holder 10 is limited in four directions, namely, a direction along one end of the connecting seat 13 abutting against the supporting portion 60 to approach one end of the connecting seat 13 abutting against the circuit board 20, a direction along one end of the connecting seat 13 abutting against the supporting portion 60 to depart from one end of the connecting seat 13 abutting against the circuit board 20, a direction along one end of the connecting seat 13 abutting against the first clamping portion 30 to approach one end of the connecting seat 13 abutting against the third clamping portion 50, and a direction along one end of the connecting seat 13 abutting against the first clamping portion 30 to depart from one end of the connecting seat 13 abutting against the third clamping portion 50, and the clamping in the second direction F2 is realized through the first bolt 91.
The device 100 further comprises a first bolt 91, the first clamping portion 30 and the third clamping portion 50 are respectively provided with a first screw hole 92 formed by extending along a second direction F2, and the first screw hole 92 is matched with the first bolt 91; the first clamping portion 30 and the third clamping portion 50 clamp the sealing seat 10 along the second direction F2 through the cooperation of the first bolt 91 and the first screw hole 92; the fly needle 11 includes a second fixing portion 111 and a second positioning portion 112, the second fixing portion 111 is fixed to the fly needle seat 12, and the second positioning portion 112 is inserted into the fly needle positioning hole 51. The first bolt 91 and the first screw hole 92 are arranged along the second direction F2 to clamp the dense needle holder 10 along the second direction F2, specifically, the first clamping portion 30 abuts against the first abutting surface 131 of the connecting seat 13, the third clamping portion 50 abuts against the fourth abutting surface 121 of the flying needle holder 12, the first abutting surface 131 and the fourth abutting surface 121 are perpendicular to the second direction F2, and the first bolt 91 and the first screw hole 92 are screwed in a matching manner to provide a screwing force along the second direction F2, and the screwing force acts on the dense needle holder 10 through the first abutting surface 131 and the fourth abutting surface 121, so that the dense needle holder 10 is clamped. Through the tight needle seat 10 tight in the clamp of second direction F2, especially tight connecting seat 13, avoid among the welding process, the high temperature conduction of solder joint is to connecting seat 13 on, lead to connecting seat 13 to produce on second direction F2 and receive thermal deformation. Meanwhile, the dense needle seat 10 is clamped in the second direction F2, so that the problem that in the welding process, the dense needle seat 10 and the circuit board 20 are displaced and dislocated in the first direction F1 to cause the connecting column 14 to be inclined and slightly deformed, and the problem that the connecting column 14 is not welded enough due to the fact that the connecting column 14 is inclined to cause the height of the welding part 143 extending out of the circuit board 20 to be uneven is avoided. Meanwhile, the tight needle seat 10 is clamped in the second direction F2, so that the flying needle seat 12 is limited from being heated and deformed along the second direction F2 due to the fact that high temperature of welding points is conducted to the flying needle seat 12 in the welding process. In the concept of the present invention, the flying needle 11 on the flying needle seat 12 is inserted into the flying needle positioning hole 51 of the third clamping portion 50 along the second direction F2, and the flying needle 11 is limited by the wall of the flying needle positioning hole 51, so that the flying needle seat 12 fixedly connected to the flying needle 11 is limited, and the flying needle seat 12 is heated and deformed along other directions perpendicular to the second direction F2 due to the high temperature of the welding spot being conducted to the flying needle seat 12 during the welding process.
Specifically, the device 100 further includes a second bolt 93, the first clamping portion 30 and the second clamping portion 40 are respectively provided with a second screw hole 94 formed to extend along the first direction F1, and the second screw hole 94 is matched with the second bolt 93; the first clamping portion 30 and the second clamping portion 40 clamp the circuit board 20 along a first direction F1 through the cooperation of the second bolt 93 and the second screw hole 94; the circuit board 20 comprises a board body 23, a connecting positioning hole 21 penetrating through the board body 23 and inserted into the connecting column 14, and a mounting positioning hole 22 penetrating through the board body 23; the device 100 further includes a third bolt 95, the first clamping portion 30 and the second clamping portion 40 are respectively provided with a plurality of third screw holes 96 extending along a first direction F1, the second screw holes 94 are matched with the second bolt 93, the number of the mounting positioning holes 22 is plural, the number of the third screw holes 96 corresponds to the number of the mounting positioning holes 22, the plurality of third screw holes 96 are arranged on the first clamping portion 30 and the second clamping portion 40 along a third direction F3, and a second central axis L2 of each third screw hole 96 corresponds to and coincides with a third central axis L3 of each mounting positioning hole 22; one surface of the circuit board 20 close to the first clamping portion 30 is abutted against the first clamping portion 30, one surface of the circuit board 20 away from the first clamping portion 30 is abutted against the second clamping portion 40, and the extending direction of the circuit board 20 is perpendicular to the first direction F1; the connecting column 14 includes a first fixing portion 141, a first positioning portion 142, and a soldering portion 143, the first fixing portion 141 is fixed to the connecting seat 13, the first positioning portion 142 is inserted into the connecting positioning hole 21, the soldering portion 143 protrudes out of the circuit board 20, and when the sealing needle holder 10 is soldered to the circuit board 20, the soldering portion 143 is soldered to a surface of the circuit board 20 away from the connecting seat 13 by solder. The second bolt 93 and the second screw hole 94 are arranged along the first direction F1 to clamp the circuit board 20 along the first direction F1, specifically, the circuit board 20 is arranged between the first clamping portion 30 and the second clamping portion 40, one surface of the circuit board 20 close to the first clamping portion 30 abuts against the first clamping portion 30, one surface of the circuit board 20 away from the first clamping portion 30 abuts against the second clamping portion 40, the extending direction of the circuit board 20 is perpendicular to the first direction F1, and the second bolt 93 and the second screw hole 94 are screwed in a matching manner to provide a screwing force along the first direction F1, and the screwing force acts on the circuit board 20 through one surface of the circuit board 20 close to the first clamping portion 30 and one surface of the circuit board 20 away from the first clamping portion 30, so as to clamp the circuit board 20. By clamping the circuit board 20 in the first direction F1, the problem of soldering supplement caused by the fact that the height of the connecting column 14 extending out of the soldering part 143 of the circuit board 20 does not meet soldering requirements due to the fact that the dense needle seat 10 and the circuit board 20 are displaced in the first direction F1 to generate a gap in the soldering process is avoided; or, the problem that the connection column 14 extends out of the uneven height of the welding part 143 of the circuit board 20, the height of part of the welding part 143 does not meet the welding requirement, and the welding is insufficient due to the fact that the sealing needle base 10 and the circuit board 20 warp in the first direction F1 is avoided. Meanwhile, the circuit board 20 is clamped in the first direction F1, the degree of thermal deformation of the circuit board 20 along the first direction F1 is limited in the welding process of the circuit board 20 due to the fact that high temperature of welding points is conducted to the circuit board 20, and the whole circuit board 20 is prevented from generating large-amplitude deformation warping. Meanwhile, by clamping the circuit board 20 in the first direction F1, the high temperature of the solder joints is isolated by the first clamping portion 30 and the second clamping portion 40, so that the high temperature is prevented from affecting other electronic components on the circuit board 20 and damaging the electronic components. Through the cooperation of the third bolt 95, the third screw hole 96 and the mounting positioning hole 22, the first clamping portion 30 and the second clamping portion 40 clamp the circuit board 20, meanwhile, through the cooperation of the mounting positioning hole 22 and the third bolt 95, the circuit board 20 is positioned, the mounting positioning hole 22 of the circuit board 20 is used for mounting and positioning with other structures during the test of the flying probe 11, in the welding process, the third bolt 95 equivalently plays a role in simulating the mounting of other structures and the circuit board 20, and therefore the position accuracy and the size of the via hole of the mounting positioning hole 22 are checked to be in accordance with requirements.
Specifically, the first central axis L1 of the first bolt 91 passes through a midpoint H of the first abutting surface 131 in the first direction F1. By arranging the first bolt 91 at a position where the first central axis L1 of the first bolt passes through the midpoint H of the first abutting surface 131 in the first direction F1, when the first bolt 91 is tightened, the tightening force acts on the midpoint H of the first abutting surface 131 in the first direction F1, so as to avoid the tightening force from generating component forces in other directions, and avoid the connecting seat 13 from warping in other directions when being clamped by the first clamping portion 30 and the third clamping portion 50, so that the connecting seat 13 maintains good flatness when being clamped by the first clamping portion 30 and the third clamping portion 50.
Further, the first bottom surface of the first clamping portion 30, the second bottom surface of the supporting portion 60, and the third bottom surface of the third clamping portion 50 are flush. The first bottom surface is a surface of the first clamping portion 30 departing from the second clamping portion 40, the second bottom surface is a surface of the supporting portion 60 departing from the connecting seat 13, and the third bottom surface is a surface of the third clamping portion 50 away from the flying-pin positioning hole 51. The first bottom surface of the first clamping portion 30, the second bottom surface of the supporting portion 60 and the third bottom surface of the third clamping portion 50 are flush with each other, so that the problem that the connecting seat 13 is warped when being inserted on the circuit board 20 due to component forces in other directions when the first bolt 91 is screwed is avoided, the connecting seat 13 can be completely abutted to the circuit board 20, and the flatness of a contact surface when the connecting seat 13 is inserted on the circuit board 20 is ensured.
Further, the apparatus 100 further includes an external circulating liquid cooling mechanism 80 and a liquid cooling chamber 70 communicating with the external circulating liquid cooling mechanism 80, wherein the external circulating liquid cooling mechanism 80 may be a conventional external circulating liquid cooling mechanism 80 in the art, and has a function of driving the cooling liquid to flow and dissipating heat during the flowing process of the cooling liquid. The liquid cooling chamber 70 comprises a first liquid cooling chamber 71 arranged in the first clamping portion 30, a second liquid cooling chamber 72 arranged in the second clamping portion 40, a third liquid cooling chamber 73 arranged in the third clamping portion 50 and a fourth liquid cooling chamber 74 arranged in the supporting portion 60, wherein the outer circulation liquid cooling mechanism 80 is respectively communicated with the first liquid cooling chamber 71, the second liquid cooling chamber 72, the third liquid cooling chamber 73 and the fourth liquid cooling chamber 74. Through adopting stainless steel material set up liquid cooling chamber 70 in first clamping part 30, second clamping part 40, third clamping part 50 and the supporting part 60, utilize the good heat conductivility of stainless steel material, conduct the heat on dense needle seat 10 and the circuit board 20 to the liquid cooling chamber 70 in, dispel the heat through extrinsic cycle liquid cooling mechanism 80 again, thereby reduce the temperature of dense needle seat 10 and circuit board 20, avoid among the welding process, because the high temperature conduction of solder joint is when dense needle seat 10 and circuit board 20, make circuit board 20 and dense needle seat 10 produce the thermal deformation, cause spliced pole 14 on dense needle seat 10 to visit the not satisfied welding requirement of weld part 143 height of circuit board 20, and the problem that the welding that leads to is insufficient. In the welding process, the sealing needle seat 10 is inserted into the circuit board 20, so that high flatness can be kept, the welding efficiency of the connecting columns 14 is guaranteed, the welding yield is improved, the number of the connecting columns 14 needing to be subjected to repair welding after automatic welding is reduced, and the production efficiency is improved.
Thereby, the clamping of the circuit board 20 and the needle holder 10 is realized through the first clamping part 30, the second clamping part 40 and the third clamping part 50; the flying needle 11 is inserted into the flying needle positioning hole 51, so that the flying needle seat 12 is prevented from being deformed by heat in the welding process; by forming the liquid cooling cavity 70 in the clamping part 110 and circularly radiating heat between the liquid cooling cavity 70 and the external circulating liquid cooling mechanism through the cooling liquid 90, the temperature of the circuit board 20 and the dense needle seat 10 in the welding process is reduced, and the welding precision of the circuit board 20 and the dense needle seat 10 is prevented from being influenced by high-temperature deformation; by using stainless steel as the material of the first clamping portion 30, the second clamping portion 40 and the third clamping portion 50, the heat conduction effect of the liquid cooling chamber 70 is improved by using the good heat conduction performance of the stainless steel while maintaining the flatness of the clamping surface by using the high-strength characteristic of the stainless steel.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (7)
1. A high-density flying probe test density needle seat and circuit board welding and clamping device is used for clamping a density needle seat and a circuit board, wherein the density needle seat comprises a flying probe, a flying probe seat for fixing the flying probe, a connecting seat integrally formed with the flying probe seat, and a connecting column fixed on the connecting seat and spliced with the circuit board, and the extending direction of the flying probe seat is vertical to the extending direction of the connecting seat; characterized in that, clamping device includes clamping part and cooling portion, clamping part includes:
the first clamping part is arranged on one side of the circuit board close to the connecting seat and is abutted with one end, far away from the fly needle seat, of the connecting seat;
the second clamping part is arranged on one side, away from the connecting seat, of the circuit board and is arranged at an interval with the flying probe seat, and the circuit board is clamped between the first clamping part and the second clamping part;
the third clamping part abuts against one end, away from the connecting seat, of the flying needle seat, the third clamping part comprises a flying needle positioning hole, and a flying needle of the flying needle seat is inserted into the flying needle positioning hole;
the cooling portion includes: the outer circulating liquid cooling mechanism, the liquid cooling cavity communicated with the outer circulating liquid cooling mechanism and the cooling liquid circulating in the outer circulating liquid cooling mechanism and the liquid cooling cavity are arranged in the clamping part; the first clamping part, the second clamping part and the third clamping part are all made of stainless steel materials;
the device further comprises a supporting part which is arranged between the first clamping part and the third clamping part and is respectively arranged at intervals with the first clamping part and the third clamping part, the supporting part is abutted against one end of the connecting seat, which is far away from the connecting column, the liquid cooling cavity further comprises a fourth liquid cooling cavity formed in the supporting part, the fourth liquid cooling cavity is communicated with the external circulation liquid cooling mechanism, and the supporting part is made of stainless steel materials;
the circuit board comprises a board body, a connecting positioning hole penetrating through the board body and connected with the connecting column in an inserting mode, and a mounting positioning hole penetrating through the board body; the connecting column comprises a first fixing part fixed with the connecting seat, a first positioning part inserted in the connecting positioning hole and a welding part extending out of the circuit board;
the first clamping part comprises a first bottom surface deviating from one surface of the second clamping part, the supporting part comprises a second bottom surface deviating from one surface of the sealing needle seat, the third clamping part comprises a third bottom surface deviating from one surface of the flying needle positioning hole along the first direction, and the first bottom surface, the second bottom surface and the third bottom surface are coplanar; the first direction is a direction approaching to/departing from one end of the connecting seat connected with the circuit board along one end of the connecting seat connected with the supporting part.
2. The high-density flying probe test sealing needle seat and circuit board welding clamping device as claimed in claim 1, wherein said liquid cooling chamber comprises: the outer circulation liquid cooling mechanism is communicated with the first liquid cooling cavity, the second liquid cooling cavity and the third liquid cooling cavity respectively.
3. The high-density flying probe test sealing probe seat and circuit board welding and clamping device as claimed in claim 1, wherein the external circulation liquid cooling mechanism comprises a frame, a heat dissipation tube mounted on the frame, and a water pump connected with the heat dissipation tube, wherein the water pump pushes cooling liquid to circulate in the liquid cooling chamber and the heat dissipation tube.
4. The welding and clamping device for the high-density flying probe test density probe seat and the circuit board as claimed in claim 1, wherein the connecting seat comprises a first abutting surface abutting against the first clamping portion, a second abutting surface abutting against the supporting portion, and a third abutting surface abutting against the circuit board; the fly needle seat includes a fourth abutment surface that abuts the third clamping portion.
5. The high-density flying probe test density probe seat and circuit board welding clamping device as claimed in claim 4, wherein the flying probe comprises a second fixing portion and a second positioning portion, the second fixing portion is fixed with the flying probe seat, and the second positioning portion is inserted into the flying probe positioning hole; the device further comprises a first bolt, the first clamping part and the third clamping part are respectively provided with a first screw hole formed by extending along a second direction, and the first screw hole is matched with the first bolt; the first clamping part and the third clamping part clamp the sealing needle seat along the second direction through the matching of the first bolt and the first screw hole; a first central axis of the first bolt passes through a midpoint of the first abutting surface in the first direction; the second direction is a direction from the first abutting surface toward/away from the fourth abutting surface.
6. The high-density flying probe test dense needle seat and circuit board welding and clamping device as claimed in claim 4, wherein the device further comprises a second bolt, the first clamping portion and the second clamping portion are respectively provided with a second screw hole formed by extending along a first direction, and the second screw hole is matched with the second bolt; the first clamping part and the second clamping part clamp the circuit board along a first direction through the matching of the second bolt and the second screw hole; the second screw hole is matched with the second bolt.
7. The high-density flying probe test density needle holder and circuit board welding and clamping device as claimed in claim 5, wherein the number of the mounting positioning holes is plural, the device further comprises a third bolt, the first clamping portion and the second clamping portion are respectively provided with a third screw hole formed by extending along a first direction, the number of the third screw holes is plural, the number of the third screw holes corresponds to the number of the mounting positioning holes, the third screw holes are arranged on the first clamping portion and the second clamping portion along a third direction, and a second central axis of each third screw hole corresponds to and coincides with a third central axis of each mounting positioning hole; the third direction is perpendicular to the second direction and the first direction, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210247862.9A CN114473127B (en) | 2022-03-14 | 2022-03-14 | Welding and clamping device for high-density flying probe test dense needle seat and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210247862.9A CN114473127B (en) | 2022-03-14 | 2022-03-14 | Welding and clamping device for high-density flying probe test dense needle seat and circuit board |
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| CN114473127A CN114473127A (en) | 2022-05-13 |
| CN114473127B true CN114473127B (en) | 2022-11-11 |
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| CN215073195U (en) * | 2021-06-04 | 2021-12-07 | 深圳市兆兴博拓科技股份有限公司 | Jig for mounting circuit board and circuit board assembly |
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| US9148962B2 (en) * | 2013-01-02 | 2015-09-29 | International Business Machines Corporation | Heat transfer device for wave soldering |
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| CN202330481U (en) * | 2011-11-24 | 2012-07-11 | 天津普林电路股份有限公司 | Special fixture for flying probe testing of high-density interconnection circuit board |
| CN203871628U (en) * | 2013-01-30 | 2014-10-08 | 控制技术有限公司 | Pin header positioning device |
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|---|---|
| CN114473127A (en) | 2022-05-13 |
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